CAT32RD4-TE13 [ONSEMI]

LED DISPLAY DRIVER, DSO8, 3 X 3 MM, 0.80 MM HEIGHT, TDFN-8;
CAT32RD4-TE13
型号: CAT32RD4-TE13
厂家: ONSEMI    ONSEMI
描述:

LED DISPLAY DRIVER, DSO8, 3 X 3 MM, 0.80 MM HEIGHT, TDFN-8

驱动 接口集成电路
文件: 总15页 (文件大小:215K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Preliminary Information  
CAT32  
CMOS White LED Driver  
FEATURES  
Low Quiescent Ground Current (0.5mA typical)  
Power Efficiency over 80%  
Drives up to 4 White LEDs in series  
Shutdown current less than 1µA  
Compatible Pinout with LT1932  
Load fault protection against open-circuits  
Low Value External Components  
Adjustable Output Current (up to 40mA)  
High Frequency 1.2MHz Operation  
Input Voltage Operation down to 2.0V  
Low profile (1mm) 6-Lead SOT23 and TDFN  
(0.8mm) package  
Low Resistance (0.5) High Voltage  
Power Switch  
APPLICATIONS  
Color LCD and keypad backlighting  
Cellular phones  
Digital Cameras  
PDAs/Games  
Handheld terminals  
Portable MP3 players  
DESCRIPTION  
The CAT32 is a DC/DC step up converter that delivers  
a regulated output current. Operation at a constant  
switching frequency of 1.2MHz allows the device to be  
used with very small value external inductor and ceramic  
capacitors.  
A high voltage output stage allows up to 4 White LEDs  
to be driven in series. Series drive provides inherent  
current matching.  
LED dimming can be done by using a DC voltage, a  
logic signal, or a pulse width modulation (PWM) signal.  
The shutdown input pin allows the device to be placed  
in power-down mode with “near zero” quiescent current.  
The CAT32 is targeted to drive multiple white light-  
emitting diodes (LEDs) connected in series and provides  
the necessary regulated current to control the brightness  
and the color purity. An external resistor RSET controls  
the output current level. LED currents of up to 40mA  
can be supported over a wide range of input supply  
voltages from 2V to 7V, making the device ideal for  
battery-powered applications.  
In addition to overcurrent limiting protection, the device  
also includes detection circuitry to ensure protection  
against open-circuit load fault conditions.  
The device is available in a low profile (1mm max height)  
6-lead thin SOT23 package and in a TDFN (0.8mm max  
height) package.  
TYPICAL APPLICATION  
VIN  
2.7V to 4.2V  
D1  
6
1
SW  
VIN  
CAT32  
PWM  
DIMMING  
CONTROL  
5
3
LED  
SHDN  
GND  
2
RSET  
4
15mA  
C1: Taiyo Yuden JMK212BJ475  
C2: Taiyo Yuden EMK212BJ105  
D1: Zetez ZHCS400  
SOT23 Pin Numbers  
L1: Sumida CLQ4D106R8  
(Panasonic ELJEA6R8)  
Figure 1. Li-Ion Driver for Four High-Brightness White LEDs  
© 2003 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 5001, Rev. X  
1
CAT32  
ORDERING INFORMATION  
Tube  
Quantity  
Reel  
Quantity  
Package  
Marking Code  
Temperature  
Range  
Part Number  
Package  
6-lead, SOT23 (1mm  
height) Tape & Reel  
CAT32EKT-TE13  
3000  
3500  
3500  
BD  
-40° C to 85° C  
-40° C to 85° C  
-40° C to 85° C  
8-pad TDFN (3x4.9mm,  
MSOP Footprint)  
Tape & Reel  
CAT32RD2-TE13  
CAT32RD4-TE13  
CCEL  
CCEM  
8-pad TDFN (3x3mm)  
Tape & Reel  
8-pad TDFN (3x4.9mm,  
MSOP Footprint)  
CAT32RD2  
CAT32RD4  
120  
120  
CCEL  
-40° C to 85° C  
-40° C to 85° C  
8-pad TDFN (3x3mm)  
CCEM  
PIN CONFIGURATION  
Power  
1
8
8
7
6
5
1
2
3
4
SW  
Power GROUND  
VIN  
SW  
SW  
GND  
LED  
1
2
3
6
5
4
VIN  
GROUND  
7
6
5
NC  
2
NC  
VIN  
SHDN  
RSET  
CAT32  
SHDN  
LED  
GND  
LED  
GND  
3
SHDN  
RSET  
RSET  
4
6-Lead SOT-23  
1mm maximum height  
(Top View)  
(Top View)  
TDFN Package: 3mm x 4.9mm  
0.8mm maximum height  
(RD2)  
TDFN Package: 3mm x 3mm  
0.8mm maximum height  
(RD4)  
θ
[Free Air]  
PIN DESCRIPTIONS  
Pin Number  
SOT23  
Pin Number  
TDFN  
Name  
Function  
1
8
SW  
Switch pin. This is the drain of the internal power  
switch. For minimum EMI, minimize the trace  
area connected to this pin.  
