FMS6303MTC1406X [ONSEMI]
视频滤波器驱动器，3 沟道，用于 SD、ED、HD (1080i) 和 HD (1080p);
| 型号： | FMS6303MTC1406X |
| 厂家： | 
ONSEMI |
| 描述： | 视频滤波器驱动器，3 沟道，用于 SD、ED、HD (1080i) 和 HD (1080p) 驱动 光电二极管 商用集成电路 驱动器 |
| 文件： | 总14页 (文件大小：902K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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February 2012
FMS6303
Low-Cost, 3-Channel, Video Filter Driver for
SD/ED/HD (1080i)/HD (1080P)
Features
Description
FMS6303 offers comprehensive filtering for set-top box
or DVD applications. It is intended to replace passive LC
filters and drivers with a low-cost integrated device.
.
Three 6th-Order Video Anti-Aliasing or
Reconstruction Filters
.
.
Supports Component YPrPb or RGB Video
Filter channels are specialized for either component
(YPbPr) or RGB video signals. These channels offer a
selectable frequency response of 8, 16, 32, or 64MHz.
Additional functionality of these channels includes input
biasing mode and output disable.
Three Channels: Selectable to 8MHz, 16MHz,
32MHz, or 64MHz for SD/ED/HD_1080i, HD_1080p
Applications
.
.
Single Video Load Driver (2VPP, 150Ω, AV = 6dB)
The FMS6303 may be driven directly by a DC-coupled
DAC output or an AC-coupled signal. All inputs accept
standard 1Vpp video signals.
Selectable Clamp or Bias Mode on Pb/B,
Pr/R Inputs
.
.
.
.
.
AC- or DC-Coupled Inputs and Outputs
DC-Coupled Outputs Eliminate Coupling Capacitors
Output Disable
Each channel includes an output amplifier capable of
driving a single (150Ω) AC- or DC-coupled video load.
All outputs can be disabled to save power in DC-coupled
applications.
Single 5V Supply
2kV CDM / 9kV HBM ESD Protection
Applications
.
.
.
.
.
Cable and Satellite Set-Top Boxes
DVD Players
HDTV
Personal Video Recorders (PVR)
Video On Demand (VOD)
Figure 1. Block Diagram
Ordering Information
Operating
Temperature
Range
Part Number
Gain Setting
Package
Packing Method
FMS6303MTC1406X
-40°C to +85°C
6dB
TSSOP-14
Tape and Reel
Note:
1. Moisture sensitivity level for all parts is MSL-1.
© 2007 Fairchild Semiconductor Corporation
FMS6303 • Rev. 1.0.2
www.fairchildsemi.com
Pin Configuration
VCC
VCC
1
2
3
4
5
6
7
14
13
12
11
10
9
FSEL0
Y/G In
FSEL1
Y/G Out
Pb/B Out
Pr/R Out
OE
Pb/B In
Pr/R In
BIAS
GND
GND
8
Figure 2. Pin Configuration
Pin Definitions
Pin #
1
Name
VCC
Type
Input
Input
Input
Input
Input
Input
Input
Input
Input
Output
Output
Output
Input
Input
Description
+5V supply
2
fSEL0
Selects filter corner frequency
Selectable video input
Selectable video input
Selectable video input
3
Y/G In
Pb/B In
Pr/R In
BIAS
4
5
6
Input Bias on Pb/B Pr/R 0=Bias 1=Clamp
Must be tied to ground. Do not float.
Must be tied to ground. Do not float.
Output disable control: 0=OFF, 1=ON
Filtered SD, ED, HD I, HD P video output
Filtered SD, ED, HD I, HD P video output
Filtered SD, ED, HD I, HD P video output
Selects filter corner frequency
7
GND
8
GND
9
OE
10
11
12
13
14
Pr/R Out
Pb/B Out
Y/G Out
fSEL1
VCC
+5V supply
Frequency Select Truth Table
fSEL1
fSEL0
Filter Frequency
8MHz
Video Format
SD, 480i
Sync Format
0
0
1
1
0
1
0
1
Bi-level, 4.70µs Pulsewidth
Bi-level, 2.35µs Pulsewidth
Tri-level, 589ns Pulsewidth
Tri-level, 295ns Pulsewidth
16MHz
ED, 480p
32MHz
HD,1080i, 720p
HD, 1080p
64MHz
© 2007 Fairchild Semiconductor Corporation
FMS6303 • Rev. 1.0.2
www.fairchildsemi.com
2
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
VCC
Parameter
Min.
