SC16C754BIB80 [NXP]

5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs; 5 V , 3.3 V和2.5 V四UART , 5兆比特/秒(最大) ,64字节FIFO
SC16C754BIB80
型号: SC16C754BIB80
厂家: NXP    NXP
描述:

5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs
5 V , 3.3 V和2.5 V四UART , 5兆比特/秒(最大) ,64字节FIFO

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SC16C754B  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte  
FIFOs  
Rev. 02 — 13 June 2005  
Product data sheet  
1. General description  
The SC16C754B is a quad Universal Asynchronous Receiver/Transmitter (UART) with  
64-byte FIFOs, automatic hardware/software flow control, and data rates up to 5 Mbit/s  
(3.3 V and 5 V). The SC16C754B offers enhanced features. It has a transmission control  
register (TCR) that stores receiver FIFO threshold levels to start/stop transmission during  
hardware and software flow control. With the FIFO RDY register, the software gets the  
status of TXRDY/RXRDY for all four ports in one access. On-chip status registers provide  
the user with error indications, operational status, and modem interface control. System  
interrupts may be tailored to meet user requirements. An internal loop-back capability  
allows on-board diagnostics.  
The UART transmits data, sent to it over the peripheral 8-bit bus, on the TX signal and  
receives characters on the RX signal. Characters can be programmed to be 5, 6, 7, or  
8 bits. The UART has a 64-byte receive FIFO and transmit FIFO and can be programmed  
to interrupt at different trigger levels. The UART generates its own desired baud rate  
based upon a programmable divisor and its input clock. It can transmit even, odd, or no  
parity and 1, 1.5, or 2 stop bits. The receiver can detect break, idle, or framing errors,  
FIFO overflow, and parity errors. The transmitter can detect FIFO underflow. The UART  
also contains a software interface for modem control operations, and has software flow  
control and hardware flow control capabilities.  
The SC16C754B is available in plastic LQFP64, LQFP80 and PLCC68 packages.  
2. Features  
4 channel UART  
5 V, 3.3 V and 2.5 V operation  
Pin compatible with SC16C654IA68, TL16C754, and SC16C554IA68 with additional  
enhancements, and software compatible with TL16C754  
Up to 5 Mbit/s data rate (at 3.3 V and 5 V; at 2.5 V maximum data rate is 3 Mbit/s)  
5 V tolerant inputs  
64-byte transmit FIFO  
64-byte receive FIFO with error flags  
Industrial temperature range (40 °C to +85 °C)  
Programmable and selectable transmit and receive FIFO trigger levels for DMA and  
interrupt generation  
Software (Xon/Xoff)/hardware (RTS/CTS) flow control  
Programmable Xon/Xoff characters  
Programmable auto-RTS and auto-CTS  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
Optional data flow resume by Xon any character  
DMA signalling capability for both received and transmitted data  
Supports 5 V, 3.3 V and 2.5 V operation  
Software selectable baud rate generator  
Prescaler provides additional divide-by-4 function  
Fast data bus access time  
Programmable Sleep mode  
Programmable serial interface characteristics  
5, 6, 7, or 8-bit characters  
Even, odd, or no-parity bit generation and detection  
1, 1.5, or 2 stop bit generation  
False start bit detection  
Complete status reporting capabilities in both normal and Sleep mode  
Line break generation and detection  
Internal test and loop-back capabilities  
Fully prioritized interrupt system controls  
Modem control functions (CTS, RTS, DSR, DTR, RI, and CD)  
Sleep mode  
3. Ordering information  
Table 1:  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
SC16C754BIBM  
SC16C754BIB80  
SC16C754BIA68  
LQFP64  
LQFP80  
PLCC68  
plastic low profile quad flat package; 64 leads; body 7 × 7 × 1.4 mm  
plastic low profile quad flat package; 80 leads; body 12 × 12 × 1.4 mm  
plastic leaded chip carrier; 68 leads  
SOT414-1  
SOT315-1  
SOT188-2  
9397 750 14668  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 02 — 13 June 2005  
2 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
4. Block diagram  
SC16C754B  
TRANSMIT  
FIFO  
TRANSMIT  
SHIFT  
TXA to TXD  
REGISTERS  
REGISTER  
D0 to D7  
IOR  
DATA BUS  
AND  
IOW  
RESET  
CONTROL  
LOGIC  
FLOW  
CONTROL  
LOGIC  
RECEIVE  
FIFO  
RECEIVE  
SHIFT  
RXA to RXD  
REGISTERS  
REGISTER  
FLOW  
CONTROL  
LOGIC  
REGISTER  
SELECT  
LOGIC  
A0 to A2  
CSA to CSD  
DTRA to DTRD  
RTSA to RTSD  
MODEM  
CONTROL  
LOGIC  
INTA to INTD  
TXRDY  
CTSA to CTSD  
RIA to RID  
CDA to CDD  
DSRA to DSRD  
RXRDY  
INTERRUPT  
CONTROL  
LOGIC  
CLOCK AND  
BAUD RATE  
GENERATOR  
INTSEL  
002aaa866  
XTAL1 XTAL2  
CLKSEL  
Fig 1. Block diagram of SC16C754B  
9397 750 14668  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 02 — 13 June 2005  
3 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
5. Pinning information  
5.1 Pinning  
1
2
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
DSRA  
CTSA  
DTRA  
DSRD  
CTSD  
DTRD  
GND  
RTSD  
INTD  
CSD  
3
4
V
CC  
5
RTSA  
INTA  
CSA  
6
7
8
TXA  
TXD  
SC16C754BIBM  
9
IOW  
IOR  
10  
11  
12  
13  
14  
15  
16  
TXB  
TXC  
CSB  
CSC  
INTB  
RTSB  
GND  
DTRB  
CTSB  
INTC  
RTSC  
V
CC  
DTRC  
CTSC  
002aab564  
Fig 2. Pin configuration for LQFP64  
9397 750 14668  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 02 — 13 June 2005  
4 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
1
2
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
n.c.  
n.c.  
n.c.  
DSRA  
CTSA  
DTRA  
DSRD  
CTSD  
DTRD  
GND  
RTSD  
INTD  
CSD  
TXD  
3
4
5
6
V
CC  
7
RTSA  
INTA  
CSA  
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
TXA  
IOR  
SC16C754BIB80  
IOW  
TXC  
TXB  
CSC  
INTC  
RTSC  
CSB  
INTB  
RTSB  
GND  
DTRB  
CTSB  
DSRB  
n.c.  
V
CC  
DTSC  
CTSC  
DSRC  
n.c.  
n.c.  
002aaa867  
Fig 3. Pin configuration for LQFP80  
9397 750 14668  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 02 — 13 June 2005  
5 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
DSRA  
CTSA  
DTRA  
DSRD  
CTSD  
DTRD  
GND  
RTSD  
INTD  
CSD  
V
CC  
RTSA  
INTA  
CSA  
TXA  
TXD  
IOW  
SC16C754BIA68  
IOR  
TXB  
TXC  
CSB  
CSC  
INTB  
RTSB  
GND  
DTRB  
CTSB  
DSRB  
INTC  
RTSC  
V
CC  
DTRC  
CTSC  
DSRC  
002aaa868  
Fig 4. Pin configuration for PLCC68  
5.2 Pin description  
Table 2:  
Symbol  
Pin description  
Pin  
Type Description  
LQFP64 LQFP80 PLCC68  
A0  
24  
23  
22  
64  
18  
31  
49  
-
30  
29  
28  
79  
23  
39  
63  
26  
34  
33  
32  
9
I
I
I
I
Address 0 select bit. Internal registers address selection.  
Address 1 select bit. Internal registers address selection.  
Address 2 select bit. Internal registers address selection.  
A1  
A2  
CDA  
CDB  
CDC  
CDD  
CLKSEL  
Carrier Detect (active LOW). These inputs are associated with  
individual UART channels A through D. A logic LOW on these pins  
indicates that a carrier has been detected by the modem for that  
channel. The state of these inputs is reflected in the modem status  
register (MSR).  
27  
43  
61  
30  
I
Clock Select. CLKSEL selects the divide-by-1 or divide-by-4  
prescalable clock. During the reset, a logic 1 (VCC) on CLKSEL  
selects the divide-by-1 prescaler. A logic 0 (GND) on CLKSEL selects  
the divide-by-4 prescaler. The value of CLKSEL is latched into  
MCR[7] at the trailing edge of RESET. A logic 1 (VCC) on CLKSEL will  
latch a 0 into MCR[7]. A logic 0 (GND) on CLKSEL will latch a 1 into  
MCR[7]. MCR[7] can be changed after RESET to alter the prescaler  
value. This pin is associated with LQFP80 and PLCC68 packages  
only. This pin is connected to VCC internally on LQFP64 package.  
9397 750 14668  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 02 — 13 June 2005  
6 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
Table 2:  
Symbol  
Pin description …continued  
Pin  
Type Description  
LQFP64 LQFP80 PLCC68  
CSA  
7
9
16  
20  
50  
54  
11  
25  
45  
59  
I
Chip Select (active LOW). These pins enable data transfers  
between the user CPU and the SC16C754B for the channel(s)  
addressed. Individual UART sections (A, B, C, D) are addressed by  
providing a logic LOW on the respective CSA through CSD pins.  
CSB  
11  
38  
42  
2
13  
49  
53  
4
CSC  
CSD  
CTSA  
CTSB  
CTSC  
CTSD  
I
Clear to Send (active LOW). These inputs are associated with  
individual UART channels A through D. A logic 0 (LOW) on the CTS  
pins indicates the modem or data set is ready to accept transmit data  
from the SC16C754B. Status can be tested by reading MSR[4].  
These pins only affect the transmit and receive operations when  
Auto-CTS function is enabled via the Enhanced Feature Register  
EFR[7] for hardware flow control operation.  
16  
33  
47  
18  
44  
58  
D0 to D7  
53, 54, 68, 69, 66, 67, I/O  
55, 56, 70, 71, 68, 1, 2,  
57, 58, 72, 73, 3, 4, 5  
Data bus (bi-directional). These pins are the 8-bit, 3-state data bus  
for transferring information to or from the controlling CPU. D0 is the  
least significant bit and the first data bit in a transmit or receive serial  
data stream.  
59, 60  
74, 75  
DSRA  
DSRB  
DSRC  
DSRD  
DTRA  
DTRB  
DTRC  
DTRD  
1
3
10  
26  
44  
60  
12  
24  
46  
58  
I
Data Set Ready (active LOW). These inputs are associated with  
individual UART channels A through D. A logic 0 (LOW) on these pins  
indicates the modem or data set is powered-on and is ready for data  
exchange with the UART. The state of these inputs is reflected in the  
modem status register (MSR).  
17  
32  
48  
3
19  
43  
59  
5
O
Data Terminal Ready (active LOW). These outputs are associated  
with individual UART channels A through D. A logic 0 (LOW) on these  
pins indicates that the SC16C754B is powered-on and ready. These  
pins can be controlled via the modem control register. Writing a  
logic 1 to MCR[0] will set the DTR output to logic 0 (LOW), enabling  
the modem. The output of these pins will be a logic 1 after writing a  
logic 0 to MCR[0], or after a reset.  
15  
34  
46  
17  
45  
57  
GND  
14, 28, 16, 36, 6, 23,  
I
Signal and power ground.  
45, 61  
56, 76  
40, 57  
INTA  
INTB  
INTC  
INTD  
6
8
15  
O
Interrupt A, B, C, and D (active HIGH). These pins provide  
individual channel interrupts INTA through INTD. INTA through INTD  
are enabled when MCR[3] is set to a logic 1, interrupt sources are  
enabled in the interrupt enable register (IER). Interrupt conditions  
include: receiver errors, available receiver buffer data, available  
transmit buffer space, or when a modem status flag is detected.  
