PZU11BL,315 [NXP]
PZUxBL series - Single Zener diodes DFN 2-Pin;型号: | PZU11BL,315 |
厂家: | NXP |
描述: | PZUxBL series - Single Zener diodes DFN 2-Pin |
文件: | 总13页 (文件大小:116K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PZUxBL series
Single Zener diodes
Rev. 01 — 6 May 2008
Product data sheet
1. Product profile
1.1 General description
General-purpose Zener diodes in SOD882 leadless ultra small Surface-Mounted
Device (SMD) plastic package.
1.2 Features
I Non-repetitive peak reverse power
dissipation: PZSM ≤ 40 W
I Low reverse current IR range
I Total power dissipation: Ptot ≤ 250 mW I Small plastic package suitable for
surface-mounted design
I Tolerance series:
I AEC-Q101 qualified
B: approximately ±5 %;
B2: approximately ±2 %
I Wide working voltage range:
nominal 2.4 V to 36 V (E24 range)
1.3 Applications
I General regulation functions
1.4 Quick reference data
Table 1.
Quick reference data
Symbol Parameter
Conditions
IF = 100 mA
Min
Typ
Max
1.1
40
Unit
V
[1]
[2]
VF
forward voltage
-
-
-
-
PZSM
non-repetitive peak reverse
power dissipation
W
[3][4]
Ptot
total power dissipation
T
amb ≤ 25 °C
-
-
250
mW
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
[2] tp = 100 µs; square wave; Tj = 25 °C prior to surge
[3] Reflow soldering is the only recommended soldering method.
[4] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
PZUxBL series
NXP Semiconductors
Single Zener diodes
2. Pinning information
Table 2.
Pinning
Pin
1
Description
cathode
Simplified outline
Graphic symbol
[1]
2
anode
2
1
1
2
006aaa152
Transparent
top view
[1] The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
-
Description
Version
PZU2.4BL to
PZU36BL[1]
leadless ultra small plastic package; 2 terminals;
SOD882
body 1.0 × 0.6 × 0.5 mm
PZU2.7B2L to
PZU24B2L[2]
[1] The series consists of 29 types with nominal working voltages from 2.4 V to 36 V.
[2] The series consists of 25 types with nominal working voltages from 2.7 V to 24 V.
4. Marking
Table 4.
Marking codes
Type number
PZU2.4BL
PZU2.7BL
PZU3.0BL
PZU3.3BL
PZU3.6BL
PZU3.9BL
PZU4.3BL
PZU4.7BL
PZU5.1BL
PZU5.6BL
PZU6.2BL
PZU6.8BL
PZU7.5BL
PZU8.2BL
PZU9.1BL
PZU10BL
PZU11BL
Marking code
Type number
PZU2.7B2L
PZU3.0B2L
PZU3.3B2L
PZU3.6B2L
PZU3.9B2L
PZU4.3B2L
PZU4.7B2L
PZU5.1B2L
PZU5.6B2L
PZU6.2B2L
PZU6.8B2L
PZU7.5B2L
PZU8.2B2L
PZU9.1B2L
PZU10B2L
PZU11B2L
PZU12B2L
Marking code
H2
H3
H4
H5
H6
H7
H8
H9
HA
HB
HC
HD
HE
HF
HG
HH
HK
HZ
K1
K2
K3
K4
K5
K6
K7
K8
H1
K9
KA
KB
KC
KD
KE
KF
PZUXBL_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 6 May 2008
2 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
Table 4.
Marking codes …continued
Type number
PZU12BL
PZU13BL
PZU15BL
PZU16BL
PZU18BL
PZU20BL
PZU22BL
PZU24BL
PZU27BL
PZU30BL
PZU33BL
PZU36BL
Marking code
Type number
PZU13B2L
PZU14B2L
PZU15B2L
PZU16B2L
PZU18B2L
PZU20B2L
PZU22B2L
PZU24B2L
-
Marking code
HL
KG
KH
KK
KL
KM
KN
KP
KR
-
HM
HN
HP
HR
HS
HT
HU
HV
HW
HX
HY
-
-
-
-
-
-
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
IF
Parameter
Conditions
Min
Max
Unit
forward current
-
-
200
mA
[1]
[1]
IZSM
non-repetitive peak reverse
current
see
Table 8
and 9
PZSM
Ptot
non-repetitive peak reverse
power dissipation
-
40
W
[2][3]
[2][4]
total power dissipation
Tamb ≤ 25 °C
-
250
mW
mW
°C
-
500
Tj
junction temperature
ambient temperature
storage temperature
-
150
Tamb
Tstg
−55
−65
+150
+150
°C
°C
[1] tp = 100 µs; square wave; Tj = 25 °C prior to surge
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
PZUXBL_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 6 May 2008
3 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
6. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
Min
Typ
Max Unit
[1][2]
[1][3]
[4]
thermal resistance from
junction to ambient
in free air
-
-
-
-
-
-
500
250
55
K/W
K/W
K/W
Rth(j-sp)
thermal resistance from
junction to solder point
[1] Reflow soldering is the only recommended soldering method.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4] Soldering point of cathode tab.
