ADM1023ARQZ-R7 [ONSEMI]
ACPI-Compliant, High Accuracy Microprocessor System Temperature Monitor; 支持ACPI，高精度微处理器系统温度监控器
| 型号： | ADM1023ARQZ-R7 |
| 厂家： | 
ONSEMI |
| 描述： | ACPI-Compliant, High Accuracy Microprocessor System Temperature Monitor |
| 文件： | 总16页 (文件大小：154K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ADM1023
ACPI-Compliant, High
Accuracy Microprocessor
System Temperature Monitor
The ADM1023 is a 2−channel digital thermometer and
under/overtemperature alarm for use in personal computers and other
systems requiring thermal monitoring and management. Optimized
for the Pentium® III, the higher accuracy allows systems designers to
safely reduce temperature guard banding and increase system
performance. The device can measure the temperature of a
microprocessor using a diode−connected PNP transistor, which may
be provided on−chip with the Pentium III or similar processors; or it
can be a low−cost, discrete NPN/PNP device such as the
2N3904/2N3906. A novel measurement technique cancels out the
absolute value of the transistor’s base emitter voltage so that no
calibration is required. The second measurement channel measures the
output of an on−chip temperature sensor to monitor the temperature of
the device and its environment.
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QSOP−16
CASE 492
MARKING DIAGRAM
1
1023A
RQZ
#YYWW
XXX
The ADM1023 communicates over a 2−wire serial interface
compatible with SMBus standards. Under/overtemperature limits can
be programmed into the device over the serial bus, and an ALERT
output signals when the on−chip or remote temperature is out of range.
This output can be used as an interrupt or as an SMBus ALERT.
xxx
#
= Specific Device Code
= Pb−Free Package
YYWW = Date Code
XXX = Assembly Lot ID
FEATURES
• Next Generation Upgrade of ADM1021
• On−Chip and Remote Temperature Sensing
• Offset Registers for System Calibration
• 1°C Accuracy and Resolution on Local Channel
• 0.125°C Resolution/1°C Accuracy on Remote Channel
• Programmable Over/Undertemperature Limits
• Programmable Conversion Rate
1
2
3
4
5
6
7
8
NC
16 NC
V
15
14
13
12
11
10
STBY
SCLK
DD
D+
NC
D–
ADM1023
TOP VIEW
NC
SDATA
ALERT
ADD0
NC
ADD1
GND
GND
• Supports System Management Bus (SMBus) ALERT
• 2−Wire SMBus Serial Interface
9
• 200 mA Max Operating Current (0.25 Conversions/Second)
• 1 mA Standby Current
• 3.0 V to 5.5 V Supply
• Small 16−Lead QSOP Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 15 of this data sheet.
• Pb−Free Packages are Available
APPLICATIONS
• Desktop Computers
• Notebook Computers
• Smart Batteries
• Industrial Controllers
• Telecomm Equipment
• Instrumentation
© Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
May, 2010 − Rev. 9
ADM1023/D
ADM1023
ADDRESS POINTER
REGISTER
ONE−SHOT
REGISTER
CONVERSION RATE
REGISTER
OFFSET
REGISTERS
ON−CHIP
TEMPERATURE
SENSOR
LOCAL TEMPERATURE
LOW−LIMIT REGISTER
LOCAL TEMPERATURE
VALUE REGISTER
LOCAL TEMPERATURE
LOW−LIMIT COMPARATOR
LOCAL TEMPERATURE
HIGH−LIMIT COMPARATOR
LOCAL TEMPERATURE
HIGH−LIMIT REGISTER
3
4
D+
D–
A−TO−D
CONVERTER
ANALOG
MUX
REMOTE TEMPERATURE
LOW−LIMIT COMPARATOR
REMOTE TEMPERATURE
LOW−LIMIT REGISTERS
BUSY RUN/STANDBY
REMOTE TEMPERATURE
HIGH−LIMIT COMPARATOR
REMOTE TEMPERATURE
HIGH−LIMIT REGISTERS
REMOTE TEMPERATURE
VALUE REGISTERS
CONFIGURATION
REGISTER
15
11
STBY
EXTERNAL DIODE OPEN−CIRCUIT
INTERRUPT
MASKING
ALERT
STATUS REGISTER
ADM1023
SMBus INTERFACE
1
2
5
7
8
9
13
16
12
14
10
6
NC
V
NC GND GND NC
NC
NC
SDATA
SCLK
ADD0
ADD1
DD
NC = NO CONNECT
Figure 1. Functional Block Diagram
ABSOLUTE MAXIMUM RATINGS
Parameter
Positive Supply Voltage (V ) to GND
Rating
−0.3 to +6.0
Unit
V
V
DD
D+, ADD0, ADD1
D− to GND
−0.3 to V +0.3
DD
−0.3 to +0.6
−0.3 to +6.0
50
SCLK, SDATA, ALERT, STBY
Input Current
V
mA
mA
V
Input Current, D−
10
ESD Rating, All Pins (Human Body Model)
2000
Continuous Power Dissipation
Up to 70°C
Derating Above 70°C
650
6.7
mW
mW/°C
Operating Temperature Range
−55 to +125
150
°C
°C
°C
°C
°C
°C
Maximum Junction Temperature (T max)
J
Storage Temperature Range
−65 to +150
300
Lead Temperature, Soldering (10 s)
IR Reflow Peak Temperature
220
IR Reflow Peak Temperature for Pb−Free
260
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
THERMAL CHARACTERISTICS
Parameter
Rating
16−Lead QSOP Package
q
= 105°C/W, q = 39°C/W
JA
JC
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ADM1023
PIN ASSIGNMENT
Pin No.
Mnemonic
Description
1
2
NC
No Connect.
Positive Supply, 3.0 V to 5.5 V.
V
DD
3
D+
D−
Positive Connection to Remote Temperature Sensor.
Negative Connection to Remote Temperature Sensor.
No Connect.
4
5
NC
6
ADD1
GND
GND
NC
Three−State Logic Input, Higher Bit of Device Address.
Supply 0 V Connection.
7
8
Supply 0 V Connection.
9
No Connect.
