FFSD0465A [ONSEMI]

Silicon Carbide (SiC) Schottky Diode – EliteSiC, 4 A, 650 V, D1, DPAK;
FFSD0465A
型号: FFSD0465A
厂家: ONSEMI    ONSEMI
描述:

Silicon Carbide (SiC) Schottky Diode – EliteSiC, 4 A, 650 V, D1, DPAK

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DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
Schottky Diode – EliteSiC,  
4ꢀA, 650 V, D1, DPAK  
1, 3. Cathode  
2. Anode  
Schottky Diode  
FFSD0465A  
Description  
3
Silicon Carbide (SiC) Schottky Diodes use a completely new  
technology that provides superior switching performance and higher  
reliability compared to Silicon. No reverse recovery current,  
temperature independent switching characteristics, and excellent  
thermal performance sets Silicon Carbide as the next generation of  
power semiconductor. System benefits include highest efficiency,  
faster operating frequency, increased power density, reduced EMI, and  
reduced system size and cost.  
1
2
DPAK  
CASE 369AS  
MARKING DIAGRAM  
Features  
Max Junction Temperature 175°C  
Avalanche Rated 25 mJ  
FFS  
D0465A  
AYWWZZ  
High Surge Current Capacity  
Positive Temperature Coefficient  
Ease of Paralleling  
No Reverse Recovery/No Forward Recovery  
This Device is PbFree, Halogen Free/BFR Free and RoHS  
FFSD0465A  
A
YWW  
ZZ  
= Specific Device Code  
= Assembly Site  
= Date Code (Year & Week)  
= Lot Code  
Compliant  
Applications  
General Purpose  
SMPS, Solar Inverter, UPS  
Power Switching Circuits  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Peak Repetitive Reverse Voltage  
Single Pulse Avalanche Energy (Note 1)  
Value  
Unit  
V
V
RRM  
650  
E
AS  
25  
4
mJ  
A
I
F
Continuous Rectified Forward Current @ T < 160°C  
C
Continuous Rectified Forward Current @ T < 135°C  
7.6  
360  
330  
38  
C
I
NonRepetitive Peak Forward  
Surge Current  
T
= 25°C, 10 ms  
= 150°C, 10 ms  
A
A
A
F, Max  
C
C
T
I
NonRepetitive Forward Surge HalfSine Pulse,  
F, SM  
Current  
t = 8.3 ms  
P
18  
A
I
Repetitive Forward Surge  
Current  
HalfSine Pulse,  
F, RM  
t
P
= 8.3 ms  
Ptot  
Power Dissipation  
T
T
= 25°C  
61  
10  
W
W
°C  
C
= 150°C  
C
T ,T  
Operating and Storage Temperature Range  
55 to  
J
STG  
+175  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. E of 25 mJ is based on starting T = 25°C, L = 0.5 mH, I = 10 A, V = 50 V  
AS  
J
AS  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
February, 2023 Rev. 5  
FFSD0465A/D  
 
