FDG327NZ [ONSEMI]
N 沟道,PowerTrench® MOSFET,20 V,1.5 A,90 mΩ;型号: | FDG327NZ |
厂家: | ONSEMI |
描述: | N 沟道,PowerTrench® MOSFET,20 V,1.5 A,90 mΩ PC 开关 光电二极管 晶体管 |
文件: | 总6页 (文件大小:365K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized
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FDG327NZ
20V N-Channel PowerTrenchÒ MOSFET
Features
General Description
·
1.5 A, 20 V.
RDS(ON) = 90 mW @ VGS = 4.5 V.
RDS(ON) = 100 mW @ VGS = 2.5 V
RDS(ON) = 140 mW @ VGS = 1.8 V
This N-Channel MOSFET has been designed
specifically to improve the overall efficiency of DC/DC
converters using either synchronous or conventional
switching PWM controllers. It has been optimized use
in small switching regulators, providing an extremely
low RDS(ON) and gate charge (QG) in a small package.
·
·
·
Fast switching speed
Low gate charge
Applications
High performance trench technology for extremely
low RDS(ON)
·
·
·
DC/DC converter
Power management
Load switch
·
High power and current handling capability.
S
D
D
G
D
Pin 1
D
SC70-6
Absolute Maximum Ratings TA=25oC unless otherwise noted
Symbol
VDSS
Parameter
Drain-Source Voltage
Ratings
Units
V
20
VGSS
Gate-Source Voltage
± 8
ID
Drain Current – Continuous
– Pulsed
(Note 1a)
1.5
A
6
PD
Power Dissipation for Single Operation
(Note 1a)
(Note 1b)
0.42
W
°C
0.38
TJ, TSTG
Operating and Storage Junction Temperature Range
–55 to +150
Thermal Characteristics
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Ambient
(Note 1a)
(Note 1b)
300
333
RqJA
°C/W
RqJA
Package Marking and Ordering Information
Device Marking
Device
Reel Size
Tape width
Quantity
.37
FDG327NZ
7’’
8mm
3000 units
Ó2008 Semiconductor Components Industries, LLC.
September-2017, Rev. 2
Publiaction Order Number:
FDG327NZ/D
Electrical Characteristics
TA = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min Typ Max Units
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage
20
V
VGS = 0 V,
ID = 250 mA
DBVDSS
DTJ
Breakdown Voltage Temperature
Coefficient
11
ID = 250 mA, Referenced to 25°C
mV/°C
IDSS
IGSS
Zero Gate Voltage Drain Current
Gate–Body Leakage
VDS = 16 V,
VGS = 0 V
VDS = 0 V
1
mA
mA
VGS = ± 8 V,
±10
On Characteristics
(Note 2)
VGS(th)
Gate Threshold Voltage
0.4
0.7
–2
1.5
V
VDS = VGS
,
ID = 250 mA
DVGS(th)
DTJ
Gate Threshold Voltage
Temperature Coefficient
ID = 250 mA, Referenced to 25°C
mV/°C
VGS = 4.5 V,
VGS = 2.5 V,
VGS = 1.8 V,
ID = 1.5 A
ID = 1.4 A
ID = 1.2 A
68
77
90
86
90
Static Drain–Source
On–Resistance
100
140
123
mW
RDS(on)
VGS = 4.5 V, ID = 1.5 A, TJ =125°C
ID(on)
gFS
On–State Drain Current
VGS = 4.5V,
VDS = 10 V,
VDS = 5 V
ID = 1.5 A
3
A
S
Forward Transconductance
9
Dynamic Characteristics
Ciss
Coss
Crss
RG
Input Capacitance
412
81
pF
pF
pF
W
VDS = 10 V,
f = 1.0 MHz
V GS = 0 V
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
44
VGS = 15 mV, f = 1.0 MHz
1.9
Switching Characteristics (Note 2)
td(on)
tr
td(off)
tf
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
Gate–Drain Charge
6.2
2.3
18
13
10
33
10
6
ns
ns
ns
ns
nC
nC
nC
VDD = 10 V,
VGS = 4.5 V,
ID = 1 A,
RGEN = 6 W
2.9
4.2
0.4
1
Qg
Qgs
Qgd
VDS = 10 V,
VGS = 4.5 V
ID = 1.5 A,
Drain–Source Diode Characteristics and Maximum Ratings
Drain–Source Diode Forward
Voltage
Diode Reverse Recovery Time
VSD
VGS = 0 V, IS = 0.32 A (Note 2)
IF = 1.5 A, diF/dt = 100 A/µs
0.6
1.2
V
trr
4
2
nS
nC
Qrr
Diode Reverse Recovery Charge
Notes:
1. RqJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RqJC is guaranteed by design while RqCA is determined by the user's board design.
