FPF2116 [ONSEMI]
IntelliMAX™ 高级负载管理产品;
ONSEMI 
Is Now Part of
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August 2008
FPF2116
IntelliMAX™ Advanced Load Management Products
tm
Features
General Description
1.8 to 5.5V Input Voltage Range
Controlled Turn-On
The FPF2116 is a load switch which provides full protection to
systems and loads which may encounter large current
conditions. This device contains a 0.125Ω current-limited P-
channel MOSFET which can operate over an input voltage
range of 1.8-5.5V. Internally, current is prevented from flowing
when the MOSFET is off and the output voltage is higher than
the input voltage. Switch control is by a logic input (ON)
capable of interfacing directly with low voltage control signals.
The part contains thermal shutdown protection which shuts off
the switch to prevent damage to the part when a continuous
over-current condition causes excessive heating.
200mA Current Limit
Undervoltage Lockout
Thermal Shutdown
<2µA Shutdown Current
Auto Restart
Fast Current limit Response Time
3µs to Moderate Over Currents
20ns to Hard Shorts
When the switch current reaches the current limit, the part
operates in a constant-current mode to prohibit excessive
currents from causing damage. If the constant current condition
still persists after 30ms, the part will shut off the switch and pull
the fault signal pin (FLAGB) low. An auto-restart feature will turn
the switch on again after 480ms if the ON pin is still active. The
minimum current limit is 200mA.
Fault Blanking
Reverse Current Blocking
RoHS Compliant
Applications
PDAs
The part is available in a space-saving 5 pin SOT23 package.
Cell Phones
GPS Devices
MP3 Players
Digital Cameras
Peripheral Ports
Hot Swap Supplies
Typical Application Circuit
TO LOAD
VOUT
VIN
ON
FPF2116
OFF ON
FLAGB
GND
Ordering Information
Current Limit
Blanking Time
[ms]
Auto-Restart
Time
Current Limit
ON Pin
Activity
Part
[mA]
[ms]
Top Mark
FPF2116
200
30
480
Active HI
2116
©2008 Fairchild Semiconductor Corporation
FPF2116 Rev. D
1
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Functional Block Diagram
VIN
UVLO
REVERSE
CURRENT
BLOCKING
CONTROL
LOGIC
ON
CURRENT
LIMIT
VOUT
THERMAL
SHUTDOWN
FLAGB
GND
Pin Configuration
VIN
1
5
4
VOUT
GND
ON
2
3
FLAGB
SOT23-5
Pin Description
Pin
Name
VIN
Function
1
2
3
Supply Input: Input to the power switch and the supply voltage for the IC
GND
ON
Ground
ON Control Input
Fault Output: Active LO, open drain output which indicates an over current supply,
under voltage or over temperature state.
4
5
FLAGB
VOUT
Switch Output: Output of the power switch
2
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FPF2116 Rev. D
Absolute Maximum Ratings
Parameter
Min
Max
6
Unit
V
VIN, VOUT, ON, FLAGB to GND
Power Dissipation @ TA = 25°C (note 1)
Operating Junction Temperature
Storage Temperature
-0.3
667
125
150
150
mW
°C
-40
-65
°C
Thermal Resistance, Junction to Ambient
°C/W
V
HBM
MM
4000
400
Electrostatic Discharge Protection
V
Recommended Operating Range
Parameter
Min
1.8
Max
5.5
Unit
V
VIN
Ambient Operating Temperature, TA
-40
85
°C
Electrical Characteristics
VIN =1.8to5.5V,TA =-40to+85°Cunlessotherwisenoted.TypicalvaluesareatVIN =3.3VandTA = 25°C.