INTA to INTD are in the high-impedance state after reset.  
12  
14  
21  
37  
18  
49  
43  
54  
55  
INTSEL  
-
67  
65  
I
Interrupt select (active HIGH with internal pull-down). INTSEL  
can be used in conjunction with MCR[3] to enable or disable the  
3-state interrupts INTA to INTD or override MCR[3] and force  
continuous interrupts. Interrupt outputs are enabled continuously by  
making this pin a logic 1. Driving this pin LOW allows MCR[3] to  
control the 3-state interrupt output. In this mode, MCR[3] is set to a  
logic 1 to enable the 3-state outputs. This pin is associated with  
LQFP80 and PLCC68 packages only. This pin is connected to GND  
internally on the LQFP64 package.  
IOR  
40  
51  
52  
I
Input/Output Read strobe (active LOW). A HIGH-to-LOW transition  
on IOR will load the contents of an internal register defined by  
address bits A[2:0] onto the SC16C754B data bus (D[7:0]) for access  
by external CPU.  
9397 750 14668  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 02 — 13 June 2005  
7 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
Table 2:  
Symbol  
Pin description …continued  
Pin  
Type Description  
LQFP64 LQFP80 PLCC68  
IOW  
n.c.  
9
11  
18  
I
Input/Output Write strobe (active LOW). A LOW-to-HIGH transition  
on IOW will transfer the contents of the data bus (D[7:0]) from the  
external CPU to an internal register that is defined by address bits  
A[2:0] and CSA and CSD.  
-
1, 2, 20, 31  
21, 22,  
-
not connected  
27, 40,  
41, 42,  
60, 61,  
62, 80  
RESET  
27  
33  
37  
I
I
Reset. This pin will reset the internal registers and all the outputs.  
The UART transmitter output and the receiver input will be disabled  
during reset time. RESET is an active HIGH input.  
RIA  
RIB  
RIC  
RID  
63  
19  
30  
50  
78  
24  
38  
64  
8
Ring Indicator (active LOW). These inputs are associated with  
individual UART channels, A through D. A logic 0 on these pins  
indicates the modem has received a ringing signal from the telephone  
line. A LOW-to-HIGH transition on these input pins generates a  
modem status interrupt, if enabled. The state of these inputs is  
reflected in the modem status register (MSR).  
28  
42  
62  
RTSA  
RTSB  
RTSC  
RTSD  
5
7
14  
22  
48  
56  
O
Request to Send (active LOW). These outputs are associated with  
individual UART channels, A through D. A logic 0 on the RTS pin  
indicates the transmitter has data ready and waiting to send. Writing  
a logic 1 in the modem control register MCR[1] will set this pin to a  
logic 0, indicating data is available. After a reset these pins are set to  
a logic 1. These pins only affect the transmit and receive operations  
when Auto-RTS function is enabled via the Enhanced Feature  
Register (EFR[6]) for hardware flow control operation.  
13  
36  
44  
15  
47  
55  
RXA  
62  
20  
29  
51  
-
77  
25  
37  
65  
34  
7
I
Receive data input. These inputs are associated with individual  
serial channel data to the SC16C754B. During the local loop-back  
mode, these RX input pins are disabled and TX data is connected to  
the UART RX input internally.  
RXB  
29  
41  
63  
38  
RXC  
RXD  
RXRDY  
O
Receive Ready (active LOW). RXRDY contains the wire-ORed  
status of all four receive channel FIFOs, RXRDY A to RXRDY D. It  
goes LOW when the trigger level has been reached or a time-out  
interrupt occurs. It goes HIGH when all RX FIFOs are empty and  
there is an error in RX FIFO. This pin is associated with LQFP80 and  
PLCC68 packages only.  
TXA  
8
10  
12  
50  
52  
35  
17  
19  
51  
53  
39  
O
O
Transmit data. These outputs are associated with individual serial  
transmit channel data from the SC16C754B. During the local  
loop-back mode, the TX output pin is disabled and TX data is  
internally connected to the UART RX input.  
TXB  
10  
39  
41  
-
TXC  
TXD  
TXRDY  
Transmit Ready (active LOW). TXRDY contains the wire-ORed  
status of all four transmit channel FIFOs, TXRDY A to TXRDY D. It  
goes LOW when there are a trigger level number of spaces available.  
It goes HIGH when all four TX buffers are full. This pin is associated  
with LQFP80 and PLCC68 packages only.  
9397 750 14668  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 02 — 13 June 2005  
8 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
Table 2:  
Symbol  
Pin description …continued  
Pin  
Type Description  
LQFP64 LQFP80 PLCC68  
VCC  
4, 21,  
35, 52  
6, 46, 66 13, 47,  
64  
I
I
Power supply input.  
XTAL1  
25  
26  
31  
32  
35  
36  
Crystal or external clock input. Functions as a crystal input or as an  
external clock input. A crystal can be connected between XTAL1 and  
XTAL2 to form an internal oscillator circuit (see Figure 14).  
Alternatively, an external clock can be connected to this pin to provide  
custom data rates.  
XTAL2  
O
Output of the crystal oscillator or buffered clock. (See also  
XTAL1.) XTAL2 is used as a crystal oscillator output or a buffered  
clock output.  
6. Functional description  
The SC16C754B UART is pin-compatible with the SC16C554 and SC16C654 UARTs. It  
provides more enhanced features. All additional features are provided through a special  
enhanced feature register.  
The UART will perform serial-to-parallel conversion on data characters received from  
peripheral devices or modems, and parallel-to-parallel conversion on data characters  
transmitted by the processor. The complete status of each channel of the SC16C754B  
UART can be read at any time during functional operation by the processor.  
The SC16C754B can be placed in an alternate mode (FIFO mode) relieving the processor  
of excessive software overhead by buffering received/transmitted characters. Both the  
receiver and transmitter FIFOs can store up to 64 bytes (including three additional bits of  
error status per byte for the receiver FIFO) and have selectable or programmable trigger  
levels. Primary outputs RXRDY and TXRDY allow signalling of DMA transfers.  
The SC16C754B has selectable hardware flow control and software flow control.  
Hardware flow control significantly reduces software overhead and increases system  
efficiency by automatically controlling serial data flow using the RTS output and CTS input  
signals. Software flow control automatically controls data flow by using programmable  
Xon/Xoff characters.  
The UART includes a programmable baud rate generator that can divide the timing  
reference clock input by a divisor between 1 and (216 1).  
6.1 Trigger levels  
The SC16C754B provides independent selectable and programmable trigger levels for  
both receiver and transmitter DMA and interrupt generation. After reset, both transmitter  
and receiver FIFOs are disabled and so, in effect, the trigger level is the default value of  
one byte. The selectable trigger levels are available via the FCR. The programmable  
trigger levels are available via the TLR.  
9397 750 14668  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 02 — 13 June 2005  
9 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
6.2 Hardware flow control  
Hardware flow control is comprised of Auto-CTS and Auto-RTS. Auto-CTS and Auto-RTS  
can be enabled/disabled independently by programming EFR[7:6].  
With Auto-CTS, CTS must be active before the UART can transmit data.  
Auto-RTS only activates the RTS output when there is enough room in the FIFO to receive  
data and de-activates the RTS output when the RX FIFO is sufficiently full. The halt and  
resume trigger levels in the TCR determine the levels at which RTS is  
activated/deactivated.  
If both Auto-CTS and Auto-RTS are enabled, when RTS is connected to CTS, data  
transmission does not occur unless the receiver FIFO has empty space. Thus, overrun  
errors are eliminated during hardware flow control. If not enabled, overrun errors occur if  
the transmit data rate exceeds the receive FIFO servicing latency.  
UART 1  
UART 2  
SERIAL TO  
PARALLEL  
RX  
TX  
PARALLEL  
TO SERIAL  
RX  
TX  
FIFO  
FIFO  
RTS  
CTS  
FLOW  
FLOW  
CONTROL  
CONTROL  
D7 to D0  
D7 to D0  
PARALLEL  
TO SERIAL  
SERIAL TO  
PARALLEL  
TX  
RX  
TX  
RX  
FIFO  
FIFO  
CTS  
RTS  
FLOW  
FLOW  
CONTROL  
CONTROL  
002aaa228  
Fig 5. Autoflow control (Auto-RTS and Auto-CTS) example  
9397 750 14668  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 02 — 13 June 2005  
10 of 50  
SC16C754B  
Philips Semiconductors  
6.2.1 Auto-RTS  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
Auto-RTS data flow control originates in the receiver block (see Figure 1 “Block diagram of  
SC16C754B” on page 3). Figure 6 shows RTS functional timing. The receiver FIFO trigger  
levels used in Auto-RTS are stored in the TCR. RTS is active if the RX FIFO level is below  
the halt trigger level in TCR[3:0]. When the receiver FIFO halt trigger level is reached,  
RTS is deasserted. The sending device (for example, another UART) may send an  
additional byte after the trigger level is reached (assuming the sending UART has another  
byte to send) because it may not recognize the deassertion of RTS until it has begun  
sending the additional byte. RTS is automatically reasserted once the receiver FIFO  
reaches the resume trigger level programmed via TCR[7:4]. This reassertion allows the  
sending device to resume transmission.  
RX  
Start  
byte N  
Stop  
Start  
byte N + 1  
Stop  
Start  
RTS  
1
2
N
N+1  
IOR  
002aaa226  
(1) N = receiver FIFO trigger level.  
(2) The two blocks in dashed lines cover the case where an additional byte is sent, as described in Section 6.2.1.  
Fig 6. RTS functional timing  
6.2.2 Auto-CTS  
The transmitter circuitry checks CTS before sending the next data byte. When CTS is  
active, the transmitter sends the next byte. To stop the transmitter from sending the  
following byte, CTS must be deasserted before the middle of the last stop bit that is  
currently being sent. The auto-CTS function reduces interrupts to the host system. When  
flow control is enabled, CTS level changes do not trigger host interrupts because the  
device automatically controls its own transmitter. Without auto-CTS, the transmitter sends  
any data present in the transmit FIFO and a receiver overrun error may result.  
Start  
byte 0 to 7  
Stop  
TX  
Start  
byte 0 to 7  
Stop  
CTS  
002aaa227  
(1) When CTS is LOW, the transmitter keeps sending serial data out.  
(2) When CTS goes HIGH before the middle of the last stop bit of the current byte, the transmitter finishes sending the current  
byte, but it does not send the next byte.  
(3) When CTS goes from HIGH to LOW, the transmitter begins sending data again.  
Fig 7. CTS functional timing  
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6.3 Software flow control  
Software flow control is enabled through the enhanced feature register and the modem  
control register. Different combinations of software flow control can be enabled by setting  
different combinations of EFR[3:0]. Table 3 shows software flow control options.  
Table 3:  
Software flow control options (EFR[3:0])  
EFR[3]  
EFR[2]  
EFR[1]  
EFR[0]  
TX, RX software flow controls  
no transmit flow control  
0
1
0
1
X
X
X
1
0
0
1
1
X
X
X
0
X
X
X
X
0
1
0
1
X
X
X
X
0
0
1
1
transmit Xon1, Xoff1  
transmit Xon2, Xoff2  
transmit Xon1, Xon2, Xoff1, Xoff2  
no receive flow control  
receiver compares Xon1, Xoff1  
receiver compares Xon2, Xoff2  
transmit Xon1, Xoff1  
receiver compares Xon1 or Xon2, Xoff1 or Xoff2  
transmit Xon2, Xoff2  
0
1
0
1
1
0
1
1
1
1
1
1
receiver compares Xon1 or Xon2, Xoff1 or Xoff2  
transmit Xon1, Xon2, Xoff1, Xoff2  
receiver compares Xon1 and Xon2, Xoff1 and Xoff2  
no transmit flow control  
receiver compares Xon1 and Xon2, Xoff1 and Xoff2  
Remark: When using software flow control, the Xon/Xoff characters cannot be used for  
data characters.  
