FDY4000CZ [ONSEMI]

互补,N 和 P 沟道,PowerTrench® MOSFET,20V;
FDY4000CZ
型号: FDY4000CZ
厂家: ONSEMI    ONSEMI
描述:

互补,N 和 P 沟道,PowerTrench® MOSFET,20V

PC 开关 光电二极管 晶体管
文件: 总11页 (文件大小:348K)
中文:  中文翻译
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November 2009  
FDY4000CZ  
Complementary N & P-Channel PowerTrench®  
MOSFET  
Features  
General Description  
Q1: N-Channel  
This Complementary N & P-Channel MOSFET has been  
designed using Fairchild Semiconductor’s advanced Power  
Trench® process to optimize the rDS(ON) @ VGS= 2.5V and  
specify the rDS(ON) @ VGS = 1.8V.  
  Max rDS(on)   0.7at VGS = 4.5V, ID = 600mA  
  Max rDS(on)   0.85at VGS = 2.5V, ID = 500mA  
  Max rDS(on)   1.25at VGS = 1.8V, ID =150 mA  
Applications  
Q2: P-Channel  
  Level shifting  
  Max rDS(on)   1.2at VGS = -4.5V, ID = -350mA  
  Max rDS(on)   1.6at VGS = -2.5V, ID = -300mA  
  Max rDS(on)   2.7at VGS = -1.8V, ID = -150mA  
  ESD protection diode (note 3)  
  Power Supply Converter Circuits  
  Load/Power Switching Cell Phones, Pagers  
  RoHS Compliant  
6
5
4
3
S2  
4
5
6
D2  
G1  
S1  
2
1
G2  
D1  
1
2
3
MOSFET Maximum Ratings TC = 25°C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Q1  
20  
12  
600  
1000  
Q2  
-20  
8
-350  
-1000  
Units  
V
V
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current -Continuous  
-Pulsed  
(Note 1a)  
ID  
mA  
625  
446  
Power Dissipation (Steady State)  
(Note 1a)  
(Note 1b)  
PD  
mW  
TJ, TSTG  
Operating and Storage Jaunting Temperature Range  
-55 to 150  
°C  
Thermal Characteristics  
RJA  
RJA  
Thermal Resistance, Junction to Ambient  
Thermal Resistance, Junction to Ambient  
(Note 1a)  
(Note 1b)  
200  
280  
°C/W  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Quantity  
E
FDY4000CZ  
SC89-6  
7”  
8mm  
3000units  
©2009 Fairchild Semiconductor Corporation  
FDY4000CZ Rev. B2  
1
www.fairchildsemi.com  
Electrical Characteristics TJ = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Type Min Typ Max Units  
Off Characteristics  
Drain to Source Breakdown Volt- ID = 250A, VGS = 0V  
Q1  
Q2  
20  
-20  
BVDSS  
V
age D = -250A, VGS = 0V  
I
BVDSS  
ꢀꢀꢀꢄTJ  
Breakdown Voltage Temperature ID = 250A, referenced to 25°C  
Q1  
Q2  
Q1  
Q2  
15  
-15  
mV/°C  
A  
Coefficient  
I
D = -250A, referenced to 25°C  
V
V
DS = 16V, VDS =0V  
DS = -16V, VDS =0V  
1
-3  
IDSS  
Zero Gate Voltage Drain Current  
VGS  
VGS  
VGS  
=
=
=
12V, VDS = 0V  
4.5V, VDS = 0V  
8V, VDS = 0V  
Q1  
Q1  
Q2  
10  
1
10  
IGSS  
Gate-Body Leakage  
A  
On Characteristics (note 2)  
V
V
GS = VDS, ID = 250A  
GS = VDS, ID = -250A  
Q1  
0.6  
1.0  
1.5  
VGS(th)  
Gate to Source Threshold Voltage  
