NX5P1000UKZ [NXP]
NX5P1000 - Logic controlled high-side power switch CSP 12-Pin;
| 型号： | NX5P1000UKZ |
| 厂家： | 
NXP |
| 描述： | NX5P1000 - Logic controlled high-side power switch CSP 12-Pin |
| 文件： | 总19页 (文件大小：737K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NX5P1000
Logic controlled high-side power switch
Rev. 2 — 14 January 2014
Product data sheet
1. General description
The NX5P1000 is an advanced power switch and ESD- protection device for USB OTG
applications. The device includes under voltage and over voltage lockout, over-current,
over-temperature, reverse bias and in-rush current protection circuits. These circuits are
designed to isolate a VBUS OTG voltage source automatically from a VBUS interface pin
when a fault condition occurs. The device features two power switch terminals, one input
(VINT) and one output (VBUS). It has a current limit input (ILIM) for defining the
over-current and in-rush current limit. A voltage detect output (VDET) is used to determine
when VINT is in the correct voltage range. An open-drain fault output (FAULT) indicates
when a fault condition has occurred and an enable input (EN) controls the state of the
switch. When EN is set LOW the device enters a low-power mode, disabling all protection
circuits except the undervoltage lockout. The low-power mode can be entered at anytime
unless the over temperature protection circuit has been triggered.
Designed for operation from 3 V to 5.5 V, it is used in power domain isolation applications
to protect from out of range operation. The enable input includes integrated logic level
translation making the device compatible with lower voltage processors and controllers.
2. Features and benefits
Wide supply voltage range from 3 V to 5.5 V
30 V tolerant on VBUS
ISW maximum 1 A continuous current
Very low ON resistance: 100 m (maximum) at a supply voltage of 4.0 V
Low-power mode (ground current 20 A typical)
1.8 V control logic
Soft start turn-on slew rate
Protection circuitry
Over-temperature protection
Over-current protection with low current output mode
Reverse bias current/Back drive protection
Overvoltage lockout
Undervoltage lockout
Analog voltage limited VBUS monitor path
ESD protection:
HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV
IEC61000-4-2 contact discharge exceeds 8 kV for pins VBUS, D, D+ and ID
Specified from 40 C to +85 C
NX5P1000
NXP Semiconductors
Logic controlled high-side power switch
3. Applications
USB OTG applications
4. Ordering information
Table 1.
Type number Package
Temperature range Name
Ordering information
Description
Version
NX5P1000UK 40 C to +85 C
WLCSP12 wafer level chip-scale package; 12 bumps;
1.36 1.66 0.51 mm, 0.4 mm pitch (Backside Coating
included)
NX5P1000
5. Marking
Table 2.
Marking codes
Type number
Marking code
NX5P1000UK
NX5P1
6. Functional diagram
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Fig 1. Logic symbol
NX5P1000
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 14 January 2014
2 of 19
NX5P1000
NXP Semiconductors
Logic controlled high-side power switch
10 mA
CURRENT SOURCE
REVERSE-CURRENT
PROTECTION
ILIM
OVER-CURRENT
PROTECTION
VBUS
VINT
UVLO/OVLO
PROT
VDET
EN
CONTROL
D-
D+
ID
FAULT
125 °C
PROT
aaa-007136
Fig 2. Logic diagram (simplified schematic)
7. Pinning information
7.1 Pinning
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Fig 3. Pin configuration WLCSP12 package
Fig 4. Ball mapping for WLCSP12
7.2 Pin description
Table 3.
Symbol
VINT
Pin description
Pin
Description
A1, B1
A3, B3
C1
internal circuitry voltage I
external connector voltage O
enable input (active HIGH) I
current limiter I/O
VBUS
EN
ILIM
D1
NX5P1000
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 14 January 2014
3 of 19
NX5P1000
NXP Semiconductors
Logic controlled high-side power switch
Table 3.
