FMS6203MTC1406X [ONSEMI]
视频滤波器驱动器，3 沟道，用于 SD/PS/HD;
| 型号： | FMS6203MTC1406X |
| 厂家： | 
ONSEMI |
| 描述： | 视频滤波器驱动器，3 沟道，用于 SD/PS/HD 驱动 光电二极管 商用集成电路 驱动器 |
| 文件： | 总10页 (文件大小：653K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
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August 2009
FMS6203
Low-Cost, 3-Channel, Video Filter Driver for SD/PS/HD
Features
Description
FMS6203 offers comprehensive filtering for set-top box
or DVD applications. It is intended to replace passive
LC filters and drivers with a low-cost integrated device.
Three 6th-Order Video Anti-Aliasing or
Reconstruction Filters
Supports Component YPrPb or RGB Video
Filter channels are specialized for either component
(YPbPr) or RGB video signals. These channels offer a
selectable frequency response of 8, 16, or 32MHz. The
filters can also be bypassed for high-frequency
operation. Additional functionality of these channels
includes input biasing mode and output disable.
Three Channels: Selectable to 8MHz, 16MHz, or
32MHz for SD/PS/HD Applications
Includes Wide Bandwidth Bypass Mode
6dB Gain Option Available for 150Ω Double
Terminated Video Load
The FMS6203 may be driven directly by a DC-coupled
DAC output or an AC-coupled signal. All inputs accept
standard 1Vpp video signals.
0dB Gain Option Available for High-Impedance
Loading
Selectable Clamp or Bias Mode on Pb/B,
Pr / B,R Inputs
Each channel includes an output amplifier capable of
driving a single (150Ω) AC- or DC-coupled video load.
All outputs can be disabled to save power in DC-
coupled applications.
Inputs and Outputs can be AC- or DC-Coupled
DC-Coupled Outputs Eliminate Coupling
Capacitors
The device is available in two factory-set options, a 0dB
gain option and a 6dB gain option.
Output Disable
Single 5V Supply
2kV CDM / 8kV HBM ESD Protection
Applications
Cable and Satellite Set-Top Boxes
DVD Players
HDTV
Personal Video Recorders (PVR)
Video On Demand (VOD)
Figure 1. Block Diagram
Ordering Information
Operating
Temperature Gain Setting
Range
Packing
Method
Part Number
Package
Eco Status
FMS6203MTC1400X -40°C to +85°C
FMS6203MTC1406X -40°C to +85°C
0dB
6dB
RoHS
RoHS
TSSOP-14
TSSOP-14
Tape and Reel
Tape and Reel
For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
Note:
1. Moisture sensitivity level is MSL-1.
© 2006 Fairchild Semiconductor Corporation
FMS6203 • Rev. 1.0.4
www.fairchildsemi.com
Pin Configuration
VCC
VCC
1
2
3
4
5
6
7
14
13
12
11
10
9
FSEL0
Y/G In
FSEL1
Y/G Out
Pb/B Out
Pr/R Out
OE
Pb/B In
Pr/R In
BIAS
GND
GND
8
Figure 2. Pin Configuration
Pin Definitions
Pin #
1
Name
VCC
Type
Input
Input
Input
Input
Input
Input
Input
Input
Input
Output
Output
Output
Input
Input
Description
+5V supply
2
FSEL0
Selects filter corner frequency
Selectable video input
3
Y/G In
Pb/B In
Pr/R In
BIAS
4
Selectable video input
5
Selectable video input
6
Input bias on Pb/B Pr/R: 0=Bias 1=Clamp
Must be tied to ground. Do not float.
Must be tied to ground. Do not float.
