FODM452R2 [ONSEMI]
5引脚MFP高速晶体管输出光耦合器;
| 型号： | FODM452R2 |
| 厂家： | 
ONSEMI |
| 描述： | 5引脚MFP高速晶体管输出光耦合器 局域网 输出元件 晶体管 光电 |
| 文件： | 总12页 (文件大小：186K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
5-Pin Mini Flat Package
High Speed Transistor
Optocoupler
MFP5 4.1X4.4, 2.54P
CASE 100AM
FODM452, FODM453
MARKING DIAGRAM
Description
The FODM452 and FODM453 optocouplers consist of an AlGaAs
LED optically coupled to a high speed photo−detector transistor. The
devices are housed in a compact 5−pin mini flat package for optimum
mounting density.
M452
X
YY
M
V
The FODM453 features a high CMR rating for optimum common
mode transient immunity.
M45x = Device Number (x = 2, 3)
V
= DIN EN/IEC60747−5−5 Mark (Note: Only
Appears on Parts Ordered with VDE Option –
See Order Entry Table)
Features
• Compact 5−pin Mini Flat Package
• High Speed − 1 MBit/s
X
YY
= One Digit Year Code, e.g., ‘7’
= ‘Two Digit Work Week Ranging from ‘01’ to
‘53’
• Superior CMR − 15 kV/ms at V = 1500 V (FODM453)
CM
M
= Assembly Package Code
• Performance Guaranteed over Temperature (0 – 70°C)
• U.L. Recognized (File # E90700)
• VDE0884 Recognized (File # 136480)
– Ordering Option V, e.g., FODM452V
• 260°C Reflow Capability for Pb−free Assembly
• These are Pb−Free Devices
FUNCTIONAL SCHEMATIC
ANODE 1
6 VCC
Applications
VO
5
• Line Receivers
• Pulse Transformer Replacement
• Output Interface to CMOS−LSTTL−TTL
• Wide Bandwidth Analog Coupling
CATHODE 3
4 GND
TRUTH TABLE
LED
Off
Output
High
On
Low
ORDERING INFORMATION
See detailed ordering and shipping information on page 10 of
this data sheet.
© Semiconductor Components Industries, LLC, 2003
1
Publication Order Number:
May, 2022 − Rev. 2
FODM453/D
FODM452, FODM453
PIN DEFINITIONS
Number
Name
Function Description
1
3
4
5
6
ANODE
CATHODE
GND
Anode
Cathode
Output Ground
Output Voltage
V
O
V
CC
Output Supply Voltage
SAFETY AND INSULATION RATINGS FOR MINI−FLAT PACKAGE (SO5 PIN)
(As per DIN EN/IEC60747−5−5. This optocoupler is suitable for “safe electrical insulation” only within the safety limit data. Compliance
with the safety ratings shall be ensured by means of protective circuits.)
Symbol
Parameter
Installation Classifications per DIN VDE 0110/1.89 Table 1
For Rated Main Voltage <150 Vrms
For Rated Main Voltage <300 Vrms
Climatic Classification
Min
−
Typ
Max
−
Unit
−
−
I−IV
−
−
I−III
−
−
40/85/21
−
Pollution Degree (DIN VDE 0110/1.89)
Comparative Tracking Index
−
2
−
−
−
CTI
175
1060
−
V
PR
Input to Output Test Voltage, Method b,
−
VIORM x 1.875 = V , 100% Production Test with t = 1 s,
PR
m
Partial Discharge <5 pC
V
PR
Input to Output Test Voltage, Method a,
848
−
−
VIORM x 1.5 = V , Type and Sample Test with t = 60 s,
PR
m
Partial Discharge <5 pC
V
Max Working Insulation Voltage
Highest Allowable Over Voltage
External Creepage
565
4000
5.0
−
−
−
−
−
−
−
−
−
−
−
−
V
IORM
peak
V
V
peak
IOTM
mm
mm
mm
°C
External Clearance
5.0
Insulation thickness
0.5
T
Safety Limit Values, Maximum Values Allowed in the Event of a Failure,
Case Temperature
150
Case
9
R
Insulation Resistance at T , V = 500 V
10
−
−
W
IO
S
IO
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2
FODM452, FODM453
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
Symbol
Parameter
Rating
Unit
°C
T
STG
Storage Temperature
Operating Temperature
−40 to +125
−40 to +85
T
OPR
°C
EMITTER
I (avg)
DC/Average Forward Input Current
25
50
1.0
5
mA
mA
A
F
I (pk)
F
Peak Forward Input Current (50% Duty Cycle, 1 ms P.W.)