Symbol
VDET
FAULT
GND
D-
Pin description …continued
Pin
A2
B2
C2
D2
D3
C3
Description
VBUS voltage level indicator O
fault condition indicator (open-drain; active LOW)
ground (0 V)
ESD-protection I/O
D+
ESD-protection I/O
ID
ESD-protection I/O
8. Functional description
Table 4.
Function table[1]
EN
X
VINT
VBUS
Z
FAULT Operation mode
0 V
0 V
L
Z
L
L
L
Z
Z
L
L
no supply
X
< 30 V
disabled; switch open
X
< 3.2 V
Z
undervoltage lockout; switch open
overvoltage lockout; switch open
over-temperature; switch open
disabled; switch open
H
H
L
> 5.5 V
Z
3.2 V to 5.5 V
3.2 V to 5.5 V
3.2 V to 5.5 V
3.2 V to 5.5 V
3.2 V to 5.5 V
Z
Z
H
H
H
VBUS = VINT
0 V to VINT
0 V to VINT
enabled; switch closed; active
over-current; switch open; constant current on VBUS
when ILIM is connected to GND, VBUS is supplied with
10 mA current source
H
H
3.2 V to 5.5 V
3.2 V to 5.5 V
VINT + 30 mV < VBUS < VINT +
0.45 V (> 4 ms)
L
L
reverse bias current/back drive; switch open
VBUS > VINT + 0.45 V
reverse bias current/back drive; switch open
[1] H = HIGH voltage level; L = LOW voltage level, Z = high-impedance OFF-state, X = Don’t care.
Table 5.
VBUS
Function table VDET versus VBUS[1]
VDET
Operation mode
3 V < VBUS < 30 V
1.5 < VDET < 5.5 V VDET detects VBUS voltage
[1] See Figure 22.
8.1 EN input
When the EN is set LOW, the N-channel MOSFET is disabled. The device enters
low-power mode disabling all protection circuits except the undervoltage lockout circuit
and setting the FAULT output high impedance. When EN is set HIGH, all protection
circuits are enabled. If an RILIM current limit resistor is detected and no fault conditions
exist, the N-channel MOSFET is enabled.
8.2 Undervoltage lockout
Independent of the logic level on the EN pin, the undervoltage lockout (UVLO) circuit
disables the N-channel MOSFET. It sets the FAULT output LOW and enters low-power
mode until VINT > 3.2 V. Once VINT > 3.2 V, the state of the N-channel MOSFET controls
the EN pin. The UVLO circuit remains active in low-power mode.
NX5P1000
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 14 January 2014
4 of 19
NX5P1000
NXP Semiconductors
Logic controlled high-side power switch
8.3 Overvoltage lockout
When EN is set HIGH, the overvoltage lockout (OVLO) circuit disables the N-channel
MOSFET. If VINT > 5.75 V, the FAULT output is set LOW. The OVLO circuit is disabled in
low-power mode and does not influence the FAULT output state. If the OVLO circuit is
active, setting the EN pin LOW returns the device to low-power mode.
8.4 ILIM
The over-current protection circuit's (OCP) trigger value Iocp, can be set using an external
resistor RILIM connected to the ILIM pin (see Figure 6). When EN is set HIGH and the ILIM
pin is grounded, the N-channel MOSFET is disabled. In addition, VBUS is supplied by the
10 mA current source and the FAULT output set LOW.
8.5 Over-current protection
If the current through the N-channel MOSFET exceeds Iocp for 20 s or VBUS < VINT
200 mV, the over-current protection (OCP) circuit disables the N-channel MOSFET within
2 s. It supplies VBUS from the 10 mA current source and indicates a fault condition by
setting the FAULT pin LOW. The OCP circuit is automatically reset when VINT > VBUS >
VINT 200 mV for 20 s. The N-channel MOSFET assumes the state defined by the EN
input, the 10 mA current source is disconnected and the FAULT pin is set high impedance.