2
3
4
5
6
4
GND  
LED  
Ground pin. Connect pin 2 to ground.  
LED (cathode) connection pin.  
RSET  
RESET pin. A resistor connected from pin 4 to  
ground sets the LED current. This pin is also  
used to dim the LEDs.  
5
6
3
2
SHDN  
Shutdown pin.  
VIN  
Input supply pin. This pin should be bypassed  
with a capacitor to ground. A 4.7µF capacitor  
mounted close to the pin is recommended.  
1
Power  
Power Ground  
Ground  
Doc. No. 5001, Rev. X  
2
CAT32  
ABSOLUTE MAXIMUM RATINGS  
These are stress ratings only and functional operation is not implied. Exposure to absolute maximum ratings for  
prolonged time periods may affect device reliability. All voltages are with respect to ground.  
VIN , LED, SHDN Voltage ....................................... 8V  
SW Voltage ........................................................... 20V  
RSET Voltage ......................................................... 1V  
Junction Temperature ....................................... 125°C  
Lead Soldering Temperature (10 secs) ............ 300°C  
Storage Temperature.......................... -65°C to 150°C  
ESD Rating - Human Body Model .................... 2000V  
RECOMMENDED OPERATING CONDITIONS  
Parameter  
VIN  
Range  
2 to 7  
Unit  
V
° C  
µH  
µF  
Ambient Temperature Range  
Inductor L1  
-40 to +85  
6.8 ±20% typical  
4.7 ±20% typical  
1.0 ±20% typical  
0 to 20  
Input Capacitor C1  
Output Capacitor C2  
ILED with 1 to 4 LEDs in series  
µF  
mA  
ELECTRICAL SPECIFICATIONS  
Over recommended operating conditions unless otherwise specified. TA = 25°C, VIN = 2V and VSHDN = 1.2V.  
Symbol  
IQ  
Parameter  
Conditions  
VRSET = 0.2V  
Min  
Typ  
0.5  
Max  
0.7  
1
Units  
mA  
µA  
Quiescent Current  
IGND  
Ground Current in Shutdown  
LED Pin Voltage  
VSHDN = 0V  
0.05  
120  
VLED  
ILED  
VIN < VOUT, ILED =15mA  
180  
40  
mV  
mA  
LED Current Adjust Range  
5
RSET = 562  
33  
38  
30  
15  
5
45  
RSET = 750Ω  
25  
36  
ILED  
Programmed LED Current  
mA  
RSET = 1.5kΩ  
12.5  
17.5  
RSET = 4.53kΩ  
ILED = 15mA  
ILED  
LED Pin Current Temperature Coefficient  
RSET Pin Voltage  
-0.01  
100  
mA/° C  
mV  
VRSET  
RSET = 1.5kΩ  
Shutdown Pin Logic High Level  
0.85  
V
Shutdown Pin Logic Low Level  
0.25  
V
fSW  
Boost Converter Frequency  
Switch Current Limit  
0.8  
1.2  
550  
0.7  
1.6  
780  
1.2  
MHz  
mA  
ISWL  
400  
VIN = 2V, ISW = 100mA  
VIN = 3V, ISW = 100mA  
RSW  
Switch Resistance  
0.5  
0.9  
5
Switch Leakage Current  
Efficiency  
Switch Off, VSW = 5V  
0.01  
µA  
Components shown  
on Figure 1  
83  
%
Doc No. 5001, Rev. X  
3
CAT32  
TYPICAL CHARACTERISTICS  
VIN=3.6V, TAMB=25˚C, CIN=4.7µF, COUT=1µF, L=6.8µH, unless otherwise specified.  
