FDG327NZ [ONSEMI]

N 沟道,PowerTrench® MOSFET,20 V,1.5 A,90 mΩ;
FDG327NZ
型号: FDG327NZ
厂家: ONSEMI    ONSEMI
描述:

N 沟道,PowerTrench® MOSFET,20 V,1.5 A,90 mΩ

PC 开关 光电二极管 晶体管
文件: 总6页 (文件大小:365K)
中文:  中文翻译
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by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized  
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Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.  
FDG327NZ  
20V N-Channel PowerTrenchÒ MOSFET  
Features  
General Description  
·
1.5 A, 20 V.  
RDS(ON) = 90 mW @ VGS = 4.5 V.  
RDS(ON) = 100 mW @ VGS = 2.5 V  
RDS(ON) = 140 mW @ VGS = 1.8 V  
This N-Channel MOSFET has been designed  
specifically to improve the overall efficiency of DC/DC  
converters using either synchronous or conventional  
switching PWM controllers. It has been optimized use  
in small switching regulators, providing an extremely  
low RDS(ON) and gate charge (QG) in a small package.  
·
·
·
Fast switching speed  
Low gate charge  
Applications  
High performance trench technology for extremely  
low RDS(ON)  
·
·
·
DC/DC converter  
Power management  
Load switch  
·
High power and current handling capability.  
S
D
D
G
D
Pin 1  
D
SC70-6  
Absolute Maximum Ratings TA=25oC unless otherwise noted  
Symbol  
VDSS  
Parameter  
Drain-Source Voltage  
Ratings  
Units  
V
20  
VGSS  
Gate-Source Voltage  
± 8  
ID  
Drain Current – Continuous  
– Pulsed  
(Note 1a)  
1.5  
A
6
PD  
Power Dissipation for Single Operation  
(Note 1a)  
(Note 1b)  
0.42  
W
°C  
0.38  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
–55 to +150  
Thermal Characteristics  
Thermal Resistance, Junction-to-Ambient  
Thermal Resistance, Junction-to-Ambient  
(Note 1a)  
(Note 1b)  
300  
333  
RqJA  
°C/W  
RqJA  
Package Marking and Ordering Information  
Device Marking  
Device  
Reel Size  
Tape width  
Quantity  
.37  
FDG327NZ  
7’’  
8mm  
3000 units  
Ó2008 Semiconductor Components Industries, LLC.  
September-2017, Rev. 2  
Publiaction Order Number:  
FDG327NZ/D  
Electrical Characteristics  
TA = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min Typ Max Units  
Off Characteristics  
BVDSS  
Drain–Source Breakdown Voltage  
20  
V
VGS = 0 V,  
ID = 250 mA  
DBVDSS  
DTJ  
Breakdown Voltage Temperature  
Coefficient  
11  
ID = 250 mA, Referenced to 25°C  
mV/°C  
IDSS  
IGSS  
Zero Gate Voltage Drain Current  
Gate–Body Leakage  
VDS = 16 V,  
VGS = 0 V  
VDS = 0 V  
1
mA  
mA  
VGS = ± 8 V,  
±10  
On Characteristics  
(Note 2)  
VGS(th)  
Gate Threshold Voltage  
0.4  
0.7  
–2  
1.5  
V
VDS = VGS  
,
ID = 250 mA  
DVGS(th)  
DTJ  
Gate Threshold Voltage  
Temperature Coefficient  
ID = 250 mA, Referenced to 25°C  
mV/°C  
VGS = 4.5 V,  
VGS = 2.5 V,  
VGS = 1.8 V,  
ID = 1.5 A  
ID = 1.4 A  
ID = 1.2 A  
68  
77  
90  
86  
90  
Static Drain–Source  
On–Resistance  
100  
140  
123  
mW  
RDS(on)  
VGS = 4.5 V, ID = 1.5 A, TJ =125°C  
ID(on)  
gFS  
On–State Drain Current  
VGS = 4.5V,  
VDS = 10 V,  
VDS = 5 V  
ID = 1.5 A  
3
A
S
Forward Transconductance  
9
Dynamic Characteristics  
Ciss  
Coss  
Crss  
RG  
Input Capacitance  
412  
81  
pF  
pF  
pF  
W
VDS = 10 V,  
f = 1.0 MHz  
V GS = 0 V  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
44  
VGS = 15 mV, f = 1.0 MHz  
1.9  
Switching Characteristics (Note 2)  
td(on)  
tr  
td(off)  
tf  
Turn–On Delay Time  
Turn–On Rise Time  
Turn–Off Delay Time  
Turn–Off Fall Time  
Total Gate Charge  