I (trans) Peak Transient Input Current (≤1 ms P.W., 300 pps)
F
V
P
Reverse Input Voltage
V
R
Input Power Dissipation
45
mW
D
(No Derating Required over Specified Operating Temp Range)
DETECTOR
(avg)
I
O
Average Output Current
Peak Output Current
Supply Voltage
8
mA
mA
V
I
O
(pk)
16
V
CC
−0.5 to 30
−0.5 to 20
100
V
Output Voltage
V
O
D
P
Output Power Dissipation
mW
(No Derating Required over Specified Operating Temp Range)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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3
FODM452, FODM453
ELECTRICAL CHARACTERISTICS (T = 0 to 70°C unless otherwise noted)
A
Symbol
Parameter
Test Condition
Device
Min
Typ*
Max
Unit
INDIVIDUAL COMPONENT CHARACTERISTICS
EMITTER
V
Input Forward Voltage
I = 16 mA, T = 25°C
−
−
1.60
−
1.7
1.8
−
V
F
F
A
I = 16 mA
F
B
VR
Input Reverse Breakdown
Voltage
I
R
= 10 mA
5.0
−
V
DV /DT
F
Temperature Coefficient of
Forward Voltage
I = 16 mA
F
−
−1.8
−
mV/°C
A
DETECTOR
Logic High Output Current
I
I = 0 mA, V = V = 5.5 V, T = 25°C
−
−
−
−
−
−
.001
.001
−
0.5
1
mA
OH
F
O
CC
A
I = 0 mA, V = V = 15 V, T = 25°C
F
O
CC
A
I = 0 mA, V = V = 15 V
50
200
1
F
O
CC
I
Logic Low Supply Current
Logic high Supply Current
I = 16 mA, V = Open, V = 15 V
100
0.05
−
mA
mA
CCL
F
O
CC
I
I = 0 mA, V = Open, V = 15 V, T = 25°C
F O CC A
CCH
I = 0 mA, V = Open, V = 15 V
2
F
O
CC
TRANSFER CHARACTERISTICS
COUPLED
CTR
Current Transfer Ratio
(Note 1)
I = 16 mA,
T = 25°C, V = 0.4 V
20
15
−
−
−
−
−
50
−
%
V
F
A
OL
V
CC
= 4.5 V
V
OL
= 0.5 V
V
OL
Logic LOW Output Voltage
I = 16 mA, I = 3 mA, V = 4.5 V, T = 25°C
F
0.4
0.5
O
CC
A
I = 16 mA, I = 2.4 mA, V = 4.5 V
F
−
O
CC
SWITCHING CHARACTERISTICS (V = 5 V)
CC
T
PHL
Propagation Delay Time to
Logic LOW
−
0.40
0.8
R = 1.9 kW, I = 16 mA, T = 25°C (Note 2)
ms
L
F
A
(Figure 9)
R = 1.9 kW, I = 16 mA (Note 2) (Figure 9)
−
−
−
1.0
0.8
ms
ms
L
F
T
PLH
Propagation Delay Time to
Logic HIGH
0.35
R = 1.9 kW, I = 16 mA, T = 25°C (Note 2)
L
F
A
(Figure 9)
R = 1.9 kW, I = 16 mA (Note 2) (Figure 9)
−
5
−
1.0
−
ms
L
F
|CM |
Common Mode Transient
Immunity at Logic HIGH
FODM452
FODM453
FODM452
FODM453
15
I = 0 mA, V = 10 V , R = 1.9 kW,
KV/ms
H
F
CM
P−P
L
T = 25°C (Note 3) (Figure 10)
A
I = 0 mA, V = 1500 V , R = 1.9 kW
15
5
40
15
40
3
−
−
−
−
KV/ms
KV/ms
KV/ms
MHz
F
CM
P−P
L
T = 25°C (Note 3) (Figure 10)
A
|CM |
Common Mode Transient
Immunity at Logic LOW
I = 16 mA, V = 10 V , R = 1.9 kW,
L
F
CM
P−P
L
T = 25°C (Note 3) (Figure 10)
A
I = 16 mA, V = 1500 V , R = 1.9 kW,
15
−
F
CM
P−P
L
T = 25°C (Note 3) (Figure 10)
A
BW
Bandwidth
R = 100 W
L
ISOLATION CHARACTERISTICS
V
Withstand Insulation Test
Voltage
RH ≤ 50%, T = 25°C, t = 1 min. (Note 4)
3750
−
−
−
−
V
ISO
A
RMS
C
Capacitance (Input to Output) f = 1 MHz (Note 4)
0.2
pF
I−O
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
*All Typicals at T = 25°C
A
1. Current Transfer Ratio is defined as a ratio of output collector current, I , to the forward LED input current, I , times 100%.
