74LCXH245MTCX [ONSEMI]
低电压双向收发器,带总线保持;型号: | 74LCXH245MTCX |
厂家: | ONSEMI |
描述: | 低电压双向收发器,带总线保持 光电二极管 逻辑集成电路 |
文件: | 总12页 (文件大小:316K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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October 2000
Revised September 2001
74LCXH245
Low Voltage Bidirectional Transceiver with Bushold
General Description
Features
The LCXH245 contains eight non-inverting bidirectional
buffers with 3-STATE outputs and is intended for bus ori-
ented applications. The device is designed for low voltage
(2.5V and 3.3V) VCC applications. The T/R input deter-
■ 5V tolerant control inputs
■ 2.3V–3.6V VCC specifications provided
■ 7.0 ns tPD max (VCC = 3.3V), 10 µA ICC max
■ Power down high impedance outputs
■ ±24 mA output drive (VCC = 3.0V)
mines the direction of data flow through the device. The OE
input disables both the A and B ports by placing them in a
high impedance state.
■ Implements patented noise/EMI reduction circuitry
■ Latch-up performance exceeds 500 mA
The LCXH245 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power dissipation. The LCXH16244 data inputs
include active bushold circuitry, eliminating the need for
external pull-up resistors to hold unused or floating data
inputs at a valid logic level.
■ Bushold on inputs eliminates the need for external
pull-up/pull-down resistors
■ ESD performance:
Human body model > 2000V
Machine model > 200V
Ordering Code:
Order Number Package Number
Package Description
74LCXH245WM
74LCXH245SJ
74LCXH245MSA
74LCXH245MTC
M20B
M20D
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MSA20
MTC20
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
Connection Diagram
Pin Descriptions
Pin Names
Description
OE
Output Enable Input
Transmit/Receive Input
T/R
A0–A7
B0–B7
Side A Inputs or 3-STATE Outputs (Bushold)
Side B Inputs or 3-STATE Outputs (Bushold)
GTO is a trademark of Fairchild Semiconductor Corporation.
© 2001 Fairchild Semiconductor Corporation
DS500363
www.fairchildsemi.com
Truth Table
Inputs
Outputs
OE
L
T/R
L
Bus B0 – B7 Data to Bus A0 – A7
L
H
Bus A0 – A7 Data to Bus B0 – B7
HIGH Z State on A0 – A7, B0 – B7 (Note 1)
H
X
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
Note 1: Unused bus terminals during HIGH Z State must be held HIGH or LOW.
Logic Diagram
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2
Absolute Maximum Ratings(Note 2)
Symbol
Parameter
Supply Voltage
Value
Conditions
Units
VCC
−0.5 to +7.0
V
VI
T/R, OE
0.5 to +7.0
−0.5 to VCC + 0.5
−0.5 to +7.0
V
I/O Ports
VO
DC Output Voltage
Output in 3-STATE
V
−0.5 to VCC + 0.5 Output in HIGH or LOW State (Note 3)
IIK
DC Input Diode Current
DC Output Diode Current
−50
−50
VI < GND
mA
mA
IOK
V
V
O < GND
O > VCC
+50
IO
DC Output Source/Sink Current
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature
±50
mA
mA
mA
°C
ICC
±100
IGND
TSTG
±100
−65 to +150
Recommended Operating Conditions (Note 4)
Symbol
Parameter
Min
2.0
1.5
0
Max
3.6
3.6
VCC
VCC
5.5
±24
±12
±8
Units
VCC
Supply Voltage
Operating
Data Retention
V
V
V
VI
Input Voltage
VO
Output Voltage
HIGH or LOW State
3-STATE
0
0
IOH/IOL
Output Current
VCC = 3.0V − 3.6V
V
CC = 2.7V - 3.0V
CC = 2.3V - 2.7V
mA
V
TA
Free-Air Operating Temperature
−40
85
°C
∆t/∆V
Input Edge Rate, VIN = 0.8V − 2.0V, VCC = 3.0V
0
10
ns/V
Note 2: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated
at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recom-
mended Operating Conditions” table will define the conditions for actual device operation.
Note 3: IO Absolute Maximum Rating must be observed.
Note 4: Floating or unused control inputs must be HIGH or LOW.
