PCA9519BS [NXP]
4-channel level translating I2C-bus/SMBus repeater; 4通道电平转换I2C总线/ SMBus的中继
| 型号： | PCA9519BS |
| 厂家： | 
NXP |
| 描述： | 4-channel level translating I2C-bus/SMBus repeater |
| 文件： | 总17页 (文件大小：109K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PCA9519
4-channel level translating I2C-bus/SMBus repeater
Rev. 01 — 22 June 2006
Objective data sheet
1. General description
The PCA9519 is a 4-channel level translating I2C-bus/SMBus repeater that enables the
processor low voltage 2-wire serial bus to interface with standard I2C-bus or SMBus I/O.
While retaining all the operating modes and features of the I2C-bus system during the
level shifts, it also permits extension of the I2C-bus by providing bidirectional buffering for
both the data (SDA) and the clock (SCL) lines, thus enabling the I2C-bus or SMBus
maximum capacitance of 400 pF on the higher voltage side. The SDA and SCL pins are
over-voltage tolerant and are high-impedance when the PCA9519 is unpowered.
The port B drivers are compliant with SMBus I/O levels, while port A uses a current
sensing mechanism to detect the input or output LOW signal which prevents bus lock-up.
The port A uses a 1 mA current source for pull-up and a 200 Ω pull-down driver. This
results in a LOW on port A accommodating smaller voltage swings. The output pull-down
on the port A internal buffer LOW is set for approximately 0.2 V, while the input threshold
of the internal buffer is set about 50 mV lower than that of the output voltage LOW. When
the port A I/O is driven LOW internally, the LOW is not recognized as a LOW by the input.
This prevents a lock-up condition from occurring. The output pull-down on the port B
drives a hard LOW and the input level is set at 0.3 of SMBus or I2C-bus voltage level
which enables port B to connect to any other I2C-bus device or buffer.
The PCA9519 drivers are not enabled unless VCC(A) is above 0.8 V and VCC(B) is above
2.5 V. The enable (EN) pin can also be used to turn the drivers on and off under system
control. Caution should be observed to only change the state of the EN pin when the bus
is idle.
2. Features
I 4-channel (4 SCL/SDA pairs), bidirectional buffer isolates capacitance and allows
400 pF on port B of the device
I Voltage level translation from port A (1 V to VCC(B) − 1 V) to port B (3.0 V to 5.5 V)
I Requires no external pull-up resistors on lower voltage port A
I Active HIGH repeater enable input
I Open-drain inputs/outputs
I Lock-up free operation
I Supports arbitration and clock stretching across the repeater
I Accommodates Standard-mode and Fast-mode I2C-bus devices and multiple masters
I Powered-off high-impedance I2C-bus pins
I Operating supply voltage range of 1.0 V to VCC(B) − 1 V on port A, 3.0 V to 5.5 V on
port B
I 5 V tolerant B-side SCL and SDA and enable pins
PCA9519
Philips Semiconductors
4-channel level translating I2C-bus/SMBus repeater
I 0 Hz to 400 kHz clock frequency
Remark: The maximum system operating frequency may be less than 400 kHz
because of the delays added by the repeater.
I ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
I Packages offered: TSSOP20, HVQFN24
3. Ordering information
Table 1.