10
11
12
13
14
15
16
ADD0
ALERT
SDATA
NC
Three−State Logic Input, Lower Bit of Device Address.
Open−Drain Logic Output Used as Interrupt or SMBus ALERT.
Logic Input/Output, SMBus Serial Data. Open−drain output.
No Connect.
SCLK
STBY
NC
Logic Input, SMBus Serial Clock.
Logic Input Selecting Normal Operation (High) or Standby Mode (Low).
No Connect.
ELECTRICAL CHARACTERISTICS (T = T
to T , V = 3.0 V to 3.6 V, unless otherwise noted. (Note 1)
MAX DD
A
MIN
Parameter
Test Conditions / Comments
Min
Typ
Max
Unit
Power Supply and ADC
Temperature Resolution, Local Sensor
Temperature Resolution, Remote Sensor
Temperature Error, Local Sensor
Guaranteed no missed codes
Guaranteed no missed codes
1.0
°C
°C
°C
0.125
T = 60°C to 100°C
−1.5
−3.0
0.5
1.0
+1.5
+3.0
A
T = 0°C to 120°C
A
Temperature Error, Remote Sensor
T , T = 60°C to 100°C (Note 2)
−1.0
−3.0
+1.0
+3.0
0.25
3.6
°C
°C
°C
V
A
D
T , T = 0°C to 120°C (Note 2)
A
D
Relative Accuracy
T = 60°C to 100°C
A
Supply Voltage Range (Note 3)
Undervoltage Lockout Threshold
Undervoltage Lockout Hysteresis
Power−On Reset Threshold
POR Threshold Hysteresis
Standby Supply Current
3.0
V
DD
V
DD
V
DD
input, disables ADC, rising edge
, falling edge (Note 4)
2.55
2.7
25
2.8
V
mV
V
0.9
1.7
50
2.2
5.0
mV
mA
= 3.3 V, no SMBus activity
1.0
4.0
SCLK at 10 kHz
Average Operating Supply Current
Autoconvert Mode, Averaged Over 4 Sec
Conversion Time
0.25 conversions/sec rate
2 conversions/sec rate
130
225
115
200
370
170
mA
mA
ms
From stop bit to conversion complete
(both channels) D+ forced to D− + 0.65 V
65
Remote Sensor Source Current
120
7.0
205
12
300
16
mA
High level (Note 4)
Low level (Note 4)
D− Source Voltage
0.7
50
V
Address Pin Bias Current (ADD0, ADD1)
Momentary at power−on reset
mA
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ADM1023
ELECTRICAL CHARACTERISTICS (T = T
to T
, V = 3.0 V to 3.6 V, unless otherwise noted. (Note 1)
DD
A
MIN
MAX
Parameter
Test Conditions / Comments
Min
Typ
Max
Unit
SMBus Interface (See Figure 2)
Logic Input High Voltage, V
STBY, SCLK, SDATA
V
V
= 3.0 V to 5.5 V
= 3.0 V to 5.5 V
2.2
V
V
IH
DD
Logic Input Low Voltage, V
STBY, SCLK, SDATA
0.8
IL
DD
SMBus Output Low Sink Current
ALERT Output Low Sink Current
SDATA forced to 0.6 V
ALERT forced to 0.4 V
6.0
1.0
mA
mA
Logic Input Current, I , I
−1.0
+1.0
400
mA
pF
kHz
ms
IH IL
SMBus Input Capacitance, SCLK, SDATA
SMBus Clock Frequency
5.0
SMBus Clock Low Time, t
t
t
between 10% points
between 90% points
1.3
0.6
0.6
LOW
LOW
SMBus Clock High Time, t
ms
HIGH
HIGH
SMBus Start Condition Setup Time,
ms
t
SU:STA
SMBus Start Condition Hold Time, t
Time from 10% of SDATA to 90% of SCLK
Time from 90% of SCLK to 10% of SDATA
Time for 10% or 90% of SDATA to 10% of SCLK
0.6
0.6
ms
ms
ns
HD:STA
SMBus Stop Condition Setup Time, t
SU:STO
SMBus Data Valid to SCLK Rising Edge
Time, t
100
SU:DAT
SMBus Bus Free Time, t
Between start/stop condition
Master clocking in data
1.3
ms
ns
ns
BUF
SCLK SDATA Rise Time, t
300
300
R MAX
F MAX
SCLK SDATA Fall Time, t
1. T = 120°C, T
V
DD
= 0 V
= 0°C
MIN
MAX
2. T is the temperature of the remote thermal diode; T , T = 60°C to 100°C
D
A
D
3. Operation at V = 5.0 V guaranteed by design; not production tested
DD
4. Guranteed by design; not production tested
tHD;STA
tR
tLOW
tF
SCL
SDA
tHD;DAT
tSU;STA
tSU;DAT
tHD;STA
tHIGH
tSU;STO
tBUF
S
P
P
S
Figure 2. Diagram for Serial Bus Timing
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4
ADM1023
TYPICAL CHARACTERISTICS
5
4
3
2
1
0
20
15
D+ TO GND
10
250mV p−p REMOTE
5
0
–5
–10
–15
–20
–25
–30
D+ TO V
DD
100mV p−p REMOTE
100
1k
10k
100k
1M
10M
100M
1
10
LEAKAGE RESISTANCE (MΩ)
100
FREQUENCY (Hz)
Figure 3. Temperature Error vs. Resistance from
Track to VDD and GND
Figure 4. Remote Temperature Error vs. Supply
Noise Frequency
9
3
2
100mV p−p
8
7
6
5
4
UPPER SPEC LEVEL
1
0
3
–1
LOWER SPEC LEVEL
50mV p−p
2
1
–2
25mV p−p
1M 10M
0
–3
50
1
10
100
1k
10k
100k
100M
60
70
80
90
100
110
120
FREQUENCY (Hz)
TEMPERATURE (5C)
Figure 5. Temperature Error vs. Common−Mode
Noise Frequency
Figure 6. Temperature Error of ADM1023 vs.
