SA58643DP [NXP]
Single-Pole Double-Throw (SPDT) switch; 单刀双掷（ SPDT ）开关
| 型号： | SA58643DP |
| 厂家： | 
NXP |
| 描述： | Single-Pole Double-Throw (SPDT) switch |
| 文件： | 总16页 (文件大小：172K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SA58643
Single-Pole Double-Throw (SPDT) switch
Rev. 01 — 20 November 2006
Product data sheet
1. General description
The SA58643 is a wideband RF switch fabricated in BiCMOS technology and
incorporating on-chip CMOS/TTL compatible drivers. Its primary function is to switch
signals in the frequency range DC to 1 GHz from one 50 Ω channel to another. The switch
is activated by a CMOS/TTL compatible signal applied to the enable channel 1 pin
(ENCH1).
The extremely low current consumption makes the SA58643 ideal for portable
applications. The excellent isolation and low loss makes this a suitable replacement for
PIN diodes.
The SA58643 is available in an 8-pin TSSOP package.
2. Features
I Wideband (DC to 1 GHz)
I Low through loss (1 dB typical at 200 MHz)
I Unused input is terminated internally in 50 Ω
I Excellent overload capability (1 dB gain compression point +18 dBm at 300 MHz)
I Low DC power (170 µA from 5 V supply)
I Fast switching (20 ns typical)
I Good isolation (off channel isolation 60 dB at 100 MHz)
I Low distortion (IP3 intercept +33 dBm)
I Good 50 Ω match (return loss 18 dB at 400 MHz)
I Full ESD protection
I Bidirectional operation
3. Applications
I Digital transceiver front-end switch
I Antenna switch
I Filter selection
I Video switch
I FSK transmitter
SA58643
NXP Semiconductors
Single-Pole Double-Throw (SPDT) switch
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
SA58643DP
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm
SOT505-1
5. Block diagram
output/input
input/output
output/input
ENCH1
002aab690
Fig 1. Block diagram of SA58643
6. Pinning information
6.1 Pinning
1
2
3
4
8
7
6
5
V
OUT1
AC_GND
GND
DD
ENCH1
GND
SA58643DP
INPUT
OUT2
002aab689
Fig 2. Pin configuration for TSSOP8
6.2 Pin description
Table 2.
Pin description
Symbol
VDD
Pin
1
Description
supply voltage
ENCH1
GND
2
enable channel 1
ground
3, 6
4
INPUT
OUT2
AC_GND
OUT1
input
5
output
7
AC ground
output
8
SA58643_1
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 20 November 2006
2 of 16
SA58643
NXP Semiconductors
Single-Pole Double-Throw (SPDT) switch
7. Equivalent circuit
1
3
8
V
+5 V
DD
OUT1
20 kΩ
CONTROL
LOGIC
50 Ω
7
AC bypass
50 Ω
6
4
2
INPUT
20 kΩ
5
OUT2
ENCH1
(logic 0 level)
002aab711
Fig 3. Equivalent circuit
8. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDD
Parameter
Conditions
Min
−0.5
-
Max
+5.5
568
Unit
V
supply voltage
power dissipation
[1]
P
Tamb = 25 °C
mW
(still air)
Tj(max)
maximum junction temperature
-
-
150
20
°C
PINPUT_OUT1_OUT2 power on pin INPUT or on
pin OUT1 or on pin OUT2
dBm
Tstg
storage temperature
−65
+150
°C
[1] Maximum dissipation is determined by the operating ambient temperature and the thermal resistance,
Rth(j-a): TSSOP8: Rth(j-a) = 220 K/W.
9. Recommended operating conditions
Table 4.
Operating conditions
Symbol Parameter
Conditions
Min
3.0
Typ
Max
5.5
Unit
V
VDD
Tamb
Tj
supply voltage
-
-
-
ambient temperature
junction temperature
SA grade
SA grade
−40
−40
+85
+105
°C
°C
SA58643_1
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 20 November 2006
3 of 16
SA58643
NXP Semiconductors
Single-Pole Double-Throw (SPDT) switch
10. Static characteristics
Table 5.