Gate–Source Charge  
Gate–Drain Charge  
6.2  
2.3  
18  
13  
10  
33  
10  
6
ns  
ns  
ns  
ns  
nC  
nC  
nC  
VDD = 10 V,  
VGS = 4.5 V,  
ID = 1 A,  
RGEN = 6 W  
2.9  
4.2  
0.4  
1
Qg  
Qgs  
Qgd  
VDS = 10 V,  
VGS = 4.5 V  
ID = 1.5 A,  
Drain–Source Diode Characteristics and Maximum Ratings  
Drain–Source Diode Forward  
Voltage  
Diode Reverse Recovery Time  
VSD  
VGS = 0 V, IS = 0.32 A (Note 2)  
IF = 1.5 A, diF/dt = 100 A/µs  
0.6  
1.2  
V
trr  
4
2
nS  
nC  
Qrr  
Diode Reverse Recovery Charge  
Notes:  
1. RqJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of  
the drain pins. RqJC is guaranteed by design while RqCA is determined by the user's board design.  
a)  
300°C/W when  
mounted on a 1in2 pad  
of 2 oz copper.  
b)  
333°C/W when mounted  
on a minimum pad of 2 oz  
copper.  
2. Pulse Test: Pulse Width < 300ms, Duty Cycle < 2.0%  
www.onsemi.com  
2
Typical Characteristics  
10  
1.8  
1.6  
1.4  
1.2  
1
VGS= 4.5V  
2.5V  
2.0V  
1.8V  
VGS=1.5V  
8
6
4
2
0
1.8V  
1.5V  
2.0V  
2.5V  
3.0V  
4.5V  
0.8  
0
1
2
3
0
2
4
6
8
10  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
ID, DRAIN CURRENT (A)  
Figure 1. On-Region Characteristics.  
Figure 2. On-Resistance Variation with  
Drain Current and Gate Voltage.  
0.22  
1.5  
1.4  
ID = 1.5A  
VGS = 4.5V  
ID = 0.8A  
0.17  
0.12  
0.07  
0.02  
1.3  
1.2  
1.1  
1
TA = 125oC  
TA = 25oC  
0.9  
0.8  
0.7  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
0.5  
1.5  
2.5  
3.5  
4.5  
TJ, JUNCTION TEMPERATURE (oC)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 3. On-Resistance Variation  
withTemperature.  
Figure 4. On-Resistance Variation with  
Gate-to-Source Voltage.  
10  
10  
8
TA = -55oC  
VGS = 0V  
VDS = 5.0V  
25oC  
1
TA = 125oC  
125oC  
25oC  
0.1  
6
-55oC  
0.01  
4
0.001  
2
0
0.0001  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
0.5  
1
1.5  
2
2.5  
VSD, BODY DIODE FORWARD VOLTAGE (V)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 5. Transfer Characteristics.  
Figure 6. Body Diode Forward Voltage Variation  
with Source Current and Temperature.  
www.onsemi.com  
3
Typical Characteristics  
5
600  
500  
400  
300  
200  
100  
0
f = 1 MHz  
VGS = 0 V  
VDS = 5V  
ID = 1.5A  
10V  
4
CISS  
15V  
3
2
1
0
COSS  
CRSS  
0
5
10  
15  
20  
0
1
2
3
4
5
Qg, GATE CHARGE (nC)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Figure 7. Gate Charge Characteristics.  
Figure 8. Capacitance Characteristics.  
10  
20  
15  
10  
5
RDS(ON) LIMIT  
SINGLE PULSE  
RqJA = 333°C/W  
TA = 25°C  
100ms  
1ms  
10ms  
100ms  
1s  
10s  
DC  
1
0.1  
VGS = 4.5V  
SINGLE PULSE  
RqJA = 333oC/W  
TA = 25oC  
0.01  
0
0.1  
1
10  
100  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
VDS, DRAIN-SOURCE VOLTAGE (V)  
t1, TIME (sec)  
Figure 9. Maximum Safe Operating Area.  
Figure 10. Single Pulse Maximum  
Power Dissipation.  
1
D = 0.5  
R
qJA(t) = r(t) * RqJA  
qJA = 333oC/W  
R
0.2  
0.1  
P(pk)  
0.1  
0.05  
t1  
0.02  
0.01  
t2  
TJ - TA = P * RqJA(t)  
Duty Cycle, D = t1 / t2  
SINGLE PULSE  
0.01  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, TIME (sec)  
Figure 11. Transient Thermal Response Curve.  
Thermal characterization performed using the conditions described in Note 1b.  
Transient thermal response will change depending on the circuit board design.  
www.onsemi.com  
4
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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