FGHL75T65MQDTL4 [ONSEMI]

IGBT - 650 V 75 A FS4 medium switching speed IGBT with full rated copack diode;
FGHL75T65MQDTL4
型号: FGHL75T65MQDTL4
厂家: ONSEMI    ONSEMI
描述:

IGBT - 650 V 75 A FS4 medium switching speed IGBT with full rated copack diode

双极性晶体管
文件: 总9页 (文件大小:235K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
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Field Stop Trench IGBT  
650 V, 75 A  
75 A, 650 V  
CESat = 1.45 V  
V
FGHL75T65MQDTL4  
C
th  
Field stop 4 generation mid speed IGBT technology Full current  
rated copack Diode technology.  
E1: Kelvin Emitter  
E2: Power Emitter  
Features  
G
Maximum Junction Temperature: T = 175°C  
J
E1  
E2  
Positive Temperature Coefficient for Easy Parallel Operating  
High Current Capability  
Low Saturation Voltage: V  
= 1.45 V (Typ.) @ I = 75 A  
C
100% of the Parts are Tested for I (Note 2)  
CE(Sat)  
LM  
Smooth and Optimized Switching  
Tight Parameter Distribution  
RoHS Compliant  
TO2474LD  
Typical Applications  
Solar Inverter  
UPS, ESS  
CASE 340CJ  
MARKING DIAGRAM  
PFC, Converters  
MAXIMUM RATINGS  
Rating  
Symbol Value  
Unit  
V
FGHL75T65  
MQDTL4  
Collector to Emitter Voltage  
V
CES  
V
GES  
650  
Gate to Emitter Voltage  
Transient Gate to Emitter Voltage  
20  
30  
V
Collector Current (Note 1)  
@ T = 25°C  
I
C
80  
75  
A
C
@ T = 100°C  
C
Pulsed Collector Current (Note 2)  
Pulsed Collector Current (Note 3)  
I
300  
300  
A
A
A
LM  
I
CM  
&Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= 3Digit Date Code  
Diode Forward Current (Note 1) @ T  
@ T  
25°C  
100°C  
I
F
80  
75  
C =  
C =  
= 2Digit Lot Traceability Code  
Pulsed Diode Maximum Forward Current  
I
300  
A
FM  
FGHL75T65MQDTL4 = Specific Device Code  
Maximum Power Dissipation @ T = 25°C  
P
D
375  
188  
W
C
@ T = 100°C  
C
Operating Junction and Storage Temperature  
Range  
T ,  
STG  
55 to  
°C  
°C  
J
ORDERING INFORMATION  
T
+175  
Device  
Package  
Shipping  
Maximum Lead Temp. for Soldering  
Purposes (1/8from Case for 5 s)  
T
L
260  
FGHL75T65MQDTL4 TO2474LD 30 Units / Tube  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Value limit by bond wire  
2. V = 400 V, V = 15 V, I = 300 A, Inductive Load, 100% tested  
CC  
GE  
C
3. Repetitive rating: Pulse width limited by max. junction temperature  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
FGHL75T65MQDTL4/D  
August, 2021 Rev. 1  
 
FGHL75T65MQDTL4  
THERMAL CHARACTERISTICS  
Rating  
Symbol  
Value  
0.40  
0.60  
40  
Unit  
°C/W  
°C/W  
°C/W  
Thermal Resistance Junctiontocase, for IGBT  
Thermal Resistance Junctiontocase, for Diode  
Thermal Resistance Junctiontoambient  
R
q
JC  
R
q
JC  
R
q
JA  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Collectoremitter Breakdown Voltage,  
Gateemitter Shortcircuited  
V
C
= 0 V,  
BV  
650  
V
GE  
CES  
I
= 1 mA  
Temperature Coefficient of Breakdown  
Voltage  
V
C