Output disable control: 0=Disable, 1=Enable
Filtered SD, PS, HD, BP video output
Filtered SD, PS, HD, BP video output
Filtered SD, PS, HD, BP video output
Selects filter corner frequency
+5V supply
7
GND
8
GND
9
OE
10
11
12
13
14
Pr/R Out
Pb/B Out
Y/G Out
FSEL1
VCC
Frequency Select Truth Table
FSEL1
FSEL0
Filter Frequency
8MHz
Video Format
SD, 480i
Sync Format
0
0
1
1
0
1
0
1
Bi-level, 4.70µs Pulsewidth
Bi-level, 2.35µs Pulsewidth
Tri-level, 589ns Pulsewidth
16MHz
PS, 480p
32MHz
HD,1080i, 720p
Bypass
© 2006 Fairchild Semiconductor Corporation
FMS6203 • Rev. 1.0.4
www.fairchildsemi.com
2
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Symbol
VCC
Parameter
Min.
-0.3
-0.3
Max.
6.0
Unit
V
DC Supply Voltage
VIO
Analog and Digital I/O
VCC+0.3
50
V
IOUT
Output Current, Any One Channel, Do Not Exceed
mA
Reliability Information
Symbol
Parameter
Min.
Typ.
Max.
Unit
TJ
TSTG
TL
Junction Temperature
+150
+150
+300
°C
°C
°C
Storage Temperature Range
-65
Lead Temperature, Soldering 10 Seconds
Thermal Resistance, JEDEC Standard Multi-Layer Test
Boards, Still Air
97
°C/W
ΘJA
Electrostatic Discharge Information
Symbol
Parameter
Max.
Unit
kV
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
8
2
ESD
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
TA
Parameter
Operating Temperature Range
Supply Voltage Range
Min.
-40
Typ.
Max.
+85
Unit
°C
VCC
4.75
5.00
5.25
V
© 2006 Fairchild Semiconductor Corporation
FMS6203 • Rev. 1.0.4
www.fairchildsemi.com
3
DC Electrical Characteristics
Unless otherwise noted, TA=25°C, VCC=5V, RSOURCE=37.5Ω, inputs AC coupled with 0.1µF, all outputs AC coupled
with 220µF into 150Ω loads, referenced to 400kHz, all gain options.
Symbol
ICC
Parameter
Supply Current(2)
Supply Current(2)
Conditions
Min.
Typ.
36
Max.
75
Units
mA
mA
VPP
V
No Load
No Load, Output Disabled
ICC1
15
35
VIN
Video Input Voltage Range Referenced to GND if DC Coupled
1.0
VIL
Digital Input Low(2)
Digital Input High(2)
FSEL0, FSEL1
0
0.8
VIH
FSEL0, FSEL1
2.4
VCC
V
tENABLE Output Enable Time
Note:
2. 100% tested at 25°C
300
ns
150Ω DC Load
Standard Definition Electrical Characteristics
Unless otherwise noted, TA=25°C, VIN=1VPP, VCC=5V, RSOURCE=37.5Ω, all inputs AC coupled with 0.1µF, all outputs
AC coupled with 220µF into 150Ω loads, referenced to 400kHz, all gain options.
Symbol
AVSD
f1dBSD
fcSD
Parameter
Channel Gain Error(3)
-1dB Bandwidth(3)
Conditions
Min. Typ. Max. Units
-0.4
0
0.4
dB
MHz
MHz
dB
%
5.20 7.15
8
-3dB Bandwidth
Attenuation (Stopband Reject)(3)
fSBSD
DG
f=27MHz
40
50
0.3
1.0
0.6
-70
75
Differential Gain
DP
Differential Phase
°
THD
Total Harmonic Distortion, Output VOUT=1.4VPP, 3.58MHz
%
XTALKSD Crosstalk (Channel-to-Channel)
1MHz
dB
dB
ns
SNR
tpdSD
Signal-to-Noise Ratio(4)
NTC-7 Weighting, 100kHz to 4.2MHz
Delay from Input to Output, 4.5MHz
Propagation Delay
85
Notes:
3. 100% tested at 25°C.
4. SNR=20 • log (714mV/rms noise).
Progressive Scan Electrical Characteristics
Unless otherwise noted, TA=25°C, VIN=1VPP, VCC=5V, RSOURCE=37.5Ω, inputs AC coupled with 0.1µF, all outputs AC
coupled with 220µF into 150Ω loads, referenced to 400kHz, all gain options.