V
Q2 -0.6 -1.0 -1.5  
VGS(th)  
ꢀꢀꢀꢄTJ  
Gate to Source Threshold Voltage ID = 250A, referenced to 25°C  
Q1  
Q2  
-3  
3
ꢀꢀ  
mV/°C  
Temperature Coefficient  
ID = -250A, referenced to 25°C  
V
V
V
V
V
V
V
V
GS = 4.5V, ID = 600mA  
0.30 0.70  
0.40 0.85  
0.80 1.25  
0.35 1.00  
GS = 2.5V, ID = 500mA  
Q1  
Q2  
GS = 1.8V, ID = 150mA,  
GS = 4.5V, ID = 600mA,TJ = 125°C  
rDS(on)  
Drain to Source On Resistance  
GS = -4.5V, ID = --350mA  
GS = -2.5V, ID = -300mA  
GS = -1.8V, ID = -150mA  
0.5  
0.8  
1.3  
0.7  
1.2  
1.6  
2.7  
1.6  
GS = -4.5V, ID = -350mA, TJ =125°C  
V
V
DS = 5V, ID = 600mA  
DS = -5V, ID = -350mA  
Q1  
Q2  
1.8  
1
gFS  
Forward Transconductance  
S
Dynamic Characteristics  
Q1  
Q2  
Q1  
Q2  
Q1  
Q2  
60  
Q1  
Ciss  
Coss  
Crss  
Input Capacitance  
pF  
pF  
pF  
100  
VDS = 10V, VGS = 0V, f = 1MHz  
20  
30  
10  
15  
Output Capacitance  
Q2  
VDS = -10V, VGS = 0V, f = 1MHz  
Reverse Transfer Capacitance  
Switching Characteristics  
Q1  
Q2  
Q1  
Q2  
Q1  
Q2  
Q1  
Q2  
6
6
8
13  
8
8
12  
12  
16  
23  
16  
16  
4.8  
2
Q1  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
ns  
ns  
V
V
DD= 10V, ID = 1A,  
GS= 4.5V, Rg = 6ꢁ  
Rise Time  
Q2  
Turn-Off Delay Time  
Fall Time  
ns  
VDD= -10V, ID = -0.5A,  
V
GS= -4.5V, Rg = 6ꢁ  
2.4  
1
ns  
Q1  
Q2  
Q1  
Q2  
Q1  
Q2  
0.8  
1.0  
0.16  
0.2  
0.26  
0.3  
1.1  
1.4  
Qg  
Total Gate Charge  
Gate to Source Gate Charge  
Gate to Drain “Miller”Charge  
nC  
nC  
nC  
Q1  
V
DS= 10V, ID = 600mA, VGS= 4.5V  
Qgs  
Qgd  
Q2  
V
DS= -10V, ID = -350mA, VGS= -4.5V  
2
www.fairchildsemi.com  
©2009 Fairchild Semiconductor Corporation  
FDY4000CZ Rev. B2  
Electrical Characteristics TJ = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Type Min Typ Max Units  
Drain-Source Diode Characteristics  
Source to Drain Diode Forward  
VGS = 0V, IS = 150mA (Note 2)  
Q1  
Q2  
0.7  
1.2  
VSD  
V
Voltage  
V
GS = 0V, IS = -150mA (Note 2)  
-0.8 -1.2  
Q1  
Q2  
Q1  
Q2  
8
Q1  
trr  
Reverse Recovery Time  
ns  
nC  
11  
IF = 600mA, di/dt = 100A/s  
Q2  
1
2
Qrr  
Reverse Recovery Charge  
IF = -350mA, di/dt = 100A/s  
Notes:  
1: R  
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of  
JA  
the drain pins. R is guaranteed by design while R  
is determined by the user's board design.  
JC  
JA  
b) 280°C/W when mounted  
on a minimum pad of 2 oz  
copper  
a) 200°C/W when mounted  
2
on a 1 in pad of 2 oz copper  
Scale 1:1 on letter size paper  
2: Pulse Test : Pulse Width < 300us, Duty Cycle < 2.0%  
3: The diode connected between the gate and source serves only as protection against ESD. No gate overvoltage rating is implied.  