Ordering information
Type number Topside
mark
Package
Name
Description
Version
PCA9519PW PCA9519 TSSOP20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1
PCA9519BS 9519
HVQFN24 plastic thermal enhanced very thin quad flat package; no leads;
SOT616-1
24 terminals; body 4 × 4 × 0.85 mm
4. Functional diagram
V
V
CC(A)
CC(B)
V
V
PCA9519
CC(A)
1 mA
A1
A2
B1
B2
CC(A)
1 mA
V
CC(A)
1 mA
A8
B8
EN
002aab643
GND
Fig 1. Functional diagram of PCA9519
PCA9519_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2006
2 of 17
PCA9519
Philips Semiconductors
4-channel level translating I2C-bus/SMBus repeater
5. Pinning information
5.1 Pinning
terminal 1
index area
1
2
20
19
18
17
16
15
14
13
12
11
EN
B1
V
CC(B)
A1
A2
A3
A4
A5
A6
A7
A8
1
2
3
4
5
6
18
17
16
15
14
13
A2
A3
A4
A5
A6
A7
B2
B3
B4
B5
B6
B7
3
B2
4
B3
PCA9519BS
5
B4
PCA9519PW
6
B5
7
B6
8
B7
9
B8
002aab641
10
GND
V
CC(A)
002aab640
Transparent top view
Fig 2. Pin configuration for TSSOP20
Fig 3. Pin configuration for HVQFN24
5.2 Pin description
Table 2.
Symbol
Pin description
Pin
TSSOP20 HVQFN24
Description
EN
GND
VCC(A)
A1
1
11
22[1]
23
24
1
enable input (active HIGH)
ground (0 V)
10
11
19
18
17
16
15
14
13
12
20
9
port A power supply
A1 port (low voltage side)[2]
A2 port (low voltage side)[2]
A3 port (low voltage side)[2]
A4 port (low voltage side)[2]
A5 port (low voltage side)[2]
A6 port (low voltage side)[2]
A7 port (low voltage side)[2]
A8 port (low voltage side)[2]
port B power supply
B8 port (SMBus/I2C-bus side)[2]
B7 port (SMBus/I2C-bus side)[2]
B6 port (SMBus/I2C-bus side)[2]
B5 port (SMBus/I2C-bus side)[2]
B4 port (SMBus/I2C-bus side)[2]
B3 port (SMBus/I2C-bus side)[2]
A2
A3
2
A4
3
A5
4
A6
5
A7
6
A8
7
VCC(B)
B8
10
12
13
14
15
16
17
B7
8
B6
7
B5
6
B4
5
B3
4
PCA9519_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2006
3 of 17
PCA9519
Philips Semiconductors
4-channel level translating I2C-bus/SMBus repeater
Table 2.
Symbol
Pin description …continued
Pin
Description
TSSOP20 HVQFN24
B2
3
2
-
18
19
B2 port (SMBus/I2C-bus side)[2]
B1 port (SMBus/I2C-bus side)[2]
B1
n.c.
8, 9, 20, 21
not connected
[1] HVQFN package die supply ground is connected to both the GND pin and the exposed center pad. The
GND pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical,
and board-level performance, the exposed pad needs to be soldered to the board using a corresponding
thermal pad on the board, and for proper heat conduction through the board thermal vias need to be
incorporated in the PCB in the thermal pad region.
[2] Port A and port B can be used for either SCL or SDA.
6. Functional description
Refer to Figure 1 “Functional diagram of PCA9519”.
The PCA9519 enables I2C-bus or SMBus translation down to VCC(A) as low as 1.0 V
without degradation of system performance. The PCA9519 contains 8 bidirectional
open-drain buffers specifically designed to support up-translation/down-translation
between the low voltage and 3.3 V SMBus or 5 V I2C-bus. Port B I/Os are over-voltage
tolerant to 5.5 V even when the device is unpowered.
The PCA9519 includes a power-up circuit that keeps the output drivers turned off until
VCC(B) is above 2.5 V and the VCC(A) is above 0.8 V. VCC(B) and VCC(A) can be applied in
any sequence at power-up. After power-up and with the EN pin HIGH, a LOW level on the
port A (below approximately 0.15 V) turns the corresponding port B driver (either SDA or
SCL) on and drives the port B down to about 0 V. When port A rises above approximately
0.15 V, the port B pull-down driver is turned off and the external pull-up resistor pulls the
pin HIGH. When the port B falls first and goes below 0.3VCC(B), the port A driver is turned
on and the port A pulls down to 0.2 V (typical). The port B pull-down is not enabled unless
the port A voltage goes below VILc. If the port A low voltage goes below VILc, the port B
pull-down driver is enabled until the port A rises above approximately 0.15 V (VILc), then
the port B, if not externally driven LOW, will continue to rise being pulled up by the
external pull-up resistor.
