CAT32RD4-TE13 [ONSEMI]
LED DISPLAY DRIVER, DSO8, 3 X 3 MM, 0.80 MM HEIGHT, TDFN-8;型号: | CAT32RD4-TE13 |
厂家: | ONSEMI |
描述: | LED DISPLAY DRIVER, DSO8, 3 X 3 MM, 0.80 MM HEIGHT, TDFN-8 驱动 接口集成电路 |
文件: | 总15页 (文件大小:215K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Preliminary Information
CAT32
CMOS White LED Driver
FEATURES
■ Low Quiescent Ground Current (0.5mA typical)
■ Power Efficiency over 80%
■ Drives up to 4 White LEDs in series
■ Shutdown current less than 1µA
■ Compatible Pinout with LT1932
■ Load fault protection against open-circuits
■ Low Value External Components
■ Adjustable Output Current (up to 40mA)
■ High Frequency 1.2MHz Operation
■ Input Voltage Operation down to 2.0V
■ Low profile (1mm) 6-Lead SOT23 and TDFN
(0.8mm) package
■ Low Resistance (0.5Ω) High Voltage
Power Switch
APPLICATIONS
■ Color LCD and keypad backlighting
■ Cellular phones
■ Digital Cameras
■ PDAs/Games
■ Handheld terminals
■ Portable MP3 players
DESCRIPTION
The CAT32 is a DC/DC step up converter that delivers
a regulated output current. Operation at a constant
switching frequency of 1.2MHz allows the device to be
used with very small value external inductor and ceramic
capacitors.
A high voltage output stage allows up to 4 White LEDs
to be driven in series. Series drive provides inherent
current matching.
LED dimming can be done by using a DC voltage, a
logic signal, or a pulse width modulation (PWM) signal.
The shutdown input pin allows the device to be placed
in power-down mode with “near zero” quiescent current.
The CAT32 is targeted to drive multiple white light-
emitting diodes (LEDs) connected in series and provides
the necessary regulated current to control the brightness
and the color purity. An external resistor RSET controls
the output current level. LED currents of up to 40mA
can be supported over a wide range of input supply
voltages from 2V to 7V, making the device ideal for
battery-powered applications.
In addition to overcurrent limiting protection, the device
also includes detection circuitry to ensure protection
against open-circuit load fault conditions.
The device is available in a low profile (1mm max height)
6-lead thin SOT23 package and in a TDFN (0.8mm max
height) package.
TYPICAL APPLICATION
VIN
2.7V to 4.2V
D1
6
1
SW
VIN
CAT32
PWM
DIMMING
CONTROL
5
3
LED
SHDN
GND
2
RSET
4
15mA
C1: Taiyo Yuden JMK212BJ475
C2: Taiyo Yuden EMK212BJ105
D1: Zetez ZHCS400
SOT23 Pin Numbers
L1: Sumida CLQ4D106R8
(Panasonic ELJEA6R8)
Figure 1. Li-Ion Driver for Four High-Brightness White LEDs
© 2003 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
Doc No. 5001, Rev. X
1
CAT32
ORDERING INFORMATION
Tube
Quantity
Reel
Quantity
Package
Marking Code
Temperature
Range
Part Number
Package
6-lead, SOT23 (1mm
height) Tape & Reel
CAT32EKT-TE13
3000
3500
3500
BD
-40° C to 85° C
-40° C to 85° C
-40° C to 85° C
—
—
—
8-pad TDFN (3x4.9mm,
MSOP Footprint)
Tape & Reel
CAT32RD2-TE13
CAT32RD4-TE13
CCEL
CCEM
8-pad TDFN (3x3mm)
Tape & Reel
8-pad TDFN (3x4.9mm,
MSOP Footprint)
CAT32RD2
CAT32RD4
120
120
CCEL
-40° C to 85° C
-40° C to 85° C
—
—
8-pad TDFN (3x3mm)
CCEM
PIN CONFIGURATION
Power
1
8
8
7
6
5
1
2
3
4
SW
Power GROUND
VIN
SW
SW
GND
LED
1
2
3
6
5
4
VIN
GROUND
7
6
5
NC
2
NC
VIN
SHDN
RSET
CAT32
SHDN
LED
GND
LED
GND
3
SHDN
RSET
RSET
4
6-Lead SOT-23
1mm maximum height
(Top View)
(Top View)
TDFN Package: 3mm x 4.9mm
0.8mm maximum height
(RD2)
TDFN Package: 3mm x 3mm
0.8mm maximum height
(RD4)
θ
[Free Air]
PIN DESCRIPTIONS
Pin Number
SOT23
Pin Number
TDFN
Name
Function
1
8
SW
Switch pin. This is the drain of the internal power
switch. For minimum EMI, minimize the trace
area connected to this pin.
