FDMA520PZ [ONSEMI]
P 沟道，PowerTrench® MOSFET，-20V，-7.3A，30mΩ;
| 型号： | FDMA520PZ |
| 厂家： | 
ONSEMI |
| 描述： | P 沟道，PowerTrench® MOSFET，-20V，-7.3A，30mΩ 脉冲 光电二极管 晶体管 |
| 文件： | 总8页 (文件大小：399K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Is Now Part of
To learn more about ON Semiconductor, please visit our website at
www.onsemi.com
Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers
will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor
product management systems do not have the ability to manage part nomenclature that utilizes an underscore
(_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain
device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated
device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please
email any questions regarding the system integration to Fairchild_questions@onsemi.com.
ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number
of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right
to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON
Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON
Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA
Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended
or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out
of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor
is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
June 2014
FDMA520PZ
Single P-Channel PowerTrench® MOSFETꢀ
–20V, –7.3A, 30m:
Features
General Description
Max rDS(on) = 30m: at VGS = –4.5V, ID = –7.3A
Max rDS(on) = 53m: at VGS = –2.5V, ID = –5.5A
This device is designed specifically for battery charge or load
switching in cellular handset and other ultraportable applications.
It features a MOSFET with low on-state resistance.
Low profile - 0.8mm maximum - in the new package MicroFET
2X2 mm
The MicroFET 2X2 package offers exceptional thermal
performance for its physical size and is well suited to linear mode
applications.
HBM ESD protection level > 3kV typical (Note 3)
Free from halogenated compounds and antimony oxides
RoHS Compliant
Pin 1
G
D
D
Bottom Drain Contact
1
D
D
G
6
5
4
D
D
S
Drain
Source
2
3
D
D
S
MicroFET 2X2 (Bottom View)
MOSFET Maximum Ratings TA = 25°C unless otherwise noted
Symbol
VDS
VGS
Parameter
Ratings
–20
Units
Drain to Source Voltage
Gate to Source Voltage
Drain Current -Continuous
-Pulsed
V
V
12
(Note 1a)
–7.3
ID
A
–24
Power Dissipation
(Note 1a)
(Note 1b)
2.4
PD
W
Power Dissipation
0.9
TJ, TSTG
Operating and Storage Junction Temperature Range
–55 to +150
°C
Thermal Characteristics
RTJA
RTJA
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
(Note 1a)
(Note 1b)
52
°C/W
145
Package Marking and Ordering Information
Device Marking
Device
Package
Reel Size
Tape Width
8mm
Quantity
520
FDMA520PZ
MicroFET 2X2
7’’
3000 units
1
©2009 Fairchild Semiconductor Corporation
FDMA520PZ Rev.B3
www.fairchildsemi.com
Electrical Characteristics TJ = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
ID = –250PA, VGS = 0V
–20
V
'BVDSS
ꢀꢀꢀ'TJ
Breakdown Voltage Temperature
Coefficient
I
D = –250PA, referenced to 25°C
VDS = –16V, VGS = 0V
VGS 12V, VDS = 0V
–8.4
mV/°C
IDSS
IGSS
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
–1
10
PA
PA
=
On Characteristics
VGS(th)
Gate to Source Threshold Voltage
VGS = VDS, ID = –250PA
–0.6
–1.1
3.5
–1.5
V
ꢀ'VGS(th)
ꢀꢀꢀ'TJ
Gate to Source Threshold Voltage
Temperature Coefficient
ID = –250PA, referenced to 25°C
mV/°C
V
GS = –4.5V, ID = –7.3A
26
42
36
22
30
53
55
rDS(on)
Static Drain to Source On Resistance
Forward Transconductance
VGS = –2.5V, ID = –5.5A
m:
VGS = –4.5V, ID = –7.3A ,TJ = 125°C
VDS = –5V, ID = –7.3A
gFS
S
Dynamic Characteristics
Ciss
Coss
Crss
Input Capacitance
1235
255
1645
340
pF
pF
pF
VDS = –10V, VGS = 0V,
f = 1MHz
Output Capacitance
Reverse Transfer Capacitance
225
340
Switching Characteristics
td(on)
tr
td(off)
tf
Turn-On Delay Time
Rise Time
10
29
83
74
14
2.9
4.4
20
47
ns
ns
VDD = –10V, ID = –7.3A
VGS = –4.5V, RGEN = 6:
Turn-Off Delay Time
Fall Time
133
119
20
ns
ns
Qg
Total Gate Charge
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
nC
nC
nC
VDD = –5V, ID = –7.3A
VGS = –4.5V
Qgs
Qgd
Drain-Source Diode Characteristics
IS
Maximum Continuous Drain-Source Diode Forward Current
Source to Drain Diode Forward Voltage VGS = 0V, IS = –2A
Reverse Recovery Time
–2
–1.2
45
A
V
VSD
trr
–0.8
30
ns
nC
IF =–7.3A, di/dt = 100A/Ps
Qrr
Reverse Recovery Charge
22
33
Notes:
1: R
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.
