MSM7577MS-K [OKI]

Telecom Circuit, 1-Func, PDSO16, 0.300 INCH, 1.27 MM PITCH, PLASTIC, SOP-16;
MSM7577MS-K
型号: MSM7577MS-K
厂家: OKI ELECTRONIC COMPONETS    OKI ELECTRONIC COMPONETS
描述:

Telecom Circuit, 1-Func, PDSO16, 0.300 INCH, 1.27 MM PITCH, PLASTIC, SOP-16

文件: 总8页 (文件大小:75K)
中文:  中文翻译
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E2A0045-16-X1  
This version: Jan. 1998  
Previous version: Nov. 1996  
¡ Semiconductor  
MSM7577  
Voice Signal Level Control LSI  
GENERAL DESCRIPTION  
The MSM7577 is an LSI for Audio Signal Level adjustment for telephone set, etc.  
Conventionally, its circuit has been made within individual unit, such as amplifiers, resistors and  
switches. However, using this LSI allows for simple mounting and economically small space.  
FEATURES  
Receiving system  
• Built-in electrical volume  
Digital control (3 bit / 8 step)  
• For transmission voice, with side tone route available.  
• Mute function available.  
Transmitting system  
• Built-in operational amplifier for transmission signal level adjustment.  
• Mute function available.  
• Single +2.7 V to +5.25 V power supply  
• Power down function  
• Package:  
16-pin plastic SOP  
(SOP16-P-300-1.27-K) (Product name : MSM7577MS-K)  
APPLICATION  
Cellular handset, cordless telephone, etc.  
1/8  
¡ Semiconductor  
MSM7577  
BLOCK DIAGRAM  
56 kW  
ATT  
10 kW  
i
o
+
RAUD  
+
200 kW  
SG  
RCV1  
AN2  
SG  
ATT0  
ATT1  
ATT2  
ATTE  
ATT0  
ATT1  
ATT2  
ATTE  
+
RCV2  
150 kW  
SG  
AO3  
AN3  
MIC  
+
35 kW  
200 kW  
TAUD  
35 kW  
+
SG  
SG  
V
DD  
SG  
GND  
PD  
PIN CONFIGURATION (TOP VIEW)  
TAUD  
AN2  
1
2
3
4
5
6
7
8
16 VDD  
15 AO3  
14 MIC  
13 AN3  
12 ATTE  
11 ATT2  
10 ATT1  
PD  
RCV2  
RCV1  
NC  
RAUD  
GND  
9
ATT0  
16-Pin Plastic SOP  
NC : No connect pin  
2/8  
¡ Semiconductor  
MSM7577  
PIN DESCRIPTION  
Pin No.  
Name  
I/O  
Description  
Output pin of transmitting voice.  
Receive voice input.  
1
TAUD  
O
2
AN2  
I
Gain control should be connected by a resistor between AN2 pin RCV2 pin.  
Power down control.  
3
PD  
1
H : Power down  
L : Power on  
Output pin of receiving voice.  
Gain control should be connected by a resistor between AN2 and RCV2 pin.  
RCV2 signal is opposite phase to RCV1 signal.  
Receive voice input.  
4
5
RCV2  
RCV1  
O
O
RCV1 signal is opposite phase to RCV2 signal.  
No Connection.  
6
7
8
NC  
I
RAUD  
GND  
Receive voice input.  
Ground (0 V).  
Volume control.  
ATT2 ATT1 ATT0  
Loss level (dB)  
0 0.3  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
–2 0.3  
9
ATT0  
ATT1  
ATT2  
–4 0.3  
10  
11  
I
–7 0.3  
–10 0.3  
–13 0.3  
–16 0.3  
–19 0.3  
Mute signal input.  
H : Mute mode  
12  
ATTE  
I
L : Operating mode  
Gain control and frequency responce control.  
Gain control should be controlled by a resistor between AN3 and AO3.  
Input pin of Microphone signal.  
13  
14  
15  
16  
AN3  
MIC  
AO3  
VDD  
I
I
Gain control and frequency responce control.  
Gain control should be controlled by a resistor between AN3 and AO3.  
Power supply (+3 V).  
O
3/8  
¡ Semiconductor  
MSM7577  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Power Supply Voltage  
Digital Input Voltage  
Analog Input Voltage  
Storage Temperature  
Symbol  
VDD  
Min.  
–0.3  
–0.3  
–0.3  
–55  
Max.  
+7.0  
Unit  
V
VIND  
VDD + 0.3  
VDD + 0.3  
+150  
V
VINA  
V
TSTG  
°C  
RECOMMENDED OPERATING CONDITIONS  
Parameter  