Quiescent Current vs. Input Voltage  
Quiescent Current vs. Temperature  
600  
600  
500  
400  
300  
200  
VIN = 7V  
VIN = 2V  
500  
400  
300  
200  
2
3
4
5
INPUT VOLTAGE [V]  
6
7
-50 -25  
0
25  
50  
75  
100 125  
Switching Frequency vs. Input Voltage  
Switching Frequency vs. Temperature  
2.00  
2.0  
1.6  
1.2  
0.8  
0.4  
0.0  
1.60  
1.20  
0.80  
0.40  
0.00  
2
3
4
5
6
7
-50 -25  
0
25  
50  
75 100 125  
INPUT VOLTAGE [V]  
LED Current vs. Input Voltage  
LED Current vs. Temperature  
35  
30  
25  
20  
15  
10  
5
20  
15  
10  
5
Rset = 750  
Rset = 1.13k  
Rset = 1.5k  
Rset = 2.26k  
0
0
2
3
4
5
6
7
-50  
-25  
0
25  
50  
75  
100 125  
INPUT VOLTAGE [V]  
Doc. No. 5001, Rev. X  
4
CAT32  
TYPICAL CHARACTERISTICS  
VIN=3.6V,TAMB=25˚C, CIN=4.7µF, COUT=1µF, L=6.8µH, unless otherwise specified.  
Switch Resistance vs. Input Voltage  
Switch Resistance vs. Temperature  
1.0  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0.8  
0.6  
0.4  
0.2  
0.0  
VIN = 3V  
2
3
4
5
6
-50  
-25  
0
25  
50  
75  
100 125  
INPUT VOLTAGE [V]  
LED Pin Voltage vs. LED current  
Vsw, IL, & Vout Signal Waveforms  
300  
250  
200  
150  
100  
50  
0
0
816  
24  
32  
LED CURRENT [mA]  
40  
VIN = 3.7V with 15mA load through 4 LEDs  
H inductor  
Inductor Current Waveform  
(VIN = 2.7V, 15mA load)  
5kHz PWM Shutdown Response  
(VIN = 2.7V, 15mA load)  
Doc No. 5001, Rev. X  
5
CAT32  
OPERATION  
possible. A low LED pin voltage ensures high efficiency.  
The CAT32 device is a high efficiency, constant  
frequency, current regulating boost converter.  
Currentthroughtheinternalpowerswitchiscontinuously  
monitoredcycle-by-cycle.Ifthecurrentlimitisexceeded,  
the switch is immediately turned off, protecting the  
device, for the remainder of the cycle.  
The device includes a switch and an internally  
compensated loop for the regulation of the LED current.  
Operation can be best understood by examining the  
blockdiagram. TheRSETpinisregulatedat100mVand  
the current through the external resistor will set the  
regulated current in the LEDs (from 5mA to 40mA) with  
a multiplication factor of 225.  
PWM dimming operation can be achieved by switching  
the SHDN pin or by pulling the RSET pin higher than  
0.1V.  
While maintaining LED current regulation, the CAT32  
automaticallyadjuststheLEDpinvoltagetobeaslowas  
BLOCK DIAGRAM  
L1  
D1  
Vin  
C1  
1
C2  
SW  
Over Voltage  
Protection  
(22V)  
1.2 MHz  
Oscillator  
LED  
-
PWM  
& Logic  
+
3
I
LED  
+
-
CAT32  
Current  
Sense  
Amp  
100mV  
6
5
V
IN  
Current  
Control  
SHDN  
I
= 225 x I  
S
LED  
SOT23 Pin Numbers  
225x  
I
R
S
GND  
SET  
4
2
R
SET  
Figure 2. CAT32 Block Diagram  
Doc. No. 5001, Rev. X  
6
CAT32  
APPLICATION INFORMATION  
Inductor Selection and Efficiency  
Inductor vendors are shown below. Contact the manufacturer for detailed technical data and new product information.  
