FSA2000UMX [ONSEMI]
自动选择带有无电容耳机音频放大器的HS-USB开关;![FSA2000UMX](http://pdffile.icpdf.com/pdf2/p00369/img/icpdf/FSA2000UMX_2254531_icpdf.jpg)
型号: | FSA2000UMX |
厂家: | ![]() |
描述: | 自动选择带有无电容耳机音频放大器的HS-USB开关 开关 放大器 音频放大器 |
文件: | 总13页 (文件大小:873K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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March 2013
FSA2000
Auto-Selecting HS-USB Switch with Cap-Free Headphone
Audio Amplifier
Description
Features
The FSA2000 is a low-cost integrated HS-USB and audio
switch that incorporates an audio headphone amplifier. This
solution eliminates many of the discrete parts currently used
in stereo headset applications. It provides stereo headphone
drivers designed to operate with a ground-centered output
signal. This allows for the removal of large and expensive
DC blocking capacitors. The headphone drivers are capable
of driving up to 40mWRMS per channel.
Switch Type
Switch Mechanism
USB Detection
USB + Headphone Amplifier
Auto (USB with VBUS
)
YES
USB 2.0 High Speed &
Full-Speed Compliant
USB
Audio Amplifier
Amplifier Output Power
Amplifier Gain
THD+N
SNR
PSRR
VCC
ICC (Audio)
ICC(USB)
Class AB
40mWRMS (32Ω)
0dB
0.1%
-90dB
-95dB
Related Resources
. FSA2000 Demonstration Board
. FSA2000 Evaluation Board
. FDB323 — FSA2000 Demonstration Board User Guide
. FEB322 — FSA2000 Evaluation Board User Guide
. AN-8032 — Demonstration Board Quick-Start Guide
2.7 to 4.3V
3mA
6µA
16- Lead UMLP 1.80 x 2.60 x
0.55mm, 0.40mm pitch
Package
. AN-8031 — Utilizing the FSA2000 MUTE Function to
Reduce Audio “Click” and “Pop”
Ordering Information
FSA2000UMX
. For samples, questions, or board requests; please
contact: Analog.Switch@fairchildsemi.com.
Applications
. MP3 Portable Media Players
. Cellular Phones, Smartphones
Typical Application
Auto Switches to USB
when VBUS present
USB Data
Cable
FS / HS USB
D+
D-
USB TX
D+/ R
D-/ L
V+
+
-
0.1µF
0.1µF
OR
V-
R
L
Audio
Subsystem
V+
+
-
32Ω
32Ω
V-
Headphone
Amplifiers
Eliminates large
220µF capacitors
Figure 1. Mobile Phone Example
© 2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA2000 • Rev. 1.0.0
Pin Descriptions
Pin #
Name
Type
Description
1
2
3
4
5
D+
D-
R
I/O
I/O
USB D+ port from processor or transceiver
USB D- port from processor or transceiver
Right audio channel input
Input
Input
L
Left audio channel input
VCC
Audio Supply Supply voltage for audio amplifiers, charge pump, and audio control; not required for USB path
Control pin intended to be used temporarily to quiet transients on the audio path upon transition of
/SHDN. Ground if not being used.
6
MUTE
Input
7
/SHDN
GND
D-/L
D+/R
VBUS
V+
Input
GND
I/O
Shutdown Enable (Requires VCC only)
8
IC ground
9
Common USB/Audio Port; USB D- data to connector or left audio channel output
Common USB/Audio Port; USB D+ data to connector or right audio channel output
10
11
12
13
14
15
16
I/O
Input/Supply USB input select pin and USB supply
Node
Input
Output
I/O
Node for filtering internal positive amplifier rail; suggest 1µF to GND
V-
Negative amplifier rail input; suggest 1µF to GND. Requires connection to CPO.
Charge pump output used to drive V-, suggest 2.2 µF to GND for filtering.
CPO
CM
Charge pump negative flying capacitor pin; connect to CP via storage capacitor, typically 1µF.
Charge pump positive flying capacitor pin; connect to CM via storage capacitor ,typically 1µF.