Static characteristics
VDD = +5 V; Tamb = 25 °C; unless otherwise specified.
Symbol
IDD
Parameter
Conditions
Min
40
Typ
Max
300
1.4
Unit
µA
V
supply current
170
[1]
Vth
threshold voltage
TTL/CMOS logic
1.1
2.0
−3.0
−1
1.25
VIH
HIGH-level input voltage
LOW-level input voltage
LOW-level input current on pin ENCH1
logic 1 level; enable channel 1
logic 0 level; enable channel 2
ENCH1 = 0.4 V
-
VDD
+0.8
+1
V
VIL
-
V
IIL(ENCH1)
0
0
µA
µA
IIH(ENCH1) HIGH-level input current on pin ENCH1
ENCH1 = 2.4 V
−1
+1
[1] The ENCH1 input must be connected to a valid logic level for proper operation of the SA58643.
11. Dynamic characteristics
Table 6.
VDD = +5 V; Tamb = 25 °C; unless otherwise specified.
All measurements include the effects of the SA58643 evaluation board. Measurement system impedance is 50 Ω.
Dynamic characteristics
Symbol Parameter
Conditions
DC to 100 MHz
500 MHz
Min
Typ
1
Max
Unit
dB
2
|s21
|
insertion power gain
-
-
-
1.4
2
-
dB
900 MHz
-
2.8
-
dB
2
[1]
|s12
|
isolation
10 MHz
70
-
80
60
50
30
20
12
17
13
20
5
dB
100 MHz
-
dB
500 MHz
-
-
dB
900 MHz
24
-
-
dB
2
2
|s22
|
output return loss
input return loss
DC to 400 MHz
900 MHz
-
dB
-
-
dB
|s11
|
DC to 400 MHz
900 MHz
-
-
dB
-
-
dB
td(off)
tf(off)
tr(on)
turn-off delay time
turn-off fall time
turn-on rise time
50 % TTL to (90 % to 10 %) RF
90 % to 10 % RF
10 % to 90 % RF
switching transients
DC to 1 GHz
100 MHz
-
-
ns
-
-
ns
-
5
-
ns
Vtrt(p-p) peak-to-peak transient voltage
-
165
+18
+33
+52
-
mV
dBm
dBm
dBm
PL(1dB)
IP3
output power at 1 dB gain compression
third-order intercept point
second-order intercept point
noise figure
-
-
-
-
IP2
100 MHz
-
-
NF
Zo = 50 Ω
100 MHz
-
-
1.0
2.0
-
-
dB
dB
900 MHz
[1] The placement of the AC bypass capacitor is critical to achieve these specifications. See Section 13 “Application information” for more
details.