Table 1: Inductor Manufacturers  
Inductor  
L (µH)  
Maximum  
Maximum  
Vendor  
Web  
DCR (m)  
Height (mm)  
ELJEA4R7  
ELJEA6R8  
4.7  
6.8  
180  
250  
2.2  
2.2  
Panasonic  
714.373.7334  
www.panasonic.com  
LQH3C4R7M24,  
LQH32CN4R7M11  
LQH3C100K24,  
LQH32CN100K11  
4.7  
260  
2.2  
Murata  
10  
300  
2.2  
770.436.1300  
www.murata.com  
www.t-yuden.com  
www.sumida.com  
LB2016B4R7  
LB2016B100  
4.7  
3.8  
250  
350  
2.0  
2.0  
Taiyo Yuden  
408.573.4150  
CMD4D06-4R7  
CMD4D06-6R8  
CLQ4D10-4R7  
CLQ4D10-6R8  
4.7  
6.8  
4.7  
6.8  
216  
296  
162  
195  
0.8  
0.8  
1.2  
1.2  
Sumida  
847.956.0666  
CAPACITOR SELECTION  
LowESR(equivalentseriesresistance)capacitorsshould  
be used at the output to minimize the output ripple  
voltage. The low ESR and small package options  
available with multilayer ceramic capacitors make them  
excellentchoices.TheX5RandX7Rcapacitortypesare  
preferred because they retain their capacitance over  
wider voltage and temperature ranges than the Y5V or  
Z5U types. A 1.0µF or 2.2µF output capacitor is  
recommended for most applications.  
Low profile ceramic capacitors with a 1mm maximum  
height/thickness are available for designs height  
requirements. Ceramic capacitors also make a good  
choice for the input capacitor, which should be mounted  
as close as possible to the CAT32. A 2.2µF or 4.7µF  
input capacitor is recommended. Table 2 shows a list of  
several ceramic capacitor manufacturers. Consult the  
manufacturers for detailed information as new products  
and package options are introduced regularly.  
ThevoltageratingoftheoutputcapacitorC2dependson  
the number of LEDs driven in series. A 10V ceramic  
capacitor is recommended when driving two LEDs. A  
16V ceramic capacitor is recommended when driving 3  
or 4 LEDs.  
Table 2: Ceramic Capacitor Manufacturers  
Supplier  
Taiyo Yuden  
Murata  
Phone  
Web  
408.573.4150  
814.237.1431  
408.986.0424  
www.t-yuden.com  
www.murata.com  
www.kemet.com  
Kemet  
Doc No. 5001, Rev. X  
7
CAT32  
DIODE SELECTION  
output voltage. The diode conducts current only when  
the power switch is turned off (typically less than one-  
third the time), so a 0.4A or 0.5A diode will be sufficient  
for most designs.  
Schottky diodes, with their low forward voltage drop and  
fast switching speed, are the ideal choice for high  
efficiency applications. Table 3 shows several different  
Schottky diodes that work well with the CAT32. Make  
sure that the diode has a voltage rating greater than the  
Table 3: Schottky Diode Suppliers  
Part  
Supplier  
MBR0520  
MBR0530  
MBR0540  
ZHCS400  
ON Semiconductor  
www.onsemi.com  
800.282.9855  
Zetex  
LED CURRENT PROGRAMMING  
regulates the current into the LED pin, ILED, to 225 times  
the value of ISET. For the best accuracy, a 1% or better  
resistor is recommended. Table 4 shows several typical  
1% RSET values.  
The LED current is programmed with a single resistor  
connected to the RSET pin The RSET pin is internally  
regulated to 100mV, which sets the current flowing out  
of this pin, ISET, equal to 100mV/RSET. The CAT32  
Table 4: RSET Resistor Values  
ILED (mA)  
RSET  
40  
30  
25  
20  
15  
10  
5
562Ω  
750Ω  
909Ω  
1.13kΩ  
1.50kΩ  
2.26kΩ  
4.53kΩ  
For other LED current values, use the following equation to choose RSET  
.
