FL77904MX_技术文档

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July 2016

FL77904

Phase-cut Dimmable Compact LED Direct AC Driver

Description

Features

The FL77904 is a direct AC line LED driver with a

minimal number of external RC passive components. In

normal configuration, one resistor adjusts LED current

for desired system luminance and another bypass

capacitor provides a stable voltage to an internal biasing

shunt regulator.

.

The simplest Direct AC LED Driver with Only Two

External RC Passive Components

.

Wide AC Input Range: 90~305 V_AC

Four Integrated High-Voltage LED Constant

Current Sinks of up to 75 mA RMS Input Current

Capability

The FL77904 provides phase-cut dimming with wide

dimming range, smooth dimming control and good

dimmer compatibility. Optimized levels of each LED

strings’ current regulation achieve over 0.98 high PF

and less than 20% low THD which makes the FL77904

suitable for high-efficiency LED lighting systems. The

FL77904 can be also used with a simple rheostat

dimmer switches which are suitable for desktop or

indoor lamps.

.

High Power Factor (above 0.98 in normal

configuration) Low Harmonic Content (THD under

20% in normal configuration)

.

Low Flicker Index by Self Valley Fill with No

Degradation of PF and THD

Adjustable LED Power with an External Current

Sense Resistor

.

TRIAC Dimmable (Leading/Trailing Edge)

Flicker index is significantly improved by using

proprietary self valley fill technique without degrading

PF and THD. The cost effective solution brings low line

ripple light quality with system compactness.

Rheostat Dimmable Flexible LED Forward Voltage

Configuration

.

Power Scalability with Multiple Driver ICs

Over-Temperature Protection (OTP)

Compact SOIC 8-Lead Package

Operation of FL77904 admits driving higher-wattage

systems, such as street lights and down lights, by

simply parallel connecting the driver ICs.

Applications

.

General LED Driving Solution for Residential,

Commercial and Industrial Lighting

Ordering Information

Operating

Temperature Range

Packing

Part Number

Package

Method

8-Lead, Small Outline Integrated Circuit

(SOIC) JEDEC MS012 150” Narrow Body,

Exposed Pad

FL77904MX

-40 to 125°C

2,500 per Reel

FL77904 • Rev. 1.1

www.fairchildsemi.com

Typical Application

2K

(Option)

VIN

Bridge

Rectifier

LED1

LED2

LED3

LED4

VDD

CS

Fuse

C_VDD

0.1µF, 50V

GND

R_CS

1%

Forward voltage (V_F)

across each LED group is

adjustable as desired.

GND

Figure 1.

Typical Application Schematic

Block Diagram

VIN

1

2

3

4

LED1

LED2

LED3

LED4

LED Current

Modulator

Shunt

Regulator

8

VDD

LED

Current

Feedback

Over-

Temperature

Protection

5

6

7

GND

CS

Figure 2.

Simplified FL77904 Block Diagram

FL77904• Rev. 1.1

www.fairchildsemi.com

2

Pin Configuration

1

2

3

4

8

7

6

5

VIN

VDD

CS

LED1

LED2

LED3

GND

LED4

Figure 3.

Pin Configuration (Top View)

Thermal Characteristics ^{(1) (2)}

Component

_JA

(1S PCB)

_JA

(2S2P PCB)

Package

Units

8-Lead, Small Outline Integrated Circuit (SOIC)

JEDEC MS012 150” Narrow Body, Exposed Pad

FL77904MX

156

37

°C/W

Notes:

1. Θ_JA: Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow.

The value given is for natural convection with no heatsink using the 1S and 2S2P boards, as specified in JEDEC

standards JESD51-2, JESD51-5, and JESD51-7, as appropriate.

2. Junction-to-ambient thermal resistance is highly dependent on application and PCB layout. In application where

the device dissipates high levels of power during operation, special care of thermal dissipation issues in PCB

design must be taken.

Pin Definitions

Pin#

Name

VIN

Description

Rectified AC Input Voltage. Connect this pin to rectified AC voltage after a bridge rectifier.

1

2

3

4

5

6

LED1

LED2

LED3

LED4

LED String Cathodes. Connect cathode(s) of each LED group to these pins.

Ground Reference Pin. Tie this pin directly to local ground plane. This ground should not be

tied to earth ground because it is not isolated from AC mains.

GND

CS

LED Current Sense. Limits the LED current depending on voltage across sensing resistor.