3
www.fairchildsemi.com  
©2009 Fairchild Semiconductor Corporation  
FDY4000CZ Rev. B2  
Typical Characteristics Q1 (N-Channel)  
1
2.6  
2.4  
2.2  
2
9*6ꢁ ꢁꢉꢆꢇ9  
ꢊꢆꢈ9  
ꢊꢆꢇ9  
9*6ꢁ ꢁꢅꢆꢈ9  
0.8  
0.6  
0.4  
0.2  
0
ꢅꢆꢈ9  
ꢅꢆꢇ9  
1.8  
1.6  
1.4  
1.2  
1
ꢅꢆꢇ9  
ꢊꢆꢈ9  
ꢊꢆꢇ9  
ꢉꢆꢇ9  
0.8  
0.8  
0
0.25  
0.5  
0.75  
1
0
0.2  
0.4  
0.6  
1
9'6ꢀꢁ'5$,1ꢂ6285&(ꢁ92/7$*(ꢁꢃ9ꢄ  
Figure 1. On-Region Characteristics  
,
'
ꢀꢁ'5$,1ꢁ&855(17ꢁꢃ$ꢄ
 
Figure 2. Normalized on-Resistance vs. Drain  
Current and Gate Voltage  
0.9  
1.6  
ID = 300mA  
,'ꢁ ꢁꢋꢈꢈP$  
*6ꢁ ꢁꢉꢆꢇ9  
0.8  
0.7  
0.6  
9
1.4  
1.2  
1
TA = 125oC  
0.5  
0.4  
0.8  
0.6  
0.3  
TA = 25oC  
0.2  
1
2
3
4
5
-50  
-25  
0
25  
50  
75  
100  
125  
150  
VGS, GATE TO SOURCE VOLTAGE (V)  
7
-
ꢀꢁ-81&7,21ꢁ7(03(5$785(ꢁꢃ
R
&ꢄ
 
Figure 3. Normalized on-Resistance vs.  
Figure4. On-Resistance vs.  
Temperature  
Gate-to-Source Voltage  
1.5  
1
25oC  
VDS = 5V  
TA = -55oC  
VGS = 0V  
1.2  
0.9  
0.6  
0.3  
0
125oC  
0.1  
0.01  
TA = 125oC  
25oC  
-55oC  
0.001  
0.0001  
0.5  
1
1.5  
2
2.5  
3
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
VGS, GATE TO SOURCE VOLTAGE (V)  
VSD, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. Source to Drain Diode Forward  
Voltage vs. Source Current and Temperature  
4
www.fairchildsemi.com  
©2009 Fairchild Semiconductor Corporation  
FDY4000CZ Rev. B2  
Typical Characteristics Q1 (N-Channel)  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
5
Iꢁ ꢁꢌ0+]  
9*6  ꢁꢈꢁ9  
,'ꢁ ꢁꢋꢈꢈP$  
ꢌꢇ9  
4
&
9'6ꢁ ꢁꢇ9  
LVV  
3
ꢌꢈ9  
2
&
RVV  
1
0
&
UVV  
0
0.2  
0.4  
0.6  
0.8  
1
0
4
8
12  
16  
20  
4Jꢀꢁ*$7(ꢁ&+$5*(ꢁꢃQ&ꢄ  
9'6ꢀꢁ'5$,1ꢁ72ꢁ6285&(ꢁ92/7$*(ꢁꢃ9ꢄ  
Figure 7. Gate Charge Characteristics  
Figure 8. Capacitance vs. Drain to source  
voltage  
10  
30  
SINGLE PULSE  
RꢀJA = 280°C/W  
TA = 25°C  
25  
20  
15  
10  
5
RDS(ON) LIMIT  
1
0.1  
1ms  
10ms  
VGS = 4.5V  
100ms  
SINGLE PULSE  
10s  
1s  
DC  
RꢀJA = 280oC/W  
TA = 25oC  
0.01  
0
0.1  
1
10  
100  
0.0001 0.001  
0.01  
0.1  
1
10  
100  
1000  
VDS, DRAIN-SOURCE VOLTAGE (V)  
t1, TIME (sec)  
Figure 9. Maximum Safe Operating Area  
Figure 10. Single Pulse Maximum Power  
Dissipation  
1
D=0.5  
0.2  
RꢀJA(t) = r(t) * R  
RꢀJA =280 °C/W  
ꢀJA  
0.1  
0.05  
0.02  
0.01  
P(pk)  
0.1  
t1  
t2  
TJ - TA = P * RꢀJA(t)  
Duty Cycle, D = t1 / t2  
SINGLE PULSE  
0.01  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, TIME (sec)  
Figure 11. Transient Thermal Response Curve  
Thermal characterization performed using the conditions described in Note 1b.  