SA58643_1
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 20 November 2006
4 of 16
SA58643
NXP Semiconductors
Single-Pole Double-Throw (SPDT) switch
12. Performance curves
002aab697
002aab698
200
0
I
DD
S
(dB)
21
(µA)
160
120
80
40
0
−2
−4
−6
−8
V
= 5 V
4 V
3 V
DD
T
= +85 °C
+25 °C
−40 °C
amb
2
3
4
3.0
4.0
5.0
6.0
10
10
10
10
V
(V)
f (MHz)
DD
Tamb = +25 °C
Fig 4. Supply current versus VDD and temperature
Fig 5. Loss versus frequency and VDD
002aab774
002aab699
−0.8
0
S
(dB)
21
S
(dB)
21
−2
−1.2
−4
−6
−8
CH2
V
= 5 V
4 V
3 V
DD
−1.6
−2.0
CH1
3
2
3
2
4
10
10
10
10
10
10
10
f (MHz)
f (MHz)
Tamb = +25 °C
Tamb = +25 °C; VDD = 5 V
Fig 6. Loss versus frequency and VDD
Fig 7. Loss matching versus frequency;
CH1 versus CH2
002aab700
002aab701
0
0
S
S
21
21
(dB)
(dB)
−2
−20
−40
−60
−80
T
= +85 °C
+25 °C
−40 °C
amb
V
= 5 V
4 V
DD
−4
−6
−8
3 V
2
3
4
2
3
4
10
10
10
10
10
10
10
10
f (MHz)
f (MHz)
VDD = 5 V
Tamb = +25 °C
Fig 8. Loss versus frequency and temperature
Fig 9. Isolation versus frequency and VDD
SA58643_1
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 20 November 2006
5 of 16
SA58643
NXP Semiconductors
Single-Pole Double-Throw (SPDT) switch
002aab702
002aab703
0
0
S
S
11
21
(dB)
(dB)
−20
V
= 5 V
4 V
3 V
DD
−10
−20
−30
−40
−60
−80
CH2
CH1
2
3
4
2
3
4
10
10
10
10
10
10
10
10
f (MHz)
f (MHz)
Tamb = +25 °C; VDD = 5 V
Tamb = +25 °C
Fig 10. Isolation matching versus frequency;
CH1 versus CH2
Fig 11. Input match ON-channel versus frequency and
VDD
002aab704
002aab705
0
0
S
S
22
22
(dB)
(dB)
−10
−10
CH1: 3 V
CH1: 5 V
CH2: 5 V
−20
−30
−20
−30
2
3
4
2
3
4
10
10
10
10
10
10
10
10
f (MHz)
f (MHz)
Tamb = +25 °C; VDD = 5 V
Tamb = +25 °C
Fig 12. Output match ON-channel versus frequency
Fig 13. OFF-channel match versus frequency and VDD
002aab706
002aab707
0
20
L(1dB)
5 V
4 V
P
S
22
(dBm)
(dB)
16
12
8
T
= +85 °C
+25 °C
−40 °C
amb
3 V
−10
−20
−30
4
0
2
3
4
2
3
4
10
10
10
10
10
10
10
10
f (MHz)
f (MHz)
VDD = 5 V
Tamb = +25 °C
Fig 14. OFF-channel match versus frequency and
temperature
Fig 15. PL(1dB) versus frequency and VDD
SA58643_1
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 20 November 2006
6 of 16
SA58643
NXP Semiconductors
Single-Pole Double-Throw (SPDT) switch
002aab708
002aab709
60
5
4
3
2
1
0
intercept point
NF
(dB)
(dBm)
50
IP2
40
V
= 5 V
4 V
3 V
DD
IP3
30
20
10
0
2
3
4
3.0
4.0
5.0
6.0
10
10
10
10
V
(V)
f (MHz)
DD
Tamb = +25 °C
Tamb = +25 °C; Zo = 50 Ω
Fig 16. Intercept points versus VDD
Fig 17. Noise Figure versus frequency and VDD
1 V
ENCH1 (pin 2)
OUT1 (pin 8)
50 mV
10 nS
002aab710
fi = 100 MHz at −6 dBm; VDD = 5 V
Fig 18. Switching speed
SA58643_1
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 20 November 2006
7 of 16
SA58643
NXP Semiconductors
Single-Pole Double-Throw (SPDT) switch
13. Application information
13.1 Evaluation demo board
The typical applications schematic and printed-circuit board layout of the SA58643
evaluation board is shown in Figure 19. The layout of the board is simple, but a few
cautions need to be observed. The input and output traces should be 50 Ω. The
placement of the AC bypass capacitor is extremely critical if a symmetric isolation
between the two channels is desired. The trace from pin 7 (AC_GND) should be drawn
back towards the package and then be routed downwards. The capacitor should be
placed straight down as close to the device as practical. For better isolation between the
two channels at higher frequencies, it is also advisable to run the two output/input traces
at an angle. This also minimizes any inductive coupling between the two traces. The
power supply bypass capacitor should be placed close to the device. Figure 5 shows the
frequency response of the SA58643. The loss matching between the two channels is
excellent to 1.2 GHz as shown in Figure 7.
