2N5060 [ONSEMI]

Sensitive Gate Silicon Controlled Rectifiers; 敏感栅硅控整流器
2N5060
型号: 2N5060
厂家: ONSEMI    ONSEMI
描述:

Sensitive Gate Silicon Controlled Rectifiers
敏感栅硅控整流器

栅极
文件: 总8页 (文件大小:74K)
中文:  中文翻译
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2N5060 Series  
Preferred Device  
Sensitive Gate  
Silicon Controlled Rectifiers  
Reverse Blocking Thyristors  
Annular PNPN devices designed for high volume consumer  
applications such as relay and lamp drivers, small motor controls, gate  
drivers for larger thyristors, and sensing and detection circuits.  
Supplied in an inexpensive plastic TO−92/TO-226AA package which  
is readily adaptable for use in automatic insertion equipment.  
http://onsemi.com  
SILICON CONTROLLED  
RECTIFIERS  
0.8 A RMS, 30 − 200 V  
Features  
Sensitive Gate Trigger Current − 200 mA Maximum  
Low Reverse and Forward Blocking Current − 50 mA Maximum,  
T = 110°C  
G
C
Low Holding Current − 5 mA Maximum  
Passivated Surface for Reliability and Uniformity  
Device Marking: Device Type, e.g., 2N5060, Date Code  
Pb−Free Packages are Available*  
A
K
MARKING  
DIAGRAM  
2N  
50xx  
YWW  
1
TO−92  
CASE 29  
STYLE 10  
2
3
50xx  
Y
Specific Device Code  
= Year  
WW  
= Work Week  
PIN ASSIGNMENT  
Cathode  
1
2
3
Gate  
Anode  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
Preferred devices are recommended choices for future use  
and best overall value.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
January, 2005 − Rev. 7  
2N5060/D  
2N5060 Series  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol  
Value  
Unit  
Peak Repetitive Off−State Voltage (Note 1)  
V
DRM,  
V
(T = *40 to 110°C, Sine Wave,  
J
V
RRM  
50 to 60 Hz, Gate Open)  
2N5060  
2N5061  
2N5062  
2N5064  
30  
60  
100  
200  
On-State Current RMS (180° Conduction Angles; T = 80°C)  
I
0.8  
A
A
C
T(RMS)  
*Average On-State Current  
I
T(AV)  
(180° Conduction Angles)  
(T = 67°C)  
C
0.51  
(T = 102°C)  
C
0.255  
*Peak Non-repetitive Surge Current,  
I
10  
A
TSM  
T = 25°C  
A
(1/2 cycle, Sine Wave, 60 Hz)  
2
2
Circuit Fusing Considerations (t = 8.3 ms)  
I t  
0.4  
A s  
*Average On-State Current  
I
A
T(AV)  
(180° Conduction Angles)  
(T = 67°C)  
C
0.51  
(T = 102°C)  
C
0.255  
*Forward Peak Gate Power (Pulse Width v 1.0 msec; T = 25°C)  
P
0.1  
0.01  
W
W
A
A
GM  
*Forward Average Gate Power (T = 25°C, t = 8.3 ms)  
P
G(AV)  
A
*Forward Peak Gate Current (Pulse Width v 1.0 msec; T = 25°C)  
I
1.0  
A
GM  
*Reverse Peak Gate Voltage (Pulse Width v 1.0 msec; T = 25°C)  
V
RGM  
5.0  
V
A
*Operating Junction Temperature Range  
*Storage Temperature Range  
T
−40 to +110  
−40 to +150  
°C  
°C  
J
T
stg  
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit  
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,  
damage may occur and reliability may be affected.  
1. V  
and V  
for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate  
DRM  
RRM  
voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current  
source such that the voltage ratings of the devices are exceeded.  
THERMAL CHARACTERISTICS  
Characteristic  
*Thermal Resistance, Junction−to−Case (Note 2)  
Thermal Resistance, Junction−to−Ambient  
Symbol  
Max  
75  
Unit  
°C/W  
°C/W  
°C  
R
q
JC  
JA  
R
200  
q
*Lead Solder Temperature (Lead Length q 1/16from case, 10 s Max)  
+230*  
2. This measurement is made with the case mounted “flat side down” on a heatsink and held in position by means of a metal clamp over the  
curved surface.  
*Indicates JEDEC Registered Data.  
http://onsemi.com  
2
 