Parameter
Symbol
Conditions
Min Typ Max Units
Basic Operation
Operating Voltage
VIN
IQ
1.8
5.5
V
VIN = 1.8 to 3.3V
VIN = 3.3 to 5.5V
95
Quiescent Current
IOUT = 0mA
µA
110
200
2
VIN Shutdown Current
VOUT Shutdown Current
VON = 0V, VIN = 5.5V, VOUT short to GND
VON = 0V, VOUT = 5.5V, VIN short to GND
VIN = 3.3V, IOUT = 50mA, TA = 25°C
VIN = 3.3V, IOUT = 50mA, TA = 85°C
VIN = 3.3V, IOUT = 50mA, TA = -40°C to +85°C
VIN = 1.8V
µA
µA
2
125
150
160
200
200
On-Resistance
RON
mΩ
65
0.75
1.30
ON Input Logic High Voltage (ON)
ON Input Logic Low Voltage
VIH
VIL
V
V
VIN = 5.5V
VIN = 1.8V
0.5
1.0
1
VIN = 5.5V
ON Input Leakage
Off Switch Leakage
VON = VIN or GND
µA
µA
ISWOFF
VON = 0V, VOUT = 0V
1
V
IN = 5V, ISINK = 10mA
0.1
0.2
0.3
1
FLAGB Output Logic Low Voltage
V
VIN = 1.8V, ISINK = 10mA
VIN = 5V, Switch on
0.15
FLAGB Output High Leakage Current
Protections
µA
Current Limit
ILIM
VIN = 3.3V, VOUT = 3.0V
Shutdown Threshold
Return from Shutdown
Hysteresis
200
1.5
300
140
130
10
400
mA
°C
Thermal Shutdown
Under Voltage Shutdown
UVLO
VIN Increasing
1.6
50
1.7
V
Under Voltage Shutdown Hysteresis
mV
3
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FPF2116 Rev. D
Electrical Characteristics Cont.
VIN = 1.8 to 5.5V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25°C.
Parameter
Symbol
Conditions
Min Typ Max Units
Dynamic
Turn On Time
tON
tOFF
RL = 500Ω, CL = 0.1µF
25
50
µs
µs
µs
µs
ms
ms
Turn Off Time
RL = 500Ω, CL = 0.1µF
RL = 500Ω, CL = 0.1µF
RL = 500Ω, CL = 0.1µF
VOUT Rise Time
VOUT Fall Time
Over Current Blanking Time
Auto-Restart Time
tRISE
12
tFALL
120
30
tBLANK
tRESTART
15
60
240
480
960
V
IN = VON = 3.3V. Moderate
3
µs
ns
Over-Current Condition.
Short Circuit Response Time
V
IN = VON = 3.3V. Hard Short.
20
Note 1: Package power dissipation on 1square inch pad, 2 oz copper board.
4
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FPF2116 Rev. D
Typical Characteristics
120
130
110
90
VON = V
IN
110
100
90
VIN = 5.5V
VIN = 3.3V
80
VIN = 1.8V
70
70
50
60
-40
-15
10
TJ, JUNCTION TEMPERATURE (oC)
Figure 2. Quiescent Current vs. Temperature
35
60
85
85
85
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
SUPPLY VOLTAGE (V)
Figure 1. Quiescent Current vs. Input Voltage
2500
500
400
300
200
100
0
2000
1500
1000
500
0
V
IN = 5.5V
VIN = 5.5V
VIN = 3.3V
VIN = 3.3V
-40
-15
10
35
60
-40
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (oC)
TJ, JUNCTION TEMPERATURE (oC)
Figure 3. ISHUTDOWN Current vs. Temperature
Figure 4. ISWITCH-OFF Current vs. Temperature
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
1.4
1.2
1
VIN = 5.5V
0.8
0.6
0.4
0.2
0
VIN = 3.3V
-40
-15
10
35
60
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
TJ, JUNCTION TEMPERATURE (oC)
SUPPLY VOLTAGE (V)
Figure 5. Reverse Current vs. Output Voltage
Figure 6. Reverse Current vs. Temperature
5
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FPF2116 Rev. D
Typical Characteristics
500
500
400
300
200
100
400
300
200
100
-40
-15
10
TJ, JUNCTION TEMPERATURE (oC)
Figure 8. Current Limit vs. Temperature
35
60
85
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
3
85
85
V -VOUT (V)
IN
Figure 7. Current Limit vs. Output Voltage
200
1.4
1.2
1
180
160
140
120
100
80
VIN = 1.8V
0.8
0.6
0.4
0.2
0
VIN = 3.3V
V
IN = 5.5V
60
-40
-15
10
35
60
1.5
2
2.5
3
3.5
4
4.5
5
5.5
TJ, JUNCTION TEMPERATURE (oC)
V , INPUT VOLTAGE (V)