V
DD
+5 V
DP package
0.1 µF
0.01 µF
OUT1
OUT2
1
2
3
4
8
7
6
5
ENCH1
GND
AC_GND
SA58643
0.01 µF
GND
INPUT
0.01 µF
0.01 µF
002aab691
a. Evaluation board schematic
top view
bottom view
C2
C2
ENCH1
ENCH1
C3
C3
C1
OUT1
Analog GND
C5
C1
OUT1
U1
U1
Analog GND
C5
C6
C6
OUT2
C4
OUT2
C4
SA58643 TSSOP8
#30007-A50
SA58643 TSSOP8
#30007-A50
B
B
A
A
Test Line
Test Line
002aab692
b. SA58643 board layout
Fig 19. Evaluation board and layout
SA58643_1
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 20 November 2006
8 of 16
SA58643
NXP Semiconductors
Single-Pole Double-Throw (SPDT) switch
The SA58643DP evaluation demo board (see Figure 19b. SA58643 board layout)
provides a stable RF layout. The demo circuit (see Figure 19a. Evaluation board
schematic) is constructed on 2-layer, 1-ounce copper, FR4 PCB material. The overall
thickness is 0.062 inches and has a dielectric constant, εr of 4.6. The transmission lines
are modeled for coplanar waveguide with both top and bottom ground. The 50 Ω
transmission line width is 1.388 mm, the gap from transmission line to top ground plane is
0.254 mm, and the dielectric thickness is 1.499 mm. To facilitate grounding, and support
low inductance ground returns, the top and bottom grounds are connected by
through-hole vias that are equal in diameter to the thickness of the PCB.
The top view in Figure 19b shows the placement of the circuit components. The RF input
(pin 4) is connected via a 50 Ω transmission line to a SMA connector. Symmetrical 50 Ω
transmission lines connect OUT1 and OUT2 (pins 5 and 8) to SMA connectors at
Outputs 1 and 2. A 50 Ω through-transmission line is provided as a calibration standard.
The outputs are selected via the DC logic level on ENCH1 (pin 2). Logic 1 level enables
Output1 (that is, connects it to the common RF input); Logic 0 enables Output2. The
positive supply, VDD (pin 1) and AC_GND (pin 7) are decoupled using 100 nF,
0805 ceramic chip capacitors to ground.
13.2 Application examples
The SA58643 is a very versatile part and can be used in many applications. Figure 20
shows a block diagram of a typical digital RF transceiver front-end. In this application the
SA58643 replaces the duplexer which is typically very bulky and lossy. Due to the low
power consumption of the device, it is ideally suited for handheld applications such as in
CT2 cordless telephones. The SA58643 can also be used to generate Amplitude Shift
Keying (ASK) or On-Off Keying (OOK), and Frequency Shift Keying (FSK) signals for
digital RF communications systems. Block diagrams for these applications are shown in
Figure 21 and Figure 22, respectively.
For applications that require a higher isolation at 1 GHz than obtained from a single
SA58643, several SA58643s can be cascaded as shown in Figure 23. The cascaded
configuration will have a higher loss, but greater than 35 dB of isolation at 1 GHz and
greater than 65 dB at 500 MHz can be obtained from this configuration. The isolation and
matching of the two channels over frequency is shown in Figure 9 and Figure 10,
respectively. By modifying the enable control, an RF multiplexer/demultiplexer or antenna
selector can be constructed. The simplicity of the SA58643 coupled with its ease of use
and high performance lends itself to many innovative applications.
The SA58643 switch terminates the OFF channel in 50 Ω. The 50 Ω resistor is internal
and is in series with the external AC bypass capacitor. Matching to impedances other than
50 Ω can be achieved by adding a resistor in series with the AC bypass capacitor (that is,
25 Ω additional to match to a 75 Ω environment).
