2N5302G [ONSEMI]

High−Power NPN Silicon Transistor; 高功率NPN硅晶体管
2N5302G
型号: 2N5302G
厂家: ONSEMI    ONSEMI
描述:

High−Power NPN Silicon Transistor
高功率NPN硅晶体管

晶体 晶体管
文件: 总5页 (文件大小:93K)
中文:  中文翻译
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2N5302  
High−Power NPN Silicon  
Transistor  
High−power NPN silicon transistors are for use in power amplifier  
and switching circuits applications.  
Features  
http://onsemi.com  
Low Collector−Emitter Saturation Voltage −  
V
CE(sat)  
= 0.75 Vdc (Max) @ I = 10 Adc  
C
30 AMPERES  
POWER TRANSISTOR  
NPN SILICON  
Pb−Free Package is Available*  
MAXIMUM RATINGS (Note 1) (T = 25°C unless otherwise noted)  
J
60 VOLTS, 200 WATTS  
Rating  
Collector−Emitter Voltage  
Collector−Base Voltage  
Collector Current − Continuous (Note 2)  
Base Current  
Symbol  
Value  
60  
Unit  
Vdc  
Vdc  
Adc  
Adc  
V
CEO  
V
60  
CB  
I
30  
C
B
I
7.5  
Total Device Dissipation @ T = 25_C  
P
200  
1.14  
W
C
D
Derate above 25_C  
W/_C  
_C  
Operating and Storage Junction  
Temperature Range  
T , T  
J
65 to +200  
stg  
TO−204AA (TO−3)  
CASE 1−07  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
0.875  
34  
Unit  
_C/W  
_C/W  
STYLE 1  
Thermal Resistance, Junction−to−Case  
Thermal Resistance, Case−to−Ambient  
q
JC  
q
CA  
MARKING DIAGRAM  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Indicates JEDEC Registered Data.  
2. Pulse Test: Pulse Width = 5 ms, Duty Cycle 10%.  
2N5302G  
AYYWW  
MEX  
T
T
C
8.0 200  
A
6.0 150  
T
C
4.0 100  
2.0 50  
T
A
2N5302 = Device Code  
G
A
YY  
WW  
MEX  
= Pb−Free Package  
= Location Code  
= Year  
= Work Week  
= Country of Origin  
0
0
0
20  
40  
60  
80  
100 120 140 160 180 200  
ORDERING INFORMATION  
TEMPERATURE (°C)  
Device  
Package  
Shipping  
Figure 1. Power Temperature Derating Curve  
2N5302  
TO−204  
100 Units/Tray  
100 Units/Tray  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
2N5302G  
TO−204  
(Pb−Free)  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
March, 2006− Rev. 2  
2N5302/D  
 