There are two other enhanced features relating to software flow control:  
Xon Any function (MCR[5]): Operation will resume after receiving any character  
after recognizing the Xoff character. It is possible that an Xon1 character is  
recognized as an Xon Any character, which could cause an Xon2 character to be  
written to the RX FIFO.  
Special character (EFR[5]): Incoming data is compared to Xoff2. Detection of the  
special character sets the Xoff interrupt (IIR[4]) but does not halt transmission. The  
Xoff interrupt is cleared by a read of the IIR. The special character is transferred to the  
RX FIFO.  
6.3.1 RX  
When software flow control operation is enabled, the SC16C754B will compare incoming  
data with Xoff1/Xoff2 programmed characters (in certain cases, Xoff1 and Xoff2 must be  
received sequentially). When the correct Xoff character is received, transmission is halted  
after completing transmission of the current character. Xoff detection also sets IIR[4] (if  
enabled via IER[5]) and causes INT to go HIGH.  
To resume transmission, an Xon1/Xon2 character must be received (in certain cases  
Xon1 and Xon2 must be received sequentially). When the correct Xon characters are  
received, IIR[4] is cleared, and the Xoff interrupt disappears.  
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6.3.2 TX  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
Xoff1/Xoff2 character is transmitted when the RX FIFO has passed the HALT trigger level  
programmed in TCR[3:0].  
Xon1/Xon2 character is transmitted when the RX FIFO reaches the RESUME trigger level  
programmed in TCR[7:4].  
The transmission of Xoff/Xon(s) follows the exact same protocol as transmission of an  
ordinary byte from the FIFO. This means that even if the word length is set to be 5, 6, or 7  
characters, then the 5, 6, or 7 least significant bits of Xoff1/Xoff2 and Xon1/Xon2 will be  
transmitted. (Note that the transmission of 5, 6, or 7 bits of a character is seldom done, but  
this functionality is included to maintain compatibility with earlier designs.)  
It is assumed that software flow control and hardware flow control will never be enabled  
simultaneously. Figure 8 shows an example of software flow control.  
6.3.3 Software flow control example  
UART1  
UART2  
TRANSMIT FIFO  
RECEIVE FIFO  
data  
PARALLEL-TO-SERIAL  
SERIAL-TO-PARALLEL  
Xon-1 WORD  
SERIAL-TO-PARALLEL  
PARALLEL-TO-SERIAL  
Xon-1 WORD  
Xoff–Xon–Xoff  
Xon-2 WORD  
Xon-2 WORD  
Xoff-1 WORD  
Xoff-1 WORD  
compare  
programmed  
Xon-Xoff  
Xoff-2 WORD  
Xoff-2 WORD  
characters  
002aaa229  
Fig 8. Software flow control example  
6.3.3.1 Assumptions  
UART1 is transmitting a large text file to UART2. Both UARTs are using software flow  
control with single character Xoff (0F) and Xon (0D) tokens. Both have Xoff threshold  
(TCR[3:0] = F) set to 60, and Xon threshold (TCR[7:4] = 8) set to 32. Both have the  
interrupt receive threshold (TLR[7:4] = D) set to 52.  
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UART1 begins transmission and sends 52 characters, at which point UART2 will generate  
an interrupt to its processor to service the RCV FIFO, but assumes the interrupt latency is  
fairly long. UART1 will continue sending characters until a total of 60 characters have  
been sent. At this time, UART2 will transmit a 0F to UART1, informing UART1 to halt  
transmission. UART1 will likely send the 61st character while UART2 is sending the Xoff  
character. Now UART2 is serviced and the processor reads enough data out of the RX  
FIFO that the level drops to 32. UART2 will now send a 0D to UART1, informing UART1 to  
resume transmission.  
6.4 Reset  
Table 4 summarizes the state of register after reset.  
Table 4:  
Register  
Register reset functions  
Reset control  
RESET  
RESET  
RESET  
RESET  
RESET  
RESET  
RESET  
RESET  
RESET  
RESET  
RESET  
RESET  
Reset state  
Interrupt enable register  
Interrupt identification register  
FIFO control register  
all bits cleared  
bit 0 is set; all other bits cleared  
all bits cleared  
Line control register  
reset to 0001 1101 (1Dh)  
all bits cleared  
Modem control register  
Line status register  
bit 5 and bit 6 set; all other bits cleared  
bits 3:0 cleared; bits 7:4 input signals  
all bits cleared  
Modem status register  
Enhanced feature register  
Receiver holding register  
Transmitter holding register  
Transmission control register  
Trigger level register  
pointer logic cleared  
pointer logic cleared  
all bits cleared  
all bits cleared  
Remark: Registers DLL, DLH, SPR, Xon1, Xon2, Xoff1, Xoff2 are not reset by the  
top-level reset signal RESET, that is, they hold their initialization values during reset.  
Table 5 summarizes the state of registers after reset.  
Table 5:  
Signal  
TX  
Signal RESET functions  
Reset control  
Reset state  
HIGH  
RESET  
RESET  
RESET  
RESET  
RESET  
RTS  
HIGH  
DTR  
HIGH  
RXRDY  
TXRDY  
HIGH  
LOW  
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6.5 Interrupts  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
The SC16C754B has interrupt generation and prioritization (six prioritized levels of  
interrupts) capability. The interrupt enable register (IER) enables each of the six types of  
interrupts and the INT signal in response to an interrupt generation. The IER can also  
disable the interrupt system by clearing bits 7:5 and 3:0. When an interrupt is generated,  
the IIR indicates that an interrupt is pending and provides the type of interrupt through  
IIR[5:0]. Table 6 summarizes the interrupt control functions.  
Table 6:  
IIR[5:0]  
Interrupt control functions  
Priority  
level  
Interrupt type  
Interrupt source  
Interrupt reset method  
00 0001  
00 0110  
None  
1
none  
none  
none  
receiver line status  
OE, FE, PE, or BI errors occur in  
characters in the RX FIFO  
FE, PE, BI: all erroneous  
characters are read from the  
RX FIFO.  
OE: read LSR  
read RHR  
00 1100  
00 0100  
2
2
RX time-out  
stale data in RX FIFO  
DRDY (data ready)  
(FIFO disable)  
RHR interrupt  
read RHR  
RX FIFO above trigger level  
(FIFO enable)  
00 0010  
3
THR interrupt  
TFE (THR empty)  
(FIFO disable)  
read IIR or a write to the THR  
TX FIFO passes above trigger level  
(FIFO enable)  
00 0000  
01 0000  
4
5
modem status  
Xoff interrupt  
MSR[3:0] = 0  
read MSR  
receive Xoff character(s)/special  
character  
receive Xon character(s)/Read of  
IIR  
10 0000  
6
CTS, RTS  
RTS pin or CTS pin change state from read IIR  
active (LOW) to inactive (HIGH)  
It is important to note that for the framing error, parity error, and break conditions, LSR[7]  
generates the interrupt. LSR[7] is set when there is an error anywhere in the RX FIFO,  
and is cleared only when there are no more errors remaining in the FIFO. LSR[4:2] always  
represent the error status for the received character at the top of the RX FIFO. Reading  
the RX FIFO updates LSR[4:2] to the appropriate status for the new character at the top of  
the FIFO. If the RX FIFO is empty, then LSR[4:2] are all zeros.  
For the Xoff interrupt, if an Xoff flow character detection caused the interrupt, the interrupt  
is cleared by an Xon flow character detection. If a special character detection caused the  
interrupt, the interrupt is cleared by a read of the IIR.  
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6.5.1 Interrupt mode operation  
In interrupt mode (if any bit of IER[3:0] is ‘1’) the processor is informed of the status of the  
receiver and transmitter by an interrupt signal, INT. Therefore, it is not necessary to  
continuously poll the line status register (LSR) to see if any interrupt needs to be serviced.  
Figure 9 shows interrupt mode operation.  
IIR  
IOW / IOR  
INT  
PROCESSOR  
IER  
1
1
1
1
THR  
RHR  
002aaa230  
Fig 9. Interrupt mode operation  
6.5.2 Polled mode operation  
In polled mode (IER[3:0] = 0000) the status of the receiver and transmitter can be  
checked by polling the line status register (LSR). This mode is an alternative to the FIFO  
interrupt mode of operation where the status of the receiver and transmitter is  
automatically known by means of interrupts sent to the CPU. Figure 10 shows FIFO polled  
mode operation.  
LSR  
IOW / IOR  
PROCESSOR  
IER  
0
0
0
0
THR  
RHR  
002aaa231  
Fig 10. FIFO polled mode operation  
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6.6 DMA operation  
There are two modes of DMA operation, DMA mode 0 or DMA mode 1, selected by  
FCR[3].  
In DMA mode 0 or FIFO disable (FCR[0] = 0) DMA occurs in single character transfers. In  
DMA mode 1, multi-character (or block) DMA transfers are managed to relieve the  
processor for longer periods of time.  
6.6.1 Single DMA transfers (DMA mode 0/FIFO disable)  
Figure 11 shows TXRDY and RXRDY in DMA mode 0/FIFO disable.  
TX  
RX  
TXRDY  
RXRDY  
at least one  
at least one  
wrptr  
rdptr  
location filled  
location filled  
TXRDY  
RXRDY  
FIFO EMPTY  
FIFO EMPTY  
wrptr  
rdptr  
002aaa232  
Fig 11. TXRDY and RXRDY in DMA mode 0/FIFO disable  
6.6.1.1 Transmitter  
When empty, the TXRDY signal becomes active. TXRDY will go inactive after one  
character has been loaded into it.  
6.6.1.2 Receiver  
RXRDY is active when there is at least one character in the FIFO. It becomes inactive  
when the receiver is empty.  
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6.6.2 Block DMA transfers (DMA mode 1)  
Figure 12 shows TXRDY and RXRDY in DMA mode 1.  
TX  
RX  
wrptr  
trigger  
level  
TXRDY  
rdptr  
RXRDY  
FIFO full  
trigger  
level  
TXRDY  
wrptr  
RXRDY  
FIFO EMPTY  
rdptr  
002aaa869  
Fig 12. TXRDY and RXRDY in DMA mode 1  
6.6.2.1 Transmitter  
TXRDY is active when there is a trigger level number of spaces available. It becomes  
inactive when the FIFO is full.  
6.6.2.2 Receiver  
RXRDY becomes active when the trigger level has been reached, or when a time-out  
interrupt occurs. It will go inactive when the FIFO is empty or an error in the RX FIFO is  
flagged by LSR[7].  
6.7 Sleep mode  
Sleep mode is an enhanced feature of the SC16C754B UART. It is enabled when EFR[4],  
the enhanced functions bit, is set and when IER[4] is set. Sleep mode is entered when:  
The serial data input line, RX, is idle (see Section 6.8 “Break and time-out  
conditions”).  
The TX FIFO and TX shift register are empty.  
There are no interrupts pending except THR and time-out interrupts.  
Remark: Sleep mode will not be entered if there is data in the RX FIFO.  
In Sleep mode, the UART clock and baud rate clock are stopped. Since most registers are  
clocked using these clocks, the power consumption is greatly reduced. The UART will  
wake up when any change is detected on the RX line, when there is any change in the  
state of the modem input pins, or if data is written to the TX FIFO.  
Remark: Writing to the divisor latches, DLL and DLH, to set the baud clock, must not be  
done during Sleep mode. Therefore, it is advisable to disable Sleep mode using IER[4]  
before writing to DLL or DLH.  
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6.8 Break and time-out conditions  
An RX idle condition is detected when the receiver line, RX, has been HIGH for  
4 character time. The receiver line is sampled midway through each bit.  
When a break condition occurs, the TX line is pulled LOW. A break condition is activated  
by setting LCR[6].  
