PCK3807A [NXP]
1:10 LVTTL clock distribution device; 1:10 LVTTL时钟分配器件![PCK3807A](http://pdffile.icpdf.com/pdf1/p00020/img/icpdf/PCK3807A_99723_icpdf.jpg)
型号: | PCK3807A |
厂家: | ![]() |
描述: | 1:10 LVTTL clock distribution device |
文件: | 总13页 (文件大小:126K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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INTEGRATED CIRCUITS
PCK3807A
1:10 LVTTL clock distribution device
Product data sheet
2004 Aug 27
Supersedes data of 2003 Jun 27
Philips
Semiconductors
Philips Semiconductors
Product data sheet
1:10 LVTTL clock distribution device
PCK3807A
DESCRIPTION
• High speed: propagation delay < 3.5 ns (max)
This low skew clock driver offers 1:10 fan-out. The large fan out from
a single input reduces loading on the preceding driver and provides
an efficient clock distribution network. The PCK3807A offers low
capacitance inputs with hysteresis for improved noise margins.
Multiple power and grounds reduce noise. Typical applications are
clock and signal distribution.
• Very low CMOS power levels
• TTL compatible inputs and outputs
• 1:10 fanout
• Maximum output rise and fall times < 1.5 ns
• Low input capacitance: 2.5 pF typical
The PCK3807A operates from a single 2.5 V or 3.3 V supply voltage
and over the full industrial temperature range of –40 °C to +85 °C.
• V = 2.3 V to 3.6 V
CC
• Overvoltage tolerance on inputs
• Available in SSOP, TSSOP, SO and QSOP packages
• >150 MHz operation
FEATURES
• Low output skew < 120 ps (max)
• Very low duty cycle distortion < 200 ps (max) for V = 2.5 V
CC
ORDERING INFORMATION
PACKAGES
20-Pin Plastic SO
TEMPERATURE RANGE
–40 °C to +85 °C
ORDER CODE
PCK3807AD
DRAWING NUMBER
SOT163-1
SOT339-1
SOT360-1
SOT724-1
20-Pin Plastic SSOP
20-Pin Plastic TSSOP
20-Pin Plastic SSOP (QSOP)
–40 °C to +85 °C
PCK3807ADB
PCK3807APW
PCK3807ADS
–40 °C to +85 °C
–40 °C to +85 °C
FUNCTIONAL BLOCK DIAGRAM
PIN CONFIGURATION
O1
O2
O3
O4
O5
V
1
20
CC
IN
2
3
19 O10
18 O9
GND
O1
V
4
17
16 O8
15
14 O7
GND
CC
5
O2
GND
6
V
CC
O3
7
V
8
13
GND
CC
IN
9
12 O6
O4
O6
O7
GND
10
11
O5
SW00986
PIN DESCRIPTION
O8
O9
Symbol
Pin
Description
IN
1
Clock input
3, 5, 7, 9, 11, 12,
14, 16, 18, 19
O1 to O10
GND
Clock outputs
2, 10, 13, 17
20
Ground
O10
V
CC
Supply voltage
SW00985
2
2004 Aug 27
Philips Semiconductors
Product data sheet
1:10 LVTTL clock distribution device
PCK3807A
1
ABSOLUTE MAXIMUM RATINGS
SYMBOL
DESCRIPTION
MIN
–0.5
–0.5
–0.5
–65
–60
MAX
+4.6
+7
UNIT
V
2
V
V
V
Terminal voltage with respect to GND
Terminal voltage with respect to GND
Terminal voltage with respect to GND
Storage temperature
TERM
TERM
TERM
stg
3
4
V
V
CC
+0.5
V
T
+150
+60
°C
mA
I
O
DC output current
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2. V terminals.
CC
3. Input terminal.
4. Outputs terminals.
CAPACITANCE
T
amb
= +25 °C, f = 1.0 MHz
SYMBOL
PARAMETER
CONDITIONS
TYP
2.5
MAX
UNIT
pF
C
C
Input capacitance
Output capacitance
V
= 0 V
IN
OUT
4
6
i
V
= 0 V
5.5
pF
o
NOTE:
1. This parameter is measured at characterization but not tested.
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
PARAMETER
UNIT
MIN
2.3
0
MAX
V
f
DC supply voltage
3.6
150
+85
50
V
MHz
°C
CC
Input signal frequency
IN
T
amb
Operating free-air temperature range
Output capacitance load
–40
–
C
pF
L
160
140
120
100
LOAD = 15 pF AND 33 Ω
DYNAMIC
CURRENT
(mA)
80
60
40
LOAD = 0
I
DD
20
0
0
50
100
150
200
SW02071
CLOCK FREQUENCY (MHz)
Figure 1. Dynamic current vs. clock frequency, V = 3.3 V
CC
3
2004 Aug 27
Philips Semiconductors
Product data sheet
1:10 LVTTL clock distribution device
PCK3807A
POWER SUPPLY CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
= max; V = V – 0.6 V
MIN
TYP
MAX
30
UNIT
mA
DI
CC
Quiescent power supply current,
TTL inputs HIGH
V
V
–
–
–
3
CC
IN
CC
Outputs open
0.31
1.0
0.45
–
I
Dynamic power supply current
= 2.7 V
mA/MHz
CCD
CC
Input toggling
50% duty cycle
15 pF and 33 Ω load
V
IN
= V or GND
CC
Outputs open
–
–
–
0.5
0.75
–
V
= 3.6 V
CC
15 pF and 33 Ω load
1.5
V
V
= V
= GND
15.5
22.8
I
C
Total power supply current
V
CC
= 2.7 V
mA
IN
CC
Dynamic power supply current
Input toggling
50% duty cycle
Outputs open
IN
f = 50 MHz
i
V
V
= V
= GND
–
50
75
IN
CC
IN
f = 150 MHz
i
f = 50 MHz
–
–
25
75
37
V
CC
= 3.6 V
i
f = 150 MHz
i
115
NOTES:
1. For conditions shown as Max or Min, use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at V = 3.3 V, +25°C ambient.
CC
3. Per TTL driven input (V = V – 0.6 V).
IN
CC
4. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
5. Values for these conditions are examples of the Ic formula. These limits are guaranteed but not tested.
6. I = I
+ I
+ I
C
QUIESCENT INPUTS
DYNAMIC
I
I
= I + Dl D N + I
(fi)
C
CC
CC
H
T
CCD
= Quiescent Current (I
, I
and I
)
CC
CCL CCH
CCZ
Dlcc = Power Supply Current for a TTL High Input (V = V – 0.6 V)
IN
CC
DH = Duty Cycle for TTL Inputs High
N = Number of TTL Inputs at D
T
H
I
= Dynamic Current Caused by an Input Transition Pair (HLH or LHL)
CCD
f = Input Frequency
i
All currents are in milliamps and all frequencies are in MHz
4
2004 Aug 27
Philips Semiconductors
Product data sheet
1:10 LVTTL clock distribution device
PCK3807A
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE
T
amb
= –40 °C to +85 °C, V = 3.3 V ± 0.3 V, unless otherwise specified
CC
1
SYMBOL
PARAMETER
TEST CONDITIONS
= 3.0 V to 3.6 V
MIN
TYP
MAX
5.5
UNIT
HIGH-level input voltage (Input pins)
HIGH-level input voltage (I/O pins)
LOW-level input voltage (Input pins)
LOW-level input voltage (I/O pins)
HIGH-level input current (Input pins)
HIGH-level input current (I/O pins)
V
V
V
V
V
2
–
–
–
–
–
–
–
–
V
IH
V
CC
CC
CC
CC
CC
= 2.3 V to 2.7 V
= 3.0 V to 3.6 V
= 2.3 V to 2.7 V
= Max
1.7
3.6
0.8
0.7
± 1
± 1
± 1
± 1
–1.0
–150
200
–
–0.5
–0.5
–
V
I
V
IL
V = 5.5 V
mA
mA
I
IH
V = V
I
–
CC
LOW-level input current (Input pins)
LOW-level input current (I/O pins)
Clamp diode voltage
V = GND
–
I
IL
V
CC
= Max
I
V = GND
–
I
V
IK
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
–
= Min; I = –18 mA
–
–0.7
–120
150
–
V
IN
3
3
I
HIGH-level input current
= 3.3 V; V = V or V ; Vo =1.5 V
–36
50
mA
mA
V
ODH
ODL
IN
IH
IL
I
LOW-level input current
= 3.3 V; V = V or V ; Vo =1.5 V
IN
IH
IL
= 2.3 V to 3.6 V
I
I
I
I
I
I
I
= –0.1 mA
V
– 0.2
V
HIGH-level output voltage
OH
OH
OH
OL
OL
OL
OL
CC
OH
OL
= 2.3 V
= –8 mA
= –8 mA
= 0.1 mA
= 8 mA
1.9
–
–
6
= 3.0 V
2.4
3
–
= 2.3 V to 3.6 V
= 2.3 V
–
–
–
–
–
0
–
–
–
0.2
0.3
0.4
0.5
± 1
–240
–
V
LOW-level output voltage
V
–
= 3.0 V
= 16 mA
= 24 mA
0.2
0.3
–
= 3.0 V
I
Input power off leakage
= 0 V; V = 4.5 V
mA
OFF
IN
5
4
l
Short circuit current
= Max; V = GND
–155
150
0.1
mA
mV
mA
OS
O
V
hys
Input hysteresis
I
I
Quiescent power supply current
V
V
= Max
10
CCL
CCH
CC
= GND or V
IN
CC
NOTES:
1. For conditions shown as Max or Min, use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at V = 3.3 V, +25 °C ambient.
