MR27V1602ETN [OKI]

OTP ROM, 1MX16, 90ns, CMOS, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48;
MR27V1602ETN
型号: MR27V1602ETN
厂家: OKI ELECTRONIC COMPONETS    OKI ELECTRONIC COMPONETS
描述:

OTP ROM, 1MX16, 90ns, CMOS, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48

OTP只读存储器 光电二极管 内存集成电路
文件: 总15页 (文件大小:135K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
FEDR27V1602E-01-03  
Issue Date: Jul. 8, 2003  
OKI Semiconductor  
MR27V1602E  
1,048,576–Word × 16–Bit or 2,097,152–Word × 8–Bit One Time PROM  
GENERAL DESCRIPTION  
The MR27V1602E is a 16 Mbit electrically One Time Programmable Read-Only Memory that can be  
electrically switched between 1,048,576-word × 16-bit and 2,097,152-word × 8-bit by the state of the BYTE# pin.  
The MR27V1602E supports high speed asynchronous read operation using a single 3.3V power supply.  
FEATURES  
· 1,048,576-word × 16-bit/2,097,152-word × 8-bit electrically switchable configuration  
· +3.3 V power supply  
· Access time  
· Operating current  
· Standby current  
90 nS MAX  
30 mA MAX  
50 µA MAX  
· Input/Output TTL compatible  
· Tri-state output  
· Packages:  
44-pin plastic SOP (SOP44-P-600-1.27-K)  
(Product Name : MR27V1602EMA)  
44-pin plastic TSOP (TSOP II 44-P-400-0.80-K) (Product Name : MR27V1602ETP)  
48-pin plastic TSOP (TSOP I 48-P-1220-0.50-1K) (Product Name : MR27V1602ETN)  
1/15  
FEDR27V1602E-01-03  
OKI Semiconductor  
MR27V1602E / OTP  
PIN CONFIGURATION (TOP VIEW)  
A16  
A15  
A14  
A13  
A12  
A11  
A10  
A9  
1
2
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
BYTE#/VPP  
VSS  
1
2
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
3
NC  
NC  
A18  
A17  
A7  
D15/A–1  
D7  
4
A19  
A8  
3
5
D14  
D6  
4
6
A9  
5
7
A10  
A11  
A12  
A13  
A14  
A15  
A16  
BYTE#/VPP  
VSS  
A6  
D13  
D5  
6
8
A8  
A5  
7
9
A19  
NC  
NC  
NC  
NC  
NC  
NC  
A18  
A17  
A7  
A4  
8
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
D12  
D4  
A3  
9
A2  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
VCC  
A1  
D11  
D3  
A0  
CE#  
VSS  
OE#  
D0  
D10  
D2  
D15/A–1  
D7  
D9  
D1  
D14  
D6  
D8  
30 D8  
A6  
D1  
29 D0  
D13  
D5  
A5  
D9  
28 OE#  
27 VSS  
26 CE#  
A4  
D2  
D12  
D4  
A3  
D10  
D3  
A2  
25  
A0  
VCC  
A1  
D11  
48-pin TSOP(I)  
44-pin SOP, TSOP(II)  
Pin name  
D15/A–1  
A0 to A19  
D0 to D14  
CE#  
Functions  
Data output/Address input  
Address input  
Data output  
Chip enable  
OE#  
Output enable  
BYTE#/VPP  
VCC  
Mode switch/Program power supply voltage  
Power supply voltage  
GND  
VSS  
NC  
Non connection  
2/15  
FEDR27V1602E-01-03  
OKI Semiconductor  
MR27V1602E / OTP  
BLOCK DIAGRAM  
A–1  
× 8/× 16 Switch  
CE#  
CE  
OE#  
OE  
BYTE#/VPP  
PGM  
A0  
A1  
A2  
Memory Cell Matrix  
A3  
A4  
A5  
1,048,576 × 16-Bit or 2,097,152 × 8-Bit  
A6  
A7  
A8  
A9  
A10  
A11  
A12  
A13  
A14  
A15  
A16  
A17  
A18  
A19  
Multiplexer  
Output Buffer  
D0  
D2  
D4  
D6  
D8 D10 D12 D14  
D1  
D3  
D5  
D7  
D9 D11 D13 D15  
In 8-bit output mode, these pins  
are placed in a high-Z state and  
pin D15 functions as the A-1  
address pin.  