2
3
4
5
6
4
GND
LED
Ground pin. Connect pin 2 to ground.
LED (cathode) connection pin.
RSET
RESET pin. A resistor connected from pin 4 to
ground sets the LED current. This pin is also
used to dim the LEDs.
5
6
3
2
SHDN
Shutdown pin.
VIN
Input supply pin. This pin should be bypassed
with a capacitor to ground. A 4.7µF capacitor
mounted close to the pin is recommended.
—
1
Power
Power Ground
Ground
Doc. No. 5001, Rev. X
2
CAT32
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional operation is not implied. Exposure to absolute maximum ratings for
prolonged time periods may affect device reliability. All voltages are with respect to ground.
VIN , LED, SHDN Voltage ....................................... 8V
SW Voltage ........................................................... 20V
RSET Voltage ......................................................... 1V
Junction Temperature ....................................... 125°C
Lead Soldering Temperature (10 secs) ............ 300°C
Storage Temperature.......................... -65°C to 150°C
ESD Rating - Human Body Model .................... 2000V
RECOMMENDED OPERATING CONDITIONS
Parameter
VIN
Range
2 to 7
Unit
V
° C
µH
µF
Ambient Temperature Range
Inductor L1
-40 to +85
6.8 ±20% typical
4.7 ±20% typical
1.0 ±20% typical
0 to 20
Input Capacitor C1
Output Capacitor C2
ILED with 1 to 4 LEDs in series
µF
mA
ELECTRICAL SPECIFICATIONS
Over recommended operating conditions unless otherwise specified. TA = 25°C, VIN = 2V and VSHDN = 1.2V.
Symbol
IQ
Parameter
Conditions
VRSET = 0.2V
Min
Typ
0.5
Max
0.7
1
Units
mA
µA
Quiescent Current
IGND
Ground Current in Shutdown
LED Pin Voltage
VSHDN = 0V
0.05
120
VLED
ILED
VIN < VOUT, ILED =15mA
180
40
mV
mA
LED Current Adjust Range
5
RSET = 562Ω
33
38
30
15
5
45
RSET = 750Ω
25
36
ILED
Programmed LED Current
mA
RSET = 1.5kΩ
12.5
17.5
RSET = 4.53kΩ
ILED = 15mA
ILED
LED Pin Current Temperature Coefficient
RSET Pin Voltage
-0.01
100
mA/° C
mV
VRSET
RSET = 1.5kΩ
Shutdown Pin Logic High Level
0.85
V
Shutdown Pin Logic Low Level
0.25
V
fSW
Boost Converter Frequency
Switch Current Limit
0.8
1.2
550
0.7
1.6
780
1.2
MHz
mA
Ω
ISWL
400
VIN = 2V, ISW = 100mA
VIN = 3V, ISW = 100mA
RSW
Switch Resistance
Ω
0.5
0.9
5
Switch Leakage Current
Efficiency
Switch Off, VSW = 5V
0.01
µA
Components shown
on Figure 1
83
%
Doc No. 5001, Rev. X
3
CAT32
TYPICAL CHARACTERISTICS
VIN=3.6V, TAMB=25˚C, CIN=4.7µF, COUT=1µF, L=6.8µH, unless otherwise specified.
