FIN1032MX [ONSEMI]

3.3V LVDS 4位高速差分接收器;
FIN1032MX
型号: FIN1032MX
厂家: ONSEMI    ONSEMI
描述:

3.3V LVDS 4位高速差分接收器

光电二极管 接口集成电路
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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s  
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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
August 2001  
Revised December 2001  
FIN1032  
3.3V LVDS 4-Bit High Speed Differential Receiver  
General Description  
Features  
This quad receiver is designed for high speed interconnect  
utilizing Low Voltage Differential Signaling (LVDS) technol-  
ogy. The receiver translates LVDS levels, with a typical dif-  
ferential input threshold of 100mV, to LVTTL signal levels.  
LVDS provides low EMI at ultra low power dissipation even  
at high frequencies. This device is ideal for high speed  
transfer of clock and data.  
Greater than 400Mbs data rate  
3.3V power supply operation  
0.4ns maximum differential pulse skew  
2.5ns maximum propagation delay  
Low power dissipation  
Power OFF protection  
The FIN1032 can be paired with its companion driver, the  
FIN1031, or any other Fairchild LVDS driver.  
Fail safe protection for open-circuit, shorted and termi-  
nated conditions  
Meets or exceeds the TIA/EIA-644 LVDS standard  
Pin compatible with equivalent RS-422 and LVPECL  
devices  
16-Lead SOIC and TSSOP packages save space  
Ordering Code:  
Order Number Package Number  
Package Description  
FIN1032M  
M16A  
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
FIN1032MTC  
MTC16  
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.  
Function Table  
Connection Diagram  
Inputs  
Outputs  
ROUT  
RIN+  
ROUT−  
EN  
H
H
H
X
EN  
X
X
X
L
H
L
L
H
L
H
Fail Safe Condition  
H
H
L
H
L
L
X
L
H
X
L
Fail Safe Condition  
X
H
Z
L
H
H = HIGH Logic Level  
Z = High Impedance  
L = LOW Logic Level  
Fail Safe = Open, Shorted, Terminated  
X = Don’t Care  
Pin Descriptions  
Pin Name  
OUT1, ROUT2, ROUT3, ROUT4  
RIN1+, RIN2+, RIN3+, RIN4+  
RIN1, RIN2, RIN3, RIN4−  
EN  
Description  
LVTTL Data Outputs  
Non-Inverting LVDS Inputs  
Inverting LVDS Inputs  
Driver Enable Pin  
R
EN  
VCC  
GND  
Inverting Driver Enable Pin  
Power Supply  
Ground  
© 2001 Fairchild Semiconductor Corporation  
DS500508  
www.fairchildsemi.com  
Absolute Maximum Ratings(Note 1)  
Recommended Operating  
Conditions  
Supply Voltage (VCC  
)
0.5V to +4.6 V  
0.5V to +4.6 V  
0.5V to 6 V  
16 mA  
DC Input Voltage (VIN  
)
Supply Voltage (VCC  
)
3.0 V to 3.6 V  
DC Input Voltage (VOUT  
)
Magnitude of Differential Voltage  
(|VID|)  
DC Output Current (IO)  
100 mV to VCC  
0.05 V to 2.35V  
0 to VCC  
Storage Temperature Range (TSTG  
Max Junction Temperature (TJ)  
Lead Temperature (TL)  
)
65°C to +150°C  
150°C  
Common-Mode Input Voltage (VIC  
)
Input Voltage (VIN  
)
Operating Temperature (TA)  
40°C to +85°C  
(Soldering, 10 seconds)  
260°C  
10,000 V  
500 V  
Note 1: The Absolute Maximum Ratings: are those values beyond which  
damage to the device may occur. The databook specifications should be  
met, without exception, to ensure that the system design is reliable over its  
power supply, temperature and output/input loading variables. Fairchild  
does not recommend operation of circuits outside databook specification.  
ESD (Human Body Model)  
ESD (Machine Model)  
DC Electrical Characteristics  
Over supply voltage and operating temperature ranges, unless otherwise specified  
Min  
Typ  
Max  
Symbol  
VTH  
Parameter  
Test Conditions  
Units  
(Note 2)  
Differential Input Threshold HIGH  
Differential Input Threshold LOW  
Input Current  
See Figure 1 and Table 1  
See Figure 1 and Table 1  
100  
mV  
mV  
µA  
VTL  
100  
IIN  
V
IN = 0V or VCC  
±20  
±20  
II(OFF)  
Power-OFF Input Current  
V
CC = 0V, VIN = 0V or 3.6V  
µA  
VIH  
Input High Voltage (EN or EN)  
2.0  
VCC  
0.8  
V
V
VIL  
Input Low Voltage (EN or EN)  
Output HIGH Voltage  
GND  
CC 0.2  
2.4  
VOH  
I
I
I
I
I
OH = −100 µA  
OH = −8 mA  
OH = 100 µA  
OL = 8 mA  
V
V
V
VOL  
