CM6305 [ONSEMI]

带 ESD 保护的 EMI 滤波器;


型号：	CM6305
厂家：	ONSEMI
描述：	带 ESD 保护的 EMI 滤波器 LTE
文件：	总5页 (文件大小：268K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CM6305

EMI Filter with ESD

Protection for SIM Card

Applications

Product Description

http://onsemi.com

The CM6305 is a 3 x 3, 8−bump EMI filter with ESD protection

device for SIM card applications in a 0.4 mm pitch CSP form factor. It

is fully compliant with IEC 61000−4−2. The CM6305 is also RoHS II

compliant.

WLCSP8

CASE 567CE

ELECTRICAL SCHEMATIC

V (C2) {External}

MARKING DIAGRAM

O1 (A3)

O2 (B3)

O3 (C3)

I1 (A2)

I2 (B1)

I3 (C1)

YWW

= CM6305

GND (B2)

YWW = Date Code

PACKAGE / PINOUT DIAGRAMS

ORDERING INFORMATION

Top View

(Bumps Down View)

Bottom View

(Bumps Up View)

†

Device

CM6305

Package

Shipping

Orientation

Marking

WLCSP−8

(Pb−Free)

5000/Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

A3 A2

B3 B2

A1 Corner

Indicator

C3 C2 C1

Table 1. PIN DESCRIPTIONS

Description

Channel 1 Internal

Channel 2 Internal

Channel 3 Internal

V External

Channel 1 External

Channel 2 External

Channel 3 External

GND

Semiconductor Components Industries, LLC, 2011

Publication Order Number:

August, 2011 − Rev. 2

CM6305/D

CM6305

ELECTRICAL SPECIFICATIONS AND CONDITIONS

Table 2. PARAMETERS AND OPERATING CONDITIONS

Parameter

Rating

–55 to +150

–40 to +85

Units

°C

Storage Temperature Range

Operating Temperature Range

°C

Power Dissipation at 70°C per Channel

Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)

Symbol

Parameter

Conditions

Min

Typ

100

Max

120

56.4

120

100

Units

Resistance

37.6

100

Leakage Current per Channel

= 3.0 V

LEAK

Capacitance on Filter Channels 1, 2 and 3

Capacitance on Clamp Channel (pin C2)

Breakdown Voltage (Positive)

At 1 MHz, V = 0 V

= 1 mA

ESD

ESD Protection Peak Discharge Voltage at A2, B1 and C1 pins (Note 2)

a) Contact Discharge per IEC 61000−4−2 standard

b) Air Discharge per IEC 61000−4−2 standard

ESD Protection Peak Discharge Voltage at C2 pin

a) Contact Discharge per IEC 61000−4−2 standard

b) Air Discharge per IEC 61000−4−2 standard

(Note 2)

ESD Protection Peak Discharge Voltage at A3, B3 and C3 pins (Note 2)

a) Contact Discharge per IEC 61000−4−2 standard

b) Air Discharge per IEC 61000−4−2 standard

1. All parameters specified at T = 25°C unless otherwise noted.

2. Standard IEC 61000−4−2 with C

= 150 pF, R

= 330 W.

Discharge

Table 4. CSP TAPE AND REEL SPECIFICATIONS ^†

Pocket Size (mm)

B X A X K

Tape Width

Part Number

Chip Size (mm)

Reel Dia.

Qty Per Reel

CM6305

1.16 X 1.16 X 0.60

1.27 X 1.27 X 0.69

8 mm

178 mm (7″)

5000

4 mm 4 mm

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specification Brochure, BRD8011/D.

http://onsemi.com

CM6305

RF CHARACTERISTICS

Figure 1. Insertion Loss, Filter 1 (pins A2, A3) and Filter 3 (pins C1, C3) (Bias = 0 V, T_A= 255C)

Figure 2. Insertion Loss, Filter 2 (pins B1, B3) (Bias = 0 V, T_A= 255C)

http://onsemi.com

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

WLCSP8, 1.16x1.16

CASE 567CE−01

ISSUE O

SCALE 4:1

DATE 27 JUL 2010

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

PIN A1

REFERENCE

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

MILLIMETERS

DIM

MIN

0.57

0.17

0.41 REF

0.24

MAX

0.63

0.24

0.05

0.29

TOP VIEW

1.16 BSC

0.40 BSC

0.05

RECOMMENDED

SOLDERING FOOTPRINT*

0.05

PACKAGE

OUTLINE

SEATING

PLANE

NOTE 3

SIDE VIEW

^8X0.25

0.05

0.03

A B

0.40

PITCH

0.40

PITCH

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

BOTTOM VIEW

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

DOCUMENT NUMBER:

DESCRIPTION:

98AON50308E

WLCSP8, 1.16X1.16

PAGE 1 OF 1

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

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