FDMS7694 [ONSEMI]

N 沟道,PowerTrench® MOSFET,30V,9.5mΩ;
FDMS7694
型号: FDMS7694
厂家: ONSEMI    ONSEMI
描述:

N 沟道,PowerTrench® MOSFET,30V,9.5mΩ

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FDMS7694  
N-Channel PowerTrench® MOSFET  
General Description  
30 V, 9.5 mΩ  
This N-Channel MOSFET has been designed specifically to  
improve the overall efficiency and to minimize switch node  
ringing of DC/DC converters using either synchronous or  
conventional switching PWM controllers.It has been optimized  
for low gate charge, low rDS(on), fast switching speed ang body  
diode reverse recovery performance.  
Features  
„ Max rDS(on) = 9.5 mΩ at VGS = 10 V, ID = 13.2 A  
„ Max rDS(on) = 14.5 mΩ at VGS = 4.5 V, ID = 10.5 A  
„ Advanced Package and Silicon combination for low rDS(on)  
and high efficiency  
Applications  
„ Next generation enhanced body diode technology,  
„ IMVP Vcore Switching for Notebook  
„ VRM Vcore Switching for Desktop and server  
„ OringFET / Load Switching  
engineered for soft recovery  
„ MSL1 robust package design  
„ 100% UIL tested  
„ DC-DC Conversion  
„ RoHS Compliant  
Bottom  
Top  
Pin 1  
S
G
S
S
S
D
D
D
D
5
6
7
8
4
3
S
S
G
2
1
D
D
D
D
Power 56  
MOSFET Maximum Ratings TA = 25 °C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
30  
V
V
(Note 4)  
±20  
Drain Current -Continuous (Package limited)  
-Continuous (Silicon limited)  
-Continuous  
TC = 25 °C  
TC = 25 °C  
TA = 25 °C  
20  
44  
ID  
A
(Note 1a)  
(Note 3)  
(Note 1a)  
13.2  
-Pulsed  
50  
EAS  
Single Pulse Avalanche Energy  
Power Dissipation  
21  
27  
mJ  
W
TC = 25 °C  
TA = 25 °C  
PD  
Power Dissipation  
2.5  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +150  
°C  
Thermal Characteristics  
RθJC  
RθJA  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
4.5  
50  
°C/W  
(Note 1a)  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
13 ’’  
Tape Width  
12 mm  
Quantity  
FDMS7694  
FDMS7694  
Power 56  
3000 units  
©2011 Semiconductor Components Industries, LLC.  
October-2017, Rev.3  
Publication Order Number:  
FDMS7694/D  
1
Electrical Characteristics TJ = 25 °C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Off Characteristics  
BVDSS  
Drain to Source Breakdown Voltage  
ID = 250 μA, VGS = 0 V  
30  
V
ΔBVDSS  
ΔTJ  
Breakdown Voltage Temperature  
Coefficient  
I
D = 250 μA, referenced to 25 °C  
16  
mV/°C  
IDSS  
IGSS  
Zero Gate Voltage Drain Current  
VDS = 24 V, VGS = 0 V  
1
μA  
Gate to Source Leakage Current, Forward VGS = 20 V, VDS = 0 V  
100  
nA  
On Characteristics  
VGS(th)  
Gate to Source Threshold Voltage  
VGS = VDS, ID = 250 μA  
D = 250 μA, referenced to 25 °C  
GS = 10 V, ID = 13.2 A  
1.0  
2.0  
-6  
3.0  
V
ΔVGS(th)  
ΔTJ  
Gate to Source Threshold Voltage  
Temperature Coefficient  
I
mV/°C  
V
7.6  
11.1  
10.6  
55  
9.5  
rDS(on)  
gFS  
Static Drain to Source On Resistance  
Forward Transconductance  
VGS = 4.5 V, ID = 10.5 A  
14.5  
13.3  
mΩ  
VGS = 10 V, ID = 13.2 A, TJ = 125 °C  
VDS = 5 V, ID = 13.2 A  
S
Dynamic Characteristics  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
1060  
353  
36  
1410  
470  
55  
pF  
pF  
pF  
Ω
VDS = 15 V, VGS = 0 V,  
f = 1 MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
0.8  
1.6  
Switching Characteristics  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Rise Time  
8.4  
2
17  
10  
33  
10  
22  
10  
ns  
ns  
VDD = 15 V, ID = 13.2 A,  
VGS = 10 V, RGEN = 6 Ω  
Turn-Off Delay Time  
Fall Time  
18  
1.6  
15  
7
ns  
ns  
Qg  
Total Gate Charge  
Total Gate Charge  
Gate to Source Charge  
Gate to Drain “Miller” Charge  
VGS = 0 V to 10 V  
nC  
nC  
nC  
nC  
Qg  
VGS = 0 V to 4.5 V  
VDD = 15 V,  
ID = 13.2 A  
Qgs  
Qgd  
3.3  
2.0  
Drain-Source Diode Characteristics  
V
GS = 0 V, IS = 2.1 A  
(Note 2)  
(Note 2)  
0.76  
0.85  
23  
1.1  
1.2  
37  
14  
33  
26  
VSD  
Source to Drain Diode Forward Voltage  
V
VGS = 0 V, IS = 13.2 A  
trr  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Time  
Reverse Recovery Charge  
ns  
nC  
ns  
IF = 13.2 A, di/dt = 100 A/μs  
IF = 13.2 A, di/dt = 300 A/μs  
Qrr  
trr  