0.1V  
RSET = 225 ×  
ILED  
Most white LEDs are driven at maximum currents of 15mA to 20mA. Some higher power designs will use two parallel  
strings of LEDs for greater light output, resulting in 30mA to 40mA (two strings of 15mA to 20mA) flowing into the LED  
pin.  
Doc. No. 5001, Rev. X  
8
CAT32  
LED DIMMING WITH PWM SIGNAL  
PWM brightness control provides the widest dimming  
range (greater than 20:1). By turning the LEDs ON and  
OFF using the control signal the LEDs operate at either  
zero or full current, but their average current changes  
with the PWM signal duty cycle. Typically, a 5kHz to  
40kHz PWM signal is used. PWM dimming with the  
CAT32 can be accomplished two different ways.  
In addition to providing the widest dimming range, PWM  
brightness control also ensures the purestwhite LED  
color over the entire dimming range. The true color of a  
white LED changes with operating current, and is the  
purestwhite at a specific forward current, usually  
15mA or 20mA. If the LED current is less than or more  
than this value, the emitted light becomes more blue.  
Applications involving color LCDs can find the blue tint  
objectionable.  
The SHDN pin can be driven directly or a resistor can be  
added to drive the RSET pin. If the SHDN pin is used,  
increasing the duty cycle will increase the LED bright-  
ness. Using this method, the LEDs can be dimmed and  
turned off completely using the same control signal. A  
0%dutycyclesignalwillturnofftheCAT32, reducingthe  
total quiescent current to near zero.  
When a PWM control signal is used to drive the SHDN  
pin of the CAT32, the LEDs are turned off and on at the  
PWM frequency. The current through them alternates  
between full current and zero current, so the average  
current changes with duty cycle. This ensures that when  
the LEDs are on, they can be driven at the appropriate  
current to give the purest white light. LED brightness  
varies linearly with the PWM duty cycle.  
If the RSET pin is used, increasing the duty cycle will  
decrease the brightness. Using this method, the LEDs  
aredimmedusingRSETandturnedoffcompletelyusing  
SHDN. IftheRSETpinisusedtoprovidePWMdimming,  
the approximate value of RPWM should be calculated  
(where VMAX is the HIGHvalue of the PWM signal):  
VMAX  
RPWM = RSET  
×
1  
0.15V  
LED DIMMING WITH A LOGIC SIGNAL  
RINCR determines how much LED current increases  
when the external NMOS switch is turned ON.  
For applications that need to adjust the LED brightness  
in discrete steps, a logic signal can be used. RMIN sets  
the minimum LED current value (when the NMOS is  
OFF):  
0.1V  
RINCR = 225 ×  
ILED(Increase)  
0.1V  
RMIN = 225 ×  
ILED(MIN)  
LED DIMMING WITH A DC VOLTAGE  
VMAX 0.1V  
RADJ = 225 ×  
ILED(MAX)  
ILEAD(MIN)  
CAT32  
SHDN  
5
CAT32  
CAT32  
CAT32  
CAT32  
RSET  
4
RSET  
4
RSET  
4
RSET  
R
4
INCR  
10k  
R
R
R
PWM  
ADJ  
PWM  
PWM  
V
PWM  
PWM  
DC  
LOGIC  
SIGNAL  
R
R
R
R
0.1µF  
SET  
SET  
SET  
MIN  
Figure 3: LED Dimming Circuits  
Doc No. 5001, Rev. X  
9
CAT32  
PCB LAYOUT GUIDELINES  
The CAT32 is a high-frequency switching regulator and  
therefore proper PCB board layout and component  
placementcanminimizenoiseandradiationandincrease  
efficiency. To maximize efficiency, the CAT32 design  
has fast switch rise and fall times. To prevent radiation  
and high frequency resonance problems minimize the  
lengthandareaofalltracesconnectedtotheSWpinand  
use a ground plane under the switching regulator.  