6.9 Programmable baud rate generator  
The SC16C754B UART contains a programmable baud generator that takes any clock  
input and divides it by a divisor in the range between 1 and (216 1). An additional  
divide-by-4 prescaler is also available and can be selected by MCR[7], as shown in  
Figure 13. The output frequency of the baud rate generator is 16× the baud rate. The  
formula for the divisor is:  
XTAL1 crystal input frequency  
---------------------------------------------------------------------------  
prescaler  
divisor =  
--------------------------------------------------------------------------------  
(desired baud rate × 16)  
Where:  
prescaler = 1, when MCR[7] is set to 0 after reset (divide-by-1 clock selected)  
prescaler = 4, when MCR[7] is set to 1 after reset (divide-by-4 clock selected).  
Remark: The default value of prescaler after reset is divide-by-1.  
Figure 13 shows the internal prescaler and baud rate generator circuitry.  
PRESCALER  
MCR[7] = 0  
LOGIC  
(DIVIDE-BY-1)  
internal  
XTAL1  
XTAL2  
INTERNAL  
OSCILLATOR  
LOGIC  
BAUD RATE  
GENERATOR  
LOGIC  
baud rate  
clock for  
transmitter  
and receiver  
input clock  
reference  
clock  
PRESCALER  
LOGIC  
(DIVIDE-BY-4)  
MCR[7] = 1  
002aaa233  
Fig 13. Prescaler and baud rate generator block diagram  
DLL and DLH must be written to in order to program the baud rate. DLL and DLH are the  
least significant and most significant byte of the baud rate divisor. If DLL and DLH are both  
zero, the UART is effectively disabled, as no baud clock will be generated.  
Remark: The programmable baud rate generator is provided to select both the transmit  
and receive clock rates.  
Table 7 and Table 8 show the baud rate and divisor correlation for crystal with frequency  
1.8432 MHz and 3.072 MHz, respectively.  
Figure 14 shows the crystal clock circuit reference.  
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5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
Table 7:  
Baud rates using a 1.8432 MHz crystal  
Desired baud rate  
Divisor used to generate  
Percent error difference  
16× clock  
between desired and actual  
50  
2304  
1536  
1047  
857  
768  
384  
192  
96  
75  
110  
0.026  
0.058  
134.5  
150  
300  
600  
1200  
1800  
2000  
2400  
3600  
4800  
7200  
9600  
19200  
38400  
56000  
64  
58  
0.69  
48  
32  
24  
16  
12  
6
3
2
2.86  
Table 8:  
Baud rates using a 3.072 MHz crystal  
Desired baud rate  
Divisor used to generate  
Percent error difference  
16× clock  
between desired and actual  
50  
3840  
2560  
1745  
1428  
1280  
640  
320  
160  
107  
96  
75  
110  
0.026  
0.034  
134.5  
150  
300  
600  
1200  
1800  
2000  
2400  
3600  
4800  
7200  
9600  
19200  
38400  
0.312  
80  
53  
0.628  
1.23  
40  
27  
20  
10  
5
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XTAL1  
XTAL2  
XTAL1  
XTAL2  
1.5 k  
X1  
X1  
1.8432 MHz  
1.8432 MHz  
C1  
22 pF  
C2  
33 pF  
C1  
22 pF  
C2  
47 pF  
002aaa870  
Fig 14. Crystal oscillator connection  
7. Register descriptions  
Each register is selected using address lines A0, A1, A2, and in some cases, bits from  
other registers. The programming combinations for register selection are shown in  
Table 9.  
Table 9:  
A1  
Register map - read/write properties  
A2  
0
0
0
0
1
1
1
1
0
0
0
1
1
1
1
1
1
1
A0  
0
1
0
1
0
1
0
1
0
1
0
0
1
0
1
0
1
1
Read mode  
Write mode  
0
0
1
1
0
0
1
1
0
0
1
0
0
1
1
1
1
1
receive holding register (RHR)  
interrupt enable register (IER)  
interrupt identification register (IIR)  
line control register (LCR)  
modem control register (MCR)[1]  
line status register (LSR)  
modem status register (MSR)  
scratchpad register (SPR)  
divisor latch LSB (DLL)[2] [3]  
divisor latch MSB (DLH)[2] [3]  
enhanced feature register (EFR)[2] [4]  
Xon1 word[2] [4]  
Xon2 word[2] [4]  
Xoff1 word[2] [4]  
Xoff2 word[2] [4]  
transmission control register (TCR)[2] [5]  
trigger level register (TLR)[2] [5]  
FIFO ready register[2] [6]  
transmit holding register (THR)  
interrupt enable register  
FIFO control register (FCR)  
line control register  
modem control register[1]  
n/a  
n/a  
scratchpad register  
divisor latch LSB[2] [3]  
divisor latch MSB[2] [3]  
enhanced feature register[2] [4]  
Xon1 word[2] [4]  
Xon2 word[2] [4]  
Xoff1 word[2] [4]  
Xoff2 word[2] [4]  
transmission control register[2] [5]  
trigger level register[2] [5]  
[1] MCR[7] can only be modified when EFR[4] is set.  
[2] Accessed by a combination of address pins and register bits.  
[3] Accessible only when LCR[7] is logic 1.  
[4] Accessible only when LCR is set to 1011 1111 (xBF).  
[5] Accessible only when EFR[4] = 1 and MCR[6] = 1, that is, EFR[4] and MCR[6] are read/write enables.  
[6] Accessible only when CSA - CSD = 0, MCR[2] = 1, and loop-back is disabled (MCR[4] = 0).  
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5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
Table 10 lists and describes the SC16C754B internal registers.  
Table 10: SC16C754B internal registers  
Read/  
Write  
A2 A1 A0 Register Bit 7  
General Register set[1]  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
0
0
0
0
0
0
0
0
1
RHR  
THR  
IER  
bit 7  
bit 6  
bit 5  
bit 5  
bit 4  
bit 4  
bit 3  
bit 3  
bit 2  
bit 2  
bit 1  
bit 1  
THR  
bit 0  
bit 0  
R
bit 7  
bit 6  
W
0/CTS  
interrupt interrupt  
enable[2] enable[2]  
0/RTS  
0/Xoff[2] 0/X Sleep modem receive  
Rx data R/W  
available  
mode[2]  
status  
interrupt interrupt  
line status empty  
interrupt interrupt  
RX FIFO FIFO  
reset enable  
0
1
0
FCR  
RX  
trigger  
level  
RX trigger 0/TX  
level (LSB) trigger  
level  
0/TX  
trigger  
level  
DMA  
mode  
select  
TX FIFO  
reset  
W
(MSB)  
(MSB)[2] (LSB)[2]  
0
0
1
1
1
1
0
0
0
1
0
1
IIR  
FCR[0]  
FCR[0]  
0/CTS,  
RTS  
0/Xoff  
interrupt interrupt  
interrupt interrupt  
R
priority  
bit 2  
priority  
bit 1  
priority  
bit 0  
status  
LCR  
MCR  
LSR  
DLAB  
break  
control bit  
set parity paritytype parity  
select enable  
number of word  
stop bits  
word  
length  
bit 0  
R/W  
R/W  
R
length  
bit 1  
1× or  
1×/4  
clock[2]  
TCR and  
TLR  
enable[2]  
0/Xon  
Any[2]  
0/enable IRQ  
loop-back enable  
OP  
FIFO  
ready  
enable  
RTS  
DTR  
0/error in THR and  
THR  
break  
framing parity error overrun data in  
RX FIFO TSR empty empty  
interrupt  
error  
CD  
bit 3  
bit 3  
bit 3  
error  
DSR  
bit 1  
receiver  
CTS  
bit 0  
1
1
1
1
1
1
1
1
1
1
0
1
0
1
1
MSR  
SPR  
TCR  
TLR  
CD  
RI  
DSR  
bit 5  
bit 5  
bit 5  
CTS  
bit 4  
bit 4  
bit 4  
RI  
R
bit 7  
bit 7  
bit 7  
bit 6  
bit 6  
bit 6  
bit 2  
bit 2  
bit 2  
R/W  
R/W  
R/W  
R
bit 1  
bit 0  
bit 1  
bit 0  
FIFO  
Rdy  
RX FIFO RX FIFO  
D status C status  
RX FIFO RX FIFO TXFIFO TX FIFO  
B status A status D status C status  
TX FIFO TX FIFO  
B status A status  
Special Register set[3]  
0
0
0
DLL  
bit 7  
bit 6  
bit 5  
bit 4  
bit 3  
bit 2  
bit 1  
bit 9  
bit 0  
bit 8  
R/W  
R/W  
0
0
1
DLH  
bit 15  
bit 14  
bit 13  
bit 12  
bit 11  
bit 10  
Enhanced Register set[4]  
0
1
0
EFR  
Auto CTS Auto RTS Special  
Enable  
software software  
software software R/W  
character enhanced flow  
flow  
flow  
flow  
detect  
functions control  
control  
bit 2  
control  
bit 1  
control  
bit 0  
[2]  
bit 3  
1
1
1
1
0
0
1
1
0
1
0
1
Xon1  
Xon2  
Xoff1  
Xoff2  
bit 7  
bit 7  
bit 7  
bit 7  
bit 6  
bit 6  
bit 6  
bit 6  
bit 5  
bit 5  
bit 5  
bit 5  
bit 4  
bit 4  
bit 4  
bit 4  
bit 3  
bit 3  
bit 3  
bit 3  
bit 2  
bit 2  
bit 2  
bit 2  
bit 1  
bit 1  
bit 1  
bit 1  
bit 0  
bit 0  
bit 0  
bit 0  
R/W  
R/W  
R/W  
R/W  
[1] These registers are accessible only when LCR[7] = 0.  
[2] This bit can only be modified if register bit EFR[4] is enabled, that is, if enhanced functions are enabled.  
[3] The Special Register set is accessible only when LCR[7] is set to a logic 1.  
[4] Enhanced Feature Register; Xon1/Xon2 and Xoff1/Xoff2 are accessible only when LCR is set to ‘BFh’.  
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Remark: Refer to the notes under Table 9 for more register access information.  
7.1 Receiver Holding Register (RHR)  
The receiver section consists of the Receiver Holding Register (RHR) and the Receiver  
Shift Register (RSR). The RHR is actually a 64-byte FIFO. The RSR receives serial data  
from the RX terminal. The data is converted to parallel data and moved to the RHR. The  
receiver section is controlled by the Line Control Register (LCR). If the FIFO is disabled,  
location zero of the FIFO is used to store the characters.  
Remark: In this case, characters are overwritten if overflow occurs.  
If overflow occurs, characters are lost. The RHR also stores the error status bits  
associated with each character.  
7.2 Transmit Holding Register (THR)  
The transmitter section consists of the Transmit Holding Register (THR) and the Transmit  
Shift Register (TSR). The THR is actually a 64-byte FIFO. The THR receives data and  
shifts it into the TSR, where it is converted to serial data and moved out on the TX  
terminal. If the FIFO is disabled, the FIFO is still used to store the byte. Characters are  
lost if overflow occurs.  
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7.3 FIFO Control Register (FCR)  
This is a write-only register that is used for enabling the FIFOs, clearing the FIFOs, setting  
transmitter and receiver trigger levels, and selecting the type of DMA signalling. Table 11  
shows FIFO control register bit settings.  
Table 11: FIFO Control Register bits description  
Bit  
Symbol  
Description  
7:6  
FCR[7] (MSB), RCVR trigger. Sets the trigger level for the RX FIFO.  
FCR[6] (LSB)  
00 - 8 characters  
01 - 16 characters  
10 - 56 characters  
11 - 60 characters  
5:4  
FCR[5] (MSB), TX trigger. Sets the trigger level for the TX FIFO.  