Pentium III Temperature
14
12
10
70
60
50
40
8
6
4
V
= 3.3V
DD
30
20
10
0
2
0
V
= 5V
DD
–2
2
4
6
8
10
12
14
16
18
20
22
24
1
5
10
25
50
75
100 250 500 750 1000
CAPACITANCE (nF)
SCLK FREQUENCY (kHz)
Figure 7. Temperature Error vs. Capacitance
Between D+ and D−
Figure 8. Standby Supply Current vs.
SCLK Frequency
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ADM1023
TYPICAL CHARACTERISTICS
4
3
2
1
550
500
450
400
350
300
250
200
150
100
50
10mV p−p
3.3V
5V
0
100k
1M
10M
FREQUENCY (Hz)
100M
1G
0.0625 0.1250 0.2500 0.5000 1.0000 2.0000 4.0000 8.0000
CONVERSION RATE (Hz)
Figure 9. Temperature Error vs. Differential−Mode
Noise Frequency
Figure 10. Operating Supply Current vs.
Conversion Rate, VDD = 5.0 V and 3.3 V
100
80
60
40
20
0
125
REMOTE
TEMPERATURE
100
INT
TEMPERATURE
75
50
25
0
−20
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
1
2
3
4
5
6
7
8
9
10
SUPPLY VOLTAGE (V)
TIME (Seconds)
Figure 11. Standby Supply Current vs.
Supply Voltage
Figure 12. Response to Thermal Shock
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ADM1023
Theory of Operation
on−chip limit registers. As with the measured value, the
local temperature limits are stored as 8−bit values and the
remote temperature limits as 11−bit values. Out−of−limit
comparisons generate flags that are stored in the status
register, and one or more out−of−limit results cause the
ALERT output to pull low.
Registers can be programmed, and the device controlled
and configured, via the serial system management bus
(SMBus). The contents of any register can also be read back
via the SMBus.
Functional Description
The ADM1023 contains a two−channel analog−to−digital
converter (ADC) with special input−signal conditioning to
enable operation with remote and on−chip diode
temperature sensors. When the ADM1023 is operating
normally, the ADC operates in a free−running mode. The
analog input multiplexer alternately selects either the
on−chip temperature sensor to measure its local temperature
or the remote temperature sensor. These signals are digitized
by the ADC, and the results are stored in the local and remote
temperature value registers. Only the eight most significant
bits (MSBs) of the local temperature value are stored as an
8−bit binary word. The remote temperature value is stored
as an 11−bit binary word in two registers. The eight MSBs
are stored in the remote temperature value high byte register
at Address 0x01. The three least significant bits (LSBs) are
stored, left justified, in the remote temperature value low
byte register at Address 0x10.
Error sources such as PCB track resistance and clock noise
can introduce offset errors into measurements on the remote
channel. To achieve the specified accuracy on this channel,
these offsets must be removed, and two offset registers are
provided for this purpose at Address 0x11 and Address
0x12.
An offset value may automatically be added to or
subtracted from the measurement by writing an 11−bit, twos
complement value to Register 0x11 (high byte) and Register
0x12 (low byte, left−justified).
Control and configuration functions consist of:
• Switching the device between normal operation and
standby mode.
• Masking or enabling the ALERT output.
• Selecting the conversion rate.
On initial powerup, the remote and local temperature
values default to −128°C. The device normally powers up
converting, making a measure of local and remote
temperature. These values are then stored before making a
comparison with the stored limits. However, if the part is
powered up in standby mode (STBY pin pulled low), no new
values are written to the register before a comparison is
made. As a result, both RLOW and LLOW are tripped in the
status register, thus generating an ALERT output. This may
be cleared in one of two ways:
• Change both the local and remote lower limits to
–128°C and read the status register (which in turn
clears the ALERT output).
• Take the part out of standby and read the status register
(which in turn clears the ALERT output). This works
only when the measured values are within the limit
values.
The offset registers default to 0 at powerup and have no
effect if nothing is written to them.
The measurement results are compared with local and
remote, high and low temperature limits, stored in six
V
DD
I
N y I
I
BIAS
D+
1
V
OUT+
C1
TO ADC
REMOTE
SENSING
TRANSISTOR
BIAS
DIODE
V
D–
OUT–
LOW−PASS FILTER
fC = 65kHz
1
CAPACITOR C1 IS OPTIONAL. IT IS ONLY NECESSARY IN NOISY ENVIRONMENTS
C1 = 1000pF MAX.
Figure 13. Input Signal Conditioning
Measurement Method
This technique, however, requires calibration to nullify
A simple method of measuring temperature is to exploit
the negative temperature coefficient of a diode, or the base
emitter voltage of a transistor, operating at constant current.
Thus, the temperature may be obtained from a direct
the effect of the absolute value of V , which varies from
device to device.
The technique used in the ADM1023 is to measure the
BE
change in V when the device is operated at two different
BE
measurement of V where:
collector currents.
BE
ǒI Ǔ
IS
C
nKT
(eq. 1)
VBE
+
1n
q
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7
ADM1023
This is given by:
ADM1023 is optimized for n
= 1.008; any deviation
TYPICAL
nKT
q
on n from this typical value causes a temperature error that is
( )
1n N
(eq. 2)
DVBE
+
calculated below for the n
and n
of a Pentium III
MIN
MAX
where:
K is Boltzmann’s constant.
q is the charge on the electron (1.6 × 10 Coulombs).
T is the absolute temperature in Kelvins.
N is the ratio of the two collector currents.
n is the ideality factor of the thermal diode (TD).
processor at T = 100°C.
TD
1.0057 * 1.008
–19
ǒ
Ǔ
DTMIN
+
273.15 Kelvin ) 100° C
1.008
+ * 0.85° C
1.0125 * 1.008
ǒ
Ǔ
DTMAX
+
273.15 Kelvin ) 100° C
1.008
+ ) 1.67° C
To measure DV , the sensor is switched between
BE
(eq. 4)
operating currents of I and NI. The resulting waveform is
passed through a low−pass filter to remove noise, then to a
chopper−stabilized amplifier that performs the functions of
amplification and rectification of the waveform to produce
Thus, the temperature error due to variation on n of the
thermal diode for a Pentium III processor is about 2.5°C.
