FDS5672 [ONSEMI]
N 沟道 PowerTrench® MOSFET 60V,12A,10mΩ;型号: | FDS5672 |
厂家: | ONSEMI |
描述: | N 沟道 PowerTrench® MOSFET 60V,12A,10mΩ 开关 光电二极管 晶体管 |
文件: | 总14页 (文件大小:435K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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July 2005
FDS5672
N-Channel PowerTrench® MOSFET
60V, 12A, 10mΩ
General Description
Features
rDS(ON) = 10mΩ, VGS = 10V, ID = 12A
This N-Channel MOSFET has been designed specifically to
improve the overall efficiency of DC/DC converters using
either synchronous or conventional switching PWM
controllers. It has been optimized for low gate charge, low
rDS(ON) = 14mΩ, VGS = 6V, ID = 10A
High performance trench technology for extremely low
rDS(ON) and fast switching speed.
rDS(ON)
Low gate charge
High power and current handling capability
Applications
DC/DC converters
Branding Dash
5
6
7
8
4
3
2
1
5
1
2
3
4
SO-8
©2005 Fairchild Semiconductor Corporation
FDS5672 Rev. A
www.fairchildsemi.com
1
MOSFET Maximum Ratings TC = 25°C unless otherwise noted
Symbol
VDSS
VGS
Parameter
Ratings
60
Units
Drain to Source Voltage
Gate to Source Voltage
Drain Current
V
V
20
Continuous (TC = 25 oC, VGS = 10V, RθJA = 50oC/W)
Continuous (TC = 25 oC, VGS = 6V, RθJA = 50oC/W)
Pulsed
12
10
A
ID
Figure 4
245
A
mJ
EAS
Single Pulse Avalanche Energy (Note 1)
Power dissipation
Derate above 25oC
2.5
W
PD
20
mW/oC
oC
TJ, TSTG
Operating and Storage Temperature
-55 to 150
Thermal Characteristics
RθJC
RθJA
RθJA
Thermal Resistance Junction to Case (Note 2)
25
50
85
oC/W
oC/W
oC/W
Thermal Resistance Junction to Ambient at 10 seconds (Note 3)
Thermal Resistance Junction to Ambient at 1000 seconds (Note 3)
Package Marking and Ordering Information
Device Marking
Device
Package
Reel Size
Tape Width
12mm
Quantity
2500 units
FDS5672
FDS5672
SO-8
330mm
Electrical Characteristics TC = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
ID = 250µA, VGS = 0V
60
-
-
-
-
-
-
V
VDS = 50V
1
IDSS
µA
VGS = 0V
TC = 150oC
-
250
100
IGSS
VGS = 20V
-
nA
On Characteristics
VGS(TH)
Gate to Source Threshold Voltage
VGS = VDS, ID = 250µA
ID = 12A, VGS = 10V
ID = 10A, VGS = 6V,
ID = 12A, VGS = 10V,
2
-
-
4
V
0.0088 0.010
0.012 0.014
-
rDS(ON)
Drain to Source On Resistance
Ω
-
0.016 0.023
T
C = 150oC
Dynamic Characteristics
CISS
COSS
CRSS
RG
Input Capacitance
-
-
-
-
-
-
-
-
-
2200
410
130
1.4
34
-
pF
pF
pF
Ω
nC
nC
nC
nC
nC
VDS = 25V, VGS = 0V,
f = 1MHz
Output Capacitance
-
-
Reverse Transfer Capacitance
Gate Resistance
VGS = 0.5V, f = 1MHz
VGS = 0V to 10V
-
Qg(TOT)
Qg(TH)
Qgs
Total Gate Charge at 10V
Threshold Gate Charge
Gate to Source Gate Charge
Gate Charge Threshold to Plateau
Gate to Drain “Miller” Charge
45
5.5
-
VGS = 0V to 2V
4.2
9.4
5.2
9.3
VDD = 30V
ID = 12A
Ig = 1.0mA
Qgs2
Qgd
-
-
www.fairchildsemi.com
©2005 Fairchild Semiconductor Corporation
FDS5672 Rev. A
2
Resistive Switching Characteristics (VGS = 10V)
tON
td(ON)
tr
Turn-On Time
Turn-On Delay Time
Rise Time
-
-
-
-
-
-
-
50
-
ns
ns
ns
ns
ns
ns
13
20
35
14
-
-
VDD = 30V, ID = 12A
VGS = 10V, RGS = 9.1Ω
td(OFF)
tf
Turn-Off Delay Time
Fall Time
-
-
tOFF
Turn-Off Time
64
Drain-Source Diode Characteristics
ISD = 12A
-
-
-
-
-
-
-
-
1.25
1.0
39
V
V
VSD
Source to Drain Diode Voltage
ISD = 6A
trr
Reverse Recovery Time
ISD=12A, dISD/dt = 100A/µs
ISD=12A, dISD/dt = 100A/µs
ns
nC
QRR
Reverse Recovered Charge
40
Notes:
1: Starting T = 25°C, L = 1mH, I = 22A, V = 60V, V = 10V.