= 0 V,  
= 1 mA  
0.6  
V/°C  
DBVCES  
DTJ  
GE  
I
Collectoremitter Cutoff Current,  
Gateemitter Shortcircuited  
V
CE  
= 0 V,  
I
250  
400  
mA  
GE  
CES  
V
= 650 V  
Gate Leakage Current, Collectoremitter  
Shortcircuited  
V
= 20 V,  
= 0 V  
I
nA  
GE  
GES  
V
CE  
ON CHARACTERISTICS  
Gateemitter Threshold Voltage  
Collectoremitter Saturation Voltage  
V
= V , I = 75 mA  
V
GE(th)  
3.0  
4.5  
6.0  
1.8  
V
V
V
GE  
CE  
C
V
= 15 V,  
= 75 A,  
T = 25°C  
J
V
CE(sat)  
1.45  
1.65  
GE  
C
I
T = 175°C  
J
DYNAMIC CHARACTERISTICS  
Input Capacitance  
V
= 30 V,  
GE  
C
4954  
163  
14  
pF  
nC  
CE  
ies  
V
= 0 V,  
Output Capacitance  
C
oes  
f = 1 MHz  
Reverse Transfer Capacitance  
Gate Charge Total  
C
res  
V
= 400 V,  
= 75 A,  
Q
149  
27  
CE  
g
I
C
Gatetoemitter Charge  
Gatetocollector Charge  
Q
Q
ge  
gc  
V
= 15 V  
GE  
34  
SWITCHING CHARACTERISTICS, INDUCTIVE LOAD  
Turnon Delay Time  
Rise Time  
T
CC  
= 25°C,  
t
30  
16  
ns  
C
d(on)  
V
= 400 V,  
t
r
I
= 37.5 A,  
C
R
= 10 W,  
G
Turnoff Delay Time  
Fall Time  
t
190  
35  
d(off)  
V
= 15 V,  
GE  
Inductive Load  
t
f
Turnon Switching Loss  
Turnoff Switching Loss  
Total Switching Loss  
Turnon Delay Time  
Rise Time  
E
on  
E
off  
0.6  
0.5  
1.1  
32  
mJ  
ns  
E
ts  
T
C
= 25°C,  
= 400 V,  
= 75 A,  
= 10 W,  
t
t
d(on)  
V
CC  
C
t
r
29  
I
R
V
G
Turnoff Delay Time  
Fall Time  
181  
32  
d(off)  
= 15 V,  
GE  
Inductive Load  
t
f
Turnon Switching Loss  
Turnoff Switching Loss  
Total Switching Loss  
E
on  
E
off  
1.2  
1.1  
2.3  
mJ  
E
ts  
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2
FGHL75T65MQDTL4  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted) (continued)  
J
Parameter  
SWITCHING CHARACTERISTICS, INDUCTIVE LOAD  
Turnon Delay Time  
Rise Time  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
T
CC  
= 150°C,  
t
t
27  
19  
ns  
C
d(on)  
V
= 400 V,  
t
r
I
= 37.5 A,  
C
R
= 10 W,  
GE  
G
Turnoff Delay Time  
Fall Time  
206  
44  
d(off)  
V
= 15 V,  
Inductive Load  
t
f
Turnon Switching Loss  
Turnoff Switching Loss  
TotaL Switching Loss  
Turnon Delay Time  
Rise Time  
E
on  
E
off  
1.9  
1.8  
1.8  
30  
mJ  
ns  
E
ts  
T
= 150°C,  
t
t
C
d(on)  
V
= 400 V,  
= 75 A,  
= 10 W,  
CC  
t
r
32  
I
C
R
G
Turnoff Delay Time  
Fall Time  
198  
40  
d(off)  
V
= 15 V,  
GE  
Inductive Load  
t
f
Turnon Switching Loss  
Turnoff Switching Loss  
Total Switching Loss  
DIODE CHARACTERISTICS  
E
on  
E
off  
2.0  
1.4  
3.4  
mJ  
V
E
ts  
Diode Forward Voltage  
I = 75 A  
F
T = 25°C  
J
V
FM  
1.65  
1.55  
2.1  
T = 175°C  
J
DIODE SWITCHING CHARACTERISTICS, INDUCTIVE LOAD  
Reverse Recovery Energy  
T
= 25°C, V = 400 V, I = 37.5 A,  
E
105  
58  
mJ  
ns  
nC  
mJ  
ns  
nC  
mJ  
ns  
nC  
mJ  
ns  
nC  
C
CE  
F
REC  
dI /dt = 1000 A/ms  
F
Diode Reverse Recovery Time  
Diode Reverse Recovery Charge  
Reverse Recovery Energy  