Remark: Ground offset between the PCA9519 ground and the ground of devices on
port A of the PCA9519 must be avoided.
The reason for this cautionary remark is that a CMOS/NMOS open-drain capable of
sinking 3 mA of current at 0.4 V will have an output resistance of 133 Ω or less (R = E / I).
Such a driver will share enough current with the port A output pull-down of the PCA9519
to be seen as a LOW as long as the ground offset is zero. If the ground offset is greater
than 0 V, then the driver resistance must be less. Since VILc can be as low as 90 mV at
cold temperatures and the low end of the current distribution, the maximum ground offset
should not exceed 50 mV.
Bus repeaters that use an output offset are not interoperable with port A of the PCA9519
as their output LOW levels will not be recognized by the PCA9519 as a LOW. If the
PCA9519 is placed in an application where the VIL of the port A of the PCA9519 does not
PCA9519_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2006
4 of 17
PCA9519
Philips Semiconductors
4-channel level translating I2C-bus/SMBus repeater
go below its VILc it will pull the port B LOW initially when the port A input transitions LOW
but port B will return HIGH, so it will not reproduce the port A input on port B. Such
applications should be avoided.
Port B is interoperable with all I2C-bus slaves, masters, and repeaters.
6.1 Enable
The EN pin is active HIGH and allows the user to select when the repeater is active. This
can be used to isolate a badly behaved slave on power-up until after the system power-up
reset. It should never change state during an I2C-bus operation because disabling during
a bus operation will hang the bus and enabling part way through a bus cycle could
confuse the I2C-bus parts being enabled.
The enable pin should only change state when the bus and the repeater port are in an idle
state to prevent system failures.
6.2 I2C-bus systems
As with the standard I2C-bus system, pull-up resistors are required to provide the logic
HIGH levels on the buffered bus (standard open-collector configuration of the I2C-bus).
The size of these pull-up resistors depends on the system. Each of the port A I/Os has an
internal pull-up current source and does not require the external pull-up resistor. The
port B is designed to work with Standard mode and Fast mode I2C-bus devices in addition
to SMBus devices. Standard mode I2C-bus devices only specify 3 mA output drive; this
limits the termination current to 3 mA in a generic I2C-bus system where Standard mode
devices and multiple masters are possible. Under certain conditions higher termination
currents can be used.
7. Application design-in information
A typical application is shown in Figure 4. In this example, the CPU is running on a 1.1 V
I2C-bus while the master is connected to a 3.3 V bus. Both buses run at 400 kHz. Master
devices can be placed on either bus.
1.1 V
3.3 V
10 kΩ
10 kΩ
V
V
CC(B)
CC(A)
A1
B1
SDA
SCL
SDA
SCL
A2
B2
PCA9519
1.1 V
CPU
MASTER
400 kHz
10 kΩ
A8
B8
EN
bus A
bus B
002aab642
Fig 4. Typical application
PCA9519_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2006
5 of 17
PCA9519
Philips Semiconductors
4-channel level translating I2C-bus/SMBus repeater
When port B of the PCA9519 is pulled LOW by a driver on the I2C-bus, a CMOS
hysteresis detects the falling edge when it goes below 0.3VCC(B) and causes the internal
driver on port A to turn on, causing port A to pull down to about 0.2 V. When port A of the
PCA9519 falls, first a comparator detects the falling edge and causes the internal driver
on port B to turn on and pull the port B pin down to ground. In order to illustrate what
would be seen in a typical application, refer to Figure 5 and Figure 6. If the bus master in
Figure 4 were to write to the slave through the PCA9519, waveforms shown in Figure 5
would be observed on the B bus. This looks like a normal I2C-bus transmission.
