FSA2000UMX [ONSEMI]

自动选择带有无电容耳机音频放大器的HS-USB开关;
FSA2000UMX
型号: FSA2000UMX
厂家: ONSEMI    ONSEMI
描述:

自动选择带有无电容耳机音频放大器的HS-USB开关

开关 放大器 音频放大器
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March 2013  
FSA2000  
Auto-Selecting HS-USB Switch with Cap-Free Headphone  
Audio Amplifier  
Description  
Features  
The FSA2000 is a low-cost integrated HS-USB and audio  
switch that incorporates an audio headphone amplifier. This  
solution eliminates many of the discrete parts currently used  
in stereo headset applications. It provides stereo headphone  
drivers designed to operate with a ground-centered output  
signal. This allows for the removal of large and expensive  
DC blocking capacitors. The headphone drivers are capable  
of driving up to 40mWRMS per channel.  
Switch Type  
Switch Mechanism  
USB Detection  
USB + Headphone Amplifier  
Auto (USB with VBUS  
)
YES  
USB 2.0 High Speed &  
Full-Speed Compliant  
USB  
Audio Amplifier  
Amplifier Output Power  
Amplifier Gain  
THD+N  
SNR  
PSRR  
VCC  
ICC (Audio)  
ICC(USB)  
Class AB  
40mWRMS (32)  
0dB  
0.1%  
-90dB  
-95dB  
Related Resources  
. FSA2000 Demonstration Board  
. FSA2000 Evaluation Board  
. FDB323 FSA2000 Demonstration Board User Guide  
. FEB322 FSA2000 Evaluation Board User Guide  
. AN-8032 Demonstration Board Quick-Start Guide  
2.7 to 4.3V  
3mA  
6µA  
16- Lead UMLP 1.80 x 2.60 x  
0.55mm, 0.40mm pitch  
Package  
. AN-8031 Utilizing the FSA2000 MUTE Function to  
Reduce Audio “Click” and “Pop”  
Ordering Information  
FSA2000UMX  
. For samples, questions, or board requests; please  
contact: Analog.Switch@fairchildsemi.com.  
Applications  
. MP3 Portable Media Players  
. Cellular Phones, Smartphones  
Typical Application  
Auto Switches to USB  
when VBUS present  
USB Data  
Cable  
FS / HS USB  
D+  
D-  
USB TX  
D+/ R  
D-/ L  
V+  
+
-
0.1µF  
0.1µF  
OR  
V-  
R
L
Audio  
Subsystem  
V+  
+
-
32Ω  
32Ω  
V-  
Headphone  
Amplifiers  
Eliminates large  
220µF capacitors  
Figure 1. Mobile Phone Example  
© 2009 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FSA2000 • Rev. 1.0.0  
Pin Descriptions  
Pin #  
Name  
Type  
Description  
1
2
3
4
5
D+  
D-  
R
I/O  
I/O  
USB D+ port from processor or transceiver  
USB D- port from processor or transceiver  
Right audio channel input  
Input  
Input  
L
Left audio channel input  
VCC  
Audio Supply Supply voltage for audio amplifiers, charge pump, and audio control; not required for USB path  
Control pin intended to be used temporarily to quiet transients on the audio path upon transition of  
/SHDN. Ground if not being used.  
6
MUTE  
Input  
7
/SHDN  
GND  
D-/L  
D+/R  
VBUS  
V+  
Input  
GND  
I/O  
Shutdown Enable (Requires VCC only)  
8
IC ground  
9
Common USB/Audio Port; USB D- data to connector or left audio channel output  
Common USB/Audio Port; USB D+ data to connector or right audio channel output  
10  
11  
12  
13  
14  
15  
16  
I/O  
Input/Supply USB input select pin and USB supply  
Node  
Input  
Output  
I/O  
Node for filtering internal positive amplifier rail; suggest 1µF to GND  
V-  
Negative amplifier rail input; suggest 1µF to GND. Requires connection to CPO.  