T
rr  
Q
591  
235  
107  
1113  
747  
151  
2780  
865  
171  
3286  
rr  
T
= 25°C, V = 400 V, I = 75 A,  
E
REC  
C
CE  
F
dI /dt = 1000 A/ms  
F
Diode Reverse Recovery Time  
Diode Reverse Recovery Charge  
Reverse Recovery Energy  
T
rr  
Q
rr  
T
C
= 150°C, V = 400 V, I = 37.5 A,  
E
REC  
CE  
F
dI /dt = 1000 A/ms  
F
Diode Reverse Recovery Time  
Diode Reverse Recovery Charge  
Reverse Recovery Energy  
T
rr  
Q
rr  
T
= 150°C, V = 400 V, I = 75 A,  
E
REC  
C
CE  
F
dI /dt = 1000 A/ms  
F
Diode Reverse Recovery Time  
Diode Reverse Recovery Charge  
T
rr  
Q
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
3
FGHL75T65MQDTL4  
TYPICAL CHARACTERISTICS  
300  
240  
180  
120  
60  
300  
20 V  
15 V  
12 V  
10 V  
20 V  
15 V  
12 V  
10 V  
T
C
= 25°C  
T
C
= 150°C  
240  
180  
120  
60  
V
GE  
= 8 V  
V
GE  
= 8 V  
0
0
0
1
2
3
4
5
0
0
1
1
2
3
4
5
V
, CollectorEmitter Voltage (V)  
V
, CollectorEmitter Voltage (V)  
CE  
CE  
Figure 1. Typical Output Characteristics  
Figure 2. Typical Output Characteristics  
300  
240  
180  
120  
60  
150  
100  
50  
Common Emitter  
Common Emitter  
= 15 V  
= 25°C  
C
V
T
= 15 V  
= 25°C  
= 150°C  
V
T
GE  
CE  
C
T
C
T
C
= 150°C  
0
0
0
1
2
3
4
5
2
4
6
8
10  
V
, CollectorEmitter Voltage (V)  
V
GE  
, GateEmitter Voltage (V)  
CE  
Figure 3. Typical Saturation Voltage  
Figure 4. Typical Transfer Characteristics  
2.5  
2.0  
1.5  
1.0  
Common Emitter  
V
GE  
= 15 V  
10000  
1000  
100  
10  
Cies  
Coes  
150 A  
75 A  
Common Emitter  
Cres  
V
T
= 0 V, f = 1 MHz  
= 25°C  
GE  
I
= 40 A  
C
C
1
10  
, CollectorEmitter Voltage (V)  
CE  
100  
50  
0
50  
100  
150  
200  
30  
T , CollectorEmitter Case Temperature (°C)  
V
C
Figure 5. Saturation Voltage vs. Case Temperature  
Figure 6. Capacitance Characteristics  
www.onsemi.com  
4
FGHL75T65MQDTL4  
TYPICAL CHARACTERISTICS (continued)  
15  
12  
9
1000  
Common Emitter  
V
CC  
= 200 V  
T
C
= 25°C  
10 ms  
DC  
100  
10  
1
300 V  
400 V  
100 ms  
1 ms  
10 ms  
6
*Notes:  
1. T = 25°C  
2. T = 175°C  
C
3
J
3. Single Pulse  
0,1  
0
0
30  
60  
90  
120  
150  
1
10  
, CollectorEmitter Voltage (V)  
CE  
100  
1000  
Q , Gate Charge (nC)  
V
g
Figure 7. Gate Charge Characteristics  
Figure 8. SOA Characteristics  
1000  
100  
10  
200  
100  
t
d(off)  
Common Emitter  
= 400 V, V = 15 V  
t
d(on)  
V
CC  
= 75 A  
GE  
I
C
T
C
T
C
= 25°C  
= 150°C  
t
r
Common Emitter  
t
r
V
= 400 V, V = 15 V  
CC  
GE  
I
T
T
= 75 A  
C
= 25°C  
C
C
= 150°C  
10  
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
R , Gate Resistance (W)  
g
R , Gate Resistance (W)  
g
Figure 9. TurnOn Characteristics vs. Gate Resistance  
Figure 10. TurnOff Characteristics vs. Gate Resistance  
500  
200  
Common Emitter  
V
= 400 V, V = 15 V  
CC  
GE  
R
T
T
= 10 W  
= 25°C  
= 150°C  
G
C
C
100  
t
d(off)  
t
r
100  
t
d(on)  
Common Emitter  
V
= 400 V, V = 15 V  