On the port A bus of the PCA9519, the clock and data lines would have a positive offset
from ground equal to the VOL of the PCA9519. After the 8th clock pulse, the data line will
be pulled to the VOL of the master device, which is very close to ground in this example. At
the end of the acknowledge, the level rises only to the LOW level set by the driver in the
PCA9519 for a short delay while the port B bus rises above 0.5VCC(B), then it continues
HIGH. It is important to note that any arbitration or clock stretching events require that the
LOW level on the port A bus at the input of the PCA9519 (VIL) is below VILc to be
recognized by the PCA9519 and then transmitted to the port B bus.
9th clock pulse
acknowledge
SCL
SDA
002aab644
Fig 5. Bus B SMBus/I2C-bus waveform
9th clock pulse
acknowledge
SCL
SDA
V
of PCA9519
OL
002aab645
V
of master
OL
Fig 6. Bus A lower voltage waveform
PCA9519_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2006
6 of 17
PCA9519
Philips Semiconductors
4-channel level translating I2C-bus/SMBus repeater
8. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCC(B)
VCC(A)
VI/O
Parameter
Conditions
Min
−0.5
−0.5
−0.5
−0.5
-
Max
+6
Unit
V
supply voltage port B
supply voltage port A
voltage on an input/output pin
+6
V
port A
+6
V
port B; enable pin (EN)
+6
V
II/O
II
input/output current
input current
±20
±20
100
+150
+85
125
300
mA
mA
mW
°C
°C
°C
°C
-
Ptot
Tstg
Tamb
Tj
total power dissipation
storage temperature
ambient temperature
junction temperature
solder point temperature
-
−65
−40
-
operating in free air
10 s max.
Tsp
-
9. Static characteristics
Table 4.
Static characteristics
GND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol Parameter
Supplies
Conditions
Min
Typ[1] Max
Unit
VCC(B)
VCC(A)
ICC(A)
supply voltage port B
3.0
1.0
1
-
5.5
V
supply voltage port A
supply current port A
-
VCC(B) − 1
V
all port A static HIGH
all port A static LOW
all port B static HIGH
2.1
11.6
3.3
3.6
20
4.5
mA
mA
mA
5
ICC(B)
supply current port B
2
Input and output of port A (A1 to A8)
VIH
VIL
VILc
VIK
ILI
HIGH-level input voltage
LOW-level input voltage
contention LOW-level input voltage
input clamping voltage
port A
port A
0.7VCC(A)
-
VCC(A)
+0.3
-
V
[2]
[2]
−0.5
−0.5
−1.5
-
-
V
+0.15
V
IL = −18 mA
-
−0.5
±1
V
input leakage current
VI = VCC(A)
-
µA
mA
V
[3]
[4]
[5]
IIL
LOW-level input current
LOW-level output voltage
−1.5
-
−1
0.2
50
−0.45
0.35
-
VOL
VOL−VILc difference between LOW-level output and port A
-
mV
LOW-level input voltage contention
ILOH
Cio
HIGH-level output leakage current
input/output capacitance
VO = 1.1 V
-
-
-
10
7
µA
6
pF
PCA9519_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2006
7 of 17
PCA9519
Philips Semiconductors
4-channel level translating I2C-bus/SMBus repeater
Table 4.