TJA
b.145°C/W when mounted on
minimum pad of 2 oz copper
a
a. 52°C/W when mounted on
2
a 1 in pad of 2 oz copper
2: Pulse Test: Pulse Width < 300Ps, Duty cycle < 2.0%.
3: The diode connected between the gate and the source serves only as protection against ESD. No gate overvoltage rating is implied.
www.fairchildsemi.com
2
FDMA520PZ Rev.B3
Typical Characteristics TJ = 25°C unless otherwise noted
24
3.0
2.5
2.0
1.5
1.0
0.5
PULSE DURATION = 80Ps
DUTY CYCLE = 0.5%MAX
PULSE DURATION = 80Ps
DUTY CYCLE = 0.5%MAX
V
V
= -4.5V
= -4V
GS
GS
GS
V
= -3.5V
18
12
6
VGS = -2.5V
V
= -2.5V
GS
V
= -3V
GS
VGS = -3V
VGS = -3.5V
VGS = -4.5V
VGS = -4V
0
0
1
2
3
4
0
6
12
18
24
-I , DRAIN CURRENT(A)
D
-V , DRAIN TO SOURCE VOLTAGE (V)
DS
Figure 1. On-Region Characteristics
Figure2. N o r m a l i z e d O n - R e s i s ta n c e
vs Drain Current and Gate Voltage
1.6
60
ID = -7.3A
PULSE DURATION = 80Ps
DUTY CYCLE = 0.5%MAX
VGS = -4.5V
1.4
1.2
1.0
0.8
0.6
50
40
30
20
10
T = 125oC
J
T
J
= 25oC
I
D
= -3.6A
3
-50 -25
0
25
50
75
100 125 150
2
4
5
6
7
8
TJ, JUNCTION TEMPERATURE (oC)
-VGS, GATE TO SOURCE VOLTAGE (V)
F i gu re 3 . N orma li zed On - Res is ta nc e
vs Junction Temperature
Figure4. On-Resistance vs Gate to
Source Voltage
30
10
24
PULSE DURATION = 80Ps
DUTY CYCLE = 0.5%MAX
V
GS
= 0V
T = 125oC
J
18
1
0.1
V
DD
= -5V
12
6
T
= 25oC
J
0.01
= 25oC
T
= 125oC
J
T
J
J
T
= -55oC
J
0.001
0.0001
T
=-55oC
3
0
0
1
2
4
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
-V , BODY DIODE FORWARD VOLTAGE (V)
SD
-VGS, GATE TO SOURCE VOLTAGE (V)
Figure 5. Transfer Characteristics
Figure6. Source to Drain Diode
Forward Voltage vs Source Current
www.fairchildsemi.com
3
FDMA520PZ Rev.B3
Typical Characteristics TJ = 25°C unless otherwise noted
10
3000
1000
I
= -7.3A
C
iss
D
V
DD
= -5V
8
6
4
2
0
V
DD
= -10V
C
oss
V
DD
= -15V
C
rss
100
30
f = 1MHz
= 0V
V
GS
0
7
14
21
28
35
0.1
1
10
20
-VDS, DRAIN TO SOURCE VOLTAGE (V)
-Q , GATE CHARGE(nC)
g
Figure 7. Gate Charge Characteristics
Figure8. C a p a c i t a n c e v s D r a i n
to Source Voltage
1E-4
1E-5
1E-6
1E-7
1E-8
1E-9
60
10
V
GS
= 0V
rDS(on) LIMIT
100us
1ms
T
J
= 125oC
1
0.1
10ms
VGS=4.5V
100ms
1s
SINGLE PULSE
T
J
= 25oC
RTJA=145oC/W
10s
DC
o
TA = 25 C
0.01
0.1
1
10
60
0
3
6
9
12
15
-V , GATE TO SOURCE VOLTAGE(V)
GS
VDS, DRAIN to SOURCE VOLTAGE (V)
Figure 9. Gate Leakage Current vs Gate to
Source Voltage
Figure 10. Forward Bias Safe
Operating Area
150
2
1
DUTY CYCLE-DESCENDING ORDER
SINGLE PULSE
= 145oC/W
D = 0.5
0.2
R
TJA
T =25oC
120
90
60
30
0
A
0.1
0.05
0.02
P
DM
0.01
0.1
t
1
SINGLE PULSE
NOTES:
t
2
DUTY FACTOR: D = t /t
1
2
0.01
PEAK T = P
J
x Z
x R
+ T
DM
TJA
TJA A
0.005
10-4
10-3
10-2
10-1
100
t, PULSE WIDTH (s)
101
102
103
10-4
10-3
10-2
10-1
100
101
102
103
t, RECTANGULAR PULSE DURATION (s)
Figure11. Single Pulse Maximum
Power Dissipation
Figure 12. Transient Thermal Response Curve