In general, this additional temperature error of the thermal
diode measurement due to deviations on n from its typical
value is given by:
a dc voltage proportional to DV . This voltage is measured
BE
by the ADC, which gives a temperature output in binary
format. To further reduce the effects of noise, digital filtering
is performed by averaging the results of 16 measurement
cycles. Signal conditioning and measurement of the internal
temperature sensor are performed in a similar manner.
Figure 13 shows the input signal conditioning used to
measure the output of an external temperature sensor. This
figure shows the external sensor as a substrate PNP
transistor, provided for temperature monitoring on some
microprocessors, but it could equally well be a discrete
transistor. If a discrete transistor is used, the collector is not
grounded and should be connected to the base. To prevent
ground noise from interfering with the measurement, the
more negative terminal of the sensor is not referenced to
ground but is biased above ground by an internal diode at the
D− input. If the sensor is operating in a noisy environment,
C1 may optionally be added as a noise filter. Its value is
1000 pF maximum. See the Layout Considerations section
for more information on C1.
n * 1.008
1.008
ǒ
273.15 Kelvin ) T
TD
Ǔ
(eq. 5)
DT +
where T is in °C.
TD
Beta of Thermal Transistor (b)
In Figure 13, the thermal diode is a substrate PNP
transistor where the emitter current is forced into the device.
The derivation of Equation 2 assumed that the collector
currents were scaled by N as the emitter currents were also
scaled by N. Thus, this assumes that beta (b) of the transistor
is constant for various collector currents. Figure 14 shows
typical b variation vs. collector current for Pentium III
processors at 100°C. The maximum b is 4.5 and varies less
than 1% over the collector current range from 7 mA to
300 mA.
b
< 4.5
MAX
I
E
nb
Sources of Errors on Thermal Transistors
b
Measurement Method; The Effect of Ideality Factor (n)
The effects of ideality factor (n) and beta (b) of the
temperature measured by a thermal transistor are described in
this section. For a thermal transistor implemented on a
submicron process, such as the substrate PNP used on a
Pentium III processor, the temperature errors due to the
combined effect of the ideality factor and beta are shown to
be less than 3°C. Equation 2 is optimized for a substrate PNP
transistor (used as a thermal diode) usually found on CPUs
designed on submicron CMOS processes such as the Pentium
III processor. There is a thermal diode on board each of these
processors. The n in Equation 2 represents the ideality factor
of this thermal diode. This ideality factor is a measure of the
deviation of the thermal diode from ideal behavior.
b
I
=
I
E
C
b+1
I
(mA)
C
7
300
Figure 14. Variation of b with Collector Currents
Expressing the collector current in terms of the emitter
current.
ƪ
(eq. 6)
(
)]
IC + IE bń b ) 1
where:
ǒ
Ǔ
ǒ
Ǔ
(
)
b 300 mA + b 7 mA 1 ) e
(
)
(eq. 7)
e + D bńb and b + b 7mA
Rewriting the equation for DV , to include the ideality
BE
According to Pentium III processor manufacturing
specifications, measured values of n at 100°C are:
nMIN + 1.0057 t nTYPICAL + 1.008 t nMAX
factor, n, and beta, b yields:
ǒ
Ǔ
(
)
1 ) e b ) 1
1 ) e b ) 1
nKT
q
ƪ
ƫ
(eq. 8)
DV
+
1n
N
BE
(
)
(eq. 3)
+ 1.0125
All b variations of less than 1% (e < 0.01) contribute to
temperature errors of less than 0.4°C.
The ADM1023 takes this ideality factor into consideration
when calculating temperature T of the thermal diode. The
TD
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ADM1023
Temperature Data Format
Register Functions
One LSB of the ADC corresponds to 0.125°C, so the
ADM1023 can measure from 0°C to 127.875°C. The
temperature data format and extended temperature
resolution are shown in Table 1 and Table 2.
The ADM1023 contains registers that are used to store the
results of remote and local temperature measurements and
high and low temperature limits, and to configure and
control the device. A description of these registers follows,
and further details are given in Table 3 to Table 7. Most of
the registers for the ADM1023 are dual−port and have
different addresses for read and write operations.
Attempting to write to a read address or to read from a write
address produces an invalid result. Register addresses above
0x14 are reserved for future use or factory test purposes and
should not be written to.
Table 1. Temperature Data Format
(Local and Remote Temperature High Byte)
Temperature (5C) (Note 1)
Digital Output
0
0 000 0000
0 000 0001
0 000 1010
0 001 1001
0 011 0010
0 100 1011
0 110 0100
0 111 1101
0 111 1111
1
10
Address Pointer Register
25
The address pointer register does not have, nor does it
require, an address, because it is the register to which the
first data byte of every write operation is automatically
written. This data byte is an address pointer that sets up one
of the other registers for the second byte of the write
operation or for a subsequent read operation.
50
75
100
125
127
1. The ADM1023 differs from the ADM1021 in that the
temperature resolution of the remote channel is improved
from 1°C to 0.125°C, but it cannot measure temperatures
below 0°C. If negative temperature measurement is required,
the ADM1021 should be used.
Value Registers
The ADM1023 has three registers to store the results of
local and remote temperature measurements. These
registers are written to by the ADC and can only be read over
the SMBus.
The results of the local and remote temperature
measurements are stored in the local and remote temperature
value registers and are compared with limits programmed
into the local and remote high and low limit registers.
The Offset Register
Two offset registers are provided at Address 0x11 and
Address 0x12. These are provided so that the user may
remove errors from the measured values of remote
temperature. These errors may be introduced by clock noise
and PCB track resistance. See Table 4 for an example of
offset values.
The offset value is stored as an 11−bit, twos complement
value in Register 0x11 (high byte) and Register 0x12 (low
byte, left justified). The value of the offset is negative if the
MSB of Register 0x11 is 1, and it is positive if the MSB of
Register 0x11 is 0. This value is added to the remote
temperature. These registers default to 0 at powerup and
have no effect if nothing is written to them. The offset
register can accept values from −128.875°C to +127.875°C.
The ADM1023 detects overflow so the remote temperature
value register does not wrap around +127°C or −128°C.