J
AS
DD
GS
2: R
drain pins. R
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the
θJA
is guaranteed by design while R
is determined by the user’s board design.
θJC
θJA
2
3: R
is measured with 1.0 in copper on FR-4 board.
θJA
www.fairchildsemi.com
©2005 Fairchild Semiconductor Corporation
FDS5672 Rev. A
3
Typical Characteristics TC = 25°C unless otherwise noted
1.2
1.0
0.8
0.6
0.4
0.2
0
15
12
9
V
= 10V
GS
6
3
0
0
25
50
75
100
125
150
25
50
75
100
125
150
o
o
T
, AMBIENT TEMPERATURE ( C)
T , AMBIENT TEMPERATURE ( C)
A
A
Figure 1. Normalized Power Dissipation vs
Ambient Temperature
Figure 2. Maximum Continuous Drain Current vs
Ambient Temperature
2
1
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
0.05
0.02
0.01
0.1
P
DM
SINGLE PULSE
0.01
t
1
t
2
NOTES:
DUTY FACTOR: D = t /t
1
2
PEAK T = P
x Z
x R
+ T
θJA A
J
DM
θJA
0.001
-5
-4
-3
-2
-1
0
1
2
3
10
10
10
10
10
10
10
10
10
t, RECTANGULAR PULSE DURATION (s)
Figure 3. Normalized Maximum Transient Thermal Impedance
1100
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
o
T
= 25 C
A
FOR TEMPERATURES
ABOVE 25 C DERATE PEAK
o
CURRENT AS FOLLOWS:
V
= 10V
GS
150 - T
A
I = I
25
125
100
10
3
-5
-4
-3
-2
-1
0
1
2
10
10
10
10
10
10
t, PULSE WIDTH (s)
10
10
10
Figure 4. Peak Current Capability
www.fairchildsemi.com
©2005 Fairchild Semiconductor Corporation
FDS5672 Rev. A
4
Typical Characteristics TC = 25°C unless otherwise noted
400
100
50
100µs
If R = 0
= (L)(I )/(1.3*RATED BV
t
- V
DD
)
AV
AS
DSS
If R ≠ 0
t
= (L/R)ln[(I *R)/(1.3*RATED BV
- V ) +1]
DD
AV
AS
DSS
1ms
10
10
1
o
STARTING T = 25 C
J
OPERATION IN THIS
AREA MAY BE
10ms
LIMITED BY r
DS(ON)
SINGLE PULSE
o
STARTING T = 150 C
J
T
= MAX RATED
J
o
T
= 25 C
A
1
0.1
0.1
1
10
70
0.1
1
10
100
V
, DRAIN TO SOURCE VOLTAGE (V)
t , TIME IN AVALANCHE (ms)
AV
DS
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 6. Unclamped Inductive Switching
Capability
Figure 5. Forward Bias Safe Operating Area
25
25
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
V
= 6V
GS
V
= 5V
GS
20
15
V
= 15V
20
DD
15
10
5
o
T
= 150 C
V
= 10V
J
GS
V
= 4.5V
GS
10
5
o
o
T
= -55 C
J
T
= 25 C
J
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
o
T
= 25 C
A
0
0
3.0
3.5
4.0
4.5
5.0
5.5
0
0.2
0.4
0.6
0.8
1.0
V
, GATE TO SOURCE VOLTAGE (V)
V
, DRAIN TO SOURCE VOLTAGE (V)
DS
GS
Figure 7. Transfer Characteristics
Figure 8. Saturation Characteristics
15.0
12.5
10.0
2.0
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
V
= 6V
GS
1.5
1.0
0.5
V
= 10V
GS
7.5
5.0
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
V
= 10V, I = 12A
D
GS
-80
-40
0
40
80
120
o
160
0
3
6
9
12
I , DRAIN CURRENT (A)
T , JUNCTION TEMPERATURE ( C)
J
D
Figure 9. Drain to Source On Resistance vs Drain
Current
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
www.fairchildsemi.com
©2005 Fairchild Semiconductor Corporation
FDS5672 Rev. A
5
Typical Characteristics TC = 25°C unless otherwise noted
1.2
1.1
1.0
0.9
0.8
0.7
0.6
1.10
1.05
1.00
V
= V , I = 250µA
DS D
GS
I
= 250µA
D
0.95
0.90
-80
-40
0
40
80
120
160
-80
-40
0
40
80
120
160
o
o
T , JUNCTION TEMPERATURE ( C)
T , JUNCTION TEMPERATURE ( C)
J
J
Figure 11. Normalized Gate Threshold Voltage vs