If the OCP circuit is active, setting the EN pin LOW returns the device to low-power mode.
8.6 Over-temperature protection
When EN is set HIGH and the device temperature exceeds 125 °C, the Over-temperature
protection (OTP) circuit disables the N-channel MOSFET. It indicates a fault condition by
setting the FAULT pin LOW. Any transition on the EN pin has no effect. Once the device
temperature decreases to below 115 °C, the device returns to the defined state. The OTP
circuit is disabled in low-power mode. However, if the OTP circuit is active, setting the EN
pin LOW does not return the device to low-power mode.
8.7 Reverse bias current/back drive protection
When EN is set HIGH, if (VINT + 30 mV) < VBUS < (VINT + 0.45 V) for longer than 4 ms,
or if VBUS > (VINT + 0.45 V), the reverse-bias current protection circuit (RCP) disables
the N-channel MOSFET. It indicates a fault condition by setting the FAULT pin LOW. Once
VBUS < VINT for longer than 4 ms the device returns to the defined state. If the RCP
circuit is active, setting the EN pin LOW returns the device to low-power mode.
8.8 FAULT output
The FAULT output is an open-drain output that requires an external pull-up resistor. If any
of the UVLO, OVLO, RCP, OCP or OTP circuits are activated the FAULT output is set
LOW to indicate a fault has occurred. The FAULT output returns to the high impedance
state automatically once the fault condition is removed.
8.9 VDET output
VDET is an analog output that allows a controller to monitor the voltage level on VBUS.
NX5P1000
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 14 January 2014
5 of 19
NX5P1000
NXP Semiconductors
Logic controlled high-side power switch
8.10 In-rush current protection
When either the EN pin or a recovered fault condition enables the N-channel MOSFET,
the in-rush current protection circuit affects the switch. It causes the switch to behave as a
current source during the time VBUS ramps up to VINT - 200 mV. The resistor connected
to ILIM determines the current. The in-rush current protection circuit is disabled in
low-power mode.
9. Application diagram
The NX5P1000 typically connects a voltage source on VINT to the VBUS of a USB
connector supporting USB3 OTG in a portable, battery operated device. The external
resistor RILIM sets the maximum current limit threshold. The FAULT signal requires an
additional external pull-up resistor. This resistor should be connected to a supply voltage
matching the logic input pin supply level it is connected to.
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Fig 5. NX5P1000 application diagram
NX5P1000
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 14 January 2014
6 of 19
NX5P1000
NXP Semiconductors
Logic controlled high-side power switch
10. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
VBUS
Min
0.5
0.5
0.5
0.5
0.5
50
50
-
Max
+32
Unit
V
[1]
[1]
[2]
[1]
VI
input voltage
VINT
+6.0
VINT + 0.5
+6.0
+6.0
-
V
EN, ILIM
D-, D+, ID
FAULT
V
V
VO
output voltage
V
IIK
input clamping current
EN: VI < 0.5 V
mA
mA
mA
C
ISK
switch clamping current VBUS; VINT; VI < 0.5 V
-
ISW
Tj(max)
switch current
Tamb = 85 °C
1000
+125
maximum junction
temperature
40
Tstg
Ptot
storage temperature
total power dissipation
65
+150
100
C
[3]
-
mW
[1] The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed.
[2] The minimum input voltage rating may be exceeded if the input current rating is observed.
[3] The (absolute) maximum power dissipation depends on the junction temperature Tj. Higher power dissipation is allowed in conjunction
with lower ambient temperatures. The conditions to determine the specified values are Tamb = 85 °C and the use of a two layer PCB.
11. Recommended operating conditions
Table 7.
