MC9S08LC36CLHE [NXP]
8-BIT, FLASH, 40MHz, MICROCONTROLLER, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, MS-026BCD, LQFP-64;
| 型号： | MC9S08LC36CLHE |
| 厂家： | 
NXP |
| 描述： | 8-BIT, FLASH, 40MHz, MICROCONTROLLER, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, MS-026BCD, LQFP-64 时钟 CD 外围集成电路 |
| 文件： | 总360页 (文件大小：3809K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC9S08LC60
MC9S08LC36
Data Sheet: Technical Data
HCS08
Microcontrollers
MC9S08LC60
Rev. 4
07/2007
freescale.com
MC9S08LC60 Series Features
8-Bit HCS08 Central Processor Unit (CPU)
Peripherals
•
•
•
•
40-MHz HCS08 CPU
•
LCD (liquid crystal display driver) — Compatible
with 5-V or 3-V LCD glass displays; functional in
wait and stop3 low-power modes; selectable
frontplane and backplane configurations:
HC08 instruction set with added BGND instruction
Background debugging system
Breakpoint capability to allow single breakpoint
setting during in-circuit debugging (plus two more
breakpoints in on-chip debug module)
–
4 x 40 or 3 x 41 (80-pin package)
4 x 32 or 3 x 33 (64-pin package)
–
•
•
ACMP (analog comparator) — option to compare to
internal reference voltage; output is software
selectable to be driven to the input capture of TPM1
channel 0.
•
In-Circuit Emulator (ICE) debug module containing
two comparators and nine trigger modes. Eight deep
FIFO for storing change-of-flow addresses and
event-only data. ICE debug module supports both
tag and force breakpoints.
ADC (analog-to-digital converter) — 8-channel,
12-bit with automatic compare function,
asynchronous clock source, temperature sensor and
internal bandgap reference channel. ADC is
hardware triggerable using the RTI counter.
•
Support for up to 32 interrupt/reset sources
Memory Options
•
Dual on-chip in-circuit programmable FLASH
memories with block protection and security
options; 60K and 36K options available
•
•
•
•
SCI (serial communications interface) — available
single-wire mode
SPI1 and SPI2 — Two serial peripheral interface
modules
•
•
Program/erase of one FLASH array while executing
from another
KBI — Two 8-pin keyboard interrupt modules with
software selectable rising or falling edge detect
On-chip random-access memory (RAM); 4K and
2.5K options available
IIC — Inter-integrated circuit bus module capable
of operation up to 100 kbps with maximum bus
loading; capable of higher baudrates with reduced
loading
Power-Saving Features
•
•
Wait plus three stops
•
TPM1 and TPM2 — Two timer/pulse-width
modulators with selectable input capture, output
compare, and edge-aligned PWM capability on each
channel. Each timer module may be configured for
buffered, centered PWM (CPWM) on all channels.
Software disable of clock monitor and low-voltage
interrupt (LVI) for lowest stop current
•
Software-generated real-time clock (RTC) functions
using real-time interrupt (RTI)
Configurable Clock Source
Input/Output
•
Clock source options include crystal, resonator,
external clock, or internally generated clock with
precision nonvolatile memory (NVM) trimming
•
Up to 24 general-purpose input/output (I/O) pins;
includes two output-only pins and one input-only
pin
•
Automatic clock monitor function
•
•
Software selectable pullups on ports when used as
input. Selection is on an individual port bit basis.
System Protection
Software selectable slew rate control on ports when
used as outputs (selection is on an individual port bit
basis)
•
•
•
Optional computer operating properly (COP) reset
Low-voltage detection with reset or interrupt
Illegal opcode detection with reset
•
•
Software selectable drive strength control on ports
when used as outputs (selection is on an individual
port bit basis)
Package Options
Internal pullup on RESET and IRQ pin to reduce
customer system cost
•
•
64-pin low-profile quad flat package (LQFP)
80-pin LQFP
MC9S08LC60 Series Data Sheet
Covers MC9S08LC60
MC9S08LC36
MC9S08LC60
Rev. 4
07/2007
This document contains information on a new product. Specifications and information herein are subject to change without notice.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
© Freescale Semiconductor, Inc., 2007. All rights reserved.
Revision History
To provide the most up-to-date information, the revision of our documents on the World Wide Web will
be the most current. Your printed copy may be an earlier revision. To verify you have the latest information
available, refer to:
http://freescale.com
The following revision history table summarizes changes contained in this document.
Revision
Number
Revision
Date
Description of Changes
Initial advance information release.
1
02/2007
Incorporated changes to the LCDSupply Field Descriptions for the CPCADJ field,
added a Run Idd chart, performed some minor formatting edits and fixed a couple
of typos.
2
05/2007
3
4
06/2007
07/2007
Updated the Appendix with ESD tables, package info, and mechanical drawings.
Updated the Appendix with ESD tables, package info, and mechanical drawings for
the 80-pin LQFP package.
This product incorporates SuperFlash® technology licensed from SST.
Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
© Freescale Semiconductor, Inc., 2007. All rights reserved.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
6
Freescale Semiconductor
List of Chapters
Chapter
Title
Page
Chapter 1
Chapter 2
Chapter 3
Chapter 4
Chapter 5
Chapter 6
Chapter 7
Chapter 8
Chapter 9
Chapter 10
Chapter 11
Chapter 12
Chapter 13
Chapter 14
Chapter 15
Chapter 16
Chapter 17
Appendix A
Appendix B
Device Overview..............................................................................21
Pins and Connections.....................................................................25
Modes of Operation.........................................................................33
Memory.............................................................................................39
Resets, Interrupts, and System Configuration .............................63
Parallel Input/Output .......................................................................81
Keyboard Interrupt (S08KBIV2)......................................................95
Central Processor Unit (S08CPUV2)............................................103
Liquid Crystal Display Driver (S08LCDV1)..................................123
Internal Clock Generator (S08ICGV4)..........................................169
Timer Pulse-Width Modulator (S08TPMV2).................................197
Serial Communications Interface (S08SCIV3).............................213
Serial Peripheral Interface (S08SPIV3) ........................................233
Inter-Integrated Circuit (S08IICV1) ...............................................249
Analog-to-Digital Converter (S08ADC12V1)................................267
Analog Comparator (S08ACMPV2) ..............................................293
Development Support ...................................................................301
Electrical Characteristics..............................................................323
Ordering Information and Mechanical Drawings........................351
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
7
Table of Contents
Section Number
Title
Page
Chapter 1
Device Overview
1.1 Introduction .....................................................................................................................................21
1.2 Devices in the MC9S08LC60 Series ...............................................................................................21
1.3 MCU Block Diagram ......................................................................................................................22
1.4 System Clock Distribution ..............................................................................................................23
Chapter 2
Pins and Connections
2.1 Introduction .....................................................................................................................................25
2.2 Device Pin Assignment ...................................................................................................................25
2.3 Recommended System Connections ...............................................................................................27
2.3.1
2.3.2
2.3.3
2.3.4
2.3.5
2.3.6
Power (V , V , V
ADC Reference Pins (V
, V
) ...............................................................................29
DD
SS
DDAD
SSAD
, V
) ...........................................................................29
REFH
REFL
Oscillator (XTAL, EXTAL) ............................................................................................29
RESET Pin ......................................................................................................................30
Background / Mode Select (BKGD/MS) .......................................................................30
LCD Pins ........................................................................................................................31
2.3.6.1 LCD Power Pins .............................................................................................31
2.3.6.2 LCD Frontplane and Backplane Driver Pins ..................................................31
General-Purpose I/O and Peripheral Ports .....................................................................31
2.3.7
Chapter 3
Modes of Operation
3.1 Introduction .....................................................................................................................................33
3.2 Features ...........................................................................................................................................33
3.3 Run Mode ........................................................................................................................................33
3.4 Active Background Mode ................................................................................................................33
3.5 Wait Mode .......................................................................................................................................34
3.6 Stop Modes ......................................................................................................................................35
3.6.1
Stop3 Mode ....................................................................................................................35
3.6.1.1 LVD Enabled in Stop Mode ............................................................................36
3.6.1.2 Active BDM Enabled in Stop Mode ...............................................................36
Stop2 Mode ....................................................................................................................36
Stop1 Mode ....................................................................................................................37
On-Chip Peripheral Modules in Stop Modes .................................................................37
3.6.2
3.6.3
3.6.4
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
9
Section Number
Title
Page
Chapter 4
Memory
4.1 MC9S08LC60 Series Memory Map ...............................................................................................39
4.1.1
Reset and Interrupt Vector Assignments ........................................................................40
4.2 Register Addresses and Bit Assignments ........................................................................................42
4.3 RAM ................................................................................................................................................47
4.4 FLASH ............................................................................................................................................48
4.4.1
4.4.2
4.4.3
4.4.4
4.4.5
4.4.6
4.4.7
Features ...........................................................................................................................49
Program and Erase Times ...............................................................................................49
Program and Erase Command Execution .......................................................................50
Burst Program Execution ...............................................................................................51
Access Errors ..................................................................................................................53
FLASH Block Protection ...............................................................................................53
Vector Redirection ..........................................................................................................54
4.5 Security ............................................................................................................................................54
4.6 FLASH Registers and Control Bits .................................................................................................56
4.6.1
4.6.2
4.6.3
4.6.4
4.6.5
4.6.6
FLASH Clock Divider Register (FCDIV) ......................................................................56
FLASH Options Register (FOPT and NVOPT) .............................................................57
FLASH Configuration Register (FCNFG) .....................................................................58
FLASH Protection Register (FPROT and NVPROT) ....................................................58
FLASH Status Register (FSTAT) ...................................................................................60
FLASH Command Register (FCMD) ............................................................................61
Chapter 5
Resets, Interrupts, and System Configuration
5.1 Introduction .....................................................................................................................................63
5.2 Features ...........................................................................................................................................63
5.3 MCU Reset ......................................................................................................................................63
5.4 Computer Operating Properly (COP) Watchdog .............................................................................64
5.5 Interrupts .........................................................................................................................................65
5.5.1
5.5.2
Interrupt Stack Frame .....................................................................................................66
External Interrupt Request (IRQ) Pin .............................................................................67
5.5.2.1 Pin Configuration Options ..............................................................................67
5.5.2.2 Edge and Level Sensitivity ..............................................................................67
Interrupt Vectors, Sources, and Local Masks .................................................................67
5.5.3
5.6 Low-Voltage Detect (LVD) System ................................................................................................69
5.6.1
5.6.2
5.6.3
5.6.4
Power-On Reset Operation .............................................................................................69
LVD Reset Operation .....................................................................................................69
LVD Interrupt Operation ................................................................................................69
Low-Voltage Warning (LVW) ........................................................................................69
5.7 Real-Time Interrupt (RTI) ...............................................................................................................69
5.8 Reset, Interrupt, and System Control Registers and Control Bits ...................................................70
5.8.1
5.8.2
Interrupt Pin Request Status and Control Register (IRQSC) .........................................70
System Reset Status Register (SRS) ...............................................................................72
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
10
Freescale Semiconductor
Section Number
Title
Page
5.8.3
5.8.4
5.8.5
5.8.6
5.8.7
5.8.8
5.8.9
System Background Debug Force Reset Register (SBDFR) ..........................................73
System Options Register (SOPT1) .................................................................................73
System Options Register (SOPT2) .................................................................................74
System Device Identification Register (SDIDH, SDIDL) ..............................................75
System Real-Time Interrupt Status and Control Register (SRTISC) .............................76
System Power Management Status and Control 1 Register (SPMSC1) .........................77
System Power Management Status and Control 2 Register (SPMSC2) .........................78
5.8.10 System Power Management Status and Control 3 Register (SPMSC3) .........................79
Chapter 6
Parallel Input/Output
6.1 Pin Behavior in Stop Modes ............................................................................................................83
6.2 Parallel I/O Registers .......................................................................................................................83
6.2.1
Port A Registers ..............................................................................................................83
6.2.1.1 Port A Data Registers (PTAD) ........................................................................84
6.2.1.2 Port A Data Direction Registers (PTADD) .....................................................84
Port A Control Registers ................................................................................................85
6.2.2.1 Internal Pullup Enable (PTAPE) .....................................................................85
6.2.2.2 Output Slew Rate Control Enable (PTASE) ...................................................86
6.2.2.3 Output Drive Strength Select (PTADS) ..........................................................86
Port B Registers ..............................................................................................................87
6.2.3.1 Port B Data Registers (PTBD) ........................................................................87
6.2.3.2 Port B Data Direction Registers (PTBDD) .....................................................88
Port B Control Registers .................................................................................................88
6.2.4.1 Internal Pullup Enable (PTBPE) .....................................................................88
6.2.4.2 Output Slew Rate Control Enable (PTBSE) ...................................................89
6.2.4.3 Output Drive Strength Select (PTBDS) ..........................................................90
Port C Registers ..............................................................................................................90
6.2.5.1 Port C Data Registers (PTCD) ........................................................................91
6.2.5.2 Port C Data Direction Registers (PTCDD) .....................................................91
Port C Control Registers .................................................................................................91
6.2.6.1 Internal Pullup Enable (PTCPE) .....................................................................92
6.2.6.2 Output Slew Rate Control Enable (PTCSE) ...................................................93
6.2.6.3 Output Drive Strength Select (PTCDS) ..........................................................93
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
Chapter 7
Keyboard Interrupt (S08KBIV2)
7.1 Introduction .....................................................................................................................................95
7.1.1
7.1.2
Features ...........................................................................................................................97
Modes of Operation ........................................................................................................97
7.1.2.1 KBI in Wait Mode ...........................................................................................97
7.1.2.2 KBI in Stop Modes .........................................................................................97
7.1.2.3 KBI in Active Background Mode ...................................................................97
Block Diagram ................................................................................................................97
7.1.3
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
11
Section Number
Title
Page
7.2 External Signal Description ............................................................................................................98
7.3 Register Definition ..........................................................................................................................99
7.3.1
7.3.2
7.3.3
KBIx Status and Control Register (KBIxSC) .................................................................99
KBIx Pin Enable Register (KBIxPE) .............................................................................99
KBIx Edge Select Register (KBIxES) ..........................................................................100
7.4 Functional Description ..................................................................................................................100
7.4.1
7.4.2
7.4.3
7.4.4
Edge Only Sensitivity ...................................................................................................101
Edge and Level Sensitivity ...........................................................................................101
KBI Pullup/Pulldown Resistors ....................................................................................101
KBI Initialization ..........................................................................................................101
Chapter 8
Central Processor Unit (S08CPUV2)
8.1 Introduction ...................................................................................................................................103
8.1.1
Features .........................................................................................................................103
8.2 Programmer’s Model and CPU Registers .....................................................................................104
8.2.1
8.2.2
8.2.3
8.2.4
8.2.5
Accumulator (A) ...........................................................................................................104
Index Register (H:X) ....................................................................................................104
Stack Pointer (SP) .........................................................................................................105
Program Counter (PC) ..................................................................................................105
Condition Code Register (CCR) ...................................................................................105
8.3 Addressing Modes .........................................................................................................................107
8.3.1
8.3.2
8.3.3
8.3.4
8.3.5
8.3.6
Inherent Addressing Mode (INH) ................................................................................107
Relative Addressing Mode (REL) ................................................................................107
Immediate Addressing Mode (IMM) ...........................................................................107
Direct Addressing Mode (DIR) ....................................................................................107
Extended Addressing Mode (EXT) ..............................................................................108
Indexed Addressing Mode ............................................................................................108
8.3.6.1 Indexed, No Offset (IX) ................................................................................108
8.3.6.2 Indexed, No Offset with Post Increment (IX+) .............................................108
8.3.6.3 Indexed, 8-Bit Offset (IX1) ...........................................................................108
8.3.6.4 Indexed, 8-Bit Offset with Post Increment (IX1+) .......................................108
8.3.6.5 Indexed, 16-Bit Offset (IX2) .........................................................................108
8.3.6.6 SP-Relative, 8-Bit Offset (SP1) ....................................................................108
8.3.6.7 SP-Relative, 16-Bit Offset (SP2) ..................................................................109
8.4 Special Operations .........................................................................................................................109
8.4.1
8.4.2
8.4.3
8.4.4
8.4.5
Reset Sequence .............................................................................................................109
Interrupt Sequence ........................................................................................................109
Wait Mode Operation ...................................................................................................110
Stop Mode Operation ...................................................................................................110
BGND Instruction ........................................................................................................111
8.5 HCS08 Instruction Set Summary ..................................................................................................112
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
12
Freescale Semiconductor
Section Number
Title
Page
Chapter 9
Liquid Crystal Display Driver (S08LCDV1)
9.1 Introduction ...................................................................................................................................123
9.1.1
9.1.2
9.1.3
Features .........................................................................................................................125
Modes of Operation ......................................................................................................125
Block Diagram ..............................................................................................................126
9.2 External Signal Description ..........................................................................................................127
9.2.1
9.2.2
9.2.3
9.2.4
9.2.5
9.2.6
BP[2:0] .........................................................................................................................127
FP[39:0] ........................................................................................................................127
BP3/FP40 ......................................................................................................................127
V
V
.............................................................................................................................127
LCD
, VLL2, V
........................................................................................................127
LL1
LL3
Vcap1, Vcap2 ...............................................................................................................128
9.3 Register Definition ........................................................................................................................128
9.3.1
9.3.2
9.3.3
9.3.4
LCD Control Register 0 (LCDCR0) .............................................................................128
LCD Control Register 1 (LCDCR1) .............................................................................129
LCD Frontplane Enable Registers 0–5 (FPENR0–FPENR5) ......................................130
LCDRAM Registers (LCDRAM) ................................................................................131
9.3.4.1 LCDRAM Registers as On/Off Selector (LCDDRMS = 0) .........................133
9.3.4.2 LCDRAM Registers as Blink Enable/Disable (LCDDRMS = 1) .................133
LCD Clock Source Register (LCDCLKS) ...................................................................133
LCD Voltage Supply Register (LCDSUPPLY) ............................................................134
LCD Blink Control Register (LCDBCTL) ...................................................................135
LCD Command and Status Register (LCDCMD) ........................................................136
9.3.5
9.3.6
9.3.7
9.3.8
9.4 Functional Description ..................................................................................................................137
9.4.1
LCD Driver Description ...............................................................................................138
9.4.1.1 LCD Duty Cycle ...........................................................................................138
9.4.1.2 LCD Bias ......................................................................................................139
9.4.1.3 LCD Module Waveform Base Clock and Frame Frequency ........................139
9.4.1.4 LCD Waveform Examples ............................................................................141
LCDRAM Registers .....................................................................................................149
9.4.2.1 LCDRAM Data Clear Command ..................................................................149
9.4.2.2 LCDRAM Data Blank Command .................................................................149
LCD Blinking ...............................................................................................................149
9.4.3.1 LCD Segment Blinking .................................................................................150
9.4.3.2 Blink Frequency ............................................................................................150
LCD Charge Pump, Voltage Divider, and Power Supply Operation ............................150
9.4.4.1 LCD Charge Pump and Voltage Divider .......................................................152
9.4.4.2 LCD Power Supply and Voltage Buffer Configuration .................................153
Resets ............................................................................................................................155
Interrupts .......................................................................................................................155
9.4.2
9.4.3
9.4.4
9.4.5
9.4.6
9.5 Initialization Section .....................................................................................................................155
9.5.1
9.5.2
Initialization Sequence .................................................................................................156
Initialization Examples .................................................................................................157
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
13
Section Number
Title
Page
9.5.2.1 Initialization Example 1 ................................................................................158
9.5.2.2 Initialization Example 2 ................................................................................159
9.5.2.3 Initialization Example 3 ................................................................................161
9.5.2.4 Initialization Example 4 ................................................................................162
9.6 Application Information ................................................................................................................163
9.6.1
LCD Seven Segment Example Description ..................................................................163
9.6.1.1 LCD Module Waveforms ..............................................................................165
9.6.1.2 Segment On Driving Waveform ....................................................................166
9.6.1.3 Segment Off Driving Waveform ...................................................................166
LCD Contrast Control ..................................................................................................166
LCD Power Consumption ............................................................................................167
9.6.2
9.6.3
Chapter 10
Internal Clock Generator (S08ICGV4)
10.1 Introduction ...................................................................................................................................169
10.2 Introduction ...................................................................................................................................171
10.2.1 Features .........................................................................................................................171
10.2.2 Modes of Operation ......................................................................................................172
10.2.3 Block Diagram ..............................................................................................................173
10.3 External Signal Description ..........................................................................................................173
10.3.1 EXTAL — External Reference Clock / Oscillator Input ..............................................173
10.3.2 XTAL — Oscillator Output ..........................................................................................173
10.3.3 External Clock Connections .........................................................................................174
10.3.4 External Crystal/Resonator Connections ......................................................................174
10.4 Register Definition ........................................................................................................................175
10.4.1 ICG Control Register 1 (ICGC1) .................................................................................175
10.4.2 ICG Control Register 2 (ICGC2) .................................................................................177
10.4.3 ICG Status Register 1 (ICGS1) ....................................................................................178
10.4.4 ICG Status Register 2 (ICGS2) ....................................................................................179
10.4.5 ICG Filter Registers (ICGFLTU, ICGFLTL) ...............................................................179
10.4.6 ICG Trim Register (ICGTRM) .....................................................................................180
10.5 Functional Description ..................................................................................................................180
10.5.1 Off Mode (Off) .............................................................................................................181
10.5.1.1 BDM Active ..................................................................................................181
10.5.1.2 OSCSTEN Bit Set .........................................................................................181
10.5.1.3 Stop/Off Mode Recovery ..............................................................................181
10.5.2 Self-Clocked Mode (SCM) ...........................................................................................181
10.5.3 FLL Engaged, Internal Clock (FEI) Mode ...................................................................182
10.5.4 FLL Engaged Internal Unlocked ..................................................................................183
10.5.5 FLL Engaged Internal Locked ......................................................................................183
10.5.6 FLL Bypassed, External Clock (FBE) Mode ...............................................................183
10.5.7 FLL Engaged, External Clock (FEE) Mode .................................................................183
10.5.7.1 FLL Engaged External Unlocked .................................................................184
10.5.7.2 FLL Engaged External Locked .....................................................................184
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Section Number
Title
Page
10.5.8 FLL Lock and Loss-of-Lock Detection ........................................................................184
10.5.9 FLL Loss-of-Clock Detection ......................................................................................185
10.5.10 Clock Mode Requirements ...........................................................................................186
10.5.11 Fixed Frequency Clock .................................................................................................187
10.5.12 High Gain Oscillator .....................................................................................................187
10.6 Initialization/Application Information ..........................................................................................187
10.6.1 Introduction ..................................................................................................................187
10.6.2 Example #1: External Crystal = 32 kHz, Bus Frequency = 4.19 MHz ........................189
10.6.3 Example #2: External Crystal = 4 MHz, Bus Frequency = 20 MHz ............................191
10.6.4 Example #3: No External Crystal Connection, 5.4 MHz Bus Frequency ....................193
10.6.5 Example #4: Internal Clock Generator Trim ................................................................195
Chapter 11
Timer Pulse-Width Modulator (S08TPMV2)
11.1 Introduction ...................................................................................................................................197
11.1.1 Features .........................................................................................................................199
11.1.2 Block Diagram ..............................................................................................................199
11.2 External Signal Description ..........................................................................................................201
11.2.1 External TPM Clock Sources .......................................................................................201
11.2.2 TPMxCHn — TPMx Channel n I/O Pins .....................................................................201
11.3 Register Definition ........................................................................................................................201
11.3.1 Timer x Status and Control Register (TPMxSC) ..........................................................202
11.3.2 Timer x Counter Registers (TPMxCNTH:TPMxCNTL) .............................................203
11.3.3 Timer x Counter Modulo Registers (TPMxMODH:TPMxMODL) .............................204
11.3.4 Timer x Channel n Status and Control Register (TPMxCnSC) ....................................205
11.3.5 Timer x Channel Value Registers (TPMxCnVH:TPMxCnVL) ....................................206
11.4 Functional Description ..................................................................................................................207
11.4.1 Counter .........................................................................................................................207
11.4.2 Channel Mode Selection ...............................................................................................208
11.4.2.1 Input Capture Mode ......................................................................................208
11.4.2.2 Output Compare Mode .................................................................................209
11.4.2.3 Edge-Aligned PWM Mode ...........................................................................209
11.4.3 Center-Aligned PWM Mode ........................................................................................210
11.5 TPM Interrupts ..............................................................................................................................211
11.5.1 Clearing Timer Interrupt Flags .....................................................................................211
11.5.2 Timer Overflow Interrupt Description ..........................................................................211
11.5.3 Channel Event Interrupt Description ............................................................................212
11.5.4 PWM End-of-Duty-Cycle Events .................................................................................212
Chapter 12
Serial Communications Interface (S08SCIV3)
12.1 Introduction ...................................................................................................................................213
12.1.1 Features .........................................................................................................................216
12.1.2 Modes of Operation ......................................................................................................216
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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12.1.3 Block Diagram ..............................................................................................................217
12.2 Register Definition ........................................................................................................................219
12.2.1 SCI Baud Rate Registers (SCIBDH, SCIBHL) ............................................................219
12.2.2 SCI Control Register 1 (SCIC1) ...................................................................................220
12.2.3 SCI Control Register 2 (SCIC2) ...................................................................................221
12.2.4 SCI Status Register 1 (SCIS1) ......................................................................................222
12.2.5 SCI Status Register 2 (SCIS2) ......................................................................................224
12.2.6 SCI Control Register 3 (SCIC3) ...................................................................................224
12.2.7 SCI Data Register (SCID) ............................................................................................225
12.3 Functional Description ..................................................................................................................226
12.3.1 Baud Rate Generation ...................................................................................................226
12.3.2 Transmitter Functional Description ..............................................................................226
12.3.2.1 Send Break and Queued Idle .........................................................................227
12.3.3 Receiver Functional Description ..................................................................................228
12.3.3.1 Data Sampling Technique .............................................................................228
12.3.3.2 Receiver Wakeup Operation .........................................................................229
12.3.4 Interrupts and Status Flags ...........................................................................................229
12.4 Additional SCI Functions ..............................................................................................................230
12.4.1 8- and 9-Bit Data Modes ..............................................................................................230
12.4.2 Stop Mode Operation ...................................................................................................231
12.4.3 Loop Mode ...................................................................................................................231
12.4.4 Single-Wire Operation ..................................................................................................231
Chapter 13
Serial Peripheral Interface (S08SPIV3)
13.1 Introduction ...................................................................................................................................233
13.1.1 Features .........................................................................................................................235
13.1.2 Block Diagrams ............................................................................................................235
13.1.2.1 SPI System Block Diagram ..........................................................................235
13.1.2.2 SPI Module Block Diagram ..........................................................................236
13.1.3 SPI Baud Rate Generation ............................................................................................237
13.2 External Signal Description ..........................................................................................................238
13.2.1 SPSCK — SPI Serial Clock .........................................................................................238
13.2.2 MOSI — Master Data Out, Slave Data In ....................................................................238
13.2.3 MISO — Master Data In, Slave Data Out ....................................................................238
13.2.4 SS — Slave Select ........................................................................................................238
13.3 Modes of Operation .......................................................................................................................239
13.3.1 SPI in Stop Modes ........................................................................................................239
13.4 Register Definition ........................................................................................................................239
13.4.1 SPI Control Register 1 (SPIxC1) ..................................................................................239
13.4.2 SPI Control Register 2 (SPIxC2) ..................................................................................240
13.4.3 SPI Baud Rate Register (SPIxBR) ...............................................................................241
13.4.4 SPI Status Register (SPIxS) ..........................................................................................242
13.4.5 SPI Data Register (SPIxD) ...........................................................................................243
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
16
Freescale Semiconductor
Section Number
Title
Page
13.5 Functional Description ..................................................................................................................244
13.5.1 SPI Clock Formats ........................................................................................................244
13.5.2 SPI Interrupts ................................................................................................................247
13.5.3 Mode Fault Detection ...................................................................................................247
Chapter 14
Inter-Integrated Circuit (S08IICV1)
14.1 Introduction ...................................................................................................................................249
14.1.1 Features .........................................................................................................................251
14.1.2 Modes of Operation ......................................................................................................251
14.1.3 Block Diagram ..............................................................................................................252
14.2 External Signal Description ..........................................................................................................252
14.2.1 SCL — Serial Clock Line .............................................................................................252
14.2.2 SDA — Serial Data Line ..............................................................................................252
14.3 Register Definition ........................................................................................................................252
14.3.1 IIC Address Register (IICA) .........................................................................................253
14.3.2 IIC Frequency Divider Register (IICF) ........................................................................253
14.3.3 IIC Control Register (IICC) ..........................................................................................256
14.3.4 IIC Status Register (IICS) ............................................................................................257
14.3.5 IIC Data I/O Register (IICD) ........................................................................................258
14.4 Functional Description ..................................................................................................................259
14.4.1 IIC Protocol ..................................................................................................................259
14.4.1.1 START Signal ...............................................................................................260
14.4.1.2 Slave Address Transmission .........................................................................260
14.4.1.3 Data Transfer .................................................................................................260
14.4.1.4 STOP Signal ..................................................................................................261
14.4.1.5 Repeated START Signal ...............................................................................261
14.4.1.6 Arbitration Procedure ....................................................................................261
14.4.1.7 Clock Synchronization ..................................................................................261
14.4.1.8 Handshaking .................................................................................................262
14.4.1.9 Clock Stretching ............................................................................................262
14.5 Resets ............................................................................................................................................262
14.6 Interrupts .......................................................................................................................................262
14.6.1 Byte Transfer Interrupt .................................................................................................263
14.6.2 Address Detect Interrupt ...............................................................................................263
14.6.3 Arbitration Lost Interrupt .............................................................................................263
14.7 Initialization/Application Information ..........................................................................................264
Chapter 15
Analog-to-Digital Converter (S08ADC12V1)
15.1 Introduction ...................................................................................................................................267
15.1.1 ADC Configuration Information ..................................................................................267
15.1.1.1 Channel Assignments ....................................................................................267
15.1.1.2 Alternate Clock .............................................................................................268
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
17
Section Number
Title
Page
15.1.1.3 Hardware Trigger ..........................................................................................268
15.1.1.4 Analog Pin Enables .......................................................................................268
15.1.1.5 Temperature Sensor ......................................................................................268
15.1.1.6 Low-Power Mode Operation ........................................................................269
15.1.2 Features .........................................................................................................................270
15.1.3 Block Diagram ..............................................................................................................270
15.2 External Signal Description ..........................................................................................................271
15.2.1 Analog Power (V
) ................................................................................................272
DDAD
15.2.2 Analog Ground (V
) ..............................................................................................272
SSAD
15.2.3 Voltage Reference High (V
) .................................................................................272
REFH
15.2.4 Voltage Reference Low (V
) ..................................................................................272
REFL
15.2.5 Analog Channel Inputs (ADx) ......................................................................................272
15.3 Register Definition ........................................................................................................................272
15.3.1 Status and Control Register 1 (ADCSC1) ....................................................................272
15.3.2 Status and Control Register 2 (ADCSC2) ....................................................................274
15.3.3 Data Result High Register (ADCRH) ..........................................................................275
15.3.4 Data Result Low Register (ADCRL) ............................................................................275
15.3.5 Compare Value High Register (ADCCVH) ..................................................................276
15.3.6 Compare Value Low Register (ADCCVL) ...................................................................276
15.3.7 Configuration Register (ADCCFG) ..............................................................................276
15.3.8 Pin Control 1 Register (APCTL1) ................................................................................278
15.3.9 Pin Control 2 Register (APCTL2) ................................................................................279
15.3.10 Pin Control 3 Register (APCTL3) ................................................................................280
15.4 Functional Description ..................................................................................................................281
15.4.1 Clock Select and Divide Control ..................................................................................281
15.4.2 Input Select and Pin Control .........................................................................................282
15.4.3 Hardware Trigger ..........................................................................................................282
15.4.4 Conversion Control .......................................................................................................282
15.4.4.1 Initiating Conversions ...................................................................................282
15.4.4.2 Completing Conversions ...............................................................................283
15.4.4.3 Aborting Conversions ...................................................................................283
15.4.4.4 Power Control ...............................................................................................283
15.4.4.5 Sample Time and Total Conversion Time .....................................................283
15.4.5 Automatic Compare Function ......................................................................................285
15.4.6 MCU Wait Mode Operation .........................................................................................285
15.4.7 MCU Stop3 Mode Operation .......................................................................................285
15.4.7.1 Stop3 Mode With ADACK Disabled ............................................................285
15.4.7.2 Stop3 Mode With ADACK Enabled .............................................................286
15.4.8 MCU Stop1 and Stop2 Mode Operation ......................................................................286
15.5 Initialization Information ..............................................................................................................286
15.5.1 ADC Module Initialization Example ...........................................................................286
15.5.1.1 Initialization Sequence ..................................................................................286
15.5.1.2 Pseudo — Code Example .............................................................................287
15.6 Application Information ................................................................................................................288
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
18
Freescale Semiconductor
Section Number
Title
Page
15.6.1 External Pins and Routing ............................................................................................288
15.6.1.1 Analog Supply Pins ......................................................................................288
15.6.1.2 Analog Reference Pins ..................................................................................289
15.6.1.3 Analog Input Pins .........................................................................................289
15.6.2 Sources of Error ............................................................................................................290
15.6.2.1 Sampling Error ..............................................................................................290
15.6.2.2 Pin Leakage Error .........................................................................................290
15.6.2.3 Noise-Induced Errors ....................................................................................290
15.6.2.4 Code Width and Quantization Error .............................................................291
15.6.2.5 Linearity Errors .............................................................................................291
15.6.2.6 Code Jitter, Non-Monotonicity and Missing Codes ......................................292
Chapter 16
Analog Comparator (S08ACMPV2)
16.1 Introduction ...................................................................................................................................293
16.1.1 ACMP/TPM1 Configuration Information ....................................................................293
16.1.2 AMCPO Availability ....................................................................................................293
16.1.3 Features .........................................................................................................................295
16.1.4 Modes of Operation ......................................................................................................295
16.1.4.1 ACMP in Wait Mode ....................................................................................295
16.1.4.2 ACMP in Stop Modes ...................................................................................295
16.1.4.3 ACMP in Active Background Mode .............................................................295
16.1.5 Block Diagram ..............................................................................................................295
16.2 External Signal Description ..........................................................................................................297
16.3 Register Definition ........................................................................................................................297
16.3.1 ACMP Status and Control Register (ACMPSC) ..........................................................298
16.4 Functional Description ..................................................................................................................299
Chapter 17
Development Support
17.1 Introduction ...................................................................................................................................301
17.1.1 Features .........................................................................................................................301
17.2 Background Debug Controller (BDC) ..........................................................................................302
17.2.1 BKGD Pin Description .................................................................................................302
17.2.2 Communication Details ................................................................................................303
17.2.3 BDC Commands ...........................................................................................................307
17.2.4 BDC Hardware Breakpoint ..........................................................................................309
17.3 On-Chip Debug System (DBG) ....................................................................................................310
17.3.1 Comparators A and B ...................................................................................................310
17.3.2 Bus Capture Information and FIFO Operation .............................................................310
17.3.3 Change-of-Flow Information ........................................................................................311
17.3.4 Tag vs. Force Breakpoints and Triggers .......................................................................311
17.3.5 Trigger Modes ..............................................................................................................312
17.3.6 Hardware Breakpoints ..................................................................................................314
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
19
Section Number
Title
Page
17.4 Register Definition ........................................................................................................................314
17.4.1 BDC Registers and Control Bits ...................................................................................314
17.4.1.1 BDC Status and Control Register (BDCSCR) ..............................................315
17.4.1.2 BDC Breakpoint Match Register (BDCBKPT) ............................................316
17.4.2 System Background Debug Force Reset Register (SBDFR) ........................................316
17.4.3 DBG Registers and Control Bits ..................................................................................317
17.4.3.1 Debug Comparator A High Register (DBGCAH) ........................................317
17.4.3.2 Debug Comparator A Low Register (DBGCAL) .........................................317
17.4.3.3 Debug Comparator B High Register (DBGCBH) .........................................317
17.4.3.4 Debug Comparator B Low Register (DBGCBL) ..........................................317
17.4.3.5 Debug FIFO High Register (DBGFH) ..........................................................318
17.4.3.6 Debug FIFO Low Register (DBGFL) ...........................................................318
17.4.3.7 Debug Control Register (DBGC) ..................................................................319
17.4.3.8 Debug Trigger Register (DBGT) ..................................................................320
17.4.3.9 Debug Status Register (DBGS) .....................................................................321
Appendix A
Electrical Characteristics
A.1 Introduction ...................................................................................................................................323
A.2 Absolute Maximum Ratings ..........................................................................................................323
A.3 Thermal Characteristics .................................................................................................................324
A.4 Electrostatic Discharge (ESD) Protection Characteristics ............................................................325
A.5 DC Characteristics .........................................................................................................................326
A.6 Supply Current Characteristics ......................................................................................................330
A.7 ADC Characteristics ......................................................................................................................333
A.8 LCD Characteristics ......................................................................................................................336
A.9 Internal Clock Generation Module Characteristics .......................................................................339
A.9.1 ICG Frequency Specifications ........................................................................................339
A.10 AC Characteristics .........................................................................................................................341
A.10.1 Control Timing ...............................................................................................................342
A.10.2 Timer/PWM (TPM) Module Timing ..............................................................................343
A.10.3 SPI Timing ......................................................................................................................344
A.11 FLASH Specifications ...................................................................................................................347
A.12 EMC Performance .........................................................................................................................348
A.12.1 Radiated Emissions .........................................................................................................348
A.12.2 Conducted Transient Susceptibility ................................................................................349
Appendix B
Ordering Information and Mechanical Drawings
B.1 Ordering Information ....................................................................................................................351
B.2 Mechanical Drawings ....................................................................................................................351
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
20
Freescale Semiconductor
Chapter 1
Device Overview
1.1
Introduction
MC9S08LC60 Series MCUs are members of the low-cost, high-performance HCS08 Family of 8-bit
microcontroller units (MCUs). All MCUs in the family use the enhanced HCS08 core and are available
with a variety of modules, memory sizes, memory types, and package types.