CC
3. Duration of the test should not exceed one second.
4. Not more than one output shorted at one time. Duration of the test should not exceed one second.
5. This parameter is guaranteed but not tested.
6. V = V – 0.6 V at rated current.
OH
CC
5
2004 Aug 27
Philips Semiconductors
Product data sheet
1:10 LVTTL clock distribution device
PCK3807A
3,4
SWITCHING CHARACTERISTICS OVER OPERATING RANGE – INDUSTRIAL
T
= –40 °C to +85 °C, V = 3.3 V ± 0.3 V, unless otherwise specified
amb
CC
2.5 V ± 0.2 V
3.3 V ± 0.3 V
1
SYMBOL
PARAMETER
CONDITIONS
UNIT
ns
2
2
MIN
MAX
2.7
MIN
1.3
MAX
2.5
t
Propagation delay
1.5
50 W to V /2; C = 10 pF
PLH
PHL
CC
L
t
t
t
t
(See Figure 2)
Output rise time
Output fall time
–
–
–
1.0
1.0
ns
ns
ns
–
R
or
1.0
1.0
F
50 W AC termination;
C = 10 pF (See Figure 3);
Output skew: skew between outputs of same
package (same transition)
0.12
–
–
–
0.12
SK(o)
L
t
Pulse skew: skew between opposite transitions
–
–
0.3
0.6
0.45
0.6
ns
ns
f ≤ 150 MHz; Outputs
connected in groups of two
SK(p)
SK(t)
of same output (|t
–t
|)
PHL PLH
t
Package skew: skew between outputs of different
packages at same power supply voltage,
temperature, package type and speed grade
t
t
Propagation delay
1.5
3.5
1.5
3
ns
50 W to V /2; C = 22 pF
(See Figure 2)
PLH
PHL
CC
L
t
t
t
Output rise time
Output fall time
–
–
–
1.0
–
–
–
1.0
ns
ns
ns
R
or
1.0
1.0
F
50 W AC termination;
C = 22 pF (See Figure 3);
L
Output skew: skew between outputs of same
package (same transition)
0.12
0.12
SK(o)
t
t
Pulse skew: skew between opposite transitions
–
–
0.3
0.6
–
–
0.45
0.6
ns
ns
f ≤ 150 MHz; Outputs
connected in groups of two
SK(p)
SK(t)
of same output (|t
–t
|)
PHL PLH
Package skew: skew between outputs of different
packages at same power supply voltage,
temperature, package type and speed grade
t
t
Propagation delay
1.5
4.0
1.5
4
ns
C = 30 pF; f ≤ 67 MHz
(See Figure 4)
PLH
PHL
L
t
t
t
Output rise time
Output fall time
–
–
–
1.0
–
–
–
1.0
ns
ns
ns
R
1.0
1.0
F
Output skew: skew between outputs of same
package (same transition)
0.35
0.35
SK(o)
t
Pulse skew: skew between opposite transitions
–
–
0.35
1.0
–
–
0.35
0.75
ns
ns
SK(p)
SK(t)
of same output (|t
–t
|)
PHL PLH
t
Package skew: skew between outputs of different
packages at same power supply voltage,
temperature, package type and speed grade
t
f
RMS jitter
–
1.0
400
4.5
–
1.0
400
4.0
ps
jitter
Maximum output frequency
Propagation delay
Functional to 400 MHz
–
–
MHz
ns
MAX
t
t
1.5
1.5
C = 50 pF; f ≤ 40 MHz
PLH
PHL
L
(See Figure 5)
t
t
t
Output rise time
Output fall time
–
–
–
1.5
–
–
–
1.5
ns
ns
ns
R
1.5
1.5
F
Output skew: skew between outputs of same
package (same transition)
0.35
0.35
SK(o)
t
Pulse skew: skew between opposite transitions
–
–
0.75
1
–
–
0.75
0.75
ns
ns
SK(P)
SK(T)
of same output (|t
–t
|)
PHL PLH
t
Package skew: skew between outputs of different
packages at same power supply voltage,
temperature, package type and speed grade
NOTES:
1. See test circuits and waveforms.
2. Minimum limits are guaranteed but not tested on Propagation Delays.
3. t , t , t are production tested. All other parameters guaranteed but not production tested.
PLH PHL SK(t)
4. Propagation delay range indicated by Min and Max limit is due to V , operating temperature and process parameters. These propagation
CC
delay limits do not imply skew.
6
2004 Aug 27
Philips Semiconductors
Product data sheet
1:10 LVTTL clock distribution device
PCK3807A
TEST CIRCUITS
VCC
VCC
VCC
Ω
100
VIN
V OUT
VIN
V OUT
PULSE
GENERATOR
PULSE
GENERATOR
D.U.T.