Recommended operating conditions
Symbol Parameter
Conditions
VINT
Min
3.0
0
Max
5.5
Unit
V
VI
input voltage
EN, ILIM
VINT
30
V
VO
output voltage
VBUS; EN = LOW
D-, D+, ID
0
V
VI/O
Tamb
input/output voltage
ambient temperature
0
5.5
V
40
+85
C
12. Thermal characteristics
Table 8.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
Typ
Unit
K/W
[1][2]
thermal resistance from junction to ambient
73
[1] The overall Rth(j-a) can vary depending on the board layout. To minimize the effective Rth(j-a), all pins must have a solid connection to
larger Cu layer areas e.g. to the power and ground layer. In multi-layer PCB applications, the second layer should be used to create a
large heat spreader area right below the device. If this layer is either ground or power, it should be connected with several vias to the top
layer connecting to the device ground or supply. Try not to use any solder-stop varnish under the chip.
[2] Rely on the measurement data given for a rough estimation of the Rth(j-a) in your application. The actual Rth(j-a) value may vary in
applications using different layer stacks and layouts
NX5P1000
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 14 January 2014
7 of 19
NX5P1000
NXP Semiconductors
Logic controlled high-side power switch
13. Static characteristics
Table 9.
Static characteristics
VI(VINT) = 4.0 V to 5.5 V; unless otherwise specified; Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Tamb = 25 C
Tamb = 40 C to +85 C Unit
Min Typ[1] Max
Min
Max
VIH
VIL
VO
VOL
IO
HIGH-level input
voltage
EN input
EN input
1.2
-
-
-
-
-
1.2
-
V
V
V
V
LOW-level input
voltage
-
0.4
5.5
0.5
-
1.5
-
0.4
5.5
0.5
output voltage
VDET; IVDET = 2 mA;
3V < VBUS < 30 V
1.5
-
LOW-level output
voltage
FAULT, IO = 8 mA
output current
Current source
-
-
-
10
-
-
IOS
-
8
-
15
IOS
-
mA
mA
mA
EN = HIGH; FAULT = Hi-Z
EN = HIGH; see Figure 6
Iocp
overcurrent
-
-
protection current
Rpu
pull-up resistance
pull-up voltage
FAULT
FAULT
ILIM
20
-
-
-
-
200
VINT
300
-
-
-
k
V
Vpu
VINT
300
RILIM
current limit
resistance
40
40
k
IGND
ground current
VBUS open; EN = LOW;
see Figure 7 and Figure 8
-
20
220
2
-
-
40
330
20
20
3.4
6.0
-
A
A
A
A
V
VBUS open; EN = HIGH;
see Figure 7 and Figure 8
-
-
-
[2]
[2]
IOFF
power-off leakage
current
VBUS = 0 V to 30 V;
VINT = 0 V; see Figure 9
-
-
-
-
-
-
IS(OFF)
VUVLO
VOVLO
OFF-state leakage
current
VBUS = 0 V to 30 V;
see Figure 10 and Figure 11
2
undervoltage lockout
voltage
3.0
5.5
-
3.2
5.75
150
3
3.4
6.0
-
3.0
5.5
-
overvoltage lockout
voltage
V
Vhys(OVLO) overvoltage lockout
hysteresis voltage
mV
pF
CI/O
input/output
capacitance
D-, D+, ID
EN
-
-
-
-
CI
input capacitance
-
-
2
-
-
-
-
-
pF
nF
CS(ON)
ON-state
1
1
capacitance
[1] Typical values are measured at Tamb = 25 C and VI(VINT) = 5.0 V.
[2] Typical value is measured at Tamb = 25 C and VI(VBUS) = 5.0 V.
NX5P1000
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 14 January 2014
8 of 19
NX5P1000
NXP Semiconductors
Logic controlled high-side power switch
13.1 Graphs
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(1) Enabled
(2) Disabled
Fig 6. Typical over-current and in-rush current limit
versus the external resistor value.