O
F
2. The 1.9 kW load represents 1 TTL unit load of 1.6 mA and 5.6 kW pull−up resistor.
3. Common mode transient immunity in logic high level is the maximum tolerable (positive) dV /dt on the leading edge of the common mode
cm
pulse signal V , to assure that the output will remain in a logic high state (i.e., V > 2.0 V). Common mode transient immunity in logic low
CM
O
level is the maximum tolerable (negative) dV /dt on the trailing edge of the common mode pulse signal, V , to assure that the output will
cm
CM
remain in a logic low state (i.e., V < 0.8 V).
O
4. Device is considered a two terminal device: Pins 1, and 3 are shorted together and Pins 4, 5, and 6 are shorted together.
www.onsemi.com
4
FODM452, FODM453
TYPICAL PERFORMANCE CURVES
1.20
100
10
T = 25°C
V
V
= 0.4 V
A
O
= 5 V
CC
1.15
1.10
1.05
1.00
0.95
0.90
T = 25°C
A
Normalized to I = 16 mA
F
1
0.1
0.01
0.001
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1
10
I , INPUT CURRENT (mA)
V , FORWARD CURRENT (mA)
F
F
Figure 1. Input Forward Current vs Forward Voltage
Figure 2. Normalized Current Transfer Ratio vs.
Input Current
1.6
I = 16 mA
V = V = 5 V
O CC
I = 0 V
F
F
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
V
V
= 0.4 V
O
= 5 V
CC
10
1
Normalized to T = 25°C
A
0.1
−40
−20
0
20
40
60
80
100
−40
−20
0
20
40
60
80
100
T , AMBIENT TEMPERATURE
A
T , TEMPERATURE (°C)
A
Figure 3. Normalized Current Transfer Ratio vs.
Ambient Temperature
Figure 4. Logic High Output Current vs.
Ambient Temperature
10
14
T = 25°C
CC
T = 25°C
CC
A
V
A
V
12
= 5 V
= 5 V
I = 40 mA
F
35 mA
30 mA
25 mA
20 mA
15 mA
10 mA
I = 16 mA
I = 10 mA
F
10
8
F
t
t
PLH
1
6
4
PHL
5 mA
2
0
0.1
0
2
4
6
8
10
12
14
16
1
2
3
4
5
6
7 8 9 10
V , OUTPUT VOLTAGE (V)
O
R , LOAD RESISTANCE (kW)
L
Figure 5. DC and Pulsed Transfer Characteristics
Figure 6. Propagation Delay vs. Load Resistance
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5
FODM452, FODM453
TYPICAL PERFORMANCE CURVES (Continued)
1400
1200
1000
800
5
0
I = 16 mA
F
R = 220 W
L
V
CC
= 5 V
R = 1.9 kW
L
R = 100 W
L
−5
600
R = 470 W
L
t
PHL
400
−10
−15
t
PLH
I = 16 mA
F
R = 1 kW
L
V
CC
= 5 V
200
0
T = 25°C
A
−40
−20
0
20
40
60
80
100
0.01
0.1
1
10
T , AMBIENT TEMPERATURE (°C)
A
f, FREQUENCY (MHz)
Figure 7. Propagation Delay vs. Ambient
Temperature
Figure 8. Frequency Response
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6
FODM452, FODM453
Pulse
Generator
tr = 5 ns
Noise
Shield
+
IF
VCC
VO
+5 V
VO
1
3
6
5
Z
O
= 50 W
RL
10% D.C.
