FDP6030BL [ONSEMI]

N 沟道逻辑电平 PowerTrench® MOSFET 30V,40A,18mΩ;
FDP6030BL
型号: FDP6030BL
厂家: ONSEMI    ONSEMI
描述:

N 沟道逻辑电平 PowerTrench® MOSFET 30V,40A,18mΩ

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FDP6030BL/FDB6030BL  
N-Channel Logic Level PowerTrench MOSFET  
Features  
• 40 A, 30 V. RDS(ON) = 0.018 @ VGS = 10 V  
RDS(ON) = 0.024 @ VGS = 4.5 V.  
General Description  
• Critical DC electrical parameters specified at elevated  
temperature.  
This N-Channel Logic Level MOSFET has been designed  
specifically to improve the overall efficiency of DC/DC  
converters using either synchronous or conventional  
switching PWM controllers.  
• Rugged internal source-drain diode can eliminate the  
need for an external Zener diode transient suppressor.  
These MOSFETs feature faster switching and lower gate  
charge than other MOSFETs with comparable RDS(on)  
specifications resulting in DC/DC power supply designs  
with higher overall efficiency.  
• High performance trench technology for  
extremely low RDS(ON)  
.
• 175°C maximum junction temperature rating.  
D
D
G
G
G
TO-220  
D
FDP Series  
S
S
TO-263AB  
FDB Series  
S
TC = 25°C unless otherwise noted  
Absolute Maximum Ratings  
FDP6030BL FDB6030BL  
Symbol  
Parameter  
Units  
VDSS  
VGSS  
ID  
Drain-Source Voltage  
Gate-Source Voltage  
30  
V
V
A
±
20  
(Note 1)  
Maximum Drain Current - Continuous  
- Pulsed  
40  
120  
°
PD  
60  
W
Total Power Dissipation @ TC = 25 C  
°
°
0.36  
Derate above 25 C  
W/ C  
°
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-65 to +175  
C
Thermal Characteristics  
°
θ
Thermal Resistance, Junction-to-Case  
2.5  
R
C/W  
JC  
°
θ
Thermal Resistance, Junction-to-Ambient  
62.5  
R
C/W  
JA  
Package Marking and Ordering Information  
Device Marking  
FDB6030BL  
Device  
Reel Size  
13’’  
Tape Width  
24mm  
Quantity  
800  
FDB6030BL  
FDP6030BL  
FDP6030BL  
Tube  
N/A  
45  
2000 Semiconductor Components Industries, LLC.  
November-2017, Rev. 3  
Publication Order Number:  
FDB6030BL/D  
TC = 25°C unless otherwise noted  
Test Conditions  
(Note 1)  
Electrical Characteristics  
Symbol  
Parameter  
Min Typ  
Max Units  
DRAIN-SOURCE AVALANCHE RATINGS  
WDSS  
Single Pulse Drain-Source  
Avalanche Energy  
VDD = 15 V, ID = 40 A  
150  
40  
mJ  
A
IAR  
Maximum Drain-Source Avalnche Current  
Off Characteristics  
µ
A
BVDSS  
Drain-Source Breakdown Voltage  
30  
V
VGS = 0 V, ID = 250  
µ
°
°
Breakdown Voltage Temperature  
Coefficient  
23  
DSS  
BV  
ID = 250 A, Referenced to 25 C  
mV/ C  
TJ  
µ
A
IDSS  
Zero Gate Voltage Drain Current VDS = 24 V, VGS = 0 V  
1
IGSSF  
Gate-Body Leakage Current,  
Forward  
VGS = 20 V, VDS = 0 V  
100  
nA  
IGSSR  
Gate-Body Leakage Current,  
Reverse  
VGS = -20 V, VDS = 0 V  
-100  
3
nA  
(Note 1)  
On Characteristics  
VGS(th)  
µ
A
Gate Threshold Voltage  
1
1.6  
V
VDS = VGS, ID = 250  
µ
°
°
Gate Threshold Voltage  
Temperature Coefficient  
-4.5  
GS(th)  
V
ID = 250 A, Referenced to 25 C  
mV/ C  
TJ  
RDS(on)  
Static Drain-Source  
On-Resistance  
VGS = 10 V, ID = 20 A,  
0.015  
0.021  
0.019  
0.018  
0.030  
0.024  
°
VGS = 10 V, ID = 20 A, TJ = 125 C  
VGS = 4.5 V,ID = 17 A  
ID(on)  
gFS  
On-State Drain Current  
VGS = 10 V, VDS = 10 V  
40  
A
S
Forward Transconductance  
VDS = 5 V, ID = 20 A  
30  
Dynamic Characteristics  
Ciss  