-0.3
-0.3
Max.
6.0
Unit
V
DC Supply Voltage
VIO
Analog and Digital I/O
VCC+0.3
50
V
IOUT
Output Current, Any One Channel, Do Not Exceed
mA
Reliability Information
Symbol
Parameter
Min.
Typ.
Max.
Unit
TJ
TSTG
TL
Junction Temperature
+150
+150
+260
°C
°C
°C
Storage Temperature Range
-65
Reflow Temperature, Soldering 10 Seconds
Thermal Resistance, JEDEC Standard Multi-Layer Test
Boards, Still Air
97
°C/W
ΘJA
Electrostatic Discharge Information
Symbol
Parameter
Max.
Unit
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
9
2
ESD
kV
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
TA
Parameter
Min.
-40
Typ.
Max.
+85
Unit
°C
Operating Temperature Range
Supply Voltage Range
VCC
4.75
5.00
5.25
V
Electrical Characteristics
Unless otherwise noted, TA=25°C, VCC=5V, RSOURCE=37.5Ω, inputs AC coupled with 0.1µF, all outputs AC coupled
with 220µF into 150Ω loads, referenced to 400kHz.
Symbol
Parameter
Channel Gain(2)
Condition
Min.
Typ.
6.0
36
Max.
Unit
Av
DC
5.8
6.2
dB
No Load, SD, ED, HD 1080i
No Load, HD 1080p
ICC
Supply Current(2)
mA
60
80
40
ICC_SD
Shutdown Supply Current(2)
No Load, Output Disabled
DC (All Channels)
20
mA
dB
PSRR Power Supply Rejection
70
Referenced to GND if DC
Coupled
VIN
Video Input Voltage Range
1.0
10
VPP
VIL
VIH
Digital Input Low(2)
Digital Input High(2)
fSEL0, fSEL1
0
0.8
V
V
fSEL0, fSEL1
2.4
VCC
tENABLE Output Enable Time
µs
150Ω DC Load
Note:
2. 100% tested at 25°C.
© 2007 Fairchild Semiconductor Corporation
FMS6303 • Rev. 1.0.2
www.fairchildsemi.com
3
Standard Definition (480i) Electrical Characteristics
Unless otherwise noted, TA=25°C, VCC=5V, RSOURCE=37.5Ω, all inputs AC coupled with 0.1µF, all outputs AC coupled
with 220µF into 150Ω loads, referenced to 400kHz.
Symbol
AVSD
f1dBSD
fcSD
Parameter
Channel Gain Error(3)
-1dB Bandwidth(3)
-3dB Bandwidth(3)
Attenuation (Stopband Reject)(3)
Condition
Min.
-0.2
5.2
Typ.
0
Max.
Unit
dB
DC
0.2
7.0
8.0
50
MHz
MHz
dB
6.5
fSBSD
DG
f=27MHz
45
Differential Gain
0.1
0.8
0.25
-78
%
DP
Differential Phase
°
THD
Total Harmonic Distortion, Output VOUT=1.4VPP, 3.58MHz
%
XTALKSD
Crosstalk (ch-to-ch)
1MHz
dB
NTC-7 Weighting, 100kHz to
4.2MHz
SNR
Signal-to-Noise Ratio(4)
74
65
dB
ns
Delay from Input to Output,
4.5MHz
tpdSD
Propagation Delay
Notes:
3. 100% tested at 25°C.
4. SNR=20 • log (714mV / rms noise).
Enhanced Definition (480p) Electrical Characteristics
Unless otherwise noted, TA=25°C, VCC=5V, RSOURCE=37.5Ω, inputs AC coupled with 0.1µF, all outputs AC coupled
with 220µF into 150Ω loads, referenced to 400kHz.
Symbol
AVED
Parameter
Channel Gain Error(5)
-1dB Bandwidth(5)
-3dB Bandwidth(5)
Attenuation (Stopband Reject)(5)
Condition
Min.
-0.2
10
Typ.
0
Max.