FCR[4] (LSB)  
00 - 8 spaces  
01 - 16 spaces  
10 - 32 spaces  
11 - 56 spaces  
FCR[5:4] can only be modified and enabled when EFR[4] is set. This is  
because the transmit trigger level is regarded as an enhanced function.  
3
2
FCR[3]  
FCR[2]  
DMA mode select.  
logic 0 = Set DMA mode ‘0’  
logic 1 = Set DMA mode ‘1’  
Reset TX FIFO.  
logic 0 = no FIFO transmit reset (normal default condition)  
logic 1 = clears the contents of the transmit FIFO and resets the FIFO  
counter logic (the transmit shift register is not cleared or altered). This  
bit will return to a logic 0 after clearing the FIFO.  
1
0
FCR[1]  
FCR[0]  
Reset RX FIFO.  
logic 0 = no FIFO receive reset (normal default condition)  
logic 1 = clears the contents of the receive FIFO and resets the FIFO  
counter logic (the receive shift register is not cleared or altered). This  
bit will return to a logic 0 after clearing the FIFO.  
FIFO enable.  
logic 0 = disable the transmit and receive FIFO (normal default  
condition)  
logic 1 = enable the transmit and receive FIFO  
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7.4 Line Control Register (LCR)  
This register controls the data communication format. The word length, number of stop  
bits, and parity type are selected by writing the appropriate bits to the LCR. Table 12  
shows the line control register bit settings.  
Table 12: Line Control Register bits description  
Bit  
Symbol  
Description  
7
LCR[7]  
Divisor latch enable.  
logic 0 = divisor latch disabled (normal default condition)  
logic 1 = divisor latch enabled  
6
5
LCR[6]  
LCR[5]  
Break control bit. When enabled, the Break control bit causes a break  
condition to be transmitted (the TX output is forced to a logic 0 state). This  
condition exists until disabled by setting LCR[6] to a logic 0.  
logic 0 = no TX break condition (normal default condition)  
logic 1 = forces the transmitter output (TX) to a logic 0 to alert the  
communication terminal to a line break condition  
Set parity. LCR[5] selects the forced parity format (if LCR[3] = 1).  
logic 0 = parity is not forced (normal default condition)  
LCR[5] = logic 1 and LCR[4] = logic 0: parity bit is forced to a logical 1 for  
the transmit and receive data  
LCR[5] = logic 1 and LCR[4] = logic 1: parity bit is forced to a logical 0 for  
the transmit and receive data  
4
3
LCR[4]  
LCR[3]  
Parity type select.  
logic 0 = odd parity is generated (if LCR[3] = 1)  
logic 1 = even parity is generated (if LCR[3] = 1)  
Parity enable.  
logic 0 = no parity (normal default condition)  
logic 1 = a parity bit is generated during transmission and the receiver  
checks for received parity  
2
LCR[2]  
Number of stop bits. Specifies the number of stop bits.  
0 = 1 stop bit (word length = 5, 6, 7, 8)  
1 = 1.5 stop bits (word length = 5)  
1 = 2 stop bits (word length = 6, 7, 8)  
1:0  
LCR[1:0]  
Word length bits 1, 0. These two bits specify the word length to be  
transmitted or received.  
00 - 5 bits  
01 - 6 bits  
10 - 7 bits  
11 - 8 bits  
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7.5 Line Status Register (LSR)  
Table 13 shows the line status register bit settings.  
Table 13: Line Status Register bits description  
Bit  
Symbol  
Description  
7
LSR[7]  
FIFO data error.  
logic 0 = no error (normal default condition)  
logic 1 = at least one parity error, framing error, or break indication is in the  
receiver FIFO. This bit is cleared when no more errors are present in the  
FIFO.  
6
5
LSR[6]  
LSR[5]  
THR and TSR empty. This bit is the Transmit Empty indicator.  
logic 0 = transmitter hold and shift registers are not empty  
logic 1 = transmitter hold and shift registers are empty  
THR empty. This bit is the Transmit Holding Register Empty indicator.  
logic 0 = Transmit Hold Register is not empty  
logic 1 = Transmit Hold Register is empty. The processor can now load up  
to 64 bytes of data into the THR if the TX FIFO is enabled.  
4
3
LSR[4]  
LSR[3]  
Break interrupt.  
logic 0 = no break condition (normal default condition)  
logic 1 = a break condition occurred and associated byte is 00, that is,  
RX was LOW for one character time frame  
Framing error.  
logic 0 = no framing error in data being read from RX FIFO (normal default  
condition)  
logic 1 = framing error occurred in data being read from RX FIFO, that is,  
received data did not have a valid stop bit  
2
1
0
LSR[2]  
LSR[1]  
LSR[0]  
Parity error.  
logic 0 = no parity error (normal default condition)  
logic 1 = parity error in data being read from RX FIFO  
Overrun error.  
logic 0 = no overrun error (normal default condition)  
logic 1 = overrun error has occurred  
Data in receiver.  
logic 0 = no data in receive FIFO (normal default condition)  
logic 1 = at least one character in the RX FIFO  
When the LSR is read, LSR[4:2] reflect the error bits (BI, FE, PE) of the character at the  
top of the RX FIFO (next character to be read). The LSR[4:2] registers do not physically  
exist, as the data read from the RX FIFO is output directly onto the output data bus,  
DI[4:2], when the LSR is read. Therefore, errors in a character are identified by reading  
the LSR and then reading the RHR.  
LSR[7] is set when there is an error anywhere in the RX FIFO, and is cleared only when  
there are no more errors remaining in the FIFO.  
Reading the LSR does not cause an increment of the RX FIFO read pointer. The RX FIFO  
read pointer is incremented by reading the RHR.  
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7.6 Modem Control Register (MCR)  
The MCR controls the interface with the modem, data set, or peripheral device that is  
emulating the modem. Table 14 shows Modem Control Register bit settings.  
Table 14: Modem Control Register bits description  
Bit  
Symbol  
Description  
[1]  
[1]  
[1]  
7
MCR[7]  
Clock select.  
logic 0 = divide-by-1 clock input  
logic 1 = divide-by-4 clock input  
TCR and TLR enable.  
6
5
4
MCR[6]  
MCR[5]  
MCR[4]  
logic 0 = no action  
logic 1 = enable access to the TCR and TLR registers  
Xon Any.  
logic 0 = disable Xon Any function  
logic 1 = enable Xon Any function  
Enable loop-back.  
logic 0 = normal operating mode  
Logic 1 = enable local loop-back mode (internal). In this mode the  
MCR[3:0] signals are looped back into MSR[7:4] and the TX output is  
looped back to the RX input internally.  
3
MCR[3]  
IRQ enable OP.  
logic 0 = forces INTA-INTB outputs to the 3-state mode and OP output  
to HIGH state  
logic 1 = forces the INTA-INTB outputs to the active state and OP  
output to LOW state. In loop-back mode, controls MSR[7].  
2
1
MCR[2]  
MCR[1]  
FIFO Ready enable.  
logic 0 = disable the FIFO Rdy register  
logic 1 = enable the FIFO Rdy register. In loop-back mode, controls  
MSR[6].  
RTS  
logic 0 = force RTS output to inactive (HIGH)  
logic 1 = force RTS output to active (LOW).  
In loop-back mode, controls MSR[4]. If Auto-RTS is enabled, the RTS  
output is controlled by hardware flow control.  
0
MCR[0]  
DTR  
logic 0 = force DTR output to inactive (HIGH)  
logic 1 = force DTR output to active (LOW).  
In loop-back mode, controls MSR[5].  
[1] MCR[7:5] can only be modified when EFR[4] is set, that is, EFR[4] is a write enable.  
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7.7 Modem Status Register (MSR)  
This 8-bit register provides information about the current state of the control lines from the  
modem, data set, or peripheral device to the processor. It also indicates when a control  
input from the modem changes state. Table 15 shows Modem Status Register bit settings  
per channel.  
Table 15: Modem Status Register bits description  
Bit  
Symbol  
Description  
7
MSR[7][1] CD (active HIGH, logical 1). This bit is the complement of the CD input  
during normal mode. During internal loop-back mode, it is equivalent to  
MCR[3].  
6
5
MSR[6][1] RI (active HIGH, logical 1). This bit is the complement of the RI input during  
normal mode. During internal loop-back mode, it is equivalent to MCR[2].  
MSR[5][1] DSR (active HIGH, logical 1). This bit is the complement of the DSR input  
during normal mode. During internal loop-back mode, it is equivalent  
MCR[0].  
4
MSR[4][1] CTS (active HIGH, logical 1). This bit is the complement of the CTS input  
during normal mode. During internal loop-back mode, it is equivalent to  
MCR[1].  
3
2
1
0
MSR[3]  
MSR[2]  
MSR[1]  
MSR[0]  
CD. Indicates that CD input (or MCR[3] in loop-back mode) has changed  
state. Cleared on a read.  
RI. Indicates that RI input (or MCR[2] in loop-back mode) has changed  
state from LOW to HIGH. Cleared on a read.  
DSR. Indicates that DSR input (or MCR[0] in loop-back mode) has changed  
state. Cleared on a read.  
CTS. Indicates that CTS input (or MCR[1] in loop-back mode) has changed  
state. Cleared on a read.  
[1] The primary inputs RI, CD, CTS, DSR are all active LOW, but their registered equivalents in the MSR and  
MCR (in loop-back) registers are active HIGH.  
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7.8 Interrupt Enable Register (IER)  
The Interrupt Enable Register (IER) enables each of the six types of interrupt, receiver  
error, RHR interrupt, THR interrupt, Xoff received, or CTS/RTS change of state from LOW  
to HIGH. The INT output signal is activated in response to interrupt generation. Table 16  
shows Interrupt Enable Register bit settings.  
Table 16: Interrupt Enable Register bits description  
Bit  
Symbol  
Description  
[1]  
7
IER[7]  
IER[6]  
IER[5]  
IER[4]  
IER[3]  
CTS interrupt enable.  
logic 0 = disable the CTS interrupt (normal default condition)  
logic 1 = enable the CTS interrupt  
RTS interrupt enable.  
[1]  
[1]  
[1]  
6
5
4
3
logic 0 = disable the RTS interrupt (normal default condition)  
logic 1 = enable the RTS interrupt  
Xoff interrupt.  
logic 0 = disable the Xoff interrupt (normal default condition)  
logic 1 = enable the Xoff interrupt  
Sleep mode.  
logic 0 = disable Sleep mode (normal default condition)  
logic 1 = enable Sleep mode. See Section 6.7 “Sleep mode” for details.  
Modem Status Interrupt.  
logic 0 = disable the modem status register interrupt (normal default  
condition)  
logic 1 = enable the modem status register interrupt  
Receive Line Status interrupt.  
2
1
0
IER[2]  
IER[1]  
IER[0]  
logic 0 = disable the receiver line status interrupt (normal default condition)  
logic 1 = enable the receiver line status interrupt  
Transmit Holding Register interrupt.  
logic 0 = disable the THR interrupt (normal default condition)  
logic 1 = enable the THR interrupt  
Receive Holding Register interrupt.  
logic 0 = disable the RHR interrupt (normal default condition)  
logic 1 = enable the RHR interrupt  
[1] IER[7:4] can only be modified if EFR[4] is set, that is, EFR[4] is a write enable. Re-enabling IER[1] will  
cause a new interrupt if the THR is below the threshold.  
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7.9 Interrupt Identification Register (IIR)  
The IIR is a read-only 8-bit register which provides the source of the interrupt in a  
prioritized manner. Table 17 shows Interrupt Identification Register bit settings.  
Table 17: Interrupt Identification Register bits description  
Bit  
7-6  
5
Symbol  
IIR[7:6]  
IIR[5]  
Description  
Mirror the contents of FCR[0].  
RTS/CTS LOW-to-HIGH change of state.  
1 = Xoff/Special character has been detected.  
3-bit encoded interrupt. See Table 18.  
Interrupt status.  
