FGD3N60LSDTM-T [ONSEMI]

IGBT,600V,3A,1.2V,DPAK,平面;
FGD3N60LSDTM-T
型号: FGD3N60LSDTM-T
厂家: ONSEMI    ONSEMI
描述:

IGBT,600V,3A,1.2V,DPAK,平面

双极性晶体管
文件: 总9页 (文件大小:1101K)
中文:  中文翻译
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ON Semiconductor  
Is Now  
To learn more about onsemi™, please visit our website at  
www.onsemi.com  
onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or  
subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi  
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regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/  
or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application  
by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized  
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Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.  
FGD3N60LSD  
IGBT  
Description  
ON Semiconductor's Insulated Gate Bipolar Transistors  
Features  
(IGBTs)  
provide very low conduction losses. The device is  
High Current Capability  
designed for applica-tions where very low On-Voltage Drop is  
a required feature.  
Very Low Saturation Voltage : VCE(sat) = 1.2 V @ IC = 3A  
High Input Impedance  
Applications  
HID Lamp Applications  
Piezo Fuel Injection Applications  
C
C
G
D-PAK  
E
G
E
Absolute Maximum Ratings  
Symbol  
Description  
FGD3N60LSD  
Units  
VCES  
VGES  
IC  
Collector-Emitter Voltage  
Gate-Emitter Voltage  
600  
V
V
± 25  
Collector Current  
@ TC  
=
25°C  
6
A
Collector Current  
@ TC = 100°C  
3
A
ICM (1)  
I F  
Pulsed Collector Current  
Diode Continous Forward Current  
Diode Maximum Forward Current  
Maximum Power Dissipation  
Derating Factor  
25  
A
(1)  
@ TC = 100°C  
3
25  
A
I FM  
PD  
A
@ TC  
=
25°C  
40  
W
W/°C  
°C  
°C  
°C  
0.32  
TJ  
Operating Junction Temperature  
Storage Temperature Range  
-55 to +150  
-55 to +150  
250  
Tstg  
TL  
Maximum Lead Temp. for Soldering  
Purposes, 1/8” from Case for 5 Seconds  
Notes :  
(1) Repetitive rating : Pulse width limited by max. junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Typ.  
Max.  
3.1  
Units  
RθJC  
Thermal Resistance, Junction-to-Case  
--  
--  
°C/W  
°C/W  
(IGBT)  
RθJA  
Thermal Resistance, Junction-to-Ambient (PCB Mount) (2)  
100  
Notes :  
(2) Mounted on 1” squre PCB (FR4 or G-10 Material)  
©2006 Semiconductor Components Industries, LLC.  
October-2017,Rev. 2  
Publication Order Number:  
FGD3N60LSD/D  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Quantity  
FGD3N60LSD  
FGD3N60LSDTM  
D-PAK  
380mm  
16mm  
2500  
Electrical Characteristics of the IGBT  
T
= 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min. Typ. Max. Units  
Off Characteristics  
BVCES  
Collector-Emitter Breakdown Voltage  
VGE = 0V, IC = 250uA  
VGE = 0V, IC = 1mA  
600  
--  
--  
--  
--  
V
BVCES  
TJ  
/
Temperature Coefficient of Breakdown  
Voltage  
0.6  
V/°C  
ICES  
IGES  
Collector Cut-Off Current  
G-E Leakage Current  
VCE = VCES, VGE = 0V  
VGE = VGES, VCE = 0V  
--  
--  
--  
--  
250  
uA  
nA  
± 100  
On Characteristics  
VGE(th)  
G-E Threshold Voltage  
IC = 3mA, VCE = VGE  
IC = 3A, VGE = 10V  
2.5  
--  
3.2  
1.2  
1.8  
5.0  
1.5  
--  
V
V
V
VCE(sat)  
Collector to Emitter  
Saturation Voltage  
I
C = 6A,  
VGE = 10V  
--  
Dynamic Characteristics  
Cies  
Coes  