Static characteristics …continued
GND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ[1] Max
Unit
Input and output of port B (B1 to B8)
VIH
HIGH-level input voltage
LOW-level input voltage
input clamping voltage
0.7VCC(B)
-
VCC(B)
V
VIL
−0.5
-
+0.3VCC(B)
V
VIK
IL = −18 mA
VI = 3.6 V
VI = 0.2 V
IOL = 6 mA
VO = 3.6 V
−1.5
-
−0.5
+1.0
10
V
ILI
input leakage current
−1.0
-
µA
µA
V
IIL
LOW-level input current
LOW-level output voltage
HIGH-level output leakage current
input/output capacitance
-
-
-
-
-
VOL
ILOH
Cio
0.1
-
0.2
10
µA
pF
6
7
Enable
VIL
LOW-level input voltage
−0.5
-
-
-
0.1VCC(A)
VCC(B)
+1
V
VIH
HIGH-level input voltage
0.9VCC(A)
−1
V
IIL(EN)
LOW-level input current on pin EN
VI = 0.2 V, EN;
µA
VCC = 3.6 V
ILI
Ci
input leakage current
input capacitance
−1
-
+1
3
µA
VI = 3.0 V or 0 V
-
2
pF
[1] Typical values with VCC(A) = 1.1 V, VCC(B) = 5.0 V.
[2] VIL specification is for the falling edge seen by the port A input. VILc is for the static LOW levels seen by the port A input resulting in
port B output staying LOW.
[3] The port A current source has a typical value of about 1 mA, but varies with both VCC(A) and VCC(B). Below VCC(A) of about 0.7 V the
port A current source current drops to 0 mA. The current source current dropping across the internal pull-down driver resistance of
about 200 Ω defines the VOL
.
[4] As long as the chip ground is common with the input ground reference the driver resistance may be as large as 120 Ω. However, ground
offset will rapidly decrease the maximum allowed driver resistance.
[5] Guaranteed by design.
PCA9519_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2006
8 of 17
PCA9519
Philips Semiconductors
4-channel level translating I2C-bus/SMBus repeater
10. Dynamic characteristics
Table 5.
Dynamic characteristics
Symbol Parameter
Conditions
Min
Typ
Max
Unit
VCC(A) = 1.1 V; VCC(B) = 3.3 V
[1]
[1]
[1]
[1]
[1]
[1]
tPLH
tPHL
tTLH
tTHL
tPLH
tPLH2
LOW-to-HIGH propagation delay
port B to port A
port B to port A
port A
69
63
14
5
109
86
216
140
96
ns
ns
ns
ns
HIGH-to-LOW propagation delay
LOW to HIGH output transition time
HIGH to LOW output transition time
LOW-to-HIGH propagation delay
LOW to HIGH propagation delay 2
22
port A
8.1
−91
153
16
port A to port B
−69
91
−139 ns
port A to port B; measured from
the 50 % of initial LOW on port A to
1.5 V rising on port B
226
ns
[1]
[1][2]
[1]
tPHL
tTLH
tTHL
tsu
HIGH-to-LOW propagation delay
LOW to HIGH output transition time
HIGH to LOW output transition time
setup time
port A to port B
73
-
122
61
24
-
183
ns
ns
ns
ns
ns
port B
-
port B
15
100
100
40
-
EN HIGH before START condition
EN HIGH after STOP condition
th
hold time
-
-
VCC(A) = 1.9 V; VCC(B) = 5.0 V
[1]
[1]
[1]
[1]
[1]
[1]
tPLH
tPHL
tTLH
tTHL
tPLH
tPLH2
LOW-to-HIGH propagation delay
port B to port A
port B to port A
port A
69
63
14
5
105
86
216
140
96
ns
ns
ns
ns
HIGH-to-LOW propagation delay
LOW to HIGH output transition time
HIGH to LOW output transition time
LOW-to-HIGH propagation delay
LOW to HIGH propagation delay 2
27
port A
8
35
port A to port B
−69
91
−89
131
−139 ns
port A to port B; measured from
the 50 % of initial LOW on port A to
1.5 V rising on port B
226
ns
[1]
[1][2]
[1]
tPHL
tTLH
tTHL
tsu
HIGH-to-LOW propagation delay
LOW to HIGH output transition time
HIGH to LOW output transition time
setup time
port A to port B
73
-
99
65
31
-
183
ns
ns
ns
ns
ns
port B
-
port B
15
100
100
40
-
EN HIGH before START condition
EN HIGH after STOP condition
th
hold time
-
-
[1] Load capacitance = 50 pF; load resistance on port B = 1.35 kΩ.
