FCP190N60-GF102 [ONSEMI]

N 沟道 SuperFET® II MOSFET 600V, 20.2A, 199mΩ;
FCP190N60-GF102
型号: FCP190N60-GF102
厂家: ONSEMI    ONSEMI
描述:

N 沟道 SuperFET® II MOSFET 600V, 20.2A, 199mΩ

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FCP190N60-GF102  
®
N SuperFET II MOSFET  
600 V, 20.2 A, 199 m  
特性  
说明  
SuperFET® II MOSFET 是飞兆半导体新一代利用电荷平衡技术  
实现出色低导通电阻和更低栅极电荷性能的高压超级结 (SJ)  
MOSFET 系列产品项技术专用于最小化导通损耗并提供卓越  
的开关性能dv/dt 额定值和更高雪崩能量。因此SuperFET  
MOSFET 非常适合开关电源应用功率因数校(PFC)务  
/ 电信电源、平板电视电源ATX 电源及工业电源应用。  
650 V @ TJ = 150°C  
典型RDS(on) = 170 m  
超低栅极电典型Qg = 57 nC)  
低有效输出电典型Coss(eff.)= 160 pF)  
100% 经过雪崩测试  
RoHS 标准  
应用  
LCD / LED / PDP 电视照明  
太阳能逆变器  
AC-DC 电源  
D
G
G
D
S
TO-220  
S
绝对最大额定值 TC = 25°C 除非另有说明。  
FCP190N60-GF102  
符号  
参数  
- DC  
单位  
VDSS  
VGSS  
600  
±20  
V
漏极-源极电压  
栅极-源极电压  
V
A
- AC  
(f > 1 Hz)  
±30  
- (TC = 25°C)  
- (TC = 100°C)  
- 脉冲  
20.2  
12.7  
60.6  
400  
ID  
漏极电流  
IDM  
EAS  
IAR  
(说1)  
(说2)  
(说1)  
(说1)  
A
mJ  
A
漏极电流  
单脉冲雪崩能量  
雪崩电流  
4.0  
EAR  
2.1  
mJ  
重复雪崩能量  
MOSFET dv/dt  
二极管恢dv/dt 峰值  
100  
dv/dt  
PD  
V/ns  
(说3)  
20  
(TC = 25°C)  
208  
W
W/°C  
°C  
功耗  
- 降低25°C 以上  
1.67  
-55 +150  
300  
TJ, TSTG  
TL  
工作和存储温度范围  
°C  
用于焊接的最大引线温度,距离外1/8",持5 秒  
热性能  
FCP190N60-GF102  
符号  
RJC  
参数  
结至外壳热阻最大值  
单位  
0.6  
°C/W  
RJA  
62.5  
结至环境热阻最大值  
© 2013 飞兆半导体公司  
December-2017, Rev. 3  
Publication Order Number:  
FCP190N60-GF102CN/D  
封装标识与定购信息  
器件编号  
顶标  
FCP190N60-GF102  
封装  
包装方法  
塑料管  
卷尺寸  
不适用  
带宽  
数量  
TO-220  
FCP190N60-GF102  
不适用  
50 个  
电气特TC = 25oC 除非另有说明。  
符号  
参数  
测试条件  
最小值 典型值 最大值  
单位  
关断特性  
VGS = 0 V, ID = 10 mA, TJ = 25°C  
VGS = 0 V, ID = 10 mA, TJ = 150°C  
600  
650  
-
-
-
-
BVDSS  
V
漏极-源极击穿电压  
BVDSS  
/ TJ  
BVDS  
IDSS  
IGSS  
击穿电压温度系数  
ID=10 mA,参考条件25°C  
-
0.67  
-
V/oC  
V
V
V
GS = 0 V, ID = 20 A  
-
-
-
-
700  
-
1
- 源极雪崩击穿电压  
零栅极电压漏极电流  
- 体漏电流  
DS = 480 V, VGS = 0 V  
-
-
-
A  
VDS = 480 V, TC = 125°C  
GS = ±20 V, VDS = 0 V  
10  
V
±100  
nA  
导通特性  
VGS(th)  
RDS(on)  
gFS  
VGS = VDS, ID = 250 A  
2.5  
-
3.5  
0.199  
-
V
S
栅极阈值电压  
VGS = 10 V, ID = 10 A  
-
-
0.17  
21  
漏极至源极静态导通电阻  
正向跨导  
V
DS = 20 V, ID = 10 A  
动态特性  
Ciss  
-
-
-
-
-
-
-
-
-
2220  
1630  
85  
2950  
pF  
pF  
pF  
pF  
pF  
nC  
nC  
nC  
输入电容  
V
DS = 25 V, VGS = 0 V,  
Coss  
Crss  
2165  
输出电容  
f = 1 MHz  
128  
反向传输电容  
输出电容  
Coss  
Coss(eff.)  
Qg(tot)  
Qgs  
VDS = 380 V, VGS = 0 V, f = 1 MHz  
42  
-
-
VDS = 0 V 480 V, VGS = 0 V  
160  
57  
有效输出电容  
10 V 的栅极电荷总量  
- 源极栅极电荷  
- 电荷  
等效串联电阻  
74  
-
VDS = 380 V, ID = 10 A,  
VGS = 10 V  
9
4)  
Qgd  
21  
-
ESR  
f = 1 MHz  
1
-
开关特性  
td(on)  
tr  
td(off)  
tf  
-
-
-
-
20  
10  
64  
5
50  
30  
ns  
ns  
ns  
ns  
导通延迟时间  
开通上升时间  
关断延迟时间  
关断下降时间  
VDD = 380 V, ID = 10 A,  
V
GS = 10 V, Rg = 4.7   
138  
20  
(说4)  
- 源极二极管特性  
IS  
-
-
-
-
-
-
-
20.2  
60.6  
1.2  
-
A
A
- 源极二极管最大正向连续电流  
ISM  
VSD  
trr  
- 源极二极管最大正向脉冲电流  
- 源极二极管正向电压  
反向恢复时间  
VGS = 0 V, ISD = 10 A  
GS = 0 V, ISD = 10 A,  
dIF/dt = 100 A/s  
-
V
280  
3.8  
ns  
C  
V
Qrr  
-
反向恢复电荷  
注意:  
