PZU5.6B1,115
更新时间:2024-09-18 13:32:11
品牌:NXP
描述:PZUxB series - Single Zener diodes in a SOD323F package SOD 2-Pin
PZU5.6B1,115 概述
PZUxB series - Single Zener diodes in a SOD323F package SOD 2-Pin 齐纳二极管 齐纳二极管
PZU5.6B1,115 规格参数
是否Rohs认证: | 符合 | 生命周期: | Transferred |
零件包装代码: | SOD | 包装说明: | PLASTIC, SC-90, 2 PIN |
针数: | 2 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8541.10.00.50 |
风险等级: | 5.48 | 配置: | SINGLE |
二极管元件材料: | SILICON | 二极管类型: | ZENER DIODE |
最大动态阻抗: | 100 Ω | JESD-30 代码: | R-PDSO-F2 |
JESD-609代码: | e3 | 湿度敏感等级: | 1 |
元件数量: | 1 | 端子数量: | 2 |
最高工作温度: | 150 °C | 最低工作温度: | -65 °C |
封装主体材料: | PLASTIC/EPOXY | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 峰值回流温度(摄氏度): | 260 |
极性: | UNIDIRECTIONAL | 最大功率耗散: | 0.31 W |
认证状态: | Not Qualified | 参考标准: | IEC-60134 |
标称参考电压: | 5.6 V | 子类别: | Voltage Reference Diodes |
表面贴装: | YES | 技术: | ZENER |
端子面层: | Tin (Sn) | 端子形式: | FLAT |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
最大电压容差: | 2% | 工作测试电流: | 5 mA |
Base Number Matches: | 1 |
PZU5.6B1,115 数据手册
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PDF下载PZUxB series
Single Zener diodes in a SOD323F package
Rev. 02 — 15 November 2009
Product data sheet
1. Product profile
1.1 General description
General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead Surface
Mounted Device (SMD) plastic package.
1.2 Features
Total power dissipation: ≤ 310 mW
Tolerance series: B: approximately ±5 %; B1, B2, B3: sequential, approximately ±2 %
Small plastic package suitable for surface mounted design
Wide working voltage range: nominal 2.4 V to 36 V
1.3 Applications
General regulation functions
1.4 Quick reference data
Table 1.
Symbol
VF
Quick reference data
Parameter
Conditions
IF = 100 mA
Tamb ≤ 25 °C
Min
Typ
Max
1.1
Unit
V
[1]
[2]
[3]
forward voltage
-
-
-
-
-
-
Ptot
total power dissipation
310
550
mW
mW
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm2.
PZUxB series
NXP Semiconductors
Single Zener diodes in a SOD323F package
2. Pinning information
Table 2.
Pinning
Pin
1
Description
cathode
Simplified outline
Symbol
[1]
1
2
2
anode
2
1
sym068
[1] The marking bar indicates the cathode
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
plastic surface mounted package; 2 leads
Version
PZU2.4B to
PZU36B[1]
SC-90
SOD323F
[1] The series consists of 97 types with nominal working voltages from 2.4 V to 36 V.
4. Marking
Table 4.
Marking codes
Type number
Marking code
Type number
Marking code
B
B1
-
B2
-
B3
-
B
B1
FH
FJ
FK
FL
-
B2
HF
HG
HH
HJ
HK
HL
HM
HN
HP
HQ
HR
-
B3
KB
KC
KD
KE
-
PZU2.4
PZU2.7
PZU3.0
PZU3.3
PZU3.6
PZU3.9
PZU4.3
PZU4.7
PZU5.1
PZU5.6
PZU6.2
PZU6.8
PZU7.5
PZU8.2
PZU9.1
G3
G4
G5
G6
G7
G8
G9
GA
GB
GC
GD
GE
GF
GG
GH
PZU10
PZU11
PZU12
PZU13
PZU14
PZU15
PZU16
PZU18
PZU20
PZU22
PZU24
PZU27
PZU30
PZU33
PZU36
GJ
GK
GL
GM
-
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FD
FE
FF
FG
H1
H2
H3
H4
H5
H6
H7
H8
H9
HA
HB
HC
HD
HE
-
-
-
-
-
GN
GP
GQ
GR
GS
GT
GU
GV
GW
GX
FM
FN
FP
FQ
FR
FS
-
KF
KG
KH
KJ
KK
KL
-
HS
HT
HU
HV
HW
HX
HY
HZ
KA
-
-
-
-
-
-
-
-
-
PZUXB_SER_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 15 November 2009
2 of 12
PZUxB series
NXP Semiconductors
Single Zener diodes in a SOD323F package
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
IF
forward current
-
-
200
mA
IZSM
non-repetitive peak reverse
current
see Table 8
and 9
[1]
PZSM
Ptot
non-repetitive peak reverse
power dissipation
-
40
W
[2]
[3]
total power dissipation
Tamb ≤ 25 °C
-
310
mW
mW
°C
-
550
Tj
junction temperature
ambient temperature
storage temperature
-
150
Tamb
Tstg
−65
−65
+150
+150
°C
°C
[1] tp = 100 μs; square wave; Tj = 25 °C prior to surge
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm2.