[2] Value is determined by RC time constant of bus line.
PCA9519_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2006
9 of 17
PCA9519
Philips Semiconductors
4-channel level translating I2C-bus/SMBus repeater
10.1 AC waveforms
V
V
CC(A)
CC(B)
input
0.5V
PHL
0.5V
input
0.5V
PHL
0.5V
CC(A)
CC(B)
CC(B)
CC(A)
0.5V
0.1 V
t
t
t
t
PLH
PLH
V
V
V
CC(B)
CC(A)
OL
70 %
70 %
70 %
70 %
0.5V
CC(B)
0.5V
CC(B)
0.5V
30 %
output
CC(A)
30 %
output
CC(A)
30 %
30 %
t
t
t
t
TLH
THL
TLH
THL
002aab646
002aab647
Fig 7. Propagation delay and transition times;
port B to port A
Fig 8. Propagation delay and transition times;
port A to port B
input
port A
50 % of initial value
0.5V
CC(B)
output
port B
t
PLH2
002aab648
Fig 9. Propagation delay from port A’s external driver switching off to the port B LOW-to-HIGH transition;
port A to port B
11. Test information
V
CC(B)
V
CC(A)
CC(B)
V
R
L
V
V
O
I
PULSE
GENERATOR
DUT
C
L
R
T
002aab649
RL = load resistor; 1.35 kΩ on port B
CL = load capacitance includes jig and probe capacitance; 50 pF
RT = termination resistance should be equal to Zo of pulse generators
Fig 10. Test circuit for open-drain outputs
PCA9519_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2006
10 of 17
PCA9519
Philips Semiconductors
4-channel level translating I2C-bus/SMBus repeater
12. Package outline
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
D
E
A
X
c
H
v
M
A
y
E
Z
11
20
Q
A
2
(A )
3
A
A
1
pin 1 index
θ
L
p
L
1
10
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.5
0.2
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT360-1
MO-153
Fig 11. Package outline SOT360-1 (TSSOP20)
PCA9519_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2006
11 of 17
PCA9519
Philips Semiconductors
4-channel level translating I2C-bus/SMBus repeater
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
SOT616-1
B
A
D
terminal 1
index area
A
A
1
E
c
detail X
e
1
C
1/2 e
y
y
C
1
e
v
M
M
C
C
A
B
b
7
12
w
L
13
6
e
e
E
h
2
1/2 e
1
18
terminal 1
index area
24
19
X
D
h
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
mm
A
b
c
E
e
e
e
2
y
D
D
E
L
v
w
y
1
1
h
1
h
max.
0.05 0.30
0.00 0.18
4.1
3.9
2.25
1.95
4.1
3.9
2.25
1.95
0.5
0.3
0.05
0.1
1
0.2
0.5
2.5
2.5
0.1 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
01-08-08
02-10-22
SOT616-1
- - -
MO-220
- - -
Fig 12. Package outline SOT616-1 (HVQFN24)
PCA9519_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2006
12 of 17
PCA9519
Philips Semiconductors
4-channel level translating I2C-bus/SMBus repeater
13. Soldering
13.1 Introduction to soldering surface mount packages
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
13.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow temperatures range from 215 °C to 260 °C depending on solder paste
material. The peak top-surface temperature of the packages should be kept below:
Table 6.
SnPb eutectic process - package peak reflow temperatures (from J-STD-020C
July 2004)
Package thickness
< 2.5 mm
Volume mm3 < 350
240 °C + 0/−5 °C
225 °C + 0/−5 °C
Volume mm3 ≥ 350
225 °C + 0/−5 °C
225 °C + 0/−5 °C
≥ 2.5 mm
Table 7.
