FIN1018MX [ONSEMI]
3.3V LVDS 1 位高速差分接收器;型号: | FIN1018MX |
厂家: | ONSEMI |
描述: | 3.3V LVDS 1 位高速差分接收器 光电二极管 接口集成电路 |
文件: | 总10页 (文件大小:1159K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON
Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA
Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended
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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
March 2001
Revised April 2002
FIN1018
3.3V LVDS 1-Bit High Speed Differential Receiver
General Description
Features
This single receiver is designed for high speed intercon-
nects utilizing Low Voltage Differential Signaling (LVDS)
technology. The receiver translates LVDS levels, with a typ-
ical differential input threshold of 100 mV, to LVTTL signal
levels. LVDS provides low EMI at ultra low power dissipa-
tion even at high frequencies. This device is ideal for high
speed transfer of clock or data.
■ Greater than 400Mbs data rate
■ 3.3V power supply operation
■ 0.4ns maximum pulse skew
■ 2.5ns maximum propagation delay
■ Low power dissipation
■ Power-Off protection
The FIN1018 can be paired with its companion driver, the
FIN1017, or with any other LVDS driver.
■ Fail safe protection for open-circuit, shorted and termi-
nated conditions
■ Meets or exceeds the TIA/EIA-644 LVDS standard
■ Flow-through pinout simplifies PCB layout
■ 8-Lead SOIC and US-8 packages save space
Ordering Code:
Order Number Package Number
Package Description
FIN1018M
M08A
8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
[TUBE]
FIN1018MX
FIN1018K8X
M08A
8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
[TAPE and REEL]
MAB08A
8-Lead US8, JEDEC MO-187, Variation CA 3.1mm Wide
[TAPE and REEL]
Pin Descriptions
Connection Diagrams
Pin Name
ROUT
RIN+
Description
8-Lead SOIC
LVTTL Data Output
Non-inverting Driver Input
Inverting Driver Input
Power Supply
RIN−
VCC
GND
NC
Ground
No Connect
Pin Assignment for US-8 Package
Function Table
Input
Outputs
RIN+
RIN−
ROUT
L
H
L
L
H
H
H
Fail Safe Condition
H = HIGH Logic Level
L = LOW Logic Level
Fail Safe = Open, Shorted, Terminated
TOP VIEW
© 2002 Fairchild Semiconductor Corporation
DS500502
www.fairchildsemi.com
Absolute Maximum Ratings(Note 1)
Recommended Operating
Conditions
Supply Voltage (VCC
)
−0.5V to +4.6V
−0.5V to +4.7V
−0.5V to +6V
16 mA
DC Input Voltage (RIN+, RIN−
)
Supply Voltage (VCC
Input Voltage (VIN
)
3.0V to 3.6V
0 to VCC
DC Output Voltage (DOUT
DC Output Current (IO)
)
)
Magnitude of Differential Voltage
(|VID|)
Storage Temperature Range (TSTG
Max Junction Temperature (TJ)
Lead Temperature (TL)
)
−65°C to +150°C
150°C
100mV to VCC
0.05V to 2.35V
−40°C to +85°C
Common-mode Input Voltage (VIC
)
Operating Temperature (TA)
(Soldering, 10 seconds)
260°C
≥ 6500V
≥ 9500V
≥ 300V
ESD (Human Body Model)
ESD (Bus Pins RIN−/RIN+ to GND)
ESD (Machine Model)
Note 1: The “Absolute Maximum Ratings”: are those values beyond which
damage to the device may occur. The databook specifications should be
met, without exception, to ensure that the system design is reliable over its
power supply, temperature and output/input loading variables. Fairchild
does not recommend operation of circuits outside databook specification.
DC Electrical Characteristics
Over supply voltage and operating temperature ranges, unless otherwise specified
Min
Typ
Max
Symbol
VTH
Parameter
Test Conditions
Units
(Note 2)
Differential Input Threshold HIGH
Differential Input Threshold LOW
Input Current
See Figure 1 and Table 1
See Figure 1 and Table 1
100
mV
mV
µA
µA
V
VTL
−100
IIN
V
IN = 0V or VCC
±20
±20
II(OFF)
VOH
Power-OFF Input Current
Output HIGH Voltage
V
CC = 0V, VIN = 0V or 3.6V
I
I
I
I
I
OH = −100 µA
OH = −8 mA
OH = 100 µA
OL = 8 mA
V
CC −0.2
2.4
V
VOL
Output LOW Voltage
0.2
0.5
V
V
VIK
ICC
Input Clamp Voltage
Power Supply Current
IK = −18 mA
−1.5
V
Inputs Open, (RIN+ = 1V and RIN− = 1.4V),
or (RIN+ = 1.4V and RIN− = 1V)
7
mA
CIN
Input Capacitance
Output Capacitance
4
6
pF
pF
COUT
Note 2: All typical values are at TA = 25°C and with VCC = 3.3V.