1.2
Devices in the MC9S08LC60 Series
Table 1-1 lists the devices available in the MC9S08LC60 Series and summarizes the differences among
them.
Table 1-1. Devices in the MC9S08LC60 Series
Device
FLASH A
FLASH B
RAM
Package
MC9S08LC60
MC9S08LC36
32K
24K
28K
12K
4K
80 LQFP
64 LQFP
2.5K
Table 1-2. Package Options by Feature
Package
Feature
80-Pin
64-Pin
ACMP
ADC
IIC
yes
8-ch
yes
yes
yes
2-ch
yes
yes
IRQ
KBI1
KBI2
8
8
2
8
SCI
yes
yes
SPI1
SPI2
yes
yes
yes
yes
TPM1
TPM2
2-ch
2-ch
2-ch
2-ch
24 - I/O
2 - Output only
1- Input only
18 - I/O
2 - Output only
1- Input only
Shared
I/O pins (max)
4x40
3x41
4x32
3x33
LCD
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
21
Chapter 1 Device Overview
1.3
MCU Block Diagram
Figure 1-1 shows the structure of the MC9S08LC60 Series MCUs.
HCS08 CORE
ON-CHIP ICE
DEBUG MODULE (DBG)
CPU
INT
ADP[7:4]
ADP3
4
PTA[7:4]/KBI1P[7:4]/ADP[7:4]
12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
ADP2
BKGD
BKP
ADP1
ADP0
HCS08 SYSTEM CONTROL
ACMP–
ACMP+
ANALOG COMPARATOR
PTA3/KBI1P3/ADP3/ACMP–
PTA2/KBI1P2/ADP2/ACMP+
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
(ACMP)
8-BIT KEYBOARD
8
PTA[1:0]/KBI1P[1:0]/ADP[1:0]
INTERRUPT (KBI1)
RTI
COP
LVD
IRQ
SS1
PTB7/KBI2P4/SS1
PTB6/KBI2P3/SPSCK1
SPSCK1
MISO1
SERIAL PERIPHERAL
INTERFACE (SPI1)
USER FLASH A
MOSI1
(LC60 = 32,768 BYTES)
(LC36 = 24,576 BYTES)
SCL
SDA
PTB5/MOSI1/SCL
PTB4/MISO1/SDA
IIC MODULE (IIC)
USER FLASH B
PTB3/KBI2P2
PTB2/RESET
RESET
(LC60 = 28,464 BYTES)
(LC36 = 12,288 BYTES)
5
3
8-BIT KEYBOARD
INTERRUPT (KBI2)
XTAL
EXTAL
USER RAM
PTB1/KBI2P1/XTAL
PTB0/KBI2P0/EXTAL
(LC60 = 4096 BYTES)
(LC36 = 2560 BYTES)
IRQ
PTC7/KBI2P7/IRQ/TPMCLK
PTC6/BKGD/MS
INTERNAL CLOCK
GENERATOR (ICG)
TPM2CH1
TPM2CH0
2-CHANNEL TIMER/PWM
PTC5/KBI2P6/TPM2CH1
PTC4/KBI2P5/TPM2CH0
(TPM2)
TPMCLK
TPM1CH0
TPM1CH1
LOW-POWER OSCILLATOR
2-CHANNEL TIMER/PWM
(TPM1)
V
LCD
SS2
V
LL1
PTC3/SS2/TPM1CH1
SPSCK2
MOSI2
MISO2
V
SERIAL PERIPHERAL
LL2
PTC2/SPSCK2/TPM1CH0
LIQUID CRYSTAL
DISPLAY DRIVER
LCD
INTERFACE (SPI2)
V
LL3
V
V
CAP1
CAP2
TxD
RxD
PTC1/MOSI2/TxD
PTC0/MISO2/RxD
SERIAL COMMUNICATIONS
INTERFACE (SCI)
BP[2:0]
BP3/FP40
FP[39:0]
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pulldown device if IRQ enabled
(IRQPE = 1).
V
DD
VOLTAGE
3. IRQ does not have a clamp diode to V . IRQ should not be driven above V
.
DD
DD
V
4. Pin contains integrated pullup device.
REGULATOR
SS
5. Input-only RESET is shared with output-only PTB2. Default function after reset is
RESET.
6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is
output-only PTC7.
VREFH
VREFL
7. PTC6/BKGD/MS is an output only pin
8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP.
9. ACMPO is not available.
VDDAD
VSSAD
Figure 1-1. MC9S08LC60 Series Block Diagram
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
22
Freescale Semiconductor
Chapter 1 Device Overview
Table 1-3 lists the functional versions of the on-chip modules.
Table 1-3. Module Versions
Module
Version
Analog Comparator (ACMP)
2
1
4
1
2
3
3
2
1
2
Analog-to-Digital Converter (ADC)
Internal Clock Generator (ICG)
Inter-Integrated Circuit (IIC)
Keyboard Interrupt (KBI)
Serial Communications Interface (SCI)
Serial Peripheral Interface (SPI)
Timer Pulse-Width Modulator (TPM)
Liquid Crystal Display Module (LCD)
Central Processing Unit (CPU)
1.4
System Clock Distribution
TPMCLK
IIC
1-kHz
SYSTEM
CONTROL
LOGIC
TPM1
TPM2
SCI
SPI1
SPI2
ACMP
ICGERCLK
RTI
FFE
÷2
ICG
FIXED FREQ CLOCK
(XCLK)
BUSCLK
ICGOUT
÷2
ICGLCLK*
COP
CPU
BDC
LCD
ADC
RAM
FLASH
ADC has min and max
frequency requirements.
FLASH has frequency
requirements for program
See Chapter 1, “Introduction” and erase operation.
and the Electricals Appendix. See the Electricals Appendix.
* ICGLCLK is the alternate BDC clock source for the MC9S08LC60 Series.
Figure 1-2. System Clock Distribution Diagram
Some of the modules inside the MCU have clock source choices. Figure 1-2 shows a simplified clock
connection diagram. The ICG supplies the clock sources:
•
ICGOUT is an output of the ICG module. It is one of the following:
— The external crystal oscillator
— An external clock source
— The output of the digitally-controlled oscillator (DCO) in the frequency-locked loop
sub-module
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
23
Chapter 1 Device Overview
Control bits inside the ICG determine which source is connected.
•
FFE is a control signal generated inside the ICG. If the frequency of ICGOUT > 4 × the frequency
of ICGERCLK, this signal is a logic 1 and the fixed-frequency clock will be the ICGERCLK.
Otherwise the fixed-frequency clock will be BUSCLK.
•
•
ICGLCLK — Development tools can select this internal self-clocked source (~ 8 MHz) to speed
up BDC communications in systems where the bus clock is slow.
ICGERCLK — External reference clock can be selected as the real-time interrupt clock source.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
24
Freescale Semiconductor
Chapter 2
Pins and Connections
2.1
Introduction
This section describes signals that connect to package pins. It includes a pinout diagram, a table of signal
properties, and detailed discussion of signals.
2.2
Device Pin Assignment
Figure 2-1 and Figure 2-2 show the pin assignments for the MC9S08LC60 Series devices in its available
packages.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
25
Chapter 2 Pins and Connections
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
FP6
FP5
FP4
FP3
FP2
FP1
FP0
BP0
BP1
1
2
3
4
5
6
7
8
FP27
FP28
FP29
FP30
FP31
FP32
FP33
FP34
FP35
FP36
FP37
FP38
9
BP2
10
11
12
13
14
15
16
17
18
19
20
MC9S08LC60 Series
BP3/FP40
80-Pin LQFP
V
cap1
V
FP39
cap2
V
PTC7/KBI2P7/IRQ/TPMCLK
PTC6/ BKGD/MS
PTC5/KBI2P6/TPM2CH1
PTC4/KBI2P5/TPM2CH0
PTC3/SS2/TPM1CH1
PTC2/SPSCK2/TPM1CH0
PTC1/MOSI2/TxD
LL1
V
LL2
V
LL3
V
LCD
PTA0/KBI1P0/ADP0
PTA1/KBI1P1/ADP1
PTA2/KBI1P2/ADP2/ACMP
+
Figure 2-1. MC9S08LC60 Series in 80-Pin LQFP Package
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
26
Freescale Semiconductor
Chapter 2 Pins and Connections
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
FP5
FP4
FP3
FP2
FP1
FP0
BP0
BP1
BP2
1
2
3
4
5
6
7
8
FP22
FP23
FP24
FP25
FP26
FP27
FP28
FP29
FP30
FP31
MC9S08LC60 Series
64-Pin LQFP
9
BP3/FP40
10
11
12
13
14
15
16
V
V
PTC7/KBI2P7/IRQ/TPMCLK
PTC6 /BKGD/MS
PTC5/KBI2P6/TPM2CH1
PTC4/KBI2P5/TPM2CH0
PTC3/SS2/TPM1CH1
CAP1
CAP2
V
LL1
V
LL2
V
LL3
V
PTC2/SPSCK2/TPM1CH0
LCD
Note: VREFH/VREFL are internally connected to VDDAD/VSSAD in the 64-pin package.
Figure 2-2. MC9S08LC60 Series in 64-Pin LQFP Package
2.3
Recommended System Connections
Figure 2-3 shows pin connections that are common to most MC9S08LC60 Series application systems in
the 80-pin package. Connections will be similar to the 64-pin package except for the number of I/O pins
available. A more detailed discussion of system connections follows.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
27
Chapter 2 Pins and Connections
V
V
REFH
PTA[7:4]/KBI1P[7:4]/ADP[7:4]
PTA3/KBI1P3/ADP3/ACMP–
PTA2/KBI1P2/ADP2/ACMP+
PTA[1:0]/KBI1P[1:0]/ADP[1:0]
DDAD
MC9S08LC60
C
BYAD
0.1 μF
V
V
SSAD
V
DD
SYSTEM
POWER
REFL
V
DD
+
3 V
PTB7/KBI2P4/SS1
PTB6/KBI2P3/SPSCK1
PTB5/MOSI1/SCL
PTB4/MISO1/SDA
PTB3/KBI2P2
+
C
C
BY
BLK
0.1 μF
10 μF
V
SS
PTB2/RESET
PTB1/KBI2P1/XTAL
PTB0/KBI2P0/EXTAL
NOTE 1
INTERFACE TO
I/O AND
R
F
R
S
PTB1/KBI2P1/XTAL
PTB0/KBI2P0/EXTAL
PERIPHERAL
APPLICATION
C2
C1
X1
PTC7/KBI2P7/IRQ/TPMCLK
PTC6/BKGD/MS
PTC5/KBI2P6/TPM2CH1
PTC4/KBI2P5/TPM2CH0
PTC3/SS2/TPM1CH1
PTC2/SPSCK2/TPM1CH0
PTC1/MOSI2/TxD
SYSTEM
BACKGROUND HEADER
NOTE 2
PTC0/MISO2/RxD
V
DD
PTC6/BKGD/MS
V
DD
4.7 kΩ to
BP[2:0]
10 kΩ
BP3/FP40
FP[39:0]
NOTE 6
PTB2/RESET
NOTE6
0.1 μF
OPTIONAL
MANUAL
RESET
NOTES:
1. Not required if using the internal oscillator
option.
V
NOTE 5
X
LCD
2. BKGD/MS is the same pin as PTC6.
3. The 64-pin LQFP combines (VSSAD to
V
LL1
NOTE 4
V
V
VREFL) and combines (VDDAD to VREFH
)
LL2
4. VLCD, VLL1, VLL2, and VLL3 can be
powered internally using VDD or
externally based on software
LL3
C
C
C
BYLCD
BYLCD
BYLCD
configuration of the LCD module.
(Shown as internally powered).
5. VLCD is a “no connect” when the LCD
module is being powered via VDD
.
V
CAP1
6. An RC filter on RESET is recommended
for EMC-sensitive applications.
C
LCD
V
CAP2
Figure 2-3. Basic System Connections
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
28
Freescale Semiconductor
Chapter 2 Pins and Connections
2.3.1
Power (VDD, VSS, VDDAD, VSSAD)
V
and V are the primary power supply pins for the MCU. This voltage source supplies power to all
SS
DD
I/O buffer circuitry and to an internal voltage regulator. The internal voltage regulator provides regulated
lower-voltage source to the CPU and other internal circuitry of the MCU.
Typically, application systems have two separate capacitors across the power pins. In this case, there
should be a bulk electrolytic capacitor, such as a 10-μF tantalum capacitor, to provide bulk charge storage
for the overall system and a 0.1-μF ceramic bypass capacitor located as close to the MCU power pins as
practical to suppress high-frequency noise.
V
and V
are the analog power supply pins for the MCU. This voltage source supplies power to
DDAD
SSAD
the ADC. A 0.1-μF ceramic bypass capacitor should be located as close to the MCU power pins as
practical to suppress high-frequency noise.
2.3.2
ADC Reference Pins (VREFH, VREFL)
V
V
are the voltage reference high and voltage reference low pins, respectively, for the ADC
REFH and REFL
module. In the 64-pin package, V
V
are shared with V
and V
, respectively.
SSAD
REFH and REFL
DDAD
2.3.3
Oscillator (XTAL, EXTAL)
Out of reset, the MCU uses an internally generated clock (self-clocked mode — f
), that is
Self_reset
approximately equivalent to an 8-MHz crystal rate. This frequency source is used during reset startup and
can be enabled as the clock source for stop recovery to avoid the need for a long crystal startup delay. This
MCU also contains a trimmable internal clock generator (ICG) module that can be used to run the MCU.
For more information on the ICG, see Chapter 10, “Internal Clock Generator (S08ICGV4).”
The oscillator in this MCU is a Pierce oscillator that can accommodate a crystal or ceramic resonator in
either of two frequency ranges selected by the RANGE bit in the ICGC1 register. Rather than a crystal or
ceramic resonator, an external oscillator can be connected to the EXTAL input pin, and the XTAL output
pin can be used as general I/O.
Refer to Figure 2-3 for the following discussion. R (when used) and R should be low-inductance
S
F
resistors such as carbon composition resistors. Wire-wound resistors, and some metal film resistors, have
too much inductance. C1 and C2 normally should be high-quality ceramic capacitors that are specifically
designed for high-frequency applications.
R is used to provide a bias path to keep the EXTAL input in its linear range during crystal startup and its
F
value is not generally critical. Typical systems use 1 MΩ to 10 MΩ. Higher values are sensitive to humidity
and lower values reduce gain and (in extreme cases) could prevent startup.
C1 and C2 are typically in the 5-pF to 25-pF range and are chosen to match the requirements of a specific
crystal or resonator. Be sure to take into account printed circuit board (PCB) capacitance and MCU pin
capacitance when sizing C1 and C2. The crystal manufacturer typically specifies a load capacitance which
is the series combination of C1 and C2 which are usually the same size. As a first-order approximation,
use 10 pF as an estimate of combined pin and PCB capacitance for each oscillator pin (EXTAL and
XTAL).
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
29
Chapter 2 Pins and Connections
2.3.4
RESET Pin
After POR, the configuration of the PTB2/RESET pin defaults to RESET. Clearing the RSTPE bit in
SOPT1 register configures the pin to be the PTB2 general-purpose, output only pin. After configured as
PTB2, the pin will remain PTB2 until the next reset. The RESET pin can be used to reset the MCU from
an external source when the pin is driven low.
When enabled as the RESET pin (RSTPE = 1), an internal pullup device is automatically enabled. It has
input hysteresis, a high current output driver, and no output slew rate control. Internal power-on reset and
low-voltage reset circuitry typically make external reset circuitry unnecessary.
The PTB2/RESET pin will default to the RESET pin when a POR enters active background mode. This
pin is normally connected to the standard 6-pin background debug connector so a development system can
directly reset the MCU system. If desired, when the pin is configured as the RESET pin, a manual external
reset can be added by supplying a simple switch to ground (pull reset pin low to force a reset).
Whenever any reset is initiated (whether from an external signal or from an internal system), the reset pin
is driven low for approximately 34 cycles of f
, released, and sampled again approximately 38
Self_reset
cycles of f
later. If reset was caused by an internal source such as low-voltage reset or watchdog
Self_reset
timeout, the circuitry expects the reset pin sample to return a logic 1. The reset circuitry decodes the cause
of reset and records it by setting a corresponding bit in the system control reset status register (SRS).
In EMC-sensitive applications, an external RC filter is recommended on the reset pin. See Figure 2-3 for
an example.
2.3.5
Background / Mode Select (BKGD/MS)
The background / mode select (BKGD/MS) shares its function with an output-only port pin, PTC6. While
in reset, the pin functions as a mode select pin. Immediately after reset rises the pin functions as the
background pin and can be used for background debug communication. While functioning as a
background/mode select pin (BKGDPE = 1), the pin includes an internal pullup device, input hysteresis,
a standard output driver, and no output slew rate control. When used as an I/O port, the pin is limited to
output only.
If nothing is connected to this pin, the MCU will enter normal operating mode at the rising edge of reset.
If a debug system is connected to the 6-pin standard background debug header, it can hold BKGD/MS low
during the rising edge of reset which forces the MCU to active background mode.
The BKGD pin is used primarily for background debug controller (BDC) communications using a custom
protocol that uses 16 clock cycles of the target MCU’s BDC clock per bit time. The target MCU’s BDC
clock could be as fast as the bus clock rate, so there should never be any significant capacitance connected
to the BKGD/MS pin that could interfere with background serial communications.
Although the BKGD pin is a pseudo open-drain pin, the background debug communication protocol
provides brief, actively driven, high speedup pulses to ensure fast rise times. Small capacitances from
cables and the absolute value of the internal pullup device play almost no role in determining rise and fall
times on the BKGD pin.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
30
Freescale Semiconductor
Chapter 2 Pins and Connections
2.3.6
LCD Pins
2.3.6.1
LCD Power Pins
The V
, V , V , V , V
, and V
pins are dedicated to providing power to the LCD module.
cap2
LCD LL1 LL2 LL3 cap1
For detailed information about these pins see the LCD chapter.
2.3.6.2
LCD Frontplane and Backplane Driver Pins
44 pins are dedicated to frontplane and backplane drivers; on the 64-pin package, 36 pins are dedicated.
Immediately after reset, the LCD driver pins are high-impedance. For detailed information about LCD
frontplane and backplane driver pins, see the LCD chapter.
2.3.7
General-Purpose I/O and Peripheral Ports
MC9S08LC60 Series MCUs support up to 24 general-purpose I/O pins which are shared with on-chip
peripheral functions (timers, serial I/O, ADC, keyboard interrupts, etc.). On each MC9S08LC60 Series
device, there is one input-only and two output-only port pins. When a port pin is configured as a
general-purpose output or a peripheral uses the port pin as an output, software can select one of two drive
strengths and enable or disable slew rate control. When a port pin is configured as a general-purpose input
or a peripheral uses the port pin as an input, software can enable a pullup device. For information about
controlling these pins as general-purpose I/O pins, see Chapter 6, “Parallel Input/Output.”
Immediately after reset, all pins that are not output-only are configured as high-impedance
general-purpose inputs with internal pullup devices disabled. After reset, the output-only port function is
not enabled but is configured for low output drive strength with slew rate control enabled. The PTC6 pin
defaults to BKGD/MS on any reset.
NOTE
To avoid extra current drain from floating input pins, the reset initialization
routine in the application program should either enable on-chip pullup
devices or change the direction of unused pins to outputs so the pins do not
float.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
31
Chapter 2 Pins and Connections
Table 2-1. Pin Availability by Package Pin-Count
Pin
Pin
Number
<-- Lowest Priority --> Highest
<-- Lowest Priority --> Highest
Number
80 64 Port Pin
Alt 1
Alt 2
Alt3
80 64 Port Pin
Alt 1
Alt 2
Alt3
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
78
80
32 PTC1
MOSI2
TxD
1
64
1
FP6
FP5
FP4
FP3
FP2
FP1
FP0
BP0
BP1
BP2
BP3
33 PTC2
SPSCK2
SS2
TPM1CH0
TPM1CH1
TPM2CH0
TPM2CH1
MS
2
34 PTC3
3
2
35 PTC4
KBI2P5
KBI2P6
BKGD
KBI2P7
FP39
FP38
FP37
FP36
FP35
FP34
FP33
FP32
FP31
FP30
FP29
FP28
FP27
FP26
FP25
FP24
FP23
FP22
FP21
FP20
FP19
FP18
FP17
FP16
FP15
FP14
FP13
FP12
FP11
FP10
FP9
4
3
36 PTC5
5
4
37 PTC6
6
5
38 PTC7
—
IRQ
TPMCLK
7
6
8
7
—
9
8
—
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
9
—
10
11
12
13
14
15
16
—
—
FP40
—
V
V
V
V
V
V
cap1
cap2
LL1
—
—
—
LL2
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
LL3
LCD
PTA0
PTA1
KBI1P0
KBI1P1
KBI1P2
KBI1P3
KBI1P4
KBI1P5
KBI1P6
KBI1P7
ADP0
ADP1
ADP2
ADP3
ADP4
ADP5
ADP6
ADP7
17 PTA2
18 PTA3
ACMP+
ACMP–
—
—
—
—
PTA4
PTA5
PTA6
PTA7
V
V
V
V
SSAD
REFL
REFH
DDAD
19
20
—
—
23
24
PTB0
PTB1
KBI2P0
KBI2P1
EXTAL
XTAL
V
V
DD
SS
25 PTB2
26 PTB3
27 PTB4
28 PTB5
29 PTB6
30 PTB7
31 PTC0
RESET
KBI2P2
MISO1
MOSI1
KBI2P3
KBI2P4
MISO2
SDA
SCL
SPSCK1
SS1
FP8
FP7
RxD
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
32
Freescale Semiconductor
Chapter 3
Modes of Operation
3.1
Introduction
The operating modes of the MC9S08LC60 Series are described in this section. Entry into each mode, exit
from each mode, and functionality while in each of the modes are described.
3.2
Features
•
Active background mode for code development
Wait mode:
•
— CPU halts operation to conserve power
— System clocks running
— Full voltage regulation is maintained
Stop modes:
•
— CPU and bus clocks stopped
— Stop1: Full power-down of internal circuits for maximum power savings
— Stop2: Partial power-down of internal circuits, RAM contents retained
— Stop3: All internal circuits powered for fast recovery; RAM and register contents are retained;
LCD module can be configured to remain operational
3.3
Run Mode
Run is the normal operating mode for the MC9S08LC60 Series. This mode is selected upon the MCU
exiting reset if the BKGD/MS pin is high. In this mode, the CPU executes code from internal memory with
execution beginning at the address fetched from memory at 0xFFFE:0xFFFF after reset.
3.4
Active Background Mode
The active background mode functions are managed through the background debug controller (BDC) in
the HCS08 core. The BDC, together with the on-chip debug module (DBG), provides the means for
analyzing MCU operation during software development.
Active background mode is entered in any of five ways:
•
•
•
•
•
When the BKGD/MS pin is low at the time the MCU exits reset
When a BACKGROUND command is received through the BKGD pin
When a BGND instruction is executed
When encountering a BDC breakpoint
When encountering a DBG breakpoint
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
33
Chapter 3 Modes of Operation
After entering active background mode, the CPU is held in a suspended state waiting for serial background
commands rather than executing instructions from the user’s application program.
Background commands are of two types:
•
Non-intrusive commands, defined as commands that can be issued while the user program is
running. Non-intrusive commands can be issued through the BKGD pin while the MCU is in run
mode; non-intrusive commands can also be executed when the MCU is in the active background
mode. Non-intrusive commands include:
— Memory access commands
— Memory-access-with-status commands
— BDC register access commands
— The BACKGROUND command
•
Active background commands, which can only be executed while the MCU is in active background
mode. Active background commands include commands to:
— Read or write CPU registers
— Trace one user program instruction at a time
— Leave active background mode to return to the user’s application program (GO)
The active background mode is used to program a bootloader or user application program into the FLASH
program memory before the MCU is operated in run mode for the first time. When MC9S08LC60 Series
MCUs are shipped from the Freescale factory, the FLASH program memory is erased by default unless
specifically noted, so there is no program that could be executed in run mode until the FLASH memory is
initially programmed. The active background mode can also be used to erase and reprogram the FLASH
memory after it has been previously programmed.
For additional information about the active background mode, refer to the Development Support chapter.
3.5
Wait Mode
Wait mode is entered by executing a WAIT instruction. Upon execution of the WAIT instruction, the CPU
enters a low-power state in which it is not clocked. The I bit in the condition code register (CCR) is cleared
when the CPU enters wait mode, enabling interrupts. When an interrupt request occurs, the CPU exits wait
mode and resumes processing, beginning with the stacking operations leading to the interrupt service
routine.
While the MCU is in wait mode, there are some restrictions on which background debug commands can
be used. Only the BACKGROUND command and memory-access-with-status commands are available
while the MCU is in wait mode. The memory-access-with-status commands do not allow memory access,
but they report an error indicating that the MCU is in either stop or wait mode. The BACKGROUND
command can be used to wake the MCU from wait mode and enter active background mode.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
34
Freescale Semiconductor
Chapter 3 Modes of Operation
3.6
Stop Modes
One of three stop modes is entered upon execution of a STOP instruction when STOPE in SOPT1 is set.
In any stop mode, the bus and CPU clocks are halted. The ICG module can be configured to leave the
reference clocks running. see Chapter 10, “Internal Clock Generator (S08ICGV4)” for more information.
Table 3-1 shows all of the control bits that affect stop mode selection and the mode selected under various
conditions. The stop mode behavior of the MCU is configured by setting the appropriate bits in the
SPMSC1 and SPMSC2 registers The selected mode is entered following the execution of a STOP
instruction.
Table 3-1. Stop Mode Selection
STOPE ENBDM 1 LVDE and LVDSE
PDC
PPDC
Stop Mode
0
x
x
x
x
Stop modes disabled; illegal opcode reset if STOP
instruction executed
1
1
1
1
1
1
0
0
0
0
x
1
0
0
0
x
x
0
1
1
x
x
x
1
0
Stop3 with BDM enabled 2
Stop3 with voltage regulator active
Stop33
Stop2
Stop1
1
ENBDM is located in the BDCSCR which is only accessible through BDC commands, see the Development Support
section.
2
3
When in Stop3 mode with BDM enabled, The SIDD will be near RIDD levels because internal clocks are enabled.
The LCD module can operate in stop3 if LCDSTP3 in LCDCR1 is asserted.
3.6.1
Stop3 Mode
Stop3 mode is entered by executing a STOP instruction under the conditions as shown in Table 3-1. The
states of all of the internal registers and logic, RAM contents, and I/O pin states are maintained.
Stop3 can be exited by asserting RESET, or by an interrupt from one of the following sources: the real-time
interrupt (RTI), LVD, ADC, IRQ or the KBI.
If stop3 is exited by means of the RESET pin, then the MCU is reset and operation will resume after taking
the reset vector. Exit by means of one of the internal interrupt sources results in the MCU taking the
appropriate interrupt vector.
A separate self-clocked source (≈1 kHz) for the real-time interrupt allows a wakeup from stop2 or stop3
mode with no external components. When RTIS2:RTIS1:RTIS0 = 0:0:0, the real-time interrupt function
and this 1-kHz source are disabled. Power consumption is lower when the 1-kHz source is disabled, but in
that case the real-time interrupt cannot wake the MCU from stop.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
35
Chapter 3 Modes of Operation
3.6.1.1
LVD Enabled in Stop Mode
The LVD system is capable of generating either an interrupt or a reset when the supply voltage drops below
the LVD voltage. If the LVD is enabled in stop (LVDE and LVDSE bits in SPMSC1 both set) at the time
the CPU executes a STOP instruction, then the voltage regulator remains active during stop mode.
For the ADC to operate the LVD must be left enabled when entering stop3.
3.6.1.2
Active BDM Enabled in Stop Mode
Entry into the active background mode from run mode is enabled if ENBDM in BDCSCR is set. This
register is described in the Development Support chapter of this data sheet. If ENBDM is set when the CPU
executes a STOP instruction, the system clocks to the background debug logic remain active when the
MCU enters stop mode. Because of this, background debug communication remains possible. In addition,
the voltage regulator does not enter its low-power standby state but maintains full internal regulation.
Most background commands are not available in stop mode. The memory-access-with-status commands
do not allow memory access, but they report an error indicating that the MCU is in either stop or wait
mode. The BACKGROUND command can be used to wake the MCU from stop and enter active
background mode if the ENBDM bit is set. After entering background debug mode, all background
commands are available.
3.6.2
Stop2 Mode
Stop2 mode is entered by executing a STOP instruction under the conditions as shown in Table 3-1. Most
of the internal circuitry of the MCU is powered off in stop2 as in stop1 with the exception of the RAM.
Upon entering stop2, all I/O pin control signals are latched so that the pins retain their states during stop2.
Exit from stop2 is performed by asserting the wake-up pins or RESET or IRQ.
NOTE
IRQ always functions as an active-low wakeup input when the MCU is in
stop2, regardless of how the pin is configured before entering stop2.
In addition, the real-time interrupt (RTI) can wake the MCU from stop2 if enabled.
Upon wake-up from stop2 mode, the MCU starts up as from a power-on reset (POR):
•
•
All module control and status registers are reset
The LVD reset function is enabled and the MCU remains in the reset state if V is below the LVD
DD
trip point (low trip point selected due to POR)
•
The CPU takes the reset vector
In addition to the above, upon waking up from stop2, the PPDF bit in SPMSC2 is set. This flag is used to
direct user code to go to a stop2 recovery routine. PPDF remains set and the I/O pin states remain latched
until a 1 is written to PPDACK in SPMSC2.
To maintain I/O states for pins that were configured as general-purpose I/O before entering stop2, the user
must restore the contents of the I/O port registers, which have been saved in RAM, to the port registers
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
36
Freescale Semiconductor
Chapter 3 Modes of Operation
before writing to the PPDACK bit. If the port registers are not restored from RAM before writing to
PPDACK, then the pins will switch to their reset states when PPDACK is written.
For pins that were configured as peripheral I/O, the user must reconfigure the peripheral module that
interfaces to the pin before writing to the PPDACK bit. If the peripheral module is not enabled before
writing to PPDACK, the pins will be controlled by their associated port control registers when the I/O
latches are opened.
3.6.3
Stop1 Mode
Stop1 mode is entered by executing a STOP instruction under the conditions as shown in Table 3-1. Most
of the internal circuitry of the MCU is powered off in stop1, providing the lowest possible standby current.
Upon entering stop1, all I/O pins automatically transition to their default reset states.
Exit from stop1 is performed by asserting the wake-up pins or RESET or IRQ.
NOTE
IRQ always functions as an active-low wakeup input when the MCU is in
stop1, regardless of how the pin is configured before entering stop1.
In addition, the real-time interrupt (RTI) can wake the MCU from stop1 if enabled.
Upon wake-up from stop1 mode, the MCU starts up as from a power-on reset (POR):
•
•
All module control and status registers are reset
The LVD reset function is enabled and the MCU remains in the reset state if V is below the LVD
DD
trip point (low trip point selected due to POR)
•
The CPU takes the reset vector
In addition to the above, upon waking up from stop1, the PDF bit in SPMSC2 is set. This flag is used to
direct user code to go to a stop1 recovery routine. PDF remains set until a 1 is written to PPDACK in
SPMSC2.
3.6.4
On-Chip Peripheral Modules in Stop Modes
When the MCU enters any stop mode, system clocks to the internal peripheral modules are stopped. Even
in the exception case (ENBDM = 1), where clocks to the background debug logic continue to operate,
clocks to the peripheral systems are halted to reduce power consumption. Refer to Section 3.6.3, “Stop1
Mode,” Section 3.6.2, “Stop2 Mode,” and Section 3.6.1, “Stop3 Mode,” for specific information on system
behavior in stop modes.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
37
Chapter 3 Modes of Operation
Table 3-2. Stop Mode Behavior
Mode
Peripheral
Stop1
Stop2
Stop3
CPU
Off
Off
Off
Off
Off
Off
Off
Off
Off
Off
Off
Off
Off
Hi-Z
Off
Standby
Off
Standby
Standby
RAM
FLASH
Standby
Parallel Port Registers
Off
Standby
ADC
Off
Optionally On1
ACMP
Off
Standby
ICG
Off
Optionally On2
Standby
IIC
Off
LCD
Off
Optionally On3
SCI
Off
Standby
SPI
Off
Standby
TPM
Off
Standby
Voltage Regulator
I/O Pins
Standby
States Held
Standby
States Held
1
2
3
Requires the asynchronous ADC clock and LVD to be enabled, else in standby.
OSCSPEN set in ICGC1, else in standby.
LCDSTP3 = 1 in the LCDCR1 register.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
38
Freescale Semiconductor
Chapter 4
Memory
4.1
MC9S08LC60 Series Memory Map
As shown in Figure 4-1, on-chip memory in the MC9S08LC60 Series consists of RAM, FLASH program
memory for nonvolatile data storage, plus I/O and control/status registers. The registers are divided into
three groups:
•
•
•
Direct-page registers (0x0000 through 0x005F)
High-page registers (0x1800 through 0x186F)
Nonvolatile registers (0xFFB0 through 0xFFBF)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
39
Chapter 4 Memory
0x0000
0x0000
DIRECT PAGE REGISTERS
DIRECT PAGE REGISTERS
0x005F
0x0060
0x005F
0x0060
RAM
RAM
4096 BYTES
2560 BYTES
0x0A5F
0x0A60
0x105F
0x1060
UNIMPLEMENTED
FLASH B
1952 BYTES
0x17FF
0x1800
0x17FF
0x1800
HIGH PAGE REGISTERS
HIGH PAGE REGISTERS
0x186F
0x1870
0x186F
0x1870
FLASH B
FLASH B
26,512 BYTES
12,288 BYTES
0x486F
0x4870
UNIMPLEMENTED
0x7FFF
0x8000
0x9FFF
0xA000
FLASH A
32,768 BYTES
FLASH A
24,576 BYTES
0xFFFF
0xFFFF
MC9S08LC36
MC9S08LC60
Figure 4-1. MC9S08LC60 Series Memory Map
4.1.1
Reset and Interrupt Vector Assignments
Table 4-1 shows address assignments for reset and interrupt vectors. The vector names shown in this table
are the labels used in the Freescale-provided equate file for the MC9S08LC60 Series. For more details
about resets, interrupts, interrupt priority, and local interrupt mask controls, refer to Chapter 5, “Resets,
Interrupts, and System Configuration.”