Cres  
Input Capacitance  
VCE = 25V VGE = 0V,  
f = 1MHz  
--  
--  
--  
185  
20  
--  
--  
--  
pF  
pF  
pF  
,
Output Capacitance  
Reverse Transfer Capacitance  
5.5  
Switching Characteristics  
td(on) Turn-On Delay Time  
tr  
td(off)  
tf  
VCC = 480 V, IC = 3A,  
RG = 470, VGE = 10V,  
Inductive Load, TC = 25°C  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
40  
40  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
ns  
ns  
Rise Time  
Turn-Off Delay Time  
Fall Time  
600  
600  
250  
1.00  
1.25  
40  
ns  
ns  
Eon  
Eoff  
Ets  
td(on)  
tr  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Turn-On Delay Time  
Rise Time  
uJ  
mJ  
mJ  
ns  
VCC = 480 V, IC = 3A,  
RG = 470, VGE = 10V,  
45  
ns  
Inductive Load, TC = 125°C  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
620  
800  
300  
1.9  
ns  
ns  
Eon  
Eoff  
Ets  
Qg  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Total Gate Charge  
Gate-Emitter Charge  
Gate-Collector Charge  
Internal Emitter Inductance  
uJ  
mJ  
mJ  
nC  
nC  
nC  
nH  
2.2  
VCE = 480 V, IC = 3A,  
VGE = 10V  
12.5  
2.8  
Qge  
Qgc  
Le  
4.9  
Measured 5mm from PKG  
7.5  
www.onsemi.com  
2
Electrical Characteristics of DIODE  
T
= 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min. Typ. Max. Units  
VFM  
Diode Forward Voltage  
IF = 3A  
TC  
TC = 100°C  
TC 25°C  
TC = 100°C  
TC 25°C  
C = 100°C  
TC 25°C  
TC = 100°C  
=
25°C  
--  
--  
--  
--  
--  
--  
--  
--  
1.5  
1.55  
234  
--  
1.9  
--  
V
ns  
A
trr  
Diode Reverse Recovery Time  
IF = 3A,  
di/dt = 100A/us  
VR = 200V  
=
--  
--  
Irr  
Diode Peak Reverse Recovery Current  
Diode Reverse Recovery Charge  
=
2.64  
--  
--  
T
--  
Qrr  
=
309  
--  
--  
nC  
--  
www.onsemi.com  
3
Typical Performance Characteristics  
Figure 1. Typical Output Characteristics  
Figure 2. Typical Output Characteristics  
30  
30  
Common Emitter  
20V  
15V  
Common Emitter  
TC = 125°C  
TC  
= 25°C  
24  
18  
12  
6
20V  
24  
15V  
10V  
18  
10V  
VGE = 8V  
VGE = 8V  
12  
6
0
0
2
4
6
8
0
0
2
4
6
8
Collector-Emitter Voltage, VCE [V]  
Collector-Emitter Voltage, VCE [V]  
Figure 3. Typical Output Characteristics  
Figure 4. Transfer Characteristics  
10  
10  
Common Emitter  
VCE = 20V  
Common Emitter  
VGE = 10V  
TC  
= 25°C  
TC  
= 25°C  
8
6
4
2
0
8
6
4
2
0
TC = 125°C  
TC = 125°C  
0.1  
1
10  
1
10  
Gate-Emitter Voltage, VGE[V]  
Collector-Emitter Voltage, VCE[V]  
Figure 5. Saturation Voltage vs. Case  
Figure 6. Capacitance Characteristics  
3
600  
Common Emitter  
Common Emitter  
VGE = 10V  
VGE = 0V, f = 1MHz  
TC = 25°C  
500  
400  
300  
200  
100  
0
2
Cies  
IC = 6A  
Coes  
Cres  
IC = 3A  
IC = 1.5A  
1
0
0
30  
60  
90  
120  
150  
1
10  
Case Temperature, TC [°C]  
Collector - Emitter Voltage, VCE [V]  
www.onsemi.com  
4
Typical Performance Characteristics (Continued)  
Figure 7. Gate Charge  
Figure 8. Turn-On Characteristics vs. Gate  
Resistance  
12  
1000  
Common Emitter  
RL = 160Ω  
Com m on Em itter  
VCC = 480V, VGE = 10V  
Vcc = 480V  
TC = 25°C  
10  
8
IC = 3A  
TC  
= 25°C  
TC = 125°C  
6
Ton  
Tr  
100  
4
2
0
10  
0
2
4
6
8
10  
12  
200  
400  
600  
800 1000  
Gate Charge, Qg [nC]  
Gate Resistance, RG []  
Figure 9. Turn-Off Characteristics vs.  