Junction Temperature
Figure 12. Normalized Drain to Source
Breakdown Voltage vs Junction Temperature
6000
10
C
= C + C
GS GD
ISS
V
= 50V
DD
8
6
4
1000
C
≅ C + C
GD
OSS
C
DS
= C
RSS
GD
100
40
2
0
WAVEFORMS IN
DESCENDING ORDER:
V
= 0V, f = 1MHz
1
I
I
= 12A
= 1A
GS
D
D
0.1
10
60
0
5
10
15
20
25
30
35
V
, DRAIN TO SOURCE VOLTAGE (V)
Q , GATE CHARGE (nC)
DS
g
Figure 13. Capacitance vs Drain to Source
Voltage
Figure 14. Gate Charge Waveforms for Constant
Gate Currents
www.fairchildsemi.com
©2005 Fairchild Semiconductor Corporation
FDS5672 Rev. A
6
Test Circuits and Waveforms
V
BV
DSS
DS
t
P
V
DS
L
I
AS
V
DD
VARY t TO OBTAIN
P
+
-
R
REQUIRED PEAK I
G
AS
V
DD
V
GS
DUT
t
P
I
0V
AS
0
0.01Ω
t
AV
Figure 15. Unclamped Energy Test Circuit
Figure 16. Unclamped Energy Waveforms
V
DS
V
Q
DD
g(TOT)
V
DS
L
V
= 10V
GS
V
GS
+
-
V
DD
V
GS
V
= 2V
DUT
GS
Q
gs2
0
I
g(REF)
Q
g(TH)
Q
Q
gd
gs
I
g(REF)
0
Figure 17. Gate Charge Test Circuit
Figure 18. Gate Charge Waveforms
V
DS
t
t
ON
OFF
t
d(OFF)
t
d(ON)
R
t
t
f
L
r
V
0
DS
90%
90%
+
-
V
GS
V
DD
10%
10%
DUT
90%
50%
R
GS
V
0
GS
50%
PULSE WIDTH
10%
V
GS
Figure 19. Switching Time Test Circuit
Figure 20. Switching Time Waveforms
www.fairchildsemi.com
©2005 Fairchild Semiconductor Corporation
FDS5672 Rev. A
7
Thermal Resistance vs. Mounting Pad Area
The maximum rated junction temperature, TJM, and the
thermal resistance of the heat dissipating path determines
the maximum allowable device power dissipation, PDM, in an
maximum transient thermal impedance curve.
Thermal resistances corresponding to other copper areas
can be obtained from Figure 21 or by calculation using
Equation 2. The area, in square inches is the top copper
area including the gate and source pads.
application.
Therefore the application’s ambient
temperature, TA (oC), and thermal resistance RθJA (oC/W)
must be reviewed to ensure that TJM is never exceeded.
Equation 1 mathematically represents the relationship and
serves as the basis for establishing the rating of the part.
26
R
= 64 + -------------------------------
(EQ. 2)
θJA
0.23 + Area
(T
– T )
A
JM
(EQ. 1)
P
= ------------------------------
DM
RθJA
The transient thermal impedance (ZθJA) is also effected by
varied top copper board area. Figure 22 shows the effect of
copper pad area on single pulse transient thermal
impedance. Each trace represents a copper pad area in
square inches corresponding to the descending list in the
graph. Spice and SABER thermal models are provided for
each of the listed pad areas.
In using surface mount devices such as the SO8 package,
the environment in which it is applied will have a significant
influence on the part’s current and maximum power
dissipation ratings. Precise determination of PDM is complex
and influenced by many factors:
Copper pad area has no perceivable effect on transient
thermal impedance for pulse widths less than 100ms. For
pulse widths less than 100ms the transient thermal
impedance is determined by the die and package.
Therefore, CTHERM1 through CTHERM5 and RTHERM1
through RTHERM5 remain constant for each of the thermal
models. A listing of the model component values is available
in Table 1.