Quiescent Current vs. Input Voltage
Quiescent Current vs. Temperature
600
600
500
400
300
200
VIN = 7V
VIN = 2V
500
400
300
200
2
3
4
5
INPUT VOLTAGE [V]
6
7
-50 -25
0
25
50
75
100 125
Switching Frequency vs. Input Voltage
Switching Frequency vs. Temperature
2.00
2.0
1.6
1.2
0.8
0.4
0.0
1.60
1.20
0.80
0.40
0.00
2
3
4
5
6
7
-50 -25
0
25
50
75 100 125
INPUT VOLTAGE [V]
LED Current vs. Input Voltage
LED Current vs. Temperature
35
30
25
20
15
10
5
20
15
10
5
Rset = 750
Rset = 1.13k
Rset = 1.5k
Rset = 2.26k
0
0
2
3
4
5
6
7
-50
-25
0
25
50
75
100 125
INPUT VOLTAGE [V]
Doc. No. 5001, Rev. X
4
CAT32
TYPICAL CHARACTERISTICS
VIN=3.6V,TAMB=25˚C, CIN=4.7µF, COUT=1µF, L=6.8µH, unless otherwise specified.
Switch Resistance vs. Input Voltage
Switch Resistance vs. Temperature
1.0
1.0
0.8
0.6
0.4
0.2
0.0
0.8
0.6
0.4
0.2
0.0
VIN = 3V
2
3
4
5
6
-50
-25
0
25
50
75
100 125
INPUT VOLTAGE [V]
LED Pin Voltage vs. LED current
Vsw, IL, & Vout Signal Waveforms
300
250
200
150
100
50
0
0
816
24
32
LED CURRENT [mA]
40
VIN = 3.7V with 15mA load through 4 LEDs
H inductor
Inductor Current Waveform
(VIN = 2.7V, 15mA load)
5kHz PWM Shutdown Response
(VIN = 2.7V, 15mA load)
Doc No. 5001, Rev. X
5
CAT32
OPERATION
possible. A low LED pin voltage ensures high efficiency.
The CAT32 device is a high efficiency, constant
frequency, current regulating boost converter.
Currentthroughtheinternalpowerswitchiscontinuously
monitoredcycle-by-cycle.Ifthecurrentlimitisexceeded,
the switch is immediately turned off, protecting the
device, for the remainder of the cycle.
The device includes a switch and an internally
compensated loop for the regulation of the LED current.
Operation can be best understood by examining the
blockdiagram. TheRSETpinisregulatedat100mVand
the current through the external resistor will set the
regulated current in the LEDs (from 5mA to 40mA) with
a multiplication factor of 225.
PWM dimming operation can be achieved by switching
the SHDN pin or by pulling the RSET pin higher than
0.1V.
While maintaining LED current regulation, the CAT32
automaticallyadjuststheLEDpinvoltagetobeaslowas
BLOCK DIAGRAM
L1
D1
Vin
C1
1
C2
SW
Over Voltage
Protection
(22V)
1.2 MHz
Oscillator
LED
-
PWM
& Logic
+
3
I
LED
+
-
CAT32
Current
Sense
Amp
100mV
6
5
V
IN
Current
Control
SHDN
I
= 225 x I
S
LED
SOT23 Pin Numbers
225x
I
R
S
GND
SET
4
2
R
SET
Figure 2. CAT32 Block Diagram
Doc. No. 5001, Rev. X
6
CAT32
APPLICATION INFORMATION
Inductor Selection and Efficiency
Inductor vendors are shown below. Contact the manufacturer for detailed technical data and new product information.
Table 1: Inductor Manufacturers
Inductor
L (µH)
Maximum
Maximum
Vendor
Web
DCR (mΩ)
Height (mm)
ELJEA4R7
ELJEA6R8
4.7
6.8
180
250
2.2
2.2
Panasonic
714.373.7334
www.panasonic.com
LQH3C4R7M24,
LQH32CN4R7M11
LQH3C100K24,
LQH32CN100K11
4.7
260
2.2
Murata
10
300
2.2
770.436.1300
www.murata.com
www.t-yuden.com
www.sumida.com
LB2016B4R7
LB2016B100
4.7
3.8
250
350
2.0
2.0
Taiyo Yuden
408.573.4150
CMD4D06-4R7
CMD4D06-6R8
CLQ4D10-4R7
CLQ4D10-6R8
4.7
6.8
4.7
6.8
216
296
162
195
0.8
0.8
1.2
1.2
Sumida
847.956.0666
CAPACITOR SELECTION
LowESR(equivalentseriesresistance)capacitorsshould
be used at the output to minimize the output ripple
voltage. The low ESR and small package options
available with multilayer ceramic capacitors make them
excellentchoices.TheX5RandX7Rcapacitortypesare
preferred because they retain their capacitance over
wider voltage and temperature ranges than the Y5V or
Z5U types. A 1.0µF or 2.2µF output capacitor is
recommended for most applications.