Table 2. Extended Temperature Resolution
(Remote Temperature Low Byte)
Extended Resolution (5C)
Temperature Low Bits
0.000
0.125
0.250
0.375
0.500
0.625
0.750
0.875
0000 0000
0010 0000
0100 0000
0110 0000
1000 0000
1010 0000
1100 0000
1110 0000
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9
ADM1023
Table 3. List of ADM1023 Registers
Read Address (Hex)
Write Address (Hex)
Name
Power−On Default
Undefined
Not applicable
Not applicable
Address pointer
00
Not applicable
Local temperature value
Remote temperature value high byte
Status
1000 0000 (0x80) (−128°C)
1000 0000 (0x80) (−128°C)
Undefined
01
Not applicable
02
Not applicable
03
09
Configuration
0000 0000 (0x00)
04
0A
Conversion rate
0000 0010 (0x02)
05
0B
Local temperature high limit
Local temperature low limit
Remote temperature high limit high byte
Remote temperature low limit high byte
One−shot
0111 1111 (0x7F) (+127°C)
1100 1001 (0xC9) (−55°C)
0111 1111 (0x7F) (+127°C)
1100 1001 (0xC9) (−55°C)
06
0C
07
0D
08
0E
Not applicable
0F (Note 1)
10
11
Not applicable
Remote temperature value low byte
Remote temperature offset high byte
Remote temperature offset low byte
Remote temperature high limit low byte
Remote temperature low limit low byte
Reserved
0000 0000
11
0000 0000
12
13
14
19
20
FE
FF
12
13
0000 0000
0000 0000
14
0000 0000
Not applicable
21
0000 0000
Reserved
Undefined
Not applicable
Not applicable
Manufacturer device ID
Die revision code
0100 0001 (0x41)
0011 xxxx (0x3x)
1. Writing to Address 0F causes the ADM1023 to perform a single measurement. It is not a data register as such; thus, it does not matter what
data is written to it.
Table 4. Offset Values
Offset Registers
Remote Temperature
0x11
0x12
Offset Value
−4°C
With Offset
Without Offset
18°C
1111 1100
1111 1111
1111 1111
0000 0000
0000 0000
0000 0001
0000 0100
0000 0000
0000 0000
1110 0000
0000 0000
0010 0000
0000 0000
0000 0000
14°C
17°C
−1°C
18°C
−0.125°C
0°C
17.875°C
18°C
18°C
18°C
+0.125°C
+1°C
18.125°C
19°C
18°C
18°C
+4°C
22°C
18°C
Status Register
Reading the status register clears the five flag bits,
provided the error conditions that caused the flags to be set
have gone away. While a limit comparator is tripped due to
a value register containing an out−of−limit measurement or
the sensor is open−circuit, the corresponding flag bit cannot
be reset. A flag bit can be reset only if the corresponding
value register contains an in−limit measurement, or the
sensor is good.
The ALERT interrupt latch is not reset by reading the
status register, but it resets when the ALERT output has been
serviced by the master reading the device address, provided
the error condition has gone away and the status register flag
bits have been reset.
Bit 7 of the status register (see Table 5) indicates that the
ADC is busy converting when it is high. Bit 6 to Bit 3 are
flags indicating the results of the limit comparisons.
If the local and/or remote temperature measurement is
above the corresponding high temperature limit or below the
corresponding low temperature limit, one or more of these
flags will be set. Bit 2 is a flag that is set if the remote
temperature sensor is open−circuit. These five flags are
NOR’d together, so that if any of them are high, the ALERT
interrupt latch is set, and the ALERT output goes low.
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10
ADM1023
Table 5. Status Register Bit Assignments
Table 7. Conversion Rate Register Code
Bit
Name
Function
Average Supply Current
Data
Conversion/Sec
mA Typ at V = 3.3 V
CC
7
BUSY
LHIGH*
LLOW*
RHIGH*
RLOW*
OPEN*
At 1 when ADC converting
0x00
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0.0625
150
150
150
150
150
150
160
180
6
At 1 when local high temp limit tripped
At 1 when local low temp limit tripped
At 1 when remote high temp limit tripped
At 1 when remote low temp limit tripped
At 1 when remote sensor open−circuit
Reserved
0.125
5
0.25
4
3
0.5
1
2
2
1 to 0
4
8
*These flags stay high until the status register is read or they are
reset by POR.
0x08 to
0xFF
Reserved
Configuration Register
Two bits of the configuration register are used. If Bit 6 is 0,
which is the power−on default, the device is in operating
mode with the ADC converting (see Table 6). If Bit 6 is set
to 1, the device is in standby mode and the ADC does not
convert. Standby mode can also be selected by taking the
STBY pin low. In standby mode, the values of remote and
local temperature remain at the value they were before the
part was placed in standby mode.
Bit 7 of the configuration register is used to mask the
ALERT output. If Bit 7 is 0, which is the power−on default,
the ALERT output is enabled. If Bit 7 is set to 1, the ALERT
output is disabled.
Limit Registers
The ADM1023 has six limit registers to store local and
remote, high and low temperature limits. These registers can
be written to and read back over the SMBus. The high limit
registers perform a > comparison, while the low limit
registers perform a < comparison. For example, if the high
limit register is programmed as a limit of 80°C, measuring
81°C results in an alarm condition. Even though the
temperature range is 0 to 127°C, it is possible to program the
limit register with negative values. This is for
backward−compatibility with the ADM1021.
One−Shot Register
Table 6. Configuration Register Bit Assignments
Power−On
The one−shot register is used to initiate a single
conversion and comparison cycle when the ADM1023 is in
standby mode, after which the device returns to standby.
This is not a data register as such, and it is the write operation
that causes the one−shot conversion. The data written to this
address is irrelevant and is not stored.
Bit
Name
Function
Default
7
MASK1
0 = ALERT Enabled
1 = ALERT Masked
0
6
RUN/STOP
0 = Run
1 = Standby
0
0
5 to 0
Reserved
Serial Bus Interface
Control of the ADM1023 is carried out via the serial bus.
The ADM1023 is connected to this bus as a slave device,
under the control of a master device. Note that the SMBus
SDA and SCLK pins are three−stated when the ADM1023
is powered down, and they do not pull down the SMBus.