Table 4-1. Reset and Interrupt Vectors
Address
(High/Low)
Vector
Vector Name
0xFFC0–0xFFC1
Unused Vector Space
(available for user program)
0xFFD0–0xFFD1
0xFFD2–0xFFD3
LCD
Vlcd
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
40
Freescale Semiconductor
Chapter 4 Memory
Table 4-1. Reset and Interrupt Vectors
Vector
Address
(High/Low)
Vector Name
0xFFD4–0xFFD5
0xFFD6–0xFFD7
0xFFD8–0xFFD9
0xFFDA–0xFFDB
0xFFDC–0xFFDD
0xFFDE–0xFFDF
0xFFE0–0xFFE1
0xFFE2–0xFFE3
0xFFE4–0xFFE5
0xFFE6–0xFFE7
0xFFE8–0xFFE9
0xFFEA–0xFFEB
0xFFEC–0xFFED
0xFFEE–0xFFEF
0xFFF0–0xFFF1
0xFFF2–0xFFF3
0xFFF4–0xFFF5
0xFFF6–0xFFF7
0xFFF8–0xFFF9
0xFFFA–0xFFFB
0xFFFC–0xFFFD
0xFFFE–0xFFFF
RTI
IIC
Vrti
Viic
ACMP
Vacmp
Vadc
ADC Conversion
Keyboard 2
Keyboard 1
SCI Transmit
SCI Receive
SCI Error
Vkeyboard2
Vkeyboard1
Vscitx
Vscirx
Vscierr
Vspi2
SPI 2
SPI 1
Vspi1
TPM2 Overflow
TPM2 Channel 1
TPM2 Channel 0
TPM1 Overflow
TPM1 Channel 1
TPM1 Channel 0
ICG
Vtpm2ovf
Vtpm2ch1
Vtpm2ch0
Vtpm1ovf
Vtpm1ch1
Vtpm1ch0
Vicg
Low Voltage Detect
IRQ
Vlvd
Virq
SWI
Vswi
Reset
Vreset
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
41
Chapter 4 Memory
4.2
Register Addresses and Bit Assignments
The registers in the MC9S08LC60 Series are divided into these three groups:
•
•
•
Direct-page registers are located in the first 128 locations in the memory map, so they are
accessible with efficient direct addressing mode instructions.
High-page registers are used much less often, so they are located above 0x1800 in the memory
map. This leaves more room in the direct page for more frequently used registers and variables.
The nonvolatile register area consists of a block of 16 locations in FLASH memory at
0xFFB0–0xFFBF.
Nonvolatile register locations include:
— NVPROT and NVOPT are loaded into working registers at reset
— An 8-byte backdoor comparison key which optionally allows a user to gain controlled access
to secure memory
Because the nonvolatile register locations are FLASH memory, they must be erased and
programmed like other FLASH memory locations.
Direct-page registers can be accessed with efficient direct addressing mode instructions. Bit manipulation
instructions can be used to access any bit in any direct-page register. Table 4-2 is a summary of all
user-accessible direct-page registers and control bits.
The direct page registers in Table 4-2 can use the more efficient direct addressing mode which only
requires the lower byte of the address. Because of this, the lower byte of the address in column one is
shown in bold text. In Table 4-3 and Table 4-4 the whole address in column one is shown in bold. In
Table 4-2, Table 4-3, and Table 4-4, the register names in column two are shown in bold to set them apart
from the bit names to the right. Cells that are not associated with named bits are shaded. A shaded cell with
a 0 indicates this unused bit always reads as a 0. Shaded cells with dashes indicate unused or reserved bit
locations that could read as 1s or 0s.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
42
Freescale Semiconductor
Chapter 4 Memory
Table 4-2. Direct-Page Register Summary (Sheet 1 of 3)
Address Register Name
Bit 7
6
5
4
3
2
1
Bit 0
0x0000
0x0001
0x0002
0x0003
0x0004
0x0005
0x0006
0x0007
0x0008
0x0009
0x000A
0x000B
0x000C
0x000D
0x000E
0x000F
0x0010
0x0011
0x0012
0x0013
0x0014
0x0015
0x0016
0x0017
0x0018
0x0019
0x001A
0x001B
0x001C
0x001D
0x001E
0x001F
0x0020
0x0021
0x0022
0x0023
0x0024
0x0025
0x0026
0x0027
0x0028
0x0029
PTAD
PTAD7
PTADD7
PTBD7
PTAD6
PTADD6
PTBD6
PTAD5
PTADD5
PTBD5
PTAD4
PTADD4
PTBD4
PTAD3
PTADD3
PTBD3
PTAD2
PTADD2
PTBD2
PTAD1
PTADD1
PTBD1
PTAD0
PTADD0
PTBD0
PTADD
PTBD
PTBDD
PTCD
PTBDD7
PTCD7
PTBDD6
PTCD6
PTBDD5
PTCD5
PTBDD4
PTCD4
PTBDD3
PTCD3
PTBDD2
PTCD2
PTBDD1
PTCD1
PTBDD0
PTCD0
PTCDD
IRQSC
Reserved
KBI1SC
KBI1PE
KBI1ES
Reserved
KBI2SC
KBI2PE
KBI2ES
ACMPSC
ADCSC1
ADCSC2
ADCRH
ADCRL
ADCCVH
ADCCVL
ADCCFG
APCTL1
IICA
PTCDD7 PTCDD6 PTCDD5 PTCDD4 PTCDD3 PTCDD2 PTCDD1 PTCDD0
0
—
IRQPDD
IRQEDG
IRQPE
—
IRQF
—
IRQACK
—
IRQIE
—
IRQMOD
—
—
0
—
0
0
0
KBF
KBACK
KBIPE2
KBIE
KBIPE1
KBIMOD
KBIPE0
KBIPE7
KBIPE6
KBIPE5
KBIPE4
KBIPE3
KBEDG7 KBEDG6 KBEDG5 KBEDG4 KBEDG3 KBEDG2 KBEDG1 KBEDG0
—
0
—
0
—
0
—
0
—
—
—
—
KBF
KBACK
KBIPE2
KBIE
KBIMOD
KBIPE0
KBIPE7
KBIPE6
KBIPE5
KBIPE4
KBIPE3
KBIPE1
KBEDG7 KBEDG6 KBEDG5 KBEDG4 KBEDG3 KBEDG2 KBEDG1 KBEDG0
ACME
COCO
ADACT
0
ACBGS
AIEN
ADTRG
0
ACF
ADCO
ACFE
0
ACIE
ACO
R1
ACMOD
ADCH
—
ACFGT
0
—
—
—
ADR11
ADR3
ADR10
ADR2
ADCV10
ADCV2
ADR9
ADR1
ADR8
ADR0
ADCV8
ADCV0
ADR7
0
ADR6
0
ADR5
0
ADR4
0
ADCV11
ADCV3
ADCV9
ADCV1
ADCV7
ADLPC
ADPC7
ADCV6
ADCV5
ADCV4
ADLSMP
ADPC4
ADDR
ADIV
MODE
ADICLK
ADPC6
ADPC5
ADPC3
ADPC2
ADPC1
ADPC0
0
IICF
MULT
ICR
IICC
IICEN
TCF
IICIE
IAAS
MST
TX
TXAK
0
RSTA
SRW
0
0
IICS
BUSY
ARBL
IICIF
RXAK
IICD
DATA
Reserved
Reserved
Reserved
SCIBDH
SCIBDL
SCIC1
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0
0
SBR6
SCISWAI
TCIE
TC
0
SBR12
SBR4
M
SBR11
SBR3
WAKE
TE
SBR10
SBR2
ILT
SBR9
SBR1
PE
SBR8
SBR0
PT
SBR7
LOOPS
TIE
TDRE
0
SBR5
RSRC
RIE
RDRF
0
SCIC2
ILIE
IDLE
0
RE
RWU
FE
SBK
PF
SCIS1
OR
NF
SCIS2
0
0
BRK13
NEIE
2
0
RAF
PEIE
Bit 0
LSBFE
SPC0
SCIC3
R8
T8
TXDIR
5
TXINV
4
ORIE
3
FEIE
1
SCID
Bit 7
SPIE
0
6
SPI1C1
SPI1C2
SPE
0
SPTIE
0
MSTR
CPOL
CPHA
0
SSOE
SPISWAI
MODFEN BIDIROE
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
43
Chapter 4 Memory
Table 4-2. Direct-Page Register Summary (Sheet 2 of 3)
Address Register Name
Bit 7
6
5
4
3
2
1
Bit 0
0x002A
0x002B
0x002C
0x002D
0x002E
0x002F
0x0030
0x0031
0x0032
0x0033
0x0034
0x0035
0x0036
0x0037
0x0038
0x0039
0x003A
0x003B
0x003C
0x003D
0x003E
0x003F
0x0040
0x0041
0x0042
0x0043
0x0044
0x0045
0x0046
0x0047
0x0048
0x0049
0x004A
0x004B
0x004C
0x004D
0x004E
0x004F
0x0050
0x0051
0x0052
0x0053
SPI1BR
0
SPPR2
SPPR1
SPPR0
0
SPR2
SPR1
SPR0
SPI1S
SPRF
0
SPTEF
MODF
0
0
0
0
Reserved
SPI1D
0
0
0
0
0
0
0
0
Bit 7
6
5
4
3
2
1
Bit 0
Reserved
Reserved
SPI2C1
0
0
0
0
0
0
0
0
0
0
0
SPIE
0
0
0
0
0
0
SPE
SPTIE
MSTR
CPOL
CPHA
SSOE
LSBFE
SPI2C2
0
0
MODFEN BIDIROE
0
SPISWAI
SPC0
SPI2BR
0
SPPR2
SPPR1
SPPR0
0
0
0
3
0
0
SPR2
SPR1
SPR0
SPI2S
SPRF
0
0
SPTEF
MODF
0
0
0
0
Reserved
SPI2D
0
0
0
4
0
0
0
0
Bit 7
0
6
5
2
1
0
Bit 0
0
Reserved
Reserved
ICGC1
0
0
0
0
0
0
0
0
0
HGO
LOLRE
RANGE
REFS
MFD
REFST
0
CLKS
OSCSTEN
LOCD
RFD
ERCS
0
0
ICGC2
LOCRE
LOCK
0
ICGS1
CLKST
LOLS
LOCS
0
ICGIF
DCOS
ICGS2
0
0
0
0
0
0
ICGFLTU
ICGFLTL
ICGTRM
Reserved
TPM1SC
TPM1CNTH
TPM1CNTL
TPM1MODH
TPM1MODL
TPM1C0SC
TPM1C0VH
TPM1C0VL
TPM1C1SC
TPM1C1VH
TPM1C1VL
Reserved
Reserved
Reserved
Reserved
Reserved
TPM2SC
TPM2CNTH
TPM2CNTL
TPM2MODH
0
FLT
FLT
TRIM
0
0
TOIE
14
0
0
0
0
PS2
10
0
PS1
9
0
TOF
Bit 15
Bit 7
Bit 15
Bit 7
CH0F
Bit 15
Bit 7
CH1F
Bit 15
Bit 7
—
CPWMS
CLKSB
CLKSA
PS0
Bit 8
Bit 0
Bit 8
Bit 0
0
13
12
4
11
6
5
3
11
2
1
14
13
12
10
9
6
5
MS0B
13
4
3
2
1
CH0IE
14
MS0A
12
ELS0B
11
ELS0A
10
0
9
Bit 8
Bit 0
0
6
5
4
3
2
1
CH1IE
14
MS1B
13
MS1A
12
ELS1B
11
ELS1A
10
0
9
Bit 8
Bit 0
—
6
5
4
3
2
1
—
—
—
—
—
—
—
—
—
—
PS1
9
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
TOF
Bit 15
Bit 7
Bit 15
TOIE
14
CPWMS
13
CLKSB
12
CLKSA
11
PS2
10
PS0
Bit 8
Bit 0
Bit 8
6
5
4
3
2
1
14
13
12
11
10
9
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
44
Freescale Semiconductor
Chapter 4 Memory
Table 4-2. Direct-Page Register Summary (Sheet 3 of 3)
Address Register Name
Bit 7
6
5
4
3
2
1
Bit 0
0x0054
0x0055
0x0056
0x0057
0x0058
0x0059
0x005A
TPM2MODL
TPM2C0SC
TPM2C0VH
TPM2C0VL
TPM2C1SC
TPM2C1VH
TPM2C1VL
Reserved
Bit 7
CH0F
Bit 15
Bit 7
6
CH0IE
14
5
MS0B
13
4
MS0A
12
3
ELS0B
11
2
ELS0A
10
1
0
9
1
0
9
1
Bit 0
0
Bit 8
Bit 0
0
6
5
4
3
2
CH1F
Bit 15
Bit 7
CH1IE
14
MS1B
13
MS1A
12
ELS1B
11
ELS1A
10
Bit 8
Bit 0
6
5
4
3
2
0x005B–
0x005F
—
—
—
—
—
—
—
—
1
For the MC9S08LC60 Series, the AMCPO pin is not available, so the ACOPE bit in the ACMPSC register is reserved and does
not have any effect.
High-page registers, shown in Table 4-3, are accessed much less often than other I/O and control registers
so they have been located outside the direct addressable memory space, starting at 0x1800.
Table 4-3. High-Page Register Summary
Address Register Name
Bit 7
6
5
4
3
2
1
Bit 0
0x1800
0x1801
0x1802
0x1803
0x1804
0x1805
0x1806
0x1807
0x1808
0x1809
SRS
POR
0
PIN
0
COP
0
ILOP
0
0
0
ICG
LVD
0
BDFR
RSTPE
ACIC
—
SBDFR
SOPT1
SOPT2
Reserved
Reserved
SDIDH
0
0
0
COPE
COPCLKS
—
COPT
0
STOPE
0
—
0
BKGDPE
0
0
0
0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
REV3
ID7
REV2
ID6
REV1
ID5
REV0
ID4
RTIE
LVDRE
PDF
—
ID11
ID3
0
ID10
ID2
RTIS2
LVDE
PPDACK
—
ID9
ID1
RTIS1
0
ID8
SDIDL
ID0
SRTISC
SPMSC1
RTIF
LVDF
0
RTIACK
LVDACK
0
RTICLKS
LVDIE
0
RTIS0
BGBE
PPDC
—
LVDSE
PPDF
—
0x180A SPMSC2
0x180B Reserved
0x180C SPMSC3
PDC
—
—
—
—
LVWF
LVWACK
LVDV
LVWV
0
0
0
0
0x180D– Reserved
0x180F
—
—
—
—
—
—
—
—
0x1810
0x1811
0x1812
0x1813
0x1814
0x1815
0x1816
0x1817
0x1818
DBGCAH
DBGCAL
DBGCBH
DBGCBL
DBGFH
DBGFL
DBGC
Bit 15
Bit 7
14
6
13
5
12
11
3
10
2
9
Bit 8
Bit 0
4
1
9
Bit 15
Bit 7
14
13
12
11
10
Bit 8
6
5
4
3
2
1
Bit 0
Bit 15
Bit 7
14
13
12
11
10
9
Bit 8
6
5
4
3
2
1
Bit 0
DBGEN
TRGSEL
AF
ARM
BEGIN
BF
TAG
0
BRKEN
RWA
TRG3
CNT3
RWAEN
TRG2
CNT2
RWB
TRG1
CNT1
RWBEN
TRG0
CNT0
DBGT
0
0
DBGS
ARMF
0x1819– Reserved
0x181F
—
—
—
—
—
—
—
—
0x1820
0x1821
0x1822
0x1823
FCDIV
DIVLD
KEYEN
—
PRDIV8
DIV5
DIV4
0
DIV3
0
DIV2
0
DIV1
SEC01
—
DIV0
SEC00
—
FOPT
FNORED
0
—
Reserved
FCNFG
—
0
—
0
—
0
—
0
0
KEYACC
0
0
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
45
Chapter 4 Memory
Table 4-3. High-Page Register Summary (continued)
Address Register Name
Bit 7
6
5
4
3
2
1
Bit 0
0x1824
0x1825
0x1826
FPROT
FSTAT
FCMD
FPS7
FCBEF
FCMD7
FPS6
FCCF
FPS5
FPS4
FACCERR
FCMD4
FPS3
0
FPS2
FBLANK
FCMD2
FPS1
0
FPDIS
0
FPVIOL
FCMD5
FCMD6
FCMD3
FCMD1
FCMD0
0x1827– Reserved
0x182F
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0x1830
0x1831
0x1832
0x1833
0x1834
0x1835
0x1836
0x1837
0x1838
0x1839
PTAPE
PTASE
PTADS
Reserved
PTBPE
PTBSE
PTBDS
Reserved
PTCPE
PTCSE
PTAPE7
PTASE7
PTADS7
0
PTAPE6
PTASE6
PTADS6
0
PTAPE5
PTASE5
PTADS5
0
PTAPE4
PTASE4
PTADS4
0
PTAPE3
PTASE3
PTADS3
0
PTAPE2
PTASE2
PTADS2
0
PTAPE1
PTASE1
PTADS1
0
PTAPE0
PTASE0
PTADS0
0
PTBPE7
PTBSE7
PTBDS7
0
PTBPE6
PTBSE6
PTBDS6
0
PTBPE5
PTBSE5
PTBDS5
0
PTBPE4
PTBSE4
PTBDS4
0
PTBPE3
PTBSE3
PTBDS3
0
PTBPE2
PTBSE2
PTBDS2
0
PTBPE1
PTBSE1
PTBDS1
0
PTBPE0
PTBSE0
PTBDS0
0
PTCPE7
PTCSE7
PTCDS7
PTCPE6
PTCSE6
PTCDS6
PTCPE5
PTCSE5
PTCDS5
PTCPE4
PTCSE4
PTCDS4
PTCPE3
PTCSE3
PTCDS3
PTCPE2
PTCSE2
PTCDS2
PTCPE1
PTCSE1
PTCDS1
PTCPE0
PTCSE0
PTCDS0
0x183A PTCDS
0x183B- Reserved
0x187F
—
—
—
—
—
—
—
—
0x1840
0x1841
0x1842
0x1843
0x1844
0x1845
0x1846
0x1847
0x1848
0x1849
LCDCR0
LCDCR1
FPENR0
FPENR1
FPENR2
FPENR3
FPENR4
FPENR5
LCDRAM0
LCDRAM1
LCDEN
LCDIEN
FP7EN
FP15EN
FP23EN
FP31EN
FP39EN
0
LPWAVE
0
LCLK2
0
LCLK1
0
LCLK0
0
0
DUTY1
LCDWAI
FP1EN
FP9EN
FP17EN
FP25EN
FP33EN
0
DUTY0
LCDSTP3
FP0EN
0
FP6EN
FP14EN
FP22EN
FP30EN
FP38EN
0
FP5EN
FP13EN
FP21EN
FP29EN
FP37EN
0
FP4EN
FP12EN
FP20EN
FP28EN
FP36EN
0
FP3EN
FP11EN
FP19EN
FP27EN
FP35EN
0
FP2EN
FP10EN
FP18EN
FP26EN
FP34EN
0
FP8EN
FP16EN
FP24EN
FP32EN
FP40EN
FP0BP0
FP2BP0
FP4BP0
FP6BP0
FP8BP0
FP1BP3
FP3BP3
FP5BP3
FP7BP3
FP9BP3
FP1BP2
FP3BP2
FP5BP2
FP7BP2
FP9BP2
FP1BP1
FP3BP1
FP5BP1
FP7BP1
FP9BP1
FP1BP0
FP3BP0
FP5BP0
FP7BP0
FP9BP0
FP0BP3
FP2BP3
FP4BP3
FP6BP3
FP8BP3
FP0BP2
FP2BP2
FP4BP2
FP6BP2
FP8BP2
FP0BP1
FP2BP1
FP4BP1
FP6BP1
FP8BP1
0x184A LCDRAM2
0x184B LCDRAM3
0x184C LCDRAM4
0x184D LCDRAM5
FP11BP3 FP11BP2 FP11BP1 FP11BP0 FP10BP3 FP10BP2 FP10BP1 FP10BP0
FP13BP3 FP13BP2 FP13BP1 FP13BP0 FP12BP3 FP12BP2 FP12BP1 FP12BP0
FP15BP3 FP15BP2 FP15BP1 FP15BP0 FP14BP3 FP14BP2 FP14BP1 FP14BP0
FP17BP3 FP17BP2 FP17BP1 FP17BP0 FP16BP3 FP16BP2 FP16BP1 FP16BP0
FP19BP3 FP19BP2 FP19BP1 FP19BP0 FP18BP3 FP18BP2 FP18BP1 FP18BP0
FP21BP3 FP21BP2 FP21BP1 FP21BP0 FP20BP3 FP20BP2 FP20BP1 FP20BP0
FP23BP3 FP23BP2 FP23BP1 FP23BP0 FP22BP3 FP22BP2 FP22BP1 FP22BP0
FP25BP3 FP25BP2 FP25BP1 FP25BP0 FP24BP3 FP24BP2 FP24BP1 FP24BP0
FP27BP3 FP27BP2 FP27BP1 FP27BP0 FP26BP3 FP26BP2 FP26BP1 FP26BP0
FP29BP3 FP29BP2 FP29BP1 FP29BP0 FP28BP3 FP28BP2 FP28BP1 FP28BP0
FP31BP3 FP31BP2 FP31BP1 FP31BP0 FP30BP3 FP30BP2 FP30BP1 FP30BP0
FP33BP3 FP33BP2 FP33BP1 FP33BP0 FP32BP3 FP32BP2 FP32BP1 FP32BP0
FP35BP3 FP35BP2 FP35BP1 FP35BP0 FP34BP3 FP34BP2 FP34BP1 FP34BP0
FP37BP3 FP37BP2 FP37BP1 FP37BP0 FP36BP3 FP36BP2 FP36BP1 FP36BP0
FP39BP3 FP39BP2 FP39BP1 FP39BP0 FP38BP3 FP38BP2 FP38BP1 FP38BP0
0x184E
0x184F
0x1850
0x1851
0x1852
0x1853
0x1854
0x1855
0x1856
0x1857
0x1858
0x1859
LCDRAM6
LCDRAM7
LCDRAM8
LCDRAM9
LCDRAM10
LCDRAM11
LCDRAM12
LCDRAM13
LCDRAM14
LCDRAM15
LCDRAM16
LCDRAM17
0x185A LCDRAM18
0x185B LCDRAM19
0x185C LCDRAM20
0
0
0
0
FP40BP3 FP40BP2 FP40BP1 FP40BP0
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
46
Freescale Semiconductor
Chapter 4 Memory
Table 4-3. High-Page Register Summary (continued)
Address Register Name
Bit 7
6
5
4
3
2
1
Bit 0
0x185D– Reserved
0x1861
—
—
—
—
—
—
—
—
0x1862
0x1863
0x1864
0x1865
LCDCLKS
LCDSUPPLY
LCDBCTL
LCDCMD
SOURCE
DIV16
CLKADJ5 CLKADJ4 CLKADJ3 CLKADJ2 CLKADJ1 CLKADJ0
LCDCPEN LCDCPMS CPCADJ1 CPCADJ0 HDRVBUF BBYPASS VSUPPLY1 VSUPPLY0
BLINK
LCDIF
0
0
0
0
0
0
BLKMODE BRATE2
BRATE1
LCDCLR
BRATE0
BLANK
LCDDRMS
0
0x1866– Reserved
0x186F
—
—
—
—
—
—
—
—
Nonvolatile FLASH registers, shown in Table 4-4, are located in the FLASH memory. These registers
include an 8-byte backdoor key which optionally can be used to gain access to secure memory resources.
During reset events, the contents of NVPROT and NVOPT in the nonvolatile register area of the FLASH
memory are transferred into corresponding FPROT and FOPT working registers in the high-page registers
to control security and block protection options.
Table 4-4. Nonvolatile Register Summary
Register
Name
Address
Bit 7
6
5
4
3
2
1
Bit 0
0xFFB0– NVBACKKEY
0xFFB7
8-Byte Comparison Key
0xFFB8– Reserved
0xFFBC
—
—
—
—
—
—
—
—
0xFFBD
0xFFBE
0xFFBF
NVPROT
NVICGTRM1
NVOPT
FPS7
FPS6
FPS5
FPS4
FPS3
FPS2
FPS1
FPDIS
NVTRIM
KEYEN
FNORED
0
0
0
0
SEC01
SEC00
1
Freescale Semiconductor provides a factory trim to set the FIRG to 243 kHz. If user code changes the value of the NVICGTRM
register, the factory trim value will be lost. User code should save the content of NVICGTRM before any mass erase operation.
Provided the key enable (KEYEN) bit is 1, the 8-byte comparison key can be used to temporarily
disengage memory security. This key mechanism can be accessed only through user code running in secure
memory. (A security key cannot be entered directly through background debug commands.) This security
key can be disabled completely by programming the KEYEN bit to 0. If the security key is disabled, the
only way to disengage security is by mass erasing the FLASH if needed (normally through the background
debug interface) and verifying that FLASH is blank. To avoid returning to secure mode after the next reset,
program the security bits (SEC01:SEC00) to the unsecured state (1:0).
4.3
RAM
The MC9S08LC60 Series includes static RAM. The locations in RAM below 0x0100 can be accessed
using the more efficient direct addressing mode, and any single bit in this area can be accessed with the bit
manipulation instructions (BCLR, BSET, BRCLR, and BRSET). Locating the most frequently accessed
program variables in this area of RAM is preferred.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
47
Chapter 4 Memory
The RAM retains data when the MCU is in low-power wait, stop2, or stop3 mode. At power-on or after
wakeup from stop1, the contents of RAM are uninitialized. RAM data is unaffected by any reset provided
that the supply voltage does not drop below the minimum value for RAM retention.
For compatibility with older M68HC05 MCUs, the HCS08 resets the stack pointer to 0x00FF. In the
MC9S08LC60 Series, it is usually best to re-initialize the stack pointer to the top of the RAM so the direct
page RAM can be used for frequently accessed RAM variables and bit-addressable program variables.
Include the following 2-instruction sequence in your reset initialization routine (where RamLast is equated
to the highest address of the RAM in the Freescale-provided equate file).
LDHX
TXS
#RamLast+1
;point one past RAM
;SP<-(H:X-1)
When security is enabled, the RAM is considered a secure memory resource and is not accessible through
BDM or through code executing from non-secure memory. See Section 4.5, “Security” for a detailed
description of the security feature.
4.4
FLASH
The FLASH memory is intended primarily for program storage. In-circuit programming allows the
operating program to be loaded into the FLASH memory after final assembly of the application product.
It is possible to program the entire array through the single-wire background debug interface. Because no
special voltages are needed for FLASH erase and programming operations, in-application programming
is also possible through other software-controlled communication paths. For a more detailed discussion of
in-circuit and in-application programming, refer to the HCS08 Family Reference Manual, Volume I,
Freescale Semiconductor document order number HCS08RMv1/D.
Because the MC9S08LC60 Series contains two FLASH arrays, program and erase operations can be
conducted on one array while executing code from the other. The security and protection features treat the
two arrays as a single memory entity. Programming and erasing of each FLASH array is conducted
through the same command interface detailed in the following sections.
It is not possible to page erase or program both arrays at the same time. The mass erase command will
erase both arrays, and the blank check command will check both arrays.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Freescale Semiconductor
Chapter 4 Memory
4.4.1
Features
Features of the FLASH memory include:
•
FLASH Size
— MC9S08LC60 — 63,232 bytes (28,464 bytes in Flash B, 32,768 bytes in Flash A)
— MC9S08LC36 — 36,864 bytes (12,288 bytes in Flash B, 24,576 bytes in Flash A)
Single power supply program and erase
•
•
•
•
•
•
•
Command interface for fast program and erase operation
Up to 100,000 program/erase cycles at typical voltage and temperature
Flexible block protection
Security feature for FLASH and RAM
Auto power-down for low-frequency read accesses to minimize run I
DD
FLASH read/program/erase over full operating voltage or temperature
4.4.2
Program and Erase Times
Before any program or erase command can be accepted, the FLASH clock divider register (FCDIV) must
be written to set the internal clock for the FLASH module to a frequency (f ) between 150 kHz and
FCLK
200 kHz (see Section 4.6.1, “FLASH Clock Divider Register (FCDIV)). This register can be written only
once, so normally this write is done during reset initialization. FCDIV cannot be written if the access error
flag, FACCERR in FSTAT, is set. The user must ensure that FACCERR is not set before writing to the
FCDIV register. One period of the resulting clock (1/f
) is used by the command processor to time
FCLK
program and erase pulses. An integer number of these timing pulses is used by the command processor to
complete a program or erase command.
Table 4-5 shows program and erase times. The bus clock frequency and FCDIV determine the frequency
of FCLK (f
). The time for one cycle of FCLK is t
= 1/f
. The times are shown as a number
FCLK
FCLK
FCLK
of cycles of FCLK and as an absolute time for the case where t
shown include overhead for the command state machine and enabling and disabling of program and erase
voltages.
= 5 μs. Program and erase times
FCLK
Table 4-5. Program and Erase Times
Parameter
Cycles of FCLK
Time if FCLK = 200 kHz
9
4
45 μs
Byte program
20 μs1
20 ms
Byte program (burst)
Page erase
4000
20,000
100 ms
Mass erase
1
Excluding start/end overhead
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
49
Chapter 4 Memory
4.4.3
Program and Erase Command Execution
The steps for executing any of the commands are listed below. The FCDIV register must be initialized and
any error flags cleared before beginning command execution. The command execution steps are:
1. Write a data value to an address in the FLASH array. The address and data information from this
write is latched into the FLASH interface. This write is a required first step in any command
sequence. For erase and blank check commands, the value of the data is not important. For page
erase commands, the address may be any address in the 512-byte page of FLASH to be erased. For
mass erase and blank check commands, the address can be any address in the FLASH memory.
Whole pages of 512 bytes are the smallest block of FLASH that may be erased. In some boundary
conditions with RAM or high page registers, the size of a block that is accessible to the user is less
than 512 bytes.
NOTE
Do not program any byte in the FLASH more than once after a successful
erase operation. Reprogramming bits in a byte which is already
programmed is not allowed without first erasing the page in which the byte
resides or mass erasing the entire FLASH memory. Programming without
first erasing may disturb data stored in the FLASH.
2. Write the command code for the desired command to FCMD. The five valid commands are blank
check (0x05), byte program (0x20), burst program (0x25), page erase (0x40), and mass erase
(0x41). The command code is latched into the command buffer.
3. Write a 1 to the FCBEF bit in FSTAT to clear FCBEF and launch the command (including its
address and data information).
A partial command sequence can be aborted manually by writing a 0 to FCBEF any time after the write to
the memory array and before writing the 1 that clears FCBEF and launches the complete command.
Aborting a command in this way sets the FACCERR access error flag which must be cleared before
starting a new command.
A strictly monitored procedure must be obeyed or the command will not be accepted. This minimizes the
possibility of any unintended changes to the FLASH memory contents. The command complete flag
(FCCF) indicates when a command is complete. The command sequence must be completed by clearing
FCBEF to launch the command. Figure 4-2 is a flowchart for executing all of the commands except for
burst programming. The FCDIV register must be initialized before using any FLASH commands.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
50
Freescale Semiconductor
Chapter 4 Memory
(Note 1)
Note 1: Required only once after reset.
WRITE TO FCDIV
START
FLASH PROGRAM AND
ERASE FLOW
0
FACCERR ?
1
CLEAR ERROR
WRITE TO FLASH
TO BUFFER ADDRESS AND DATA
WRITE COMMAND TO FCMD
WRITE 1 TO FCBEF
Note 2: Wait at least four bus cycles
before checking FCBEF or FCCF.
TO LAUNCH COMMAND
(Note 2)
AND CLEAR FCBEF
YES
FPVIOL OR
FACCERR ?
ERROR EXIT
NO
0
FCCF ?
1
DONE
Figure 4-2. FLASH Program and Erase Flowchart
4.4.4
Burst Program Execution
The burst program command is used to program sequential bytes of data in less time than would be
required using the standard program command. For the MC9S08LC60 Series, it is possible to burst across
FLASH array boundaries as long as the addresses are consecutive. This is possible because the high
voltage to the FLASH array does not need to be disabled between program operations. Ordinarily, when a
program or erase command is issued, an internal charge pump associated with the FLASH memory must
be enabled to supply high voltage to the array. Upon completion of the command, the charge pump is
turned off. When a burst program command is issued, the charge pump is enabled and then remains
enabled after completion of the burst program operation if these two conditions are met:
•
The next burst program command has been queued before the current program operation has
completed.
•
The next sequential address selects a byte on the same physical row as the current byte being
programmed. A row of FLASH memory consists of 64 bytes. A byte within a row is selected by
addresses A5 through A0. A new row begins when addresses A5 through A0 are all zero.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
51
Chapter 4 Memory
The first byte of a series of sequential bytes being programmed in burst mode will take the same amount
of time to program as a byte programmed in standard mode. Subsequent bytes will program in the burst
program time provided that the conditions above are met. In the case the next sequential address is the
beginning of a new row, the program time for that byte will be the standard time instead of the burst time.
This is because the high voltage to the array must be disabled and then enabled again. If a new burst
command has not been queued before the current command completes, then the charge pump will be
disabled and high voltage removed from the array.
(Note 1)
Note 1: Required only once after reset.
WRITE TO FCDIV
FLASH BURST
PROGRAM FLOW
START
0
FACCERR ?
1
CLEAR ERROR
0
FCBEF ?
1
WRITE TO FLASH
TO BUFFER ADDRESS AND DATA
WRITE COMMAND (0x25) TO FCMD
WRITE 1 TO FCBEF
Note 2: Wait at least four bus cycles before
checking FCBEF or FCCF.
TO LAUNCH COMMAND
(Note 2)
AND CLEAR FCBEF
YES
FPVIO OR
FACCERR ?
ERROR EXIT
NO
YES
NEW BURST COMMAND ?
NO
0
FCCF ?
1
DONE
Figure 4-3. FLASH Burst Program Flowchart
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
52
Freescale Semiconductor
Chapter 4 Memory
4.4.5
Access Errors
An access error occurs whenever the command execution protocol is violated. Any of the following
specific actions will cause the access error flag (FACCERR) in FSTAT to be set. FACCERR must be
cleared by writing a 1 to FACCERR in FSTAT before any command can be processed.
•
•
•
•
Writing to a FLASH address before the internal FLASH clock frequency has been set by writing
to the FCDIV register
Writing to a FLASH address while FCBEF is not set (A new command cannot be started until the
command buffer is empty.)
Writing a second time to a FLASH address before launching the previous command (There is only
one write to FLASH for every command.)
Writing a second time to FCMD before launching the previous command (There is only one write
to FCMD for every command.)
•
•
Writing to any FLASH control register other than FCMD after writing to a FLASH address
Writing any command code other than the five allowed codes (0x05, 0x20, 0x25, 0x40, or 0x41)
to FCMD
•
•
•
Accessing (read or write) any FLASH control register other than the write to FSTAT (to clear
FCBEF and launch the command) after writing the command to FCMD
The MCU enters stop mode while a program or erase command is in progress (The command is
aborted.)
Writing the byte program, burst program, or page erase command code (0x20, 0x25, or 0x40) with
a background debug command while the MCU is secured (The background debug controller can
do blank check and mass erase commands only while the MCU is secure.)
•
Writing 0 to FCBEF to cancel a partial command
4.4.6
FLASH Block Protection
The block protection feature prevents the protected region of FLASH from program or erase changes.
Block protection is controlled through the FLASH Protection Register (FPROT). When enabled, block
protection begins at any 512 byte boundary below the last address of FLASH, 0xFFFF. (see Section 4.6.4,
“FLASH Protection Register (FPROT and NVPROT)”).
After exit from reset, FPROT is loaded with the contents of the NVPROT location which is in the
nonvolatile register block of the FLASH memory. In user mode, if FPDIS is set, all FPROT bits are
writeable. In user mode, if FPDIS is clear, the FPS bits are writeable as long as the size of the protected
region is being increased. Because NVPROT is within the last sector of FLASH, if any amount of memory
is protected, NVPROT is itself protected and cannot be altered (intentionally or unintentionally) by the
application software. FPROT can be written through background debug commands, which provide a way
to erase and reprogram protected FLASH memory.
The block protection mechanism is illustrated in Figure 4-4. The FPS bits are used as the upper bits of the
last address of unprotected memory. This address is formed by concatenating FPS7:FPS1 with logic 1 bits
as shown. For example, in order to protect the last 8192 bytes of memory (addresses 0xE000 through
0xFFFF), the FPS bits must be set to 1101 111 which results in the value 0xDFFF as the last address of
unprotected memory. In addition to programming the FPS bits to the appropriate value, FPDIS (bit 0 of
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
53
Chapter 4 Memory
NVPROT) must be programmed to logic 0 to enable block protection. Therefore the value 0xDE must be
programmed into NVPROT to protect addresses 0xE000 through 0xFFFF.