IN
Figure 9. RON vs. Temperature
Figure 10. On Threshold vs. VIN
1000
100
ILOAD = 10mA
CC = 3.3V
ILOAD = 10mA
VCC = 3.3V
V
T(FALL)
100
10
1
TOFF
T(RISE)
TON
10
-40
-15
TJ, JUNCTION TEMPERATURE (oC)
Figure 11. TON/TOFF vs. Temperature
10
35
60
-40
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (oC)
Figure 12. TRISE/TFALL vs. Temperature
6
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FPF2116 Rev. D
Typical Characteristics
40
600
550
500
450
400
35
30
25
20
-40
-15
10
35
60
85
-40
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (oC)
TJ, JUNCTION TEMPERATURE (oC)
Figure 13. TBLANK vs. Temperature
Figure 14. TRESTART vs. Temperature
VON
VON
2V/DIV
2V/DIV
VOUT
VOUT
2V/DIV
2V/DIV
IOUT
IOUT
200mA/DIV
200mA/DIV
VFLAGB
2V/DIV
VFLAGB
2V/DIV
10ms/DIV
100ms/DIV
Figure 15. TBLANK Response
Figure 16. TRESTART Response
RL = 500Ω, CL = 0.1µF
RL = 500Ω, CL = 0.1µF
VON
VON
2V/DIV
2V/DIV
IOUT
IOUT
10mA/DIV
10mA/DIV
100µs/DIV
200ns/DIV
Figure 17. TON Response
Figure 18. TOFF Response
7
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FPF2116 Rev. D
Typical Characteristics
VIN = VON
VIN
CIN = 10µF
2V / DIV
COUT = 0.1µF
V
IN/VON
2V/DIV
IOUT
5A/DIV
IOUT
200mA/DIV
VOUT
2V/DIV
20µs/DIV
50µs/DIV
Figure 19. Short Circuit Response Time
(Output Shorted to GND)
Figure 20. Current Limit Response
(Switch power up to hard short)
VIN
2V/DIV
VON
2V/DIV
IOUT
200mA/DIV
50µs/DIV
Figure 21. Current Limit Response Time
(Output Shorted to GND by 10Ω, moderate short)
8
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FPF2116 Rev. D
Current Limiting
Description of Operation
The current limit ensures that the current through the switch
doesn't exceed 400mA while not limiting at less than 200mA.
The part has a blanking time of 30 ms, nominally, during which
the switch will act as a constant current source. At the end of the
blanking time, the switch will be turned-off and the FLAGB pin
will activate to indicate that current limiting has occurred.
The FPF2116 is a current limited switch that protects systems
and loads which can be damaged or disrupted by the
application of high currents. The core of the device is a 0.125Ω
P-channel MOSFET and a controller capable of functioning over
a wide input operating range of 1.8-5.5V. The controller protects
against system malfunctions through current limiting, under-
voltage lockout and thermal shutdown. The current limit is
preset for 200mA.
Under-Voltage Lockout
The under-voltage lockout turns-off the switch if the input
voltage drops below the under-voltage lockout threshold. With
the ON pin active the input voltage rising above the
under-voltage lockout threshold will cause a controlled turn-on
of the switch which limits current over-shoots.
On/Off Control
The ON pin controls the state of the switch. Activating ON
continuously holds the switch in the on state so long as there is
no fault. An under-voltage on VIN or a junction temperature in
excess of 150°C overrides the ON control to turn off the switch.
In addition, excessive current will cause the switch to turn off.
The part has an Auto-Restart feature which will automatically
turn the switch on again after 480 ms. ON is active HI and has a
low threshold making it capable of interfacing with low voltage
signals. When the MOSFET is off, the body diode is disabled so
no current can flow through it.