Conversion Rate Register
The lowest three bits of this register are used to program
the conversion rate by dividing the ADC clock by 1, 2, 4, 8,
16, 32, 64, or 128, to give conversion times from 125 ms
(Code 0x07) to 16 seconds (Code 0x00). This register can be
written to and read back over the SMBus. The higher five
bits of this register are unused and must be set to 0. Use of
slower conversion times greatly reduces the device’s power
consumption, as shown in Table 7.
Address Pins
In general, every SMBus device has a 7−bit device address
(except for some devices that have extended, 10−bit
addresses). When the master device sends a device address
over the bus, the slave device with that address responds.
The ADM1023 has two address pins, ADD0 and ADD1, to
allow selection of the device address, so that several
ADM1023s can be used on the same bus and to avoid
conflict with other devices. Although only two address pins
are provided, these pins are three−state and can be grounded,
left unconnected, or tied to V , so that a total of nine
DD
different addresses are possible, as shown in Table 8.
Note that the state of the address pins is sampled only at
powerup, so changing them after powerup has no effect.
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11
ADM1023
clock pulse, known as the Acknowledge bit. All
other devices on the bus remain idle while the
selected device waits for data to be read from or
written to it. If the R/W bit is 0, the master writes
to the slave device. If the R/W bit is 1, the master
reads from the slave device.
Table 8. Device Addresses (Note 1)
ADD0
ADD1
Device Address
0
0
0
NC
1
0011 000
0011 001
0011 010
0101 001
0101 010
0101 011
1001 100
1001 101
1001 110
0
2. Data is sent over the serial bus in sequences of
nine clock pulses, 8 bits of data followed by an
Acknowledge bit from the slave device.
NC
NC
NC
1
0
NC
1
Transitions on the data line must occur during the
low period of the clock signal and remain stable
during the high period, because a low−to−high
transition when the clock is high may be
0
1
NC
1
1
interpreted as a stop signal. The number of data
bytes that can be transmitted over the serial bus in
a single read or write operation is limited only by
what the master and slave devices can handle.
3. When all data bytes have been read or written,
stop conditions are established. In write mode, the
master pulls the data line high during the 10th
clock pulse to assert a stop condition. In read
mode, the master device overrides the
1. ADD0 and ADD1 are sampled at powerup only.
The serial bus protocol operates as follows:
1. The master initiates data transfer by establishing a
start condition, defined as a high−to−low transition
on the serial data line, SDATA, while the serial
clock line, SCLK, remains high. This indicates
that an address/data stream will follow. All slave
peripherals connected to the serial bus respond to
the start condition and shift in the next 8 bits.
These bits consist of a 7−bit address (MSB first)
plus an R/W bit, which determines the direction of
the data transfer, that is, whether data is written to,
or read from, the slave device.
Acknowledge bit by pulling the data line high
during the low period before the ninth clock pulse.
This is known as No Acknowledge. The master
then takes the data line low during the low period
before the 10th clock pulse, then high during the
10th clock pulse to assert a stop condition.
The peripheral whose address corresponds to the
transmitted address responds by pulling the data
line low during the low period before the ninth
1
9
1
9
SCLK
D6
D2
0
1
0
1
1
A1
A0
D7
D5
D4
D3
D1
SDATA
START BY
D0
R/W
ACK. BY
ACK. BY
ADM1023
MASTER
ADM1023
FRAME 1
SERIAL BUS ADDRESS BYTE
FRAME 2
ADDRESS POINTER REGISTER BYTE
1
9
SCLK (CONTINUED)
SDATA (CONTINUED)
D4
D3
D2
D1
D7
D6
D5
D0
ACK. BY
STOP BY
ADM1023 MASTER
FRAME 3
DATA BYTE
Figure 15. Writing a Register Address to the Address Pointer Register, then Writing Data to the Selected Register
1
9
1
9
SCLK
D6
D2
SDATA
0
1
0
1
1
A1
A0
R/W
D7
D5
D4
D3
D1
D0
START BY
MASTER
ACK. BY
ADM1023
ACK. BY
ADM1023
STOP BY
MASTER
FRAME 1
SERIAL BUS ADDRESS BYTE
FRAME 2
ADDRESS POINTER REGISTER BYTE
Figure 16. Writing to the Address Pointer Register Only
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12
ADM1023
1
9
1
9
SCLK
R/W
A5
A1
A0
D2
A6
A4
A3
A2
D7
D5
D4
D3
D1
SDATA
D6
D0
ACK. BY
ADM1023
NO ACK.
STOP BY
BY MASTER MASTER
START BY
MASTER
FRAME 1
SERIAL BUS ADDRESS BYTE
FRAME 2
DATA BYTE FROM ADM1023
Figure 17. Reading Data from a Previously Selected Register
Any number of bytes of data may be transferred over the
serial bus in one operation, but it is not possible to mix read
and write in one operation because the type of operation is
determined at the beginning and cannot subsequently be
changed without starting a new operation.
For the ADM1023, write operations contain either one or
two bytes, while read operations contain one byte and
perform the following functions:
To write data to one of the device data registers or read
data from it, the address pointer register must be set so that
the correct data register is addressed. Data can then be
written into that register or read from it. The first byte of a
write operation always contains a valid address that is stored
in the address pointer register. If data is to be written to the
device, the write operation contains a second data byte that
is written to the register selected by the address pointer
register.
This is illustrated in Figure 15. The device address is sent
over the bus followed by R/W set to 0. This is followed by
two data bytes. The first data byte is the address of the
internal data register to be written to, which is stored in the
address pointer register. The second data byte is the data to
be written to the internal data register.
the address pointer register is already at the correct
value. This is because the first data byte of a write is
always written to the address pointer register.
• Do not forget that ADM1023 registers have different
addresses for read and write operations. The write
address of a register must be written to the address
pointer if data is to be written to that register, but it is
not possible to read data from that address. The read
address of a register must be written to the address
pointer before data can be read from that register.