D.U.T.
50 Ω
Ω
100
10 pF
10 pF
RT
RT
220 pF
SW00976
SW00975
Figure 2. Z = 50 W TO V /2, C = 10 pF
The capacitor value for ac termination is determined by the
operating frequency. For very low frequencies a higher capacitor
value should be selected.
O
CC
L
Figure 3. Z = 50 W AC termination, C = 10 pF
O
L
V
V
CC
CC
V
OUT
V
OUT
V
V
IN
IN
PULSE
GENERATOR
D.U.T.
PULSE
GENERATOR
D.U.T.
C
30 pF
L
C
L
R
T
R
T
50 pF
SW00977
SW00978
Figure 4. C = 30 pF circuit
Figure 5. C = 50 pF circuit
L
L
7
2004 Aug 27
Philips Semiconductors
Product data sheet
1:10 LVTTL clock distribution device
PCK3807A
TIMING DIAGRAMS
V
V
I
V
V
I
M
0 V
M
INPUT
tPLH1
tPHL1
V
INPUT
OH
0V
tPLH
tPHL
V
V
M
V
OL
OUTPUT
1
2
OH
V
V
IH
IL
SK(o)
t
tSK(o)
V
V
V
OH
M
OUTPUT
OUTPUT
OL
tPLH2
tPHL2
tF
SW00980
tR
=
PHL2 –
–
tSK(o)
|tPLH2
tPLH1 or |t
tPHL1
|
|
SW00981
Figure 6. Package delay (see Table 1)
Figure 7. Output skew – t
(see Table 1)
SK(O)
V
V
I
V
I
M
0 V
V
M
INPUT
tPHL1
tPLH1
V
0 V
OH
INPUT
V
V
M
tPHL
tPLH
V
V
V
OH
M
OL
PACKAGE 1 OUTPUT
PACKAGE 2 OUTPUT
tSK(t)
tSK(t)
V
V
V
OH
M
OUTPUT
OL
OL
tPLH2
tPHL2
=
tSK(p)
|tPHL
–
tPLH |
–
tSK(t)
PLH2
tPLH1 | or |tPHL2
–
tPHL1 |
= |t
SW00982
SW00983
Figure 8. Pulse skew – t
(see Table 1)
Figure 9. Package skew – t
(see Table 1)
SK(p)
SK(y)
Table 1. Reference levels
Reference level
For V = 3.3 ± 0.3 V
V
V
M
I
3.0 V
1.5 V
/2
CC
For V = 2.5 ± 0.2 V
V
CC
V
CC
CC
8
2004 Aug 27
Philips Semiconductors
Product data sheet
1:10 LVTTL clock distribution device
PCK3807A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
9
2004 Aug 27
Philips Semiconductors
Product data sheet
1:10 LVTTL clock distribution device
PCK3807A
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
10
2004 Aug 27
Philips Semiconductors
Product data sheet
1:10 LVTTL clock distribution device
PCK3807A
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
11
2004 Aug 27
Philips Semiconductors
Product data sheet
1:10 LVTTL clock distribution device
PCK3807A
SSOP20: plastic shrink small outline package; 20 leads;
body width 3.9 mm; lead pitch 0.635 mm
SOT724-1
12
2004 Aug 27
Philips Semiconductors
Product data sheet
1:10 LVTTL clock distribution device
PCK3807A
REVISION HISTORY
Rev
Date
Description
_2
20040827
Product data sheet (9397 750 14007). Supersedes data of 2003 Jun 27 (9397 750 11683).
Modifications:
• Recommended Operating Conditions table on page 3: change V Min. limit from 2.5 V to 2.3 V.
CC
_1
20030627
Product data (9397 750 11683); ECN 853-2431 30019 dated 18 June 2003. Initial version
Data sheet status
Product
status
Definitions
[1]
Level
Data sheet status
[2] [3]
I
Objective data
Development
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
Production
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limitingvaluesdefinition— Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated
viaaCustomerProduct/ProcessChangeNotification(CPCN).PhilipsSemiconductorsassumesnoresponsibilityorliabilityfortheuseofanyoftheseproducts,conveys
nolicenseortitleunderanypatent, copyright, ormaskworkrighttotheseproducts, andmakesnorepresentationsorwarrantiesthattheseproductsarefreefrompatent,
copyright, or mask work right infringement, unless otherwise specified.
Koninklijke Philips Electronics N.V. 2004
Contact information
All rights reserved. Printed in U.S.A.
For additional information please visit
http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
Date of release: 08-04
9397 750 14007
For sales offices addresses send e-mail to:
sales.addresses@www.semiconductors.philips.com.
Document order number:
Philips
Semiconductors
相关型号:
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