DC Electrical Characteristics
VCC
TA = −40°C to +85°C
Symbol
VIH
Parameter
Conditions
Units
(V)
2.3 − 2.7
2.7 − 3.6
2.3 − 2.7
2.7 - 3.6
2.3 - 3.6
2.3
Min
1.7
2.0
Max
HIGH Level Input Voltage
V
V
VIL
LOW Level Input Voltage
HIGH Level Output Voltage
0.7
0.8
VOH
I
I
I
I
I
I
I
I
I
I
OH = −100 µA
V
CC − 0.2
OH = −8 mA
OH = −12 mA
OH = −18 mA
OH = −24 mA
OL = 100 µA
OL = 8mA
1.8
2.7
2.2
V
3.0
2.4
3.0
2.2
VOL
LOW Level Output Voltage
Input Leakage Current
2.3 − 3.6
2.3
0.2
0.6
OL = 12 mA
OL = 16 mA
OL = 24 mA
2.7
0.4
V
3.0
0.4
3.0
0.55
±5.0
II
VI = VCC or GND
2.3 − 3.6
µA
3
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DC Electrical Characteristics (Continued)
VCC
(V)
TA = −40°C to +85°C
Symbol
II(HOLD)
Parameter
Conditions
IN = 0.7V
Units
Min
45
Max
Bushold Input Minimum
Drive Hold Current
V
V
V
V
2.3
3.0
2.7
3.6
IN = 1.7V
IN = 0.8V
IN = 2.0V
−45
75
µA
−75
300
−300
450
−450
II(OD)
Bushold Input Over-Drive
Current to Change State
(Note 6)
(Note 7)
(Note 6)
(Note 7)
µA
IOZ
ICC
3-STATE I/O Leakage
V
O = VCC or GND
2.3 − 3.6
2.3 − 3.6
2.3 − 3.6
2.3 - 3.6
±5.0
10
µA
µA
µA
Quiescent Supply Current
VI = VCC or GND
3.6V ≤ VI, VO ≤ 5.5V (Note 5)
±10
500
∆ICC
Increase in ICC per Input
VIH = VCC −0.6V
Note 5: Outputs disabled or 3-STATE only.
Note 6: An external driver must source at least the specified current to switch from LOW-to-HIGH.
Note 7: An external driver must sink at least the specified current to switch from HIGH-to-LOW.
AC Electrical Characteristics
T
A = −40°C to +85°C, RL = 500Ω
CC = 2.7V
L = 50 pF
V
CC = 3.3V ± 0.3V
V
V
CC = 2.5V ± 0.2V
Symbol
Parameter
Units
CL = 50 pF
C
CL = 30 pF
Min
1.5
1.5
1.5
1.5
1.5
1.5
Max
7.0
7.0
8.5
8.5
7.5
7.5
1.0
1.0
Min
1.5
1.5
1.5
1.5
1.5
1.5
Max
8.0
8.0
9.5
9.5
8.5
8.5
Min
1.5
1.5
1.5
1.5
1.5
1.5
Max
tPHL
tPLH
tPZL
tPZH
tPLZ
Propagation Delay
An to Bn or Bn to An
Output Enable Time
8.4
ns
ns
ns
ns
8.4
10.5
10.5
9.0
Output Disable Time
tPHZ
tOSHL
tOSLH
9.0
Output to Output Skew
(Note 8)
Note 8: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH).
Dynamic Switching Characteristics
VCC
TA = 25°C
Symbol
VOLP
Parameter
Conditions
Units
(V)
3.3
2.5
3.3
2.5
Typical
0.8
Quiet Output Dynamic Peak VOL
C
C
C
C
L = 50 pF, VIH = 3.3V, VIL = 0V
L = 30 pF, VIH = 2.5V, VIL = 0V
L = 50 pF, VIH = 3.3V, V IL = 0V
L = 30 pF, VIH = 2.5V, VIL = 0V
V
V
0.6
VOLV
Quiet Output Dynamic Valley VOL
−0.8
−0.6
Capacitance
Symbol
Parameter
Conditions
Typical
Units
pF
CIN
Input Capacitance
V
CC = Open, VI = 0V or VCC
7
8
CI/O
CPD
Input/Output Capacitance
V
CC = 3.3V, VI = 0V or VCC
pF
Power Dissipation Capacitance
V
CC = 3.3V, VI = 0V or VCC, f = 10 MHz
25
pF
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4
AC LOADING and WAVEFORMS Generic for LCX Family
FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance)
Test
tPLH, tPHL
PZL, tPLZ
Switch
Open
t
6V at VCC = 3.3 ± 0.3V; and 2.7V
VCC x 2 at VCC = 2.5 ± 0.2V
tPZH, tPHZ
GND
3-STATE Output High Enable and
Disable Times for Logic
Waveform for Inverting and Non-Inverting Functions
Setup Time, Hold Time and Recovery Time for Logic
Propagation Delay. Pulse Width and trec Waveforms
trise and tfall
3-STATE Output Low Enable and
Disable Times for Logic
FIGURE 2. Waveforms
(Input Characteristics; f =1MHz, tr = tf = 3ns)
VCC
Symbol
Vmi
3.3V ± 0.3V
1.5V
1.5V
2.7V
2.5V ± 0.2V
VCC/2
VCC/2
1.5V
1.5V
Vmo
Vx
V
V
OL + 0.3V
OH − 0.3V
V
V
OL + 0.3V
OH − 0.3V
V
V
OL + 0.15V
OH − 0.15V
Vy
5
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Schematic Diagram Generic for LCXH Family (with Bushold)
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6
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package Number M20B
7
www.fairchildsemi.com
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
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8
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
Package Number MSA20
9
www.fairchildsemi.com
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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www.fairchildsemi.com
10
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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