FFSD0465A  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Value  
Unit  
R
Thermal Resistance, Junction to Case, Max.  
2.46  
°C/W  
q
JC  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Forward Voltage  
Test Condition  
I = 4 A, T = 25°C  
Min  
Typ  
1.50  
1.6  
1.72  
Max  
1.75  
2.0  
2.4  
200  
400  
600  
Unit  
V
F
V
F
C
I = 4 A, T = 125°C  
F
C
I = 4 A, T = 175°C  
F
C
I
R
Reverse Current  
V
R
V
R
V
R
= 650 V, T = 25°C  
mA  
C
= 650 V, T = 125°C  
C
= 650 V, T = 175°C  
C
Q
Total Capacitive Charge  
Total Capacitance  
V = 400 V  
16  
nC  
pF  
C
C
V
R
V
R
V
R
= 1 V, f = 100 kHz  
= 200 V, f = 100 kHz  
= 400 V, f = 100 kHz  
258  
29  
21  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
ORDERING INFORMATION  
Part Number  
Top Marking  
Package  
Shipping*  
FFSD0465A  
FFSD0465A  
DPAK  
2500 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D  
TYPICAL CHARACTERISTICS  
(T = 25°C UNLESS OTHERWISE NOTED)  
J
6  
10  
4
3
2
1
7  
10  
T
J
= 175°C  
T = 55°C  
J
8  
10  
10  
T
J
= 25°C  
T
= 75°C  
J
T
= 125°C  
= 175°C  
T
J
= 75°C  
J
T
= 25°C  
J
T
T
J
= 125°C  
J
T = 55°C  
J
9  
0
0.0  
200  
300  
400  
500  
600 650  
0.5  
1.0  
1.5  
2.0  
V , REVERSE VOLTAGE (V)  
R
V , FORWARD VOLTAGE (V)  
F
Figure 1. Forward Characteristics  
Figure 2. Reverse Characteristics  
www.onsemi.com  
2
FFSD0465A  
TYPICAL CHARACTERISTICS (CONTINUED)  
(T = 25°C UNLESS OTHERWISE NOTED)  
J
70  
56  
42  
70  
56  
42  
28  
D = 0.1  
D = 0.2  
D = 0.3  
D = 0.5  
28  
14  
0
14  
0
D = 0.7  
D = 1  
25  
50  
75  
100  
125  
150  
175  
25  
50  
75  
100  
125  
150  
175  
T , CASE TEMPERATURE (5C)  
Figure 4. Power Derating  
T , CASE TEMPERATURE (5C)  
C
C
Figure 3. Current Derating  
1000  
100  
50  
25  
20  
15  
10  
5
0
0
100  
200  
300  
400  
500  
600 650  
0.1  
1
10  
100  
650  
V , REVERSE VOLTAGE (V)  
R
V , REVERSE VOLTAGE (V)  
R
Figure 6. Capacitance vs. Reverse Voltage  
Figure 5. Capacitive Charge vs. Reverse  
Voltage  
5
4
3
2
1
0
0
100  
200  
300  
400  
500  
600 650  
V , REVERSE VOLTAGE (V)  
R
Figure 7. Capacitance Stored Energy  
www.onsemi.com  
3
FFSD0465A  
TYPICAL CHARACTERISTICS (CONTINUED)  
(T = 25°C UNLESS OTHERWISE NOTED)  
J
2
1
DUTY CYCLE DESCENDING ORDER  
P
DM  
0.1  
0.5  
t
1
0.2  
t
2
0.1  
NOTES:  
(t) = r(t) × R  
0.05  
0.01  
Z
q
q
JC  
JC  
0.02  
0.01  
R
q
= 2.46°C/W  
JC  
Peak T = P  
× Z  
q
(t) + T  
JC C  
J
DM  
Duty cycle, D = t /t  
1
2
SINGLE PULSE  
0.001  
6  
5  
4  
3  
2  
1  
10  
10  
10  
10  
10  
10  
1
t, RECTANGULAR PULSE DURATION (sec)  
Figure 8. Junction-to-Case Transient Thermal Response Curve  
TEST CIRCUIT AND WAVEFORMS  
L = 0.5 mH  
R < 0.1 W  
V
DD  
= 50 V  
EAVL = 1/2LI2 [V  
/ (V V )]  
R(AVL) DD  
R(AVL)  
Q1 = IGBT (BV  
> DUT V  
)
CES  
R(AVL)  
V
AVL  
L
R
+
V
CURRENT  
SENSE  
DD  
I
L
I
L
Q1  
I V  
V
DD  
DUT  
t
0
t
1
t
2
t
Figure 9. Unclamped Inductive Switching Test Circuit & Waveform  
www.onsemi.com  
4
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
DPAK3 (TO252 3 LD)  
CASE 369AS  
ISSUE A  
DATE 28 SEP 2022  
GENERIC  
MARKING DIAGRAM*  
XXXXXX  
XXXXXX  
AYWWZZ  
XXXX = Specific Device Code  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
ZZ  
= Assembly Lot Code  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
98AON13810G  
DPAK3 (TO252 3 LD)  
PAGE 1 OF 1  
DESCRIPTION:  
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© Semiconductor Components Industries, LLC, 2019  
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ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
Technical Library: www.onsemi.com/design/resources/technicaldocumentation  
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