Transient thermal response will change depending on the circuit board design.  
5
www.fairchildsemi.com  
©2009 Fairchild Semiconductor Corporation  
FDY4000CZ Rev. B2  
Typical Characteristics Q2 (P-Channel)  
1
2.6  
2.2  
1.8  
1.4  
1
VGS= -4.5V  
-2.5V  
VGS=-1.8V  
-2.0V  
0.8  
-4.0V  
-3.0V  
0.6  
0.4  
0.2  
0
-2.0V  
-2.5V  
-1.8V  
-3.0V  
0.4  
-3.5V  
-4.0V  
-4.5V  
0.6  
0
0.2  
0.6  
0.8  
1
0
0.5  
1
1.5  
2
-ID, DRAIN CURRENT (A)  
-VDS, DRAIN TO SOURCE VOLTAGE (V)  
Figure 12. On-Region Characteristics  
Figure 13. Normalized on-Resistance vs. Drain  
Current and Gate Voltage  
1.6  
2
ID = -0.35A  
VGS = -4.5V  
ID = -0.175A  
1.75  
1.5  
1.4  
1.2  
1
1.25  
1
TA = 125oC  
0.75  
TA = 25oC  
0.5  
0.8  
0.25  
0.6  
0
2
4
6
8
10  
-50  
-25  
0
J
25  
50  
75  
100  
125  
150  
T , JUNCTION TEMPERATURE (oC)  
-VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 14. Normalized on-Resistance vs.  
Figure15. On-Resistance vs.  
Temperature  
Gate-to-Source Voltage  
1
0.1  
1
VGS = 0V  
VDS = -5V  
0.8  
0.6  
0.01  
TA = 125oC  
0.4  
TA = 125oC  
-55oC  
25oC  
0.001  
0.0001  
0.2  
-55oC  
25oC  
0
0.5  
1
1.5  
2
2.5  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
-VGS, GATE TO SOURCE VOLTAGE (V)  
-VSD, BODY DIODE FORWARD VOLTAGE (V)  
Figure 16. Transfer Characteristics  
Figure 17. Source to Drain Diode Forward  
Voltage vs. Source Current and Temperature  
6
www.fairchildsemi.com  
©2009 Fairchild Semiconductor Corporation  
FDY4000CZ Rev. B2  
Typical Characteristics Q2 (P-Channel)  
10  
150  
125  
100  
75  
f = 1 MHz  
GS = 0 V  
ID = -0.35A  
V
8
VDS = -5V  
-15V  
C
iss  
6
-10V  
4
Coss  
50  
2
0
25  
C
rss  
0
0
0.5  
1
1.5  
2
2.5  
0
2
4
6
8
10  
12  
-VDS, DRAIN TO SOURCE VOLTAGE (V)  
Qg, GATE CHARGE (nC)  
Figure 18. Gate Charge Characteristics  
Figure 19. Capacitance vs. Drain to source  
voltage  
10  
1
10  
8
6
4
2
100s  
RDS(ON) LIMIT  
1ms  
10ms  
100ms  
1s  
10s  
DC  
0.1  
VGS = -4.5V  
SINGLE PULSE  
R
JA = 280oC/W  
T
A = 25oC  
0
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
0.01  
0.01  
t1, TIME (sec)  
0.1  
1
10  
100  
-VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 20. Maximum Safe Operating Area  
Figure21. Single Pulse Maximum Power  
Dissipation  
1
D = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
SINGLE PULSE  
0.01  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, TIME (sec)  
Figure 22. Transient Thermal Response Curve  
Thermal characterization performed using the conditions described in Note 1b.  
Transient thermal response will change depending on the circuit board design.  