FPS7 FPS6 FPS5 FPS4 FPS3 FPS2 FPS1
1
1
1
1
1
1
1
1
1
A15 A14
A13
A12
A11
A10
A9
A8 A7 A6 A5 A4 A3 A2 A1 A0
Figure 4-4. Block Protection Mechanism
One use for block protection is to block protect an area of FLASH memory for a bootloader program. This
bootloader program can call a routine outside of FLASH that can be used to sector erase and re-program
the rest of the FLASH memory. The bootloader is protected even if MCU power is lost during an erase and
reprogram operation.
4.4.7
Vector Redirection
Whenever any block protection is enabled, the reset and interrupt vectors will be protected. Vector
redirection allows users to modify interrupt vector information without unprotecting bootloader and reset
vector space. Vector redirection is enabled by programming the FNORED bit in the NVOPT register
located at address 0xFFBF to zero. For redirection to occur, at least some portion but not all of the FLASH
memory must be block protected by programming the NVPROT register located at address 0xFFBD. All
of the interrupt vectors (memory locations 0xFFC0–0xFFFD) are redirected, while the reset vector
(0xFFFE–0xFFFF) is not. When more than 32K is protected, vector redirection must not be enabled.
For example, if 512 bytes of FLASH are protected, the protected address region is from 0xFE00 through
0xFFFF. The interrupt vectors (0xFFC0–0xFFFD) are redirected to the locations 0xFDC0–0xFDFD. Now,
if an SPI interrupt is taken for instance, the values in the locations 0xFDE0–0xFDE1 are used for the vector
instead of the values in the locations 0xFFE0–0xFFE1. This allows the user to reprogram the unprotected
portion of the FLASH with new program code including new interrupt vector values while leaving the
protected area, which includes the default vector locations, unchanged.
4.5
Security
The MC9S08LC60 Series includes circuitry to prevent unauthorized access to the contents of FLASH and
RAM memory. When security is engaged, FLASH and RAM are considered secure resources. Direct-page
registers, high-page registers, and the background debug controller are considered unsecured resources.
Programs executing within secure memory have normal access to any MCU memory locations and
resources. Attempts to access a secure memory location with a program executing from an unsecured
memory space or through the background debug interface are blocked (writes are ignored and reads return
all 0s).
Security is engaged or disengaged based on the state of two nonvolatile register bits (SEC01:SEC00) in
the FOPT register. During reset, the contents of the nonvolatile location NVOPT are copied from FLASH
into the working FOPT register in high-page register space. A user engages security by programming the
NVOPT location which can be done at the same time the FLASH memory is programmed. The 1:0 state
disengages security while the other three combinations engage security. Notice the erased state (1:1)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
54
Freescale Semiconductor
Chapter 4 Memory
makes the MCU secure. During development, whenever the FLASH is erased, it is good practice to
immediately program the SEC00 bit to 0 in NVOPT so SEC01:SEC00 = 1:0. This would allow the MCU
to remain unsecured after a subsequent reset.
The on-chip debug module cannot be enabled while the MCU is secure. The separate background debug
controller can still be used for background memory access commands, but the MCU cannot enter active
background mode except by holding BKGD/MS low at the rising edge of reset.
A user can choose to allow or disallow a security unlocking mechanism through an 8-byte backdoor
security key. If the nonvolatile KEYEN bit in NVOPT/FOPT is 0, the backdoor key is disabled and there
is no way to disengage security without completely erasing all FLASH locations. If KEYEN is 1, a secure
user program can temporarily disengage security by:
1. Writing 1 to KEYACC in the FCNFG register. This makes the FLASH module interpret writes to
the backdoor comparison key locations (NVBACKKEY through NVBACKKEY+7) as values to
be compared against the key rather than as the first step in a FLASH program or erase command.
2. Writing the user-entered key values to the NVBACKKEY through NVBACKKEY+7 locations.
These writes must be done in order, starting with the value for NVBACKKEY and ending with
NVBACKKEY+7. STHX should not be used for these writes because these writes cannot be done
on adjacent bus cycles. User software normally would get the key codes from outside the MCU
system through a communication interface such as a serial I/O.
3. Writing 0 to KEYACC in the FCNFG register. If the 8-byte key that was just written matches the
key stored in the FLASH locations, SEC01:SEC00 are automatically changed to 1:0 and security
will be disengaged until the next reset.
The security key can be written only from secure memory (either RAM or FLASH), so it cannot be entered
through background commands without the cooperation of a secure user program.
The backdoor comparison key (NVBACKKEY through NVBACKKEY+7) is located in FLASH memory
locations in the nonvolatile register space so users can program these locations just as they would program
any other FLASH memory location. The nonvolatile registers are in the same 512-byte block of FLASH
as the reset and interrupt vectors, so block protecting that space also block protects the backdoor
comparison key. Block protects cannot be changed from user application programs, so if the vector space
is block protected, the backdoor security key mechanism cannot permanently change the block protect,
security settings, or the backdoor key.
Security can always be disengaged through the background debug interface by performing these steps:
1. Disable any block protections by writing FPROT. FPROT can be written only with background
debug commands, not from application software.
2. Mass erase FLASH, if necessary.
3. Blank check FLASH. Provided FLASH is completely erased, security is disengaged until the next
reset.
To avoid returning to secure mode after the next reset, program NVOPT so SEC01:SEC00 = 1:0.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
55
Chapter 4 Memory
4.6
FLASH Registers and Control Bits
The FLASH module consists of high-page including nonvolatile registers that are copied into
corresponding high-page control registers at reset. There is also an 8-byte comparison key in FLASH
memory. Refer to Table 4-3 and Table 4-4 for the absolute address assignments for all FLASH registers.
This section refers to registers and control bits only by their names. A Freescale-provided equate or header
file normally is used to translate these names into the appropriate absolute addresses.
4.6.1
FLASH Clock Divider Register (FCDIV)
Bit 7 of this register is a read-only status flag. Bits 6 through 0 may be read at any time but can be written
only one time. Before any erase or programming operations are possible, write to this register to set the
frequency of the clock for the nonvolatile memory system within acceptable limits.
7
6
5
4
3
2
1
0
R
W
DIVLD
PRDIV8
DIV5
DIV4
DIV3
DIV2
DIV1
DIV0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-5. FLASH Clock Divider Register (FCDIV)
Table 4-6. FCDIV Field Descriptions
Description
Field
7
Divisor Loaded Status Flag — When set, this read-only status flag indicates that the FCDIV register has been
written since reset. Reset clears this bit and the first write to this register causes this bit to become set regardless
of the data written.
DIVLD
0 FCDIV has not been written since reset; erase and program operations disabled for FLASH.
1 FCDIV has been written since reset; erase and program operations enabled for FLASH.
6
Prescale (Divide) FLASH Clock by 8
PRDIV8
0 Clock input to the FLASH clock divider is the bus rate clock.
1 Clock input to the FLASH clock divider is the bus rate clock divided by 8.
5
Divisor for FLASH Clock Divider — The FLASH clock divider divides the bus rate clock (or the bus rate clock
divided by 8 if PRDIV8 = 1) by the value in the 6-bit DIV5:DIV0 field plus one. The resulting frequency of the
internal FLASH clock must fall within the range of 200 kHz to 150 kHz for proper FLASH operations.
Program/erase timing pulses are one cycle of this internal FLASH clock, which corresponds to a range of 5 μs
to 6.7 μs. The automated programming logic uses an integer number of these pulses to complete an erase or
program operation. See Equation 4-1 and Equation 4-2. Table 4-7 shows the appropriate values for PRDIV8 and
DIV5:DIV0 for selected bus frequencies.
DIV[5:0]
if PRDIV8 = 0 — f
if PRDIV8 = 1 — f
= f
÷ ([DIV5:DIV0] + 1)
Eqn. 4-1
Eqn. 4-2
FCLK
Bus
= f
÷ (8 × ([DIV5:DIV0] + 1))
FCLK
Bus
Table 4-7 shows the appropriate values for PRDIV8 and DIV5:DIV0 for selected bus frequencies.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
56
Freescale Semiconductor
Chapter 4 Memory
Table 4-7. FLASH Clock Divider Settings
PRDIV8
(Binary)
DIV5:DIV0
fFCLK
Program/Erase Timing Pulse
fBus
(Decimal)
(5 μs Min, 6.7 μs Max)
20 MHz
10 MHz
8 MHz
1
0
0
0
0
0
0
0
12
49
39
19
9
192.3 kHz
200 kHz
200 kHz
200 kHz
200 kHz
200 kHz
200 kHz
150 kHz
5.2 μs
5 μs
5 μs
4 MHz
5 μs
2 MHz
5 μs
1 MHz
4
5 μs
200 kHz
150 kHz
0
5 μs
0
6.7 μs
4.6.2
FLASH Options Register (FOPT and NVOPT)
During reset, the contents of the nonvolatile location NVOPT are copied from FLASH into FOPT. Bits 5
through 2 are not used and always read 0. This register may be read at any time, but writes have no meaning
or effect. To change the value in this register, erase and reprogram the NVOPT location in FLASH memory
as usual and then issue a new MCU reset.
7
6
5
4
3
2
1
0
R
W
KEYEN
FNORED
SEC01
SEC00
0
0
0
0
Reset
This register is loaded from nonvolatile location NVOPT during reset.
= Unimplemented or Reserved
Figure 4-6. FLASH Options Register (FOPT)
Table 4-8. FOPT Field Descriptions
Description
Field
7
Backdoor Key Mechanism Enable — When this bit is 0, the backdoor key mechanism cannot be used to
disengage security. The backdoor key mechanism is accessible only from user (secured) firmware. BDM
commands cannot be used to write key comparison values that would unlock the backdoor key. For more detailed
information about the backdoor key mechanism, refer to Section 4.5, “Security.”
KEYEN
0
1
No backdoor key access allowed.
If user firmware writes an 8-byte value that matches the nonvolatile backdoor key (NVBACKKEY through
NVBACKKEY+7, in that order), security is temporarily disengaged until the next MCU reset.
6
Flash No Redirect (Vector Redirection Disable) — When this bit is 1, then vector redirection is disabled.
FNORED 0 Vector redirection enabled.
1 Vector redirection disabled.
1:0
Security State Code — This 2-bit field determines the security state of the MCU as shown in Table 4-9. When
SEC0[1:0] the MCU is secure, the contents of RAM and FLASH memory cannot be accessed by instructions from any
unsecured source including the background debug interface. For more detailed information about security, refer
to Section 4.5, “Security.”
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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57
Chapter 4 Memory
Table 4-9. Security States
SEC01:SEC00
Description
0:0
0:11
1:0
secure
secure
unsecured
secure
1:1
1
The 0:1 bit pattern is the recommended value to be used since it requires two
bit changes before going to the unsecured state.
4.6.3
FLASH Configuration Register (FCNFG)
Bits 7 through 5 may be read or written at any time. Bits 4 through 0 always read 0 and cannot be written.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
KEYACC
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-7. FLASH Configuration Register (FCNFG)
Table 4-10. FCNFG Field Descriptions
Description
Field
5
Enable Writing of Access Key — This bit enables writing of the backdoor comparison key. For more detailed
information about the backdoor key mechanism, refer to Section 4.5, “Security.”
KEYACC
0 Writes to 0xFFB0–0xFFB7 are interpreted as the start of a FLASH programming or erase command.
1 Writes to NVBACKKEY (0xFFB0–0xFFB7) are interpreted as comparison key writes.
4.6.4
FLASH Protection Register (FPROT and NVPROT)
The FPROT register defines which FLASH sectors are protected against program and erase operations.
The FPROT register is also used to determine whether FLASH protection is disabled.
During the reset sequence, the FPROT register is loaded from the nonvolatile location NVPROT. To
change the protection that will be loaded during the reset sequence, the sector containing NVPROT must
be unprotected and erased, then NVPROT can be reprogrammed. With FPDIS set all FPROT bits are
writable, but with FPDIS clear the FPS bits are writable as long as the size of the protected region is being
increased. Any write to FPROT that attempts to decrease the size of the protected memory will be ignored.
Trying to alter data in any protected area will result in a protection violation error and the FPVIOL flag
will be set in the FSTAT register. Mass erase is not possible if any one of the sectors is protected.
In order to change the data flash block protection on a temporary basis, the FPROT register EPS bits can
be written to. To change the data flash block protection that will be loaded during the reset sequence, the
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Freescale Semiconductor
Chapter 4 Memory
FLASH block must first be unprotected, then 0xFFBD in the flash configuration field must be
reprogrammed.
7
6
5
4
3
2
1
0
R
W
FPS7
FPS6
FPS5
FPS4
FPS3
FPS2
FPS1
FPDIS
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
Reset
This register is loaded from nonvolatile location NVPROT during reset.
= Unimplemented or Reserved
Figure 4-8. FLASH Protection Register (FPROT)
1
If FPDIS is set, these bits are writeable in user mode. Background commands can be used to change the contents of these bits
in FPROT in any mode.
Table 4-11. FPROT Field Descriptions
Field
Description
7:1
FPS[7:1]
FLASH Protect Select Bits — When FPDIS = 0, this 7-bit field determines the ending address of unprotected
FLASH locations at the high address end of the FLASH. Protected FLASH locations cannot be erased or
programmed.
0
FLASH Protection Disable
FPDIS
0 FLASH block specified by FPS[7:1] is block protected (program and erase not allowed).
1 No FLASH block is protected.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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59
Chapter 4 Memory
4.6.5
FLASH Status Register (FSTAT)
Bits 3, 1, and 0 always read 0 and writes have no meaning or effect. The remaining five bits are status bits
that can be read at any time. Writes to these bits have special meanings that are discussed in the bit
descriptions.
7
6
5
4
3
2
1
0
R
W
FCCF
0
FBLANK
0
0
FCBEF
FPVIOL
FACCERR
Reset
1
1
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-9. FLASH Status Register (FSTAT)
Table 4-12. FSTAT Field Descriptions
Description
Field
7
FLASH Command Buffer Empty Flag — The FCBEF bit is used to launch commands. It also indicates that the
command buffer is empty so that a new command sequence can be executed when performing burst
programming. The FCBEF bit is cleared by writing a 1 to it or when a burst program command is transferred to
the array for programming. Only burst program commands can be buffered.
FCBEF
0 Command buffer is full (not ready for additional commands).
1 A new burst program command may be written to the command buffer.
6
FLASH Command Complete Flag — FCCF is set automatically when the command buffer is empty and no
command is being processed. FCCF is cleared automatically when a new command is started (by writing 1 to
FCBEF to register a command). Writing to FCCF has no meaning or effect.
0 Command in progress
FCCF
1 All commands complete
5
FLASH Protection Violation Flag — FPVIOL is set automatically when a command attempts to erase or
program a location in a protected block (the erroneous command is ignored). FPVIOL is cleared by writing a 1
to FPVIOL.
FPVIOL
0 No protection violation.
1 An attempt was made to erase or program a protected location.
4
FLASH Access Error Flag — FACCERR is set automatically when the proper command sequence is not
FACCERR followed exactly (the erroneous command is ignored), if a program or erase operation is attempted before the
FCDIV register has been initialized, or if the MCU enters stop while a command was in progress. For a more
detailed discussion of the exact actions that are considered access errors, see Section 4.4.5, “Access Errors.”
FACCERR is cleared by writing a 1 to FACCERR. Writing a 0 to FACCERR has no meaning or effect.
0 No access error has occurred.
1 An access error has occurred.
2
FLASH Verified as All Blank (Erased) Flag — FBLANK is set automatically at the conclusion of a blank check
command if the entire FLASH array was verified to be erased. FBLANK is cleared by clearing FCBEF to write a
new valid command. Writing to FBLANK has no meaning or effect.
FBLANK
0 After a blank check command is completed and FCCF = 1, FBLANK = 0 indicates the FLASH array is not
completely erased.
1 After a blank check command is completed and FCCF = 1, FBLANK = 1 indicates the FLASH array is
completely erased (all 0x00FF).
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Chapter 4 Memory
4.6.6
FLASH Command Register (FCMD)
Only five command codes are recognized in normal user modes as shown in Table 4-14. Refer to
Section 4.4.3, “Program and Erase Command Execution” for a detailed discussion of FLASH
programming and erase operations.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
FCMD7
0
FCMD6
0
FCMD5
0
FCMD4
0
FCMD3
0
FCMD2
0
FCMD1
0
FCMD0
0
Reset
Figure 4-10. FLASH Command Register (FCMD)
Table 4-13. FCMD Field Descriptions
Description
Field
7:0
See Table 4-14 for a description of FCMD[7:0].
FCMD[7:0]
1
Table 4-14. FLASH Commands
Command
Blank check
FCMD
Equate File Label
mBlank
0x05
0x20
0x25
0x40
0x41
Byte program
mByteProg
Byte program — burst mode
Page erase (512 bytes/page)
Mass erase (all FLASH)
mBurstProg
mPageErase
mMassErase
1
All other command codes are illegal and generate an access error.
It is not necessary to perform a blank check command after a mass erase operation. Blank check is required
only as part of the security unlocking mechanism.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Chapter 5
Resets, Interrupts, and System Configuration
5.1
Introduction
This section discusses basic reset and interrupt mechanisms and the various sources of reset and interrupts
in the MC9S08LC60 Series. Some interrupt sources from peripheral modules are discussed in greater
detail within other sections of this data manual. This section gathers basic information about all reset and
interrupt sources in one place for easy reference. A few reset and interrupt sources, including the computer
operating properly (COP) watchdog and real-time interrupt (RTI), are not part of on-chip peripheral
systems with their own sections but are part of the system control logic.
5.2
Features
Reset and interrupt features include:
•
Multiple sources of reset for flexible system configuration and reliable operation:
— Power-on detection (POR)
— Low voltage detection (LVD) with enable
— External RESET pin with enable
— COP watchdog with enable and two timeout choices
— Illegal opcode
— Serial command from a background debug host
Reset status register (SRS) to indicate source of most recent reset
Separate interrupt vectors for each module (reduces polling overhead) (see Table 5-2)
•
•
5.3
MCU Reset
Resetting the MCU provides a way to start processing from a known set of initial conditions. During reset,
most control and status registers are forced to initial values and the program counter is loaded from the
reset vector (0xFFFE:0xFFFF). On-chip peripheral modules are disabled and I/O pins are initially
configured as general-purpose high-impedance inputs with pullup devices disabled. The I bit in the
condition code register (CCR) is set to block maskable interrupts so the user program has a chance to
initialize the stack pointer (SP) and system control settings. SP is forced to 0x00FF at reset.
The MC9S08LC60 Series has seven sources for reset:
•
•
•
Power-on reset (POR)
Low-voltage detect (LVD)
Computer operating properly (COP) timer
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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63
Chapter 5 Resets, Interrupts, and System Configuration
•
•
•
•
Illegal opcode detect
Background debug forced reset
External pin reset (PIN) — can be disabled using RSTPE in SOPT2
Clock generator loss of lock and loss of clock reset
Each of these sources, with the exception of the background debug forced reset, has an associated bit in
the system reset status register. Whenever the MCU enters reset, the internal clock generator (ICG) module
switches to self-clocked mode with the frequency of f
selected. The reset pin is driven low for 34
Self_reset
internal bus cycles where the internal bus frequency is half the ICG frequency. After the 34 cycles are
completed, the pin is released and will be pulled up by the internal pullup resistor, unless it is held low
externally. After the pin is released, it is sampled after another 38 cycles to determine whether the reset pin
is the cause of the MCU reset.
5.4
Computer Operating Properly (COP) Watchdog
The COP watchdog is intended to force a system reset when the application software fails to execute as
expected. To prevent a system reset from the COP timer (when it is enabled), application software must
reset the COP timer periodically. If the application program gets lost and fails to reset the COP before it
times out, a system reset is generated to force the system back to a known starting point.
After any reset, the COPE becomes set in SOPT1 enabling the COP watchdog (see Section 5.8.4, “System
Options Register (SOPT1),” for additional information). If the COP watchdog is not used in an application,
it can be disabled by clearing COPE. The COP counter is reset by writing any value to the address of SRS.
This write does not affect the data in the read-only SRS. Instead, the act of writing to this address is
decoded and sends a reset signal to the COP counter.
The COPCLKS bit in SOPT2 (see Section 5.8.5, “System Options Register (SOPT2),” for additional
information) selects the clock source used for the COP timer. The clock source options are either the bus
clock or an internal 1kHz clock source. With each clock source, there is an associated short and long
time-out controlled by COPT in SOPT1. Table 5-1 summaries the control functions of the COPCLKS and
COPT bits. The COP watchdog defaults to operation from the 1kHz clock source and the associated long
8
time-out (2 cycles).
Table 5-1. COP Configuration Options
Control Bits
Clock Source
COP Overflow Count
COPCLKS
COPT
25 cycles (32 ms)1
28 cycles (256 ms)1
213 cycles
0
0
1
1
0
1
0
1
~1 kHz
~1 kHz
Bus
218 cycles
Bus
1
Values are shown in this column based on tRTI = 1 ms. See tRTI in the appendix
Section A.10.1, “Control Timing,” for the tolerance of this value.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Chapter 5 Resets, Interrupts, and System Configuration
Even if the application will use the reset default settings of COPE, COPCLKS and COPT, the user must
write to the write-once SOPT1 and SOPT2 registers during reset initialization to lock in the settings. That
way, they cannot be changed accidentally if the application program gets lost. The initial writes to SOPT1
and SOPT2 will reset the COP counter.
The write to SRS that services (clears) the COP counter must not be placed in an interrupt service routine
(ISR) because the ISR could continue to be executed periodically even if the main application program
fails.
When the bus clock source is selected, the COP counter does not increment while the MCU is in
background debug mode or while the system is in stop mode. The COP counter resumes once the MCU
exits background debug mode.
When the 1-kHz clock source is selected, the COP counter is re-initialized to zero upon entry to either
background debug mode or stop mode. The COP counter begins from zero once the MCU exits
background debug mode or stop mode.
5.5
Interrupts
Interrupts provide a way to save the current CPU status and registers, execute an interrupt service routine
(ISR), and then restore the CPU status so processing resumes where it left off before the interrupt. Other
than the software interrupt (SWI), which is a program instruction, interrupts are caused by hardware events
such as an edge on the IRQ pin or a timer-overflow event. The debug module can also generate an SWI
under certain circumstances.
If an event occurs in an enabled interrupt source, an associated read-only status flag will become set. The
CPU will not respond until and unless the local interrupt enable is set to 1 to enable the interrupt. The I bit
in the CCR is 0 to allow interrupts. The global interrupt mask (I bit) in the CCR is initially set after reset
which masks (prevents) all maskable interrupt sources. The user program initializes the stack pointer and
performs other system setup before clearing the I bit to allow the CPU to respond to interrupts.
When the CPU receives a qualified interrupt request, it completes the current instruction before responding
to the interrupt. The interrupt sequence follows the same cycle-by-cycle sequence as the SWI instruction
and consists of:
•
•
•
•
Saving the CPU registers on the stack
Setting the I bit in the CCR to mask further interrupts
Fetching the interrupt vector for the highest-priority interrupt that is currently pending
Filling the instruction queue with the first three bytes of program information starting from the
address fetched from the interrupt vector locations
While the CPU is responding to the interrupt, the I bit is automatically set to avoid the possibility of another
interrupt interrupting the ISR itself (this is called nesting of interrupts). Normally, the I bit is restored to 0
when the CCR is restored from the value stacked on entry to the ISR. In rare cases, the I bit may be cleared
inside an ISR (after clearing the status flag that generated the interrupt) so that other interrupts can be
serviced without waiting for the first service routine to finish. This practice is not recommended for anyone
other than the most experienced programmers because it can lead to subtle program errors that are difficult
to debug.
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Chapter 5 Resets, Interrupts, and System Configuration
The interrupt service routine ends with a return-from-interrupt (RTI) instruction which restores the CCR,
A, X, and PC registers to their pre-interrupt values by reading the previously saved information off the
stack.
NOTE
For compatibility with the M68HC08, the H register is not automatically
saved and restored. It is good programming practice to push H onto the stack
at the start of the interrupt service routine (ISR) and restore it just before the
RTI that is used to return from the ISR.
When two or more interrupts are pending when the I bit is cleared, the highest priority source is serviced
first (see Table 5-2).
5.5.1
Interrupt Stack Frame
Figure 5-1 shows the contents and organization of a stack frame. Before the interrupt, the stack pointer
(SP) points at the next available byte location on the stack. The current values of CPU registers are stored
on the stack starting with the low-order byte of the program counter (PCL) and ending with the CCR. After
stacking, the SP points at the next available location on the stack which is the address that is one less than
the address where the CCR was saved. The PC value that is stacked is the address of the instruction in the
main program that would have executed next if the interrupt had not occurred.
UNSTACKING
TOWARD LOWER ADDRESSES
ORDER
7
0
SP AFTER
INTERRUPT STACKING
5
4
3
2
1
1
2
3
4
5
CONDITION CODE REGISTER
ACCUMULATOR
*
INDEX REGISTER (LOW BYTE X)
PROGRAM COUNTER HIGH
PROGRAM COUNTER LOW
SP BEFORE
THE INTERRUPT
STACKING
ORDER
TOWARD HIGHER ADDRESSES
* High byte (H) of index register is not automatically stacked.
Figure 5-1. Interrupt Stack Frame
When an RTI instruction is executed, these values are recovered from the stack in reverse order. As part of
the RTI sequence, the CPU fills the instruction pipeline by reading three bytes of program information,
starting from the PC address just recovered from the stack.
The status flag causing the interrupt must be acknowledged (cleared) before returning from the ISR.
Typically, the flag should be cleared at the beginning of the ISR so that if another interrupt is generated by
this same source, it will be registered so it can be serviced after completion of the current ISR.
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Chapter 5 Resets, Interrupts, and System Configuration
5.5.2
External Interrupt Request (IRQ) Pin
External interrupts are managed by the IRQSC status and control register. When the IRQ function is
enabled, synchronous logic monitors the pin for edge-only or edge-and-level events. When the MCU is in
stop mode and system clocks are shut down, a separate asynchronous path is used so the IRQ (if enabled)
can wake the MCU.
5.5.2.1
Pin Configuration Options
The IRQ pin enable (IRQPE) control bit in the IRQSC register must be 1 for the IRQ pin to act as the
interrupt request (IRQ) input. When the pin is configured as an IRQ input, the user can choose the polarity
of edges or levels detected (IRQEDG), whether the pin detects edges-only or edges and levels (IRQMOD),
and whether an event causes an interrupt or only sets the IRQF flag (which can be polled by software).
When the IRQ pin is configured to detect rising edges, an optional pulldown resistor is available rather than
a pullup resistor. BIH and BIL instructions may be used to detect the level on the IRQ pin when the pin is
configured to act as the IRQ input.
NOTE
The voltage measured on the pulled up IRQ pin may be as low as
V
– 0.7 V. The internal gates connected to this pin are pulled all the way
DD
to V . All other pins with enabled pullup resistors will have an unloaded
DD
measurement of V
.
DD
5.5.2.2
Edge and Level Sensitivity
The IRQMOD control bit re-configures the detection logic so it detects edge events and pin levels. In this
edge detection mode, the IRQF status flag becomes set when an edge is detected (when the IRQ pin
changes from the deasserted to the asserted level), but the flag is continuously set (and cannot be cleared)
as long as the IRQ pin remains at the asserted level.
5.5.3
Interrupt Vectors, Sources, and Local Masks
Table 5-2 provides a summary of all interrupt sources. Higher-priority sources are located toward the
bottom of the table. The high-order byte of the address for the interrupt service routine is located at the
first address in the vector address column, and the low-order byte of the address for the interrupt service
routine is located at the next higher address.
When an interrupt condition occurs, an associated flag bit becomes set. If the associated local interrupt
enable is 1, an interrupt request is sent to the CPU. Within the CPU, if the global interrupt mask (I bit in
the CCR) is 0, the CPU will finish the current instruction, stack the PCL, PCH, X, A, and CCR CPU
registers, set the I bit, and then fetch the interrupt vector for the highest priority pending interrupt.
Processing then continues in the interrupt service routine.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Chapter 5 Resets, Interrupts, and System Configuration
Table 5-2. Vector Summary
Vector
Priority Number
Vector
Address
(High/Low)
Vector Name
Module
Source
Enable
Description
23
through
31
0xFFC0/0xFFC1
through
0xFFD0/0xFFD1
Unused Vector Space
(available for user program)
Lower
22
21
0xFFD2/0xFFD3
0xFFD4/0xFFD5
Vlcd
Vrti
LCD
LCDIF
RTIF
LCDIEN
LCD interrupt
System
control
RTIE
Real-time interrupt
20
19
18
0xFFD6/0xFFD7
0xFFD8/0xFFD9
0xFFDA/0xFFDB
Viic
Vacmp
Vadc
IIC
IICIS
ACF
IICIE
ACIE
AIEN
IIC control
ACMP
ACMP
ADC
COCO
AD conversion
complete
17
16
15
0xFFDC/0xFFDD Vkeyboard2
KBI2
KBI1
SCI
KBF
KBF
KBIE
KBIE
Keyboard 2 pins
Keyboard 1 pins
SCI transmit
0xFFDE/0xFFDF
0xFFE0/0xFFE1
Vkeyboard1
Vscitx
TDRE
TC
TIE
TCIE
14
13
0xFFE2/0xFFE3
0xFFE4/0xFFE5
Vscirx
SCI
SCI
IDLE
RDRF
ILIE
RIE
SCI receive
SCI error
Vscierr
OR
NF
FE
PF
ORIE
NFIE
FEIE
PFIE
12
11
0xFFE6/0xFFE7
0xFFE8/0xFFE9
Vspi2
Vspi1
SPI2
SPI1
SPIF
MODF
SPTEF
SPIE
SPIE
SPTIE
SPI 2
SPI 1
SPIF
MODF
SPTEF
SPIE
SPIE
SPTIE
10
9
0xFFEA/0xFFEB
0xFFEC/0xFFED
0xFFEE/0xFFEF
0xFFF0/0xFFF1
0xFFF2/0xFFF3
0xFFF4/0xFFF5
0xFFF6/0xFFF7
Vtpm2ovf
Vtpm2ch1
Vtpm2ch0
Vtpm1ovf
Vtpm1ch1
Vtpm1ch0
Vicg
TPM2
TPM2
TPM2
TPM1
TPM1
TPM1
ICG
TOF
CH1F
CH0F
TOF
TOIE
CH1IE
TPM2 overflow
TPM2 channel 1
TPM2 channel 0
TPM1 overflow
TPM1 channel 1
TPM1 channel 0
ICG
8
CH0IE
7
TOIE
6
CH1F
CH0F
CH1IE
5
CH0IE
4
ICGIF
LOLRE/LOCRE
(LOLS/LOCS)
3
0xFFF8/0xFFF9
Vlvd
System
control
LVDF
LVDIE
Low-voltage detect
2
1
0xFFFA/0xFFFB
0xFFFC/0xFFFD
Virq
IRQ
IRQF
IRQIE
—
IRQ pin
Vswi
Core
SWI
Software interrupt
Instruction
0
0xFFFE/0xFFFF
Vreset
System
control
COP
ICG
LVD
COPE
LVDRE
—
Watchdog timer
Low-voltage detect
External pin
POR
—
Illegal opcode
Higher
RESET pin
Illegal opcode
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Chapter 5 Resets, Interrupts, and System Configuration
5.6
Low-Voltage Detect (LVD) System
The MC9S08LC60 Series includes a system to protect against low voltage conditions to protect memory
contents and control MCU system states during supply voltage variations. The system comprises a
power-on reset (POR) circuit and an LVD circuit with a user selectable trip voltage, either high (V
)
LVDH
or low (V
). The LVD circuit is enabled when LVDE in SPMSC1 is high and the trip voltage is selected
LVDL
by LVDV in SPMSC2. The LVD is disabled upon entering any of the stop modes unless the LVDSE bit is
set. If LVDSE and LVDE are both set, then the MCU cannot enter stop1 or stop2, and the current
consumption in stop3 with the LVD enabled will be greater.
5.6.1
Power-On Reset Operation
When power is initially applied to the MCU, or when the supply voltage drops below the V
level, the
POR
POR circuit will cause a reset condition. As the supply voltage rises, the LVD circuit will hold the chip in
reset until the supply has risen above the V
following a POR.
level. Both the POR bit and the LVD bit in SRS are set
LVDL
5.6.2
LVD Reset Operation
The LVD can be configured to generate a reset upon detection of a low voltage condition by setting
LVDRE to 1. After an LVD reset has occurred, the LVD system will hold the MCU in reset until the supply
voltage has risen above the level determined by LVDV. The LVD bit in the SRS register is set following
either an LVD reset or POR.
5.6.3
LVD Interrupt Operation
When a low voltage condition is detected and the LVD circuit is configured for interrupt operation (LVDE
set, LVDIE set, and LVDRE clear), then LVDF will be set and an LVD interrupt will occur.
5.6.4
Low-Voltage Warning (LVW)
The LVD system has a low voltage warning flag to indicate to the user that the supply voltage is
approaching, but is still above, the LVD voltage. The LVW does not have an interrupt associated with it.
There are two user selectable trip voltages for the LVW, one high (V
voltage is selected by LVWV in SPMSC3.
) and one low (V
). The trip
LVWH
LVWL
5.7
Real-Time Interrupt (RTI)
The real-time interrupt function can be used to generate periodic interrupts. The RTI can accept two
sources of clocks, the 1-kHz internal clock or an external clock if available. The RTICLKS bit in SRTISC
is used to select the RTI clock source.
Either clock source can be used when the MCU is in run, wait or stop3 mode. When using the external
oscillator in stop3, it must be enabled in stop (EREFSTEN = 1) and configured for low frequency operation
(RANGE = 0). Only the internal 1-kHz clock source can be selected to wake the MCU from stop1 or stop2
modes.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Chapter 5 Resets, Interrupts, and System Configuration
The SRTISC register includes a read-only status flag, a write-only acknowledge bit, and a 3-bit control
value (RTIS) used to select one of seven wakeup periods. The RTI has a local interrupt enable, RTIE, to
allow masking of the real-time interrupt. The RTI can be disabled by writing each bit of RTIS to zeroes,
and no interrupts will be generated. See Section 5.8.7, “System Real-Time Interrupt Status and Control
Register (SRTISC)” for detailed information about this register.
5.8
Reset, Interrupt, and System Control Registers and Control Bits
One 8-bit register in the direct page register space and eight 8-bit registers in the high-page register space
are related to reset and interrupt systems.
Refer to the direct-page register summary in Chapter 4, “Memory” of this data sheet for the absolute
address assignments for all registers. This section refers to registers and control bits only by their names.
A Freescale-provided equate or header file is used to translate these names into the appropriate absolute
addresses.
Some control bits in the SOPT1, SOPT2, and SPMSC2 registers are related to modes of operation.
Although brief descriptions of these bits are provided here, the related functions are discussed in greater
detail in Chapter 3, “Modes of Operation.”
5.8.1
Interrupt Pin Request Status and Control Register (IRQSC)
These bits are used to configure the IRQ function, report status, and acknowledge IRQ events.
7
6
5
4
3
2
1
0
R
W
0
IRQF
0
IRQPDD
IRQEDG
IRQPE
IRQIE
IRQMOD
IRQACK
0
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 5-2. Interrupt Request Status and Control Register (IRQSC)
Table 5-3. IRQSC Field Descriptions
Description
Field
6
Interrupt Request (IRQ) Pull Device Disable— This read/write control bit is used to disable the internal
pullup/pulldown device when the IRQ pin is enabled (IRQPE = 1) allowing for an external device to be used.
0 IRQ pull device enabled if IRQPE = 1.
IRQPDD
1 IRQ pull device disabled if IRQPE = 1.
5
Interrupt Request (IRQ) Edge Select — This read/write control bit is used to select the polarity of edges or
levels on the IRQ pin that cause IRQF to be set. The IRQMOD control bit determines whether the IRQ pin is
sensitive to both edges and levels or only edges. When the IRQ pin is enabled as the IRQ input and is configured
to detect rising edges, the optional pullup resistor is re-configured as an optional pulldown resistor.