Fig 7. Typical ground current versus temperature
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(1) Tamb = 85 C
(2) Tamb = 25 C
(3) Tamb = 40 C
Fig 8. Typical ground current versus input voltage
Fig 9. Typical power-off leakage current versus input
voltage on pin VBUS
NX5P1000
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 14 January 2014
9 of 19
NX5P1000
NXP Semiconductors
Logic controlled high-side power switch
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(1) Tamb = 85 C
(2) amb = 25 C
(3) Tamb = 40 C
(1)
(2)
V
V
I(VBUS) = 15.0 V
I(VBUS) = 10.0 V
T
(3) VI(VBUS) = 5.0 V
Fig 10. Typical OFF-state leakage current versus input
voltage on pin VBUS
Fig 11. Typical OFF-state leakage current versus
temperature
13.2 ON resistance
Table 10. ON resistance
At recommended operating conditions; voltages are referenced to GND (ground = 0 V)
Symbol Parameter
Conditions
Tamb = 25 C
Tamb = 40 C to +85 C Unit
Min Typ Max
Min
Max
RON
ON resistance switch enabled; ILOAD = 200 mA;
see Figure 12, Figure 13 and
Figure 14
VI(VINT) = 4.0 V to 5.5 V
-
60
-
-
100
m
13.3 ON resistance test circuit and waveforms
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.
Fig 12. Test circuit for measuring ON resistance
NX5P1000
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 14 January 2014
10 of 19
NX5P1000
NXP Semiconductors
Logic controlled high-side power switch
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(1) VI(VINT) = 5.5 V
(2) VI(VINT) = 4.0 V
(1) Tamb = 85 C
(2) amb = 25 C
(3) Tamb = 40 C
T
Fig 13. Typical ON resistance versus temperature
Fig 14. Typical ON resistance versus input voltage
14. Dynamic characteristics
Table 11. Dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for test circuit see Figure 16.
VI(VINT) = 4.0 V to 5.5 V.
Symbol Parameter
Conditions
Tamb = 25 C
Tamb = 40 C to +85 C Unit
Min
Typ
0.24
1.5
Max
Min
0.16
-
Max
ten
enable time
disable time
turn-on time
turn-off time
EN to VBUS; see Figure 15
EN to VBUS; see Figure 15
EN to VBUS; see Figure 15
EN to VBUS; see Figure 15
VBUS; see Figure 15
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ms
ms
ms
ms
ms
tdis
ton
0.63
34.5
0.39
0.52
-
toff
tTLH
LOW to HIGH
output transition
time
0.16
tTHL
HIGH to LOW
output transition
time
VBUS; see Figure 15
-
33
-
-
-
ms
NX5P1000
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Product data sheet
Rev. 2 — 14 January 2014
11 of 19
NX5P1000
NXP Semiconductors
Logic controlled high-side power switch
14.1 Waveforms, graphs and test circuit
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Measurement points are given in Table 12.
Logic level: VOH is the typical output voltage that occurs with the output load.
Fig 15. Switching times
Table 12. Measurement points
Supply voltage
EN Input
VM
Output
VX
VI(VINT)
VY
4.0 V to 5.5 V
0.5 VI
0.9 VOH
0.1 VOH
(1
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Test data is given in Table 13.
Definitions test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
EXT = External voltage for measuring switching times.
V
Fig 16. Test circuit for measuring switching times
Table 13. Test data
Supply voltage
VEXT
Input
VI
Load
CL
RL
4.0 V to 5.5 V
1.5 V
100 F
150
NX5P1000
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 14 January 2014
12 of 19
NX5P1000
NXP Semiconductors
Logic controlled high-side power switch
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EN = 1.5 V; VINT = 4 V; RL = 150 ; CL = 220 F;
RILIM = 50 k; Tamb = 25 C.
EN = 1.5 V; VINT = 5.5 V; RL = 150 ; CL = 220 F;
RILIM = 50 k; Tamb = 25 C.
(1) EN
(1) EN
(2) VBUS
(3) II(VINT)
(2) VBUS
(3) II(VINT)
Fig 17. Typical enable time and in-rush current
Fig 18. Typical enable time and in-rush current
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EN = 1.5 V; VINT = 4 V; RL = 150 ; CL = 100 F;
amb = 25 C.
