CM1220-04CP [ONSEMI]
4 and 8-Channel ESD Protection Arrays in CSP; 4和8通道ESD保护阵列的CSP
| 型号： | CM1220-04CP |
| 厂家： | 
ONSEMI |
| 描述： | 4 and 8-Channel ESD Protection Arrays in CSP |
| 文件： | 总10页 (文件大小：345K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
4 and 8-Channel ESD Protection
Arrays in CSP
CM1220
Features
Functional Description
•
•
•
Four and eight channels of ESD protection
OptiGuardTM coated for improved reliability
15kV ESD protection on each channel
The CM1220 ESD protection arrays are available in four
and eight channel configurations. Each ESD channel
features a nominal capacitance of 14pF making the devices
ideal for protecting high speed I/O ports and LCD and
(IEC 61000-4-2 Level 4, contact discharge)
30kV ESD protection on each channel (HBM)
•
•
camera data lines without significantly affecting signal
integrity. The CM1220 integrates avalanche-type ESD
diodes on every channel, providing a very high level of
protection for sensitive electronic components that may be
subjected to electrostatic discharge (ESD). These diodes
safely dissipate ESD strikes of 15kV, exceeding the
maximum requirement of the IEC61000-4-2 international
standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
CM1220 protect against contact discharges at greater than
30kV.
Chip Scale Package (CSP) features extremely low
lead inductance for optimum ESD protection
5 bump, 0.960mm X 1.330mm CSP footprint
for CM1220-04
•
•
•
10 bump, 1.960mm X 1.330mm CSP footprint
for CM1220-08
RoHS-compliant, lead-free version packaging
Applications
•
•
LCD and camera data lines in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs, etc.
•
•
•
•
Keypads and buttons
These devices are particularly well-suited for portable
electronics (e.g. wireless handsets, PDAs, notebook
computers) because of their small package and easy-to-
use pin assignments. In particular, the CM1220 is ideal for
protecting high speed I/O ports and data and control lines
for the LCD display and camera interface in mobile
handsets.
Wireless handsets
Handheld PCs/PDAs
LCD and camera modules
The CM1220 incorporates CMD’s OptiGuardTM coating for
improved reliability at assembly in a space-saving, low-
profile Chip Scale Package.
Block Diagram
©2010 SCILLC. All rights reserved.
March 2010 – Rev.2
Publication Order Number:
CM1220/D
CM1220
Pin Configurations
Top View
(Bumps Down)
Bottom View
(Bumps Up)
CM1220-04
5-Bump CSP Package
With OptiGuardTM
Top View
(Bumps Down)
Bottom View
(Bumps Up)
CM1220-08
10-Bump CSP Package
With OptiGuardTM
Note:
1). These drawings are not to scale.
Rev.2 | Page 2 of 10 | www.onsemi.com
CM1220
Pin Descriptions
CM1220-08
CM1220-04
CM1220-08
CM1220-04
DESCRIPTION
ESD1 ESD Channel
ESD2 ESD Channel
DESCRIPTION
PINS
NAME
PINS
NAME
PINS
NAME
PINS
NAME
A1
ESD1
A1
A3
C1
C3
C5
C7
B6
ESD5
C1
C3
−
ESD3
ESD Channel
ESD Channel
ESD Channel
ESD Channel
Device Ground
A3
A5
A7
B2
ESD2
ESD3
ESD4
GND
ESD6
ESD7
ESD8
GND
ESD4
ESD Channel
ESD Channel
Device Ground
−
−
−
−
−
−
−
−
B2
GND
−
Ordering Information
Bumps
Package
Ordering Part Number1
Part Marking
5
CSP
CM1220-04CP
J
10
CSP
CM1220-08CP
L208
Note 1: Parts are shipped in Tape and Reel form unless otherwise specified.