0 IRQ is falling edge or falling edge/low-level sensitive.
IRQEDG
1 IRQ is rising edge or rising edge/high-level sensitive.
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Chapter 5 Resets, Interrupts, and System Configuration
Table 5-3. IRQSC Field Descriptions (continued)
Field
Description
4
IRQ Pin Enable — This read/write control bit enables the IRQ pin function. When this bit is set, the IRQ pin can
be used as an interrupt request. Also, when this bit is set, either an internal pull-up or an internal pull-down
resistor is enabled depending on the state of the IRQMOD bit.
0 IRQ pin function is disabled.
IRQPE
1 IRQ pin function is enabled.
3
IRQ Flag — This read-only status bit indicates when an interrupt request event has occurred.
IRQF
0 No IRQ request.
1 IRQ event detected.
2
IRQ Acknowledge — This write-only bit is used to acknowledge interrupt request events (write 1 to clear IRQF).
Writing 0 has no meaning or effect. Reads always return 0. If edge-and-level detection is selected (IRQMOD = 1),
IRQF cannot be cleared while the IRQ pin remains at its asserted level.
IRQACK
1
IRQ Interrupt Enable — This read/write control bit determines whether IRQ events generate a hardware
interrupt request.
IRQIE
0 Hardware interrupt requests from IRQF disabled (use polling).
1 Hardware interrupt requested whenever IRQF = 1.
0
IRQ Detection Mode — This read/write control bit selects either edge-only detection or edge-and-level
IRQMOD detection. The IRQEDG control bit determines the polarity of edges and levels that are detected as interrupt
request events. See Section 5.5.2.2, “Edge and Level Sensitivity” for more details.
0 IRQ event on falling edges or rising edges only.
1 IRQ event on falling edges and low levels or on rising edges and high levels.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Chapter 5 Resets, Interrupts, and System Configuration
5.8.2
System Reset Status Register (SRS)
This register includes six read-only status flags to indicate the source of the most recent reset. When a
debug host forces reset by writing 1 to BDFR in the SBDFR register, none of the status bits in SRS will be
set. Writing any value to this register address clears the COP watchdog timer without affecting the contents
of this register. The reset state of these bits depends on what caused the MCU to reset.
7
6
5
4
3
2
1
0
R
POR
PIN
COP
ILOP
ICG
LVD
0
0
W
POR:
Writing any value to SRS address clears COP watchdog timer.
1
u
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
LVR:
Any other reset:
Note(1)
Note(1)
Note(1)
Note(1)
u = Unaffected by reset
1
Any of these reset sources that are active at the time of reset will cause the corresponding bit(s) to be set; bits corresponding to sources
that are not active at the time of reset will be cleared.
Figure 5-3. System Reset Status (SRS)
Table 5-4. SRS Field Descriptions
Field
Description
7
POR
Power-On Reset — Reset was caused by the power-on detection logic. Because the internal supply voltage was
ramping up at the time, the low-voltage reset (LVD) status bit is also set to indicate that the reset occurred while
the internal supply was below the LVD threshold.
0 Reset not caused by POR.
1 POR caused reset.
6
PIN
External Reset Pin — Reset was caused by an active-low level on the external reset pin.
0 Reset not caused by external reset pin.
1 Reset came from external reset pin.
5
COP
Computer Operating Properly (COP) Watchdog — Reset was caused by the COP watchdog timer timing out.
This reset source may be blocked by COPE = 0.
0 Reset not caused by COP timeout.
1 Reset caused by COP timeout.
4
Illegal Opcode — Reset was caused by an attempt to execute an unimplemented or illegal opcode. The STOP
instruction is considered illegal if stop is disabled by STOPE = 0 in the SOPT register. The BGND instruction is
considered illegal if active background mode is disabled by ENBDM = 0 in the BDCSC register.
0 Reset not caused by an illegal opcode.
ILOP
1 Reset caused by an illegal opcode.
2
ICG
Internal Clock Generation Module Reset — Reset was caused by an ICG module reset.
0 Reset not caused by ICG module.
1 Reset caused by ICG module.
1
LVD
Low Voltage Detect — If the LVD reset is enabled (LVDE = LVDRE = 1) and the supply drops below the LVD trip
voltage, an LVD reset occurs. The LVD function is disabled when the MCU enters stop. To maintain LVD operation
in stop, the LVDSE bit must be set.
0 Reset not caused by LVD trip or POR.
1 Reset caused by LVD trip or POR.
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Chapter 5 Resets, Interrupts, and System Configuration
5.8.3
System Background Debug Force Reset Register (SBDFR)
This register contains a single write-only control bit. A serial background command such as
WRITE_BYTE must be used to write to SBDFR. Attempts to write this register from a user program are
ignored. Reads always return 0x0000.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
BDFR1
0
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
1
BDFR is writable only through serial background debug commands, not from user programs.
Figure 5-4. System Background Debug Force Reset Register (SBDFR)
Table 5-5. SBDFR Field Descriptions
Description
Field
0
Background Debug Force Reset — A serial background mode command such as WRITE_BYTE allows an
external debug host to force a target system reset. Writing 1 to this bit forces an MCU reset. This bit cannot be
written from a user program.
BDFR
5.8.4
System Options Register (SOPT1)
This register may be read at any time. Bits 3 and 2 are unimplemented and always read 0. This is a
write-once register so only the first write after reset is honored. Any subsequent attempt to write to SOPT1
(intentionally or unintentionally) is ignored to avoid accidental changes to these sensitive settings. SOPT1
should be written during the user’s reset initialization program to set the desired controls even if the desired
settings are the same as the reset settings.
7
6
5
4
3
2
1
0
R
W
0
0
COPE
COPT
STOPE
BKGDPE
RSTPE
Reset
1
1
0
1
0
0
1
1
= Unimplemented or Reserved
Figure 5-5. System Options Register (SOPT1)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
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Chapter 5 Resets, Interrupts, and System Configuration
Table 5-6. SOPT1 Field Descriptions
Field
Description
7
COP Watchdog Enable — This write-once bit defaults to 1 after reset.
0 COP watchdog timer disabled.
COPE
1 COP watchdog timer enabled (force reset on timeout).
6
COP Watchdog Timeout — This write-once bit selects the timeout period of the COP. COPT along with
COPCLKS in SOPT2 defines the COP timeout period.
0 Short timeout period selected.
COPT
1 Long timeout period selected.
5
Stop Mode Enable — This write-once bit defaults to 0 after reset, which disables stop mode. If stop mode is
disabled and a user program attempts to execute a STOP instruction, an illegal opcode reset is forced.
0 Stop mode disabled.
STOPE
1 Stop mode enabled.
1
Background Debug Mode Pin Enable — The BKGDPE bit enables the PTG0/BKGD/MS pin to function as
BKGDPE BKGD/MS. When the bit is clear, the pin will function as PTG0, which is an output-only general-purpose I/O. This
pin always defaults to BKGD/MS function after any reset.
0 BKGD pin disabled.
1 BKGD pin enabled.
0
Reset Pin Enable — This write-once bit when set enables the PTB2/RESET/ pin to function as
RESET. When clear, the pin functions as one of its input only alternative functions. This pin defaults to its
input-only port function following an MCU POR. Once configured for RESET pin, only POR can disable the
RESET pin function. When RSTPE is set, an internal pullup device is enabled on RESET.
0 PTB2/RESET/ pin functions as PTB2.
RSTPE
1 PTB2/RESET/ pin functions as RESET.
5.8.5
System Options Register (SOPT2)
This register may be read at any time.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
COPCLKS1
ACIC
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 5-6. System Options Register (SOPT2)
1
This bit can be written only one time after reset. Additional writes are ignored.
Table 5-7. SOPT2 Field Descriptions
Field
Description
COP Watchdog Clock Select — This write-once bit selects the clock source of the COP watchdog.
7
COPCLKS 0 Internal 1-kHz clock is source to COP.
1 Bus clock is source to COP.
0
Analog Comparator to Input Capture Enable— This bit connects the output of ACMP to TPM1 input channel 0.
0 ACMP output not connected to TPM1 input channel 0
ACIC
1 ACMP output connected to TPM1 input channel 0.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Chapter 5 Resets, Interrupts, and System Configuration
5.8.6
System Device Identification Register (SDIDH, SDIDL)
This read-only register is included so host development systems can identify the HCS08 derivative and
revision number. This allows the development software to recognize where specific memory blocks,
registers, and control bits are located in a target MCU.
7
6
5
4
3
2
1
0
R
W
REV3
REV2
REV1
REV0
ID11
ID10
ID9
ID8
1
(1)
(1)
(1)
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
1
The revision number that is hard coded into these bits reflects the current silicon revision level.
Figure 5-7. System Device Identification Register High (SDIDH)
Table 5-8. SDIDH Field Descriptions
Field
Description
7:4
Revision Number — The high-order 4 bits of SDIDH are hard-coded to reflect the current mask set revision
REV[3:0]
number (0–F).
3:0
Part Identification Number — Each derivative in the HCS08 Family has a unique identification number. The
ID[11:8]
MC9S08LC60 Series is hard-coded to the value 0x0. See also ID bits in Table 5-9.
7
6
5
4
3
2
1
0
R
W
ID7
ID6
ID5
ID4
ID3
ID2
ID1
ID0
Reset
0
0
0
0
1
1
0
0
= Unimplemented or Reserved
Figure 5-8. System Device Identification Register Low (SDIDL)
Table 5-9. SDIDL Field Descriptions
Description
Field
7:0
Part Identification Number — Each derivative in the HCS08 Family has a unique identification number. The
ID[7:0]
MC9S08LC60 Series is hard coded to the value 0x0C. See also ID bits in Table 5-8.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
75
Chapter 5 Resets, Interrupts, and System Configuration
5.8.7
System Real-Time Interrupt Status and Control Register (SRTISC)
This register contains one read-only status flag, one write-only acknowledge bit, three read/write delay
selects, and one unimplemented bit, which always reads 0.
7
6
5
4
3
2
1
0
R
W
RTIF
0
0
RTICLKS
RTIE
RTIS2
RTIS1
RTIS0
RTIACK
0
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 5-9. System RTI Status and Control Register (SRTISC)
Table 5-10. SRTISC Field Descriptions
Description
Field
7
RTIF
Real-Time Interrupt Flag — This read-only status bit indicates the periodic wakeup timer has timed out.
0 Periodic wakeup timer not timed out.
1 Periodic wakeup timer timed out.
6
Real-Time Interrupt Acknowledge — This write-only bit is used to acknowledge real-time interrupt request
RTIACK
(write 1 to clear RTIF). Writing 0 has no meaning or effect. Reads always return 0.
5
Real-Time Interrupt Clock Select — This read/write bit selects the clock source for the real-time interrupt.
RTICLKS 0 Real-time interrupt request clock source is internal 1-kHz oscillator.
1 Real-time interrupt request clock source is external clock.
4
Real-Time Interrupt Enable — This read/write bit enables real-time interrupts.
0 Real-time interrupts disabled.
RTIE
1 Real-time interrupts enabled.
2:0
Real-Time Interrupt Period Selects — These read/write bits select the wakeup period for the RTI. See
RTIS[2:0] Table 5-11.
Table 5-11. Real-Time Interrupt Period
Internal 1 kHz Clock Source 1
(tRTI = 1 ms, Nominal)
External Clock Source 2
Period = text
RTIS2:RTIS1:RTIS0
0:0:0
0:0:1
0:1:0
0:1:1
1:0:0
1:0:1
1:1:0
1:1:1
Disable RTI
8 ms
Disable RTI
text x 256
32 ms
text x 1024
text x 2048
text x 4096
text x 8192
text x 16384
text x 32768
64 ms
128 ms
256 ms
512 ms
1.024 s
1
2
See Table A-13 tRTI in Appendix A, “Electrical Characteristics,” for the tolerance on these values.
text is based on the external clock source, resonator, or crystal selected by the ICG configuration. See Table A-12 for details.
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Chapter 5 Resets, Interrupts, and System Configuration
5.8.8
System Power Management Status and Control 1 Register (SPMSC1)
This high page register contains status and control bits to support the low voltage detect function, and to
enable the bandgap voltage reference for use by the ADC module. To configure the low voltage detect trip
voltage, see Table 5-14 for the LVDV bit description in SPMSC3.
(1)
7
6
5
4
3
2
1
0
R
W
LVDF
0
0
0
LVDIE
LVDRE2
LVDSE
LVDE(2)
BGBE
LVDACK
0
Reset
0
0
1
1
1
0
= Unimplemented or Reserved
1 Bit 1 is a reserved bit that must always be written to 0.
2 This bit can be written only one time after reset. Additional writes are ignored.
Figure 5-10. System Power Management Status and Control 1 Register (SPMSC1)
Table 5-12. SPMSC1 Field Descriptions
Description
Field
7
Low-Voltage Detect Flag — Provided LVDE = 1, this read-only status bit indicates a low-voltage detect event.
LVDF
6
Low-Voltage Detect Acknowledge — This write-only bit is used to acknowledge low voltage detection errors
LVDACK
(write 1 to clear LVDF). Reads always return 0.
5
Low-Voltage Detect Interrupt Enable — This read/write bit enables hardware interrupt requests for LVDF.
0 Hardware interrupt disabled (use polling).
LVDIE
1 Request a hardware interrupt when LVDF = 1.
4
Low-Voltage Detect Reset Enable — This read/write bit enables LVDF events to generate a hardware reset
(provided LVDE = 1).
LVDRE
0 LVDF does not generate hardware resets.
1 Force an MCU reset when LVDF = 1.
3
Low-Voltage Detect Stop Enable — Provided LVDE = 1, this read/write bit determines whether the low-voltage
detect function operates when the MCU is in stop mode.
LVDSE
0 Low-voltage detect disabled during stop mode.
1 Low-voltage detect enabled during stop mode.
2
Low-Voltage Detect Enable — This read/write bit enables low-voltage detect logic and qualifies the operation
LVDE
of other bits in this register.
0 LVD logic disabled.
1 LVD logic enabled.
0
Bandgap Buffer Enable — This bit enables an internal buffer for the bandgap voltage reference for use by the
ADC module on one of its internal channels or the ACMP.
0 Bandgap buffer disabled.
BGBE
1 Bandgap buffer enabled.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
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Chapter 5 Resets, Interrupts, and System Configuration
5.8.9
System Power Management Status and Control 2 Register (SPMSC2)
This register is used to configure the stop mode behavior of the MCU. For more information concerning
partial power down mode, see Section 3.6, “Stop Modes.”
7
6
5
4
3
2
1
0
R
W
PPDF
0
0
0
PDF
0
PDC1
PPDC1
PPDACK
0
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
1 This bit can be written only one time after reset. Additional writes are ignored.
Figure 5-11. System Power Management Status and Control 2 Register (SPMSC2)
Table 5-13. SPMSC2 Field Descriptions
Description
Field
4
PDF
Power Down Flag — This read-only status bit indicates the MCU has recovered from stop1 mode.
0 MCU has not recovered from stop1 mode.
1 MCU recovered from stop1 mode.
3
Partial Power Down Flag — The PPDF bit indicates that the MCU has exited the stop2 mode.
PPDF
0 Not stop2 mode recovery.
1 Stop2 mode recovery.
2
Partial Power Down Acknowledge — Writing a 1 to PPDACK clears the PPDF bit.
PPDACK
1
PDC
Power Down Control — The write-once PDC bit controls entry into the power down (stop2 and stop1) modes.
0 Power down modes are disabled.
1 Power down modes are enabled.
0
Partial Power Down Control — The write-once PPDC bit controls which power down mode, stop1 or stop2, is
selected.
PPDC
0 Stop1, full power down, mode enabled if PDC set.
1 Stop2, partial power down, mode enabled if PDC set.
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Chapter 5 Resets, Interrupts, and System Configuration
5.8.10 System Power Management Status and Control 3 Register (SPMSC3)
This register is used to report the status of the low voltage warning function behavior of the MCU.
7
6
5
4
3
2
1
0
R
0
0
0
0
LVWF
0
LVDV
LVWV
W
LVWACK
0
Power-on reset
(POR):
0(1)
0(1)
0(1)
0
u
u
0
u
u
0
0
0
0
0
0
0
0
0
0
0
0
LVD reset
(LVR):
0
0
Any other
reset:
= Unimplemented or Reserved
u = Unaffected by reset
1
LVWF will be set in the case when VSupply transitions below the trip point or after reset and VSupply is already below VLVW
.
Figure 5-12. System Power Management Status and Control 3 Register (SPMSC3)
Table 5-14. SPMSC3 Field Descriptions
Description
Field
7
Low-Voltage Warning Flag — The LVWF bit indicates the low voltage warning status.
0 Low voltage warning not present.
LVWF
1 Low voltage warning is present or was present.
6
Low-Voltage Warning Acknowledge — The LVWACK bit is the low-voltage warning acknowledge. Writing a 1
LVWACK
to LVWACK clears LVWF to 0 if a low voltage warning is not present.
5
Low-Voltage Detect Voltage Select — The LVDV bit selects the LVD trip point voltage (VLVD).
0 Low trip point selected (VLVD = VLVDL).
LVDV
1 High trip point selected (VLVD = VLVDH).
4
Low-Voltage Warning Voltage Select — The LVWV bit selects the LVW trip point voltage (VLVW).
0 Low trip point selected (VLVW = VLVWL).
LVWV
1 High trip point selected (VLVW = VLVWH).
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Chapter 5 Resets, Interrupts, and System Configuration
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Chapter 6
Parallel Input/Output
This section explains software controls related to parallel input/output (I/O). The MC9S08LC60 Series has
three I/O ports which include a total of up to 24 general-purpose I/O pins (pin availability depends on
device and package option, see Table 1-2 for details). See Chapter 2, “Pins and Connections,” for more
information about the logic and hardware aspects of these pins.
Many of these pins are shared with on-chip peripherals such as timer systems, SPI, SCI, IIC, external
interrupts, or keyboard interrupts as shown in Table 2-1. The peripheral modules have priority over the I/Os
so that when a peripheral is enabled, the I/O functions associated with the shared pins are disabled. After
reset, the shared peripheral functions are disabled so that the pins are controlled by the I/O. All of the I/Os
are configured as inputs (PTxDDn = 0) with pullup devices disabled (PTxPEn = 0), except for output-only
pin PTC6 which defaults to BKGD/MS pin and PTB2 which defaults to the RESET function.
When these other modules are not controlling the port pins, they revert to general-purpose I/O control. As
a general-purpose I/O control, a port data bit provides access to input (read) and output (write) data, a data
direction bit controls the direction of the pin, and a pullup enable bit enables an internal pullup device
(provided the pin is configured as an input), and a slew rate control bit controls the rise and fall times of
the pins.
NOTE
Not all general-purpose I/O pins are available on all packages. To avoid
extra current drain from floating input pins, the user’s reset initialization
routine in the application program should either enable on-chip pullup
devices or change the direction of unconnected pins to outputs so the pins
do not float.
Reading and writing of parallel I/Os is performed through the port data registers. The direction, either input
or output, is controlled through the port data direction registers. The parallel I/O port function for an
individual pin is illustrated in the block diagram shown in Figure 6-1.
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Freescale Semiconductor
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Chapter 6 Parallel Input/Output
PTxDDn
OUTPUT ENABLE
OUTPUT DATA
D
Q
PTxDn
D
Q
1
0
PORT READ
DATA
INPUT DATA
SYNCHRONIZER
BUSCLK
Figure 6-1. Parallel I/O Block Diagram
The data direction control bit (PTxDDn) determines whether the output buffer for the associated pin is
enabled, and also controls the source for port data register reads. The input buffer for the associated pin is
always enabled unless the pin is enabled as an analog function or is an output-only pin.
When a shared digital function is enabled for a pin, the output buffer is controlled by the shared function.
However, the data direction register bit will continue to control the source for reads of the port data register.
When a shared analog function is enabled for a pin, both the input and output buffers are disabled. A value
of 0 is read for any port data bit where the bit is an input (PTxDDn = 0) and the input buffer is disabled.
In general, whenever a pin is shared with both an alternate digital function and an analog function, the
analog function has priority such that if both the digital and analog functions are enabled, the analog
function controls the pin.
It is a good programming practice to write to the port data register before changing the direction of a port
pin to become an output. This ensures that the pin will not be driven momentarily with an old data value
that happened to be in the port data register.
Associated with the parallel I/O ports is a set of registers located in the high page register space that operate
independently of the parallel I/O registers. These registers are used to control pullups, slew rate, and drive
strength for the pins. See Section 6.2.1, “Port A Registers for more information.
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Chapter 6 Parallel Input/Output
6.1
Pin Behavior in Stop Modes
Pin behavior following execution of a STOP instruction depends on the stop mode that is entered. An
explanation of pin behavior for the various stop modes follows:
•
In stop1 mode, all internal registers including parallel I/O control and data registers are powered
off. Each of the pins assumes its default reset state (output buffer and internal pullup disabled).
Upon exit from stop1, all pins must be reconfigured the same as if the MCU had been reset.
•
Stop2 mode is a partial power-down mode, whereby latches maintain the pin state as before the
STOP instruction was executed. CPU register status and the state of I/O registers must be saved in
RAM before the STOP instruction is executed to place the MCU in stop2 mode. Upon recovery
from stop2 mode, before accessing any I/O, the user must examine the state of the PPDF bit in the
SPMSC2 register. If the PPDF bit is 0, I/O must be initialized as if a power on reset had occurred.
If the PPDF bit is 1, I/O data previously stored in RAM, before the STOP instruction was executed,
peripherals previously enabled will require being initialized and restored to their pre-stop
condition. The user must then write a 1 to the PPDACK bit in the SPMSC2 register. Access of pins
is now permitted again in the user’s application program.
•
In stop3 mode, all pin states are maintained because internal logic stays powered up. Upon
recovery, all pin functions are the same as before entering stop3.
6.2
Parallel I/O Registers
Port A Registers
6.2.1
This section provides information about all registers and control bits associated with the parallel I/O ports.
The parallel I/O registers are located in page zero of the memory map.
Refer to tables in Chapter 3, “Modes of Operation” for the absolute address assignments for all parallel
I/O registers. This section refers to registers and control bits only by their names. A Freescale-provided
equate or header file normally is used to translate these names into the appropriate absolute addresses.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
83
Chapter 6 Parallel Input/Output
6.2.1.1
Port A Data Registers (PTAD)
Port A parallel I/O function is controlled by the data and data direction registers in this section.
7
6
5
4
3
2
1
0
R
W
PTAD7
PTAD6
PTAD5
PTAD4
PTAD3
PTAD2
PTAD1
PTAD0
Reset
0
0
0
0
0
0
0
0
Figure 6-2. Port A Data Register (PTAD)
Table 6-1. PTAD Field Descriptions
Description
Field
7:0
Port A Data Register Bits — For port A pins that are inputs, reads return the logic level on the pin. For port A
PTAD[7:0] pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port A pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTAD to all 0s, but these 0s are not driven out the corresponding pins because reset also configures
all port pins as high-impedance inputs with pullups disabled.
6.2.1.2
Port A Data Direction Registers (PTADD)
7
6
5
4
3
2
1
0
R
W
PTADD7
PTADD6
PTADD5
PTADD4
PTADD3
PTADD2
PTADD1
PTADD0
Reset
0
0
0
0
0
0
0
0
Figure 6-5. Data Direction for Port A (PTADD)
Table 6-2. PTADD Field Descriptions
Description
Field
7:0
Data Direction for Port A Bits — These read/write bits control the direction of port A pins and what is read for
PTADD[7:0] PTAD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port A bit n and PTAD reads return the contents of PTADn.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
84
Freescale Semiconductor
Chapter 6 Parallel Input/Output
6.2.2
Port A Control Registers
Associated with the parallel I/O ports is a set of registers located in the high page register space that operate
independently of the parallel I/O registers. These registers are used to control pullups, slew rate, and drive
strength for the associated pins and may be used in conjunction with the peripheral functions on these pins
for most modules.
The pins associated with port A are controlled by the registers in this section. These registers control the
pin pullup, slew rate and drive strength of the port A pins independent of the parallel I/O registers.
6.2.2.1
Internal Pullup Enable (PTAPE)
An internal pullup device can be enabled for each port pin by setting the corresponding bit in the pullup
enable register (PTAPEn). The pullup device is disabled if the pin is configured as an output by the parallel
I/O control logic or any shared peripheral function regardless of the state of the corresponding pullup
enable register bit. The pullup device is also disabled if the pin is controlled by an analog function.
7
6
5
4
3
2
1
0
R
W
PTAPE7
PTAPE6
PTAPE5
PTAPE4
PTAPE3
PTAPE2
PTAPE1
PTAPE0
Reset
0
0
0
0
0
0
0
0
Figure 6-7. Pullup Enable for Port A (PTAPE)
Table 6-3. PTAPE Field Descriptions
Description
Field
7:0
Pullup Enable for Port A Bits — For port A pins that are inputs, these read/write control bits determine whether
PTAPE[7:0] internal pullup devices are enabled provided the corresponding PTADDn is 0. For port A pins that are configured
as outputs, these bits are ignored and the internal pullup devices are disabled. When any of bits 7 through 0 of
port A are enabled as KBI inputs and are configured to detect rising edges/high levels, the pullup enable bits
enable pulldown rather than pullup devices.
0 Internal pullup device disabled.
1 Internal pullup device enabled.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
85
Chapter 6 Parallel Input/Output
6.2.2.2
Output Slew Rate Control Enable (PTASE)
Slew rate control can be enabled for each port pin by setting the corresponding bit in the slew rate control
register (PTASEn). When enabled, slew control limits the rate at which an output can transition in order to
reduce EMC emissions. Slew rate control has no effect on pins which are configured as inputs.
7
6
5
4
3
2
1
0
R
W
PTASE7
PTASE6
PTASE5
PTASE4
PTASE3
PTASE2
PTASE1
PTASE0
Reset
1
1
1
1
1
1
1
1
Figure 6-8. Slew Rate Control Enable for Port A (PTASE)
Table 6-4. PTASE Field Descriptions
Description
Field
7:0
Slew Rate Control Enable for Port A Bits — For port A pins that are outputs, these read/write control bits
PTASE[7:0] determine whether the slew rate controlled outputs are enabled. For port A pins that are configured as inputs,
these bits are ignored.
0 Slew rate control disabled.
1 Slew rate control enabled.
6.2.2.3
Output Drive Strength Select (PTADS)
An output pin can be selected to have high output drive strength by setting the corresponding bit in the
drive strength select register (PTADSn). When high drive is selected a pin is capable of sourcing and
sinking greater current. Even though every I/O pin can be selected as high drive, the user must ensure that
the total current source and sink limits for the chip are not exceeded. Drive strength selection is intended
to affect the DC behavior of I/O pins. However, the AC behavior is also affected. High drive allows a pin
to drive a greater load with the same switching speed as a low drive enabled pin into a smaller load.
Because of this the EMC emissions may be affected by enabling pins as high drive.
7
6
5
4
3
2
1
0
R
W
PTADS7
PTADS6
PTADS5
PTADS4
PTADS3
PTADS2
PTADS1
PTADS0
Reset
0
0
0
0
0
0
0
0
Figure 6-9. Drive Strength Selection for Port A (PTADS)
Table 6-5. PTADS Field Descriptions
Description
Field
7:0
Output Drive Strength Selection for Port A Bits—Each of these control bits selects between low and high output
PTADS[7:0] drive for the associated PTA pin. For port A pins that are configured as inputs, these bits have no effect.
0 Low output drive strength selected for port A bit n.
1 High output drive strength selected for port A bit n.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
86
Freescale Semiconductor
Chapter 6 Parallel Input/Output
6.2.3
Port B Registers
This section provides information about all registers and control bits associated with the parallel I/O ports.
The parallel I/O registers are located in page zero of the memory map.
Refer to tables in Chapter 4, “Memory” for the absolute address assignments for all parallel I/O registers.
This section refers to registers and control bits only by their names. A Freescale-provided equate or header
file normally is used to translate these names into the appropriate absolute addresses.
6.2.3.1
Port B Data Registers (PTBD)
Port B parallel I/O function is controlled by the data and data direction registers in this section.
7
6
5
4
3
2
1
0
R
W
PTBD7
PTBD6
PTBD5
PTBD4
PTBD3
PTBD21
PTBD1
PTBD0
Reset
0
0
0
0
0
0
0
0
Figure 6-10. Port B Data Register (PTBD)
1
Reads of PTBD2 always return the contents of PTBD2, regardless of the value stored in the bit PTBDD2
Table 6-6. PTBD Field Descriptions
Field
Description
Port B Data Register Bits — For port B pins that are inputs, reads return the logic level on the pin. For port B
7:0
PTBD[7:0] pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port B pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTBD to all 0s, but these 0s are not driven out the corresponding pins because reset also configures
all port pins as high-impedance inputs with pullups disabled.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
87
Chapter 6 Parallel Input/Output
6.2.3.2
Port B Data Direction Registers (PTBDD)
7
6
5
4
3
2
1
0
R
W
PTBDD7
PTBDD6
PTBDD5
PTBDD4
PTBDD3
PTBDD21
PTBDD1
PTBDD0
Reset
0
0
0
0
0
0
0
0
Figure 6-13. Data Direction for Port B (PTBDD)
1
PTBDD2 has no effect on the output-only PTB2 pin.
Table 6-7. PTBDD Field Descriptions
Field
Description
Data Direction for Port B Bits — These read/write bits control the direction of port B pins and what is read for
7:0
PTBDD[7:0] PTBD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port B bit n and PTBD reads return the contents of PTBDn.
6.2.4
Port B Control Registers
Associated with the parallel I/O ports is a set of registers located in the high page register space that operate
independently of the parallel I/O registers. These registers are used to control pullups, slew rate, and drive
strength for the associated pins and may be used in conjunction with the peripheral functions on these pins
for most modules.
The pins associated with Port B are controlled by the registers in this section. These registers control the
pin pullup, slew rate and drive strength of the Port B pins independent of the parallel I/O registers.
6.2.4.1
Internal Pullup Enable (PTBPE)
An internal pullup device can be enabled for each port pin by setting the corresponding bit in the pullup
enable register (PTBPEn). The pullup device is disabled if the pin is configured as an output by the parallel
I/O control logic or any shared peripheral function regardless of the state of the corresponding pullup
enable register bit. The pullup device is also disabled if the pin is controlled by an analog function.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
88
Freescale Semiconductor
Chapter 6 Parallel Input/Output
7
6
5
4
3
2
1
0
R
W
PTBPE7
PTBPE6
PTBPE5
PTBPE4
PTBPE3
PTBPE2
PTBPE1
PTBPE0
Reset
0
0
0
0
0
0
0
0
Figure 6-15. Pullup Enable for Port B (PTBPE)
Table 6-8. PTBPE Field Descriptions
Description
Field
7:0
Pullup Enable for Port B Bits — For port B pins that are inputs, these read/write control bits determine whether
PTBPE[7:0] internal pullup devices are enabled provided the corresponding PTBDDn is 0. For port B pins that are configured
as outputs, these bits are ignored and the internal pullup devices are disabled. When bit 0, 1, 3, 6, or 7 of port B
is enabled as KBI inputs and are configured to detect rising edges/high levels, the pullup enable bits enable
pulldown rather than pullup devices.
0 Internal pullup device disabled.
1 Internal pullup device enabled.
6.2.4.2
Output Slew Rate Control Enable (PTBSE)
Slew rate control can be enabled for each port pin by setting the corresponding bit in the slew rate control
register (PTBSEn). When enabled, slew control limits the rate at which an output can transition in order
to reduce EMC emissions. Slew rate control has no effect on pins which are configured as inputs.
7
6
5
4
3
2
1
0
R
W
PTBSE7
PTBSE6
PTBSE5
PTBSE4
PTBSE3
PTBSE2
PTBSE1
PTBSE0
Reset
1
1
1
1
1
1
1
1
Figure 6-16. Slew Rate Control Enable for Port B (PTBSE)
Table 6-9. PTBSE Field Descriptions
Description
Field
7:0
Slew Rate Control Enable for Port B Bits — For port B pins that are outputs, these read/write control bits
PTBSE[7:0] determine whether the slew rate controlled outputs are enabled. For port B pins that are configured as inputs,
these bits are ignored.
0 Slew rate control disabled.
1 Slew rate control enabled.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
89
Chapter 6 Parallel Input/Output
6.2.4.3
Output Drive Strength Select (PTBDS)
An output pin can be selected to have high output drive strength by setting the corresponding bit in the
drive strength select register (PTBDSn). When high drive is selected a pin is capable of sourcing and
sinking greater current. Even though every I/O pin can be selected as high drive, the user must ensure that
the total current source and sink limits for the chip are not exceeded. Drive strength selection is intended
to affect the DC behavior of I/O pins. However, the AC behavior is also affected. High drive allows a pin
to drive a greater load with the same switching speed as a low drive enabled pin into a smaller load.
Because of this the EMC emissions may be affected by enabling pins as high drive.
7
6
5
4
3
2
1
0
R
W
PTBDS7
PTBDS6
PTBDS5
PTBDS4
PTBDS3
PTBDS2
PTBDS1
PTBDS0
Reset
0
0
0
0
0
0
0
0
Figure 6-17. Drive Strength Selection for Port B (PTBDS)
Table 6-10. PTBDS Field Descriptions
Description
Field
7:0
Output Drive Strength Selection for Port B Bits—Each of these control bits selects between low and high output
PTBDS[7:0] drive for the associated PTB pin. For port B pins that are configured as inputs, these bits have no effect.
0 Low output drive strength selected for port B bit n.
1 High output drive strength selected for port B bit n.
6.2.5
Port C Registers
This section provides information about all registers and control bits associated with the parallel I/O ports.
The parallel I/O registers are located in page zero of the memory map.
Refer to tables in Chapter 4, “Memory” for the absolute address assignments for all parallel I/O registers.
This section refers to registers and control bits only by their names. A Freescale-provided equate or header
file normally is used to translate these names into the appropriate absolute addresses.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
90
Freescale Semiconductor
Chapter 6 Parallel Input/Output
6.2.5.1
Port C Data Registers (PTCD)
Port C parallel I/O function is controlled by the data and data direction registers in this section.
7
6
5
4
3
2
1
0
R
W
PTCD71
PTCD62
PTCD5
PTCD4
PTCD3
PTCD2
PTCD1
PTCD0
Reset
0
0
0
0
0
0
0
0
Figure 6-18. Port C Data Register (PTCD)
1
2
Reads of PTCD7 always return the pin value of PTC7, regardless of the value stored in the bit PTCDD7
Reads of PTCD6 always return the contents of PTCD6, regardless of the value stored in the bit PTCDD6.
Table 6-11. PTCD Field Descriptions
Field
Description
Port C Data Register Bits — For port C pins that are inputs, reads return the logic level on the pin. For port C
7:0
PTCD[7:0] pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port C pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTCD to all 0s, but these 0s are not driven out the corresponding pins because reset also
configures all port pins as high-impedance inputs with pullups disabled.
6.2.5.2
Port C Data Direction Registers (PTCDD)
7
6
5
4
3
2
1
0
R
W
PTCDD71
PTCDD62
PTCDD5
PTCDD4
PTCDD3
PTCDD2
PTCDD1
PTCDD0
Reset
0
0
0
0
0
0
0
0
Figure 6-21. Data Direction for Port C (PTCDD)
1
2
PTCDD7 has no effect on the input-only PTC7 pin.
PTCDD6 has no effect on the output-only PTC6 pin
Table 6-12. PTCDD Field Descriptions
Field
Description
Data Direction for Port C Bits — These read/write bits control the direction of port C pins and what is read for
7:0
PTCDD[7:0] PTCD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port C bit n and PTCD reads return the contents of PTCDn.
6.2.6
Port C Control Registers
Associated with the parallel I/O ports is a set of registers located in the high page register space that operate
independently of the parallel I/O registers. These registers are used to control pullups, slew rate, and drive
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
91
Chapter 6 Parallel Input/Output
strength for the associated pins and may be used in conjunction with the peripheral functions on these pins
for most modules.
The pins associated with Port C are controlled by the registers in this section. These registers control the
pin pullup, slew rate and drive strength of the Port C pins independent of the parallel I/O registers.
6.2.6.1
Internal Pullup Enable (PTCPE)
An internal pullup device can be enabled for each port pin by setting the corresponding bit in the pullup
enable register (PTCPEn). The pullup device is disabled if the pin is configured as an output by the parallel
I/O control logic or any shared peripheral function regardless of the state of the corresponding pullup
enable register bit. The pullup device is also disabled if the pin is controlled by an analog function.