ALERT Output
The ALERT output goes low whenever an out−of−limit
measurement is detected or if the remote temperature sensor
is open−circuit. It is an open drain and requires a 10 kW
pull−up to V . Several ALERT outputs can be
DD
wire−AND’ed together, so that the common line goes low if
one or more of the ALERT outputs goes low.
The ALERT output can be used as an interrupt signal to a
processor, or it may be used as an SMBALERT. Slave
devices on the SMBus normally cannot signal to the master
that they want to talk, but the SMBALERT function allows
them to do so.
One or more ALERT outputs are connected to a common
SMBALERT line connected to the master. When the
SMBALERT line is pulled low by one of the devices, the
procedure shown in Figure 18 occurs.
When reading data from a register, there are two
possibilities:
1. If the ADM1023’s address pointer register value is
unknown or not the desired value, it is necessary
to set it to the correct value before data can be read
from the desired data register. This is done by
performing a write to the ADM1023 as before, but
only the data byte containing the register read
address is sent, as data is not to be written to the
register. This is shown in Figure 16.
MASTER
RECEIVES
SMBALERT
ALERT RESPONSE
ADDRESS
DEVICE
ADDRESS ACK
NO
START
RD ACK
STOP
MASTER SENDS
ARA AND READ
COMMAND
DEVICE SENDS
ITS ADDRESS
A read operation is then performed consisting of
the serial bus address, R/W bit set to 1, followed
by the data byte read from the data register. This is
shown in Figure 17.
Figure 18. Use of SMBALERT
SMBALERT Process
1. SMBALERT pulled low.
2. If the address pointer register is known to be at the
desired address already, data can be read from the
corresponding data register without first writing to
the address pointer register.
2. Master initiates a read operation and sends the
alert response address (ARA = 0001 100). This is
a general call address that must not be used as a
specific device address.
3. The device whose ALERT output is low responds
to the ARA and the master reads its device
address. The address of the device is now known,
and it can be interrogated in the usual way.
NOTES:
• It is possible to read a data byte from a data register
without first writing to the address pointer register.
However, it is not possible to write data to a register
without writing to the address pointer register even if
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ADM1023
4. If more than one device’s ALERT output is low,
collector connected to the substrate. Discrete types can be
either PNP or NPN, connected as a diode (base−shorted to
collector). If an NPN transistor is used, the collector and
base are connected to D+ and the emitter to D−. If a PNP
transistor is used, the collector and base are connected to D−
and the emitter to D+.
The user has no choice with substrate transistors, but if a
discrete transistor is used, the best accuracy is achieved by
choosing devices according to the following criteria:
• Base emitter voltage greater than 0.25 V at 6 mA, at the
highest operating temperature.
the one with the lowest device address has priority,
in accordance with normal SMBus arbitration.
5. Once the ADM1023 has responded to the ARA, it
resets its ALERT output, provided that the error
condition that caused the ALERT no longer exists.
If the SMBALERT line remains low, the master
sends ARA again, and so on until all devices
whose ALERT outputs were low have responded.
Low Power Standby Modes
The ADM1023 can be put into a low power standby mode
using hardware or software, that is, by taking the STBY
input low or by setting Bit 6 of the configuration register.
When STBY is high or Bit 6 is low, the ADM1023 operates
normally. When STBY is pulled low or Bit 6 is high, the
ADC is inhibited, and any conversion in progress is
terminated without writing the result to the corresponding
value register.
• Base emitter voltage less than 0.95 V at 100 mA, at the
lowest operating temperature.
• Base resistance less than 100 W.
• Small variation in h (approximately 50 to 150), which
fe
indicates tight control of V characteristics.
BE
Transistors such as 2N3904, 2N3906, or equivalents in
SOT−23 packages are suitable devices to use.
The SMBus is still enabled. Power consumption in the
standby mode is reduced to less than 10 mA if there is no
SMBus activity, or 100 mA if there are clock and data signals
on the bus.
These two modes are similar but not identical. When
STBY is low, conversions are completely inhibited. When
Bit 6 is set, but STBY is high, a one−shot conversion of both
channels can be initiated by writing any data value to the
one−shot register (Address 0x0F).
Thermal Inertia and Self−Heating
Accuracy depends on the temperature of the remote
sensing diode and/or the internal temperature sensor being
at the same temperature as that being measured, and a
number of factors can affect this. Ideally, the sensor should
be in good thermal contact with the part of the system being
measured, such as the processor, for example. If it is not in
good thermal contact, the thermal inertia caused by the mass
of the sensor causes a lag in the response of the sensor to a
temperature change. With the remote sensor, this should not
be a problem, as it will be either a substrate transistor in the
processor or a small package device, such as SOT−23,
placed in close proximity to it.
Sensor Fault Detection
The ADM1023 has a fault detector at the D+ input that
detects if the external sensor diode is open−circuit. This is a
simple voltage comparator that trips if the voltage at D+
exceeds V – 1.0 V (typical). The output of this comparator
is checked when a conversion is initiated and sets Bit 2 of the
status register if a fault is detected.
The on−chip sensor, however, is often remote from the
processor and monitors only the general ambient
temperature around the package. The thermal time constant
of the QSOP−16 package is about 10 seconds.
In practice, the package has electrical, and hence thermal,
connection to the printed circuit board. Therefore, the
temperature rise due to self−heating is negligible.
CC
If the remote sensor voltage falls below the normal
measuring range, for example, due to the diode being
short−circuited, the ADC outputs –128°C (1000 0000 000).
Because the normal operating temperature range of the
device extends only down to 0°C, this output code is never
seen in normal operation and can be interpreted as a fault
condition.
In this respect, the ADM1023 differs from, and improves
upon, competitive devices that output 0 if the external sensor
goes short−circuit. Unlike the ADM1023, these other
devices can misinterpret a genuine 0°C measurement as a
fault condition.
Layout Considerations
Digital boards can be electrically noisy environments, and
the ADM1023 is measuring very small voltages from the
remote sensor; therefore, care must be taken to minimize
noise induced at the sensor inputs. The following
precautions are needed:
• Place the ADM1023 as close as possible to the remote
sensing diode. Provided that the worst noise sources,
such as clock generators, data/address buses, and CRTs,
are avoided, this distance can be 4 to 8 inches.