2N5060 Series  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Characteristic  
OFF CHARACTERISTICS  
Symbol  
Min  
Typ  
Max  
Unit  
*Peak Repetitive Forward or Reverse Blocking Current (Note 3)  
I
, I  
DRM RRM  
(V = Rated V  
or V  
)
T
C
T
C
= 25°C  
= 110°C  
10  
50  
mA  
mA  
AK  
DRM  
RRM  
ON CHARACTERISTICS  
*Peak Forward On−State Voltage (Note 4)  
(I = 1.2 A peak @ T = 25°C)  
V
TM  
1.7  
V
TM  
A
Gate Trigger Current (Continuous DC) (Note 5)  
*(V = 7.0 Vdc, R = 100 W)  
I
mA  
GT  
T
C
T
C
= 25°C  
= −40°C  
200  
350  
AK  
L
Gate Trigger Voltage (Continuous DC) (Note 5)  
*(V = 7.0 Vdc, R = 100 W)  
T
C
T
C
= 25°C  
= −40°C  
V
0.8  
1.2  
V
V
GT  
AK  
L
*Gate Non−Trigger Voltage  
(V = Rated V , R = 100 W) T = 110°C  
V
GD  
0.1  
AK  
DRM  
L
C
Holding Current (Note 5)  
T
T
= 25°C  
= −40°C  
I
5.0  
10  
mA  
ms  
C
C
H
*(V = 7.0 Vdc, initiating current = 20 mA)  
AK  
Turn-On Time  
Delay Time  
Rise Time  
t
t
3.0  
0.2  
d
r
(I = 1.0 mA, V = Rated V ,  
DRM  
GT  
D
Forward Current = 1.0 A, di/dt = 6.0 A/ms  
Turn-Off Time  
t
ms  
q
(Forward Current = 1.0 A pulse,  
Pulse Width = 50 ms,  
0.1% Duty Cycle, di/dt = 6.0 A/ms,  
dv/dt = 20 V/ms, I = 1 mA)  
2N5060, 2N5061  
2N5062, 2N5064  
10  
30  
GT  
DYNAMIC CHARACTERISTICS  
Critical Rate of Rise of Off−State Voltage  
dv/dt  
30  
V/ms  
(Rated V  
, Exponential)  
DRM  
3. R = 1000 W is included in measurement.  
GK  
4. Forward current applied for 1 ms maximum duration, duty cycle p 1%.  
5. R current is not included in measurement.  
GK  
*Indicates JEDEC Registered Data.  
Voltage Current Characteristic of SCR  
+ Current  
Anode +  
V
TM  
Symbol  
Parameter  
V
Peak Repetitive Off State Forward Voltage  
Peak Forward Blocking Current  
Peak Repetitive Off State Reverse Voltage  
Peak Reverse Blocking Current  
Peak on State Voltage  
DRM  
DRM  
on state  
I
I
H
I
at V  
RRM  
RRM  
V
RRM  
RRM  
I
V
TM  
+ Voltage  
I
H
Holding Current  
I
at V  
DRM  
Reverse Blocking Region  
(off state)  
DRM  
Forward Blocking Region  
(off state)  
Reverse Avalanche Region  
Anode −  
http://onsemi.com  
3
 