7
6
5
4
3
2
1
0
R
W
PTCPE71
PTCPE62
PTCPE5
PTCPE4
PTCPE3
PTCPE2
PTCPE1
PTCPE0
Reset
0
0
0
0
0
0
0
0
Figure 6-23. Pullup Enable for Port C (PTCPE)
1
2
PTCPE7 has no effect on the output-only PTC7 pin.
PTCPE6 has no effect on the output-only PTC6 pin.
Table 6-13. PTCPE Field Descriptions
Field
Description
Pullup Enable for Port C Bits — For port C pins that are inputs, these read/write control bits determine whether
7:0
PTCPE[7:0] internal pullup devices are enabled provided the corresponding PTCDDn is 0. For port C pins that are configured
as outputs, these bits are ignored and the internal pullup devices are disabled. When bits 4, 5, or 7 of port C are
enabled as KBI inputs and are configured to detect rising edges/high levels, the pullup enable bits enable
pulldown rather than pullup devices.
0 Internal pullup device disabled.
1 Internal pullup device enabled.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
92
Freescale Semiconductor
Chapter 6 Parallel Input/Output
6.2.6.2
Output Slew Rate Control Enable (PTCSE)
Slew rate control can be enabled for each port pin by setting the corresponding bit in the slew rate control
register (PTCSEn). When enabled, slew control limits the rate at which an output can transition in order
to reduce EMC emissions. Slew rate control has no effect on pins which are configured as inputs.
7
6
5
4
3
2
1
0
R
W
PTCSE71
PTCSE62
PTCSE5
PTCSE4
PTCSE3
PTCSE2
PTCSE1
PTCSE0
Reset
1
1
1
1
1
1
1
1
Figure 6-24. Slew Rate Control Enable for Port C (PTCSE)
1
2
PTCSE7 has no effect on the input-only PTC7 pin.
Reads of PTCD6 always return the contents of PTCD6, regardless of the value stored in the bit PTCDD6.
Table 6-14. PTCSE Field Descriptions
Field
Description
Slew Rate Control Enable for Port C Bits — For port C pins that are outputs, these read/write control bits
7:0
PTCSE[7:0] determine whether the slew rate controlled outputs are enabled. For port C pins that are configured as inputs,
these bits are ignored.
0 Slew rate control disabled.
1 Slew rate control enabled.
6.2.6.3
Output Drive Strength Select (PTCDS)
An output pin can be selected to have high output drive strength by setting the corresponding bit in the
drive strength select register (PTCDSn). When high drive is selected a pin is capable of sourcing and
sinking greater current. Even though every I/O pin can be selected as high drive, the user must ensure that
the total current source and sink limits for the chip are not exceeded. Drive strength selection is intended
to affect the DC behavior of I/O pins. However, the AC behavior is also affected. High drive allows a pin
to drive a greater load with the same switching speed as a low drive enabled pin into a smaller load.
Because of this the EMC emissions may be affected by enabling pins as high drive.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
93
Chapter 6 Parallel Input/Output
7
6
5
4
3
2
1
0
R
PTCDS71
0
PTCDS62
PTCDS5
PTCDS4
PTCDS3
PTCDS2
PTCDS1
PTCDS0
W
Reset
0
0
0
0
0
0
0
Figure 6-25. Drive Strength Selection for Port C (PTCDS)
1
2
PTCDS7 has no effect on the input-only PTC7 pin.
PTCDD6 has no effect on the output-only PTC6 pin.
Table 6-15. PTCDS Field Descriptions
Field
Description
Output Drive Strength Selection for Port C Bits—Each of these control bits selects between low and high output
7:0
PTCDS[7:0] drive for the associated PTC pin. For port C pins that are configured as inputs, these bits have no effect.
0 Low output drive strength selected for port C bit n.
1 High output drive strength selected for port C bit n.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
94
Freescale Semiconductor
Chapter 7
Keyboard Interrupt (S08KBIV2)
7.1
Introduction
This on-chip peripheral module is called a keyboard interrupt (KBI) module because originally it was
designed to simplify the connection and use of row-column matrices of keyboard switches. However, these
inputs are also useful as extra external interrupt inputs and as an external means of waking up the MCU
from stop or wait low-power modes.
The KBI module allows up to eight pins to act as additional interrupt sources. These pins can be configured
for either rising-edge sensing or falling-edge sensing. The sensing mode for all eight pins can also be
modified to detect edges and levels instead of only edges.
MC9S08LC60 Series MCUs have two KBIs. When they are described individually, they are called KBI1
and/or KBI2. When referring to the module in general or both KBIs collectively, they are called KBIx.
Figure 7-1 Shows the MC9S08LC60 Series block guide with the KBIs highlighted.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
95
Chapter 7 Keyboard Interrupt (S08KBIV2)
HCS08 CORE
ON-CHIP ICE
DEBUG MODULE (DBG)
CPU
INT
ADP[7:4]
ADP3
4
PTA[7:4]/KBI1P[7:4]/ADP[7:4]
12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
ADP2
BKGD
BKP
ADP1
ADP0
HCS08 SYSTEM CONTROL
ACMP–
ACMP+
ANALOG COMPARATOR
PTA3/KBI1P3/ADP3/ACMP–
PTA2/KBI1P2/ADP2/ACMP+
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
(ACMP)
8-BIT KEYBOARD
INTERRUPT (KBI1)
8
PTA[1:0]/KBI1P[1:0]/ADP[1:0]
RTI
COP
LVD
IRQ
SS1
PTB7/KBI2P4/SS1
PTB6/KBI2P3/SPSCK1
SPSCK1
MISO1
SERIAL PERIPHERAL
INTERFACE (SPI1)
USER FLASH A
MOSI1
(LC60 = 32,768 BYTES)
(LC36 = 24,576 BYTES)
SCL
SDA
PTB5/MOSI1/SCL
PTB4/MISO1/SDA
IIC MODULE (IIC)
USER FLASH B
PTB3/KBI2P2
PTB2/RESET
RESET
(LC60 = 28,464 BYTES)
(LC36 = 12,288 BYTES)
5
3
8-BIT KEYBOARD
INTERRUPT (KBI2)
XTAL
EXTAL
USER RAM
PTB1/KBI2P1/XTAL
PTB0/KBI2P0/EXTAL
(LC60 = 4096 BYTES)
(LC36 = 2560 BYTES)
IRQ
PTC7/KBI2P7/IRQ/TPMCLK
PTC6/BKGD/MS
INTERNAL CLOCK
GENERATOR (ICG)
TPM2CH1
TPM2CH0
2-CHANNEL TIMER/PWM
PTC5/KBI2P6/TPM2CH1
PTC4/KBI2P5/TPM2CH0
(TPM2)
TPMCLK
TPM1CH0
TPM1CH1
LOW-POWER OSCILLATOR
2-CHANNEL TIMER/PWM
(TPM1)
V
LCD
SS2
V
LL1
PTC3/SS2/TPM1CH1
SPSCK2
MOSI2
MISO2
V
SERIAL PERIPHERAL
LL2
PTC2/SPSCK2/TPM1CH0
LIQUID CRYSTAL
DISPLAY DRIVER
LCD
INTERFACE (SPI2)
V
LL3
V
V
CAP1
CAP2
TxD
RxD
PTC1/MOSI2/TxD
PTC0/MISO2/RxD
SERIAL COMMUNICATIONS
INTERFACE (SCI)
BP[2:0]
BP3/FP40
FP[39:0]
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pulldown device if IRQ enabled
(IRQPE = 1).
V
DD
VOLTAGE
3. IRQ does not have a clamp diode to V . IRQ should not be driven above V
.
DD
DD
V
4. Pin contains integrated pullup device.
REGULATOR
SS
5. Input-only RESET is shared with output-only PTB2. Default function after reset is
RESET.
6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is
output-only PTC7.
VREFH
VREFL
7. PTC6/BKGD/MS is an output only pin
8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP.
9. ACMPO is not available.
VDDAD
VSSAD
Figure 7-1. MC9S08LC60 Series Block Diagram Highlighting KBI Block and Pins
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
96
Freescale Semiconductor
Chapter 7 Keyboard Interrupt (S08KBIV2)
7.1.1
Features
The KBI features include:
•
•
Up to eight keyboard interrupt pins with individual pin enable bits.
Each keyboard interrupt pin is programmable as falling edge (or rising edge) only, or both falling
edge and low level (or both rising edge and high level) interrupt sensitivity.
•
•
One software enabled keyboard interrupt.
Exit from low-power modes.
7.1.2
Modes of Operation
This section defines the KBI operation in wait, stop, and background debug modes.
7.1.2.1
KBI in Wait Mode
The KBI continues to operate in wait mode if enabled before executing the WAIT instruction. Therefore,
an enabled KBI pin (KBPEx = 1) can be used to bring the MCU out of wait mode if the KBI interrupt is
enabled (KBIE = 1).
7.1.2.2
KBI in Stop Modes
The KBI operates asynchronously in stop3 mode if enabled before executing the STOP instruction.
Therefore, an enabled KBI pin (KBPEx = 1) can be used to bring the MCU out of stop3 mode if the KBI
interrupt is enabled (KBIE = 1).
During either stop1 or stop2 mode, the KBI is disabled. In some systems, the pins associated with the KBI
may be sources of wakeup from stop1 or stop2, see the stop modes section in the Modes of Operation
chapter. Upon wake-up from stop1 or stop2 mode, the KBI module will be in the reset state.
7.1.2.3
KBI in Active Background Mode
When the microcontroller is in active background mode, the KBI will continue to operate normally.
7.1.3
Block Diagram
The block diagram for the keyboard interrupt module is shown Figure 7-2.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
97
Chapter 7 Keyboard Interrupt (S08KBIV2)
BUSCLK
KBACK
RESET
V
1
DD
KBF
0
KBIxP0
CLR
Q
S
KBIPE0
D
SYNCHRONIZER
STOP BYPASS
CK
KBEDG0
KBIx
KEYBOARD
INTERRUPT FF
STOP
INTERRUPT
REQUEST
1
0
KBIxPn
KBMOD
S
KBIPEn
KBIE
KBEDGn
Figure 7-2. Keyboard Interrupt (KBI) Block Diagram
7.2
External Signal Description
The KBI input pins can be used to detect either falling edges, or both falling edge and low level interrupt
requests. The KBI input pins can also be used to detect either rising edges, or both rising edge and high
level interrupt requests.
The signal properties of KBI are shown in Table 7-1.
Table 7-1. Signal Properties
Signal
Function
I/O
KBIxPn
Keyboard interrupt pins
I
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7.3
Register Definition
The KBI includes three registers:
•
•
•
An 8-bit pin status and control register.
An 8-bit pin enable register.
An 8-bit edge select register.
Refer to the direct-page register summary in the Memory chapter for the absolute address assignments for
all KBI registers. This section refers to registers and control bits only by their names and relative address
offsets.
Some MCUs may have more than one KBI, so register names include placeholder characters to identify
which KBI is being referenced.
7.3.1
KBIx Status and Control Register (KBIxSC)
KBIxSC contains the status flag and control bits, which are used to configure the KBI.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
KBF
0
KBIE
KBMOD
KBACK
0
Reset:
0
0
0
0
0
0
0
= Unimplemented
Figure 7-3. KBIx Status and Control Register
Table 7-2. KBIxSC Register Field Descriptions
Description
Field
7:4
Unused register bits, always read 0.
3
KBF
Keyboard Interrupt Flag — KBF indicates when a keyboard interrupt is detected. Writes have no effect on KBF.
0 No keyboard interrupt detected.
1 Keyboard interrupt detected.
2
Keyboard Acknowledge — Writing a 1 to KBACK is part of the flag clearing mechanism. KBACK always reads
KBACK as 0.
1
Keyboard Interrupt Enable — KBIE determines whether a keyboard interrupt is requested.
KBIE
0 Keyboard interrupt request not enabled.
1 Keyboard interrupt request enabled.
0
Keyboard Detection Mode — KBMOD (along with the KBEDG bits) controls the detection mode of the keyboard
KBMOD interrupt pins.0Keyboard detects edges only.
1 Keyboard detects both edges and levels.
7.3.2
KBIx Pin Enable Register (KBIxPE)
KBIxPE contains the pin enable control bits.
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7
6
5
4
3
2
1
0
R
W
KBIPE7
KBIPE6
KBIPE5
KBIPE4
KBIPE3
KBIPE2
KBIPE1
KBIPE0
Reset:
0
0
0
0
0
0
0
0
Figure 7-4. KBIx Pin Enable Register
Table 7-3. KBIxPE Register Field Descriptions
Description
Field
7:0
Keyboard Pin Enables — Each of the KBIPEn bits enable the corresponding keyboard interrupt pin.
KBIPEn 0 Pin not enabled as keyboard interrupt.
1 Pin enabled as keyboard interrupt.
7.3.3
KBIx Edge Select Register (KBIxES)
KBIxES contains the edge select control bits.
7
6
5
4
3
2
1
0
R
W
KBEDG7
0
KBEDG6
0
KBEDG5
0
KBEDG4
KBEDG3
KBEDG2
KBEDG1
KBEDG0
Reset:
0
0
0
0
0
Figure 7-5. KBIx Edge Select Register
Table 7-4. KBIxES Register Field Descriptions
Description
Field
7:0
Keyboard Edge Selects — Each of the KBEDGn bits selects the falling edge/low level or rising edge/high level
KBEDGn function of the corresponding pin).
0 Falling edge/low level.
1 Rising edge/high level.
7.4
Functional Description
This on-chip peripheral module is called a keyboard interrupt (KBI) module because originally it was
designed to simplify the connection and use of row-column matrices of keyboard switches. However, these
inputs are also useful as extra external interrupt inputs and as an external means of waking the MCU from
stop or wait low-power modes.
The KBI module allows up to eight pins to act as additional interrupt sources. Writing to the KBIPEn bits
in the keyboard interrupt pin enable register (KBIxPE) independently enables or disables each KBI pin.
Each KBI pin can be configured as edge sensitive or edge and level sensitive based on the KBMOD bit in
the keyboard interrupt status and control register (KBIxSC). Edge sensitive can be software programmed
to be either falling or rising; the level can be either low or high. The polarity of the edge or edge and level
sensitivity is selected using the KBEDGn bits in the keyboard interrupt edge select register (KBIxES).
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Synchronous logic is used to detect edges. Prior to detecting an edge, enabled keyboard inputs must be at
the deasserted logic level. A falling edge is detected when an enabled keyboard input signal is seen as a
logic 1 (the deasserted level) during one bus cycle and then a logic 0 (the asserted level) during the next
cycle. A rising edge is detected when the input signal is seen as a logic 0 during one bus cycle and then a
logic 1 during the next cycle.
7.4.1
Edge Only Sensitivity
A valid edge on an enabled KBI pin will set KBF in KBIxSC. If KBIE in KBIxSC is set, an interrupt
request will be presented to the CPU. Clearing of KBF is accomplished by writing a 1 to KBACK in
KBIxSC.
7.4.2
Edge and Level Sensitivity
A valid edge or level on an enabled KBI pin will set KBF in KBIxSC. If KBIE in KBIxSC is set, an
interrupt request will be presented to the CPU. Clearing of KBF is accomplished by writing a 1 to KBACK
in KBIxSC provided all enabled keyboard inputs are at their deasserted levels. KBF will remain set if any
enabled KBI pin is asserted while attempting to clear by writing a 1 to KBACK.
7.4.3
KBI Pullup/Pulldown Resistors
The KBI pins can be configured to use an internal pullup/pulldown resistor using the associated I/O port
pullup enable register. If an internal resistor is enabled, the KBIxES register is used to select whether the
resistor is a pullup (KBEDGn = 0) or a pulldown (KBEDGn = 1).
7.4.4
KBI Initialization
When a keyboard interrupt pin is first enabled it is possible to get a false keyboard interrupt flag. To prevent
a false interrupt request during keyboard initialization, the user should do the following:
1. Mask keyboard interrupts by clearing KBIE in KBIxSC.
2. Enable the KBI polarity by setting the appropriate KBEDGn bits in KBIxES.
3. If using internal pullup/pulldown device, configure the associated pullup enable bits in PTxPE.
4. Enable the KBI pins by setting the appropriate KBIPEn bits in KBIxPE.
5. Write to KBACK in KBIxSC to clear any false interrupts.
6. Set KBIE in KBIxSC to enable interrupts.
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Chapter 8
Central Processor Unit (S08CPUV2)
8.1
Introduction
This section provides summary information about the registers, addressing modes, and instruction set of
the CPU of the HCS08 Family. For a more detailed discussion, refer to the HCS08 Family Reference
Manual, volume 1, Freescale Semiconductor document order number HCS08RMV1/D.
The HCS08 CPU is fully source- and object-code-compatible with the M68HC08 CPU. Several
instructions and enhanced addressing modes were added to improve C compiler efficiency and to support
a new background debug system which replaces the monitor mode of earlier M68HC08 microcontrollers
(MCU).
8.1.1
Features
Features of the HCS08 CPU include:
•
•
•
•
•
•
•
Object code fully upward-compatible with M68HC05 and M68HC08 Families
All registers and memory are mapped to a single 64-Kbyte address space
16-bit stack pointer (any size stack anywhere in 64-Kbyte address space)
16-bit index register (H:X) with powerful indexed addressing modes
8-bit accumulator (A)
Many instructions treat X as a second general-purpose 8-bit register
Seven addressing modes:
— Inherent — Operands in internal registers
— Relative — 8-bit signed offset to branch destination
— Immediate — Operand in next object code byte(s)
— Direct — Operand in memory at 0x0000–0x00FF
— Extended — Operand anywhere in 64-Kbyte address space
— Indexed relative to H:X — Five submodes including auto increment
— Indexed relative to SP — Improves C efficiency dramatically
Memory-to-memory data move instructions with four address mode combinations
•
•
Overflow, half-carry, negative, zero, and carry condition codes support conditional branching on
the results of signed, unsigned, and binary-coded decimal (BCD) operations
•
•
•
Efficient bit manipulation instructions
Fast 8-bit by 8-bit multiply and 16-bit by 8-bit divide instructions
STOP and WAIT instructions to invoke low-power operating modes
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8.2
Programmer’s Model and CPU Registers
Figure 8-1 shows the five CPU registers. CPU registers are not part of the memory map.
7
0
ACCUMULATOR
A
16-BIT INDEX REGISTER H:X
INDEX REGISTER (HIGH) INDEX REGISTER (LOW)
H
X
15
8
7
0
SP
PC
STACK POINTER
15
0
PROGRAM COUNTER
7
0
CONDITION CODE REGISTER
V
1
1
H
I
N
Z
C
CCR
CARRY
ZERO
NEGATIVE
INTERRUPT MASK
HALF-CARRY (FROM BIT 3)
TWO’S COMPLEMENT OVERFLOW
Figure 8-1. CPU Registers
8.2.1
Accumulator (A)
The A accumulator is a general-purpose 8-bit register. One operand input to the arithmetic logic unit
(ALU) is connected to the accumulator and the ALU results are often stored into the A accumulator after
arithmetic and logical operations. The accumulator can be loaded from memory using various addressing
modes to specify the address where the loaded data comes from, or the contents of A can be stored to
memory using various addressing modes to specify the address where data from A will be stored.
Reset has no effect on the contents of the A accumulator.
8.2.2
Index Register (H:X)
This 16-bit register is actually two separate 8-bit registers (H and X), which often work together as a 16-bit
address pointer where H holds the upper byte of an address and X holds the lower byte of the address. All
indexed addressing mode instructions use the full 16-bit value in H:X as an index reference pointer;
however, for compatibility with the earlier M68HC05 Family, some instructions operate only on the
low-order 8-bit half (X).
Many instructions treat X as a second general-purpose 8-bit register that can be used to hold 8-bit data
values. X can be cleared, incremented, decremented, complemented, negated, shifted, or rotated. Transfer
instructions allow data to be transferred from A or transferred to A where arithmetic and logical operations
can then be performed.
For compatibility with the earlier M68HC05 Family, H is forced to 0x00 during reset. Reset has no effect
on the contents of X.
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8.2.3
Stack Pointer (SP)
This 16-bit address pointer register points at the next available location on the automatic last-in-first-out
(LIFO) stack. The stack may be located anywhere in the 64-Kbyte address space that has RAM and can
be any size up to the amount of available RAM. The stack is used to automatically save the return address
for subroutine calls, the return address and CPU registers during interrupts, and for local variables. The
AIS (add immediate to stack pointer) instruction adds an 8-bit signed immediate value to SP. This is most
often used to allocate or deallocate space for local variables on the stack.
SP is forced to 0x00FF at reset for compatibility with the earlier M68HC05 Family. HCS08 programs
normally change the value in SP to the address of the last location (highest address) in on-chip RAM
during reset initialization to free up direct page RAM (from the end of the on-chip registers to 0x00FF).
The RSP (reset stack pointer) instruction was included for compatibility with the M68HC05 Family and
is seldom used in new HCS08 programs because it only affects the low-order half of the stack pointer.
8.2.4
Program Counter (PC)
The program counter is a 16-bit register that contains the address of the next instruction or operand to be
fetched.
During normal program execution, the program counter automatically increments to the next sequential
memory location every time an instruction or operand is fetched. Jump, branch, interrupt, and return
operations load the program counter with an address other than that of the next sequential location. This
is called a change-of-flow.
During reset, the program counter is loaded with the reset vector that is located at 0xFFFE and 0xFFFF.
The vector stored there is the address of the first instruction that will be executed after exiting the reset
state.
8.2.5
Condition Code Register (CCR)
The 8-bit condition code register contains the interrupt mask (I) and five flags that indicate the results of
the instruction just executed. Bits 6 and 5 are set permanently to 1. The following paragraphs describe the
functions of the condition code bits in general terms. For a more detailed explanation of how each
instruction sets the CCR bits, refer to the HCS08 Family Reference Manual, volume 1, Freescale
Semiconductor document order number HCS08RMv1.
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7
0
CONDITION CODE REGISTER
V
1
1
H
I
N
Z
C
CCR
CARRY
ZERO
NEGATIVE
INTERRUPT MASK
HALF-CARRY (FROM BIT 3)
TWO’S COMPLEMENT OVERFLOW
Figure 8-2. Condition Code Register
Table 8-1. CCR Register Field Descriptions
Description
Field
7
Two’s Complement Overflow Flag — The CPU sets the overflow flag when a two’s complement overflow occurs.
V
The signed branch instructions BGT, BGE, BLE, and BLT use the overflow flag.
0 No overflow
1 Overflow
4
H
Half-Carry Flag — The CPU sets the half-carry flag when a carry occurs between accumulator bits 3 and 4 during
an add-without-carry (ADD) or add-with-carry (ADC) operation. The half-carry flag is required for binary-coded
decimal (BCD) arithmetic operations. The DAA instruction uses the states of the H and C condition code bits to
automatically add a correction value to the result from a previous ADD or ADC on BCD operands to correct the
result to a valid BCD value.
0 No carry between bits 3 and 4
1 Carry between bits 3 and 4
3
I
Interrupt Mask Bit — When the interrupt mask is set, all maskable CPU interrupts are disabled. CPU interrupts
are enabled when the interrupt mask is cleared. When a CPU interrupt occurs, the interrupt mask is set
automatically after the CPU registers are saved on the stack, but before the first instruction of the interrupt service
routine is executed.
Interrupts are not recognized at the instruction boundary after any instruction that clears I (CLI or TAP). This
ensures that the next instruction after a CLI or TAP will always be executed without the possibility of an intervening
interrupt, provided I was set.
0 Interrupts enabled
1 Interrupts disabled
2
N
Negative Flag — The CPU sets the negative flag when an arithmetic operation, logic operation, or data
manipulation produces a negative result, setting bit 7 of the result. Simply loading or storing an 8-bit or 16-bit value
causes N to be set if the most significant bit of the loaded or stored value was 1.
0 Non-negative result
1 Negative result
1
Z
Zero Flag — The CPU sets the zero flag when an arithmetic operation, logic operation, or data manipulation
produces a result of 0x00 or 0x0000. Simply loading or storing an 8-bit or 16-bit value causes Z to be set if the
loaded or stored value was all 0s.
0 Non-zero result
1 Zero result
0
C
Carry/Borrow Flag — The CPU sets the carry/borrow flag when an addition operation produces a carry out of bit
7 of the accumulator or when a subtraction operation requires a borrow. Some instructions — such as bit test and
branch, shift, and rotate — also clear or set the carry/borrow flag.
0 No carry out of bit 7
1 Carry out of bit 7
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8.3
Addressing Modes
Addressing modes define the way the CPU accesses operands and data. In the HCS08, all memory, status
and control registers, and input/output (I/O) ports share a single 64-Kbyte linear address space so a 16-bit
binary address can uniquely identify any memory location. This arrangement means that the same
instructions that access variables in RAM can also be used to access I/O and control registers or nonvolatile
program space.
Some instructions use more than one addressing mode. For instance, move instructions use one addressing
mode to specify the source operand and a second addressing mode to specify the destination address.
Instructions such as BRCLR, BRSET, CBEQ, and DBNZ use one addressing mode to specify the location
of an operand for a test and then use relative addressing mode to specify the branch destination address
when the tested condition is true. For BRCLR, BRSET, CBEQ, and DBNZ, the addressing mode listed in
the instruction set tables is the addressing mode needed to access the operand to be tested, and relative
addressing mode is implied for the branch destination.
8.3.1
Inherent Addressing Mode (INH)
In this addressing mode, operands needed to complete the instruction (if any) are located within CPU
registers so the CPU does not need to access memory to get any operands.
8.3.2
Relative Addressing Mode (REL)
Relative addressing mode is used to specify the destination location for branch instructions. A signed 8-bit
offset value is located in the memory location immediately following the opcode. During execution, if the
branch condition is true, the signed offset is sign-extended to a 16-bit value and is added to the current
contents of the program counter, which causes program execution to continue at the branch destination
address.
8.3.3
Immediate Addressing Mode (IMM)
In immediate addressing mode, the operand needed to complete the instruction is included in the object
code immediately following the instruction opcode in memory. In the case of a 16-bit immediate operand,
the high-order byte is located in the next memory location after the opcode, and the low-order byte is
located in the next memory location after that.
8.3.4
Direct Addressing Mode (DIR)
In direct addressing mode, the instruction includes the low-order eight bits of an address in the direct page
(0x0000–0x00FF). During execution a 16-bit address is formed by concatenating an implied 0x00 for the
high-order half of the address and the direct address from the instruction to get the 16-bit address where
the desired operand is located. This is faster and more memory efficient than specifying a complete 16-bit
address for the operand.
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8.3.5
Extended Addressing Mode (EXT)
In extended addressing mode, the full 16-bit address of the operand is located in the next two bytes of
program memory after the opcode (high byte first).
8.3.6
Indexed Addressing Mode
Indexed addressing mode has seven variations including five that use the 16-bit H:X index register pair and
two that use the stack pointer as the base reference.
8.3.6.1
Indexed, No Offset (IX)
This variation of indexed addressing uses the 16-bit value in the H:X index register pair as the address of
the operand needed to complete the instruction.
8.3.6.2
Indexed, No Offset with Post Increment (IX+)
This variation of indexed addressing uses the 16-bit value in the H:X index register pair as the address of
the operand needed to complete the instruction. The index register pair is then incremented
(H:X = H:X + 0x0001) after the operand has been fetched. This addressing mode is only used for MOV
and CBEQ instructions.
8.3.6.3
Indexed, 8-Bit Offset (IX1)
This variation of indexed addressing uses the 16-bit value in the H:X index register pair plus an unsigned
8-bit offset included in the instruction as the address of the operand needed to complete the instruction.
8.3.6.4
Indexed, 8-Bit Offset with Post Increment (IX1+)
This variation of indexed addressing uses the 16-bit value in the H:X index register pair plus an unsigned
8-bit offset included in the instruction as the address of the operand needed to complete the instruction.
The index register pair is then incremented (H:X = H:X + 0x0001) after the operand has been fetched. This
addressing mode is used only for the CBEQ instruction.
8.3.6.5
Indexed, 16-Bit Offset (IX2)
This variation of indexed addressing uses the 16-bit value in the H:X index register pair plus a 16-bit offset
included in the instruction as the address of the operand needed to complete the instruction.
8.3.6.6
SP-Relative, 8-Bit Offset (SP1)
This variation of indexed addressing uses the 16-bit value in the stack pointer (SP) plus an unsigned 8-bit
offset included in the instruction as the address of the operand needed to complete the instruction.
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8.3.6.7
SP-Relative, 16-Bit Offset (SP2)
This variation of indexed addressing uses the 16-bit value in the stack pointer (SP) plus a 16-bit offset
included in the instruction as the address of the operand needed to complete the instruction.
8.4
Special Operations
The CPU performs a few special operations that are similar to instructions but do not have opcodes like
other CPU instructions. In addition, a few instructions such as STOP and WAIT directly affect other MCU
circuitry. This section provides additional information about these operations.
8.4.1
Reset Sequence
Reset can be caused by a power-on-reset (POR) event, internal conditions such as the COP (computer
operating properly) watchdog, or by assertion of an external active-low reset pin. When a reset event
occurs, the CPU immediately stops whatever it is doing (the MCU does not wait for an instruction
boundary before responding to a reset event). For a more detailed discussion about how the MCU
recognizes resets and determines the source, refer to the Resets, Interrupts, and System Configuration
chapter.
The reset event is considered concluded when the sequence to determine whether the reset came from an
internal source is done and when the reset pin is no longer asserted. At the conclusion of a reset event, the
CPU performs a 6-cycle sequence to fetch the reset vector from 0xFFFE and 0xFFFF and to fill the
instruction queue in preparation for execution of the first program instruction.
8.4.2
Interrupt Sequence
When an interrupt is requested, the CPU completes the current instruction before responding to the
interrupt. At this point, the program counter is pointing at the start of the next instruction, which is where
the CPU should return after servicing the interrupt. The CPU responds to an interrupt by performing the
same sequence of operations as for a software interrupt (SWI) instruction, except the address used for the
vector fetch is determined by the highest priority interrupt that is pending when the interrupt sequence
started.
The CPU sequence for an interrupt is:
1. Store the contents of PCL, PCH, X, A, and CCR on the stack, in that order.
2. Set the I bit in the CCR.
3. Fetch the high-order half of the interrupt vector.
4. Fetch the low-order half of the interrupt vector.
5. Delay for one free bus cycle.
6. Fetch three bytes of program information starting at the address indicated by the interrupt vector
to fill the instruction queue in preparation for execution of the first instruction in the interrupt
service routine.
After the CCR contents are pushed onto the stack, the I bit in the CCR is set to prevent other interrupts
while in the interrupt service routine. Although it is possible to clear the I bit with an instruction in the
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interrupt service routine, this would allow nesting of interrupts (which is not recommended because it
leads to programs that are difficult to debug and maintain).
For compatibility with the earlier M68HC05 MCUs, the high-order half of the H:X index register pair (H)
is not saved on the stack as part of the interrupt sequence. The user must use a PSHH instruction at the
beginning of the service routine to save H and then use a PULH instruction just before the RTI that ends
the interrupt service routine. It is not necessary to save H if you are certain that the interrupt service routine
does not use any instructions or auto-increment addressing modes that might change the value of H.
The software interrupt (SWI) instruction is like a hardware interrupt except that it is not masked by the
global I bit in the CCR and it is associated with an instruction opcode within the program so it is not
asynchronous to program execution.
8.4.3
Wait Mode Operation
The WAIT instruction enables interrupts by clearing the I bit in the CCR. It then halts the clocks to the
CPU to reduce overall power consumption while the CPU is waiting for the interrupt or reset event that
will wake the CPU from wait mode. When an interrupt or reset event occurs, the CPU clocks will resume
and the interrupt or reset event will be processed normally.
If a serial BACKGROUND command is issued to the MCU through the background debug interface while
the CPU is in wait mode, CPU clocks will resume and the CPU will enter active background mode where
other serial background commands can be processed. This ensures that a host development system can still
gain access to a target MCU even if it is in wait mode.
8.4.4
Stop Mode Operation
Usually, all system clocks, including the crystal oscillator (when used), are halted during stop mode to
minimize power consumption. In such systems, external circuitry is needed to control the time spent in
stop mode and to issue a signal to wake up the target MCU when it is time to resume processing. Unlike
the earlier M68HC05 and M68HC08 MCUs, the HCS08 can be configured to keep a minimum set of
clocks running in stop mode. This optionally allows an internal periodic signal to wake the target MCU
from stop mode.
When a host debug system is connected to the background debug pin (BKGD) and the ENBDM control
bit has been set by a serial command through the background interface (or because the MCU was reset into
active background mode), the oscillator is forced to remain active when the MCU enters stop mode. In this
case, if a serial BACKGROUND command is issued to the MCU through the background debug interface
while the CPU is in stop mode, CPU clocks will resume and the CPU will enter active background mode
where other serial background commands can be processed. This ensures that a host development system
can still gain access to a target MCU even if it is in stop mode.
Recovery from stop mode depends on the particular HCS08 and whether the oscillator was stopped in stop
mode. Refer to the Modes of Operation chapter for more details.
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8.4.5
BGND Instruction
The BGND instruction is new to the HCS08 compared to the M68HC08. BGND would not be used in
normal user programs because it forces the CPU to stop processing user instructions and enter the active
background mode. The only way to resume execution of the user program is through reset or by a host
debug system issuing a GO, TRACE1, or TAGGO serial command through the background debug
interface.
Software-based breakpoints can be set by replacing an opcode at the desired breakpoint address with the
BGND opcode. When the program reaches this breakpoint address, the CPU is forced to active background
mode rather than continuing the user program.
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8.5
HCS08 Instruction Set Summary
Instruction Set Summary Nomenclature
The nomenclature listed here is used in the instruction descriptions in Table 8-2.
Operators
( )
←
&
|
⊕
×
÷
:
+
–
=
=
=
=
=
=
=
=
=
=
Contents of register or memory location shown inside parentheses
Is loaded with (read: “gets”)
Boolean AND
Boolean OR
Boolean exclusive-OR
Multiply
Divide
Concatenate
Add
Negate (two’s complement)
CPU registers
A
CCR
H
X
PC
PCH
PCL
SP
=
Accumulator
Condition code register
=
=
=
=
=
=
=
Index register, higher order (most significant) 8 bits
Index register, lower order (least significant) 8 bits
Program counter
Program counter, higher order (most significant) 8 bits
Program counter, lower order (least significant) 8 bits
Stack pointer
Memory and addressing
M = A memory location or absolute data, depending on addressing mode
M:M + 0x0001= A 16-bit value in two consecutive memory locations. The higher-order (most
significant) 8 bits are located at the address of M, and the lower-order (least
significant) 8 bits are located at the next higher sequential address.
Condition code register (CCR) bits
V
H
I
N
Z
C
=
=
=
=
=
=
Two’s complement overflow indicator, bit 7
Half carry, bit 4
Interrupt mask, bit 3
Negative indicator, bit 2
Zero indicator, bit 1
Carry/borrow, bit 0 (carry out of bit 7)
CCR activity notation
Bit not affected
–
=
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
112
Freescale Semiconductor
Chapter 8 Central Processor Unit (S08CPUV2)
0
1
=
=
=
=
Bit forced to 0
Bit forced to 1
Bit set or cleared according to results of operation
Undefined after the operation
U
Machine coding notation
dd
ee
ff
ii
jj
kk
hh
ll
=
=
=
=
=
=
=
=
=
Low-order 8 bits of a direct address 0x0000–0x00FF (high byte assumed to be 0x00)
Upper 8 bits of 16-bit offset
Lower 8 bits of 16-bit offset or 8-bit offset
One byte of immediate data
High-order byte of a 16-bit immediate data value
Low-order byte of a 16-bit immediate data value
High-order byte of 16-bit extended address
Low-order byte of 16-bit extended address
Relative offset
rr
Source form
Everything in the source forms columns, except expressions in italic characters, is literal information that
must appear in the assembly source file exactly as shown. The initial 3- to 5-letter mnemonic is always a
literal expression. All commas, pound signs (#), parentheses, and plus signs (+) are literal characters.
n — Any label or expression that evaluates to a single integer in the range 0–7
opr8i — Any label or expression that evaluates to an 8-bit immediate value
opr16i — Any label or expression that evaluates to a 16-bit immediate value
opr8a — Any label or expression that evaluates to an 8-bit value. The instruction treats this 8-bit
value as the low order 8 bits of an address in the direct page of the 64-Kbyte address
space (0x00xx).
opr16a — Any label or expression that evaluates to a 16-bit value. The instruction treats this
value as an address in the 64-Kbyte address space.
oprx8 — Any label or expression that evaluates to an unsigned 8-bit value, used for indexed
addressing
oprx16 — Any label or expression that evaluates to a 16-bit value. Because the HCS08 has a
16-bit address bus, this can be either a signed or an unsigned value.
rel — Any label or expression that refers to an address that is within –128 to +127 locations
from the next address after the last byte of object code for the current instruction. The
assembler will calculate the 8-bit signed offset and include it in the object code for this
instruction.