FUNCTION TABLE  
Mode  
Read (16-Bit)  
Read (8-Bit)  
CE#  
L
OE#  
BYTE#/VPP  
VCC  
D0 to D7  
DOUT  
D8 to D14  
DOUT  
D15/A–1  
L/H  
L
L
H
L
L
Hi–Z  
H
L
Output disable  
Standby  
L
H
3.3 V  
4.0 V  
Hi–Z  
Hi–Z  
H
L
H
Program  
L
H
H
H
H
L
DIN  
9.75 V  
Program inhibit  
Program verify  
Hi–Z  
DOUT  
: Don’t Care (H or L)  
3/15  
FEDR27V1602E-01-03  
OKI Semiconductor  
MR27V1602E / OTP  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Operating temperature under bias  
Storage temperature  
Symbol  
Condition  
Value  
Unit  
°C  
Ta  
Tstg  
VI  
0 to 70  
–55 to 125  
–0.5 to VCC+0.5  
–0.5 to VCC+0.5  
–0.5 to 5  
°C  
V
Input voltage  
Output voltage  
VO  
V
relative to VSS  
Power supply voltage  
Program power supply voltage  
Power dissipation per package  
VCC  
VPP  
PD  
V
–0.5 to 11.5  
1.0  
V
W
RECOMMENDED OPERATING CONDITIONS  
(Ta = 0 to 70°C)  
Parameter  
VCC power supply voltage  
VPP power supply voltage  
Input “H” level  
Symbol  
VCC  
Condition  
Min.  
3.0  
Typ.  
Max.  
3.6  
Unit  
V
VPP  
–0.5  
2.2  
VCC+0.5  
VCC+0.5  
0.6  
V
V
V
V
CC = 3.0 to 3.6 V  
VIH  
Input “L” level  
VIL  
–0.5  
Voltage is relative to VSS  
.
: Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.  
: -1.5V(Min.) when pulse width of undershoot is less than 10ns.  
4/15  
FEDR27V1602E-01-03  
OKI Semiconductor  
MR27V1602E / OTP  
ELECTRICAL CHARACTERISTICS  
DC Characteristics  
(VCC = 3.3 V ± 0.3 V, Ta = 0 to 70°C)  
parameter  
Input leakage current  
Output leakage current  
VCC power supply current  
(Standby)  
Symbol  
ILI  
Condition  
VI = 0 to VCC  
VO = 0 to VCC  
CE# = VCC  
CE# = VIH  
Min.  
Typ.  
Max.  
10  
10  
50  
1
Unit  
µA  
ILO  
µA  
ICCSC  
ICCST  
µA  
mΑ  
VCC power supply current  
(Read)  
CE# = VIL, OE# = VIH  
tc = 90 ns  
ICCA  
30  
mA  
VPP power supply current  
Input “H” level  
IPP  
VIH  
VIL  
VPP = VCC  
2.2  
10  
VCC+0.5  
0.6  
µA  
V
Input “L” level  
–0.5  
2.4  
V
Output “H” level  
Output “L” level  
VOH  
VOL  
IOH = –2 mA  
IOL = 4 mA  
V
0.4  
V
Voltage is relative to VSS  
.
: Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.  
: -1.5V(Min.) when pulse width of undershoot is less than 10ns.  
AC Characteristics  
(VCC = 3.3 V ± 0.3 V, Ta = 0 to 70°C)  
Parameter  
Address cycle time  
Address access time  
CE# access time  
Symbol  
tC  
Condition  
Min.  
90  
0
Max.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tACC  
tCE  
CE# = OE# = VIL  
OE# = VIL  
90  
90  
45  
20  
20  
OE# access time  
tOE  
CE# = VIL  
tCHZ  
tOHZ  
tOH  
OE# = VIL  
Output disable time  
Output hold time  
CE# = VIL  
0
CE# = OE# = VIL  
0
Measurement conditions  
Input signal level --------------------------------------0 V/3 V  
Input timing reference level-------------------------0.8 V/2.0 V  
Output load ---------------------------------------------100 pF  
Output timing reference level ----------------------0.8 V/2.0 V  
1.73 V  
330 Ω  
Output  
100 pF  
(Including scope and jig)  
5/15  
FEDR27V1602E-01-03  
OKI Semiconductor  
MR27V1602E / OTP  
TIMING CHART (READ CYCLE)  
16-BIT READ MODE (BYTE# = VIH)  
tC  
A0 to A19  
CE#  
tOH  
tCE  
tCHZ  
tOE  
OE#  
tACC  
tOHZ  
Valid Data  
D0 to D15  
Hi-Z  
Hi-Z  
8-BIT READ MODE (BYTE# = VIL)  
tC  
A–1 to A19  
tOH  
tCE  
CE#  
tCHZ  
tOE  
OE#  
tOHZ  
tACC  
Valid Data  
D0 to D7  
Hi-Z  
Hi-Z  
D8 to D14  
Hi-Z  
6/15  
FEDR27V1602E-01-03  
OKI Semiconductor  
MR27V1602E / OTP  
ELECTRICAL CHARACTERISTICS (PROGRAMMING OPERATION)  
DC Characteristics  
(Ta = 25°C ± 5°C)  
Parameter  
Input leakage current  
VPP power supply current (Program)  
VCC power supply current  
Input “H” level  
Symbol  
ILI  
Condition  
Min.  
