FDB390N15A [ONSEMI]

N 沟道,PowerTrench® MOSFET,150V,27A,39mΩ;
FDB390N15A
型号: FDB390N15A
厂家: ONSEMI    ONSEMI
描述:

N 沟道,PowerTrench® MOSFET,150V,27A,39mΩ

开关 脉冲 晶体管
文件: 总11页 (文件大小:878K)
中文:  中文翻译
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2015 5 月  
FDB390N15A  
N PowerTrench® MOSFET  
150 V27 A39 mΩ  
特性  
说明  
N 沟道 MOSFET 采用飞兆半导体先进的 PowerTrench® 工艺  
生产,这一先进工艺是专为最大限度地降低导通电阻并保持卓越  
开关性能而定制的。  
RDS(on) = 33.5 mΩ (Typ.) @ VGS = 10 V, ID = 27 A  
快速开关速度  
低栅极电荷QG=14.3 nC (典型值)  
高性能沟道技术可实现极低RDS(on)  
高功率和高电流处理能力  
RoHS 标准  
应用  
消费电子设备  
LED 电视  
同步整流  
不间断电源  
微型太阳能逆变器  
D
D
G
G
S
D2-PAK  
S
MOSFET 最大额定TC = 25°C 除非另有说明。  
FDB390N15A  
符号  
参数  
单位  
VDSS  
VGSS  
150  
±20  
±30  
27  
V
漏极-源极电压  
栅极-源极电压  
- DC  
V
A
- AC  
(f > 1 Hz)  
- TC = 25°C,硅限制)  
- TC = 100°C,硅限制)  
- 脉冲  
ID  
漏极电流  
19  
IDM  
108  
78  
A
mJ  
漏极电流  
(说1)  
(说2)  
(说3)  
EAS  
dv/dt  
单脉冲雪崩能量  
二极管恢dv/dt 峰值  
6.0  
75  
V/ns  
W
(TC = 25°C)  
PD  
功耗  
0.5  
W/°C  
°C  
- 降低25°C 以上  
TJ, TSTG  
TL  
工作和存储温度范围  
-55 +175  
300  
°C  
用于焊接的最大引线温度,距离外1/8",持5 秒。  
热性能  
FDB390N15A  
符号  
参数  
结至外壳热阻最大值  
单位  
RθJC  
2.0  
62.5  
40  
结至环境热最小尺寸2 盎司焊盘)最大值。  
结至环境热1 in2 2 盎司焊盘)最大值。  
°C/W  
RθJA  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
1
FDB390N15A Rev. 1.8  
封装标识与定购信息  
器件编号  
顶标  
FDB390N15A  
封装  
D2-PAK  
包装方法  
卷带  
卷尺寸  
带宽  
数量  
330 mm  
24 mm  
FDB390N15A  
800 个  
电气特TC = 25°C 除非另有说明。  
符号  
参数  
测试条件  
最小值 典型值 最大值  
单位  
关断特性  
BVDSS  
ID = 250 μAVGS = 0 V  
150  
-
-
-
-
V
- 源极击穿电压  
ΔBVDSS  
/ ΔTJ  
击穿电压温度系数  
ID = 250 μA,温度25°C  
0.1  
V/°C  
VDS = 120 VVGS = 0 V  
VDS = 120 VTC = 150°C  
VGS = ±20 VVDS = 0 V  
-
-
-
-
-
-
1
IDSS  
IGSS  
μA  
零栅极电压漏极电流  
500  
±100  
nA  
- 体漏电流  
导通特性  
VGS(th)  
RDS(on)  
gFS  
VGS = VDSID = 250 μA  
VGS = 10 VID = 27 A  
VDS = 10 VID = 27 A  
2.0  
-
4.0  
39.0  
-
V
mΩ  
S
栅极阈值电压  
-
-
33.5  
33  
漏极至源极静态导通电阻  
正向跨导  
动态特性  
Ciss  
-
-
-
965  
96  
1285  
pF  
pF  
pF  
pF  
nC  
nC  
nC  
nC  
Ω
输入电容  
VDS = 75 VVGS = 0 V,  
f = 1 MHz  
Coss  
Crss  
130  
输出电容  
5.8  
169  
14.3  
5.0  
2.0  
3.5  
1.4  
-
反向传输电容  
Coss(er)  
Qg(tot)  
Qgs  
VDS = 75 VID = 27 A  
-
能量相关输出电容  
10 V 的栅极电荷总量  
- 源极栅极电荷  
栅极平台电荷阈值  
- 电荷  
等效串联电(G-S)  
-
18.6  
V
DS = 75 VID = 27 A,  
-
-
-
-
VGS = 10 V  
Qgs2  
Qgd  
-
-
-
(说4)  
ESR  
f = 1 MHz  
开关特性  
td(on)  
tr  
td(off)  
tf  
-
-
-
-
14  
10  
20  
5