4
IIR[4]  
3-1  
0
IIR[3:1]  
IIR[0]  
logic 0 = an interrupt is pending  
logic 1 = no interrupt is pending  
The interrupt priority list is shown in Table 18.  
Table 18: Interrupt priority list  
Priority IIR[5]  
level  
IIR[4]  
IIR[3]  
IIR[2]  
IIR[1]  
IIR[0]  
Source of the interrupt  
1
2
2
3
4
5
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
0
0
0
1
1
1
0
0
0
1
0
0
1
0
0
0
0
0
0
0
0
Receiver Line Status error  
Receiver time-out interrupt  
RHR interrupt  
THR interrupt  
Modem interrupt  
Received Xoff signal/  
special character  
6
1
0
0
0
0
0
CTS, RTS change of state from  
active (LOW) to inactive (HIGH)  
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7.10 Enhanced Feature Register (EFR)  
This 8-bit register enables or disables the enhanced features of the UART. Table 19 shows  
the Enhanced Feature Register bit settings.  
Table 19: Enhanced Feature Register bits description  
Bit  
Symbol  
Description  
7
EFR[7]  
CTS flow control enable.  
logic 0 = CTS flow control is disabled (normal default condition)  
logic 1 = CTS flow control is enabled. Transmission will stop when a HIGH  
signal is detected on the CTS pin.  
6
EFR[6]  
EFR[5]  
EFR[4]  
RTS flow control enable.  
logic 0 = RTS flow control is disabled (normal default condition)  
logic 1 = RTS flow control is enabled. The RTS pin goes HIGH when the  
receiver FIFO HALT trigger level TCR[3:0] is reached, and goes LOW when  
the receiver FIFO RESUME transmission trigger level TCR[7:4] is reached.  
5
Special character detect.  
logic 0 = special character detect disabled (normal default condition)  
logic 1 = special character detect enabled. Received data is compared with  
Xoff2 data. If a match occurs, the received data is transferred to FIFO and  
IIR[4] is set to a logical 1 to indicate a special character has been detected.  
4
Enhanced functions enable bit.  
logic 0 = disables enhanced functions and writing to IER[7:4], FCR[5:4],  
MCR[7:5].  
logic 1 = enables the enhanced function IER[7:4], FCR[5:4], and MCR[7:5]  
can be modified, that is, this bit is therefore a write enable.  
3:0  
EFR[3:0] Combinations of software flow control can be selected by programming these  
bits. See Table 3 “Software flow control options (EFR[3:0])”.  
7.11 Divisor latches (DLL, DLH)  
These are two 8-bit registers which store the 16-bit divisor for generation of the baud clock  
in the baud rate generator. DLH stores the most significant part of the divisor. DLL stores  
the least significant part of the divisor.  
Note that DLL and DLH can only be written to before Sleep mode is enabled, that is,  
before IER[4] is set.  
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7.12 Transmission Control Register (TCR)  
This 8-bit register is used to store the RX FIFO threshold levels to stop/start transmission  
during hardware/software flow control. Table 20 shows Transmission Control Register bit  
settings.  
Table 20: Transmission Control Register bits description  
Bit  
7:4  
3:0  
Symbol  
Description  
TCR[7:4] RX FIFO trigger level to resume transmission (0-60).  
TCR[3:0] RX FIFO trigger level to halt transmission (0-60).  
TCR trigger levels are available from 0 to 60 bytes with a granularity of four.  
Remark: TCR can only be written to when EFR[4] = 1 and MCR[6] = 1. The programmer  
must program the TCR such that TCR[3:0] > TCR[7:4]. There is no built-in hardware  
check to make sure this condition is met. Also, the TCR must be programmed with this  
condition before Auto-RTS or software flow control is enabled to avoid spurious operation  
of the device.  
7.13 Trigger Level Register (TLR)  
This 8-bit register is used to store the transmit and received FIFO trigger levels used for  
DMA and interrupt generation. Trigger levels from 4 to 60 can be programmed with a  
granularity of 4. Table 21 shows Trigger Level Register bit settings.  
Table 21: Trigger Level Register bits description  
Bit  
7:4  
3:0  
Symbol  
TLR[7:4]  
TLR[3:0]  
Description  
RX FIFO trigger levels (4 to 60), number of characters available.  
TX FIFO trigger levels (4 to 60), number of spaces available.  
Remark: TLR can only be written to when EFR[4] = 1 and MCR[6] = 1. If TLR[3:0] or  
TLR[7:4] are logical 0, the selectable trigger levels via the FIFO Control Register (FCR)  
are used for the transmit and receive FIFO trigger levels. Trigger levels from 4 to 60 bytes  
are available with a granularity of four. The TLR should be programmed for N4, where N is  
the desired trigger level.  
7.14 FIFO ready register  
The FIFO ready register provides real-time status of the transmit and receive FIFOs of  
both channels.  
Table 22: FIFO ready register bits description  
Bit  
Symbol  
Description  
7:4  
FIFO Rdy[7:4] 0 = there are less than a RX trigger level number of characters in the  
RX FIFO  
1 = the RX FIFO has more than a RX trigger level number of characters  
available for reading or a time-out condition has occurred  
3:0  
FIFO Rdy[3:0] 0 = there are less than a TX trigger level number of spaces available in  
the TX FIFO  
1 = there are at least a TX trigger level number of spaces available in the  
TX FIFO  
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Product data sheet  
Rev. 02 — 13 June 2005  
32 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
The FIFO Rdy register is a read-only register that can be accessed when any of the two  
UARTs is selected CSA - CSD = 0, MCR[2] (FIFO Rdy Enable) is a logic 1, and loop-back  
is disabled. The address is 111.  
8. Programmer’s guide  
The base set of registers that is used during high-speed data transfer have a  
straightforward access method. The extended function registers require special access  
bits to be decoded along with the address lines. The following guide will help with  
programming these registers. Note that the descriptions below are for individual register  
access. Some streamlining through interleaving can be obtained when programming all  
the registers.  
Table 23: Register programming guide  
Command  
Actions  
read LCR (03), save in temp  
set baud rate to VALUE1, VALUE2  
set LCR (03) to 80  
set DLL (00) to VALUE1  
set DLM (01) to VALUE2  
set LCR (03) to temp  
set Xoff1, Xon1 to VALUE1, VALUE2  
set Xoff2, Xon2 to VALUE1, VALUE2  
read LCR (03), save in temp  
set LCR (03) to BF  
set Xoff1 (06) to VALUE1  
set Xon1 (04) to VALUE2  
set LCR (03) to temp  
read LCR (03), save in temp  
set LCR (03) to BF  
set Xoff-2 (07) to VALUE1  
set Xon-2 (05) to VALUE2  
set LCR (03) to temp  
set software flow control mode to VALUE  
set flow control threshold to VALUE  
read LCR (03), save in temp  
set LCR (03) to BF  
set EFR (02) to VALUE  
set LCR (03) to temp  
read LCR (03), save in temp1  
set LCR (03) to BF  
read EFR (02), save in temp2  
set EFR (02) to 10 + temp2  
set LCR (03) to 00  
read MCR (04), save in temp3  
set MCR (04) to 40 + temp3  
set TCR (06) to VALUE  
set MCR (04) to temp3  
set LCR (03) to BF  
set EFR (02) to temp2  
set LCR (03) to temp1  
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Product data sheet  
Rev. 02 — 13 June 2005  
33 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
Table 23: Register programming guide …continued  
Command  
Actions  
read LCR (03), save in temp1  
set TX FIFO and RX FIFO thresholds  
to VALUE  
set LCR (03) to BF  
read EFR (02), save in temp2  
set EFR (02) to 10 + temp2  
set LCR (03) to 00  
read MCR (04), save in temp3  
set MCR (04) to 40 + temp3  
set TLR (07) to VALUE  
set MCR (04) to temp3  
set LCR (03) to BF  
set EFR (02) to temp2  
set LCR (03) to temp1  
read MCR (04), save in temp1  
read FIFO Rdy register  
[1]  
set temp2 = temp1 × EF  
set MCR (04) = 40 + temp2  
read FFR (07), save in temp2  
pass temp2 back to host  
set MCR (04) to temp1  
set prescaler value to divide-by-1  
read LCR (03), save in temp1  
set LCR (03) to BF  
read EFR (02), save in temp2  
set EFR (02) to 10 + temp2  
set LCR (03) to 00  
read MCR (04), save in temp3  
[1]  
set MCR (04) to temp3 × 7F  
set LCR (03) to BF  
set EFR (02) to temp2  
set LCR (03) to temp1  
read LCR (03), save in temp1  
ret LCR (03) to BF  
set prescaler value to divide-by-4  
read EFR (02), save in temp2  
set EFR (02) to 10 + temp2  
set LCR (03) to 00  
read MCR (04), save in temp3  
set MCR (04) to temp3 + 80  
set LCR (03) to BF  
set EFR (02) to temp2  
set LCR (03) to temp1  
[1] × sign here means bit-AND.  
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Product data sheet  
Rev. 02 — 13 June 2005  
34 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
9. Limiting values  
Table 24: Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VCC  
VI  
Parameter  
Conditions  
Min  
-
Max  
Unit  
V
supply voltage  
input voltage  
7
0.3  
0.3  
40  
65  
VCC + 0.3  
VCC + 0.3  
+85  
V
VO  
output voltage  
V
Tamb  
Tstg  
ambient temperature  
storage temperature  
operating in free-air  
°C  
°C  
+150  
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Product data sheet  
Rev. 02 — 13 June 2005  
35 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
10. Static characteristics  
Table 25: Static characteristics  
Tolerance of VCC ± 10 %, unless otherwise specified.  
Symbol Parameter  
Conditions  
VCC = 2.5 V  
Typ  
VCC = 3.3 V and 5 V  
Min Typ Max  
Unit  
Min  
Max  
VCC  
VI  
supply voltage  
input voltage  
VCC 10 % VCC VCC + 10 % VCC 10 % VCC VCC + 10 % V  
0
-
-
VCC  
VCC  
0
-
-
VCC  
VCC  
V
V
[1]  
[1]  
VIH  
HIGH-level input  
voltage  
1.6  
2.0  
VIL  
LOW-level input  
voltage  
-
-
0.65  
-
-
0.8  
V
[2]  
[3]  
[4]  
[3]  
[4]  
[3]  
[4]  
[3]  
[4]  
VO  
output voltage  
0
-
VCC  
0
-
VCC  
V
VOH  
HIGH-level  
output voltage  
IOH = 8 mA  
IOH = 4 mA  
IOH = 800 µA  
IOH = 400 µA  
-
-
-
-
2.0  
-
-
-
V
-
-
2.0  
-
V
1.85  
-
-
-
-
-
V
1.85  
-
-
-
-
-
V
VOL  
LOW-level output IOL = 8 mA  
voltage[5]  
-
-
-
-
-
0.4  
0.4  
-
V
IOL = 4 mA  
-
-
-
-
-
V
IOL = 2 mA  
IOL = 1.6 mA  
-
-
0.4  
0.4  
18  
+85  
-
-
V
-
-
-
-
-
-
-
-
-
V
Ci  
input capacitance  
18  
+85  
pF  
°C  
Tamb  
ambient  
temperature  
operating in  
free air  
40  
+25  
40  
+25  
[6]  
[7]  
Tj  
junction  
temperature  
0
-
25  
-
125  
50  
0
-
25  
-
125  
80  
°C  
f(i)XTAL1 crystal input  
frequency  
MHz  
δ
clock duty cycle  
supply current  
-
-
-
50  
-
-
4.5  
-
-
-
-
50  
-
-
6
-
%
[8]  
[9]  
ICC  
f = 5 MHz  
mA  
µA  
ICCsleep sleep current  
200  
200  
[1] Meets TTL levels, VIO(min) = 2 V and VIH(max) = 0.8 V on non-hysteresis inputs.  