−2.0 V  
                                      
2N5302  
ELECTRICAL CHARACTERISTICS (T = 25_C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Max  
Unit  
OFF CHARACTERISTICS (Note 3)  
Collector−Emitter Sustaining Voltage (Note 4)  
V
Vdc  
CEO(sus)  
(I = 200 mAdc, I = 0)  
60  
C
B
Collector Cutoff Current  
(V = 60 Vdc, I = 0)  
I
mAdc  
mAdc  
mAdc  
mAdc  
mAdc  
CEO  
5.0  
1.0  
10  
CE  
B
Collector Cutoff Current  
(V = 60 Vdc, V  
I
I
CEX  
CEX  
CBO  
EBO  
= 1.5 Vdc)  
EB(off)  
CE  
Collector Cutoff Current  
(V = 60 Vdc, V  
= 1.5 Vdc, T = 150_C)  
CE  
EB(off)  
C
Collector Cutoff Current  
I
I
(V = 80 Vdc, I = 0)  
1.0  
5.0  
CB  
E
Emitter Cutoff Current (V = 5.0 Vdc, I = 0)  
BE  
C
ON CHARACTERISTICS  
DC Current Gain (Note 4)  
*(I = 1.0 Adc, V = 2.0 Vdc)  
h
FE  
C
CE  
40  
15  
5.0  
60  
*(I = 15 Adc, V = 2.0 Vdc)  
C
CE  
*(I = 30 Adc, V = 4.0 Vdc)  
C
CE  
*Collector−Emitter Saturation Voltage (Note 4)  
(I = 10 Adc, I = 1.0 Adc)  
V
V
Vdc  
Vdc  
Vdc  
CE(sat)  
BE(sat)  
C
B
0.75  
2.0  
3.0  
(I = 20 Adc, I = 2.0 Adc)2  
C
B
(I = 30 Adc, I = 6.0 Adc)  
C
B
*Base Emitter Saturation Voltage (Note 4)  
(I = 10 Adc, I = 1.0 Adc)  
C
B
1.7  
1.8  
2.5  
(I = 15 Adc, I = 1.5 Adc)  
C
B
(I = 20 Adc, I = 2.0 Adc)  
C
B
*Base−Emitter On Voltage (Note 4)  
(I = 15 Adc, V = 2.0 Vdc)  
V
BE(on)  
1.7  
3.0  
C
CE  
(I = 30 Adc, V = 4.0 Vdc)  
C
CE  
DYNAMIC CHARACTERISTICS (Note 3)  
Current−Gain − Bandwidth Product (I = 1.0 Adc, V = 10 Vdc, f = 1.0 MHz)  
f
T
2.0  
40  
MHz  
C
CE  
Small−Signal Current Gain (I = 1.0 Adc, V = 10 Vdc, f = 1.0 kHz)  
h
fe  
C
CE  
SWITCHING CHARACTERISTICS (Note 3)  
Rise Time  
t
1.0  
2.0  
1.0  
ms  
ms  
ms  
r
Storage Time  
Fall Time  
(V = 30 Vdc, I = 10 Adc, I = I = 1.0 Adc)  
t
CC  
C
B1  
B2  
s
t
f
3. Indicates JEDEC Registered Data.  
4. Pulse Width v 300 ms, Duty Cycle v 2.0%.  
SWITCHING TIME EQUIVALENT TEST CIRCUITS  
V
CC  
INPUT PULSE  
ꢀt 20 ns  
V
INPUT PULSE  
ꢀt 20 ns  
+ꢁ30 V  
CC  
+ꢁ30 V  
r
ꢀPW = 10 to 100 ms  
ꢀDUTY CYCLE = 2.0%  
r
ꢀPW = 10 to 100 ms  
ꢀDUTY CYCLE = 2.0%  
3.0  
3.0  
+11 V  
0
+11 V  
TO  
SCOPE  
10  
TO  
SCOPE  
10  
t 20 ns  
r
t 20 ns  
r
D
−ꢁ9.0 V  
V
= 7.0 V  
BB  
Figure 2. Turn−On time  
Figure 3. Turn−Off time  
http://onsemi.com  
2
 
2N5302  
1.0  
0.7  
0.5  
D = 0.5  
0.3  
0.2  
0.2  
0.1  
P
(pk)  
q
q
(t) = r(t) q  
JC  
JC  
0.1  
= 0.875°C/W MAX  
JC  
0.05  
0.07  
0.05  
D CURVES APPLY FOR POWER  
PULSE TRAIN SHOWN  
READ TIME AT t  
0.02  
0.01  
t
1
0.03  
0.02  
1
t
2
T
− T = P  
C
q (t)  
SINGLE PULSE  
J(pk)  
(pk) JC  
DUTY CYCLE, D = t /t  
1 2  
0.01  
0.02  
0.03 0.05 0.1  
0.2 0.3  
0.5  
1.0  
2.0 3.0 5.0  
10  
20 30  
50  
100  
200 300 500  
1000 2000  
t, TIME (ms)  
Figure 4. Thermal Response  
100  
3000  
2000  
50  
100 ms  
T = 25°C  
J
20  
10  
1000  
500  
5.0 ms  
5302  
C
5.0  
2.0  
dc  
ib  
1.0 ms  
T = 200°C  
J
Secondary Breakdown Limited  
Bonding Wire Limited  
C
ob  
1.0  
0.5  
T = 25°C  
C
300  
200  
Thermal Limitations  
Pulse Duty Cycle 10%  
2N5302  
0.2  
0.1  
100  
1.0  
2.0 3.0  
5.0  
10  
20 30  
50  
100  
0.5  
1.0  
2.0 3.0  
5.0 7.0 10  
20 30  
50  
V
, COLLECTOR−EMITTER VOLTAGE (VOLTS)  
V , REVERSE VOLTAGE (VOLTS)  
R
CE  
Figure 5. Active−Region Safe Operating Area  
Figure 6. Capacitance versus Voltage  
3.0  
5.0  
T = 25°C  
J
3.0  
2.0  
T = 25°C  
C B  
I
= I  
B1 B2  
I /I = 10  
J
I /I = 10  
C B  
t ′  
s
t ′ ≈ t − 1/8 t  
s
s
f
1.0  
0.7  
0.5  
1.0  
0.7  
0.5  
t @ V = 30 V  
r CC  
t @ V = 30 V  
f CC  
0.3  
0.2  
0.3  
t @ V = 10 V  
f CC  
t @ V = 10 V  
r CC  
0.1  
t @ V = 2.0 V  
d OB  
0.07  
0.05  
0.1  
0.03 0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0  
10  
20 30  
0.03 0.05 0.1  
0.3 0.5  
1.0 3.0  
5.0  
10  
30  
I , COLLECTOR CURRENT (AMP)  
C
I , COLLECTOR CURRENT (AMP)  
C
Figure 7. Turn−On Time  
Figure 8. Turn−Off Time  
http://onsemi.com  
3
                                                