1. Mounting pad area onto which the device is attached and
whether there is copper on one side or both sides of the
board.
2. The number of copper layers and the thickness of the
board.
3. The use of external heat sinks.
4. The use of thermal vias.
200
5. Air flow and board orientation.
R
= 64 + 26/(0.23+Area)
θJA
6. For non steady state applications, the pulse width, the
duty cycle and the transient thermal response of the part,
the board and the environment they are in.
150
Fairchild provides thermal information to assist the
designer’s preliminary application evaluation. Figure 21
defines the RθJA for the device as a function of the top
copper (component side) area. This is for a horizontally
positioned FR-4 board with 1oz copper after 1000 seconds
of steady state power with no air flow. This graph provides
the necessary information for calculation of the steady state
junction temperature or power dissipation. Pulse
applications can be evaluated using the Fairchild device
Spice thermal model or manually utilizing the normalized
100
50
0.001
0.01
0.1
1
10
2
AREA, TOP COPPER AREA (in )
Figure 21. Thermal Resistance vs Mounting
Pad Area
150
COPPER BOARD AREA - DESCENDING ORDER
2
0.04 in
2
0.28 in
0.52 in
0.76 in
1.00 in
120
90
60
30
0
2
2
2
-1
0
1
2
3
10
10
10
t, RECTANGULAR PULSE DURATION (s)
10
10
Figure 22. Thermal Impedance vs Mounting Pad Area
www.fairchildsemi.com
©2005 Fairchild Semiconductor Corporation
FDS5672 Rev. A
8
PSPICE Electrical Model
.SUBCKT FDS5672 2 1 3 ;
Ca 12 8 7e-10
rev June 2005
Cb 15 14 7e-10
Cin 6 8 2.2e-10
LDRAIN
DPLCAP
DRAIN
2
5
10
Dbody 7 5 DbodyMOD
Dbreak 5 11 DbreakMOD
Dplcap 10 5 DplcapMOD
RLDRAIN
RSLC1
51
DBREAK
+
RSLC2
5
ESLC
11
51
Ebreak 11 7 17 18 67
Eds 14 8 5 8 1
Egs 13 8 6 8 1
Esg 6 10 6 8 1
Evthres 6 21 19 8 1
Evtemp 20 6 18 22 1
-
+
50
-
17
DBODY
RDRAIN
6
8
EBREAK 18
-
ESG
EVTHRES
+
16
21
+
-
19
8
MWEAK
LGATE
EVTEMP
RGATE
GATE
1
6
+
-
18
22
It 8 17 1
MMED
9
20
MSTRO
8
RLGATE
Lgate 1 9 1.23e-9
Ldrain 2 5 1.0e-9
Lsource 3 7 0.18e-9
LSOURCE
CIN
SOURCE
3
7
RSOURCE
RLSOURCE
RLgate 1 9 12.3
RLdrain 2 5 10
RLsource 3 7 1.8
S1A
S2A
RBREAK
12
15
13
8
14
13
17
18
RVTEMP
19
S1B
S2B
Mmed 16 6 8 8 MmedMOD
Mstro 16 6 8 8 MstroMOD
Mweak 16 21 8 8 MweakMOD
13
CB
CA
IT
14
-
+
+
VBAT
6
8
5
8
EGS
EDS
+
Rbreak 17 18 RbreakMOD 1
Rdrain 50 16 RdrainMOD 1e-3
Rgate 9 20 1.4
-
-
8
22
RVTHRES
RSLC1 5 51 RSLCMOD 1.0e-6
RSLC2 5 50 1.0e3
Rsource 8 7 RsourceMOD 3.2e-3
Rvthres 22 8 RvthresMOD 1
Rvtemp 18 19 RvtempMOD 1
S1a 6 12 13 8 S1AMOD
S1b 13 12 13 8 S1BMOD
S2a 6 15 14 13 S2AMOD
S2b 13 15 14 13 S2BMOD
Vbat 22 19 DC 1