Thermal Shutdown
The thermal shutdown protects the part from internally or
externally generated excessive temperatures. During an over-
temperature condition the FLAGB is activated and the switch is
turned-off. The switch automatically turns-on again if
temperature of the die drops below the threshold temperature.
Fault Reporting
Upon the detection of an over-current, an input under-voltage,
or an over-temperature condition, the FLAGB signals the fault
mode by immediately activating LO. The FLAGB goes LO at the
end of the blanking time. It will remain LO during the fault and
immediately returns HI at the end of the fault condition. FLAGB
is an open-drain MOSFET which requires a pull-up resistor
between VIN and FLAGB. During shutdown, the pull-down on
FLAGB is disabled to reduce current draw from the supply.
9
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FPF2116 Rev. D
Application Information
Typical Application
VOUT
VIN
ON
R1 = 100KΩ
FPF2116
R2 = 110Ω
OFF ON
5.5V MAX
FLAGB
Battery
5.5V
C2 = 0.1µF
GND
C1 = 4.7µF
Input Capacitor
Board Layout
To limit the voltage drop on the input supply caused by transient
in-rush currents when the switch turns-on into a discharged load
capacitor or a short-circuit, a capacitor needs to be placed
between VIN and GND. A 4.7µF ceramic capacitor, CIN, must be
placed close to the VIN pin. A higher value of CIN can be used to
further reduce the voltage drop experienced as the switch is
turned on into a large capacitive load.
For best performance, all traces should be as short as possible.
To be most effective, the input and output capacitors should be
placed close to the device to minimize the effects that parasitic
trace inductances may have on normal and short-circuit
operation. Using wide traces for VIN, VOUT and GND will help
minimize parasitic electrical effects along with minimizing the
case to ambient thermal impedance.
Output Capacitor
A 0.1uF capacitor COUT, should be placed between VOUT and
GND. This capacitor will prevent parasitic board inductances
from forcing VOUT below GND when the switch turns-off. The
total output capacitance needs to be kept below a maximum
value, COUT(max), to prevent the part from registering an
over-current condition and turning off the switch. The maximum
output capacitance can be determined from the following
formula,
ILIM(min) × tBLANK(min)
(1)
COUT(max) = -----------------------------------------------------------------
VIN
Power Dissipation
During normal operation as a switch, the power dissipation is
small and has little effect on the operating temperature of the
part. The parts with the higher current limits will dissipate the
most power and that will only be,
P = (ILIM)2 × RDS = (0.4)2 × 0.125 = 20mW
(2)
When in current limit the maximum power dissipation will occur
when the output is shorted to ground. The power dissipation will
scale by the Auto-Restart Time, tRSTRT, and the Over Current
Blanking Time, tBLANK, so that the maximum power dissipated
is typically,
tBLANK
-------------------------------------------
P(max) =
× VIN(max) × ILIM(max)
t
RETRY + tBLANK
60
60 + 960
----------------------
=
× 5.5 × 0.4 = 130mW
(3)
10
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FPF2116 Rev. D
Dimensional Outline and Pad Layout
11
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FPF2116 Rev. D
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not intended to be an exhaustive list of all such trademarks.
®
Build it Now™
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PDP SPM™
Power-SPM™
PowerTrench
The Power Franchise
®
®
Global Power ResourceSM
Green FPS™
Programmable Active Droop™
TinyBoost™
TinyBuck™
®
QFET
Current Transfer Logic™
Green FPS™ e-Series™
GTO™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
QS™
Quiet Series™
RapidConfigure™
Saving our world, 1mW at a time™
SmartMax™
®
TinyLogic
®
EcoSPARK
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
µSerDes™
EfficentMax™
EZSWITCH™ *
™
SMART START™
®
SPM
MicroPak™
MillerDrive™
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Motion-SPM™
STEALTH™
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SuperSOT™-3
SuperSOT™-6
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SupreMOS™
®
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Ultra FRFET™
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OPTOLOGIC
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tm
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Datasheet contains the design specifications for product development. Specifications may change
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Rev. I35
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FPF2116 Rev. D
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