The CS pin is used to set the LED current regulation target.

7

8

Internal Biasing Shunt Regulator Output. This pin supplies current to internal circuitry. A

17-V shunt regulator is internally connected to this pin. A bypassing capacitor is

recommended to be added to reduce noise from VIN.

VDD

EP

Exposed Thermal Pad. EP is not tied to GND inside the IC. It is recommended to tie it to

GND externally.

0

FL77904 • Rev. 1.1

www.fairchildsemi.com

3

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Symbol

Parameter

Min.

-0.3

-55

Max.

500

200

6

Unit

V

V_IN

V_LED1

V_LED2

V_LED3

V_LED4

V_CS

VIN Voltage

LED1 Pin Voltage

LED2 Pin Voltage

LED3 Pin Voltage

LED4 Pin Voltage

CS Pin Voltage

Junction Temperature

Storage Temperature

LED1 Current

V

T_J

+150

60

ºC

mA

T_STG

I_LED1

I_LED2

I_LED3

I_LED4

Notes:

-65

LED2 Current

80

LED3 Current

100

150

LED4 Current

3. Stress beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.

4. All voltage values, except differential voltages, are given with respect to the GND pin.

5. Human Body Model, ANSI/ESDA/JEDEC JS-001-2012: 0.8 kV at Pins 1~4, 0.4 kV at Pin 5, 1.5 kV at Pins 7~8.

6. Charged Device Model, JESD22-C101: 1.0 kV at Pins 1~8.

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not

recommend exceeding them or designing to Absolute Maximum Ratings.

Symbol

Parameter

Operating Junction Temperature

Min.

Max.

Unit

T_j

-40

+125

°C

FL77904 • Rev. 1.1

www.fairchildsemi.com

4

Electrical Characteristics

Unless otherwise noted, R_CS= 10 Ω, and T_A= 25°C. Currents are defined as positive into the device and negative out

of the device.

Symbol

VIN Supply

I_QUIES.VIN

VDD Output

V_DD

Parameter

V_INQuiescent Current

VDD Voltage

Conditions

V_IN= 500 V Maximum

V_IN= 20.0 V

Min. Typ. Max. Unit

0.75

17

1.20

18

mA

V

16

LED Current

I_LED1

LED1 Current

LED2 Current

LED3 Current

LED4 Current

V_IN= 20.0 V, V_LED1= 20.0 V

V_IN= 20.0 V, V_LED2= 20.0 V

V_IN= 20.0 V, V_LED3= 35.0 V

V_IN= 20.0 V, V_LED4= 20.0 V

17.4

40.4

78.2

87.8

23.0

47.0

86.0

28.6

53.6

93.8

mA

I_LED2

I_LED3

I_LED4

96.0 104.2

Over-Temperature Protection

T_OTP

OTP Temperature⁽⁷⁾

Leakage Current

170

°C

I_LED1-LK

I_LED2-LK

I_LED3-LK

I_LED4-LK

LED1 Leakage Current

V_LED1= 500 V, V_IN= 0 V

V_LED2= 500 V, V_IN= 0 V

V_LED3= 500 V, V_IN= 0 V

V_LED4= 200 V, V_IN= 0 V

1

µA

LED2 Leakage Current

LED3 Leakage Current

LED4 Leakage Current

Notes:

7. Not tested in production. Internal over-temperature protection circuitry protects the device from permanent damage. LEDs shut

down at the junction temperature of T_J=170°C (typical.).

FL77904 • Rev. 1.1

www.fairchildsemi.com

5

Typical Performance Characteristics

1.1

1.03

1.02

1.01

1

1.05

1

0.99

0.98

0.97

0.95

0.9

-40 -20

0

25

40

60

80 100 120 140

-40 -20

0

25

40

60

80 100 120 140

Temperature(ºC)

Figure 4.

I_QUIES.VINvs. Temperature

Figure 5.

V_DDvs. Temperature

1.03

1.02

1.01

1

1.03

1.02

1.01

1

0.99

0.98

0.97

0.99

0.98

0.97

-40 -20

0

25

40

60

80 100 120 140

-40 -20

0

25

40

60

80 100 120 140

Temperature(ºC)

Figure 6.

I_LED1vs. Temperature

Figure 7.