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
400
230
55
Unit
K/W
K/W
K/W
[1]
[2]
[3]
Rth(j-a)
thermal resistance from
junction to ambient
in free air
-
-
-
-
-
-
Rth(j-sp)
thermal resistance from
junction to solder point
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm2.
[3] Soldering point of cathode tab
7. Characteristics
Table 7.
Characteristics
Tj = 25 °C unless otherwise specified
Symbol
Parameter
Conditions
IF = 10 mA
IF = 100 mA
Min
Typ
Max
0.9
Unit
[1]
[1]
VF
forward voltage
-
-
-
-
V
V
1.1
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02
PZUXB_SER_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 15 November 2009
3 of 12
PZUxB series
NXP Semiconductors
Single Zener diodes in a SOD323F package
Table 8.
Characteristics per type; PZU2.4B to PZU5.6B3
Tj = 25 °C unless otherwise specified
PZU Sel Working
Maximum differential
resistance
rdif (Ω)
Reverse
current
IR (μA)
Temperature Diode
Non-repetitive peak
xxx
voltage
VZ (V);
coefficient
SZ (mV/K);
IZ = 5 mA
capacitance reverse current
Cd (pF)[1]
IZSM (A)[2]
IZ = 5 mA
Min
2.3
2.5
Max
IZ = 0.5 mA IZ = 5 mA
Max
50
VR (V) Typ
Max
450
440
Max
8
2.4
2.7
B
B
2.6
1000
1000
100
100
1
1
−1.6
−2.0
2.9
20
8
B1 2.5
2.75
2.9
B2 2.65
3.0
3.3
3.6
3.9
4.3
B
2.80
3.20
3.05
3.20
3.50
3.35
3.50
3.80
3.65
3.80
4.10
3.97
4.10
4.48
4.21
4.34
4.48
4.90
4.61
4.75
4.90
5.37
5.04
5.20
5.37
5.92
5.55
5.73
5.92
1000
1000
1000
1000
1000
95
95
90
90
90
10
5
1
1
1
1
1
−2.1
−2.4
−2.4
−2.5
−2.5
425
410
390
370
350
8
8
8
8
8
B1 2.80
B2 2.95
B
3.10
B1 3.10
B2 3.25
B
3.40
5
B1 3.40
B2 3.55
B
3.70
3
B1 3.70
B2 3.87
B
4.01
3
B1 4.01
B2 4.15
B3 4.28
4.7
5.1
5.6
B
4.42
800
250
100
80
60
40
2
2
1
1
−1.4
0.3
325
300
275
8
B1 4.42
B2 4.55
B3 4.69
B
4.84
1.5
2.5
5.5
5.5
B1 4.84
B2 4.98
B3 5.14
B
5.31
1.9
B1 5.31
B2 5.49
B3 5.67
[1] f = 1 MHz; VR = 0 V
[2] tp = 100 μs; square wave; Tj = 25 °C prior to surge
PZUXB_SER_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 15 November 2009
4 of 12
PZUxB series
NXP Semiconductors
Single Zener diodes in a SOD323F package
Table 9.