Symbol
Parameter
Conditions
Min. Typ. Max. Units
AVPS
Channel Gain Error(5)
-0.4
0
13.5
16
0.4
dB
MHz
MHz
dB
f1dBSPS -1dB Bandwidth(5)
10.0
fcPS
-3dB Bandwidth
Attenuation (Stopband Reject)(5)
fSBPS
THD
f=54MHz
37
44
Total Harmonic Distortion, Output VOUT=1.4VPP, 7MHz
0.55
-75
66
%
XTALKPS Crosstalk (Channel-to-Channel)
1MHz
dB
SNR
tpdPS
Signal-to-Noise Ratio(6)
Unweighted; 100kHz to 15MHz
Delay from Input to Output, 10MHz
dB
Propagation Delay
47
ns
Notes:
5. 100% tested at 25°C.
6. SNR=20 • log (714mV/rms noise).
© 2006 Fairchild Semiconductor Corporation
FMS6203 • Rev. 1.0.4
www.fairchildsemi.com
4
High-Definition Electrical Characteristic
Unless otherwise noted, TA=25°C, VIN=1VPP, VCC=5V, RSOURCE=37.5Ω, inputs AC coupled with 0.1µF, all outputs AC
coupled with 220µF into 150Ω loads, referenced to 400kHz, all gain options.
Symbol
AVHD
f1dBHD
fcHD
Parameter
Channel Gain Error(7)
-1dB Bandwidth(7)
Conditions
Min. Typ. Max. Units
-0.4
28
0
0.4
dB
MHz
MHz
dB
31
32
-3dB Bandwidth
Attenuation (Stopband Reject)(7)
fSBHD
f=74.25MHz
VOUT=0.7VPP, 22MHz, 0dB, 10kΩ Load
30
40
0.5
0.5
-75
-57
66
THD
Total Harmonic Distortion, Output
%
V
OUT=1.4VPP, 22MHz, 6dB, 150Ω Load
1MHz
dB
dB
dB
ns
XTALKHD Crosstalk (Channel-to-Channel)
30MHz
SNR
tpdHD
Signal-to-Noise Ratio(8)
Propagation Delay
Unweighted, 100kHz to 30MHz
Delay from Input to Output, 20MHz
25
Notes:
7. 100% tested at 25°C.
8. SNR=20 • log (714mV/rms noise).
Bypass Mode Electrical Characteristics
Unless otherwise noted, TA=25°C, VIN=1VPP, VCC=5V, RSOURCE=37.5Ω, inputs AC coupled with 0.1µF, all outputs AC
coupled with 220µF into 150Ω loads, referenced to 400kHz, all gain options.
Symbol
AVBP
Parameter
Channel Gain Error(9)
-1dB Bandwidth
Conditions
Min. Typ. Max. Units
DC
-0.4
0
0.4
dB
f1dBBP
fcBP
90
MHz
MHz
-3dB Bandwidth
115
0.3
0.25
-74
-64
70
VOUT=0.7VPP, 22MHz, 0dB, 10kΩ Load
OUT=1.4VPP, 22MHz, 6dB, 150Ω Load
THD
Total Harmonic Distortion, Output
%
V
1MHz
dB
dB
dB
XTALKBP Crosstalk (Channel-to-Channel)
30MHz
SNR
Signal-to-Noise Ratio(10)
Unweighted, 100kHz to 30MHz
Notes:
9. 100% tested at 25°C.
10. SNR=20 • log (714mV/rms noise).
© 2006 Fairchild Semiconductor Corporation
FMS6203 • Rev. 1.0.4
www.fairchildsemi.com
5
Layout Considerations
General layout and supply bypassing play a major role
Consider 70µm copper for high-power designs.
in
high-frequency
performance
and
thermal
Make the PCB as thin as possible by reducing FR4
thickness.
characteristics. Fairchild offers an evaluation board to
guide layout and aid device evaluation. The evaluation
board is a four-layer board with full power and ground
planes. Following this layout configuration provides
optimum performance and thermal characteristics for
the device. For the best results, follow the steps and
recommended routing rules listed below.