CP
I/O
Pin Configuration
CP
16
CM
15
CPO
14
V-
13
Charge Pump
& Voltage
Regulator
12
11
10
9
D+
D-
R
1
2
V+
3MΩ
VBUS
D+/R
D-/L
V+
+
-
V-
V+
V-
3
4
+
-
L
Audio / Click & Pop Control
5
6
7
8
VCC
MUTE /SHDN GND
Figure 2. FSA2000UMX (Top View)
© 2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA2000 • Rev. 1.0.0
2
Functional Diagram
Transient
Suppression
Functional Mode
Power Down
Audio Power Down
Audio Mode
USB Mode
VBUS
VCC
LOW
LOW
LOW
LOW
HIGH
X(1)
X(1)
X(1)
LOW
X(1)
X(1)
HIGH
LOW
X(1)
HIGH
HIGH
HIGH
HIGH
HIGH
LOW
/SHDN
MUTE
Charge Pump
R/L Amplifiers
D+/R, D-/L
OFF
OFF
OFF
OFF
ON
ON
ON
OFF
OFF
OFF
HI-Z
A
HI-Z
B
D+/R, D-/L=0V
C
R/L
D
D+/D-
E
Figure 3 Label
Notes:
1. The (X) indicates “Don’t Care” state.
A
B
C
D
C
B
E
VCC
Audio
Control
/SDHN
MUTE
R
L
USB
Control
VBUS
D+
D-
Audio Mode
USB Mode
D+/R
D-/L
Figure 3. Functional Diagram
.
.
Audio Power Down –An active-LOW shutdown pin (/SHDN) allows the amplifiers to be placed in low-power
(or shutdown) mode to conserve battery power. While the FSA2000 is in shutdown mode, USB data transfers are
allowed whenever a USB cable is connected to a host (VBUS is HIGH). The audio amplifiers are enabled and
connected to the common port when /SHDN is HIGH and VBUS is LOW.
Transient Suppression – The FSA2000 audio amplifier has a soft turn-on feature that suppresses click and pop on
the audio path when the path is selected. In addition to the soft turn-on feature of the amplifier, the MUTE pin mutes
the audio path when asserted HIGH. The mute functionality also has an internal pull-down that disables mute if the
MUTE pin is floated. The MUTE pin allows control of the mute functionality by the application. Please refer to
application note AN-8031, describing the recommended timing and control of MUTE for optimal performance.
© 2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA2000 • Rev. 1.0.0
3
Functional Description
1µF
2.2µF
1µF
CP
16
CM
15
CPO
14
V-
13
Charge Pump
& Voltage
Regulator
12
11
10
9
D+
1
2
V+
1µF
HS USB TX
VBUS
D+/R
D-/L
D-
R
V+
+
Ci
-
V-
3
4
ZIN
Audio
Subsystem
0.1µF
Ci
V+
+
-
V-
L
ZIN
0.1µF
USB
Port
Audio / Click & Pop Control
2.7 – 4.3V
0.1µF
5
6
7
8
1µF
VCC
MUTE /SHDN GND
Figure 4. Micro-USB Application
Application Guidelines
performance in the system design. Equation 2 shows the
cut-off frequency of the recommended guidelines.
. Device Placement – Minimize to USB port & USB TX.
. PIN 1, 2, 9, 10 – Minimize and match trace lengths for
USB compliance.
. PIN 5 – Use standard decoupling devices, 0.1µF & 1µF
capacitors; as close to the device as possible.
. PIN 3, 4 – Suggest 0.1µFcapacitor as close to the
device as possible for DC-blocking and setting low-
frequency response of audio amplifier. The input
capacitors combine with the input impedance of the
amplifiers to form a high-pass filter. Equation 1 can be
used to calculate the -3dB cut-off frequency of the high-
pass filter for the given input capacitor value and the
FSA2000 input impedance.
. PIN 8 – Minimize ground trace length between headphone
connector and device; minimize ground path resistance.
. PIN 12 – Suggested 0.1µFcapacitor to GND for filtering; as
close to the device as possible.
. PIN13, 14 – Use low-ESR (equivalent series resistance)
ceramic capacitors for lowest charge pump impedance,
which provides maximum output power of the audio
amplifiers. Recommended to place the components as close
as possible to the device.
1
f3dB
(1)
(2)
2 ZINCi
1
. PIN15, 16 - The charge pump has been optimized for low-
ESR ceramic capacitors for the flying capacitor between CP
and CM, along with the output capacitors on V+, CPO, and
V-. Optimized values for these capacitors are in Figure 4.