Unit
dB
DC
0.2
f1dBSED
fcED
14
MHz
MHz
dB
13
16
fSBED
f=54MHz
37
50
THD
Total Harmonic Distortion, Output VOUT=1.4VPP, 7MHz
0.1
-70
%
XTALKED
Crosstalk (ch-to-ch)
1MHz
dB
Unweighted; 100kHz to
15MHz
SNR
Signal-to-Noise Ratio(6)
66
30
dB
ns
Delay from Input to Output,
10MHz
tpdED
Propagation Delay
Notes:
5. 100% tested at 25°C.
6. SNR=20 • log (714mV / rms noise).
© 2007 Fairchild Semiconductor Corporation
FMS6303 • Rev. 1.0.2
www.fairchildsemi.com
4
High-Definition (1080i) Electrical Characteristic
Unless otherwise noted, TA=25°C, VCC=5V, RSOURCE=37.5Ω, inputs AC coupled with 0.1µF, all outputs AC coupled
with 220µF into 150Ω loads, referenced to 400kHz.
Symbol
AVHD
Parameter
Channel Gain Error(7)
-1dB Bandwidth(7)
-3dB Bandwidth(7)
Condition
Min.
-0.2
28
Typ.
0
Max.
Unit
dB
DC
0.2
f1dBHD
fcHD
30
MHz
MHz
30
32
Attenuation (Stopband
Reject)(7)
fSBHD
THD
f=74.25MHz
30
40
dB
%
Total Harmonic
Distortion, Output
0.5
VOUT=1.4VPP, 22MHz, 6dB, 150Ω Load
1MHz
-72
-63
66
dB
dB
dB
ns
XTALKHD Crosstalk (ch-to-ch)
30MHz
SNR
tpdHD
Signal-to-Noise Ratio(8)
Propagation Delay
Unweighted, 100kHz to 30MHz
Delay from Input to Output, 20MHz
17
Notes:
7. 100% tested at 25°C.
8. SNR=20 • log (714mV / rms noise).
High-Definition (1080p) Electrical Characteristics
Unless otherwise noted, TA=25°C, VCC=5V, RSOURCE=37.5Ω, inputs AC coupled with 0.1µF, all outputs AC coupled
with 220µF into 150Ω loads, referenced to 400kHz.
Symbol
AVHD
Parameter
Channel Gain Error(9)
-1dB Bandwidth(9)
-3dB Bandwidth(9)
Condition
Min.
-0.2
50
Typ.
0
Max.
Unit
dB
DC
0.2
f1dBHD
fcHD
55
MHz
MHz
60
65
Attenuation (Stopband
Reject)(9)
fsbHD
THD
f=148MHz
15
23
dB
%
Total Harmonic
Distortion, Output
0.5
VOUT=1.4VPP, 44MHz, 6dB, 150Ω Load
1MHz
-78
-62
69
8
dB
dB
dB
ns
XTALKHD Crosstalk (ch-to-ch)
60MHz
SNR
tpdHD
Signal-to-Noise Ratio(10) Unweighted, 100kHz to 60MHz
Propagation Delay
Delay from Input to Output, 20MHz
Notes:
9. 100% tested at 25°C.
10. SNR=20 • log (714mV / rms noise).
© 2007 Fairchild Semiconductor Corporation
FMS6303 • Rev. 1.0.2
www.fairchildsemi.com
5
Typical Performance Characteristics
Figure 3. FMS6303 SD Frequency Response
Figure 4. FMS6303 SD Frequency Response (Flatness)
Figure 5. FMS6303 ED Frequency Response
© 2007 Fairchild Semiconductor Corporation
FMS6303 • Rev. 1.0.2
www.fairchildsemi.com
6
Typical Performance Characteristics
Figure 6. FMS6303 ED Frequency Response (Flatness)
Figure 7. FMS6303 1080i HD Frequency Response
Figure 8. FMS6303 1080i HD Frequency Response (Flatness)
© 2007 Fairchild Semiconductor Corporation
FMS6303 • Rev. 1.0.2
www.fairchildsemi.com
7
Typical Performance Characteristics
Figure 9. FMS6303 1080p Frequency Response
Figure 10. FMS6303 1080p Frequency Response (Flatness)
© 2007 Fairchild Semiconductor Corporation
FMS6303 • Rev. 1.0.2
www.fairchildsemi.com
8
Typical Performance Characteristics
Figure 11. Differential Gain
Figure 12. Differential Phase
© 2007 Fairchild Semiconductor Corporation
FMS6303 • Rev. 1.0.2
www.fairchildsemi.com
9
Layout Considerations
General layout and supply bypassing play a major role
.