Low profile ceramic capacitors with a 1mm maximum
height/thickness are available for designs height
requirements. Ceramic capacitors also make a good
choice for the input capacitor, which should be mounted
as close as possible to the CAT32. A 2.2µF or 4.7µF
input capacitor is recommended. Table 2 shows a list of
several ceramic capacitor manufacturers. Consult the
manufacturers for detailed information as new products
and package options are introduced regularly.
ThevoltageratingoftheoutputcapacitorC2dependson
the number of LEDs driven in series. A 10V ceramic
capacitor is recommended when driving two LEDs. A
16V ceramic capacitor is recommended when driving 3
or 4 LEDs.
Table 2: Ceramic Capacitor Manufacturers
Supplier
Taiyo Yuden
Murata
Phone
Web
408.573.4150
814.237.1431
408.986.0424
www.t-yuden.com
www.murata.com
www.kemet.com
Kemet
Doc No. 5001, Rev. X
7
CAT32
DIODE SELECTION
output voltage. The diode conducts current only when
the power switch is turned off (typically less than one-
third the time), so a 0.4A or 0.5A diode will be sufficient
for most designs.
Schottky diodes, with their low forward voltage drop and
fast switching speed, are the ideal choice for high
efficiency applications. Table 3 shows several different
Schottky diodes that work well with the CAT32. Make
sure that the diode has a voltage rating greater than the
Table 3: Schottky Diode Suppliers
Part
Supplier
MBR0520
MBR0530
MBR0540
ZHCS400
ON Semiconductor
www.onsemi.com
800.282.9855
Zetex
LED CURRENT PROGRAMMING
regulates the current into the LED pin, ILED, to 225 times
the value of ISET. For the best accuracy, a 1% or better
resistor is recommended. Table 4 shows several typical
1% RSET values.
The LED current is programmed with a single resistor
connected to the RSET pin The RSET pin is internally
regulated to 100mV, which sets the current flowing out
of this pin, ISET, equal to 100mV/RSET. The CAT32
Table 4: RSET Resistor Values
ILED (mA)
RSET
40
30
25
20
15
10
5
562Ω
750Ω
909Ω
1.13kΩ
1.50kΩ
2.26kΩ
4.53kΩ
For other LED current values, use the following equation to choose RSET
.
0.1V
RSET = 225 ×
ILED
Most white LEDs are driven at maximum currents of 15mA to 20mA. Some higher power designs will use two parallel
strings of LEDs for greater light output, resulting in 30mA to 40mA (two strings of 15mA to 20mA) flowing into the LED
pin.
Doc. No. 5001, Rev. X
8
CAT32
LED DIMMING WITH PWM SIGNAL
PWM brightness control provides the widest dimming
range (greater than 20:1). By turning the LEDs ON and
OFF using the control signal the LEDs operate at either
zero or full current, but their average current changes
with the PWM signal duty cycle. Typically, a 5kHz to
40kHz PWM signal is used. PWM dimming with the
CAT32 can be accomplished two different ways.
In addition to providing the widest dimming range, PWM
brightness control also ensures the “purest” white LED
color over the entire dimming range. The true color of a
white LED changes with operating current, and is the
“purest” white at a specific forward current, usually
15mA or 20mA. If the LED current is less than or more
than this value, the emitted light becomes more blue.
Applications involving color LCDs can find the blue tint
objectionable.
The SHDN pin can be driven directly or a resistor can be
added to drive the RSET pin. If the SHDN pin is used,
increasing the duty cycle will increase the LED bright-
ness. Using this method, the LEDs can be dimmed and
turned off completely using the same control signal. A
0%dutycyclesignalwillturnofftheCAT32, reducingthe
total quiescent current to near zero.