I/f < 100 ms
0.1 mF
4
GND
IF Monitor
C = 1.5 mF
L
Rm
IF
0
VO
5 V
1.5 V
1.5 V
TPLH
VOL
TPHL
Figure 9. Switching Time Test Circuit
IF
Noise
Shield
+
VCC
VO
+5 V
1
3
6
5
RL
VO
A
B
VFF
0.1 mF
GND
−
4
VCM
+
−
Pulse Gen
VCM10 V
0 V
90% 90%
10%
tr
10%
tf
VO
5 V
Switch at A : I = 0 mA
F
VO
VOL
Switch at A : I = 16 mA
F
Figure 10. Common Mode Immunity Test Circuit
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7
FODM452, FODM453
FOOTPRINT DRAWING FOR PCB LAYOUT
0.61
1.27
1.27
1.27
Device
‘A’
Device
‘B’
5.05
7.95
Pin 1
Pin 1
1.45
2.54
End Stacking Configuration
Unutilized Solder Pad
Dimensions in millimeters
Figure 11. Footprint Drawing for PCB Layout
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8
FODM452, FODM453
REFLOW PROFILE
Max. Ramp−up Rate = 3°C/s
Max. Ramp−down Rate = 6°C/s
T
P
260
240
t
P
T
L
220
200
180
160
140
120
T
smax
t
L
Preheat Area
T
smin
t
s
100
80
60
40
20
0
120
240
360
Time 25°C to Peak
Time (seconds)
Figure 12. Reflow Profile
Table 1. REFLOW PROFILE
Profile Freature
Pb−Free Assembly Profile
150°C
Temperature Minimum (T
)
smin
Temperature Maximum (T
)
200°C
smax
Time (t ) from (T
to T )
smax
60 – 120 seconds
3°C/second max.
217°C
S
smin
Ramp−up Rate (t to t )
L
P
Liquidous Temperature (T )
L
Time (t ) Maintained Above (T )
60 – 150 seconds
260°C +0°C / –5°C
30 seconds
L
L
Peak Body Package Temperature
Time (t ) within 5°C of 260°C
P
Ramp−down Rate (T to T )
6°C/second max.
8 minutes max.
P
L
Time 25°C to Peak Temperature
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9
FODM452, FODM453
ORDERING INFORMATION
Part Number
†
Package
Shipping
FODM452
MFP5 4.1X4.4, 2.54P
(Pb−Free)
100 Units / Tube
2500 / Tape & Reel
100 Units / Tube
FODM452R2
FODM452V
MFP5 4.1X4.4, 2.54P
(Pb−Free)
MFP5 4.1X4.4, 2.54P
IEC60747−5−2
(Pb−Free)
FODM452R2V
MFP5 4.1X4.4, 2.54P
IEC60747−5−2
(Pb−Free)
2500 / Tape & Reel
FODM453
FODM453R2
FODM453V
MFP5 4.1X4.4, 2.54P
(Pb−Free)
100 Units / Tube
2500 / Tape & Reel
100 Units / Tube
MFP5 4.1X4.4, 2.54P
(Pb−Free)
MFP5 4.1X4.4, 2.54P
IEC60747−5−2
(Pb−Free)
FODM453R2V
MFP5 4.1X4.4, 2.54P
IEC60747−5−2
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
10
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
MFP5 4.1X4.4, 2.54P
CASE 100AM
ISSUE O
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13486G
MFP5 4.1X4.4, 2.54P
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
ADDITIONAL INFORMATION
TECHNICAL PUBLICATIONS:
Technical Library: www.onsemi.com/design/resources/technical−documentation
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ONLINE SUPPORT: www.onsemi.com/support
For additional information, please contact your local Sales Representative at
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