Gate Resistance  
Figure 10. Switching Loss vs. Gate Resistance  
10000  
10000  
Common Emitter  
VCC = 480V, VGE = 10V  
IC = 3A  
TC  
= 25°C  
Eoff  
TC = 125°C  
1000  
Toff  
Tf  
1000  
Eon  
100  
Common Emitter  
VCC = 480V, VGE = 10V  
IC = 3A  
TC  
= 25°C  
TC = 125°C  
100  
10  
200  
400  
600  
800 1000  
200  
400  
600  
800 1000  
Gate Resistance, RG []  
Gate Resistance, RG []  
Figure 11. Turn-On Characteristics vs.  
Collector Current  
Figure 12. Turn-Off Characteristics vs.  
Collector Current  
Common Emitter  
Vcc = 480V, VGE = 10V  
R
G = 470Ω  
25°C  
100  
TC  
=
1000  
Toff  
Tf  
TC = 125°C  
Ton  
Tr  
Common Emitter  
Vcc = 480 V, VGE = 10V  
G = 470Ω  
TC = 25°C  
R
T
C = 125°C  
10  
2
3
4
100  
Collector Current, IC [A]  
2
3
4
Collector Current, IC [A]  
www.onsemi.com  
5
Typical Performance Characteristics (Continued)  
Figure 13. Switching Loss vs. Collector Current  
Figure 14. Forward Characteristics  
100  
Tc = 25°C  
Common Emitter  
Vcc = 480 V, VGE = 10V  
Tc = 100°C  
RG = 470Ω  
TC = 25°C  
TC = 125°C  
10  
Eoff  
Eon  
1000  
1
100  
0.1  
0
1
2
3
4
2
3
4
Collector Current, IC [A]  
Forward Voltage Drop, VF [V]  
Figure 15. Forward Voltage Drop Vs Tj  
Figure 16. SOA Characteristics  
100  
2.8  
Ic MAX (Pulsed)  
2.4  
50µs  
10  
100µs  
Ic MAX (Continuous)  
IF=6 A  
1ms  
2.0  
1
DC Operation  
1.6  
IF=3 A  
Single Nonrepetitive  
0.1  
Pulse Tc = 25°C  
Curves must be derated  
linearly with increase  
in temperature  
IF=1.5 A  
1.2  
0.01  
25  
50  
75  
100  
125  
0.1  
1
10  
100  
1000  
Junction Temperature, Tj [°C]  
Collector - Emitter Voltage, VCE [V]  
Figure 17. Transient Thermal Impedance of IGBT  
10  
0.5  
1
0.2  
0.1  
0.05  
0.02  
0.01  
Pdm  
0.1  
single pulse  
t1  
t2  
Duty factor D = t1 / t2  
Peak Tj = Pdm  
1
× Zthjc + T  
C
0.01  
1E-5  
1E-4  
1E-3  
0.01  
0.1  
10  
Rectangular Pulse Duration [sec]  
www.onsemi.com  
6
Mechanical Dimensions  
D-PAK  
Dimensions in Millimeters  
www.onsemi.com  
7
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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