When a PWM control signal is used to drive the SHDN
pin of the CAT32, the LEDs are turned off and on at the
PWM frequency. The current through them alternates
between full current and zero current, so the average
current changes with duty cycle. This ensures that when
the LEDs are on, they can be driven at the appropriate
current to give the purest white light. LED brightness
varies linearly with the PWM duty cycle.
If the RSET pin is used, increasing the duty cycle will
decrease the brightness. Using this method, the LEDs
aredimmedusingRSETandturnedoffcompletelyusing
SHDN. IftheRSETpinisusedtoprovidePWMdimming,
the approximate value of RPWM should be calculated
(where VMAX is the “HIGH” value of the PWM signal):
VMAX
RPWM = RSET
×
− 1
0.15V
LED DIMMING WITH A LOGIC SIGNAL
RINCR determines how much LED current increases
when the external NMOS switch is turned ON.
For applications that need to adjust the LED brightness
in discrete steps, a logic signal can be used. RMIN sets
the minimum LED current value (when the NMOS is
OFF):
0.1V
RINCR = 225 ×
ILED(Increase)
0.1V
RMIN = 225 ×
ILED(MIN)
LED DIMMING WITH A DC VOLTAGE
VMAX − 0.1V
RADJ = 225 ×
ILED(MAX)
−ILEAD(MIN)
CAT32
SHDN
5
CAT32
CAT32
CAT32
CAT32
RSET
4
RSET
4
RSET
4
RSET
R
4
INCR
10kΩ
R
R
R
PWM
ADJ
PWM
PWM
V
PWM
PWM
DC
LOGIC
SIGNAL
R
R
R
R
0.1µF
SET
SET
SET
MIN
Figure 3: LED Dimming Circuits
Doc No. 5001, Rev. X
9
CAT32
PCB LAYOUT GUIDELINES
The CAT32 is a high-frequency switching regulator and
therefore proper PCB board layout and component
placementcanminimizenoiseandradiationandincrease
efficiency. To maximize efficiency, the CAT32 design
has fast switch rise and fall times. To prevent radiation
and high frequency resonance problems minimize the
lengthandareaofalltracesconnectedtotheSWpinand
use a ground plane under the switching regulator.
The switch, schottky output diode and output capacitor
signal path should be kept as short as possible. The
ground connection for the RSET resistor should be tied
directly to the GND pin and not be shared with other
components.
TYPICAL APPLICATION CIRCUITS
The application diagrams below are shown for the SOT23 packages.
Two LEDs with DC Level Dimming Control:
D1
VIN
6
1
VIN
SW
CAT32
5
3
SHDN
LED
RSET
4
GND
2
15mA
2.5V DC
DIMMING
CONTROL
Three LEDs with DC Level Dimming Control:
Efficiency - Three LEDs
D1
85
VIN
Vin = 4.2V
80
75
70
65
60
6
1
Vin = 3.0V
VIN
SW
CAT32
5
3
SHDN
LED
RSET
4
GND
2
15mA
2.5V DC
DIMMING
CONTROL
0
5
10
15
20
LED CURRENT [mA]
Doc. No. 5001, Rev. X
10
CAT32
Efficiency - Four LEDs
Four LEDs with PWM Dimming Control:
D1
85
VIN
Vin = 4.2V
80
75
70
65
60
6
1
Vin = 3.0V
VIN
SW
CAT32
PWM
DIMMING
CONTROL
5
3
SHDN
LED
RSET
4
GND
2
15mA
0
5
10
15
20
LED CURRENT [mA]
Doc No. 5001, Rev. X
11
CAT32
PACKAGE OUTLINES
6 LEAD SOT-23
(AA OPTION)
3
4
aaa C 2X
D
D
H
e1
B
A
5
B
N/2
+1
N
VIEW A-A
SEE VIEW C
E/2
E1/2
R1
E1
E
3
4
R
GAUGE
PLANE
L2
L
aaa C D
SEATING
PLANE
C
2X
(L1)
VIEW C
1
2
N/2
bbb
C
(b)
b1