I_LED2vs. Temperature

1.03

1.02

1.01

1

1.03

1.02

1.01

1

0.99

0.98

0.97

0.99

0.98

0.97

-40 -20

0

25

40

60

80 100 120 140

-40 -20

0

25

40

60

80 100 120 140

Temperature(ºC)

Figure 8.

I_LED3vs. Temperature

Figure 9.

I_LED4vs. Temperature

FL77904 • Rev. 1.1

www.fairchildsemi.com

6

Functional Description

The FL77904 can drive LED strings attached directly to

the rectified AC mains using only two external RC

components (R_CSand C_VDD). With 4 integrated high

voltage current sink, LED current in each string is

precisely controlled with system compactness. High PF

and low THD are obtained by the optimized current sink

levels. Phase-cut dimming is easily obtained with wide

dimming range and good dimmer compatibility. Flicker

index in the direct AC drive topology can be improved

by adopting proprietary self valley-fill solution.

harmonic contents and improves power factor as well as

Electromagnetic Interference (EMI) characteristics.

By fully utilizing available headroom, the FL77904 offers

high efficiency, power factor and low harmonic

distortion. Typically, power factor is higher than 0.98

and THD is lower than 20%. The efficiency heavily

depends on a LED configuration.

LED Current and Power Setting

The LED current is managed by an external current

sense resistor R_CS. Regulation target of each channel's

current sink is calculated as follows.

Operation

When the rectified AC line voltage, V_IN, is higher than

the forward voltage of the consecutive LED groups,

each LED group turns on automatically as the

corresponding current sink has enough voltage

headroom across it. Each current sink increases up to

the predefined current level and maintains the level until

the following channel current sink gets enough voltage

headroom across it.

0.23

0.47

I

_LED1

, I_LED2



,

R_CS

(1)

0.86

0.96

_LED3

, and I_LED4



.

R_CS

Root-mean-square (RMS) value of the input current can

be calculated using the peak regulated current, I_LED4

AC Line

Voltage (V_IN

,

LED Current

(I_F)

)

and crest factor. Since the LED current waveform is

similar to the AC line voltage, the crest factor is close to

the crest factor of a sine wave, √2=1.414. But the actual

crest factor depends on the flattened time of the I_LED4

and LED configuration. With FL77904, the typical crest

factor is approximately 1.35. Thus, based on estimated

input power, P_IN, the R_CSresistor value can be

calculated as follows.

I_LED4

I_LED3

V_F1'''+V_F2''+V_F3'+V_F4

V_F1''+V_F2'+V_F3

I_LED2

V_F1'+V_F2

I_LED1

V_F1

0.96V_{AC .RMS}

t_D1t_D2

t_D3

t_D4

t_D3t_D2t_D1

R_CS

·

t_D1: Current is directed to LED1 pin through 1^stLED group.

t_D2: Current is directed to LED2 pin through 1^stand 2^ndLED groups.

t_D3: Current is directed to LED3 pin through 1^st, 2^nd, and 3^rdLED groups.

t_D4: Current is directed to LED4 pin through 1^st, 2^nd, 3^rd, and 4^thLED groups.

V_F1/V_F1'/V_F1''/V_F1''': Forward voltage at forward current of I_LED1/I_LED2/I_LED3/I_LED4

in 1^stLED group.

V_F2/V_F2'/V_F2'': Forward voltage at forward current of I_LED2/I_LED3/I_LED4in 2^ndLED

group.

V_F3/V_F3': Forward voltage at forward current of I_LED3/I_LED4in 3^rdLED group.

V_F4: Forward voltage at forward current of I_LED4in 4^thLED group.

(2)

1.35 P

IN

The actual R_CSneeds to be adjusted with respect to the

LED configuration.

·

LED Configuration

·

In the LED configuration, it is required to increase the

total LED forward voltage to improve efficiency. For

example, compared to using 4 LEDs with V_Fof 60 V

(total V_F= 60 V x 4 channels = 240 V) for each LED

group, using 4 LEDs with V_Fequal to 65 V (total V_F=

65 V x 4 channels = 260 V) will improve the efficiency

simply due to the higher total V_F. Each LED channel can

Figure 10. FL77904 Operation

When V_INreaches the forward voltage across the 1st

LED group (V_F1) at forward current I_F= I_LED1, the current

drawn from the V_INis directed to the LED1 through the

1st LED group. In sequence, when V_INreaches forward

voltage across the 1st and 2nd LED groups (V_F1'+V_F2) at

I_F= I_LED2, the current is directed to LED2 across the 1st

and 2nd LED groups. Then, when V_INreaches

V_F1''+V_F2'+V_F3at I_F=I_LED3, the LED current go through

1st, 2nd, and 3rd LED groups and sinks to the LED3.