Typ.  
Max.  
10  
Unit  
µA  
mA  
mA  
V
VI = VCC+0.5 V  
IPP2  
ICC  
CE# = VIL  
50  
50  
VIH  
3.0  
–0.5  
2.4  
VCC+0.5  
0.8  
Input “L” level  
VIL  
IOH = –400 µA  
IOL = 2.1 mA  
V
Output “H” level  
VOH  
VOL  
VPP  
VCC  
V
Output “L” level  
0.45  
10.0  
4.1  
V
Program voltage  
9.5  
3.9  
9.75  
4.0  
V
VCC power supply voltage  
V
Voltage is relative to VSS  
.
AC Characteristics  
(VCC = 4.0 V ± 0.1 V, BYTE#/VPP = 9.75 V ± 0.25 V, Ta = 25°C ± 5°C)  
Parameter  
Address set-up time  
Symbol  
tAS  
Condition  
Min.  
100  
2
Typ.  
10  
Max.  
Unit  
ns  
µs  
ns  
µs  
ns  
ns  
µs  
µs  
ns  
ns  
OE# set-up time  
tOES  
tDS  
Data set-up time  
100  
2
Address hold time  
tAH  
Data hold time  
tDH  
100  
0
Output float delay time from OE#  
VPP voltage set-up time  
Program pulse width  
Data valid from OE#  
Address hold from OE# high  
tOHZ  
tVS  
100  
2
tPW  
9
11  
tOE  
0
100  
tAOH  
Pin Check Function  
Pin Check Function is to check contact between each device-pin and each socket-lead with EPROM programmer.  
Setting up address as following condition call the preprogrammed codes on device outputs.  
(VCC = 3.3 V ± 0.3 V, CE# = VIL, OE# = VIL, BYTE#/VPP = VIH, Ta = 25°C ± 5°C)  
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9  
A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 DATA  
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
VH  
VH  
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
1
0
1
0
FF00  
00FF  
FFFF  
Other conditions  
: VH = 8 V ± 0.25 V  
7/15  
FEDR27V1602E-01-03  
OKI Semiconductor  
MR27V1602E / OTP  
Consecutive Programming Waveforms  
A0 to A19  
tAS  
tAH  
CE#  
OE#  
tPW  
High  
tDH  
tDS  
Din  
Din  
D0 to D15  
tVS  
BYTE#/Vpp  
Consecutive Program Verify Waveforms  
A0 to A19  
CE#  
High  
tACC  
tAHO  
OE#  
tOHZ  
Dout  
tOE  
Dout  
D0 to D15  
9.75 V  
BYTE#/Vpp  
8/15  
FEDR27V1602E-01-03  
OKI Semiconductor  
MR27V1602E / OTP  
Program and Program Verify Cycle Waveforms  
A0 to A19  
tAS  
tAHO  
CE#  
OE#  
tPW  
tOES  
tDH  
tOE  
tOHZ  
tOHZ  
Dout  
tDS  
Din  
D0 to D15  
9.75 V  
BYTE#/Vpp  
Pin Capacitance  
(VCC = 3.3 V, Ta = 25°C, f = 1 MHz)  
Parameter  
Input  
Symbol  
CIN1  
Condition  
Min.  
Typ.  
Max.  
8
Unit  
VI = 0 V  
VO = 0 V  
pF  
BYTE#/VPP  
Output  
CIN2  
120  
10  
COUT  
9/15  
FEDR27V1602E-01-03  
OKI Semiconductor  
MR27V1602E / OTP  
Programming/Verify Flow Chart  
Programming  
Verify  
Start  
Start  
NG  
NG  
Pin Check  
Bad Insertion  
Bad Insertion  
Pin Check  
PASS  
PASS  
Address = First Location  
Address = First Location  
VCC = 4.0 V  
VCC = 3.0 V/VPP = 3.0 V  
VPP = 9.75 V  
NG  
Verify  
PASS  
Program 10 µs  
VCC = 3.6 V/VPP = 3.6 V  
NO  
Last Address?  