[2] Applies for external output buffers.  
[3] These parameters apply for D7 to D0.  
[4] These parameters apply for DTRA, DTRB, INIA, INTB, RTSA, RTSB, RXRDYA, RXRDYB, TXRDYA, TXRDYB, TXA, TXB.  
[5] Except XTAL2, VOL = 1 V typical.  
[6] These junction temperatures reflect simulated conditions. Absolute maximum junction temperature is 150 °C. The customer is  
responsible for verifying junction temperature.  
[7] Applies to external clock; crystal oscillator max. 24 MHz.  
[8] Measurement condition, normal operation other than Sleep mode:  
VCC = 3.3 V; Tamb = 25 °C. Full duplex serial activity on all two serial (UART) channels at the clock frequency specified in the  
recommended operating conditions with divisor of 1.  
[9] When using crystal oscillator. The use of an external clock will increase the sleep current.  
9397 750 14668  
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Product data sheet  
Rev. 02 — 13 June 2005  
36 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
11. Dynamic characteristics  
Table 26: Dynamic characteristics  
Tamb = 40 °C to +85 °C; tolerance of VCC ± 10 %, unless otherwise specified.  
Symbol Parameter  
Conditions  
VCC = 2.5 V  
Min Max  
VCC = 3.3 V  
Min Max  
VCC = 5.0 V  
Min Max  
Unit  
t1w, t2w clock pulse duration  
10  
-
-
6
-
6
-
ns  
MHz  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
[1] [2]  
fXTAL  
t6s  
oscillator/clock frequency  
address setup time  
48  
-
80  
-
80  
-
0
-
0
0
t6h  
address hold time  
0
-
0
-
0
-
t7d  
IOR delay from chip select  
IOR strobe width  
10  
90  
0
-
10  
26  
0
-
10  
23  
0
-
t7w  
25 pF load  
-
-
-
t7h  
chip select hold time from IOR  
read cycle delay  
-
-
-
t9d  
25 pF load  
25 pF load  
25 pF load  
20  
-
-
20  
-
-
20  
-
-
t12d  
t12h  
t13d  
t13w  
t13h  
t15d  
t16s  
t16h  
t17d  
t18d  
delay from IOR to data  
data disable time  
90  
26  
15  
-
23  
15  
-
-
15  
-
-
IOW delay from chip select  
IOW strobe width  
10  
20  
0
-
10  
20  
0
10  
15  
0
-
-
-
chip select hold time from IOW  
write cycle delay  
-
-
-
25  
20  
15  
-
-
25  
15  
5
-
20  
15  
5
-
data setup time  
-
-
-
data hold time  
-
-
-
delay from IOW to output  
25 pF load  
25 pF load  
100  
100  
-
33  
24  
-
29  
23  
delay to set interrupt from  
Modem input  
-
-
-
t19d  
t20d  
t21d  
delay to reset interrupt from  
IOR  
25 pF load  
-
-
-
-
100  
-
-
-
-
24  
-
-
-
-
23  
ns  
delay from stop to set interrupt  
1TRCLK  
[3]  
1TRCLK  
[3]  
1TRCLK ns  
[3]  
delay from IOR to reset  
interrupt  
25 pF load  
100  
100  
29  
45  
28  
40  
ns  
ns  
t22d  
t23d  
delay from start to set interrupt  
delay from IOW to transmit  
start  
8TRCLK 24TRCLK 8TRCLK 24TRCLK 8TRCLK 24TRCLK ns  
[3]  
[3]  
[3]  
[3]  
[3]  
[3]  
t24d  
t25d  
delay from IOW to reset  
interrupt  
-
100  
-
45  
-
40  
ns  
delay from stop to set RXRDY  
-
1TRCLK  
[3]  
-
1TRCLK  
[3]  
-
1TRCLK ns  
[3]  
t26d  
t27d  
t28d  
delay from IOR to reset RXRDY  
delay from IOW to set TXRDY  
-
-
-
100  
100  
-
-
-
45  
45  
-
-
-
40  
40  
ns  
ns  
delay from start to reset  
TXRDY  
8TRCLK  
[3]  
8TRCLK  
[3]  
8TRCLK ns  
[3]  
tRESET  
N
RESET pulse width  
baud rate divisor  
200  
1
-
200  
-
200  
-
ns  
(216 1) 1  
(216 1) 1  
(216 1)  
[1] Applies to external clock, crystal oscillator max 24 MHz.  
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Product data sheet  
Rev. 02 — 13 June 2005  
37 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
1
t3w  
[2] Maximum frequency =  
-------  
[3] RCLK is an internal signal derived from divisor latch LSB (DLL) and divisor latch MSB (DLM) divisor latches.  
11.1 Timing diagrams  
t
6h  
valid  
address  
A0 to A2  
t
t
13h  
6s  
active  
CSx  
t
t
13d  
15d  
t
13w  
IOW  
active  
t
16h  
t
16s  
D0 to D7  
data  
002aaa109  
Fig 15. General write timing  
t
t
6h  
7h  
valid  
address  
A0 to A2  
t
6s  
active  
CSx  
IOR  
t
t
7d  
9d  
t
7w  
active  
t
t
12h  
12d  
D0 to D7  
data  
002aaa110  
Fig 16. General read timing  
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Product data sheet  
Rev. 02 — 13 June 2005  
38 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
active  
IOW  
t
17d  
RTS  
DTR  
change of state  
change of state  
CD  
CTS  
DSR  
change of state  
change of state  
t
t
18d  
18d  
INT  
active  
active  
active  
active  
active  
t
19d  
active  
IOR  
t
18d  
change of state  
RI  
002aaa352  
Fig 17. Modem input/output timing  
t
t
1w  
2w  
EXTERNAL  
CLOCK  
002aaa112  
t
3w  
1
f XTAL  
=
-------  
t3w  
Fig 18. External clock timing  
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Product data sheet  
Rev. 02 — 13 June 2005  
39 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
next  
data  
start  
bit  
parity stop start  
bit  
bit  
bit  
data bits (0 to 7)  
D3 D4  
RX  
D0  
D1  
D2  
D5  
D6  
D7  
5 data bits  
6 data bits  
7 data bits  
t
20d  
active  
INT  
t
21d  
active  
IOR  
16 baud rate clock  
002aaa113  
Fig 19. Receive timing  
next  
data  
start  
bit  
parity stop start  
bit bit  
bit  
data bits (0 to 7)  
D3 D4  
D0  
D1  
D2  
D5  
D6  
D7  
RX  
t
25d  
active data  
ready  
RXRDY  
IOR  
t
26d  
active  
002aab063  
Fig 20. Receive ready timing in non-FIFO mode  
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Product data sheet  
Rev. 02 — 13 June 2005  
40 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
start  
bit  
parity stop  
bit  
bit  
data bits (0 to 7)  
D3 D4  
D0  
D1  
D2  
D5  
D6  
D7  
RX  
first byte that  
reaches the  
trigger level  
t
25d  
active data  
ready  
RXRDY  
IOR  
t
26d  
active  
002aab064  
Fig 21. Receive ready timing in FIFO mode  
next  
data  
start  
bit  
parity stop start  
bit bit  
bit  
data bits (0 to 7)  
TX  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
5 data bits  
6 data bits  
7 data bits  
active  
INT  
transmitter ready  
t
22d  
t
24d  
t
23d  
active  
active  
IOW  
16 baud rate clock  
002aaa116  
Fig 22. Transmit timing  
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© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 02 — 13 June 2005  
41 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
next  
data  
start  
bit  
parity stop start  
bit  
bit  
bit  
data bits (0 to 7)  
D3 D4  
D0  
D1  
D2  
D5  
D6  
D7  
TX  
IOW  
active  
t
28d  
D0 to D7  
byte #1  
t
27d  
active transmitter  
ready  
TXRDY  
transmitter  
not ready  
002aab062  
Fig 23. Transmit ready timing in non-FIFO mode  
start  
bit  
parity stop  
bit bit  
data bits (0 to 7)  
D3 D4  
D0  
D1  
D2  
D5  
D6  
D7  
TX  
5 data bits  
6 data bits  
7 data bits  
IOW  
active  
t
28d  
D0 to D7  
byte #32  
t
27d  
TXRDY  
FIFO full  
002aab065  
Fig 24. Transmit ready timing in FIFO mode (DMA mode ‘1’)  
9397 750 14668  
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Product data sheet  
Rev. 02 — 13 June 2005  
42 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
12. Package outline  
LQFP64: plastic low profile quad flat package; 64 leads; body 7 x 7 x 1.4 mm  
SOT414-1  
y
X
A
48  
33  
49  
32  
Z
E
e
A
2
A
H
E
E
(A )  
3
A
1
w M  
p
θ
b
pin 1 index  
L
p
L
64  
17  
detail X  
1
16  
Z
v
M
A
D
e
w M  
b
p
D
B
H
v
M
B
D
0
2.5  
scale  
5 mm  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
θ
1
2
3
p
E
p
D
E
max.  
7o  
0o  
0.15 1.45  
0.05 1.35  
0.23 0.20 7.1  
0.13 0.09 6.9  
7.1  
6.9  
9.15 9.15  
8.85 8.85  
0.75  
0.45  
0.64 0.64  
0.36 0.36  
1.6  
mm  
0.25  
0.4  
1
0.2 0.08 0.08  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
00-01-19  
03-02-20  
SOT414-1  
136E06  
MS-026  
Fig 25. Package outline SOT414-1 (LQFP64)  
9397 750 14668  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 02 — 13 June 2005  
43 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm  
SOT315-1  
y
X
A
60  
41  
Z
61  
40  
E
e
H
A
E
2
E
A
(A )  
3
A
1
w M  
p
θ
b
L
p
L
pin 1 index  
80  
21  
detail X  
1
20  
Z
D
v
M
A
e
w M  
b
p
D
B
H
v
M
B
D
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
H
L
L
v
w
y
Z
Z
θ
1
2
3
p
D
E
p
D
E
max.  
7o  
0o  
0.16 1.5  
0.04 1.3  
0.27 0.18 12.1 12.1  
0.13 0.12 11.9 11.9  
14.15 14.15  
13.85 13.85  
0.75  
0.30  
1.45 1.45  
1.05 1.05  
mm  
1.6  
0.25  
0.5  
1
0.2 0.15 0.1  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
00-01-19  
03-02-25  
SOT315-1  
136E15  
MS-026  
Fig 26. Package outline SOT315-1 (LQFP80)  
9397 750 14668  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 02 — 13 June 2005  
44 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
PLCC68: plastic leaded chip carrier; 68 leads  
SOT188-2  
e
e
E
D
y
X
A
60  
44  
Z
E
43  
61  
b
p
b
1
w
M
68  
1
H
E
E
pin 1 index  
A
e
A
1
A
4
(A )  
3
L
p
9
k
27  
β
detail X  
10  
26  
v
M
A
e
Z
D
D
B
H
v
M
B
D
0
5
10 mm  
scale  
DIMENSIONS (mm dimensions are derived from the original inch dimensions)  
(1)  
(1)  
A
A
Z
Z
E
4
1
(1)  
(1)  
D
UNIT  
mm  
A
A
b
D
E
e
e
e
H
H
k
L
p
v
w
y
β
b
3
1
D
E
D
E
p
max.  
min.  
max. max.  