Charge pump output used to drive V-, suggest 2.2 µF to GND for filtering.  
CPO  
CM  
Charge pump negative flying capacitor pin; connect to CP via storage capacitor, typically 1µF.  
Charge pump positive flying capacitor pin; connect to CM via storage capacitor ,typically 1µF.  
CP  
I/O  
Pin Configuration  
CP  
16  
CM  
15  
CPO  
14  
V-  
13  
Charge Pump  
& Voltage  
Regulator  
12  
11  
10  
9
D+  
D-  
R
1
2
V+  
3M  
VBUS  
D+/R  
D-/L  
V+  
+
-
V-  
V+  
V-  
3
4
+
-
L
Audio / Click & Pop Control  
5
6
7
8
VCC  
MUTE /SHDN GND  
Figure 2. FSA2000UMX (Top View)  
© 2009 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FSA2000 Rev. 1.0.0  
2
Functional Diagram  
Transient  
Suppression  
Functional Mode  
Power Down  
Audio Power Down  
Audio Mode  
USB Mode  
VBUS  
VCC  
LOW  
LOW  
LOW  
LOW  
HIGH  
X(1)  
X(1)  
X(1)  
LOW  
X(1)  
X(1)  
HIGH  
LOW  
X(1)  
HIGH  
HIGH  
HIGH  
HIGH  
HIGH  
LOW  
/SHDN  
MUTE  
Charge Pump  
R/L Amplifiers  
D+/R, D-/L  
OFF  
OFF  
OFF  
OFF  
ON  
ON  
ON  
OFF  
OFF  
OFF  
HI-Z  
A
HI-Z  
B
D+/R, D-/L=0V  
C
R/L  
D
D+/D-  
E
Figure 3 Label  
Notes:  
1. The (X) indicates “Don’t Care” state.  
A
B
C
D
C
B
E
VCC  
Audio  
Control  
/SDHN  
MUTE  
R
L
USB  
Control  
VBUS  
D+  
D-  
Audio Mode  
USB Mode  
D+/R  
D-/L  
Figure 3. Functional Diagram  
.
.
Audio Power Down An active-LOW shutdown pin (/SHDN) allows the amplifiers to be placed in low-power  
(or shutdown) mode to conserve battery power. While the FSA2000 is in shutdown mode, USB data transfers are  
allowed whenever a USB cable is connected to a host (VBUS is HIGH). The audio amplifiers are enabled and  
connected to the common port when /SHDN is HIGH and VBUS is LOW.  
Transient Suppression The FSA2000 audio amplifier has a soft turn-on feature that suppresses click and pop on  
the audio path when the path is selected. In addition to the soft turn-on feature of the amplifier, the MUTE pin mutes  
the audio path when asserted HIGH. The mute functionality also has an internal pull-down that disables mute if the  
MUTE pin is floated. The MUTE pin allows control of the mute functionality by the application. Please refer to  
application note AN-8031, describing the recommended timing and control of MUTE for optimal performance.  
© 2009 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FSA2000 Rev. 1.0.0  
3
 
 
Functional Description  
1µF  
2.2µF  
1µF  
CP  
16  
CM  
15  
CPO  
14  
V-  
13  
Charge Pump  
& Voltage  
Regulator  
12  
11  
10  
9
D+  
1
2
V+  
1µF  
HS USB TX  
VBUS  
D+/R  
D-/L  
D-  
R
V+  
+
Ci  
-
V-  
3
4
ZIN  
Audio  
Subsystem  
0.1µF  
Ci  
V+  
+
-
V-  
L
ZIN  
0.1µF  
USB  
Port  
Audio / Click & Pop Control  
2.7 4.3V  
0.1µF  
5
6
7
8
1µF  
VCC  
MUTE /SHDN GND  
Figure 4. Micro-USB Application  
Application Guidelines  
performance in the system design. Equation 2 shows the  
cut-off frequency of the recommended guidelines.  
. Device Placement Minimize to USB port & USB TX.  