If the external diode channel is not being used and is
shorted out, the resulting ALERT may be cleared by writing
0x80 (−128°C) to the low limit register.
• Route the D+ and D− tracks close together, in parallel,
with grounded guard tracks on each side. Provide a
ground plane under the tracks if possible (see Figure 19).
Applications
Factors Affecting Accuracy, Remote Sensing Diode
The ADM1023 is designed to work with substrate
transistors built into processors or with discrete transistors.
Substrate transistors are generally PNP types with the
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14
ADM1023
Application Circuits
• Use wide tracks to minimize inductance and reduce
noise pickup. 10 mil track minimum width and spacing
is recommended.
Figure 20 shows a typical application circuit for the
ADM1023, using a discrete sensor transistor connected via
a shielded, twisted−pair cable. The pullups on SCLK,
SDATA, and ALERT are required only if they are not
already provided elsewhere in the system.
10MIL
GND
10MIL
10MIL
D+
0.1μF
3V
TO 5.5V
V
DD
10MIL
ADM1023
D+
D–
10MIL
10MIL
10kΩ 10kΩ 10kΩ
IN
1000pF
SHIELD
TO
CONTROL
CHIP
D–
I/O
OUT
2N3904
GND
10MIL
ALERT
ADD0
SET TO
REQUIRED
ADDRESS
Figure 19. Arrangement of Signal Tracks
ADD1
GND
• Try to minimize the number of copper/solder joints,
which can cause thermocouple effects. Where
copper/solder joints are used, make sure that they are in
both the D+ and D− path and at the same temperature.
Thermocouple effects should not be a major problem as
1°C corresponds to about 240 mV, and thermocouple
voltages are about 3 mV/°C of temperature difference.
Unless there are two thermocouples with a big
Figure 20. Typical Application Circuit
The SCLK and SDATA pins of the ADM1023 can be
interfaced directly to the SMBus of an I/O chip. Figure 21
shows how the ADM1023 might be integrated into a system
using this type of I/O controller.
temperature differential between them, thermocouple
voltages should be much less than 240 mV.
D–
ADM1023
• Place a 0.1 mF bypass capacitor close to the V pin
DD
PROCESSOR
D+
and 1000 pF input filter capacitors across D+, D− close
to the ADM1023.
• If the distance to the remote sensor is more than 8
inches, the use of twisted pair cable is recommended.
This is effective up to approximately 6 to 12 feet.
SYSTEM BUS
DISPLAY
SYSTEM
MEMORY
GMCH
• For longer distances (up to 100 feet), use shielded,
twisted−pair cable such as Belden #8451 microphone
cable. Connect the twisted pair to D+ and D−, and
connect the shield to GND close to the ADM1023.
Leave the remote end of the shield unconnected to
avoid ground loops.
DISPLAY
CACHE
PCI SLOTS
HARD
DISK
CD ROM
PCI BUS
ICH I/O
CONTROLLER
HUB
2 IDE PORTS
SMBUS
SUPER I/O
Because the measurement technique uses switched
current sources, excessive cable and/or filter capacitance
can affect the measurement. When using long cables, the
filter capacitor may be reduced or removed.
USB USB
FWH
(FIRMWARE
HUB)
2 USB PORTS
Cable resistance can also introduce errors. A 1 W series
resistance introduces about 1°C error.
Figure 21. System Using ADM1023 and I/O Controller
ORDERING INFORMATION
†
Device Number
ADM1023ARQZ
Temperature Range
0°C to +120°C
Package Type
16−Lead QSOP
16−Lead QSOP
16−Lead QSOP
Package Option
RQ−16
Shipping
98 Tube
ADM1023ARQZ−REEL
ADM1023ARQZ−R7
0°C to +120°C
RQ−16
2500 Tape & Reel
1000 Tape & Reel
0°C to +120°C
RQ−16
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*The “Z’’ suffix indicates Pb−Free part.
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15
ADM1023
PACKAGE DIMENSIONS
QSOP16
CASE 492−01
ISSUE O
−A−
Q
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
R
2. CONTROLLING DIMENSION: INCH.
3. THE BOTTOM PACKAGE SHALL BE BIGGER THAN
THE TOP PACKAGE BY 4 MILS (NOTE: LEAD SIDE
ONLY). BOTTOM PACKAGE DIMENSION SHALL
FOLLOW THE DIMENSION STATED IN THIS
DRAWING.
4. PLASTIC DIMENSIONS DOES NOT INCLUDE MOLD
FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 6 MILS PER
SIDE.
H x 45
_
U
RAD.
0.013 X 0.005
DP. MAX
−B−
5. BOTTOM EJECTOR PIN WILL INCLUDE THE
COUNTRY OF ORIGIN (COO) AND MOLD CAVITY I.D.
MOLD PIN
MARK
INCHES
MIN
MILLIMETERS
DIM
A
B
C
D
F
MAX
0.196
0.157
0.068
0.012
0.035
MIN
4.80
3.81
1.55
0.20
0.41
MAX
4.98
3.99
1.73
0.31
0.89
0.189
0.150
0.061
0.008
0.016
RAD.
0.005−0.010
TYP
G
G
H
J
0.025 BSC
0.64 BSC
L
0.008 0.018
0.0098 0.0075
0.20
0.249
0.10
5.84
0
0.46
0.191
0.25
6.20
8
P
DETAIL E
M
0.25 (0.010)
T
K
L
0.004
0.230
0
0.010
0.244
8
M
N
P
_
_
_
_
0
0.007
7
0.011
0
0.18
7
0.28
_
_
_
_
Q
R
U
V
0.020 DIA
0.51 DIA
V
K
0.025
0.025
0
0.035
0.035
8
0.64
0.64
0
0.89
0.89
8
C
N 8 PL
_
_
_
_
−T−
D16 PL
0.25 (0.010)
SEATING
PLANE
M
S
S
A
T
B
J
M
F
DETAIL E
Protected by U.S. Patents 5,195,827; 5,867,012; 5,982,221; 6,097,239; 6,133,753; 6,169,442; other patents pending.
Pentium is a registered trademark of Intel Corporation.
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