1. 重复额定值:脉冲宽度受限于最大结温。  
2. I = 4 AV = 50 VR = 25 ,启T = 25°C。  
AS  
DD  
G
J
3. I 10 Adi/dt 200 A/sV BV  
,启T = 25°C。  
SD  
DD  
DSS  
J
4. 本质上独立于工作温度的典型特性。  
www.onsemi.com  
2
典型性能特征  
1. 通态区域特性  
2. 传递特性  
50  
100  
VGS = 15.0V  
*Notes:  
1. VDS = 20V  
10.0V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
4.5V  
2. 250s Pulse Test  
150oC  
10  
10  
25oC  
-55oC  
1
*Notes:  
1. 250s Pulse Test  
2. TC = 25oC  
0.3  
0.1  
1
1
10  
2
3
4
5
6
7
8
VDS, Drain to Source Voltage[V]  
VGS, Gate to Source Voltage[V]  
3. 导通电阻变化与漏极电流和栅极电压  
4. 体二极管正向电压变化与源极电流和温度  
0.5  
100  
0.4  
150oC  
25oC  
10  
0.3  
VGS = 10V  
0.2  
VGS = 20V  
*Notes:  
1. VGS = 0V  
*Note: TC = 25oC  
40  
2. 250s Pulse Test  
1
0.2  
0.1  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
0
10  
20  
30  
50  
VSD, Body Diode Forward Voltage [V]  
ID, Drain Current [A]  
5. 电容特性  
6. 栅极电荷特性  
10000  
10  
Ciss  
VDS = 120V  
8
6
4
2
0
VDS = 300V  
VDS = 480V  
1000  
Coss  
100  
*Note:  
1. VGS = 0V  
10  
2. f = 1MHz  
Crss  
C
C
C
= C + C (C = shorted)  
gs gd ds  
iss  
= C + C  
ds  
oss  
rss  
gd  
1
= C  
gd  
*Note: ID = 10A  
40 60  
0.5  
0.1  
1
10  
100  
600  
0
20  
Qg, Total Gate Charge [nC]  
VDS, Drain to Source Voltage [V]  
www.onsemi.com  
3
典型性能特(接上页)  
7. 击穿电压变化与温度的关系  
8. 导通电阻变化与温度的关系  
1.2  
3.0  
2.5  
2.0  
1.5  
1.0  
1.1  
1.0  
0.9  
*Notes:  
1. VGS = 0V  
*Notes:  
1. VGS = 10V  
0.5  
0.0  
2. ID = 10mA  
2. ID = 10A  
0.8  
-100  
-100  
-50  
0
50  
100  
150  
200  
-50  
0
50  
100  
150  
200  
TJ, Junction Temperature [oC]  
TJ, Junction Temperature [oC]  
9. 最大安全工作区  
10. 最大漏极电流与壳体温度的关系  
25  
100  
10s  
100s  
1ms  
10ms  
DC  
20  
15  
10  
5
10  
1
Operation in This Area  
is Limited by R DS(on)  
*Notes:  
0.1  
1. TC = 25oC  
2. TJ = 150oC  
3. Single Pulse  
0.01  
0
25  
50  
75  
100  
125  
150  
0.1  
1
10  
100  
1000  
TC, Case Temperature [oC]  
VDS, Drain to Source Voltage [V]  
11. Eoss 与漏- 源极电压的关系  
10  
8
6
4
2
0
0
100  
200  
300  
400  
500  
600  
VDS, Drain to Source Voltage [V]  
www.onsemi.com  
4
典型性能特(接上页)  
12. 瞬态热响应曲线  
1
0.5  
0.2  
PDM  
0.1  
0.1  
t1  
t2  
0.05  
*Notes:  
0.02  
0.01  
1. ZJC(t) = 0.6oC/W Max.  
2. Duty Factor, D= t1/t2  
3. TJM - TC = PDM * ZJC(t)  
Single pulse  
0.01  
10-5  
10-4  
10-3  
10-2  
10-1  
1
t1形脉冲持续时[ ]  
www.onsemi.com  
5
I
= 常量  
G
13. 栅极电荷测试电路与波形  
RL  
VDS  
90%  
VDS  
VDD  
VGS  
RG  
10%  
VGS  
DUT  
V
GS  
td(on)  
tr  
td(off)  
tf  
t on  
t off  
14. 阻性开关测试电路与波形  
VGS  
15. 非箝位电感开关测试电路与波形  
www.onsemi.com  
6
+
DUT  
VDS  
_
I SD  
L
Driver  
RG  
Same Type  
as DUT  
VDD  
VGS  
• dv/dt controlled by RG  
• ISD controlled by pulse period  
Gate Pulse Width  
--------------------------  
VGS  
D =  
Gate Pulse Period  
10V  
( Driver )  
IFM , Body Diode Forward Current  
I SD  
di/dt  
( DUT )  
IRM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
VSD  
VDS  
( DUT )  
VDD  
Body Diode  
Forward Voltage Drop  
16. 二极管恢dv/dt 峰值测试电路与波形  
www.onsemi.com  
7
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