The switch, schottky output diode and output capacitor  
signal path should be kept as short as possible. The  
ground connection for the RSET resistor should be tied  
directly to the GND pin and not be shared with other  
components.  
TYPICAL APPLICATION CIRCUITS  
The application diagrams below are shown for the SOT23 packages.  
Two LEDs with DC Level Dimming Control:  
D1  
VIN  
6
1
VIN  
SW  
CAT32  
5
3
SHDN  
LED  
RSET  
4
GND  
2
15mA  
2.5V DC  
DIMMING  
CONTROL  
Three LEDs with DC Level Dimming Control:  
Efficiency - Three LEDs  
D1  
85  
VIN  
Vin = 4.2V  
80  
75  
70  
65  
60  
6
1
Vin = 3.0V  
VIN  
SW  
CAT32  
5
3
SHDN  
LED  
RSET  
4
GND  
2
15mA  
2.5V DC  
DIMMING  
CONTROL  
0
5
10  
15  
20  
LED CURRENT [mA]  
Doc. No. 5001, Rev. X  
10  
CAT32  
Efficiency - Four LEDs  
Four LEDs with PWM Dimming Control:  
D1  
85  
VIN  
Vin = 4.2V  
80  
75  
70  
65  
60  
6
1
Vin = 3.0V  
VIN  
SW  
CAT32  
PWM  
DIMMING  
CONTROL  
5
3
SHDN  
LED  
RSET  
4
GND  
2
15mA  
0
5
10  
15  
20  
LED CURRENT [mA]  
Doc No. 5001, Rev. X  
11  
CAT32  
PACKAGE OUTLINES  
6 LEAD SOT-23  
(AA OPTION)  
3
4
aaa C 2X  
D
D
H
e1  
B
A
5
B
N/2  
+1  
N
VIEW A-A  
SEE VIEW C  
E/2  
E1/2  
R1  
E1  
E
3
4
R
GAUGE  
PLANE  
L2  
L
aaa C D  
SEATING  
PLANE  
C
2X  
(L1)  
VIEW C  
1
2
N/2  
bbb  
C
(b)  
b1  
WITH METAL  
e
2X N/2 TIPS  
B
NX  
b
5
M
ddd C A B D  
c
c1  
BASE METAL  
SECTION B - B  
7
b
5
8
A
5
e/2  
X
A2  
ccc  
C
A
NX  
X=A &/or B  
X
X=A &/or B  
A1  
SEATING  
PLANE  
ODD LEAD SIDES  
TOP VIEW  
EVEN LEAD SIDES  
TOP VIEW  
A
C
All Dimensions are in Millimeters  
Min  
Nom  
Max  
1.00  
0.10  
0.90  
0.20  
0.16  
Notes  
Tolerances of Form and Position  
Notes  
A
aaa  
bbb  
ccc  
0.15  
0.25  
0.10  
1,2  
1,2  
1,2  
A1  
A2  
c
0.01  
0.84  
0.12  
0.08  
0.05  
0.87  
0.15  
7
Variations  
6 AB  
c1  
D
0.13  
7
AA  
Nom  
BA  
2.90BSC  
2.80BSC  
1.60BSC  
0.40  
3,4  
3,4  
3,4  
Min  
Max  
0.45  
0.39  
Min  
0.30  
0.31  
Nom  
Max  
0.45  
0.39  
Min  
0.22  
0.22  
Nom  
Max Notes  
E
b
0.30  
0.31  
0.36  
0.30  
7,8  
E1  
L
b1  
e
0.35  
0.35  
0.26  
0.30  
0.50  
0.95BSC  
1.90BSC  
6
0.95BSC  
1.90BSC  
5
0.65BSC  
1.95BSC  
8
L1  
L2  
R
0.60REF  
0.25BSC  
e1  
N
0.10  
0.10  
0°  
0.25  
8°  
Tolerances of Form and Position  
R1  
θ
ddd  
0.20  
0.20  
0.13  
1,2  
Notes:  
4°  
1. Dimensions and tolerancing per ASME Y14.5M - 1994  
2. Dimension are in mm.  
3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs  
shall not exceed 0.15mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead  
flash or protrusion shall not exceed 0.15mm per side. D and E1 dimensions are determined at Datum H.  