AC Electrical Characteristics
Over supply voltage and operating temperature ranges, unless otherwise specified
Min
Typ
Max
Symbol
tPLH
Parameter
Test Conditions
Units
(Note 3)
Propagation Delay LOW-to-HIGH
Propagation Delay HIGH-to-LOW
Output Rise Time (20% to 80%)
Output Fall Time (80% to 20%)
0.9
0.9
2.5
2.5
ns
ns
ns
ns
ns
ns
tPHL
tTLH
|VID| = 400 mV, CL = 10 pF
0.5
0.5
tTHL
See Figure 1 and Figure 2
tSK(P)
tSK(PP)
Note 3: All typical values are at TA = 25°C and with VCC = 3.3V.
Pulse Skew |tPLH - tPHL
|
0.4
1.0
Part-to-Part Skew (Note 4)
Note 4: tSK(PP) is the magnitude of the difference in propagation delay times between any specified terminals of two devices switching in the same direction
(either LOW-to-HIGH or HIGH-to-LOW) when both devices operate with the same supply voltage, same temperature, and have identical test circuits.
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2
Note A: All input pulses have frequency = 10MHz, tR or tF = 1ns
Note B: CL includes all probe and fixture capacitances
FIGURE 1. Differential Receiver Voltage Definitions and Propagation Delay and Transition Time Test Circuit
TABLE 1. Receiver Minimum and Maximum Input Threshold Test Voltages
Resulting Differential Resulting Common Mode
Applied Voltages (V)
Input Voltage (mV)
VID
Input Voltage (V)
VIC
VIA
VIB
1.25
1.15
2.4
2.3
0.1
0
1.15
1.25
2.3
2.4
0
100
−100
100
1.2
1.2
2.35
2.35
0.05
0.05
1.2
−100
100
0.1
0.9
1.5
1.8
2.4
0
−100
600
1.5
0.9
2.4
1.8
0.6
0
−600
600
1.2
2.1
−600
600
2.1
0.3
0.6
−600
0.3
FIGURE 2. LVDS Input to LVTTL Output AC Waveforms
3
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DC / AC Typical Performance Curves
FIGURE 3. Output High Voltage vs.
Power Supply Voltage
FIGURE 4. Output Low Voltage vs.
Power Supply Voltage
FIGURE 5. Output Short Circuit Current vs.
Power Supply Voltage
FIGURE 6. Power Supply Current vs.
Frequency
FIGURE 8. Differential Propagation Delay
Power Supply Voltage
FIGURE 7. Power Supply Current vs.
Ambient Temperature
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4
DC / AC Typical Performance Curves (Continued)
FIGURE 9. Differential Propagation Delay vs.
Ambient Temperature
FIGURE 10. Differential Skew vs.
Power Supply Voltage
FIGURE 11. Differential Skew vs.
FIGURE 12. Differential Propagation Delay vs.
Differential Input Voltage
Ambient Temperature
FIGURE 14. Transition Time vs.
Power Supply Voltage
FIGURE 13. Differential Propagation Delay vs.
Common-Mode Voltage
5
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DC / AC Typical Performance Curves (Continued)
FIGURE 15. Transition Time vs.
FIGURE 16. Differential Propagation Delay vs.
Ambient Temperature
Load
FIGURE 18. Transition Time vs.
Load
FIGURE 17. Differential Propagation Delay vs.
Load
FIGURE 20. Power Supply Current vs.
Power Supply Voltage
FIGURE 19. Transition Time vs.
Load
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6
Physical Dimensions inches (millimeters) unless otherwise noted
8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package Number M08A
7
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
8-Lead US8, JEDEC MO-187, Variation CA 3.1mm Wide
Package Number MAB08A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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www.fairchildsemi.com
8
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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