Increment Address  
NG  
Verify  
YES  
PASS  
Address = First Location  
Device Passed  
Device Failed  
X = 0  
NG  
X = X+1  
Verify(One Word)  
PASS  
YES  
NO  
Increment Address  
Last Address?  
X = 2?  
YES  
NO  
Program 10 µs  
VCC = 3.0 V/VPP = 3.0 V  
NG  
Verify  
PASS  
Device Passed  
Device Failed  
10/15  
FEDR27V1602E-01-03  
OKI Semiconductor  
MR27V1602E / OTP  
PACKAGE DIMENSIONS  
(Unit: mm)  
SOP44-P-600-1.27-K  
Mirror finish  
Package material  
Lead frame material  
Pin treatment  
Package weight (g)  
Rev. No./Last Revised  
Epoxy resin  
42 alloy  
Solder plating (5µm)  
2.10 TYP.  
4/Dec. 5, 1996  
5
Notes for Mounting the Surface Mount Type Package  
The surface mount type packages are very susceptible to heat in reflow mounting and humidity  
absorbed in storage.  
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product  
name, package name, pin number, package code and desired mounting conditions (reflow method,  
temperature and times).  
11/15  
FEDR27V1602E-01-03  
OKI Semiconductor  
MR27V1602E / OTP  
(Unit: mm)  
TSOP(2)44-P-400-0.80-K  
Mirror finish  
Package material  
Lead frame material  
Pin treatment  
Package weight (g)  
Rev. No./Last Revised  
Epoxy resin  
42 alloy  
Solder plating (5µm)  
0.54 TYP.  
3/Dec. 10, 1996  
5
Notes for Mounting the Surface Mount Type Package  
The surface mount type packages are very susceptible to heat in reflow mounting and humidity  
absorbed in storage.  
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product  
name, package name, pin number, package code and desired mounting conditions (reflow method,  
temperature and times).  
12/15  
FEDR27V1602E-01-03  
OKI Semiconductor  
MR27V1602E / OTP  
(Unit: mm)  
TSOP(1)48-P-1220-0.50-1K  
Mirror finish  
Package material  
Lead frame material  
Pin treatment  
Package weight (g)  
Rev. No./Last Revised  
Epoxy resin  
42 alloy  
Solder plating (5µm)  
0.55 TYP.  
1/Dec. 2, 1999  
5
Notes for Mounting the Surface Mount Type Package  
The surface mount type packages are very susceptible to heat in reflow mounting and humidity  
absorbed in storage.  
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product  
name, package name, pin number, package code and desired mounting conditions (reflow method,  
temperature and times).  
13/15  
FEDR27V1602E-01-03  
OKI Semiconductor  
MR27V1602E / OTP  
REVISION HISTORY  
Page  
Document  
No.  
Date  
Description  
Previous Current  
Edition  
Edition  
FEDR27V1602E-01-  
Jun 4, 2003  
Jul 8, 2003  
Final edition 2  
Change tCHZ, tOHZ to 20ns  
02  
FEDR27V1602E-01-  
03  
5
5
14/15  
FEDR27V1602E-01-03  
OKI Semiconductor  
MR27V1602E / OTP  
NOTICE  
1. The information contained herein can change without notice owing to product and/or technical improvements.  
Before using the product, please make sure that the information being referred to is up-to-date.  
2. The outline of action and examples for application circuits described herein have been chosen as an  
explanation for the standard action and performance of the product. When planning to use the product, please  
ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.  
3. When designing your product, please use our product below the specified maximum ratings and within the  
specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating  
temperature.  
4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation  
resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or  
unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified  
maximum ratings or operation outside the specified operating range.  
5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is  
granted by us in connection with the use of the product and/or the information and drawings contained herein.  
No responsibility is assumed by us for any infringement of a third party’s right which may result from the use  
thereof.  
6. The products listed in this document are intended for use in general electronics equipment for commercial  
applications (e.g., office automation, communication equipment, measurement equipment, consumer  
electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any  
system or application that requires special or enhanced quality and reliability characteristics nor in any  
system or application where the failure of such system or application may result in the loss or damage of  
property, or death or injury to humans.  
Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace  
equipment, nuclear power control, medical equipment, and life-support systems.  
7. Certain products in this document may need government approval before they can be exported to particular  
countries. The purchaser assumes the responsibility of determining the legality of export of these products  
and will take appropriate and necessary steps at their own expense for these.  
8. No part of the contents contained herein may be reprinted or reproduced without our prior permission.  
Copyright 2003 Oki Electric Industry Co., Ltd.  
15/15  

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