Characteristics per type; PZU6.2B to PZU36B
Tj = 25 °C unless otherwise specified
PZU Sel Working
Maximum differential
resistance
rdif (Ω)
Reverse
current
IR (nA)
Temperature Diode
Non-repetitive peak
xxx
voltage
VZ (V);
coefficient
SZ (mV/K);
IZ = 5 mA
capacitance reverse current
Cd (pF)[1]
IZSM (A)[2]
IZ = 5 mA
Min
Max
IZ = 0.5 mA IZ = 5 mA
Max
VR (V) Typ
Max
Max
6.2
B
5.86
6.53
6.12
6.33
6.53
7.14
6.73
6.93
7.14
7.84
7.36
7.60
7.84
8.64
8.10
8.36
8.64
9.55
8.93
9.23
9.55
80
60
60
60
60
30
20
10
10
10
10
10
10
10
10
500
3
2.7
3.4
4.0
4.6
5.5
6.4
7.4
8.4
9.4
10.4
250
5.5
B1 5.86
B2 6.06
B3 6.26
6.8
7.5
8.2
9.1
10
B
6.47
500
500
500
500
100
100
100
100
100
3.5
4
215
170
150
120
110
108
105
103
101
5.5
3.5
3.5
3.5
3.5
3
B1 6.47
B2 6.65
B3 6.86
B
7.06
B1 7.06
B2 7.28
B3 7.52
B
7.76
5
B1 7.76
B2 8.02
B3 8.28
B
8.56
6
B1 8.56
B2 8.85
B3 9.15
B
9.45
10.55 60
9.87
7
B1 9.45
B2 9.77
10.21
B3 10.11 10.55
11
B
10.44 11.56 60
8
B1 10.44 10.88
B2 10.76 11.22
B3 11.10 11.56
12
B
11.42 12.60 80
9
3
B1 11.42 11.90
B2 11.74 12.24
B3 12.08 12.60
13
B
12.47 13.96 80
10
11
2.5
2
B1 12.47 13.03
B2 12.91 13.49
B3 13.37 13.96
B2 13.70 14.30 80
14
PZUXB_SER_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 15 November 2009
5 of 12
PZUxB series
NXP Semiconductors
Single Zener diodes in a SOD323F package
Table 9.
Characteristics per type; PZU6.2B to PZU36B …continued
Tj = 25 °C unless otherwise specified
PZU Sel Working
Maximum differential
resistance
rdif (Ω)
Reverse
current
IR (nA)
Temperature Diode
Non-repetitive peak
xxx
voltage
VZ (V);
coefficient
SZ (mV/K);
IZ = 5 mA
capacitance reverse current
Cd (pF)[1]
IZSM (A)[2]
IZ = 5 mA
Min
Max
IZ = 0.5 mA IZ = 5 mA
Max
VR (V) Typ
Max
Max
15
B
13.84 15.52 80
15
20
20
20
25
30
50
11
12
13
15
17
19
11.4
12.4
14.4
16.4
18.4
20.4
99
2
B1 13.84 14.46
B2 14.34 14.98
B3 14.85 15.52
16
18
20
22
24
B
15.37 17.09 80
50
50
50
50
50
97
93
88
84
80
1.5
1.5
1.5
1.3
1.3
B1 15.37 16.01
B2 15.85 16.51
B3 16.35 17.09
B
16.94 19.03 80
B1 16.94 17.70
B2 17.56 18.35
B3 18.21 19.03
B
18.86 21.08 100
B1 18.86 19.70
B2 19.52 20.39
B3 20.21 21.08
B
20.88 23.17 100
B1 20.88 21.77
B2 21.54 22.47
B3 22.23 23.17
B
22.93 25.57 120
B1 22.93 23.96
B2 23.72 24.78
B3 24.54 25.57
27
30
33
36
B
B
B
B
25.1
28
28.9
32
150
200
250
300
40
40
40
60
50
50
50
50
21
23
25
27
23.4
26.6
29.7
33.0
73
66
60
59
1
1
31
35
0.9
0.8
34
38
[1] f = 1 MHz; VR = 0 V
[2] tp = 100 μs; square wave; Tj = 25 °C prior to surge
PZUXB_SER_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 15 November 2009
6 of 12
PZUxB series
NXP Semiconductors
Single Zener diodes in a SOD323F package
mbg781
mgl273
300
0
S
Z
I
F
4.3
(mV/K)
(mA)
200
−1
3.9
3.6
100
−2
−3
3.3
3.0
2.4
2.7
0
0.6
0.8
1
0
20
40
60
I
Z
(mA)
V
F
(V)
Tj = 25 °C
PZU2.4B to PZU4.3B
Tj = 25 °C to 150 °C
Fig 1. Forward current as a function of forward
voltage; typical values
Fig 2. Temperature coefficient as a function of
working current; typical values
mgl274
006aaa687
400
10
12
P
tot
S
Z
(mW)
11
(mV/K)
10
300
9.1
5
8.2
7.5
6.8
200
100
0
6.2
5.6
5.1
0
4.7
−5
0
4
8
12
16
20
0
50
100
150
200
(°C)
I
Z
(mA)
T
amb
PZU4.7B to PZU12B
FR4 PCB, standard footprint
Tj = 25 °C to 150 °C
Fig 3. Temperature coefficient as a function of
working current; typical values
Fig 4. Power derating curve
PZUXB_SER_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 15 November 2009
7 of 12
PZUxB series
NXP Semiconductors
Single Zener diodes in a SOD323F package
8. Package outline
1.35
1.15
0.80
0.65
0.5
0.3
1
2.7 1.8
2.3 1.6
2
0.40
0.25
0.25
0.10
Dimensions in mm
04-09-13
Fig 5. Package outline SOD323F (SC-90)
9. Packing information
Table 10. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description
Packing quantity
3000
10000
-135
PZU2.4B to
PZU36B
SOD323F 4 mm pitch, 8 mm tape and reel
-115
[1] For further information and the availability of packing methods, see Section 14.