ESLC 51 50 VALUE={(V(5,51)/ABS(V(5,51)))*(PWR(V(5,51)/(1e-6*250),2.5))}
.MODEL DbodyMOD D (IS=4.5E-12 RS=4.7e-3 TRS1=1.5e-3 TRS2=2e-5
+ CJO=1.6e-9 M=0.55 TT=1.8e-8 XTI=3.0)
.MODEL DbreakMOD D (RS=2.5 TRS1=1.0e-3 TRS2=1e-6)
.MODEL DplcapMOD D (CJO=6.0e-10 IS=1.0e-30 N=10 M=0.45)
.MODEL MmedMOD NMOS (VTO=3.35 KP=4 IS=1e-30 N=10 TOX=1 L=1u W=1u RG=1.4)
.MODEL MstroMOD NMOS (VTO=3.93 KP=50 IS=1e-30 N=10 TOX=1 L=1u W=1u)
.MODEL MweakMOD NMOS (VTO=2.82 KP=0.04 IS=1e-30 N=10 TOX=1 L=1u W=1u RG=14 RS=0.1)
.MODEL RbreakMOD RES (TC1=7e-4 TC2=-1.3e-7)
.MODEL RdrainMOD RES (TC1=1.0e-4 TC2=1e-5)
.MODEL RSLCMOD RES (TC1=1.0e-2 TC2=1e-7)
.MODEL RsourceMOD RES (TC1=1.0e-2 TC2=1.0e-6)
.MODEL RvthresMOD RES (TC1=-3.9e-3 TC2=-1.4e-5)
.MODEL RvtempMOD RES (TC1=-4e-3 TC2=2e-7)
.MODEL S1AMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-4.0 VOFF=-2.0)
.MODEL S1BMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-2.0 VOFF=-4.0)
.MODEL S2AMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-0.5 VOFF=0)
.MODEL S2BMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=0 VOFF=-0.5)
.ENDS
Note: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global
Temperature Options; IEEE Power Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank
Wheatley.
www.fairchildsemi.com
©2005 Fairchild Semiconductor Corporation
FDS5672 Rev. A
9
SABER Electrical Model
REV June 2005
ttemplate FDS5672 n2,n1,n3
electrical n2,n1,n3
{
var i iscl
dp..model dbodymod = (isl=4.5e-12,rs=4.7e-3,trs1=1.5e-3,trs2=2e-5,cjo=1.6e-9,m=0.55,tt=1.8e-8,xti=3.0)
dp..model dbreakmod = (rs=2.5,trs1=1e-4,trs2=1e-6)
dp..model dplcapmod = (cjo=6.0e-10,isl=10.0e-30,nl=10,m=0.45)
m..model mmedmod = (type=_n,vto=3.35,kp=4,is=1e-30, tox=1)
m..model mstrongmod = (type=_n,vto=3.93,kp=50,is=1e-30, tox=1)
m..model mweakmod = (type=_n,vto=2.82,kp=0.04,is=1e-30, tox=1,rs=0.1)
sw_vcsp..model s1amod = (ron=1e-5,roff=0.1,von=-4.0,voff=-2.0)
sw_vcsp..model s1bmod = (ron=1e-5,roff=0.1,von=-2.0,voff=-4.0)
LDRAIN
DPLCAP
5
DRAIN
2
sw_vcsp..model s2amod = (ron=1e-5,roff=0.1,von=-0.5,voff=0)
sw_vcsp..model s2bmod = (ron=1e-5,roff=0.1,von=0,voff=-0.5)
10
RLDRAIN
c.ca n12 n8 = 7e-10
c.cb n15 n14 = 7e-10
c.cin n6 n8 = 2.2e-9
RSLC1
51
RSLC2
ISCL
dp.dbody n7 n5 = model=dbodymod
dp.dbreak n5 n11 = model=dbreakmod
dp.dplcap n10 n5 = model=dplcapmod
DBREAK
11
50
-
RDRAIN
6
8
ESG
DBODY
EVTHRES
+
16
21
+
spe.ebreak n11 n7 n17 n18 = 67
-
19
8
MWEAK
LGATE
EVTEMP
spe.eds n14 n8 n5 n8 = 1
spe.egs n13 n8 n6 n8 = 1
RGATE
GATE
1
6
+
-
18
22
EBREAK
+
MMED
9
20
spe.esg n6 n10 n6 n8 = 1
spe.evthres n6 n21 n19 n8 = 1
spe.evtemp n20 n6 n18 n22 = 1
MSTRO
8
17
18
-
RLGATE
LSOURCE
CIN
SOURCE
3
7