. PIN 1, 2, 9, 10 Minimize and match trace lengths for  
USB compliance.  
. PIN 5 Use standard decoupling devices, 0.1µF & 1µF  
capacitors; as close to the device as possible.  
. PIN 3, 4 Suggest 0.1µFcapacitor as close to the  
device as possible for DC-blocking and setting low-  
frequency response of audio amplifier. The input  
capacitors combine with the input impedance of the  
amplifiers to form a high-pass filter. Equation 1 can be  
used to calculate the -3dB cut-off frequency of the high-  
pass filter for the given input capacitor value and the  
FSA2000 input impedance.  
. PIN 8 Minimize ground trace length between headphone  
connector and device; minimize ground path resistance.  
. PIN 12 Suggested 0.1µFcapacitor to GND for filtering; as  
close to the device as possible.  
. PIN13, 14 Use low-ESR (equivalent series resistance)  
ceramic capacitors for lowest charge pump impedance,  
which provides maximum output power of the audio  
amplifiers. Recommended to place the components as close  
as possible to the device.  
1
f3dB  
(1)  
(2)  
2  ZINCi  
1
. PIN15, 16 - The charge pump has been optimized for low-  
ESR ceramic capacitors for the flying capacitor between CP  
and CM, along with the output capacitors on V+, CPO, and  
V-. Optimized values for these capacitors are in Figure 4.  
17.7Hz   
2(90k)(0.1F)  
. It is desirable to be below the 20Hz audio range.  
Users have flexibility to adjust capacitor for audio  
© 2009 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FSA2000 Rev. 1.0.0  
4
 
Detailed Description  
USB Compliance  
over the behavior of the amplifier during startup and power  
down. The MUTE pin forces the audio outputs into a known  
and controlled state so that any transients of the amplifier  
are not propagated to the headphones as clicks and pops.  
Figure 6 shows the correct timing of the MUTE pin in relation  
to the /SHDN pin for optimal click and pop performance.  
Figure 6. Power-Up and Power-Down Timing  
Figure 5. High-Speed USB 2.0 Eye Compliance (5.5V)  
Table 1.  
Parameter  
Recommended MUTE Timing  
Transient Suppression  
Suggested  
Timing  
Description  
A common issue with headphone amplifiers is audible noises  
through the headset when the amplifier is powering up or  
down. Sharp transients often occur on the audio outputs  
during this transition that cause audible “click and pop.” The  
FSA2000 prevents these transients during power-up by  
muting the outputs until the internal charge pumps are  
stable. This ensures that any transients caused by the  
charge pump are not propagated to the outputs. In cases  
where the application needs a longer startup time for mute,  
the FSA2000 has a MUTE pin that allows application control  
MUTE setup time to /SHDN  
rising edge  
TMUTEPU_SETUP  
TMUTEPU_HOLD  
TMUTEPD_SETUP  
TMUTEPD_HOLD  
>500ns  
MUTE hold time to /SHDN  
rising edge  
~500ns  
>500ns  
~500ns  
MUTE setup time to /SHDN  
falling edge  
MUTE hold time to /SHDN  
falling edge  
© 2009 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FSA2000 Rev. 1.0.0  
5
 
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable  
above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition,  
extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute  
maximum ratings are stress ratings only.  
Symbol  
Parameter  
Min.  
Max.  
Unit  
Audio Mode  
USB Mode  
-0.3  
-0.3  
+4.5  
+6.0  
VCC  
Supply Voltage  
V
VBUS  
VCNTRL  
VSWUSB  
VSWAUDIO  
ISW  
Supply Voltage  
-0.3  
+6.0  
V
V
Control Pin Voltage - /SHDN, MUTE  
USB I/O  
-0.3  
+6.0  
VBUS 6.0  
VCC 6.0  
VBUS + 0.3  
VCC + 0.3  
30  
V
Audio I/O  
V
Switch I/O Current (Continuous)  
mA  
mA  
C  
C  
C  
IPEAK  
TJ  
Peak Switch I/O Current (Pulsed, 1ms Duration, <10% Duty Cycle)  
Junction Temperature  
50  
+150  
+150  
+240  
Storage Temperature Range  
-65  
TSTG  
Lead Temperature (Soldering, 10 seconds)  
TL  
IEC 61000-4-2 System USB Connector pins (D+/R, D-/L, VBUS  
)
Air Gap  
15  
4
D+/R, D-/L  
All Other Pins  
VBUS  
ESD  
JEDEC JESD22-A114, Human Body Model  
2
kV  
1
JEDEC JESD22-C101, Charged Device Model  
All Pins  
2
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating  
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend  
exceeding these ratings or designing to Absolute Maximum Ratings.  