Operating Temperature  
Power Supply Voltage  
Analog Output Load  
Resistance 1  
Symbol  
Ta  
Condition  
Min.  
–20  
Typ.  
25  
Max.  
70  
Unit  
°C  
VDD  
VDD  
+2.7  
+3.00  
+5.25  
V
RLA1  
RLA2  
TAUD  
600  
10  
W
Analog Output Load  
Resistance 2  
Except TAUD pin.  
kW  
4/8  
¡ Semiconductor  
MSM7577  
ELECTRICAL CHARACTERISTICS  
DC Characteristics  
( Ta = –20°C to 70°C, VDD = 2.7 V to 5.25 V )  
Parameter  
Symbol  
IDD  
Condition  
VDD = 3.0 V  
*VDD = 5.0 V  
PD = VDD  
Min.  
Typ.  
1.2  
Max.  
2.4  
Unit  
mA  
mA  
V
Power Supply Current  
10.0  
0.1  
20  
Power Down Current  
Low Level Input  
Voltage  
0.2  
ATT0 to ATT2  
ATTE, PD  
0.3 ¥  
VDD  
VIL  
0
High Level Input  
Voltage  
ATT0 to ATT2  
ATTE, PD  
0.7 ¥  
VIH  
VDD  
+10  
1.2  
V
VDD  
Digital Input Leakage  
Current  
IIL  
IIH  
VI = GND  
–10  
mA  
VI = VDD  
Analog Input  
Voltage Level  
Analog Input  
Resistance  
RAUD, MIC  
AN2, AN3  
VIA  
RIA  
V01  
V02  
VP-P  
kW  
RAUD  
200  
MIC  
Analog Output  
Level Range 1  
Analog Output  
Level Range 2  
RCV1, RCV2, AO3  
RL = 5 kW (to SG level)  
TAUD  
1.2  
1.2  
VP-P  
VP-P  
RL = 600 W (to SG level)  
5/8  
¡ Semiconductor  
MSM7577  
Analog Interface Characteristics  
( Ta = –20°C to 70°C, VDD = 2.7 V to 5.25 V )  
Parameter  
RX-AUDIO  
Symbol  
Condition  
RAUD-RCV1  
Min.  
Typ.  
Max.  
Unit  
ATT = 0 dB  
VRXA  
+14  
+15  
+16  
dB  
Path Gain  
ATTE = L  
RAUD-RCV1  
RAUD = –20 dBV  
ATTE = 0 dB  
RX-AUDIO  
LRXA  
40  
dB  
Loss Level (Mute)  
ATTE = LÆH  
MIC-TAUD  
TX-AUDIO  
Loss Level  
MIC = –20 dBV  
ATTE = LÆH  
LTXA  
40  
0
dB  
dB  
MIC-TAUD  
TX-AUDIO  
Path Gain  
AO3 and AN3 are connected  
600 W load resistance  
MIC-RCV1  
VTXA  
–1.0  
+1.0  
MIC Path Gain  
VRTA  
VATG  
–9.5  
–0.3  
–8.5  
0
–7.5  
+0.3  
dB  
dB  
AO3 and AN3 are connected  
RAUD-RCV1  
ATT  
Establish Error  
ATT0 to ATT2  
MIC = –7.45 dBV  
fi = 1 kHz  
TX-AUDIO  
Distortion  
8
%
600 W load resistance  
6/8  
¡ Semiconductor  
MSM7577  
APPLICATION CIRCUIT  
MSM7577MS-K  
+3 V  
C2  
C1  
Transmit voice data  
1
TAUD  
VDD 16  
C4  
2 AN2  
3 PD  
15  
14  
AO3  
MIC  
R2  
C3  
RCV2  
4
5
AN3 13  
R1  
RCV1  
ATTE 12  
6 NC  
11  
10  
ATT2  
ATT1  
C1  
R1 > 30 kW  
R2 > 30 kW  
C1 = 0.1 µF  
C2 = 1 µF  
Receive voice data  
RAUD  
7
8
GND  
ATT0 9  
C3 = 50 pF  
C4 = 10 pF  
Gain = R2/R1  
In the Reverse Type  
C6  
R4  
AO3  
R3 > 10 kW  
R4 > 10 kW  
C5 > 1 µF  
C6 = 50 pF  
Gain = R4/R3  
C5  
R3  
AN3  
MIC  
Analog input  
+
In the Same Phase Type  
C7  
R5  
MIC  
AN3  
R5 > 10 kW  
R6 > 10 kW  
C7 > 0.1 µF  
C8 > 1 µF  
C9 = 10 pF  
Gain = 1 + (R5/R6)  
Analog input  
+
AO3  
R6  
C8  
C9  
7/8  
¡ Semiconductor  
MSM7577  
PACKAGE DIMENSIONS  
(Unit : mm)  
SOP16-P-300-1.27-K  
Mirror finish  
Package material  
Lead frame material  
Pin treatment  
Solder plate thickness  
Package weight (g)  
Epoxy resin  
Cu alloy  
Solder plating  
5 mm or more  
0.21 TYP.  
Notes for Mounting the Surface Mount Type Package  
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which  
are very susceptible to heat in reflow mounting and humidity absorbed in storage.  
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the  
product name, package name, pin number, package code and desired mounting conditions  
(reflow method, temperature and times).  
8/8  

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