i.it n8 n17 = 1
RSOURCE
RLSOURCE
S1A
S2A
l.lgate n1 n9 = 1.23e-9
l.ldrain n2 n5 = 1.0e-9
l.lsource n3 n7 = 0.18e-9
RBREAK
12
15
13
8
14
13
17
18
RVTEMP
19
S1B
S2B
13
CB
res.rlgate n1 n9 = 12.3
res.rldrain n2 n5 = 10
res.rlsource n3 n7 = 1.8
CA
IT
14
-
+
+
VBAT
6
8
5
8
EGS
EDS
+
-
-
8
m.mmed n16 n6 n8 n8 = model=mmedmod, l=1u, w=1u
22
m.mstrong n16 n6 n8 n8 = model=mstrongmod, l=1u, w=1u
m.mweak n16 n21 n8 n8 = model=mweakmod, l=1u, w=1u
RVTHRES
res.rbreak n17 n18 = 1, tc1=7e-4,tc2=-1.3e-7
res.rdrain n50 n16 = 1e-3, tc1=1e-4,tc2=1e-5
res.rgate n9 n20 = 1.4
res.rslc1 n5 n51 = 1e-6, tc1=1e-2,tc2=1e-7
res.rslc2 n5 n50 = 1e3
res.rsource n8 n7 = 3.2e-3, tc1=1e-2,tc2=1e-6
res.rvthres n22 n8 = 1, tc1=-3.9e-3,tc2=-1.4e-5
res.rvtemp n18 n19 = 1, tc1=-4e-3,tc2=2e-7
sw_vcsp.s1a n6 n12 n13 n8 = model=s1amod
sw_vcsp.s1b n13 n12 n13 n8 = model=s1bmod
sw_vcsp.s2a n6 n15 n14 n13 = model=s2amod
sw_vcsp.s2b n13 n15 n14 n13 = model=s2bmod
v.vbat n22 n19 = dc=1
equations {
i (n51->n50) +=iscl
iscl: v(n51,n50) = ((v(n5,n51)/(1e-9+abs(v(n5,n51))))*((abs(v(n5,n51)*1e6/250))** 2.5))
}
}
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©2005 Fairchild Semiconductor Corporation
FDS5672 Rev. A
10
SPICE Thermal Model
REV June 2005
JUNCTION
th
FDS5672_JA Junction Ambient
Copper Area = 1sq.in
CTHERM1 TH 8 2e-3
CTHERM2 8 7 5e-3
CTHERM3 7 6 1e-2
CTHERM4 6 5 4e-2
CTHERM5 5 4 9e-2
CTHERM6 4 3 2e-1
CTHERM7 3 2 1
RTHERM1
RTHERM2
RTHERM3
RTHERM4
RTHERM5
RTHERM6
RTHERM7
RTHERM8
CTHERM1
8
7
CTHERM2
CTHERM3
CTHERM4
CTHERM5
CTHERM6
CTHERM7
CTHERM8
CTHERM8 2 TL 3
RTHERM1 TH 8 1e-1
RTHERM2 8 7 5e-1
RTHERM3 7 6 1
RTHERM4 6 5 5
RTHERM5 5 4 8
RTHERM6 4 3 12
RTHERM7 3 2 18
RTHERM8 2 TL 25
6
5
SABER Thermal Model
SABER thermal model FDS5672
Copper Area = 1sq.in
template thermal_model th tl
thermal_c th, tl
{
ctherm.ctherm1 th 8 =2e-3
ctherm.ctherm2 8 7 =5e-3
ctherm.ctherm3 7 6 =1e-2
ctherm.ctherm4 6 5 =4e-2
ctherm.ctherm5 5 4 =9e-2
ctherm.ctherm6 4 3 =2e-1
ctherm.ctherm7 3 2 =1
ctherm.ctherm8 2 tl =3
4
3
2
rrtherm.rtherm1 th 8 =1e-1
rtherm.rtherm2 8 7 =5e-1
rtherm.rtherm3 7 6 =1
rtherm.rtherm4 6 5 =5
rtherm.rtherm5 5 4 =8
rtherm.rtherm6 4 3 =12
rtherm.rtherm7 3 2 =18
rtherm.rtherm8 2 tl =25
}
tl
AMBIENT
T ABLE 1. THERMAL MODELS
COMPONANT
CTHERM6
CTHERM7
CTHERM8
RTHERM6
RTHERM7
RTHERM8
0.04 in2
1.2e-1
0.5
0.28 in2
1.5e-1
1.0
0.52 in2
2.0e-1
1.0
0.76 in2
2.0e-1
1.0
1.0 in2
2.0e-1
1.0
1.3
2.8
3.0
3.0
3.0
26
20
15
13
12
39
24
21
19
18
55
38.7
31.3
29.7
25
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©2005 Fairchild Semiconductor Corporation
FDS5672 Rev. A
11
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