Coss  
Crss  
Input Capacitance  
V
DS = 15 V, VGS = 0 V,  
1160  
250  
pF  
pF  
pF  
f = 1.0 MHz  
Output Capacitance  
Reverse Transfer Capacitance  
100  
(Note 1)  
Switching Characteristics  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
VDD = 15 V, ID = 1 A,  
9
17  
20  
37  
16  
17  
ns  
ns  
VGS = 10 V, RGEN = 6  
11  
23  
8
ns  
ns  
Qg  
Qgs  
Qgd  
VDS = 15 V,  
12  
3.2  
3.7  
nC  
nC  
nC  
ID = 20 A, VGS = 5 V  
Drain-Source Diode Characteristics and Maximum Ratings  
(Note 1)  
IS  
Maximum Continuous Drain-Source Diode Forward Current  
40  
A
V
(Note 1)  
VSD  
Drain-Source Diode Forward  
Voltage  
VGS = 0 V, IS = 20 A  
0.95  
1.2  
Note:  
1. Pulse Test: Pulse Width 300 µs, Duty Cycle 2.0%  
www.onsemi.com  
2
Typical Characteristics  
2.6  
2.4  
2.2  
2
80  
VGS = 10V  
6.0V  
70  
5.0V  
60  
50  
40  
30  
20  
10  
0
4.5V  
VGS = 3.0V  
4.0V  
1.8  
1.6  
1.4  
1.2  
1
3.5V  
3.5V  
4.0V  
4.5V  
5.0V  
3.0V  
4
7.0V  
10V  
0.8  
0
10  
20  
30  
40  
50  
0
1
2
3
5
ID, DRAIN CURRENT (A)  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. On-Region Characteristics.  
Figure 2. On-Resistance Variation  
with Drain Current and Gate Voltage.  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
1.8  
ID = 10 A  
ID = 20A  
1.6  
1.4  
1.2  
1
VGS = 10V  
TA = 125oC  
TA = 25oC  
0.8  
0.6  
VGS = 0V  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
2
4
6
8
10  
TJ, JUNCTION TEMPERATURE (oC)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 3. On-Resistance Variation  
with Temperature.  
Figure 4. On-Resistance Variation  
with Gate-to-Source Voltage.  
100  
10  
50  
40  
30  
20  
10  
0
TA = -55oC  
VGS = 0V  
VDS = 5V  
25oC  
TA = 125oC  
125oC  
1
25oC  
-55oC  
0.1  
0.01  
0.001  
0.0001  
1
2
3
4
5
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
VGS, GATE TO SOURCE VOLTAGE (V)  
V
SD, BODY DIODE FORWARD VOLTAGE (V)  
Figure 6. Body Diode Forward Voltage  
Variation with Source Current  
and Temperature.  
Figure 5. Transfer Characteristics.  
www.onsemi.com  
3
Typical Characteristics (continued)  
1600  
1400  
1200  
1000  
800  
600  
400  
200  
0
10  
f = 1 MHz  
GS = 0 V  
ID = 20A  
VDS = 5V  
10V  
V
8
6
4
2
0
15V  
CISS  
COSS  
CRSS  
0
5
10  
15  
20  
25  
30  
0
5
10  
15  
20  
25  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Qg, GATE CHARGE (nC)  
Figure 7. Gate-Charge Characteristics.  
Figure 8. Capacitance Characteristics.  
2500  
1000  
100  
10  
VGS = 10V  
SINGLE PULSE  
RθJC = 2.5oC/W  
TC = 25oC  
SINGLE PULSE  
2000  
1500  
1000  
500  
0
Rθ  
=2.5°C/W  
TC = 25°C  
JC  
10 s  
µ
s
100  
µ
1ms  
RDS(ON) LIMIT  
10ms  
100ms  
DC  
1
0.01  
0.1  
1
10  
100  
1,000  
0.1  
1
10  
100  
SINGLE PULSE TIME (mSEC)  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 9. Maximum Safe Operating Area.  
Figure 10. Single Pulse Maximum  
Power Dissipation.  
1
D = 0.5  
0.5  
0.3  
0.2  
0.2  
R
(t) = r(t) * R  
JC  
θ
JC  
θ
R
= 2.5 °C/W  
JC  
θ
0.1  
0.1  
P(pk)  
0.05  
0.05  
0.02  
0.01  
t
1
t
2
0.03  
0.02  
T - T = P * R JC (t)  
θ
Single Pulse  
J
C
Duty Cycle, D = t /t  
1
2
0.01  
0.01  
0.1  
1
10  
100  
1000  
t
,TIME (ms)  
1
Figure 11. Transient Thermal Response Curve.  
www.onsemi.com  
4
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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