Symbol  
Parameter  
Min.  
Typ.  
5.0  
Max.  
Unit  
VBUS  
VCC  
USB Supply Voltage  
4.0  
2.7  
0
5.5  
4.5  
VCC  
VBUS  
VCC  
5
V
V
Supply Voltage  
3.3  
VCNTRL  
VSWUSB  
VSWAUDIO  
VSWING  
TA  
Control Voltage - /SHDN, MUTE  
D+/L, D-/R, D+, D- Input Range  
L,R Audio Input Range  
L,R Audio Input Amplitude  
Temperature Range  
V
0
V
-2.5  
V
VP-P  
°C  
Ω
-40  
16  
+25  
32  
+85  
ZLOAD  
JA  
Headset Load Impedance  
40  
Package Thermal Resistance, JEDEC Standard Multi-Layer Boards, Still Air  
C/W  
© 2009 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FSA2000 Rev. 1.0.0  
6
DC Electrical Characteristics  
TA = 25°C, VCC = 3.0V, audio inputs at -6dBV and AC coupled with 0.1µF, audio outputs DC coupled into 32Ω loads  
referenced to 1kHz, unless otherwise noted.  
TA = - 40°C to +85°C  
Symbol  
Parameter  
VCC (V)  
Conditions  
Unit  
Min.  
Typ.  
Max.  
Common Pins  
/SHDN, MUTE, Control Input  
Voltage HIGH  
VIH  
VIL  
2.7 to 4.5  
2.7 to 4.5  
1.65  
V
Control Input Voltage LOW  
0.5  
10  
1
VCNTRL = 3.6V  
-1  
-1  
/SHDN, MUTE, Input HIGH  
Current  
IIN  
4.5  
µA  
µA  
VCNTRL = 0V  
Common Port (D+/R, D-/L)  
VSW = 0V, 5.5V  
IOFF  
Power Off Leakage Current  
VCC = VBUS = 0  
10  
D+/R, D-/L = 0.3V,  
VCC 0.3V, D+, D- = 0.3V,  
VCC 0.3V or Floating,  
/SHDN=0V, VBUS=0v,  
MUTE=0V, R/L=0V  
Off-Leakage Current of Port  
D+, D-  
INO(0FF)  
3.6  
3.6  
-50  
-50  
1
50  
nA  
D+/R, D-/L = 0.3V, VCC 0.3V  
D+, D- = Floating  
VBUS=5.5V, /SHDN=0V,  
MUTE=0V, R/L=0V  
On-Leakage Current of Port  
D+/R or D-/L  
INC(0N)  
1
50  
nA  
VBUS, MUTE, Internal Pull-Down  
Resistor  
RPD  
3.5  
M  
USB Switch Path  
USB Analog Signal Range  
0
3.6  
6.5  
V
RONUSB  
HS Switch On Resistance(2)  
VBUS=5  
VBUS=5  
VD+/D- = 0V, 0.4V, ION = -8mA  
VD+/D- = 0V, ION = - 8mA  
4.0  
0.4  
(2, 3)  
∆ RONUSB  
HS Delta RON  
Audio Amplifier Path  
4
)
Audio Amp Input Impedance(  
ZIN  
3.0 to 4.5  
90  
kΩ  
Power Supply  
Quiescent Supply Current  
(Audio Mode)  
IOUT = 0, /SHDN = VCC  
MUTE=0V, D+/D-=0V  
,
ICC(Audio)  
ICC(/SHDN)  
ICC(USB)  
4.5  
4.5  
3
1
6
5
5
mA  
µA  
µA  
Quiescent Supply Current (VCC  
in Shutdown Mode  
)
IOUT = 0, /SHDN = 0V,  
MUTE=0V, D+/D-=0V  
Quiescent Supply Current  
(USB Mode)  
IOUT=0, MUTE=0V,  
/SHDN=VBUS, L/R=0V  
VBUS=5.5  
10  
Notes:  
2. On resistance is determined by the voltage drop between the D+/D- and D+/R,D-/L pins at the indicated current through  
the switch.  