Output LOW Voltage  
Input Clamp Voltage  
0.2  
0.5  
VIK  
IOZ  
IOS  
IK = −18 mA  
1.5  
15  
V
Disabled Output Leakage Current  
Output Short Circuit Test  
EN = 0.8 and EN = 2V, VOUT = 3.6V or 0V  
Receiver Enabled, VOUT = 0V  
±20  
100  
5
µA  
mA  
mA  
mA  
µA  
(one output shorted at a time)  
ICCZ  
ICC  
Disabled Power Supply Current  
Power Supply Current  
Receiver Disabled  
Receiver Enabled, (RIN+ = 1V and RIN= 1.4V)  
or (RIN+ = 1.4V and RIN= 1V)  
15  
IPU/PD  
Output Power Up/Power Down  
High Z Leakage Current  
Input Capacitance  
V
CC = 0V to 1.5V  
±20  
CIN  
3.5  
6
pF  
pF  
COUT  
Output Capacitance  
Note 2: All typical values are at TA = 25°C and with VCC = 3.3V.  
www.fairchildsemi.com  
2
AC Electrical Characteristics  
Over supply voltage and operating temperature ranges, unless otherwise specified  
Min  
Typ  
Max  
Symbol  
tPLH  
Parameter  
Test Conditions  
Units  
(Note 3)  
Propagation Delay LOW-to-HIGH  
Propagation Delay HIGH-to-LOW  
Output Rise Time (20% to 80%)  
Output Fall Time (80% to 20%)  
1.0  
1.0  
2.5  
2.5  
1.2  
1.2  
0.4  
ns  
ns  
ns  
ns  
ns  
tPHL  
tTLH  
|VID| = 400 mV, CL = 10 pF,  
0.7  
0.7  
tTHL  
R
L = 1kΩ  
tSK(P)  
tSK(LH)  
tSK(HL)  
tSK(PP)  
fMAX  
Pulse Skew |tPLH - tPHL|  
See Figure 1 and Figure 2  
Channel-to-Channel Skew  
0.3  
1.0  
ns  
ns  
(Note 4)  
Part-to-Part Skew (Note 5)  
Maximum Operating Frequency  
(Note 6)  
R
L = 1k, CL = 10 pF,  
200  
325  
MHz  
see Figure 1 and Figure 2  
tZH  
tZL  
tHZ  
tLZ  
LVTTL Output Enable Time from Z to HIGH  
LVTTL Output Enable Time from Z to LOW  
LVTTL Output Disable Time from HIGH to Z  
LVTTL Output Disable Time from LOW to Z  
5.0  
5.0  
5.0  
5.0  
ns  
ns  
ns  
ns  
R
L = 1k, CL = 10 pF,  
See Figure 3 and Figure 4  
Note 3: All typical values are at TA = 25°C and with VCC = 3.3V.  
Note 4: tSK(LH), tSK(HL) is the skew between specified outputs of a single device when the outputs have identical loads and are switching in the same direc-  
tion.  
Note 5: tSK(PP) is the magnitude of the difference in propagation delay times between any specified terminals of two devices switching in the same direction  
(either LOW-to-HIGH or HIGH-to-LOW) when both devices operate with the same supply voltage, same temperature, and have identical test circuits.  
Note 6: fMAX Criteria: Input tR = tF < 1 ns, VID = 300 mV, (1.05V to 1.35V pp), 50% duty cycle; Output duty cycle 40% to 60%, VOL < 0.5V, VOH > 2.4V.  
All channels switching in phase.  
Note A: All input pulses have frequency = 10MHz, tR or tF = 1ns  
Note B: CL includes all probe and jig capacitances  
FIGURE 1. Differential Receiver Voltage Definitions and Propagation Delay and Transition Time Test Circuit  
TABLE 1. Receiver Minimum and Maximum Input Threshold Test Voltages  
Applied Voltages (V)  
Resulting Differential Input  
Resulting Common Mode Input  
Voltage (mA)  
VID  
Voltage (V)  
VIC  
VIA  
VIB  
1.25  
1.15  
2.4  
2.3  
0.1  
0
1.15  
1.25  
2.3  
2.4  
0
100  
100  
100  
1.2  
1.2  
2.35  
2.35  
0.05  
0.05  
1.2  
100  
100  
0.1  
0.9  
1.5  
1.8  
2.4  
0
100  
600  
1.5  
0.9  
2.4  
1.8  
0.6  
0
600  
600  
1.2  
2.1  
600  
600  
2.1  
0.3  
0.6  
600  
0.3  
3
www.fairchildsemi.com  
FIGURE 2. LVDS Input to LVTTL Output AC Waveforms  
Test Circuit for LVTTL Outputs  
FIGURE 3. AC Loading Circuit for LVTTL Outputs  
Voltage Waveforms Enable and Disable Times  
Note A: CL includes probes and jig capacitance  
Note B: All LVTTL input pulses have the following characteristics: Frequency = 10 MHz tR or tF 2 ns  
FIGURE 4. LVTTL Outputs Test Circuit and AC Waveforms  
www.fairchildsemi.com  
4
Physical Dimensions inches (millimeters) unless otherwise noted  
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
Package Number M16A  
5
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
Package Number MTC16  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
www.fairchildsemi.com  
6
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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