17.7Hz
2(90k)(0.1F)
. It is desirable to be below the 20Hz audio range.
Users have flexibility to adjust capacitor for audio
© 2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA2000 • Rev. 1.0.0
4
Detailed Description
USB Compliance
over the behavior of the amplifier during startup and power
down. The MUTE pin forces the audio outputs into a known
and controlled state so that any transients of the amplifier
are not propagated to the headphones as clicks and pops.
Figure 6 shows the correct timing of the MUTE pin in relation
to the /SHDN pin for optimal click and pop performance.
Figure 6. Power-Up and Power-Down Timing
Figure 5. High-Speed USB 2.0 Eye Compliance (5.5V)
Table 1.
Parameter
Recommended MUTE Timing
Transient Suppression
Suggested
Timing
Description
A common issue with headphone amplifiers is audible noises
through the headset when the amplifier is powering up or
down. Sharp transients often occur on the audio outputs
during this transition that cause audible “click and pop.” The
FSA2000 prevents these transients during power-up by
muting the outputs until the internal charge pumps are
stable. This ensures that any transients caused by the
charge pump are not propagated to the outputs. In cases
where the application needs a longer startup time for mute,
the FSA2000 has a MUTE pin that allows application control
MUTE setup time to /SHDN
rising edge
TMUTEPU_SETUP
TMUTEPU_HOLD
TMUTEPD_SETUP
TMUTEPD_HOLD
>500ns
MUTE hold time to /SHDN
rising edge
~500ns
>500ns
~500ns
MUTE setup time to /SHDN
falling edge
MUTE hold time to /SHDN
falling edge
© 2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA2000 • Rev. 1.0.0
5
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable
above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition,
extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute
maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Unit
Audio Mode
USB Mode
-0.3
-0.3
+4.5
+6.0
VCC
Supply Voltage
V
VBUS
VCNTRL
VSWUSB
VSWAUDIO
ISW
Supply Voltage
-0.3
+6.0
V
V
Control Pin Voltage - /SHDN, MUTE
USB I/O
-0.3
+6.0
VBUS – 6.0
VCC – 6.0
VBUS + 0.3
VCC + 0.3
30
V
Audio I/O
V
Switch I/O Current (Continuous)
mA
mA
C
C
C
IPEAK
TJ
Peak Switch I/O Current (Pulsed, 1ms Duration, <10% Duty Cycle)
Junction Temperature
50
+150
+150
+240
Storage Temperature Range
-65
TSTG
Lead Temperature (Soldering, 10 seconds)
TL
IEC 61000-4-2 System USB Connector pins (D+/R, D-/L, VBUS
)
Air Gap
15
4
D+/R, D-/L
All Other Pins
VBUS
ESD
JEDEC JESD22-A114, Human Body Model
2
kV
1
JEDEC JESD22-C101, Charged Device Model
All Pins
2
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend
exceeding these ratings or designing to Absolute Maximum Ratings.
Symbol
Parameter
Min.
Typ.
5.0
Max.
Unit
VBUS
VCC
USB Supply Voltage
4.0
2.7
0
5.5
4.5
VCC
VBUS
VCC
5
V
V
Supply Voltage
3.3
VCNTRL
VSWUSB
VSWAUDIO
VSWING
TA
Control Voltage - /SHDN, MUTE
D+/L, D-/R, D+, D- Input Range
L,R Audio Input Range
L,R Audio Input Amplitude
Temperature Range
V
0
V
-2.5
V
VP-P
°C
Ω
-40
16
+25
32
+85
ZLOAD
JA
Headset Load Impedance
40
Package Thermal Resistance, JEDEC Standard Multi-Layer Boards, Still Air
C/W
© 2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA2000 • Rev. 1.0.0
6
DC Electrical Characteristics
TA = 25°C, VCC = 3.0V, audio inputs at -6dBV and AC coupled with 0.1µF, audio outputs DC coupled into 32Ω loads
referenced to 1kHz, unless otherwise noted.
TA = - 40°C to +85°C
Symbol
Parameter
VCC (V)
Conditions
Unit
Min.
Typ.
Max.