2N5060 Series  
CURRENT DERATING  
130  
130  
110  
90  
a
α = CONDUCTION ANGLE  
α
α = CONDUCTION ANGLE  
120  
110  
100  
90  
CASE MEASUREMENT  
POINT − CENTER OF  
FLAT PORTION  
TYPICAL PRINTED  
CIRCUIT BOARD  
MOUNTING  
dc  
70  
80  
dc  
α = 30°  
180°  
120°  
60°  
90°  
70  
50  
30  
60  
50  
α = 30°  
60° 90° 120°  
180°  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0
0.1  
0.2  
0.3  
0.4  
I
, AVERAGE ON-STATE CURRENT (AMP)  
I
, AVERAGE ON-STATE CURRENT (AMP)  
T(AV)  
T(AV)  
Figure 1. Maximum Case Temperature  
Figure 2. Maximum Ambient Temperature  
CURRENT DERATING  
10  
5.0  
7.0  
5.0  
3.0  
2.0  
T = 110°C  
J
25°C  
3.0  
2.0  
1.0  
0.7  
0.5  
1.0  
1.0  
2.0 3.0  
5.0 7.0 10  
20 30  
50 70 100  
0.3  
0.2  
NUMBER OF CYCLES  
Figure 4. Maximum Non−Repetitive Surge Current  
0.8  
0.6  
0.4  
180°  
120°  
0.1  
a
90°  
60°  
0.07  
0.05  
α = CONDUCTION ANGLE  
α = 30°  
0.03  
0.02  
dc  
0.2  
0
0.01  
0
0.5  
1.0  
1.5  
2.0  
2.5  
0
0.1  
0.2  
0.3  
0.4  
0.5  
v , INSTANTANEOUS ON-STATE VOLTAGE (VOLTS)  
T
I
, AVERAGE ON-STATE CURRENT (AMP)  
T(AV)  
Figure 3. Typical Forward Voltage  
Figure 5. Power Dissipation  
http://onsemi.com  
4
2N5060 Series  
1.0  
0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
0.002  
0.005  
0.01  
0.02  
0.05  
0.1  
0.2  
0.5  
1.0  
2.0  
5.0  
10  
20  
t, TIME (SECONDS)  
Figure 6. Thermal Response  
TYPICAL CHARACTERISTICS  
0.8  
0.7  
0.6  
0.5  
200  
V
= 7.0 V  
AK  
R = 100  
V
= 7.0 V  
AK  
R = 100  
100  
50  
L
L
R
= 1.0 k  
GK  
2N5062-64  
20  
10  
5.0  
2N5060-61  
2.0  
1.0  
0.5  
0.4  
0.3  
0.2  
75  
−50  
−25  
0
25  
50  
75  
100 110  
−75  
−50  
−25  
0
25  
50  
75  
100 110  
T , JUNCTION TEMPERATURE (°C)  
J
T , JUNCTION TEMPERATURE (°C)  
J
Figure 8. Typical Gate Trigger Current  
Figure 7. Typical Gate Trigger Voltage  
4.0  
3.0  
V
= 7.0 V  
AK  
R = 100  
L
R
GK  
= 1.0 k  
2.0  
2N5060,61  
1.0  
0.8  
2N5062-64  
0.6  
0.4  
−75  
−50  
−25  
0
25  
50  
75  
100 110  
T , JUNCTION TEMPERATURE (°C)  
J
Figure 9. Typical Holding Current  
http://onsemi.com  
5
2N5060 Series  
ORDERING INFORMATION  
Device  
Package  
TO−92  
Shipping  
2N5060  
5,000 Units / Box  
2,000 / Tape & Reel  
2,000 / Tape & Reel  
2N5060RLRA  
TO−92  
2N5060RLRAG  
TO−92  
(Pb−Free)  
2N5060RLRM  
2N5061  
TO−92  
TO−92  
2,000 / Ammo Pack  
5,000 Units / Box  
5,000 Units / Box  
2N5061G  
TO−92  
(Pb−Free)  
2N5061RLRA  
TO−92  
2,000 / Tape & Reel  
2,000 / Tape & Reel  
2N5061RLRAG  
TO−92  
(Pb−Free)  
2N5061RLRM  
2N5062  
TO−92  
TO−92  
2,000 / Ammo Pack  
5,000 Units / Box  
5,000 Units / Box  
2N5062G  
TO−92  
(Pb−Free)  
2N5062RLRA  
TO−92  
2,000 / Tape & Reel  
2,000 / Tape & Reel  
2N5062RLRAG  
TO−92  
(Pb−Free)  
2N5064  
TO−92  
TO−92  
TO−92  
5,000 Units / Box  
2,000 / Tape & Reel  
2,000 / Ammo Pack  
2,000 / Ammo Pack  
2N5064RLRA  
2N5064RLRM  
2N5064RLRMG  
TO−92  
(Pb−Free)  
2N5060RL1  
TO−92  
2,000 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
6
2N5060 Series  
PACKAGE DIMENSIONS  
TO−92  
TO−226AA  
CASE 29−11  
ISSUE AL  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
A
B
2. CONTROLLING DIMENSION: INCH.  
3. CONTOUR OF PACKAGE BEYOND DIMENSION R  
IS UNCONTROLLED.  
4. LEAD DIMENSION IS UNCONTROLLED IN P AND  
BEYOND DIMENSION K MINIMUM.  
R
P
L
INCHES  
DIM MIN MAX  
MILLIMETERS  
SEATING  
PLANE  
K
MIN  
4.45  
4.32  
3.18  
0.407  
1.15  
2.42  
0.39  
12.70  
6.35  
2.04  
−−−  
MAX  
5.20  
5.33  
4.19  
0.533  
1.39  
2.66  
0.50  
−−−  
A
B
C
D
G
H
J
0.175  
0.170  
0.125  
0.016  
0.045  
0.095  
0.015  
0.500  
0.250  
0.080  
−−−  
0.205  
0.210  
0.165  
0.021  
0.055  
0.105  
0.020  
−−−  
D
X X  
G
J
H
V
K
L
−−−  
−−−  
C
N
P
R
V
0.105  
0.100  
−−−  
2.66  
2.54  
−−−  
SECTION X−X  
0.115  
0.135  
2.93  
3.43  
1
N
−−−  
−−−  
N
STYLE 10:  
PIN 1. CATHODE  
2. GATE  
3. ANODE  
http://onsemi.com  
7
2N5060 Series  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA  
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
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Email: orderlit@onsemi.com  
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2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
2N5060/D  

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