3. RON = RON_max RON_min measured at identical VCC, temperature, and voltage.  
4. Guaranteed by characterization, but not production tested.  
© 2009 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FSA2000 Rev. 1.0.0  
7
 
 
 
AC Electrical Characteristics  
TA = 25°C, VCC = 3.0V, audio inputs at -6dBV and AC coupled with 0.1µF, audio outputs DC coupled into 32Ω loads  
referenced to 1kHz, unless otherwise noted.  
TA = - 40°C to +85°C  
Symbol  
Parameter  
VCC (V)  
Conditions  
Unit  
Min. Typ. Max.  
Audio Amplifier Path  
tONAUDIO  
tOFFAUDIO  
tMUTE_ON  
tMUTE_OFF  
Turn-On Time /SHDN to Output  
Turn-Off Time /SHDN to Output  
MUTE Turn-On Time  
3.0 to 4.5  
3.0 to 4.5  
3.0 to 4.5  
3.0 to 4.5  
2.7  
VD+/R, D-/L = 1.0V; CL = 0pF,  
VD+/R, D-/L = 1.0V; CL = 0pF  
1
ms  
μs  
μs  
μs  
100  
1
1
MUTE Turn-Off Time  
25  
35  
40  
5
THD_N=1%, VL,R In Phase,  
RLOAD=32Ω, 1KHz  
Output Power(5  
)
Pout  
3.3  
mWrms  
4.5  
VOS  
AV  
Output Offset Voltage  
Amplifier Gain  
Gain Matching of L & R Channels(5)  
Frequency Response(5)  
Distortion(5)  
Signal to Noise Ratio(5)  
Crosstalk between L & R Channel(5)  
Inputs Grounded  
mV  
dB  
dB  
dB  
%
Input = -26dBV at 1kHz, RL=16Ω  
Input = -26dBV, 20Hz to 20kHz  
0
AMATCH  
fR  
0.5  
20Hz to 20kHz referenced to 1kHz -1.5  
f=1KHz, Vsw=50mVrms, RL=64Ω  
A Weighted  
1.5  
THD+N  
SNR  
0.1  
-90  
-60  
dB  
dB  
XTLKsprk  
Input=-26bBV  
USB Switch Path  
tPDUSB  
USB Switch Propagation Delay(5)  
4.0 to 5.5  
4.0 to 5.5  
RL = 50Ω; CL = 0pF  
0.25  
720  
-95  
ns  
VD+/R, D-/L = 1.0V; RL = 32Ω;  
CL = 0pF, /SHDN,VCC=0  
tONUSB  
Turn-On Time VBUS to Output  
5.5  
2
μs  
VD+/R, D-/L = 1.0V; RL = 32Ω;  
CL = 0pF, /SHDN,VCC=0  
tOFFUSB  
BW  
Turn-Off Time VBUS to Output  
4.0 to 5.5  
4.0 to 5.5  
μs  
-3db Bandwidth USB  
RL=50Ω, CL=0pF, Signal 0dBm  
MHz  
Power Supply  
tSUPPLY  
Power-Up Stabilization Time  
V+, V- within 90% of Final Value  
1
ms  
dB  
217Hz 12% Duty Cycle Square  
Wave 2.7V to 3.2V at VCC  
Output (D+/R) in Vrms as Single  
Wideband Noise Measurement  
within 20Hz 20kHz, A Weighted  
Power Supply Noise Rejection at  
Common Output(5)  
PSRRSPKR  
Note:  
5. Guaranteed by characterization; not production tested.  
© 2009 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FSA2000 Rev. 1.0.0  
8
 
USB High-Speed-Related AC Electrical Characteristics  
TA = 25°C unless otherwise noted.  