7
www.fairchildsemi.com  
©2009 Fairchild Semiconductor Corporation  
FDY4000CZ Rev. B2  
Dimensional Outline and Pad Layout  
1.70  
A
1.50  
0.50  
0.30  
0.15  
0.50  
B
6
1
4
3
1.20 BSC  
(0.20)  
1.60  
1.25  
1.80  
0.1 C B A  
0.30  
0.55  
0.50  
1.00  
TOP VIEW  
LAND PATTERN RECOMMENDATION  
0.60  
0.56  
0.18  
SEE DETAIL A  
0.10  
C
0.35 BSC  
0.20 BSC  
DETAIL A  
SCALE 2 : 1  
0.10  
0.00  
BOTTOM VIEW  
NOTES:  
A) THIS PACKAGE CONFORMS TO EIAJ  
SC89 PACKAGING STANDARD.  
B) ALL DIMENSIONS ARE IN MILLIMETERS.  
C) DRAWING CONFORMS TO ASME Y14.5M-1994  
D) DIMENSIONS ARE EXCLUSIVE OF BURRS,  
MOLD FLASH, AND TIE BAR EXTRUSIONS.  
MAD06ArevA  
8
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©2009 Fairchild Semiconductor Corporation  
FDY4000CZ Rev. B2  
TRADEMARKS  
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not  
intended to be an exhaustive list of all such trademarks.  
®
®
AccuPower™  
Auto-SPM™  
FPS™  
PowerTrench  
PowerXS™  
The Power Franchise  
F-PFS™  
®
®
Build it Now™  
CorePLUS™  
FRFET  
Programmable Active Droop™  
SM  
®
Global Power Resource  
Green FPS™  
QFET  
QS™  
TinyBoost™  
TinyBuck™  
TinyCalc™  
CorePOWER™  
CROSSVOLT™  
CTL™  
Green FPS™ e-Series™  
Gmax™  
Quiet Series™  
RapidConfigure™  
®
TinyLogic  
Current Transfer Logic™  
GTO™  
IntelliMAX™  
®
TINYOPTO™  
TinyPower™  
EcoSPARK  
EfficentMax™  
EZSWITCH™*  
ISOPLANAR™  
MegaBuck™  
MICROCOUPLER™  
MicroFET™  
Saving our world, 1mW /W /kW at a time™  
TinyPWM™  
SmartMax™  
TinyWire™  
™*  
SMART START™  
®
TriFault Detect™  
TRUECURRENT™*  
SPM  
MicroPak™  
STEALTH™  
SuperFET™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SupreMOS™  
SyncFET™  
Sync-Lock™  
®*  
®
MillerDrive™  
MotionMax™  
Motion-SPM™  
®
Fairchild  
®
®
Fairchild Semiconductor  
FACT Quiet Series™  
UHC  
®
OPTOLOGIC  
Ultra FRFET™  
UniFET™  
VCX™  
®
®
®
FACT  
OPTOPLANAR  
®
FAST  
FastvCore™  
VisualMax™  
XS™  
tm  
FETBench™  
PDP SPM™  
Power-SPM™  
®
FlashWriter  
*
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.  
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE  
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY  
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY  
THEREIN, WHICH COVERS THESE PRODUCTS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE  
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems which, (a) are  
intended for surgical implant into the body or (b) support or sustain life,  
and (c) whose failure to perform when properly used in accordance with  
instructions for use provided in the labeling, can be reasonably  
expected to result in a significant injury of the user.  
2. A critical component in any component of a life support, device, or  
system whose failure to perform can be reasonably expected to cause  
the failure of the life support device or system, or to affect its safety or  
effectiveness.  
ANTI-COUNTERFEITING POLICY  
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,  
www.Fairchildsemi.com, under Sales Support.  
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their  
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application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the  
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild  
Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild  
Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of  
up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and  
warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is  
committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Datasheet contains the design specifications for product development. Specifications  
may change in any manner without notice.  
Advance Information  
Formative / In Design  
Datasheet contains preliminary data; supplementary data will be published at a later  
date. Fairchild Semiconductor reserves the right to make changes at any time without  
notice to improve design.  
Preliminary  
First Production  
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to  
make changes at any time without notice to improve the design.  
No Identification Needed  
Obsolete  
Full Production  
Datasheet contains specifications on a product that is discontinued by Fairchild  
Semiconductor. The datasheet is for reference information only.  
Not In Production  
Rev. I41  
9
www.fairchildsemi.com  
©2009 Fairchild Semiconductor Corporation  
FDY4000CZ Rev. B2  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
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