SA58643_1
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 20 November 2006
9 of 16
SA58643
NXP Semiconductors
Single-Pole Double-Throw (SPDT) switch
5200
602A
IF OUT
KEYPAD
AND
DISPLAY
MICRO-
CONTROLLER
SA58643
TX/RX
5200
VCO
modulation
002aab693
Fig 20. A typical TDMA/digital RF transceiver system front-end
f
1
ASK output
oscillator
FSK output
SA58643
SA58643
50 Ω
f
enable
2
enable
CH1
CH1
TTL data
TTL data
002aab694
002aab695
Fig 21. Amplitude Shift Keying (ASK)
generator
Fig 22. Frequency Shift Keying (FSK)
generator
OUT1/IN1
SA58643
IN/OUT
SA58643
SA58643
OUT2/IN2
002aab696
enable
Fig 23. Cascaded configuration
SA58643_1
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 20 November 2006
10 of 16
SA58643
NXP Semiconductors
Single-Pole Double-Throw (SPDT) switch
14. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
A
(A )
2
A
3
A
1
pin 1 index
θ
L
p
L
1
4
detail X
e
w M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT
v
w
y
Z
θ
1
2
3
p
max.
0.15
0.05
0.95
0.80
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
5.1
4.7
0.7
0.4
0.70
0.35
6°
0°
mm
1.1
0.65
0.25
0.94
0.1
0.1
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-04-09
03-02-18
SOT505-1
Fig 24. Package outline SOT505-1 (TSSOP8)
SA58643_1
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 20 November 2006
11 of 16
SA58643
NXP Semiconductors
Single-Pole Double-Throw (SPDT) switch
15. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus PbSn soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
SA58643_1
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 20 November 2006
12 of 16
SA58643
NXP Semiconductors
Single-Pole Double-Throw (SPDT) switch
15.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 25) than a PbSn process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7 and 8
Table 7.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
220
< 2.5
235
220
≥ 2.5
220
Table 8.
Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 25.
SA58643_1
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 20 November 2006
13 of 16
SA58643
NXP Semiconductors
Single-Pole Double-Throw (SPDT) switch
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 25. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
16. Abbreviations
Table 9.
Abbreviations
Description
Acronym
ASK
Amplitude Shift Keying
BiCMOS
CMOS
DC
Bipolar Complementary Metal Oxide Semiconductor
Complementary Metal Oxide Semiconductor
Direct Current
ESD
Electrostatic Discharge
Frequency Shift Keying
On-Off Keying
FSK
OOK
PIN
Positive Intrinsic Negative
Radio Frequency
RF
SMA
TTL
Sub-Miniature A
Transistor-Transistor Logic
17. Revision history
Table 10. Revision history
Document ID
Release date
20061120
Data sheet status
Change notice
Supersedes
SA58643_1
Product data sheet
-
-
SA58643_1
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 20 November 2006
14 of 16
SA58643
NXP Semiconductors
Single-Pole Double-Throw (SPDT) switch
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of a NXP Semiconductors product can reasonably be expected to
18.2 Definitions
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
18.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
19. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
SA58643_1
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 01 — 20 November 2006
15 of 16
SA58643
NXP Semiconductors
Single-Pole Double-Throw (SPDT) switch
20. Contents
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
7
Equivalent circuit. . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 3
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 4
Performance curves . . . . . . . . . . . . . . . . . . . . . 5
8
9
10
11
12
13
13.1
13.2
Application information. . . . . . . . . . . . . . . . . . . 8
Evaluation demo board. . . . . . . . . . . . . . . . . . . 8
Application examples . . . . . . . . . . . . . . . . . . . . 9
14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
15
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Introduction to soldering . . . . . . . . . . . . . . . . . 12
Wave and reflow soldering . . . . . . . . . . . . . . . 12
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13
15.1
15.2
15.3
15.4
16
17
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14
18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
18.1
18.2
18.3
18.4
19
20
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2006.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 20 November 2006
Document identifier: SA58643_1
相关型号：
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