38  
30  
50  
20  
ns  
ns  
ns  
ns  
导通延迟时间  
开通上升时间  
关断延迟时间  
关断下降时间  
VDD = 75 VID = 27 A,  
V
GS = 10 VRG = 4.7 Ω  
(说4)  
- 源极二极管特性  
IS  
-
-
-
-
-
-
-
27  
108  
1.25  
-
A
A
- 源极二极管最大正向连续电流  
- 源极二极管最大正向脉冲电流  
- 源极二极管正向电压  
反向恢复时间  
ISM  
VSD  
trr  
VGS = 0 VISD = 27 A  
-
V
63  
131  
ns  
nC  
VGS = 0 VISD = 27 AVDD = 75 V,  
dIF/dt = 100 A/μs  
Qrr  
-
反向恢复电荷  
注意:  
1. 重复额定值:脉冲宽度受限于最大结温。  
2. T = 25°CL = 3 mHI = 7.2 A。  
J
SD  
3. I 27 Adi/dt 200 A/μsV BV  
,开T = 25°C。  
J
SD  
DD  
DSS  
4. 本质上独立于工作温度的典型特性。  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
2
FDB390N15A Rev. 1.8  
典型性能特征  
1. 导通区域特性  
2. 传输特性  
200  
200  
VGS = 15.0V  
*Notes:  
1. VDS = 10V  
10.0V  
8.0V  
7.0V  
6.5V  
6.0V  
5.5V  
5.0V  
100  
100  
2. 250μs Pulse Test  
10  
10  
25oC  
175oC  
-55oC  
*Notes:  
1. 250μs Pulse Test  
2. TC = 25oC  
1
1
0.1  
2
3
4
5
6
7
1
5
VGS, Gate-Source Voltage[V]  
VDS, Drain-Source Voltage[V]  
3. 导通电阻变化与漏极电流和  
栅极电压的关系  
4. 体二极管正向电压变化与源极电流  
和温度的关系  
80  
200  
100  
60  
VGS = 10V  
25oC  
175oC  
10  
40  
VGS = 20V  
*Notes:  
1. VGS = 0V  
*Note: TC = 25oC  
2. 250μs Pulse Test  
20  
1
0.4  
0
20  
40  
60  
80  
100  
0.6  
0.8  
1.0  
1.2 1.3  
ID, Drain Current [A]  
VSD, Body Diode Forward Voltage [V]  
5. 电容特性  
6. 栅极电荷特性  
2000  
10  
1000  
100  
10  
Ciss  
VDS = 30V  
DS = 75V  
DS = 120V  
8
6
4
2
0
V
V
Coss  
*Note:  
1. VGS = 0V  
2. f = 1MHz  
Crss  
C
C
C
= C + C (C = shorted)  
gs gd ds  
iss  
= C + C  
ds  
oss  
rss  
gd  
= C  
gd  
*Note: ID = 27A  
12  
1
0.1  
1
10  
100 200  
0
4
8
16  
VDS, Drain-Source Voltage [V]  
Qg, Total Gate Charge [nC]  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
3
FDB390N15A Rev. 1.8  
典型性能特(接上页)  
7. 击穿电压变化与温度的关系  
8. 导通电阻变化与温度的关系  
1.12  
2.8  
2.4  
2.0  
1.6  
1.2  
1.08  
1.04  
1.00  
*Notes:  
1. VGS = 0V  
0.96  
0.92  
*Notes:  
1. VGS = 10V  
0.8  
2. ID = 250μA  
2. ID = 27A  
0.4  
-80  
-40  
0
40  
80  
120 160 200  
-80  
-40  
0
40  
80  
120 160 200  
TJ, Junction Temperature [oC]  
TJ, Junction Temperature [oC]  
9. 最大安全工作区  
10. 最大漏极电流与壳温的关系  
300  
30  
VGS= 10V  
100  
10μs  
25  
20  
15  
10  
5
100μs  
10  
Operation in This Area  
is Limited by R DS(on)  
1ms  
10ms  
DC  
1
*Notes:  
1. TC = 25oC  
0.1  
2. TJ = 175oC  
RθJC = 2.0oC/W  
3. Single Pulse  
0.01  
0
25  
50  
75  
100  
125  
150  
175  
1
10  