10. Soldering
3.05
2.80
2.10
1.60
solder lands
solder resist
occupied area
solder paste
1.65 0.95
0.50 0.60
0.50
(2×)
001aab169
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 6. Reflow soldering footprint SOD323F (SC-90)
PZUXB_SER_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 15 November 2009
8 of 12
PZUxB series
NXP Semiconductors
Single Zener diodes in a SOD323F package
11. Mounting
43.4
43.4
10
0.6
0.6
10
0.6
0.6
40
40
0.6
0.5
0.5
0.6
Dimensions in mm
PCB thickness = 1.6 mm
006aaa487
Dimensions in mm
PCB thickness = 1.6 mm
006aaa488
Fig 7. FR4 PCB, standard footprint
Fig 8. FR4 PCB, mounting pad for
cathode 1cm2
PZUXB_SER_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 15 November 2009
9 of 12
PZUxB series
NXP Semiconductors
Single Zener diodes in a SOD323F package
12. Revision history
Table 11. Revision history
Document ID
PZUXB_SER_2
Modifications:
Release date
20091115
Data sheet status
Change notice
Supersedes
Product data sheet
-
PZUXB_SER_1
• This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
PZUXB_SER_1
20060307
Product data sheet
-
-
PZUXB_SER_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 15 November 2009
10 of 12
PZUxB series
NXP Semiconductors
Single Zener diodes in a SOD323F package
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PZUXB_SER_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 15 November 2009
11 of 12
PZUxB series
NXP Semiconductors
Single Zener diodes in a SOD323F package
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Packing information . . . . . . . . . . . . . . . . . . . . . 8
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
3
4
5
6
7
8
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 15 November 2009
Document identifier: PZUXB_SER_2
PZU5.6B1,115 替代型号
型号 | 制造商 | 描述 | 替代类型 | 文档 |
PZU5.6B1 | NXP | Single Zener diodes in a SOD323F package | 完全替代 | |
PZU5.6B2,115 | NXP | PZUxB series - Single Zener diodes in a SOD323F package SOD 2-Pin | 类似代替 |
PZU5.6B1,115 相关器件
型号 | 制造商 | 描述 | 价格 | 文档 |
PZU5.6B1,135 | NXP | 5.6V, 0.31W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, PLASTIC, SC-90, 2 PIN | 获取价格 | |
PZU5.6B1A | NXP | 暂无描述 | 获取价格 | |
PZU5.6B1A | NEXPERIA | Single Zener diodesProduction | 获取价格 | |
PZU5.6B1A,115 | ETC | DIODE ZENER 5.6V 320MW SOD323 | 获取价格 | |
PZU5.6B1A-Q | NEXPERIA | Single Zener diodesProduction | 获取价格 | |
PZU5.6B1A/DG | NXP | DIODE 5.6 V, 0.32 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, PLASTIC, SC-76, 2 PIN, Voltage Regulator Diode | 获取价格 | |
PZU5.6B2 | NXP | Single Zener diodes in a SOD323F package | 获取价格 | |
PZU5.6B2 | NEXPERIA | Zener diodes in a SOD323F packageProduction | 获取价格 | |
PZU5.6B2,115 | NXP | PZUxB series - Single Zener diodes in a SOD323F package SOD 2-Pin | 获取价格 | |
PZU5.6B2A | NXP | 5.6V, 0.32W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, PLASTIC, SC-76, 2 PIN | 获取价格 |
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