7. Characteristics
Table 7.
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max Unit
[1]
VF
forward voltage
IF = 10 mA
-
-
-
-
0.9
1.1
V
V
IF = 100 mA
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
Table 8.
Characteristics per type; PZU2.4BL to PZU5.6B2L
Tj = 25 °C unless otherwise specified.
PZUxxx Sel
Working
voltage
Differential resistance Reverse
Temperature Diode
Non-repetitive
current
coefficient
capacitance peak reverse
rdif (Ω)
current
ZSM (A)[2]
VZ (V)
IR (µA)
SZ (mV/K)
Cd (pF)[1]
I
IZ = 5 mA
IZ = 0.5 mA IZ = 5 mA
IZ = 5 mA
Min
2.3
2.5
Max Max
Max
100
100
Max
50
VR (V) Typ
Max
450
440
Max
8
2.4
2.7
B
2.6
2.9
1000
1000
1
1
−1.6
−2.0
B
20
8
B2
B
2.65 2.9
3.0
3.3
3.6
3.9
4.3
2.80 3.20 1000
2.95 3.20
95
95
90
90
90
10
5
1
1
1
1
1
−2.1
−2.4
−2.4
−2.5
−2.5
425
410
390
370
350
8
8
8
8
8
B2
B
3.10 3.50 1000
3.25 3.50
B2
B
3.40 3.80 1000
3.55 3.80
5
B2
B
3.70 4.10 1000
3.87 4.10
3
B2
B
4.01 4.48 1000
4.15 4.34
3
B2
PZUXBL_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 6 May 2008
4 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
Table 8.
Characteristics per type; PZU2.4BL to PZU5.6B2L …continued
Tj = 25 °C unless otherwise specified.
PZUxxx Sel
Working
voltage
Differential resistance Reverse
current
Temperature Diode
Non-repetitive
coefficient
capacitance peak reverse
r
dif (Ω)
current
IZSM (A)[2]
VZ (V)
IR (µA)
SZ (mV/K)
Cd (pF)[1]
IZ = 5 mA
IZ = 0.5 mA IZ = 5 mA
Max
IZ = 5 mA
Min
Max Max
Max
VR (V) Typ
Max
Max
4.7
5.1
5.6
B
4.42 4.90 800
4.55 4.75
80
60
40
2
1
−1.4
0.3
325
8
B2
B
4.84 5.37 250
4.98 5.20
2
1
1.5
2.5
300
275
5.5
5.5
B2
B
5.31 5.92 100
5.49 5.73
1.9
B2
[1] f = 1 MHz; VR = 0 V
[2] tp = 100 µs; square wave; Tj = 25 °C prior to surge
Table 9.
Characteristics per type; PZU6.2BL to PZU36BL
Tj = 25 °C unless otherwise specified.
PZUxxx Sel
Working
voltage
Differential resistance Reverse
Temperature Diode
Non-repetitive
current
coefficient
capacitance peak reverse
rdif (Ω)
current
ZSM (A)[2]
VZ (V)
IR (nA)
SZ (mV/K)
Cd (pF)[1]
I
IZ = 5 mA
IZ = 0.5 mA IZ = 5 mA
IZ = 5 mA
Min
Max Max
Max
Max
VR (V) Typ
Max
Max
6.2
6.8
7.5
8.2
9.1
10
B
5.86 6.53 80
6.06 6.33
30
500
3
2.7
3.4
4.0
4.6
5.5
6.4
7.4
8.4
9.4
10.4
250
5.5
B2
B
6.47 7.14 60
6.65 6.93
20
10
10
10
10
10
10
10
10
500
500
500
500
100
100
100
100
100
3.5
4
215
170
150
120
110
108
105
103
101
5.5
3.5
3.5
3.5
3.5
3
B2
B
7.06 7.84 60
7.28 7.60
B2
B
7.76 8.64 60
8.02 8.36
5
B2
B
8.56 9.55 60
8.85 9.23
6
B2
B
9.45 10.55 60
9.77 10.21
7
B2
B
11
10.44 11.56 60
10.76 11.22
8
B2
B
12
11.42 12.60 80
11.74 12.24
9
3
B2
B
13
12.47 13.96 80
12.91 13.49
10
11
2.5
2
B2
B2
14
13.70 14.30 80
PZUXBL_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 6 May 2008
5 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
Table 9.
Characteristics per type; PZU6.2BL to PZU36BL …continued
Tj = 25 °C unless otherwise specified.