Address modes
INH
IMM
DIR
EXT
=
=
=
=
Inherent (no operands)
8-bit or 16-bit immediate
8-bit direct
16-bit extended
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
113
Chapter 8 Central Processor Unit (S08CPUV2)
IX
IX+
IX1
=
=
=
=
16-bit indexed no offset
16-bit indexed no offset, post increment (CBEQ and MOV only)
16-bit indexed with 8-bit offset from H:X
16-bit indexed with 8-bit offset, post increment
(CBEQ only)
IX1+
IX2
REL
SP1
SP2
=
=
=
=
16-bit indexed with 16-bit offset from H:X
8-bit relative offset
Stack pointer with 8-bit offset
Stack pointer with 16-bit offset
Table 8-2. HCS08 Instruction Set Summary (Sheet 1 of 7)
Effect
on CCR
Source
Form
Operation
Description
V H I N Z C
ADC #opr8i
IMM
DIR
EXT
IX2
A9 ii
B9 dd
2
3
4
4
3
3
5
4
ADC opr8a
ADC opr16a
ADC oprx16,X
ADC oprx8,X
ADC ,X
ADC oprx16,SP
ADC oprx8,SP
C9 hh ll
D9 ee ff
E9 ff
Add with Carry
A ← (A) + (M) + (C)
↕
↕
↕
↕
↕
↕
↕
↕
↕
↕
–
–
IX1
IX
SP2
SP1
F9
9ED9 ee ff
9EE9 ff
ADD #opr8i
ADD opr8a
IMM
DIR
EXT
IX2
IX1
IX
SP2
SP1
AB ii
BB dd
2
3
4
4
3
3
5
4
ADD opr16a
ADD oprx16,X
ADD oprx8,X
ADD ,X
CB hh ll
DB ee ff
EB ff
Add without Carry
A ← (A) + (M)
FB
ADD oprx16,SP
ADD oprx8,SP
9EDB ee ff
9EEB ff
Add Immediate Value
SP ← (SP) + (M)
AIS #opr8i
–
–
–
–
–
–
–
–
–
–
– IMM
A7 ii
2
(Signed) to Stack Pointer M is sign extended to a 16-bit value
Add Immediate Value
H:X ← (H:X) + (M)
AIX #opr8i
(Signed) to Index
– IMM
AF ii
2
M is sign extended to a 16-bit value
Register (H:X)
AND #opr8i
AND opr8a
IMM
DIR
EXT
A4 ii
B4 dd
2
3
4
4
3
3
5
4
AND opr16a
AND oprx16,X
AND oprx8,X
AND ,X
C4 hh ll
D4 ee ff
E4 ff
IX2
Logical AND
A ← (A) & (M)
0
–
–
–
–
↕
↕
↕
↕
–
IX1
IX
SP2
SP1
F4
AND oprx16,SP
AND oprx8,SP
9ED4 ee ff
9EE4 ff
ASL opr8a
ASLA
ASLX
ASL oprx8,X
ASL ,X
ASL oprx8,SP
DIR
INH
38 dd
48
5
1
1
5
4
6
Arithmetic Shift Left
(Same as LSL)
INH
58
↕
↕
C
0
IX1
68 ff
78
b7
b0
b0
IX
SP1
9E68 ff
ASR opr8a
ASRA
ASRX
ASR oprx8,X
ASR ,X
ASR oprx8,SP
DIR
INH
37 dd
47
5
1
1
5
4
6
INH
57
C
Arithmetic Shift Right
↕
–
–
–
–
↕
↕
↕
IX1
67 ff
77
b7
IX
SP1
9E67 ff
BCC rel
Branch if Carry Bit Clear
Branch if (C) = 0
–
–
–
– REL
24 rr
3
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
114
Freescale Semiconductor
Chapter 8 Central Processor Unit (S08CPUV2)
Table 8-2. HCS08 Instruction Set Summary (Sheet 2 of 7)
Effect
on CCR
Source
Form
Operation
Description
V H I N Z C
DIR (b0)
DIR (b1)
DIR (b2)
DIR (b3)
DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
11 dd
13 dd
15 dd
17 dd
19 dd
1B dd
1D dd
1F dd
5
5
5
5
5
5
5
5
BCLR n,opr8a
Clear Bit n in Memory
Mn ← 0
– – – – – –
Branch if Carry Bit Set
(Same as BLO)
BCS rel
BEQ rel
Branch if (C) = 1
Branch if (Z) = 1
REL
REL
25 rr
27 rr
3
3
– – – – – –
– – – – – –
Branch if Equal
Branch if Greater Than or
Equal To
BGE rel
Branch if (N ⊕ V) = 0
REL
INH
90 rr
82
3
– – – – – –
– – – – – –
(Signed Operands)
Waits For and Processes BDM
Commands Until GO, TRACE1, or
TAGGO
Enter Active Background
if ENBDM = 1
BGND
5+
Branch if Greater Than
(Signed Operands)
BGT rel
Branch if (Z) | (N ⊕ V) = 0
REL
REL
92 rr
28 rr
3
3
– – – – – –
– – – – – –
Branch if Half Carry Bit
Clear
BHCC rel
Branch if (H) = 0
Branch if Half Carry Bit
Set
BHCS rel
BHI rel
Branch if (H) = 1
Branch if (C) | (Z) = 0
Branch if (C) = 0
REL
REL
REL
29 rr
22 rr
24 rr
3
3
3
– – – – – –
– – – – – –
– – – – – –
Branch if Higher
Branch if Higher or Same
(Same as BCC)
BHS rel
BIH rel
BIL rel
Branch if IRQ Pin High
Branch if IRQ Pin Low
Branch if IRQ pin = 1
Branch if IRQ pin = 0
REL
REL
2F rr
2E rr
3
3
– – – – – –
– – – – – –
BIT #opr8i
BIT opr8a
BIT opr16a
BIT oprx16,X
BIT oprx8,X
BIT ,X
IMM
DIR
EXT
IX2
A5 ii
B5 dd
2
3
4
4
3
3
5
4
C5 hh ll
D5 ee ff
E5 ff
(A) & (M)
(CCR Updated but Operands
Not Changed)
Bit Test
↕
↕
–
0 – –
IX1
IX
SP2
SP1
F5
BIT oprx16,SP
BIT oprx8,SP
9ED5 ee ff
9EE5 ff
Branch if Less Than
or Equal To
(Signed Operands)
BLE rel
Branch if (Z) | (N ⊕ V) = 1
REL
93 rr
3
– – – – – –
Branch if Lower
(Same as BCS)
BLO rel
BLS rel
BLT rel
Branch if (C) = 1
Branch if (C) | (Z) = 1
Branch if (N ⊕ V ) = 1
REL
REL
REL
25 rr
23 rr
91 rr
3
3
3
– – – – – –
– – – – – –
– – – – – –
Branch if Lower or Same
Branch if Less Than
(Signed Operands)
Branch if Interrupt Mask
Clear
BMC rel
BMI rel
BMS rel
Branch if (I) = 0
Branch if (N) = 1
Branch if (I) = 1
REL
REL
REL
2C rr
2B rr
2D rr
3
3
3
– – – – – –
– – – – – –
– – – – – –
Branch if Minus
Branch if Interrupt Mask
Set
BNE rel
BPL rel
BRA rel
Branch if Not Equal
Branch if Plus
Branch if (Z) = 0
Branch if (N) = 0
No Test
REL
REL
REL
26 rr
2A rr
20 rr
3
3
3
– – – – – –
– – – – – –
– – – – – –
Branch Always
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
115
Chapter 8 Central Processor Unit (S08CPUV2)
Table 8-2. HCS08 Instruction Set Summary (Sheet 3 of 7)
Effect
on CCR
Source
Form
Operation
Description
V H I N Z C
DIR (b0)
DIR (b1)
DIR (b2)
DIR (b3)
DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
01 dd rr
03 dd rr
05 dd rr
07 dd rr
09 dd rr
0B dd rr
0D dd rr
0F dd rr
5
5
5
5
5
5
5
5
Branch if Bit n in Memory
BRCLR n,opr8a,rel
BRN rel
Branch if (Mn) = 0
Uses 3 Bus Cycles
Branch if (Mn) = 1
↕
– – – – –
Clear
Branch Never
REL
21 rr
3
– – – – – –
DIR (b0)
DIR (b1)
DIR (b2)
DIR (b3)
DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
00 dd rr
02 dd rr
04 dd rr
06 dd rr
08 dd rr
0A dd rr
0C dd rr
0E dd rr
5
5
5
5
5
5
5
5
Branch if Bit n in Memory
Set
BRSET n,opr8a,rel
↕
– – – – –
DIR (b0)
DIR (b1)
DIR (b2)
DIR (b3)
DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
10 dd
12 dd
14 dd
16 dd
18 dd
1A dd
1C dd
1E dd
5
5
5
5
5
5
5
5
BSET n,opr8a
BSR rel
Set Bit n in Memory
Mn ← 1
– – – – – –
PC ← (PC) + 0x0002
push (PCL); SP ← (SP) – 0x0001
push (PCH); SP ← (SP) – 0x0001
PC ← (PC) + rel
Branch to Subroutine
Compare and Branch if
REL
AD rr
5
– – – – – –
CBEQ opr8a,rel
CBEQA #opr8i,rel
CBEQX #opr8i,rel
CBEQ oprx8,X+,rel Equal
CBEQ ,X+,rel
CBEQ oprx8,SP,rel
Branch if (A) = (M)
Branch if (A) = (M)
Branch if (X) = (M)
Branch if (A) = (M)
Branch if (A) = (M)
Branch if (A) = (M)
DIR
IMM
IMM
IX1+
IX+
31 dd rr
41 ii rr
51 ii rr
61 ff rr
71 rr
5
4
4
5
5
6
– – – – – –
SP1
9E61 ff rr
CLC
CLI
Clear Carry Bit
C ← 0
I ← 0
INH
INH
98
9A
1
1
– – – – – 0
– – 0 – – –
Clear Interrupt Mask Bit
Clear
CLR opr8a
CLRA
CLRX
CLRH
CLR oprx8,X
CLR ,X
CLR oprx8,SP
M ← 0x00
A ← 0x00
X ← 0x00
H ← 0x00
M ← 0x00
M ← 0x00
M ← 0x00
DIR
INH
INH
INH
IX1
IX
3F dd
4F
5
1
1
1
5
4
6
5F
8C
0 – – 0 1 –
6F ff
7F
SP1
9E6F ff
CMP #opr8i
CMP opr8a
IMM
DIR
EXT
IX2
A1 ii
B1 dd
2
3
4
4
3
3
5
4
CMP opr16a
CMP oprx16,X
CMP oprx8,X
CMP ,X
C1 hh ll
D1 ee ff
E1 ff
(A) – (M)
(CCR Updated But Operands Not
Changed)
Compare Accumulator
with Memory
↕
– –
↕
↕
↕
IX1
IX
SP2
SP1
F1
CMP oprx16,SP
CMP oprx8,SP
9ED1 ee ff
9EE1 ff
COM opr8a
COMA
M ← (M)= 0xFF – (M)
A ← (A) = 0xFF – (A)
X ← (X) = 0xFF – (X)
M ← (M) = 0xFF – (M)
M ← (M) = 0xFF – (M)
M ← (M) = 0xFF – (M)
DIR
INH
INH
IX1
IX
33 dd
43
5
1
1
5
4
6
COMX
Complement
53
↕
↕
↕
↕
0 – –
1
COM oprx8,X
COM ,X
COM oprx8,SP
(One’s Complement)
63 ff
73
9E63 ff
SP1
CPHX opr16a
CPHX #opr16i
CPHX opr8a
EXT
IMM
DIR
SP1
3E hh ll
65 jj kk
75 dd
6
3
5
6
(H:X) – (M:M + 0x0001)
(CCR Updated But Operands Not
Changed)
Compare Index Register
(H:X) with Memory
↕
↕
– –
CPHX oprx8,SP
9EF3 ff
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
116
Freescale Semiconductor
Chapter 8 Central Processor Unit (S08CPUV2)
Table 8-2. HCS08 Instruction Set Summary (Sheet 4 of 7)
Effect
on CCR
Source
Form
Operation
Description
V H I N Z C
CPX #opr8i
IMM
DIR
EXT
IX2
A3 ii
B3 dd
2
3
4
4
3
3
5
4
CPX opr8a
CPX opr16a
CPX oprx16,X
CPX oprx8,X
CPX ,X
CPX oprx16,SP
CPX oprx8,SP
C3 hh ll
D3 ee ff
E3 ff
Compare X (Index
Register Low) with
Memory
(X) – (M)
(CCR Updated But Operands Not
Changed)
↕
↕
↕
↕
↕
↕
– –
IX1
IX
SP2
SP1
F3
9ED3 ee ff
9EE3 ff
Decimal Adjust
Accumulator After ADD or
ADC of BCD Values
DAA
(A)
↕ INH
72
1
U – –
10
DBNZ opr8a,rel
DBNZA rel
DIR
INH
INH
3B dd rr
4B rr
7
4
4
7
6
8
Decrement A, X, or M
Branch if (result) ≠ 0
DBNZX Affects X Not H
DBNZX rel
Decrement and Branch if
Not Zero
5B rr
– – – – – –
DBNZ oprx8,X,rel
DBNZ ,X,rel
DBNZ oprx8,SP,rel
IX1
IX
6B ff rr
7B rr
9E6B ff rr
SP1
DEC opr8a
DECA
M ← (M) – 0x01
A ← (A) – 0x01
X ← (X) – 0x01
M ← (M) – 0x01
M ← (M) – 0x01
M ← (M) – 0x01
DIR
INH
INH
IX1
IX
3A dd
4A
5
1
1
5
4
6
DECX
5A
Decrement
Divide
↕
↕
↕
↕
– –
–
DEC oprx8,X
DEC ,X
DEC oprx8,SP
6A ff
7A
9E6A ff
SP1
A ← (H:A)÷(X)
DIV
↕ INH
52
6
– – – –
H ← Remainder
EOR #opr8i
EOR opr8a
IMM
DIR
EXT
A8 ii
B8 dd
2
3
4
4
3
3
5
4
EOR opr16a
EOR oprx16,X
EOR oprx8,X
EOR ,X
C8 hh ll
D8 ee ff
E8 ff
Exclusive OR
Memory with
Accumulator
IX2
A ← (A ⊕ M)
↕
↕
↕
↕
0 – –
–
IX1
IX
SP2
SP1
F8
EOR oprx16,SP
EOR oprx8,SP
9ED8 ee ff
9EE8 ff
INC opr8a
INCA
INCX
INC oprx8,X
INC ,X
INC oprx8,SP
M ← (M) + 0x01
A ← (A) + 0x01
X ← (X) + 0x01
M ← (M) + 0x01
M ← (M) + 0x01
M ← (M) + 0x01
DIR
INH
3C dd
4C
5
1
1
5
4
6
INH
5C
Increment
↕
– –
–
IX1
6C ff
7C
IX
SP1
9E6C ff
JMP opr8a
JMP opr16a
JMP oprx16,X
JMP oprx8,X
JMP ,X
DIR
BC dd
CC hh ll
DC ee ff
EC ff
3
4
4
3
3
EXT
Jump
PC ← Jump Address
IX2
IX1
IX
– – – – – –
FC
JSR opr8a
JSR opr16a
JSR oprx16,X
JSR oprx8,X
JSR ,X
DIR
EXT
IX2
IX1
IX
BD dd
CD hh ll
DD ee ff
ED ff
5
6
6
5
5
PC ← (PC) + n (n = 1, 2, or 3)
Push (PCL); SP ← (SP) – 0x0001
Push (PCH); SP ← (SP) – 0x0001
PC ← Unconditional Address
Jump to Subroutine
– – – – – –
FD
LDA #opr8i
LDA opr8a
IMM
DIR
EXT
IX2
A6 ii
B6 dd
2
3
4
4
3
3
5
4
LDA opr16a
LDA oprx16,X
LDA oprx8,X
LDA ,X
C6 hh ll
D6 ee ff
E6 ff
Load Accumulator from
Memory
A ← (M)
0 – –
↕
↕
↕
↕
–
–
IX1
IX
SP2
SP1
F6
LDA oprx16,SP
LDA oprx8,SP
9ED6 ee ff
9EE6 ff
LDHX #opr16i
LDHX opr8a
LDHX opr16a
LDHX ,X
LDHX oprx16,X
LDHX oprx8,X
LDHX oprx8,SP
IMM
DIR
EXT
IX
IX2
IX1
SP1
45 jj kk
55 dd
32 hh ll
9EAE
9EBE ee ff
9ECE ff
9EFE ff
3
4
5
5
6
5
5
Load Index Register (H:X)
from Memory
H:X ← (M:M + 0x0001)
0 – –
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
117
Chapter 8 Central Processor Unit (S08CPUV2)
Table 8-2. HCS08 Instruction Set Summary (Sheet 5 of 7)
Effect
on CCR
Source
Form
Operation
Description
V H I N Z C
LDX #opr8i
IMM
DIR
EXT
IX2
AE ii
BE dd
2
3
4
4
3
3
5
4
LDX opr8a
LDX opr16a
LDX oprx16,X
LDX oprx8,X
LDX ,X
LDX oprx16,SP
LDX oprx8,SP
CE hh ll
DE ee ff
EE ff
Load X (Index Register
Low) from Memory
X ← (M)
↕
↕
↕
0 – –
–
IX1
IX
SP2
SP1
FE
9EDE ee ff
9EEE ff
LSL opr8a
LSLA
LSLX
LSL oprx8,X
LSL ,X
LSL oprx8,SP
DIR
INH
INH
IX1
IX
38 dd
48
5
1
1
5
4
6
Logical Shift Left
(Same as ASL)
58
C
0
↕
↕
↕
– –
68 ff
78
b7
b0
b0
SP1
9E68 ff
LSR opr8a
LSRA
LSRX
LSR oprx8,X
LSR ,X
LSR oprx8,SP
DIR
INH
INH
IX1
IX
34 dd
44
5
1
1
5
4
6
54
0
C
Logical Shift Right
↕
↕
↕
↕
– – 0
64 ff
74
b7
SP1
9E64 ff
MOV opr8a,opr8a
MOV opr8a,X+
MOV #opr8i,opr8a
MOV ,X+,opr8a
(M)
← (M)
DIR/DIR
DIR/IX+
IMM/DIR
IX+/DIR
4E dd dd
5E dd
6E ii dd
7E dd
5
5
4
5
destination
source
Move
↕
0 – –
–
H:X ← (H:X) + 0x0001 in
IX+/DIR and DIR/IX+ Modes
MUL
Unsigned multiply
X:A ← (X) × (A)
INH
42
5
– 0 – – – 0
NEG opr8a
NEGA
M ← – (M) = 0x00 – (M)
A ← – (A) = 0x00 – (A)
X ← – (X) = 0x00 – (X)
M ← – (M) = 0x00 – (M)
M ← – (M) = 0x00 – (M)
M ← – (M) = 0x00 – (M)
DIR
INH
INH
IX1
IX
30 dd
40
5
1
1
5
4
6
NEGX
Negate
(Two’s Complement)
50
↕
↕
↕
– –
NEG oprx8,X
NEG ,X
NEG oprx8,SP
60 ff
70
9E60 ff
SP1
NOP
No Operation
Uses 1 Bus Cycle
INH
9D
1
– – – – – –
– – – – – –
Nibble Swap
Accumulator
NSA
A ← (A[3:0]:A[7:4])
INH
62
1
ORA #opr8i
ORA opr8a
IMM
DIR
EXT
IX2
AA ii
BA dd
2
3
4
4
3
3
5
4
ORA opr16a
ORA oprx16,X
ORA oprx8,X
ORA ,X
CA hh ll
DA ee ff
EA ff
InclusiveORAccumulator
and Memory
A ← (A) | (M)
↕
↕
–
0 – –
IX1
IX
SP2
SP1
FA
ORA oprx16,SP
ORA oprx8,SP
9EDA ee ff
9EEA ff
Push Accumulator onto
Stack
PSHA
PSHH
PSHX
PULA
PULH
PULX
Push (A); SP ← (SP) – 0x0001
Push (H); SP ← (SP) – 0x0001
Push (X); SP ← (SP) – 0x0001
SP ← (SP + 0x0001); Pull (A)
SP ← (SP + 0x0001); Pull (H)
SP ← (SP + 0x0001); Pull (X)
INH
INH
INH
INH
INH
INH
87
8B
89
86
8A
88
2
2
2
3
3
3
– – – – – –
– – – – – –
– – – – – –
– – – – – –
– – – – – –
– – – – – –
Push H (Index Register
High) onto Stack
Push X (Index Register
Low) onto Stack
Pull Accumulator from
Stack
Pull H (Index Register
High) from Stack
Pull X (Index Register
Low) from Stack
ROL opr8a
ROLA
DIR
INH
INH
IX1
IX
39 dd
49
5
1
1
5
4
6
ROLX
59
C
Rotate Left through Carry
↕
↕
↕
↕
– –
ROL oprx8,X
ROL ,X
ROL oprx8,SP
69 ff
79
9E69 ff
b7
b0
SP1
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
118
Freescale Semiconductor
Chapter 8 Central Processor Unit (S08CPUV2)
Table 8-2. HCS08 Instruction Set Summary (Sheet 6 of 7)
Effect
on CCR
Source
Form
Operation
Description
V H I N Z C
ROR opr8a
DIR
INH
INH
IX1
IX
36 dd
46
5
1
1
5
4
6
RORA
RORX
Rotate Right through
Carry
56
C
↕
↕
↕
↕
– –
ROR oprx8,X
ROR ,X
66 ff
76
9E66 ff
b7
b0
ROR oprx8,SP
SP1
SP ← 0xFF
RSP
Reset Stack Pointer
Return from Interrupt
Return from Subroutine
INH
9C
80
81
1
9
6
– – – – – –
(High Byte Not Affected)
SP ← (SP) + 0x0001; Pull (CCR)
SP ← (SP) + 0x0001; Pull (A)
SP ← (SP) + 0x0001; Pull (X)
SP ← (SP) + 0x0001; Pull (PCH)
SP ← (SP) + 0x0001; Pull (PCL)
SP ← SP + 0x0001; Pull (PCH)
SP ← SP + 0x0001; Pull (PCL)
RTI
↕
↕
↕
↕
↕
↕ INH
RTS
INH
– – – – – –
SBC #opr8i
SBC opr8a
IMM
DIR
EXT
IX2
A2 ii
2
3
4
4
3
3
5
4
B2 dd
SBC opr16a
SBC oprx16,X
SBC oprx8,X
SBC ,X
C2 hh ll
D2 ee ff
E2 ff
Subtract with Carry
A ← (A) – (M) – (C)
↕
↕
↕
↕
– –
IX1
IX
SP2
SP1
F2
SBC oprx16,SP
SBC oprx8,SP
9ED2 ee ff
9EE2 ff
SEC
SEI
Set Carry Bit
C ← 1
I ← 1
INH
INH
99
9B
1
1
– – – – – 1
– – 1 – – –
Set Interrupt Mask Bit
STA opr8a
DIR
EXT
IX2
IX1
IX
B7 dd
C7 hh ll
D7 ee ff
E7 ff
3
4
4
3
2
5
4
STA opr16a
STA oprx16,X
STA oprx8,X
STA ,X
Store Accumulator in
Memory
M ← (A)
↕
↕
↕
↕
0 – –
–
–
F7
STA oprx16,SP
STA oprx8,SP
SP2
SP1
9ED7 ee ff
9EE7 ff
STHX opr8a
STHX opr16a
STHX oprx8,SP
DIR
EXT
SP1
35 dd
96 hh ll
9EFF ff
4
5
5
Store H:X (Index Reg.)
(M:M + 0x0001) ← (H:X)
I bit ← 0; Stop Processing
0 – –
Enable Interrupts:
Stop Processing
Refer to MCU
STOP
INH
8E
2+
– – 0 – – –
Documentation
STX opr8a
DIR
EXT
IX2
IX1
IX
BF dd
CF hh ll
DF ee ff
EF ff
3
4
4
3
2
5
4
STX opr16a
STX oprx16,X
STX oprx8,X
STX ,X
Store X (Low 8 Bits of
Index Register)
in Memory
M ← (X)
↕
↕
↕
↕
0 – –
–
FF
STX oprx16,SP
STX oprx8,SP
SP2
SP1
9EDF ee ff
9EEF ff
SUB #opr8i
SUB opr8a
IMM
DIR
EXT
IX2
IX1
IX
SP2
SP1
A0 ii
B0 dd
2
3
4
4
3
3
5
4
SUB opr16a
SUB oprx16,X
SUB oprx8,X
SUB ,X
C0 hh ll
D0 ee ff
E0 ff
Subtract
A ← (A) – (M)
↕
↕
– –
F0
SUB oprx16,SP
SUB oprx8,SP
9ED0 ee ff
9EE0 ff
PC ← (PC) + 0x0001
Push (PCL); SP ← (SP) – 0x0001
Push (PCH); SP ← (SP) – 0x0001
Push (X); SP ← (SP) – 0x0001
Push (A); SP ← (SP) – 0x0001
Push (CCR); SP ← (SP) – 0x0001
I ← 1;
SWI
Software Interrupt
INH
83
11
– – 1 – – –
PCH ← Interrupt Vector High Byte
PCL ← Interrupt Vector Low Byte
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
119
Chapter 8 Central Processor Unit (S08CPUV2)
Table 8-2. HCS08 Instruction Set Summary (Sheet 7 of 7)
Effect
on CCR
Source
Form
Operation
Description
V H I N Z C
Transfer Accumulator to
CCR
TAP
TAX
TPA
CCR ← (A)
X ← (A)
↕
↕
↕
↕
↕
↕ INH
84
97
85
1
1
1
Transfer Accumulator to
X (Index Register Low)
INH
INH
– – – – – –
– – – – – –
Transfer CCR to
Accumulator
A ← (CCR)
TST opr8a
TSTA
(M) – 0x00
(A) – 0x00
(X) – 0x00
(M) – 0x00
(M) – 0x00
(M) – 0x00
DIR
INH
INH
IX1
IX
3D dd
4D
4
1
1
4
3
5
TSTX
5D
Test for Negative or Zero
↕
↕
–
0 – –
TST oprx8,X
TST ,X
TST oprx8,SP
6D ff
7D
9E6D ff
SP1
TSX
TXA
TXS
WAIT
Transfer SP to Index Reg.
H:X ← (SP) + 0x0001
A ← (X)
INH
INH
INH
INH
95
9F
94
8F
2
– – – – – –
– – – – – –
– – – – – –
– – 0 – – –
Transfer X (Index Reg.
Low) to Accumulator
1
Transfer Index Reg. to SP
SP ← (H:X) – 0x0001
I bit ← 0; Halt CPU
2
Enable Interrupts; Wait
for Interrupt
2+
1
Bus clock frequency is one-half of the CPU clock frequency.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
120
Freescale Semiconductor
Chapter 8 Central Processor Unit (S08CPUV2)
Table 8-3. Opcode Map (Sheet 1 of 2)
Bit-Manipulation
10
Branch
20
Read-Modify-Write
Control
Register/Memory
00
5
5
3
30
5
40
1
50
1
60
5
70
4
80
9
90
3
A0
2
B0
3
C0
4
D0
4
E0
3
F0
3
BRSET0 BSET0
3
01
BRA
NEG
NEGA
NEGX
NEG
NEG
RTI
INH
6
BGE
REL
3
SUB
SUB
SUB
SUB
SUB
SUB
DIR
5
2
11
DIR
5
2
21
REL
3
2
DIR
5
1
INH
4
1
INH
4
2
IX1
5
1
IX
5
1
81
2
91
2
IMM
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
31
41
51
61
71
A1
B1
C1
D1
E1
F1
BRCLR0 BCLR0
BRN
REL
3
CBEQ CBEQA CBEQX CBEQ
CBEQ
RTS
BLT
REL
3
CMP
CMP
CMP
CMP
CMP
CMP
3
DIR
5
2
DIR
5
2
22
3
DIR
5
3
IMM
5
3
IMM
6
3
IX1+
1
2
IX+
1
1
82
INH
2
2
IMM
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
02
12
32
42
52
62
72
5+ 92
A2
B2
C2
D2
E2
F2
BRSET1 BSET1
BHI
REL
3
LDHX
MUL
INH
1
DIV
INH
1
NSA
INH
5
DAA
INH
4
BGND
BGT
REL
3
SBC
SBC
SBC
SBC
SBC
SBC
3
DIR
5
2
DIR
5
2
23
3
EXT
5
1
43
1
53
1
63
1
73
1
INH
2
2
IMM
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
03
13
33
83
11 93
A3
B3
C3
D3
E3
F3
BRCLR1 BCLR1
BLS
REL
3
COM
COMA
COMX
COM
COM
SWI
INH
1
BLE
REL
2
CPX
CPX
CPX
CPX
CPX
CPX
3
DIR
5
2
DIR
5
2
24
2
DIR
5
1
INH
1
INH
2
IX1
5
1
IX
4
1
84
2
94
2
IMM
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
04
14
34
44
1
54
1
64
74
A4
B4
C4
D4
E4
F4
BRSET2 BSET2
BCC
REL
3
LSR
DIR
4
LSRA
LSRX
LSR
LSR
TAP
INH
1
TXS
INH
2
AND
AND
AND
AND
AND
AND
3
DIR
5
2
DIR
5
2
25
2
35
1
INH
3
1
INH
4
2
65
IX1
3
1
75
IX
5
1
85
1
95
2
IMM
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
05
15
45
55
A5
B5
C5
D5
E5
F5
BRCLR2 BCLR2
BCS
STHX
LDHX
LDHX
CPHX
CPHX
TPA
TSX
BIT
BIT
BIT
BIT
BIT
BIT
LDA
STA
3
DIR
5
2
DIR
5
2
26
REL
3
2
DIR
5
3
IMM
1
2
DIR
1
3
IMM
5
2
DIR
4
1
86
INH
3
1
96
INH
5
2
A6
IMM
2
2
B6
DIR
3
3
C6
EXT
4
3
D6
IX2
4
2
E6
IX1
3
1
F6
IX
3
06
16
36
ROR
46
56
66
ROR
76
ROR
BRSET3 BSET3
BNE
REL
3
BEQ
REL
3
RORA
RORX
PULA
STHX
EXT
1
TAX
INH
1
LDA
IMM
2
AIS
IMM
2
LDA
DIR
3
STA
DIR
3
LDA
EXT
4
STA
EXT
4
LDA
IX2
4
STA
IX2
4
LDA
IX1
3
STA
IX1
3
3
07
DIR
5
2
17
DIR
5
2
27
2
DIR
5
1
INH
1
INH
2
IX1
5
1
IX
4
1
87
INH
2
3
97
2
A7
2
B7
3
C7
3
D7
2
E7
1
F7
IX
2
37
47
1
57
1
67
77
BRCLR3 BCLR3
ASR
ASRA
ASRX
ASR
ASR
PSHA
3
08
DIR
5
2
18
DIR
5
2
28
2
DIR
5
1
INH
1
1
INH
1
2
IX1
5
1
IX
4
1
88
INH
3
1
98
2
A8
2
B8
3
C8
3
D8
2
E8
1
F8
IX
3
38
48
58
68
78
BRSET4 BSET4
BHCC
LSL
DIR
5
LSLA
LSLX
LSL
IX1
5
LSL
PULX
CLC
INH
1
EOR
EOR
EOR
EOR
EOR
EOR
3
DIR
5
2
DIR
5
2
REL
2
39
1
INH
1
1
INH
1
2
69
1
79
IX
4
1
INH
2
1
99
2
IMM
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
09
19
29
3
49
59
89
A9
B9
C9
D9
E9
F9
BRCLR4 BCLR4
BHCS
ROL
ROLA
ROLX
ROL
ROL
PSHX
SEC
ADC
ADC
ADC
ADC
ADC
ADC
3
DIR
5
2
DIR
5
2
REL
3
2
DIR
5
1
INH
1
1
INH
1
2
IX1
5
1
IX
4
1
INH
3
1
INH
1
2
IMM
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
0A
1A
2A
3A
4A
5A
6A
7A
8A
9A
AA
BA
CA
DA
EA
FA
BRSET5 BSET5
BPL
REL
3
DEC
DECA
DECX
DEC
DEC
PULH
CLI
INH
1
ORA
ORA
ORA
ORA
ORA
ORA
3
DIR
5
2
DIR
5
2
2B
2
DIR
7
1
INH
1
INH
2
IX1
7
1
IX
6
1
INH
2
1
9B
2
IMM
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
0B
1B
3B
4B
4
5B
4
6B
7B
8B
AB
BB
CB
DB
EB
FB
BRCLR5 BCLR5
BMI
REL
3
DBNZ
DBNZA DBNZX
DBNZ
DBNZ
PSHH
SEI
INH
1
ADD
IMM
ADD
ADD
ADD
ADD
ADD
3
DIR
5
2
DIR
5
2
2C
3
DIR
5
2
INH
1
2
INH
1
3
IX1
5
2
IX
4
1
INH
1
9C
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
0C
1C
3C
4C
5C
6C
7C
8C
1
BC
CC
DC
EC
FC
BRSET6 BSET6
BMC
INC
DIR
4
INCA
INCX
INC
IX1
4
INC
CLRH
RSP
JMP
JMP
JMP
JMP
JMP
3
DIR
5
2
DIR
5
2
REL
3
2
3D
1
INH
1
1
INH
1
2
6D
1
7D
IX
3
1
INH
1
INH
1
2
DIR
5
3
EXT
6
3
IX2
6
2
IX1
5
1
IX
5
0D
1D
2D
4D
5D
9D
AD
5
BD
CD
DD
ED
FD
BRCLR6 BCLR6
BMS
TST
DIR
6
TSTA
TSTX
TST
IX1
4
TST
NOP
BSR
JSR
JSR
JSR
JSR
JSR
3
DIR
5
2
DIR
5
2
REL
3
2
3E
1
INH
5
1
INH
5
2
6E
1
7E
IX
5
1
INH
2
REL
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
IX
3
0E
1E
2E
4E
5E
8E
2+ 9E
AE
BE
CE
DE
EE
FE
BRSET7 BSET7
BIL
CPHX
MOV
MOV
MOV
MOV
STOP
Page 2
LDX
LDX
LDX
LDX
LDX
LDX
3
DIR
5
2
DIR
5
2
2F
REL
3
3
EXT
3
DD
1
2
DIX+
1
3
IMD
5
2
IX+D
4
1
INH
2
IMM
2
2
DIR
3
3
EXT
4
3
IX2
4
2
IX1
3
1
FF
IX
2
0F
1F
3F
5
4F
5F
6F
7F
1
8F
2+ 9F
1
AF
BF
STX
CF
STX
DF
STX
EF
STX
BRCLR7 BCLR7
BIH
REL
CLR
CLRA
CLRX
CLR
CLR
WAIT
TXA
AIX
STX
3
DIR
2
DIR
2
2
DIR
1
INH
1
INH
2
IX1
IX
1
INH
1
INH
2
IMM
2
DIR
3
EXT
3
IX2
2
IX1
1
IX
INH
IMM
DIR
EXT
DD
Inherent
REL
IX
IX1
IX2
IMD
Relative
SP1
SP2
IX+
Stack Pointer, 8-Bit Offset
Stack Pointer, 16-Bit Offset
Indexed, No Offset with
Post Increment
Indexed, 1-Byte Offset with
Post Increment
Immediate
Direct
Indexed, No Offset
Indexed, 8-Bit Offset
Indexed, 16-Bit Offset
IMM to DIR
Extended
DIR to DIR
IX+D IX+ to DIR
IX1+
DIX+ DIR to IX+
Opcode in
F0
3
HCS08 Cycles
Instruction Mnemonic
Addressing Mode
Hexadecimal
SUB
Number of Bytes
1
IX
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
121
Chapter 8 Central Processor Unit (S08CPUV2)
Table 8-3. Opcode Map (Sheet 2 of 2)
Bit-Manipulation
Branch
Read-Modify-Write
9E60
Control
Register/Memory
6
9ED0
SUB
5
9EE0
4
NEG
SUB
3
SP1
6
4
SP2
5
3
SP1
4
9E61
9ED1
9EE1
CBEQ
CMP
CMP
4
SP1
4
SP2
5
3
SP1
4
9ED2
9EE2
SBC
SBC
4
SP2
5
3
SP1
4
9E63
6
9ED3
9EE3
9EF3
6
COM
CPX
CPX
CPHX
3
SP1
6
4
SP2
5
3
SP1
4
3
SP1
9E64
9ED4
9EE4
LSR
SP1
AND
AND
3
4
SP2
5
3
SP1
4
9ED5
9EE5
BIT
BIT
4
SP2
5
3
SP1
4
9E66
6
9ED6
9EE6
ROR
LDA
LDA
3
SP1
6
4
SP2
5
3
SP1
4
9E67
9ED7
9EE7
ASR
STA
STA
3
SP1
6
4
SP2
5
3
SP1
4
9E68
9ED8
9EE8
LSL
EOR
EOR
3
SP1
6
4
SP2
5
3
SP1
4
9E69
9ED9
9EE9
ROL
ADC
ADC
3
SP1
6
4
SP2
5
3
SP1
4
9E6A
9EDA
9EEA
DEC
ORA
ORA
3
SP1
8
4
SP2
5
3
SP1
4
9E6B
9EDB
9EEB
DBNZ
ADD
SP2
ADD
SP1
4
SP1
4
3
9E6C
6
INC
3
SP1
5
9E6D
TST
SP1
3
9EAE
5
6
5
5
4
5
LDHX
2
IX
IX2
IX1
SP1
5
9E6F
6
CLR
STX
SP2
STX
SP1
STHX
3
SP1
4
3
3
SP1
INH
Inherent
Immediate
Direct
REL
IX
IX1
IX2
IMD
Relative
SP1
SP2
IX+
Stack Pointer, 8-Bit Offset
Stack Pointer, 16-Bit Offset
Indexed, No Offset with
Post Increment
Indexed, 1-Byte Offset with
Post Increment
IMM
DIR
EXT
DD
Indexed, No Offset
Indexed, 8-Bit Offset
Indexed, 16-Bit Offset
IMM to DIR
Extended
DIR to DIR
IX1+
IX+D IX+ to DIR
DIX+ DIR to IX+
Note: All Sheet 2 Opcodes are Preceded by the Page 2 Prebyte (9E)
Prebyte (9E) and Opcode in
Hexadecimal
9E60
3
6
HCS08 Cycles
Instruction Mnemonic
Addressing Mode
NEG
Number of Bytes
SP1
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
122
Freescale Semiconductor
Chapter 9
Liquid Crystal Display Driver (S08LCDV1)
9.1
Introduction
The LCD driver module is a CMOS charge pump voltage inverter that is designed for low-voltage,
low-power operation. The LCD driver module is designed to generate the appropriate waveforms to drive
multiplexed numeric, alpha-numeric, or custom LCD panels. Depending on LCD module hardware and
software configuration, the LCD panels can be either 3 Vor 5 V and be driven by different waveform
modes. The LCD module also has several timing and control settings that can be software configured
depending on the applications requirements. Timing and control consists of registers and control logic for:
•
•
•
•
•
LCD frame frequency
Duty cycle select
Frontplane/backplane select and enable
Blink modes and frequency
Operation in low-power modes
In a 64-pin package, the LCD module can be configured to drive 4 backplanes/32 frontplanes (128
segments) or 3 backplanes/33 frontplanes (99 segments). In a 80-pin package, the LCD module can be
configured to drive a maximum of 4 backplanes/40 frontplanes (160 segments) or 3 backplanes/41
frontplanes (123 segments). These configurations are summarized in Table 9-1.