Pb-free process - package peak reflow temperatures (from J-STD-020C July
2004)
Package thickness
Volume mm3 < 350
Volume mm3 350 to
2000
Volume mm3 > 2000
< 1.6 mm
260 °C + 0 °C
260 °C + 0 °C
250 °C + 0 °C
260 °C + 0 °C
250 °C + 0 °C
245 °C + 0 °C
260 °C + 0 °C
245 °C + 0 °C
245 °C + 0 °C
1.6 mm to 2.5 mm
≥ 2.5 mm
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
PCA9519_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2006
13 of 17
PCA9519
Philips Semiconductors
4-channel level translating I2C-bus/SMBus repeater
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C
or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
13.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270 °C and 320 °C.
13.5 Package related soldering information
Table 8.
Package[1]
Suitability of surface mount IC packages for wave and reflow soldering methods
Soldering method
Wave
Reflow[2]
BGA, HTSSON..T[3], LBGA, LFBGA, SQFP,
SSOP..T[3], TFBGA, VFBGA, XSON
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable[4]
suitable
PLCC[5], SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended[5][6]
not recommended[7]
not suitable
suitable
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L[8], PMFP[9], WQCCN..L[8]
suitable
not suitable
[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales office.
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
PCA9519_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2006
14 of 17
PCA9519
Philips Semiconductors
4-channel level translating I2C-bus/SMBus repeater
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
14. Abbreviations
Table 9.
Abbreviations
Description
Acronym
CDM
CMOS
CPU
Charged Device Model
Complementary Metal Oxide Semiconductor
Central Processing Unit
Device Under Test
DUT
ESD
ElectroStatic Discharge
Human Body Model
HBM
I/O
Input/Output
I2C-bus
Inter-Integrated Circuit Bus
Machine Model
MM
NMOS
RC
Negative-channel Metal Oxide Semiconductor
Resistor Capacitor network
System Management Bus
SMBus
15. Revision history
Table 10. Revision history
Document ID
Release date
20060622
Data sheet status
Change notice
Supersedes
PCA9519_1
Objective data sheet
-
-
PCA9519_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2006
15 of 17
PCA9519
Philips Semiconductors
4-channel level translating I2C-bus/SMBus repeater
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.semiconductors.philips.com.
to result in personal injury, death or severe property or environmental
16.2 Definitions
damage. Philips Semiconductors accepts no liability for inclusion and/or use
of Philips Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Philips Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Philips Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and and
operation of the device at these or any other conditions above those given in
the Characteristics sections of this document is not implied. Exposure to
limiting values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Philips Semiconductors
sales office. In case of any inconsistency or conflict with the short data sheet,
the full data sheet shall prevail.
Terms and conditions of sale — Philips Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.semiconductors.philips.com/profile/terms, including those
pertaining to warranty, intellectual property rights infringement and limitation
of liability, unless explicitly otherwise agreed to in writing by Philips
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, Philips Semiconductors does not give any representations
or warranties, expressed or implied, as to the accuracy or completeness of
such information and shall have no liability for the consequences of use of
such information.
Semiconductors. In case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — Philips Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — Philips Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a Philips Semiconductors product can reasonably be expected
I2C-bus — logo is a trademark of Koninklijke Philips Electronics N.V.
17. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
PCA9519_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2006
16 of 17
PCA9519
Philips Semiconductors
4-channel level translating I2C-bus/SMBus repeater
18. Contents
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
6.1
6.2
Functional description . . . . . . . . . . . . . . . . . . . 4
Enable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
I2C-bus systems . . . . . . . . . . . . . . . . . . . . . . . . 5
7
Application design-in information . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . 10
Test information. . . . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
8
9
10
10.1
11
12
13
13.1
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14
Package related soldering information . . . . . . 14
13.2
13.3
13.4
13.5
14
15
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© Koninklijke Philips Electronics N.V. 2006.
All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.
Date of release: 22 June 2006
Document identifier: PCA9519_1
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