CC  
GE  
t
r
R
T
T
= 10 W  
= 25°C  
= 150°C  
G
C
C
10  
10  
0
50  
100  
150  
200  
0
50  
100  
150  
200  
I , Collector Current (A)  
C
I , Collector Current (A)  
C
Figure 11. TurnOn Characteristics vs. Collector  
Figure 12. TurnOff Characteristics vs. Collector  
Current  
Current  
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5
FGHL75T65MQDTL4  
TYPICAL CHARACTERISTICS (continued)  
10  
10  
Common Emitter  
= 400 V, V = 15 V  
V
CC  
GE  
I
C
= 75 A  
T
C
T
C
= 25°C  
= 150°C  
E
on  
E
on  
1
E
off  
Common Emitter  
V
CC  
= 400 V, V = 15 V  
GE  
R
T
T
= 10 W  
= 25°C  
= 150°C  
G
C
C
E
off  
1
0,1  
0
10  
20  
30  
40  
50  
0
50  
100  
150  
200  
R , Gate Resistance (W)  
g
I , Collector Current (A)  
C
Figure 13. Switching Loss vs. Gate Resistance  
Figure 14. Switching Loss vs. Collector Current  
300  
60  
Common Emitter  
T
C
T
C
= 25°C  
= 150°C  
T
C
T
C
= 25°C  
= 150°C  
250  
200  
150  
100  
50  
50  
40  
30  
20  
10  
0
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
400  
600  
800  
1000  
1200  
1400  
1600  
V , Forward Voltage (V)  
F
di /dt, Diode Current Slop (A/ms)  
F
Figure 15. Forward Characteristics  
Figure 16. Reverse Recovery Current  
300  
250  
200  
150  
100  
50  
5
4,5  
4
T
C
T
C
= 25°C  
= 150°C  
T
C
T
C
= 25°C  
= 150°C  
3,5  
3
2,5  
2
1,5  
1
0,5  
0
400  
0
400  
600  
800  
1000  
1200  
1400  
1600  
600  
800  
1000  
1200  
1400  
1600  
di /dt, Diode Current Slop (A/ms)  
F
di /dt, Diode Current Slop (A/ms)  
F
Figure 17. Reverse Recovery Time  
Figure 18. Stored Charge  
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6
FGHL75T65MQDTL4  
TYPICAL CHARACTERISTICS (continued)  
1
0.1  
0.5  
PDM  
0.2  
0.1  
t1  
t2  
0.05  
0.02  
Duty Factor, D = t / t  
1
2
0.01  
Peak T = Pdm x Zthjc + T  
j
c
R
1
R
2
0.01  
0.001  
0.0001  
C = t / R  
C = t / R  
1
1
1
2
2
2
Single Pulse  
i:  
ri [K/W]: 0.00690 0.04226 0.11080  
t [s]: 1.741E5 8.297E5 3.073E3 1.497E2  
1
2
3
4
0.06875  
6  
5  
4  
3  
2  
1  
0
1
10  
10  
10  
10  
10  
10  
10  
10  
Rectangular Pulse Duration (s)  
Figure 19. Transient Thermal Impedance of IGBT  
1
0.1  
0.5  
0.2  
PDM  
0.1  
t1  
0.05  
t2  
0.02  
Duty Factor, D = t / t  
1
2
0.01  
Peak T = Pdm x Zthjc + T  
j
c
0.01  
R
1
R
2
0.001  
0.0001  
Single Pulse  
C = t / R  
C = t / R  
1
1
1
2
2
2
i:  
1
2
3
4
ri [K/W]: 0.00796 0.06415 0.14360 0.13740  
t [s]: 1.002E5 1.761E4 3.348E3 2.927E2  
6  
5  
4  
3  
2  
1  
0
1
10  
10  
10  
10  
10  
10  
10  
10  
Rectangular Pulse Duration (s)  
Figure 20. Transient Thermal Impedance of Diode  
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7
FGHL75T65MQDTL4  
PACKAGE DIMENSIONS  
TO2474LD  
CASE 340CJ  
ISSUE A  
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8
FGHL75T65MQDTL4  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
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