Common Pins
/SHDN, MUTE, Control Input
Voltage HIGH
VIH
VIL
2.7 to 4.5
2.7 to 4.5
1.65
V
Control Input Voltage LOW
0.5
10
1
VCNTRL = 3.6V
-1
-1
/SHDN, MUTE, Input HIGH
Current
IIN
4.5
µA
µA
VCNTRL = 0V
Common Port (D+/R, D-/L)
VSW = 0V, 5.5V
IOFF
Power Off Leakage Current
VCC = VBUS = 0
10
D+/R, D-/L = 0.3V,
VCC – 0.3V, D+, D- = 0.3V,
VCC – 0.3V or Floating,
/SHDN=0V, VBUS=0v,
MUTE=0V, R/L=0V
Off-Leakage Current of Port
D+, D-
INO(0FF)
3.6
3.6
-50
-50
1
50
nA
D+/R, D-/L = 0.3V, VCC – 0.3V
D+, D- = Floating
VBUS=5.5V, /SHDN=0V,
MUTE=0V, R/L=0V
On-Leakage Current of Port
D+/R or D-/L
INC(0N)
1
50
nA
VBUS, MUTE, Internal Pull-Down
Resistor
RPD
3.5
M
USB Switch Path
USB Analog Signal Range
0
3.6
6.5
V
Ω
Ω
RONUSB
HS Switch On Resistance(2)
VBUS=5
VBUS=5
VD+/D- = 0V, 0.4V, ION = -8mA
VD+/D- = 0V, ION = - 8mA
4.0
0.4
(2, 3)
∆ RONUSB
HS Delta RON
Audio Amplifier Path
4
)
Audio Amp Input Impedance(
ZIN
3.0 to 4.5
90
kΩ
Power Supply
Quiescent Supply Current
(Audio Mode)
IOUT = 0, /SHDN = VCC
MUTE=0V, D+/D-=0V
,
ICC(Audio)
ICC(/SHDN)
ICC(USB)
4.5
4.5
3
1
6
5
5
mA
µA
µA
Quiescent Supply Current (VCC
in Shutdown Mode
)
IOUT = 0, /SHDN = 0V,
MUTE=0V, D+/D-=0V
Quiescent Supply Current
(USB Mode)
IOUT=0, MUTE=0V,
/SHDN=VBUS, L/R=0V
VBUS=5.5
10
Notes:
2. On resistance is determined by the voltage drop between the D+/D- and D+/R,D-/L pins at the indicated current through
the switch.
3. ∆RON = RON_max – RON_min measured at identical VCC, temperature, and voltage.
4. Guaranteed by characterization, but not production tested.
© 2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA2000 • Rev. 1.0.0
7
AC Electrical Characteristics
TA = 25°C, VCC = 3.0V, audio inputs at -6dBV and AC coupled with 0.1µF, audio outputs DC coupled into 32Ω loads
referenced to 1kHz, unless otherwise noted.
TA = - 40°C to +85°C
Symbol
Parameter
VCC (V)
Conditions
Unit
Min. Typ. Max.
Audio Amplifier Path
tONAUDIO
tOFFAUDIO
tMUTE_ON
tMUTE_OFF
Turn-On Time /SHDN to Output
Turn-Off Time /SHDN to Output
MUTE Turn-On Time
3.0 to 4.5
3.0 to 4.5
3.0 to 4.5
3.0 to 4.5
2.7
VD+/R, D-/L = 1.0V; CL = 0pF,
VD+/R, D-/L = 1.0V; CL = 0pF
1
ms
μs
μs
μs
100
1
1
MUTE Turn-Off Time
25
35
40
5
THD_N=1%, VL,R In Phase,
RLOAD=32Ω, 1KHz
Output Power(5
)
Pout
3.3
mWrms
4.5
VOS
AV
Output Offset Voltage
Amplifier Gain
Gain Matching of L & R Channels(5)
Frequency Response(5)
Distortion(5)
Signal to Noise Ratio(5)
Crosstalk between L & R Channel(5)
Inputs Grounded
mV
dB
dB
dB
%
Input = -26dBV at 1kHz, RL=16Ω
Input = -26dBV, 20Hz to 20kHz
0
AMATCH
fR
0.5
20Hz to 20kHz referenced to 1kHz -1.5
f=1KHz, Vsw=50mVrms, RL=64Ω
A Weighted
1.5
THD+N
SNR
0.1
-90
-60
dB
dB
XTLKsprk
Input=-26bBV
USB Switch Path
tPDUSB
USB Switch Propagation Delay(5)
4.0 to 5.5
4.0 to 5.5
RL = 50Ω; CL = 0pF
0.25
720
-95
ns
VD+/R, D-/L = 1.0V; RL = 32Ω;
CL = 0pF, /SHDN,VCC=0
tONUSB
Turn-On Time VBUS to Output
5.5
2
μs
VD+/R, D-/L = 1.0V; RL = 32Ω;
CL = 0pF, /SHDN,VCC=0
tOFFUSB
BW
Turn-Off Time VBUS to Output
4.0 to 5.5
4.0 to 5.5
μs
-3db Bandwidth – USB
RL=50Ω, CL=0pF, Signal 0dBm
MHz
Power Supply
tSUPPLY
Power-Up Stabilization Time
V+, V- within 90% of Final Value
1
ms
dB
217Hz 12% Duty Cycle Square
Wave 2.7V to 3.2V at VCC
Output (D+/R) in Vrms as Single
Wideband Noise Measurement
within 20Hz – 20kHz, A Weighted
Power Supply Noise Rejection at
Common Output(5)
PSRRSPKR
Note:
5. Guaranteed by characterization; not production tested.
© 2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA2000 • Rev. 1.0.0
8
USB High-Speed-Related AC Electrical Characteristics
TA = 25°C unless otherwise noted.
TA = - 40°C to +85°C
Min. Typ. Max.
Symbol
Parameter
VBUS (V)
Conditions
Unit
Skew of Opposite Transitions of the
Same Output(6)
tR = tF = 750ps (10-90%) at 240MHz
CL = 0pF, RL = 50Ω
tSK(P)
4.0 to 5.5
4.0 to 5.5
35
ps
ps
RL = 50Ω, CL = 50pF, tR = tF = 500ps
(10-90%) at 480Mbps (PRBS = 215 – 1)
tJ
Total Jitter(6)
130
Note:
6. Guaranteed by characterization; not production tested.
Capacitance
TA = 25°C unless otherwise noted.
TA = - 40°C to +85°C
Min. Typ. Max.
Symbol
Parameter
VCC /VBUS(V)
Conditions
Unit
Control Pin Input Capacitance
(/SHDN, MUTE)
CIN
VCC = 3.0, 4.5
VBias = 0.05V
2.8
pF
CON_USB
D+, D- (Source Port) On Capacitance
VBUS=5.0
VBUS=5.0
VBias = 0.2V, f = 1MHz, f=240MHz
f = 1MHz
8.8
2.8
pF
pF
COFF_USB D+, D- (Source Port) Off Capacitance
© 2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA2000 • Rev. 1.0.0
9
Physical Dimensions
0.10
C
2.100
A
1.80
15X
2X
0.563
B
0.663
1
PIN #1 IDENT
2.900
2.60
0.400
0.10
C
16X
0.225
2X
TOP VIEW
0.55 MAX.
RECOMMENDED LAND PATTERN
0.10
0.08
C
0.152
SEATING
PLANE
C
0.050
C
SIDE VIEW
TERMINAL SHAPE VARIANTS
0.40
0.60
5
0.30
0.50
0.15
0.25
0.15
0.25
0.100
15X
15X
15X
0.100
9
PIN 1
NON-PIN 1
0.40
Supplier 1
1
0.30
0.50
0.15
0.25
0.15
0.25
0.30
0.50
13
16
15X
ALL TERMINALS
PIN 1
NON-PIN 1
0.10
0.05
C
C
A B
Supplier 2
BOTTOM VIEW
A. THIS PACKAGE IS NOT CURRENTLY REGISTERED WITH
ANY STANDARDS COMMITTEE
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994
D. TERMINAL SHAPE MAY VARY ACCORDING TO PACKAGE
SUPPLIER, SEE TERMINAL SHAPE VARIANTS
E. LAND PATTERN IS A MINIMAL TOE DESIGN
F. DRAWING FILE NAME : UMLP16AREV3
Figure 7. 16-Pin Ultrathin Molded Leadless Package (UMLP)
Order Number
Operating Temperature Range
Package Description
Packing Method
FSA2000UMX
-40 to 85°C
16-Terminal Ultrathin Molded Leadless Package (UMLP)
Tape & Reel
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty
therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/.
© 2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA2000 • Rev. 1.0.0
10
© 2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA2000 • Rev. 1.0.0
11
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