EN = 1.5 V; VINT = 4 V; RL = 150 ; CL = 100 F;
ILIM = 50 k; Tamb = 25 C.
T
R
Fig 19. Typical enable time versus current limit
resistance (RILIM
Fig 20. Typical disable time
)
NX5P1000
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 14 January 2014
13 of 19
NX5P1000
NXP Semiconductors
Logic controlled high-side power switch
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EN = 1.5 V; VINT = 5.5 V; RL = 150 ; CL = 100 F;
RILIM = 50 k; Tamb = 25 C.
Fig 21. Typical disable time
Fig 22. Typical VDET versus VBUS
NX5P1000
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 14 January 2014
14 of 19
NX5P1000
NXP Semiconductors
Logic controlled high-side power switch
15. Package outline
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Fig 23. Package outline NX5P1000 (WLCSP12)
NX5P1000
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 14 January 2014
15 of 19
NX5P1000
NXP Semiconductors
Logic controlled high-side power switch
16. Abbreviations
Table 14. Abbreviations
Acronym
CDM
Description
Charged Device Model
DUT
Device Under Test
ESD
ElectroStatic Discharge
Human Body Model
HBM
MOSFET
OCP
Metal-Oxide Semiconductor Field Effect Transistor
Overcurrent Protection
OTP
Overtemperature Protection
Reverse Current Protection
Universal Serial Bus On-The-Go
Undervoltage lockout
RCP
USB OTG
UVLO
VBUS
OVLO
USB Power Supply
Overvoltage lockout
17. Revision history
Table 15. Revision history
Document ID
NX5P1000 v.2
Modifications:
NX5P1000 v.1
Release date
20140114
Data sheet status
Change notice
Supersedes
Product data sheet
-
NX5P1000 v.1
• IOS changed into Iocp (errata).
20130429 Product data sheet
-
-
NX5P1000
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 14 January 2014
16 of 19
NX5P1000
NXP Semiconductors
Logic controlled high-side power switch
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
18.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
NX5P1000
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 14 January 2014
17 of 19
NX5P1000
NXP Semiconductors
Logic controlled high-side power switch
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NX5P1000
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2 — 14 January 2014
18 of 19
NX5P1000
NXP Semiconductors
Logic controlled high-side power switch
20. Contents
1
2
3
4
5
6
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
8
Functional description . . . . . . . . . . . . . . . . . . . 4
ENinput. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Undervoltage lockout . . . . . . . . . . . . . . . . . . . . 4
Overvoltage lockout . . . . . . . . . . . . . . . . . . . . . 5
ILIM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Over-current protection. . . . . . . . . . . . . . . . . . . 5
Over-temperature protection . . . . . . . . . . . . . . 5
Reverse bias current/back drive protection . . . 5
FAULToutput . . . . . . . . . . . . . . . . . . . . . . . . . 5
VDEToutput . . . . . . . . . . . . . . . . . . . . . . . . . . 5
In-rush current protection . . . . . . . . . . . . . . . . . 6
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
9
Application diagram . . . . . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Recommended operating conditions. . . . . . . . 7
Thermal characteristics . . . . . . . . . . . . . . . . . . 7
10
11
12
13
Static characteristics. . . . . . . . . . . . . . . . . . . . . 8
Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
ON resistance. . . . . . . . . . . . . . . . . . . . . . . . . 10
ON resistance test circuit and waveforms . . . 10
13.1
13.2
13.3
14
14.1
15
Dynamic characteristics . . . . . . . . . . . . . . . . . 11
Waveforms, graphs and test circuit . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16
16
17
18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
18.1
18.2
18.3
18.4
19
20
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 14 January 2014
Document identifier: NX5P1000
相关型号：
NX5P3001UKZ
NX5P3001 - Bidirectional high-side power switch for charger and USB‑OTG combined applications
NXP
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