PZUxxx Sel
Working
voltage
Differential resistance Reverse
current
Temperature Diode
Non-repetitive
coefficient
capacitance peak reverse
r
dif (Ω)
current
IZSM (A)[2]
VZ (V)
IR (nA)
SZ (mV/K)
Cd (pF)[1]
IZ = 5 mA
IZ = 0.5 mA IZ = 5 mA
Max
IZ = 5 mA
Min
Max Max
Max
VR (V) Typ
Max
Max
15
16
18
20
22
24
B
13.84 15.52 80
14.34 14.98
15
20
20
20
25
30
50
11
12
13
15
17
19
11.4
12.4
14.4
16.4
18.4
20.4
99
2
B2
B
15.37 17.09 80
15.85 16.51
50
50
50
50
50
97
93
88
84
80
1.5
1.5
1.5
1.3
1.3
B2
B
16.94 19.03 80
17.56 18.35
B2
B
18.86 21.08 100
19.52 20.39
B2
B
20.88 23.17 100
21.54 22.47
B2
B
22.93 25.57 120
23.72 24.78
B2
B
27
30
33
36
25.1 28.9 150
40
40
40
60
50
50
50
50
21
23
25
27
23.4
26.6
29.7
33.0
73
66
60
59
1
B
28
31
34
32
35
38
200
250
300
1
B
0.9
0.8
B
[1] f = 1 MHz; VR = 0 V
[2] tp = 100 µs; square wave; Tj = 25 °C prior to surge
PZUXBL_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 6 May 2008
6 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
006aab129
mbg781
3
10
300
P
(W)
I
ZSM
F
(mA)
2
10
200
10
100
1
10
0
0.6
−1
1
10
0.8
1
t
(ms)
V (V)
F
p
Tj = 25 °C (prior to surge)
Tj = 25 °C
Fig 1. Non-repetitive peak reverse power dissipation
as a function of pulse duration; maximum
values
Fig 2. Forward current as a function of forward
voltage; typical values
mgl274
mgl273
10
0
12
S
S
Z
Z
11
4.3
(mV/K)
(mV/K)
10
9.1
5
−1
8.2
7.5
6.8
3.9
3.6
6.2
5.6
5.1
0
−2
−3
3.3
4.7
3.0
2.4
2.7
−5
0
4
8
12
16
20
0
20
40
60
I
(mA)
I
(mA)
Z
Z
Tj = 25 °C to 150 °C
Tj = 25 °C to 150 °C
PZU4.7BL to PZU12B2L
PZU2.4BL to PZU4.3B2L
Fig 3. Temperature coefficient as a function of
working current; typical values
Fig 4. Temperature coefficient as a function of
working current; typical values
PZUXBL_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 6 May 2008
7 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
006aab246
006aab247
2
2
10
10
V
(V) = 4.7
I
I
Z
Z(nom)
Z
(mA)
(mA)
V
(V) = 2.4
Z(nom)
3.6 4.3
3.9
3.0
3.3
10
10
5.6
6.8
9.1
11
2.7
6.2
8.2
7.5
5.1
10
12
1
1
−1
−1
10
10
−2
−2
10
10
10
10
−3
−3
0
1
2
3
4
5
0
2
4
6
8
10
12
V (V)
Z
14
V
(V)
Z
Tj = 25 °C
PZU2.4BL to PZU4.3B2L
Tj = 25 °C
PZU4.7BL to PZU12B2L
Fig 5. Working current as a function of working
voltage; typical values
Fig 6. Working current as a function of working
voltage; typical values
006aab248
2
10
I
V
(V) = 13
Z
Z(nom)
(mA)
10
14
15
16
18
22
27
33
20
24
30
36
1
−1
10
10
10
−2
−3
10
20
30
40
V
(V)
Z
Tj = 25 °C
PZU13BL to PZU36BL
Fig 7. Working current as a function of working voltage; typical values
PZUXBL_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 6 May 2008
8 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
0.50
0.46
0.62
0.55
2
1
0.30
0.22
1.02
0.95
0.65
0.30
0.22
0.55
0.47
cathode marking on top side
Dimensions in mm
03-04-17
Fig 8. Package outline SOD882
10. Packing information
Table 10. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
10000
PZU2.4BL to
PZU36BL
SOD882
2 mm pitch, 8 mm tape and reel
-315
PZU2.7B2L to
PZU24B2L
[1] For further information and the availability of packing methods, see Section 13.
PZUXBL_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 6 May 2008
9 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
11. Soldering
1.30
0.30
R = 0.05 (8×)
R = 0.05 (8×)
0.60 0.70 0.80
(2×) (2×) (2×)
0.90
0.30
(2×)
0.40
(2×)
0.50
(2×)
solder lands
solder paste
solder resist
occupied area
mbl872
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 9. Reflow soldering footprint SOD882
PZUXBL_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 6 May 2008
10 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
12. Revision history
Table 11. Revision history
Document ID
Release date
20080506
Data sheet status
Change notice
Supersedes
PZUXBL_SER_1
Product data sheet
-
-
PZUXBL_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 6 May 2008
11 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PZUXBL_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 6 May 2008
12 of 13
PZUxBL series
NXP Semiconductors
Single Zener diodes
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9
Quality information . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Packing information. . . . . . . . . . . . . . . . . . . . . . 9
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
3
4
5
6
7
8
8.1
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 6 May 2008
Document identifier: PZUXBL_SER_1
相关型号:
PZU11DB2/DG
DIODE 11 V, 0.25 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, HALOGEN FREE, PLASTIC, SMD, SC-88A, 5 PIN, Voltage Regulator Diode
NXP
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