θ1  
4°  
10°  
12°  
4. The package top may be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, the bar  
burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. D and E1 dimensions are determined at Datum H.  
5. Datums A & B to be determined at Datum H.  
6. Package varation "AB" is a 5 lead version of the 6 lead variation "AA" where lead #5 has been removed from the 6 lead "AA" variation.  
7. These dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip.  
8. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the "b" dimension at maximum material condition. The dambar  
cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07mm.  
Doc. No. 5001, Rev. X  
12  
CAT32  
TDFN 3X3 PACKAGE (RD4)  
0.75 + 0.05  
A
8
5
B
2X  
2X  
0.15  
C
1
4
3.00 + 0.10  
(S)  
0.0 - 0.05  
0.15  
C
PIN 1 INDEX AREA  
5
8
0.75 + 0.05  
2.30 + 0.10  
C0.35  
C
0.25 min.  
PIN 1 ID  
0.30 + 0.10 (8x)  
1
0.30 + 0.07 (8x)  
0.65 TYP. (6x)  
1.95 REF. (2x)  
NOTE:  
1. ALL DIMENSION ARE IN mm. ANGLES IN DEGREES.  
2. COPLANARITY SHALL NOT EXCEED 0.08 mm.  
3. WARPAGE SHALL NOT EXCEED 0.10 mm.  
4. PACKAGE LENGTH / PACKAGE WIDTH ARE CONSIDERED AS SPECIAL CHARACTERISTIC(S)  
5. REFER JEDEC MO-229 / WEEC  
Doc No. 5001, Rev. X  
13  
CAT32  
TDFN 3X4.9 PACKAGE (RD2)  
A
5
8
8
5
B
2.00 + 0.15  
0.15  
0.20  
0.60 + 0.10 (8X)  
PIN 1 ID  
2x  
d
0.15 c  
1
4
3.00 + 0.10  
(S)  
4
1
0.65 TYP. (6x)  
2x  
d
0.15 c  
0.30 + 0.05 (8X)  
8x  
PIN 1 INDEX AREA  
1.95 REF. (2x)  
j
0.10m C A B  
0.75 + 0.05  
f 0.10 c  
0.20 REF.  
8x  
d 0.08 c  
C
NOTE:  
1. ALL DIMENSION ARE IN mm. ANGLES IN DEGREES.  
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.  
COPLANARITY SHALL NOT EXCEED 0.08mm.  
3. WARPAGE SHALL NOT EXCEED 0.10mm.  
4. PACKAGE LENGTH / PACKAGE WIDTH ARE CONSIDERED AS SPECIAL  
CHARACTERISTIC(S).  
5. REFER TO JEDEC MO-229, FOOTPRINTS ARE COMPATIBLE TO 8 MSOP.  
0.0-0.05  
Doc. No. 5001, Rev. X  
14  
Copyrights, Trademarks and Patents  
Trademarks and registered trademarks of Catalyst Semiconductor include each of the following:  
DPP ™  
AE2 ™  
Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products. For a complete list of patents  
issued to Catalyst Semiconductor contact the Company’s corporate office at 408.542.1000.  
CATALYST SEMICONDUCTOR MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING THE SUITABILITY OF ITS  
PRODUCTS FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE  
RIGHTS OF THIRD PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING  
OUT OF ANY SUCH USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES.  
Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or  
other applications intended to support or sustain life, or for any other application in which the failure of the Catalyst Semiconductor product could create a  
situation where personal injury or death may occur.  
Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets  
labeled "Advance Information" or "Preliminary" and other products described herein may not be in production or offered for sale.  
Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate  
typical semiconductor applications and may not be complete.  
Catalyst Semiconductor, Inc.  
Corporate Headquarters  
1250 Borregas Avenue  
Sunnyvale, CA 94089  
Phone: 408.542.1000  
Publication #: 5001  
Revison:  
Issue date:  
Type:  
X
9/11/03  
Preliminary  
Fax: 408.542.1200  
www.catalyst-semiconductor.com  

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