WITH METAL
e
2X N/2 TIPS
B
NX
b
5
M
ddd C A B D
c
c1
BASE METAL
SECTION B - B
7
b
5
8
A
5
e/2
X
A2
ccc
C
A
NX
X=A &/or B
X
X=A &/or B
A1
SEATING
PLANE
ODD LEAD SIDES
TOP VIEW
EVEN LEAD SIDES
TOP VIEW
A
C
All Dimensions are in Millimeters
Min
—
Nom
—
Max
1.00
0.10
0.90
0.20
0.16
Notes
Tolerances of Form and Position
Notes
A
aaa
bbb
ccc
0.15
0.25
0.10
1,2
1,2
1,2
A1
A2
c
0.01
0.84
0.12
0.08
0.05
0.87
0.15
7
Variations
6 AB
c1
D
0.13
7
AA
Nom
—
BA
2.90BSC
2.80BSC
1.60BSC
0.40
3,4
3,4
3,4
Min
Max
0.45
0.39
Min
0.30
0.31
Nom
—
Max
0.45
0.39
Min
0.22
0.22
Nom
—
Max Notes
E
b
0.30
0.31
0.36
0.30
7,8
E1
L
b1
e
0.35
0.35
0.26
0.30
0.50
0.95BSC
1.90BSC
6
0.95BSC
1.90BSC
5
0.65BSC
1.95BSC
8
L1
L2
R
0.60REF
0.25BSC
—
e1
N
0.10
0.10
0°
—
0.25
8°
Tolerances of Form and Position
R1
θ
—
ddd
0.20
0.20
0.13
1,2
Notes:
4°
1. Dimensions and tolerancing per ASME Y14.5M - 1994
2. Dimension are in mm.
3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.15mm per side. D and E1 dimensions are determined at Datum H.
θ1
4°
10°
12°
4. The package top may be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, the bar
burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. D and E1 dimensions are determined at Datum H.
5. Datums A & B to be determined at Datum H.
6. Package varation "AB" is a 5 lead version of the 6 lead variation "AA" where lead #5 has been removed from the 6 lead "AA" variation.
7. These dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip.
8. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the "b" dimension at maximum material condition. The dambar
cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07mm.
Doc. No. 5001, Rev. X
12
CAT32
TDFN 3X3 PACKAGE (RD4)
0.75 + 0.05
A
8
5
B
2X
2X
0.15
C
1
4
3.00 + 0.10
(S)
0.0 - 0.05
0.15
C
PIN 1 INDEX AREA
5
8
0.75 + 0.05
2.30 + 0.10
C0.35
C
0.25 min.
PIN 1 ID
0.30 + 0.10 (8x)
1
0.30 + 0.07 (8x)
0.65 TYP. (6x)
1.95 REF. (2x)
NOTE:
1. ALL DIMENSION ARE IN mm. ANGLES IN DEGREES.
2. COPLANARITY SHALL NOT EXCEED 0.08 mm.
3. WARPAGE SHALL NOT EXCEED 0.10 mm.
4. PACKAGE LENGTH / PACKAGE WIDTH ARE CONSIDERED AS SPECIAL CHARACTERISTIC(S)
5. REFER JEDEC MO-229 / WEEC
Doc No. 5001, Rev. X
13
CAT32
TDFN 3X4.9 PACKAGE (RD2)
A
5
8
8
5
B
2.00 + 0.15
0.15
0.20
0.60 + 0.10 (8X)
PIN 1 ID
2x
d
0.15 c
1
4
3.00 + 0.10
(S)
4
1
0.65 TYP. (6x)
2x
d
0.15 c
0.30 + 0.05 (8X)
8x
PIN 1 INDEX AREA
1.95 REF. (2x)
j
0.10m C A B
0.75 + 0.05
f 0.10 c
0.20 REF.
8x
d 0.08 c
C
NOTE:
1. ALL DIMENSION ARE IN mm. ANGLES IN DEGREES.
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
COPLANARITY SHALL NOT EXCEED 0.08mm.
3. WARPAGE SHALL NOT EXCEED 0.10mm.
4. PACKAGE LENGTH / PACKAGE WIDTH ARE CONSIDERED AS SPECIAL
CHARACTERISTIC(S).
5. REFER TO JEDEC MO-229, FOOTPRINTS ARE COMPATIBLE TO 8 MSOP.
0.0-0.05
Doc. No. 5001, Rev. X
14
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Publication #: 5001
Revison:
Issue date:
Type:
X
9/11/03
Preliminary
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