CM6310 [ONSEMI]
Data Line Filter, DATA LINE FILTER;
| 型号： | CM6310 |
| 厂家： | 
ONSEMI |
| 描述： | Data Line Filter, DATA LINE FILTER LTE |
| 文件： | 总4页 (文件大小：330K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CM6310
EMI Filter with ESD
Protection for SIM Card
Applications
Product Description
http://onsemi.com
The CM6310 is a 24−bump EMI filter with ESD protection device
for data line application in a 0.5 mm pitch, 5 x 5 CSP form factor. It is
fully compliant with IEC 61000−4−2. The CM6310 is RoHS II
compliant.
Features
• 24−Bump, 2.60 mm X 2.60 mm Footprint Chip Scale Package
• These Devices are Pb−Free and are RoHS Compliant
WLCSP24
CASE 567CJ
ELECTRICAL SCHEMATIC
Input n
R
Output n
I/O
GND
1 of 10 Filter Channels
MARKING DIAGRAM
+
CM6310
WWYY
XXXXXX
CM6310
WWYY
= CM6310
= Date Code
XXXXXX = Last six digits of lot#
ORDERING INFORMATION
†
Device
Package
Shipping
5000/Tape & Reel
CM6310
CSP−24
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
April, 2011 − Rev. 8
CM6310/D
CM6310
PACKAGE / PINOUT DIAGRAMS
Top View
(Bumps Down View)
Bottom View
(Bumps Up View)
Orientation
Marking
1
2
3
4
5
5
4
3
2
1
+
A
B
C
D
E
A
B
C
D
E
A1 Corner
Indicator
CM6310
Table 1. PIN DESCRIPTIONS
Pin
Description
Pin
Description
B1
C1
A2
C2
B2
C3
A5
C4
B5
C5
A3
A4
Channel 1 Input
Channel 2 Input
Channel 3 Input
Channel 4 Input
Channel 5 Input
Channel 6 Input
Channel 7 Input
Channel 8 Input
Channel 9 Input
Channel 10 Input
GND
D1
E1
D2
E2
D3
E3
D4
E4
D5
E5
B3
B4
Channel 1 Output
Channel 2 Output
Channel 3 Output
Channel 4 Output
Channel 5 Output
Channel 6 Output
Channel 7 Output
Channel 8 Output
Channel 9 Output
Channel 10 Output
GND
GND
GND
ELECTRICAL SPECIFICATIONS AND CONDITIONS
Table 2. PARAMETERS AND OPERATING CONDITIONS
Parameter
Rating
Units
°C
Storage Temperature Range
–55 to +150
–40 to +85
Operating Temperature Range
°C
Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
Conditions
Min
900
80
Typ
1000
100
8
Max
1100
120
10
Units
W
R
Resistance
I/O
C
Capacitance per line
At 1 MHz, V = 0 V
pF
V
IN
V
BR
Breakdown voltage (Reverse)
Leakage current at stand off voltage V
I
= 1 mA
6
R
I
V = 3 V per line
RM
500
nA
kV
LEAK
RM
V
ESD
ESD Protection Peak Discharge Voltage
a) Contact Discharge per IEC 61000−4−2
standard
(Note 2)
15
15
b) Air Discharge per IEC 61000−4−2 standard
1. All parameters specified at T = 25°C unless otherwise noted.
A
2. Standard IEC 61000−4−2 with C
= 150 pF, R
= 330 W.
Discharge
Discharge
http://onsemi.com
2
CM6310
RF CHARACTERISTICS
T = 255C, DC bias = 0 V, 50 W Environment Using Evaluation PCB
A
Figure 1. Typical Filter Frequency Response
MECHANICAL SPECIFICATION
Vertical Structure Specification*
Table 4. VERTICAL STRUCTURE DIMENSIONS (nominal)
Ref.
a
Parameter
Die Thickness
Bump Standoff
UBM−(Ti/Cu)
Material
Dimension
406 mm
240 mm
5.0 mm
Silicon
b
Plated Cu
Sputtered Cu
Sputtered Ti
0.4 mm
d
0.1 mm
UBM Wetting Area
Diameter
280 mm
e
f
Solder Bump Diameter
after Bump Reflow
320 mm
c
Metal Pad
AlSiCu
1.5 mm
324 mm
g
Metal Pad Diameter
D2
D1
0.406 mm
0.650 mm
Finished Thickness
Figure 2. Sectional View
* Daisy Chain CM6010
http://onsemi.com
3
CM6310
PACKAGE DIMENSIONS
WLCSP24, 2.6x2.6
CASE 567CJ−01
ISSUE O
NOTES:
D
A
B
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
PIN A1
REFERENCE
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM
A
A1
A2
b
MIN
0.61
0.21
0.41 REF
0.29
MAX
0.69
0.27
E
0.34
D
E
e
2.60 BSC
2.60 BSC
0.50 BSC
2X
0.05
0.05
C
2X
C
TOP VIEW
SIDE VIEW
A2
A
0.05
C
RECOMMENDED
0.05
C
A1
SOLDERING FOOTPRINT*
SEATING
PLANE
NOTE 3
C
PACKAGE
OUTLINE
A1
e
24X
b
0.05
0.03
C A B
E
C
e
D
C
B
0.50
PITCH
24X
0.25
0.50
PITCH
A
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
1
2
3
4
5
BOTTOM VIEW
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
CM6310/D
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