100 200  
TC, Case Temperature [oC]  
VDS, Drain-Source Voltage [V]  
11. 输出电(Eoss) 与漏源极电压的关系  
12. 非箝位电感开关能力  
1.2  
12  
If R = 0  
10  
tAV = (L)(IAS)/(1.3*RATED BVDSS-VDD)  
If R = 0  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
tAV = (L/R)In[(IAS*R)/(1.3*RATED BVDSS-VDD)+1]  
STARTING TJ = 25oC  
STARTING TJ = 150oC  
1
0
30  
60  
90  
120  
150  
0.01  
0.1  
1
10 20  
VDS, Drain to Source Voltage [V]  
tAV, TIME IN AVALANCHE (ms)  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
4
FDB390N15A Rev. 1.8  
典型性能特(接上页)  
13. 瞬态热响应曲线  
3
1
0.5  
0.2  
PDM  
0.1  
t1  
0.05  
t2  
0.1  
0.02  
0.01  
*Notes:  
1. ZθJC(t) = 2.0oC/W Max.  
2. Duty Factor, D= t1/t2  
3. TJM - TC = PDM * ZθJC(t)  
Single pulse  
0.01  
10-5  
10-4  
10-3  
10-2  
10-1  
1
t
1形脉冲持续时[ ]  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
5
FDB390N15A Rev. 1.8  
I = 常量  
G
14. 栅极电荷测试电路与波形  
RL  
VDS  
90%  
VDS  
VDD  
VGS  
RG  
10%  
VGS  
DUT  
V
GS  
td(on)  
tr  
td(off)  
tf  
t on  
t off  
15. 阻性开关测试电路与波形  
VGS  
16. 非箝位电感开关测试电路与波形  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
6
FDB390N15A Rev. 1.8  
+
DUT  
VDS  
_
I SD  
L
Driver  
RG  
Same Type  
as DUT  
VDD  
VGS  
• dv/dt controlled by RG  
• ISD controlled by pulse period  
Gate Pulse Width  
--------------------------  
VGS  
D =  
Gate Pulse Period  
10V  
( Driver )  
IFM , Body Diode Forward Current  
I SD  
di/dt  
( DUT )  
IRM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
VSD  
VDS  
( DUT )  
VDD  
Body Diode  
Forward Voltage Drop  
17. 二极管恢dv/dt 峰值测试电路与波形  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
7
FDB390N15A Rev. 1.8  
机械尺寸  
2
18. TO263 (D PAK) 2 引脚表面贴装  
封装图纸作为一项服务,提供给考虑飞兆半导体元件的客户。具体参数可能会有变化,且不会做出相应通知。请注意图纸上的版本和 /  
或日期联系飞兆半导体代表核实或获得最新版本装规格并不扩大飞兆公司全球范围内的条款与条件其是其中涉及飞兆公司  
产品保修的部分。  
随时访问飞兆半导体在线封装网页,可以获取最新的封装图纸:  
http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT263-002  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
8
FDB390N15A Rev. 1.8  
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Datasheet contains the design specifications for product development. Specifications  
may change in any manner without notice.  
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Rev. I74  
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©2011 飞兆半导体公司  
FDB390N15A Rev. 1.8  
9
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