a)
300°C/W when
mounted on a 1in2 pad
of 2 oz copper.
b)
333°C/W when mounted
on a minimum pad of 2 oz
copper.
2. Pulse Test: Pulse Width < 300ms, Duty Cycle < 2.0%
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2
Typical Characteristics
10
1.8
1.6
1.4
1.2
1
VGS= 4.5V
2.5V
2.0V
1.8V
VGS=1.5V
8
6
4
2
0
1.8V
1.5V
2.0V
2.5V
3.0V
4.5V
0.8
0
1
2
3
0
2
4
6
8
10
VDS, DRAIN TO SOURCE VOLTAGE (V)
ID, DRAIN CURRENT (A)
Figure 1. On-Region Characteristics.
Figure 2. On-Resistance Variation with
Drain Current and Gate Voltage.
0.22
1.5
1.4
ID = 1.5A
VGS = 4.5V
ID = 0.8A
0.17
0.12
0.07
0.02
1.3
1.2
1.1
1
TA = 125oC
TA = 25oC
0.9
0.8
0.7
-50
-25
0
25
50
75
100
125
150
0.5
1.5
2.5
3.5
4.5
TJ, JUNCTION TEMPERATURE (oC)
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 3. On-Resistance Variation
withTemperature.
Figure 4. On-Resistance Variation with
Gate-to-Source Voltage.
10
10
8
TA = -55oC
VGS = 0V
VDS = 5.0V
25oC
1
TA = 125oC
125oC
25oC
0.1
6
-55oC
0.01
4
0.001
2
0
0.0001
0
0.2
0.4
0.6
0.8
1
1.2
1.4
0.5
1
1.5
2
2.5
VSD, BODY DIODE FORWARD VOLTAGE (V)
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 5. Transfer Characteristics.
Figure 6. Body Diode Forward Voltage Variation
with Source Current and Temperature.
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3
Typical Characteristics
5
600
500
400
300
200
100
0
f = 1 MHz
VGS = 0 V
VDS = 5V
ID = 1.5A
10V
4
CISS
15V
3
2
1
0
COSS
CRSS
0
5
10
15
20
0
1
2
3
4
5
Qg, GATE CHARGE (nC)
VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 7. Gate Charge Characteristics.
Figure 8. Capacitance Characteristics.
10
20
15
10
5
RDS(ON) LIMIT
SINGLE PULSE
RqJA = 333°C/W
TA = 25°C
100ms
1ms
10ms
100ms
1s
10s
DC
1
0.1
VGS = 4.5V
SINGLE PULSE
RqJA = 333oC/W
TA = 25oC
0.01
0
0.1
1
10
100
0.0001
0.001
0.01
0.1
1
10
100
1000
VDS, DRAIN-SOURCE VOLTAGE (V)
t1, TIME (sec)
Figure 9. Maximum Safe Operating Area.
Figure 10. Single Pulse Maximum
Power Dissipation.
1
D = 0.5
R
qJA(t) = r(t) * RqJA
qJA = 333oC/W
R
0.2
0.1
P(pk)
0.1
0.05
t1
0.02
0.01
t2
TJ - TA = P * RqJA(t)
Duty Cycle, D = t1 / t2
SINGLE PULSE
0.01
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, TIME (sec)
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1b.
Transient thermal response will change depending on the circuit board design.
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4
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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