.
Consider 70µm copper for high-power designs.
in
high-frequency
performance
and
thermal
Make the PCB as thin as possible by reducing FR4
thickness.
characteristics. Fairchild offers an evaluation board to
guide layout and aid device evaluation. The evaluation
board is a four-layer board with full power and ground
planes. Following this layout configuration provides
optimum performance and thermal characteristics for
the device. For the best results, follow the steps and
recommended routing rules listed below.
.
.
.
Use vias in the power pad to tie adjacent layers
together.
Remember that baseline temperature is a function
of board area, not copper thickness.
Use modeling techniques for first-order
approximation.
Recommended Routing / Layout Rules
.
.
Do not run analog and digital signals in parallel.
Output Considerations
Use separate analog and digital power planes to
supply power.
The FMS6303 outputs are DC offset from the input by
150mV; therefore, VOUT = 2•VIN DC+150mV. This offset
is required to obtain optimal performance from the
output driver and is held at the minimum value to
decrease the standing DC current into the load. Since
the FMS6303 has a 2x (6dB) gain, the output is typically
connected via a 75ꢀ-series back-matching resistor
followed by the 75ꢀ video cable. Because of the
inherent divide by two of this configuration, the blanking
level at the load of the video signal is always less than
1V. When AC-coupling the output, ensure that the
coupling capacitor of choice passes the lowest
frequency content in the video signal and that line time
distortion (video tilt) is kept as low as possible.
.
.
.
.
Run traces on top of the ground plane at all times.
Do not run traces over ground/power splits.
Avoid routing at 90-degree angles.
Minimize clock and video data trace length
differences.
.
.
.
.
.
Include 10µF and 0.1µF ceramic power supply
bypass capacitors.
Place the 0.1µF capacitor within 0.1 inches of the
device power pin.
Place the 10µF capacitor within 0.75 inches of the
device power pin.
The selection of the coupling capacitor is a function of
the subsequent circuit input impedance and the leakage
current of the input being driven. To obtain the highest
quality output video signal, the series termination
resistor must be placed as close to the device output pin
as possible. This greatly reduces the parasitic
capacitance and inductance effect on the FMS6303
output driver. Recommended distance from device pin
to place series termination resistor is no greater than 0.1
inches.
For multi-layer boards, use a large ground plane to
help dissipate heat.
For two-layer boards, use a ground plane that
extends beyond the device body by at least 0.5
inches on all sides. Include a metal paddle under
the device on the top layer.
.
Minimize all trace lengths to reduce series
inductance.
Thermal Considerations
Since the interior of most systems, such as set-top
boxes, TVs, and DVD players, are at +70ºC;
consideration must be given to providing an adequate
heat sink for the device package for maximum heat
dissipation. When designing a system board, determine
how much power each device dissipates. Ensure that
devices of high power are not placed in the same
location, such as directly above (top plane) and below
bottom plane) each other on the PCB.
PCB Thermal Layout Considerations
Figure 13. Distance from Device Pin to Series
Termination Resistor
.
Understand the system power requirements and
environmental conditions.
.
Maximize thermal performance of the PCB.
© 2007 Fairchild Semiconductor Corporation
FMS6303 • Rev. 1.0.2
www.fairchildsemi.com
10
Physical Dimensions
0.43 TYP
0.65
1.65
6.10
0.45
12.00°TOP & BOTTOM
R0.09 min
A. CONFORMS TO JEDEC REGISTRATION MO-153,
VARIATION AB, REF NOTE 6
B. DIMENSIONS ARE IN MILLIMETERS
R0.09min
1.00
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
AND TIE BAR EXTRUSIONS
D. DIMENSIONING AND TOLERANCES PER ANSI
Y14.5M, 1982
E. LANDPATTERN STANDARD: SOP65P640X110-14M
F. DRAWING FILE NAME: MTC14REV6
Figure 14. 14-Lead Thin Shrink Small Outline Package (TSSOP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2007 Fairchild Semiconductor Corporation
FMS6303 • Rev.1.0.2
www.fairchildsemi.com
11
© 2007 Fairchild Semiconductor Corporation
FMS6303 • Rev.1.0.2
www.fairchildsemi.com
12
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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