Absolute Maximum Ratings
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
°C
Standard Operating Conditions
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
°C
Rev. 2 | Page 3 of 10 | www.onsemi.com
CM1220
Electrical Operating Characteristics (see Note 1)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP MAX UNITS
CDIODE
Diode (Channel) Capacitance
At 2.5VDC Reverse
Bias, 1MHz, 30mVAC
11
14
17
pF
VDIODE
ILEAK
Diode Standoff Voltage
Diode Leakage Current
IDIODE = 10µA
6.0
0.1
V
1
µA
VIN = +3.3V
(reverse bias voltage)
VSIG
VESD
RDYN
Signal Clamp Voltage
Positive Clamp
Negative Clamp
IDIODE = 10mA
5.6
-1.5
6.8
-0.8
9.0
-0.4
V
V
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883, Method 3015
b) Contact Discharge per IEC 61000-4-2
Note 2
30
15
kV
kV
Dynamic Resistance
Positive
Negative
2.3
0.9
Ω
Ω
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time. Unused pins are left open.
Performance Information
Diode Characteristics (nominal conditions unless specified otherwise)
Figure 1. Insertion Loss Vs. Frequency (0V Bias)
Rev.2 | Page 4 of 10 | www.onsemi.com
CM1220
Application Information
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Pad Shape
Round
Non-Solder Mask defined pads
0.290mm Round
0.125mm - 0.150mm
0.300mm Round
50/50 by volume
No Clean
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
OSP (Entek Cu Plus 106A)
+50µm
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183ûC)
+20µm
60 seconds
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
260°C
Non-Solder MaskDefinedPad
0.240mmDIA.
Solder Stencil Opening
0.300mmDIA.
SolderMaskOpening
0.290mmDIA.
Figure 2. Recommended Non-Solder Mask Defined Pad Illustration
Figure 3. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 2 | Page 5 of 10 | www.onsemi.com
CM1220
Mechanical Specifications
The CM1220 is supplied in custom Chip Scale Packages (CSP) depending on the channel count. Dimensions for these
packages are presented in the following pages.
CM1220-04CP Mechanical Specifications
Package Specifications
Custom CSP
5
Package
Bumps
Millimeters
Min Nom Max
Inches
Nom
Dim
Min
Max
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
0.915 0.960 1.005 0.0360 0.0378 0.0396
1.285 1.330 1.375 0.0506 0.0524 0.0541
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.575 0.644 0.714 0.0226 0.0254 0.0281
Package Dimensions for CM1220-04CP Chip Scale
Package
0.368
0.419 0.470 0.0145 0.0165 0.0185
3500 pieces
# per tape and
reel
Controlling dimension: millimeters
Rev.2 | Page 6 of 10 | www.onsemi.com
CM1220
CSP Tape and Reel Specifications
POCKET SIZE (mm) TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
PART NUMBER
CHIP SIZE (mm)
B0 X A0 X K0
P0
P1
CM1220-04
1.33 X 0.96 X 0.644
1.42 X 1.07 X 0.740
8mm
178mm (7")
3500
4mm 4mm
Rev. 2 | Page 7 of 10 | www.onsemi.com
CM1220
CM1220-08CP Mechanical Specifications
Package Specifications
Custom CSP
10
Package
Bumps
Millimeters
Min Nom Max
Inches
Nom
Dim
Min
Max
1.915 1.960 2.005 0.0754 0.0772 0.0789
1.285 1.330 1.375 0.0506 0.0524 0.0541
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.091 0.0110
0.575 0.644 0.714 0.0226 0.0254 0.0281
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
Package Dimensions for CM1220-08CP Chip Scale
Package
0.368
0.419 0.470 0.0145 0.0165 0.0185
3500 pieces
# per tape and
reel
Controlling dimension: millimeters
Rev.2 | Page 8 of 10 | www.onsemi.com
CM1220
CSP Tape and Reel Specifications
POCKET SIZE (mm) TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
PART NUMBER
CHIP SIZE (mm)
B0 X A0 X K0
P0
P1
CM1220-08
1.96 X 1.33 X 0.644
8mm
178mm (7")
3500
4mm 4mm
2.08 X 1.45 X 0.740
Rev. 2 | Page 9 of 10 | www.onsemi.com
CM1220
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
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Rev.2 | Page 10 of 10 | www.onsemi.com
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