TA = - 40°C to +85°C  
Min. Typ. Max.  
Symbol  
Parameter  
VBUS (V)  
Conditions  
Unit  
Skew of Opposite Transitions of the  
Same Output(6)  
tR = tF = 750ps (10-90%) at 240MHz  
CL = 0pF, RL = 50Ω  
tSK(P)  
4.0 to 5.5  
4.0 to 5.5  
35  
ps  
ps  
RL = 50Ω, CL = 50pF, tR = tF = 500ps  
(10-90%) at 480Mbps (PRBS = 215 1)  
tJ  
Total Jitter(6)  
130  
Note:  
6. Guaranteed by characterization; not production tested.  
Capacitance  
TA = 25°C unless otherwise noted.  
TA = - 40°C to +85°C  
Min. Typ. Max.  
Symbol  
Parameter  
VCC /VBUS(V)  
Conditions  
Unit  
Control Pin Input Capacitance  
(/SHDN, MUTE)  
CIN  
VCC = 3.0, 4.5  
VBias = 0.05V  
2.8  
pF  
CON_USB  
D+, D- (Source Port) On Capacitance  
VBUS=5.0  
VBUS=5.0  
VBias = 0.2V, f = 1MHz, f=240MHz  
f = 1MHz  
8.8  
2.8  
pF  
pF  
COFF_USB D+, D- (Source Port) Off Capacitance  
© 2009 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FSA2000 Rev. 1.0.0  
9
 
Physical Dimensions  
0.10  
C
2.100  
A
1.80  
15X  
2X  
0.563  
B
0.663  
1
PIN #1 IDENT  
2.900  
2.60  
0.400  
0.10  
C
16X  
0.225  
2X  
TOP VIEW  
0.55 MAX.  
RECOMMENDED LAND PATTERN  
0.10  
0.08  
C
0.152  
SEATING  
PLANE  
C
0.050  
C
SIDE VIEW  
TERMINAL SHAPE VARIANTS  
0.40  
0.60  
5
0.30  
0.50  
0.15  
0.25  
0.15  
0.25  
0.100  
15X  
15X  
15X  
0.100  
9
PIN 1  
NON-PIN 1  
0.40  
Supplier 1  
1
0.30  
0.50  
0.15  
0.25  
0.15  
0.25  
0.30  
0.50  
13  
16  
15X  
ALL TERMINALS  
PIN 1  
NON-PIN 1  
0.10  
0.05  
C
C
A B  
Supplier 2  
BOTTOM VIEW  
A. THIS PACKAGE IS NOT CURRENTLY REGISTERED WITH  
ANY STANDARDS COMMITTEE  
B. DIMENSIONS ARE IN MILLIMETERS.  
C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994  
D. TERMINAL SHAPE MAY VARY ACCORDING TO PACKAGE  
SUPPLIER, SEE TERMINAL SHAPE VARIANTS  
E. LAND PATTERN IS A MINIMAL TOE DESIGN  
F. DRAWING FILE NAME : UMLP16AREV3  
Figure 7. 16-Pin Ultrathin Molded Leadless Package (UMLP)  
Order Number  
Operating Temperature Range  
Package Description  
Packing Method  
FSA2000UMX  
-40 to 85°C  
16-Terminal Ultrathin Molded Leadless Package (UMLP)  
Tape & Reel  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without  
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most  
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty  
therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/.  
© 2009 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FSA2000 Rev. 1.0.0  
10  
© 2009 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FSA2000 Rev. 1.0.0  
11  
ON Semiconductor and  
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