                                                          
                                                                      
0.4  
0.3  
0.2 −ꢁ0.1  
0
0.1 0.2  
0.3 0.4  
0.5 0.6  
2N5302  
300  
200  
2.0  
V
V
= 10 V  
= 2.0 V  
CE  
CE  
T = 175°C  
J
T = 25°C  
J
1.6  
1.2  
0.8  
0.4  
0
I
C
= 2.0 A 5.0 A  
10 A  
20 A  
25°C  
100  
70  
50  
−ꢁ55°C  
30  
20  
10  
0.03 0.05 0.1 0.3 0.5  
1.0 3.0  
5.0  
10  
30  
0.01 0.02  
0.05 0.1 0.2  
0.5  
1.0 2.0  
5.0  
10  
I , COLLECTOR CURRENT (AMP)  
C
I , BASE CURRENT (AMP)  
B
Figure 9. DC Current Gain  
Figure 10. Collector Saturation Region  
8
7
10  
10  
2.0  
1.8  
V
= 30 V  
CE  
T = 25°C  
J
1.6  
1.4  
1.2  
1.0  
0.8  
I
= 10 x I  
CES  
C
6
5
4
3
2
10  
10  
10  
10  
10  
I
C
= 2 x I  
CES  
I
I  
CES  
C
V
V
@ I /I = 10  
C B  
BE(sat)  
0.6  
0.4  
0.2  
0
V
@ V = 2.0 V  
CE  
BE(on)  
CE(sat)  
TYPICAL I  
VALUES OBTAINED  
CES  
FROM FIGURE 13  
@ I /I = 10  
C B  
0
20  
40  
60  
80 100 120 140 160 180 200  
0.03 0.05 0.1 0.3  
0.5  
1.0 3.0 5.0  
10  
30  
T , JUNCTION TEMPERATURE (°C)  
J
I , COLLECTOR CURRENT (AMP)  
C
Figure 11. Effects of Base−Emitter Resistance  
Figure 12. “On” Voltages  
3
2
1
0
10  
10  
10  
10  
+ꢁ2.5  
+ꢁ2.0  
+ꢁ1.5  
+ꢁ1.0  
+ꢁ0.5  
0
V
= 30 V  
T = −ꢁ55°C to +175°C  
CE  
J
T = 175°C  
J
h
FEꢀ  
@ꢀV  
+ꢀ 2.0ꢀV  
CEꢀ  
2
*APPLIES FOR I /I  
<
C B  
100°C  
25°C  
*qV for V  
C
CE(sat)  
I
C
= I  
CES  
−ꢁ0.5  
−ꢁ1.0  
−1  
ꢁ 2  
10  
10  
qV for V  
B
−ꢁ1.5  
−ꢁ2.0  
−ꢁ2.5  
BE(sat)  
REVERSE  
FORWARD  
ꢁ 3  
10  
0.03 0.05 0.1 0.3  
0.5  
1.0 3.0 5.0  
10  
30  
V
, BASE−EMITTER VOLTAGE (VOLTS)  
I , COLLECTOR CURRENT (AMP)  
C
BE  
Figure 13. Collector Cut−Off Region  
Figure 14. Temperature Coefficients  
http://onsemi.com  
4
 
2N5302  
PACKAGE DIMENSIONS  
TO−204 (TO−3)  
CASE 1−07  
ISSUE Z  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
A
N
2. CONTROLLING DIMENSION: INCH.  
3. ALL RULES AND NOTES ASSOCIATED WITH  
REFERENCED TO−204AA OUTLINE SHALL APPLY.  
C
SEATING  
PLANE  
−T−  
E
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN MAX  
39.37 REF  
−−− 26.67  
K
D 2 PL  
A
B
C
D
E
G
H
K
L
1.550 REF  
−−− 1.050  
M
M
M
Y
0.13 (0.005)  
T
Q
0.250  
0.038  
0.055  
0.335  
0.043  
0.070  
6.35  
0.97  
1.40  
8.51  
1.09  
1.77  
U
−Y−  
L
V
H
0.430 BSC  
0.215 BSC  
0.440 0.480  
0.665 BSC  
−−− 0.830  
10.92 BSC  
5.46 BSC  
11.18 12.19  
16.89 BSC  
−−− 21.08  
2
1
B
G
N
Q
U
V
0.151  
1.187 BSC  
0.131 0.188  
0.165  
3.84  
30.15 BSC  
3.33  
4.19  
4.77  
−Q−  
0.13 (0.005)  
M
M
Y
T
STYLE 1:  
PIN 1. BASE  
2. EMITTER  
CASE: COLLECTOR  
ON Semiconductor and  
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
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2N5302/D  

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