4.57  
4.19  
0.81 24.33 24.33  
0.66 24.13 24.13  
23.62 23.62 25.27 25.27 1.22 1.44  
22.61 22.61 25.02 25.02 1.07 1.02  
0.53  
0.33  
0.51 0.25  
3.3  
1.27  
0.05  
0.18 0.18  
0.1  
2.16 2.16  
o
45  
0.180  
0.165  
0.032 0.958 0.958  
0.026 0.950 0.950  
0.93 0.93 0.995 0.995 0.048 0.057  
0.89 0.89 0.985 0.985 0.042 0.040  
0.021  
0.013  
inches  
0.02 0.01 0.13  
0.007 0.007 0.004 0.085 0.085  
Note  
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
01-11-14  
SOT188-2  
112E10  
MS-018  
EDR-7319  
Fig 27. Package outline SOT188-2 (PLCC68)  
9397 750 14668  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 02 — 13 June 2005  
45 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
13. Soldering  
13.1 Introduction to soldering surface mount packages  
This text gives a very brief insight to a complex technology. A more in-depth account of  
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages  
(document order number 9398 652 90011).  
There is no soldering method that is ideal for all surface mount IC packages. Wave  
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch  
SMDs. In these situations reflow soldering is recommended.  
13.2 Reflow soldering  
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and  
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement. Driven by legislation and  
environmental forces the worldwide use of lead-free solder pastes is increasing.  
Several methods exist for reflowing; for example, convection or convection/infrared  
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)  
vary between 100 seconds and 200 seconds depending on heating method.  
Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste  
material. The top-surface temperature of the packages should preferably be kept:  
below 225 °C (SnPb process) or below 245 °C (Pb-free process)  
for all BGA, HTSSON..T and SSOP..T packages  
for packages with a thickness 2.5 mm  
for packages with a thickness < 2.5 mm and a volume 350 mm3 so called  
thick/large packages.  
below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a  
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.  
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.  
13.3 Wave soldering  
Conventional single wave soldering is not recommended for surface mount devices  
(SMDs) or printed-circuit boards with a high component density, as solder bridging and  
non-wetting can present major problems.  
To overcome these problems the double-wave soldering method was specifically  
developed.  
If wave soldering is used the following conditions must be observed for optimal results:  
Use a double-wave soldering method comprising a turbulent wave with high upward  
pressure followed by a smooth laminar wave.  
For packages with leads on two sides and a pitch (e):  
larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be  
parallel to the transport direction of the printed-circuit board;  
9397 750 14668  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 02 — 13 June 2005  
46 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the  
transport direction of the printed-circuit board.  
The footprint must incorporate solder thieves at the downstream end.  
For packages with leads on four sides, the footprint must be placed at a 45° angle to  
the transport direction of the printed-circuit board. The footprint must incorporate  
solder thieves downstream and at the side corners.  
During placement and before soldering, the package must be fixed with a droplet of  
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the adhesive is cured.  
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C  
or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.  
A mildly-activated flux will eliminate the need for removal of corrosive residues in most  
applications.  
13.4 Manual soldering  
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage  
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be  
limited to 10 seconds at up to 300 °C.  
When using a dedicated tool, all other leads can be soldered in one operation within  
2 seconds to 5 seconds between 270 °C and 320 °C.  
13.5 Package related soldering information  
Table 27: Suitability of surface mount IC packages for wave and reflow soldering methods  
Package [1]  
Soldering method  
Wave  
Reflow[2]  
BGA, HTSSON..T[3], LBGA, LFBGA, SQFP,  
SSOP..T[3], TFBGA, VFBGA, XSON  
not suitable  
suitable  
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,  
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,  
HVSON, SMS  
not suitable[4]  
suitable  
PLCC[5], SO, SOJ  
suitable  
suitable  
LQFP, QFP, TQFP  
not recommended[5] [6]  
not recommended[7]  
not suitable  
suitable  
SSOP, TSSOP, VSO, VSSOP  
CWQCCN..L[8], PMFP[9], WQCCN..L[8]  
suitable  
not suitable  
[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);  
order a copy from your Philips Semiconductors sales office.  
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the  
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or  
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn  
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit  
Packages; Section: Packing Methods.  
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no  
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with  
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package  
body peak temperature must be kept as low as possible.  
9397 750 14668  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 02 — 13 June 2005  
47 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the  
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink  
on the top side, the solder might be deposited on the heatsink surface.  
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave  
direction. The package footprint must incorporate solder thieves downstream and at the side corners.  
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is  
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.  
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger  
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.  
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered  
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by  
using a hot bar soldering process. The appropriate soldering profile can be provided on request.  
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.  
14. Revision history  
Table 28: Revision history  
Document ID  
SC16C754B_2  
Modifications:  
Release date Data sheet status  
20050613 Product data sheet  
Change notice Doc. number  
Supersedes  
-
9397 750 14668 SC16C754B_1  
Section 1 “General description”, 3rd paragraph: added ‘LQFP64’  
Section 2 “Features”, 4th bullet: changed ‘baud rate’ to ‘data rate’ (2 places)  
Table 1 “Ordering information”: added LQFP64 package offering  
Figure 2 “Pin configuration for LQFP64” added  
Table 2 “Pin description”:  
added column for LQFP64 pinning  
descriptions for CLKSEL, INTSEL, RXRDY, TXRDY modified to indicate the package-type to  
which they apply  
Table 10 “SC16C754B internal registers”: shading removed, replaced with reference to Table  
note 2  
Table 24 “Limiting values”: table note removed (statement shown in Section 17 “Disclaimers”)  
Table 25 “Static characteristics”:  
description following title changed from ‘VCC = 2.5 V, 3.3 V ± 10 % or 5 V ± 10 %’ to  
Tolerance of VCC ± 10 %; unless otherwise specified.’  
Added ‘VCC =’ to value limits column headings  
Table note 5: changed ‘x2’ to ‘XTAL2’  
Table 26 “Dynamic characteristics”:  
symbol ‘t3w’ changed to ‘fXTAL’; added reference to (new) Table note 2  
under values for t20d, t23d, t25d, t28d: changed ‘RCLK cycles’ to ‘TRCLK’; added reference to  
Table note 3; added unit ‘ns’  
symbol N: removed ‘RCLK cycle(s)’ from values (N is a number)  
added (new) Table note 2  
Figure 25 “Package outline SOT414-1 (LQFP64)” added  
Section 18 “Trademarks” added  
SC16C754B_1  
20050127  
Product data sheet  
-
9397 750 13114  
-
9397 750 14668  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 02 — 13 June 2005  
48 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
15. Data sheet status  
Level Data sheet status[1] Product status[2] [3]  
Definition  
I
Objective data  
Development  
This data sheet contains data from the objective specification for product development. Philips  
Semiconductors reserves the right to change the specification in any manner without notice.  
II  
Preliminary data  
Qualification  
This data sheet contains data from the preliminary specification. Supplementary data will be published  
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in  
order to improve the design and supply the best possible product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips Semiconductors reserves the  
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant  
changes will be communicated via a Customer Product/Process Change Notification (CPCN).  
[1]  
[2]  
Please consult the most recently issued data sheet before initiating or completing a design.  
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at  
URL http://www.semiconductors.philips.com.  
[3]  
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
customers using or selling these products for use in such applications do so  
at their own risk and agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
16. Definitions  
Short-form specification The data in a short-form specification is  
extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
Right to make changes — Philips Semiconductors reserves the right to  
make changes in the products - including circuits, standard cells, and/or  
software - described or contained herein in order to improve design and/or  
performance. When the product is in full production (status ‘Production’),  
relevant changes will be communicated via a Customer Product/Process  
Change Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no  
license or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products are  
free from patent, copyright, or mask work right infringement, unless otherwise  
specified.  
Limiting values definition Limiting values given are in accordance with  
the Absolute Maximum Rating System (IEC 60134). Stress above one or  
more of the limiting values may cause permanent damage to the device.  
These are stress ratings only and operation of the device at these or at any  
other conditions above those given in the Characteristics sections of the  
specification is not implied. Exposure to limiting values for extended periods  
may affect device reliability.  
Application information Applications that are described herein for any  
of these products are for illustrative purposes only. Philips Semiconductors  
make no representation or warranty that such applications will be suitable for  
the specified use without further testing or modification.  
18. Trademarks  
Notice — All referenced brands, product names, service names and  
17. Disclaimers  
trademarks are the property of their respective owners.  
Life support — These products are not designed for use in life support  
appliances, devices, or systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips Semiconductors  
19. Contact information  
For additional information, please visit: http://www.semiconductors.philips.com  
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com  
9397 750 14668  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 02 — 13 June 2005  
49 of 50  
SC16C754B  
Philips Semiconductors  
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs  
20. Contents  
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
8
Programmer’s guide . . . . . . . . . . . . . . . . . . . . 33  
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 35  
Static characteristics . . . . . . . . . . . . . . . . . . . 36  
Dynamic characteristics. . . . . . . . . . . . . . . . . 37  
Timing diagrams. . . . . . . . . . . . . . . . . . . . . . . 38  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 43  
9
10  
11  
11.1  
12  
13  
13.1  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46  
Introduction to soldering surface mount  
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46  
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 46  
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 46  
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 47  
Package related soldering information. . . . . . 47  
6
6.1  
6.2  
Functional description . . . . . . . . . . . . . . . . . . . 9  
Trigger levels. . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Hardware flow control. . . . . . . . . . . . . . . . . . . 10  
Auto-RTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Auto-CTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Software flow control . . . . . . . . . . . . . . . . . . . 12  
RX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
TX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Software flow control example . . . . . . . . . . . . 13  
Assumptions . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Interrupt mode operation . . . . . . . . . . . . . . . . 16  
Polled mode operation . . . . . . . . . . . . . . . . . . 16  
DMA operation . . . . . . . . . . . . . . . . . . . . . . . . 17  
Single DMA transfers (DMA mode 0/FIFO  
13.2  
13.3  
13.4  
13.5  
6.2.1  
6.2.2  
6.3  
6.3.1  
6.3.2  
6.3.3  
6.3.3.1  
6.4  
14  
15  
16  
17  
18  
19  
Revision history . . . . . . . . . . . . . . . . . . . . . . . 48  
Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 49  
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 49  
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 49  
Contact information . . . . . . . . . . . . . . . . . . . . 49  
6.5  
6.5.1  
6.5.2  
6.6  
6.6.1  
disable) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Block DMA transfers (DMA mode 1). . . . . . . . 18  
Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Sleep mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Break and time-out conditions . . . . . . . . . . . . 19  
Programmable baud rate generator . . . . . . . . 19  
6.6.1.1  
6.6.1.2  
6.6.2  
6.6.2.1  
6.6.2.2  
6.7  
6.8  
6.9  
7
Register descriptions . . . . . . . . . . . . . . . . . . . 21  
Receiver Holding Register (RHR). . . . . . . . . . 23  
Transmit Holding Register (THR) . . . . . . . . . . 23  
FIFO Control Register (FCR) . . . . . . . . . . . . . 24  
Line Control Register (LCR) . . . . . . . . . . . . . . 25  
Line Status Register (LSR). . . . . . . . . . . . . . . 26  
Modem Control Register (MCR) . . . . . . . . . . . 27  
Modem Status Register (MSR). . . . . . . . . . . . 28  
Interrupt Enable Register (IER) . . . . . . . . . . . 29  
Interrupt Identification Register (IIR). . . . . . . . 30  
Enhanced Feature Register (EFR) . . . . . . . . . 31  
Divisor latches (DLL, DLH) . . . . . . . . . . . . . . . 31  
Transmission Control Register (TCR). . . . . . . 32  
Trigger Level Register (TLR). . . . . . . . . . . . . . 32  
FIFO ready register. . . . . . . . . . . . . . . . . . . . . 32  
7.1  
7.2  
7.3  
7.4  
7.5  
7.6  
7.7  
7.8  
7.9  
7.10  
7.11  
7.12  
7.13  
7.14  
© Koninklijke Philips Electronics N.V. 2005  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior  
written consent of the copyright owner. The information presented in this document does  
not form part of any quotation or contract, is believed to be accurate and reliable and may  
be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under  
patent- or other industrial or intellectual property rights.  
Date of release: 13 June 2005  
Document number: 9397 750 14668  
Published in The Netherlands  

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