7
18  
Qrr  
14  
nC  
Notes:  
2
1. R  
is determined with the device mounted on a 1 in pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R  
is guaranteed by design while R is determined by  
θCA  
θJA  
θJC  
the user's board design.  
a)  
50 °C/W when mounted on a  
1 in pad of 2 oz copper  
b) 125 °C/W when mounted on a  
minimum pad of 2 oz copper.  
2
2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%.  
3. E of 21 mJ is based on starting T = 25 °C, L = 0.3 mH, I = 12 A, V = 27 V, V = 10 V. 100% test at L = 0.1 mH, I = 20 A.  
AS  
J
AS  
DD  
GS  
AS  
4. As an N-ch device, the negative Vgs rating is for low duty cycle pulse occurrence only. No continuous rating is implied.  
www.onsemi.com  
2
Typical Characteristics TJ = 25 °C unless otherwise noted  
50  
5
4
3
2
1
0
VGS = 4.5 V  
VGS = 3.5 V  
VGS = 4 V  
40  
VGS = 4 V  
30  
VGS = 5 V  
VGS = 10 V  
VGS = 3.5 V  
VGS = 4.5 V  
20  
10  
0
VGS = 5 V  
VGS = 10 V  
PULSE DURATION = 80 μs  
DUTY CYCLE = 0.5% MAX  
PULSE DURATION = 80 μs  
DUTY CYCLE = 0.5% MAX  
0
1
2
3
4
5
0
10  
20  
30  
40  
50  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
ID, DRAIN CURRENT (A)  
Figure 1. On Region Characteristics  
Figure2. N o r m a l i z e d O n - R e s i s ta n c e  
vs Drain Current and Gate Voltage  
30  
1.6  
PULSE DURATION = 80 μs  
DUTY CYCLE = 0.5% MAX  
ID = 13.2 A  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
VGS = 10 V  
25  
20  
15  
10  
5
ID = 13.2 A  
TJ = 125 oC  
TJ = 25 o  
C
2
4
6
8
10  
-75 -50 -25  
0
25 50 75 100 125 150  
TJ, JUNCTION TEMPERATURE (oC)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 3. Normalized On Resistance  
vs Junction Temperature  
Figure4. On-Resistance vs Gate to  
Source Voltage  
50  
100  
VGS = 0 V  
PULSE DURATION = 80 μs  
DUTY CYCLE = 0.5% MAX  
40  
30  
20  
10  
0
10  
1
VDS = 5 V  
TJ = 150 o  
C
TJ = 150 o  
C
TJ = 25 oC  
TJ = 25 o  
C
0.1  
TJ = -55 o  
C
TJ = -55 o  
C
0.01  
1
2
3
4
5
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
VGS, GATE TO SOURCE VOLTAGE (V)  
VSD, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure6. Source to Drain Diode  
Forward Voltage vs Source Current  
www.onsemi.com  
3
Typical Characteristics TJ = 25 °C unless otherwise noted  
10  
2000  
1000  
ID = 13.2 A  
VDD = 15 V  
Ciss  
8
6
4
2
0
VDD = 20 V  
VDD = 10 V  
Coss  
100  
f = 1 MHz  
= 0 V  
V
GS  
Crss  
10  
0.1  
0
4
8
Q , GATE CHARGE (nC)  
12  
16  
1
10  
30  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
g
Figure 7. Gate Charge Characteristics  
Figure8. C a p a c i t a n c e v s D r a i n  
to Source Voltage  
20  
50  
40  
30  
20  
10  
0
VGS = 10 V  
10  
TJ = 25 o  
C
TJ = 100 o  
C
VGS = 4.5 V  
TJ = 125 o  
C
Limited by Package  
RθJC = 4.5oC/W  
1
0.01  
0.1  
1
10  
100  
25  
50  
75  
100  
125  
150  
TC, CASE TEMPERATURE (oC)  
tAV, TIME IN AVALANCHE (ms)  
Figure9. U n c l a m p e d I n d u c t i v e  
Switching Capability  
Figure10. Maximum Continuous Drain  
Current vs Case Temperature  
100  
10  
500  
VGS = 10 V  
SINGLE PULSE  
θJA = 125 oC/W  
A = 25 oC  
R
100  
10  
100us  
T
1ms  
10 ms  
100 ms  
1 s  
1
THIS AREA IS  
LIMITED BY r  
DS(on)  
SINGLE PULSE  
TJ = MAX RATED  
0.1  
10 s  
DC  
R
θJA = 125 oC/W  
A = 25 oC  
1
T
0.01  
0.5  
10-4  
10-3  
10-2  
t, PULSE WIDTH (sec)  
10-1  
1
10  
0.01  
0.1  
1
10  
100200  
100 1000  
VDS, DRAIN to SOURCE VOLTAGE (V)  
Figure 11. Forward Bias Safe  
Operating Area  
Figure12. Single Pulse Maximum  
Power Dissipation  
www.onsemi.com  
4
Typical Characteristics TJ = 25 °C unless otherwise noted  
2
1
0.1  
DUTY CYCLE-DESCENDING ORDER  
D = 0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
P
DM  
t
1
t
2
0.01  
0.001  
NOTES:  
DUTY FACTOR: D = t /t  
SINGLE PULSE  
θJA = 125 oC/W  
1
2
R
PEAK T = P  
J
x Z  
x R  
+ T  
DM  
θJA  
θJA A  
10-4  
10-3  
10-2  
10-1  
t, RECTANGULAR PULSE DURATION (sec)  
1
10  
100  
1000  
Figure 13. Junction-to-Ambient Transient Thermal Response Curve  
www.onsemi.com  
5
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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