Use vias in the power pad to tie adjacent layers
together.
Remember that baseline temperature is a function
of board area, not copper thickness.
Use modeling techniques for first-order
approximation.
Recommended Routing / Layout Rules
Do not run analog and digital signals in parallel.
Output Considerations
Use separate analog and digital power planes to
supply power.
The FMS6203 outputs are DC offset from the input by
150mV; therefore, VOUT = 2•VIN DC+150mV. This offset
is required to obtain optimal performance from the
output driver and is held at the minimum value to
decrease the standing DC current into the load. Since
the FMS6203 has a 2x (6dB) gain, the output is typically
connected via a 75ꢀ-series back-matching resistor
followed by the 75ꢀ video cable. Because of the
inherent divide by two of this configuration, the blanking
level at the load of the video signal is always less than
1V. When AC-coupling the output, ensure that the
coupling capacitor of choice passes the lowest
frequency content in the video signal and that line time
distortion (video tilt) is kept as low as possible.
Run traces on top of the ground plane at all times.
Do not run traces over ground/power splits.
Avoid routing at 90-degree angles.
Minimize clock and video data trace length
differences.
Include 10µF and 0.1µF ceramic power supply
bypass capacitors.
Place the 0.1µF capacitor within 0.1 inches of the
device power pin.
Place the 10µF capacitor within 0.75 inches of the
device power pin.
The selection of the coupling capacitor is a function of
the subsequent circuit input impedance and the leakage
current of the input being driven. To obtain the highest
quality output video signal, the series termination
resistor must be placed as close to the device output
pin as possible. This greatly reduces the parasitic
capacitance and inductance effect on the FMS6203
output driver. Recommended distance from device pin
to place series termination resistor is no greater than
0.1 inches.
For multi-layer boards, use a large ground plane to
help dissipate heat.
For two-layer boards, use a ground plane that
extends beyond the device body by at least 0.5
inches on all sides. Include a metal paddle under
the device on the top layer.
Minimize all trace lengths to reduce series
inductance.
Thermal Considerations
Since the interior of most systems, such as set-top
boxes, TVs, and DVD players, are at +70ºC;
consideration must be given to providing an adequate
heat sink for the device package for maximum heat
dissipation. When designing a system board, determine
how much power each device dissipates. Ensure that
devices of high power are not placed in the same
location, such as directly above (top plane) and below
bottom plane) each other on the PCB.
Figure 3. Distance from Device Pin to Series
Termination Resistor
PCB Thermal Layout Considerations
Understand the system power requirements and
environmental conditions.
Maximize thermal performance of the PCB.
© 2006 Fairchild Semiconductor Corporation
FMS6203 • Rev. 1.0.4
www.fairchildsemi.com
6
Physical Dimensions
0.43 TYP
0.65
1.65
6.10
0.45
12.00°TOP & BOTTOM
R0.09 min
A. CONFORMS TO JEDEC REGISTRATION MO-153,
VARIATION AB, REF NOTE 6
B. DIMENSIONS ARE IN MILLIMETERS
R0.09min
1.00
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
AND TIE BAR EXTRUSIONS
D. DIMENSIONING AND TOLERANCES PER ANSI
Y14.5M, 1982
E. LANDPATTERN STANDARD: SOP65P640X110-14M
F. DRAWING FILE NAME: MTC14REV6
Figure 4. 14-Lead Thin Shrink Small Outline Package (TSSOP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2006 Fairchild Semiconductor Corporation
FMS6203 • Rev.1.0.4
www.fairchildsemi.com
7
© 2006 Fairchild Semiconductor Corporation
FMS6203 • Rev.1.0.4
www.fairchildsemi.com
8
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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