www.fairchildsemi.com
4
FDMA520PZ Rev.B3
Dimensional Outline and Pad Layout
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision a
obtain the most recent revision. Package specifications do not expand the terms of Fairchild's worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
child Semiconductor representative to ver
ify or
nd/or date on the drawing and contact a Fair
tor’s online packaging area for the most recent package drawings:
Always visit Fairchild Semiconduc
http://www.fairchildsemi.com/package/packageDetails.html?id=PN_MLDEB-C06
www.fairchildsemi.com
5
FDMA520PZ Rev.B3
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
AccuPower™
AX-CAP *
BitSiC™
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
F-PFS™
FRFET
®*
®
®
®
tm
®
Global Power ResourceSM
GreenBridge™
Green FPS™
PowerTrench
PowerXS™
Programmable Active Droop™
QFET
QS™
Quiet Series™
RapidConfigure™
™
®
TinyBoost
TinyBuck
®
TinyCalc™
®
Green FPS™ e-Series™
Gmax™
GTO™
®
TinyLogic
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
Current Transfer Logic™
IntelliMAX™
®
DEUXPEED
ISOPLANAR™
Marking Small Speakers Sound Louder
and Better™
MegaBuck™
MICROCOUPLER™
MicroFET™
MicroPak™
MicroPak2™
MillerDrive™
MotionMax™
Dual Cool™
TranSiC™
®
EcoSPARK
Saving our world, 1mW/W/kW at a time™
SignalWise™
SmartMax™
TriFault Detect™
TRUECURRENT *
EfficentMax™
ESBC™
®
μSerDes™
SMART START™
®
Solutions for Your Success™
®
®
SPM
Fairchild
®
®
STEALTH™
SuperFET
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS
SyncFET™
Sync-Lock™
UHC
Fairchild Semiconductor
FACT Quiet Series™
®
Ultra FRFET™
UniFET™
VCX™
VisualMax™
VoltagePlus™
XS™
®
®
mWSaver
OptoHiT™
OPTOLOGIC
OPTOPLANAR
FACT
FAST
®
®
FastvCore™
FETBench™
FPS™
®
®
仙童 ™
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY
THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used here in:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or
effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,
www.Fairchildsemi.com, under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed
application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild
Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of
up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and
warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is
committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Advance Information
Formative / In Design
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
Preliminary
First Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
No Identification Needed
Obsolete
Full Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Not In Production
Rev. I68
www.fairchildsemi.com
FDMA520PZ Rev. B3
6
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
© Semiconductor Components Industries, LLC
www.onsemi.com
相关型号：
©2020 ICPDF网 联系我们和版权申明