Finally, when V_INreaches V_F1'''+V_F2''+V_F3'+V_F4at

I_F=I_LED4, the current goes through all 4 LED groups and

is directed to the LED4.

have different V_F. For example, if

a design is

implemented with 144 pieces of 3-V LEDs for

replacement of 2-feet fluorescent lamp, designer can

assign flexible numbers of LEDs for LED channels such

as 25s2p-32s2p-6s2p-18s1p (“s” stands for LEDs in

series and “p” stands for LEDs in parallel) or 18s2p-

18s2p-18s2p-36s1p.

In any LED structure, V_Fof first LED group should be

higher than VIN-pin turn-on voltage, which is 20 V. If the

V_Fof the first LED group is configured to be lower than

VIN-pin turn-on voltage, I_LED1will not have the correct

regulation level when input voltage, V_IN, is just exceeds

the V_F.

Whenever the active channel (one that is sinking LED

current) is changed from one channel to the adjacent

channel with respect to the change in the V_IN, the new

active channel's current increases gradually while the

existing active channel's current decreases gradually.

This smooth current transition reduces frequency

FL77904 • Rev. 1.1

www.fairchildsemi.com

7

A good starting point for choosing a LED configuration is

to have about 260 V~280 V of the total V_Ffor 220 V_AC

The V_DDripple can be reduced by a bypassing

capacitor, C_VDD. If the C_VDDis not used, or its value is

small, the V_DDvoltage fluctuates and goes even down to

0 V. It makes the FL77904 reset, but the FL77904

automatically restarts every cycle when the AC line

mains and 130 V~140 V of the total V_Ffor 120 V_AC

.

Internal Shunt Regulator Output, V_DD

voltage reaches

a certain level. General design

The system implemented with FL77904 does not require

a bulk capacitor after bridge-rectification diodes. As a

result, the V_DD, which supplies biasing voltage for the

FL77904, has voltage ripple like the rectification voltage

after the bridge diodes as shown in Figure 11.

suggestion is to add C_VDDfor noise filtering. The

recommended C_VDDvalue is 1 µF with 50 V of voltage

rating.

Over-Temperature Protection (OTP)

The FL77904 provides over temperature protection

(OTP) inherently. When the driver's junction

temperature exceeds a specified threshold temperature

(T_J= 170°C), the driver will shut down automatically and

recover once the temperature drops lower enough than

the internal threshold temperature. Without this

protection, the lifetime of the FL77904 can be reduced

and irreparable damage can occur. Good thermal

management is required to achieve best performance

and long life span of the FL77904.

V_IN

V_DD

V_DDvalley

Figure 11. V_DDRipple without C_VDD

FL77904 • Rev. 1.1

www.fairchildsemi.com

8

5.10

4.70

A

3.20

B

8

5

1.75

4.10

3.70

6.20

5.80

5.60

2.30

PIN #1

1

4

0.51

0.31

1.27

0.65

M

0.25

C B A

LAND PATTERN RECOMMENDATION

TOP VIEW

0.50

0.25

1.50

1.25

0.70

0.60

B

C

8°

0°

0.10

C

0.25

0.05

FRONT VIEW

0.25

0.10

SIDE VIEW

0.90

0.40

1.75 MAX

1

1.05

0.25

4

DETAIL B

SCALE 2:1

NOTES:

A. NO INDUSTRY STANDARD APPLIES TO THIS

PACKAGE

2.56

2.05

B. ALL DIMENSIONS ARE IN MILLIMETERS

C. DIMENSIONS DO NOT INCLUDE MOLD FLASH

OR BURRS

D. DRAWING FILENAME: MKT-M08Frev2

8

5

3.45

2.09

BOTTOM VIEW

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent

coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.

ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,

regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer

application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not

designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification

in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized

application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and

expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such

claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This

literature is subject to all applicable copyright laws and is not for resale in any manner.

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1


型号：	FL77904MX
厂家：	ONSEMI
描述：	Phase-cut Dimmable Compact LED Direct AC Driver 驱动接口集成电路
文件：	总11页 (文件大小：316K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

FL77904MX [ONSEMI]

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