ESDR0544MDMR4G [ONSEMI]
ESD Protection Diode, Ultra Low Capacitance, Low Clamping Voltage;
| 型号： | ESDR0544MDMR4G |
| 厂家： | 
ONSEMI |
| 描述： | ESD Protection Diode, Ultra Low Capacitance, Low Clamping Voltage |
| 文件： | 总4页 (文件大小：177K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ESDR0544M
Transient Voltage
Suppressors
Low Capacitance ESD Protection for
High Speed Data
http://onsemi.com
The ESDR0544M transient voltage suppressor is designed to
protect high speed data lines from ESD. Ultra−low capacitance and
low ESD clamping voltage make this device an ideal solution for
protecting voltage sensitive high speed data lines. The flow−through
style package allows for easy PCB layout and matched trace lengths
necessary to maintain consistent impedance between high speed
differential lines such as HDMI.
MARKING
DIAGRAM
10
Micro−10
DM SUFFIX
CASE 846B
544M
AYWG
G
1
1
Features
• Low Capacitance (0.9 pF Max Between I/O Lines and Ground)
• ESD Rating of Class 3B (Exceeding 8 kV) per Human Body model
and Class C (Exceeding 400 V) per Machine Model
• Protection for the Following IEC Standards:
IEC 61000−4−2 (8 kV Contact)
A
Y
W
G
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
• UL Flammability Rating of 94 V−0
• This is a Pb−Free Device
PIN CONFIGURATION
AND SCHEMATIC
Typical Applications
• HDMI
• DVI
N/C N/C N/C N/C N/C
10
9
8
7
6
• Display Port
• MDDI
• eSATA
MAXIMUM RATINGS
Rating
Symbol
Value
−55 to +125
−55 to +150
260
Unit
°C
1
2
3
4
5
Operating Junction Temperature Range
Storage Temperature Range
T
J
I/O I/O GND I/O I/O
T
stg
°C
Lead Solder Temperature −
Maximum (10 Seconds)
T
L
°C
Pin 1
Pin 2
Pin 4
Pin 5
IEC 61000−4−2 Contact (ESD)
ESD
8.0
kV
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Pin 3
ORDERING INFORMATION
Device
Package
Shipping
ESDR0544MDMR4G Micro−10
(Pb−Free)
1000 /
Tape & Reel
See Application Note AND8308/D for further description of
survivability specs.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
July, 2010 − Rev. 0
ESDR0544M/D
ESDR0544M
ELECTRICAL CHARACTERISTICS (T =25°C unless otherwise specified)
A
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
Conditions
Min
Typ
Max
Unit
V
V
RWM
(Note 1)
= 1 mA, (Note 2)
5.0
V
BR
I
T
6.0
V
Reverse Leakage Current
Junction Capacitance
Junction Capacitance
I
V
V
V
= 5 V
1.0
0.9
0.7
mA
pF
pF
R
RWM
C
= 0 V, f = 1 MHz between I/O Pins and GND
= 0 V, f = 1 MHz between I/O Pins
0.7
0.3
J
J
R
R
C
1. TVS devices are normally selected according to the working peak reverse voltage (V
or continuous peak operating voltage level.
), which should be equal or greater than the DC
RWM
2. V is measured at pulse test current I .
BR
T
http://onsemi.com
2
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
Micro10
CASE 846B−03
ISSUE D
DATE 07 DEC 2004
SCALE 2:1
NOTES:
−A−
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846B−01 OBSOLETE. NEW STANDARD
846B−02
−B−
K
G
PIN 1 ID
D 8 PL
M
S
S
A
0.08 (0.003)
T B
MILLIMETERS
INCHES
DIM MIN
MAX
3.10
3.10
1.10
0.30
MIN
MAX
0.122
0.122
0.043
0.012
C
0.038 (0.0015)
A
B
C
D
G
H
J
2.90
2.90
0.95
0.20
0.114
0.114
0.037
0.008
−T−
SEATING
PLANE
L
H
J
0.50 BSC
0.020 BSC
0.05
0.10
4.75
0.40
0.15
0.21
5.05
0.70
0.002
0.004
0.187
0.016
0.006
0.008
0.199
0.028
SOLDERING FOOTPRINT
K
L
1.04
0.041
0.32
0.0126
10X
10X
GENERIC
MARKING DIAGRAM*
xxxx
AYW
3.20
0.126
4.24
0.167 0.208
5.28
xxxx
= Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
A
Y
W
G
0.50
mm
inches
ǒ
Ǔ
8X0.0196
SCALE 8:1
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Micro10
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON03799D
Micro10
PAGE 1 OF 1
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