Table 9-1. Configuration Options by Package Type
Package Type
No. of Backplanes
No. of Frontplanes
No. of Segments
4
3
4
3
32
33
40
41
128
99
64-pin
160
123
80-pin
Figure 9-1 shows the MC9S08LC60 Series block diagram with the LCD highlighted.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
123
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
HCS08 CORE
ON-CHIP ICE
DEBUG MODULE (DBG)
CPU
INT
ADP[7:4]
ADP3
4
PTA[7:4]/KBI1P[7:4]/ADP[7:4]
12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
ADP2
BKGD
BKP
ADP1
ADP0
HCS08 SYSTEM CONTROL
ACMP–
ACMP+
ANALOG COMPARATOR
PTA3/KBI1P3/ADP3/ACMP–
PTA2/KBI1P2/ADP2/ACMP+
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
(ACMP)
8-BIT KEYBOARD
8
PTA[1:0]/KBI1P[1:0]/ADP[1:0]
INTERRUPT (KBI1)
RTI
COP
LVD
IRQ
SS1
PTB7/KBI2P4/SS1
PTB6/KBI2P3/SPSCK1
SPSCK1
MISO1
SERIAL PERIPHERAL
INTERFACE (SPI1)
USER FLASH A
MOSI1
(LC60 = 32,768 BYTES)
(LC36 = 24,576 BYTES)
SCL
SDA
PTB5/MOSI1/SCL
PTB4/MISO1/SDA
IIC MODULE (IIC)
USER FLASH B
PTB3/KBI2P2
PTB2/RESET
RESET
(LC60 = 28,464 BYTES)
(LC36 = 12,288 BYTES)
5
3
8-BIT KEYBOARD
INTERRUPT (KBI2)
XTAL
EXTAL
USER RAM
PTB1/KBI2P1/XTAL
PTB0/KBI2P0/EXTAL
(LC60 = 4096 BYTES)
(LC36 = 2560 BYTES)
IRQ
PTC7/KBI2P7/IRQ/TPMCLK
PTC6/BKGD/MS
INTERNAL CLOCK
GENERATOR (ICG)
TPM2CH1
TPM2CH0
2-CHANNEL TIMER/PWM
PTC5/KBI2P6/TPM2CH1
PTC4/KBI2P5/TPM2CH0
(TPM2)
TPMCLK
TPM1CH0
TPM1CH1
LOW-POWER OSCILLATOR
2-CHANNEL TIMER/PWM
(TPM1)
V
LCD
SS2
V
LL1
PTC3/SS2/TPM1CH1
SPSCK2
MOSI2
MISO2
V
SERIAL PERIPHERAL
LL2
PTC2/SPSCK2/TPM1CH0
LIQUID CRYSTAL
DISPLAY DRIVER
LCD
INTERFACE (SPI2)
V
LL3
V
V
CAP1
CAP2
TxD
RxD
PTC1/MOSI2/TxD
PTC0/MISO2/RxD
SERIAL COMMUNICATIONS
INTERFACE (SCI)
BP[2:0]
BP3/FP40
FP[39:0]
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pulldown device if IRQ enabled
(IRQPE = 1).
V
DD
VOLTAGE
3. IRQ does not have a clamp diode to VDD. IRQ should not be driven above VDD.
4. Pin contains integrated pullup device.
V
REGULATOR
SS
5. Input-only RESET is shared with output-only PTB2. Default function after reset is
RESET.
6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is
output-only PTC7.
VREFH
VREFL
7. PTC6/BKGD/MS is an output only pin
8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP.
9. ACMPO is not available.
VDDAD
VSSAD
Figure 9-1. MC9S08LC60 Series Block Diagram Highlighting LCD Block and Pins
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
124
Freescale Semiconductor
Chapter 9 Liquid Crystal Display (S08LCDV1)
9.1.1
Features
The LCD module driver module features include:
•
•
•
Low-power LCD waveform mode
LCD waveforms functional in wait and stop3 low-power modes
Selectable frontplane/backplane configuration
— Up to 41 frontplanes
— Up to 4 backplanes
•
•
Programmable LCD frame frequency
Programmable blink modes and frequency
— Independent blink control for each LCD segment
— Blink function remains active in stop3 mode
•
•
Programmable LCD power supply switch making it an ideal solution for battery powered and
board level applications
— Requires only four external capacitors
— Internal LCD power using V (1.8 to 3.6 V)
DD
— External V
power supply option (0.9 to 1.8 V)
LCD
Integrated charge pump for LCD
— Hardware configurable to drive 3-V or 5-V LCD panels
— On-chip generation of bias voltages, adjustable charge pump frequency
Dedicated LCD RAM
•
•
•
LCD frame frequency interrupt event
Internal ADC channels are connected to V
and V
to monitor their magnitudes.This feature
LCD
LL1
makes it possible to adjust the contrast by software.
•
Low-power, low-voltage CMOS technology
9.1.2
Modes of Operation
The LCD module supports the following operation modes:
Table 9-2. Modes of Operation
Operation
Mode
Stop1
Stop2
all LCD operation is suspended. It is recommended to blank the display before entering stop1
all LCD operation is suspended. It is recommended to blank the display before entering stop2.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
125
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
Table 9-2. Modes of Operation (continued)
Mode
Operation
Stop3
Depending on the state of the LCDSTP3 bit, the LCD module can operate an LCD panel in stop3 mode.
If LCDSTP3 = 1, LCD module clock generation is turned off and the LCD module enters a power
conservation state.If LCDSTP3 = 0, the LCD module can operate an LCD panel in stop3, and the LCD
module continues to display the current LCD panel contents base on the LCDRAM registers.
If the LCD is enabled in stop3, the ICGERCLK must be selected as the clock source since the bus clock
is not available in stop3.
Wait
Depending on the configuration, the LCD module can operate an LCD panel in wait mode. If LCDWAI = 1,
the LCD module clock generation is turned off and the LCD module enters a power conservation state.If
LCDWAI = 0, the LCD module can operate an LCD panel in wait, and the LCD module continues to
display the current LCD panel contents base on the LCDRAM registers.
Blinking functionality remains active in wait or stop3 mode. If the MCU is in wait or stop3, the LCDRAM
registers cannot be changed. Stop3 provides the lowest power consumption state where the LCD module
is functional.
9.1.3
Block Diagram
Figure 9-2 is a block diagram of the LCD module.
LCD DIGITAL
LCD RAM
lcd_regs
LCD
FP/BP DRIVER
lcd_ipbus_interface
IP
BUS
lcd_vgen
lcd_control
BASE
CLOCK
lcd_clkgen
CONTROL
CLOCK INPUT
V
V
V
LL1
LL2
LL3
LCD CHARGE PUMP
Figure 9-2. LCD Driver Block Diagram
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
126
Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.2
External Signal Description
The LCD module has several external pins dedicated to power supply and also LCD frontplane/backplane
signaling. Table 9-3 itemizes all the LCD external pins. See the Pins and Connections chapter for
device-specific pin configurations.
Table 9-3. Signal Properties
Name
3 backplanes
Port
Function
Reset State
BP[2:0], Backplane waveform signals that connect directly to the pads High impedance
FP[39:0] Frontplane waveform signals that connect directly to the pads High impedance
40 frontplanes
Frontplane/backplane
BP3/FP40 Switchable frontplane/backplane signal that connects directly High impedance
to the pads
LCD voltage
VLCD
LCD supply voltage
LCD bias voltages
—
—
LCD bias voltages
VLL1
,
,
VLL2
VLL3
LCD charge pump capacitance
Vcap1
,
Charge pump capacitor pins
—
Vcap2
9.2.1
BP[2:0]
This output signal vector represents the analog backplane waveforms of the LCD module. These signals
are connected to the back plane of the LCD panel.
9.2.2
FP[39:0]
This output signal vector represents the analog frontplane waveforms of the LCD module. These signals
are connected to the front plane of the LCD panel.
9.2.3
BP3/FP40
This signal vector represents either an analog frontplane or backplane waveform of the LCD module
depending on the configuration of the DUTY[1:0] bit field.
9.2.4
VLCD
V
is the positive supply voltage for the LCD module waveform generation. V
can internally derive
LCD
LCD
from V or externally derive from voltage source range from 0.9 to 1.8 Volts. V
is connected to a
DD
LCD
switch capacitor charge pump DC/DC converter (voltage doubler and voltage tripler) which is able to
generate double or triple V in order to support either 3-V or 5-V LCD glass. V is also connected
LCD
LCD
internally to an internal ADC channel in order to monitor the V
magnitude.
LCD
9.2.5
VLL1, VLL2, VLL3
V
, V , and V
are bias voltages for the LCD module driver waveforms. Internally generated using
LL3
LL1 LL2
the internal charge pump when it is enabled.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
127
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.2.6
Vcap1, Vcap2
The charge pump capacitor is used to transfer charge from the input supply to the regulated output. It is
recommended that a low equivalent series resistance (ESR) capacitor be used. Proper orientation is
imperative when using a polarized capacitor.
9.3
Register Definition
This section consists of register descriptions. Each description includes a standard register diagram.
Details of register bit and field function follow the register diagrams, in bit order.
9.3.1
LCD Control Register 0 (LCDCR0)
7
6
5
4
3
2
1
0
R
0
LCDEN
LPWAVE
LCLK2
LCLK1
LCLK0
DUTY1
DUTY0
W
Reset
0
1
0
0
0
0
1
1
= Unimplemented or Reserved
Figure 9-3. LCD Control Register 0 (LCDCR0)
Read: anytime
Write: LCDEN anytime. To avoid segment flicker the clock prescaler bits (LCLK[2:0]) and the duty select
bits (DUTY[1:0]) must not be changed when the LCD module is enabled.
Table 9-4. LCDCR0 Field Descriptions
Field
Description
7
LCD Driver Enable — The LCDEN bit starts the LCD module waveform generator.
LCDEN
0
All frontplane and backplane pins are disabled. In addition, the LCD module system is disabled and all LCD
waveform generation clocks are stopped.
1
LCD module driver system is enabled. All frontplanes pins enabled using the frontplane enable register will
output an LCD module driver waveform.The backplane pins will output an LCD module driver waveform
based on the settings of DUTY0 and DUTY1.
6
LCD Waveform — The LPWAVE bit allows selection of two types of LCD waveforms.
LPWAVE
0
1
Normal waveforms selected.
Low-power waveforms selected.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
128
Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
Table 9-4. LCDCR0 Field Descriptions (continued)
Field
Description
5:3
LCD Clock Prescaler — The LCD module clock prescaler bits are used as a clock divider to generate the LCD
LCLK[2:0] waveform base clock as shown in Equation 9-1. The waveform base clock is used, with the LCD module duty
cycle configuration to determine the LCD module frame frequency.LCD module frame frequency calculations are
provided in 9.4.1.3/p.139.
Eqn. 9-1
LCDCLK
=
LCD Waveform Base Clock
16 x 2 LCLK[2:0]
where LCDCLK ≅ 32.768 kHz
1:0
LCD Duty Select — DUTY[1:0] bits select the duty cycle of the LCD module driver.
DUTY[1:0] 00 Reserved.
01 Use BP[1:0] (1/2 duty cycle). This mode forces the multiplexed BP3/FP40 pin to be configured as FP40
10 Use BP[2:0] (1/3 duty cycle). This mode forces the multiplexed BP3/FP40 pin to be configured as FP40
11 Use BP[3:0] (1/4 duty cycle). This mode forces the multiplexed BP3/FP40 pin to be configured as BP3
(default)
9.3.2
LCD Control Register 1 (LCDCR1)
7
6
5
4
3
2
1
0
R
0
0
0
0
0
LCDIEN
LCDWAI
LCDSTP3
W
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 9-4. LCD Control Register 1 (LCDCR1)
Read: anytime
Table 9-5. LCDCR1 Field Descriptions
Description
Field
7
LCD Module Frame Frequency Interrupt Enable — Enables an LCD interrupt.event that coincides with the
LCD module frame frequency (LPWAVE=0) or sub-frame frequency (LPWAVE=1).
0 The start of the LCD module frame causes a LCD module interrupt request.
1 No Interrupt request is generated by this event.
LCDIEN
1
LCD Module Driver and Charge Pump Stop While in Wait Mode
LCDWAI
0 Allows the LCD driver and charge pump to continue running during wait mode.
1 Disables the LCD driver and charge pump whenever the MCU goes into wait mode.
0
LCD Module Driver and Charge Pump Stop While in Stop3 Mode
LCDSTP3 0 Allows the LCD module driver and charge pump to continue running during stop3.
1 Disables the LCD module driver and charge pump whenever the MCU goes into stop3.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
129
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.3.3
LCD Frontplane Enable Registers 0–5 (FPENR0–FPENR5)
When LCDEN = 1, these bits enable the frontplane output waveform on the corresponding frontplane pin.
7
FP7EN
0
6
FP6EN
0
5
FP5EN
0
4
FP4EN
0
3
FP3EN
0
2
FP2EN
0
1
FP1EN
0
0
R
W
FPENR0
FPENR1
FPENR2
FPENR3
FPENR4
FPENR5
FP0EN
Reset
R
0
FP15EN
0
FP14EN
0
FP13EN
0
FP12EN
0
FP11EN
0
FP10EN
0
FP9EN
0
FP8EN
W
Reset
R
0
FP23EN
0
FP22EN
0
FP21EN
0
FP20EN
0
FP19EN
0
FP18EN
0
FP17EN
0
FP16EN
W
Reset
R
0
FP31EN
0
FP30EN
0
FP29EN
0
FP28EN
0
FP27EN
0
FP26EN
0
FP25EN
0
FP24EN
W
Reset
R
0
FP39EN
FP38EN
FP37EN
FP36EN
FP35EN
FP34EN
FP33EN
FP32EN
W
Reset
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
FP40EN
0
W
Reset
0
0
0
0
0
0
0
Unimplemented or Reserved
Read: anytime
Write: anytime
Table 9-6. FPENR0–FPENR5 Field Descriptions
Description
Field
40:0
Frontplane Output Enable — The FP[40:0]EN bit enables the frontplane driver outputs. If LCDEN = 0, these
FP[40:0]EN bits have no effect on the state of the I/O pins.It is recommended to set FP[40:0]EN bits before LCDEN is set.
0 Frontplane driver output disabled on FPnn.
1 Frontplane driver output enabled on FPnn.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
130
Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.3.4
LCDRAM Registers (LCDRAM)
The LCDRAM registers control the on/off state for frontplane drivers or the blink enables/disables for each
individual LCD segment depending on the state of the LCDDRMS bit in the LCDCMD register. After reset
the LCDRAM contents will be indeterminate (I), as indicated by Figure 9-5.
7
6
5
4
3
2
1
0
R
W
FP1BP3
FP1BP2
FP1BP1
FP1BP0
FP0BP3
FP0BP2
FP0BP1
FP0BP0
Reset
R
I
I
I
I
I
I
I
I
FP3BP3
FP3BP2
FP3BP1
FP3BP0
FP2BP3
FP2BP2
FP2BP1
FP2BP0
W
Reset
R
I
I
I
I
I
I
I
I
FP5BP3
FP5BP2
FP5BP1
FP5BP0
FP4BP3
FP4BP2
FP4BP1
FP4BP0
W
Reset
R
I
I
I
I
I
I
I
I
FP7BP3
FP7BP2
FP7BP1
FP7BP0
FP6BP3
FP6BP2
FP6BP1
FP6BP0
W
Reset
R
I
I
I
I
I
I
I
I
FP9BP3
FP9BP2
FP9BP1
FP9BP0
FP8BP3
FP8BP2
FP8BP1
FP8BP0
W
Reset
R
I
I
I
I
I
I
I
I
FP11BP3
FP11BP2
FP11BP1
FP11BP0
FP10BP3
FP10BP2
FP10BP1
FP10BP0
W
Reset
R
I
I
I
I
I
I
I
I
FP13BP3
FP13BP2
FP13BP1
FP13BP0
FP12BP3
FP12BP2
FP12BP1
FP12BP0
W
Reset
R
I
I
I
I
I
I
I
I
FP15BP3
FP15BP2
FP15BP1
FP15BP0
FP14BP3
FP14BP2
FP14BP1
FP14BP0
W
Reset
R
I
I
I
I
I
I
I
I
FP17BP3
FP17BP2
FP17BP1
FP17BP0
FP16BP3
FP16BP2
FP16BP1
FP16BP0
W
Reset
R
I
I
I
I
I
I
I
I
FP19BP3
FP19BP2
FP19BP1
FP19BP0
FP18BP3
FP18BP2
FP18BP1
FP18BP0
W
Reset
R
I
I
I
I
I
I
I
I
FP21BP3
I
FP21BP2
I
FP21BP1
I
FP21BP0
I
FP20BP3
I
FP20BP2
I
FP20BP1
I
FP20BP0
I
W
Reset
I = Value is indeterminate
Figure 9-5. LCD Data Registers (LCDRAM)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
131
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
R
FP23BP3
FP23BP2
FP23BP1
FP23BP0
FP22BP3
FP22BP2
FP22BP1
FP22BP0
W
Reset
R
I
I
I
I
I
I
I
I
FP25BP3
FP25BP2
FP25BP1
FP25BP0
FP24BP3
FP24BP2
FP24BP1
FP24BP0
W
Reset
R
I
I
I
I
I
I
I
I
FP27BP3
FP27BP2
FP27BP1
FP27BP0
FP26BP3
FP26BP2
FP26BP1
FP26BP0
W
Reset
R
I
I
I
I
I
I
I
I
FP29BP3
FP29BP2
FP29BP1
FP29BP0
FP28BP3
FP28BP2
FP28BP1
FP28BP0
W
Reset
R
I
I
I
I
I
I
I
I
FP31BP3
FP31BP2
FP31BP1
FP31BP0
FP30BP3
FP30BP2
FP30BP1
FP30BP0
W
Reset
R
I
I
I
I
I
I
I
I
FP33BP3
FP33BP2
FP33BP1
FP33BP0
FP32BP3
FP32BP2
FP32BP1
FP32BP0
W
Reset
R
I
I
I
I
I
I
I
I
FP35BP3
FP35BP2
FP35BP1
FP35BP0
FP34BP3
FP34BP2
FP34BP1
FP34BP0
W
Reset
R
I
I
I
I
I
I
I
I
FP37BP3
I
FP37BP2
I
FP37BP1
I
FP37BP0
I
FP36BP3
FP36BP2
FP36BP1
FP36BP0
W
Reset
R
I
I
I
I
FP39BP3
FP39BP2
FP39BP1
FP39BP0
FP38BP3
FP38BP2
FP38BP1
FP38BP0
W
Reset
R
I
I
I
I
I
I
I
I
0
0
0
0
FP40BP3
I
FP40BP2
I
FP40BP1
I
FP40BP0
I
W
Reset
I
I
I
I
I = Value is indeterminate
Figure 9-5. LCD Data Registers (LCDRAM) (continued)
Read: anytime
Write: anytime
The LCDRAM registers provide access to two different register groups. Access to each register group is
controlled by the state of the LCDDRMS bit in the LCDCMD register. Each LCDRAM register location
provides the waveforms for up to two frontplane drivers.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
132
Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.3.4.1
LCDRAM Registers as On/Off Selector (LCDDRMS = 0)
If LCDDRMS bit in the LCDCMD register is deasserted, the LCDRAM register accesses a register bank
that controls the on/off state for frontplane drivers.
Table 9-7. LCDRAM Field Descriptions (when LCDDRMS = 0)
Field
Description
FP[n]BP[x] Segment On — If LCDDRMS in the LCDCMD is deasserted (LCDDRMS=0), the FP[n]BP[x] bit in the LCDRAM
registers controls on/off state for the LCD segment connected between FP[n] and BP[x].Asserting the FP[n]BP[x]
bit displays (turns on) the LCD segment connected between FP[n] and BP[x].
0 LCD segment off.
1 LCD segment on.
9.3.4.2
LCDRAM Registers as Blink Enable/Disable (LCDDRMS = 1)
If LCDDRMS in the LCDCMD register is asserted, the LCDRAM register accesses a register bank that
controls the blink enables/disables for each individual LCD segment.
Table 9-8. LCDRAM Field Descriptions (when LCCDRMS = 1)
Field
Description
FP[n]BP[x] LCD Segment Blink Enable — If LCDDRMS bit in the LCDCMD is asserted (LCDDRMS=1), the FP[n]BP[x] bit
in the LCDRAM registers controls blink mode enable/disable state for the LCD segment connected between
FP[n] and BP[x].Asserting the FP[n]BP[x] bit enable the blink mode for the LCD segment connected between
FP[n] and BP[x] if the associated bit when LCDDRMS = 0 is also set.
0 Disables blink enable for LCD segment.
1 Enables blink enable for LCD segment.
9.3.5
LCD Clock Source Register (LCDCLKS)
7
6
5
4
3
2
1
0
R
SOURCE
DIV16
CLKADJ5
CLKADJ4
CLKADJ3
CLKADJ2
CLKADJ1
CLKADJ0
W
Reset
0
0
0
0
0
1
0
1
Figure 9-6. LCD Clock Source Register (LCDCLKS)
Read: anytime
Write: anytime.It is recommended that CLKADJ[5:0], DIV16, and SOURCE not be modified while the
LCDEN bit is asserted.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
133
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
Table 9-9. LCDCLKS Field Descriptions
Field
Description
7
LCD Clock Source Select — The LCD module has two possible clock sources. This bit is used to select which
SOURCE clock source is the basis for LCDCLK.
0 Selects the ICGERCLK (external clock reference) as the LCD clock source.
1 Selects the ICGOUT/2 (bus clock) as the LCD clock source.
6
LCD Clock Prescaler Enable— Enable prescaler by 16.
0 LCD clock prescaler is disabled.
DIV16
1 LCD clock prescaler is enabled.
5:0
LCD Clock Source Divider— The LCD module is designed to operate using a 32.768 kHz clock source for
CLKADJ[5:0 reduced power consumption (LCDCLK = 32.768 kHz). This bit field is used as a clock divider to adjust the LCD
]
clock source to be approximately 32.768 kHz.
LCDCLK = LCD clock source / (16DIV16 × (CLKADJ[5:0] +1) )
Eqn. 9-2
9.3.6
LCD Voltage Supply Register (LCDSUPPLY)
7
6
5
4
3
2
1
0
R
LCDCPEN
LCDCPMS
CPCADJ1
CPCADJ0
HDRVBUF
BBYPASS
VSUPPLY1 VSUPPLY0
W
Reset
0
0
1
1
0
1
0
1
Unimplemented or Reserved
Figure 9-7. LCD Voltage Supply Register (LCDSUPPLY)
Read: anytime
Write: anytime. It is recommended that VSUPPLY[1:0] must not be modified while the LCDEN bit is
asserted. In addition, VSUPPLY[1:0] must be configured according to the external hardware power supply
configuration.
Table 9-10. LCDSUPPLY Field Descriptions
Field
Description
7
LCD Module Charge Pump Enable— Enables LCD module charge pump for 1/3 bias.
0 LCD charge pump is disabled. (An external bias is required.)
LCDCPEN
1 LCD charge pump is enabled. (The internal 1/3-bias is forced.)
6
LCD Module Charge Pump Mode Select— This configuration depends on whether the LCD panel operating
voltage is specified as 3 V or 5 V. LCDCPMS configures the internal charge pump to be a voltage doubler
(recommended for use with 3-V LCD glass) or a voltage tripler (recommended for use with 5-V LCD glass).
0 Selects voltage doubler.
LCDCPMS
1 Selects voltage tripler.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
134
Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
Table 9-10. LCDSUPPLY Field Descriptions (continued)
Field
Description
5:4
LCD Module Charge Pump Clock Adjust- Adjust the clock source for the charge pump
CPCADJ[1:0]
(C
PADJ[1:0] +1)
Charge Pump Clock Rate = LCDCLK / (6 × 2
)
Eqn. 9-3
00 Configures for 2728 Hz charge pump frequency (LCDCLK = 32.768khz)
01 Configures for 1364 Hz charge pump frequency (LCDCLK = 32.768khz)
10 Configures for 682 Hz charge pump frequency (LCDCLK = 32.768khz)
11 Configures for 341 Hz charge pump frequency (LCDCLK = 32.768khz)
3
High Drive Buffer Mode Select — This bit enhances the VLCD buffer drive active high buffer drive for larger
capacitance LCD glass. (See Figure 9-17 for details.)
HDRVBUF
0 Normal buffer drive. (Ideal for 2000 pF LCD glass.)
1 High buffer drive. (Ideal for 4000 pF LCD glass.)
2
Op Amp Control— Determines whether the internal LCD op amp buffer is bypassed. (See Figure 9-17 for
BBYPASS
details)
0 Buffered mode
1 Unbuffered mode
1:0
Voltage Supply Control— Configures whether the LCD module power supply is external or internal. It is
VSUPPLY[1:0] recommended that this bit field not be modified while the LCD module is enabled (e.g., LCDEN = 1). See
Figure 9-17 for more detail.
9.3.7
LCD Blink Control Register (LCDBCTL)
7
6
5
4
3
2
1
0
R
0
0
0
BLINK
BLKMODE
BRATE2
BRATE1
BRATE0
W
Reset
0
0
0
0
0
0
0
0
Unimplemented or Reserved
Figure 9-8. LCD Blink Control Register (LCDBCTL)
Read: anytime
Write: anytime. It is recommended that BRATE[1:0] and BLKMODE, must not be modified while BLINK
is asserted.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
135
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
Table 9-11. LCDBCTL Field Descriptions
Field
Description
7
Blink Command — Starts or stops LCD module blinking.The blink command takes effect at the beginning of the
BLINK
next LCD frame cycle.
0 Disables blinking.
1 Starts blinking at blinking frequency specified by LCD blink rate calculation (see Equation 9-4).
3
Blink Mode Select — Configures whether to blink either individual LCD segments or the entire LCD panel
BLKMODE depending on the state of the BLKMODE bit.BLINK must be enabled; if BLINK = 0, this bit has no effect.
0 Blink only individual LCD segments as specified by the LCDRAM register banks.
1 Blink all LCD segments regardless of contents of the LCDRAM register banks.
2:0
Blink Rate Configuration— Selects the frequency at which the LCD display blinks when the BLINK is asserted.
BRATE[2:0] Equation 9-4 shows how BRATE[2:0] bit field is used in the LCD blink rate calculation.
Equation 9-4 provides an expression for the LCD waveform base clock
Eqn. 9-4
LCD waveform base clock
LCD module blink rate =
2 (5+ BRATE[2:0])
LCD module blink rate calculations are provided in 9.4.3.2/p.150.
9.3.8
LCD Command and Status Register (LCDCMD)
7
6
5
4
3
2
1
0
R
0
0
0
0
0
LCDIF
BLANK
LCDDRMS
0
W
LCDCLR
0
Reset
0
0
0
0
0
0
Unimplemented or Reserved
Figure 9-9. LCD Command Register (LCDCMD)
Read: anytime. The LCDCLR bit always reads zero.
Write: anytime.
Table 9-12. LCDCMD Field Descriptions
Field
Description
7
LCD Interrupt Flag — LCDIF indicates that an interrupt condition has occurred. To clear the interrupt, read
LCDCMD register and then write a 1 to LCDIF.
LCDIF
0 interrupt condition has not occurred.
1 interrupt condition has occurred.
3
LCD Module Data Register Mode Select — The LCDRAM registers provide access to two different register
LCDDRMS groups. Access to each register group is controlled by the state of the LCDDRMS bit.
0 Selects the LCDRAM registers to access registers that control the on/off state for LCD segments.
1 Selects the LCDRAM registers to access registers that control the blink enable/disable state for LCD
segments.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
136
Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
Table 9-12. LCDCMD Field Descriptions
Field
Description
1
LCD Data Register Clear Command — Deasserts all accessible bits in the LCDRAM registers. To clear all LCD
segment blink enables in the LCDRAM registers, the LCDCLR bit must be asserted only while LCDDRMS = 1.To
clear the entire LCD display, the LCDCLR bit must be asserted only while LCDDRMS = 0.
0 Contents of LCD data register are not deasserted by hardware.
LCDCLR
1 Deasserts all accessible bits in the LCDRAM registers. The LCDDLR bit clears after all accessible bits in the
LCDRAM registers are set to 0.
0
LCD Display Blank Command — Asserting this bit clears all segments in the LCD display regardless of the
contents of the LCDRAM registers or the state of the LCDDRMS bit. BLANK does not disable the LCD timing
generator.
BLANK
0 LCD segments are displayed or cleared depending on the contents of the LCDRAM registers when the
LCDDRMS bit is clear.
1 LCD segments are cleared regardless of the contents of the LCDRAM registers or the state of the LCDDRMS
bit. The content of the LCDRAM registers is unchanged by the BLANK bit.
9.4
Functional Description
This section provides a complete functional description of the LCD block, detailing the operation of the
design from the end-user perspective.
Before enabling the LCD module by asserting the LCDEN bit in the LCDCR0 register, it is recommended
that the LCD module be configured based on the end application requirements. Out of reset, the LCD
module is configured with default settings, but these settings are not optimal for every application. The
LCD module provides several versatile configuration settings and options to support varied
implementation requirements including:
•
•
•
•
Frame frequency
Duty cycle
Frame frequency interrupt enable
Blinking frequency and options
The LCD module also provides a frontplane enable control. Setting the frontplane enable bit, FP[n]EN, for
a particular pin enables the LCD module functionality of that pin when the LCDEN bit is set. When both
the LCDEN and required FP[n]EN bits are set, the LCDRAM can then be used to activate (display) the
corresponding LCD segments on an LCD panel.
The LCDRAM registers control the on/off state for the FP and BP segments of the LCD when the
LCDDRMS bit in the LCDCMD is cleared.If LCDDRMS = 0 when a 1 is written to the FP[n]BP[x] bit,
the corresponding connected segment turns on.When a 0 is written, the segment is turned off. For a detailed
description of LCD module operation for a basic seven-segment LCD display, see Section 9.6.1, “LCD
Seven Segment Example Description”.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
137
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.4.1
LCD Driver Description
The LCD module driver has three modes of operation:
•
•
•
1/2 duty (2 backplanes), 1/3 bias (4 voltage levels)
1/3 duty (3 backplanes), 1/3 bias (4 voltage levels)
1/4 duty (4 backplanes), 1/3 bias (4 voltage levels)
Note all modes are 1/3 bias. These modes of operation are described in more detail in the following
sections.
9.4.1.1
LCD Duty Cycle
The duty cycle indicates the number of LCD panel segments capable of being driven by each individual
frontplane output driver. Depending on the duty cycle, the LCD waveform drive can be categorized as
either static or multiplex.
In static driving method, the LCD is driven with two square waveforms. The static driving method is the
most basic method to drive an LCD panel, but, because each frontplace driver can drive only one LCD
segment, static driving limits the number of LCD segments that can be driven. In static mode, only one
backplane is required.
In multiplex mode, the LCD waveforms are multi-level and depend on the bias mode. Multiplex mode,
depending on the number of backplanes, can drive multiple LCD segments with a single frontplane driver.
Multiplex mode is effective in reducing the number of driver circuits and the number of connections to
LCD segments. For multiplex mode operation, at least two backplane drivers are needed. The LCD module
is optimized for multiplex mode.
The duty cycle indicates the amount of time the LCD panel segment is energized during each LCD module
frame cycle. The denominator of the duty cycle indicates the number of backplanes that are being used to
drive an LCD panel. Therefore, the available duty cycle options for the LCD module are 1/2, 1/3, and 1/4.
The duty cycle is configured using the DUTY[1:0] bit field in the LCDCR0 register as shown in
Table 9-13.
Table 9-13. LCD Module Duty Cycle Modes
LCDCR0 Register
Backplanes
Duty
DUTY1
DUTY0
BP3
BP2
BP1
BP0
1/2
1/3
0
1
1
0
1
0
1
0
OFF
OFF
BP3
N/A
OFF
BP2
BP2
N/A
BP1
BP1
BP1
N/A
BP0
BP0
BP0
N/A
1/4
Reserved
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
138
Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.4.1.2
LCD Bias
Because a single frontplane driver is configured to drive more and more individual LCD segments, more
voltage levels are required to generate the appropriate waveforms to drive the segment. The LCD module
is designed to operate using the 1/3 bias mode.
Defined by Equation 9-5, the bias indicates the number of voltage levels used to power the LCD display.
1 / (voltage level – 1)
Eqn. 9-5
9.4.1.3
LCD Module Waveform Base Clock and Frame Frequency
The LCD module is designed to operate using a 32.768-kHz clock input. Two possible clock sources are
available to the LCD module has which are selectable by configuration of the SOURCE bit in the
LCDCLKS register. The two clock sources include:
•
•
External crystal (SOURCE = 0)
Internal ICG (SOURCE = 1)
Figure 9-10 shows the LCD clock tree. The clock tree shows the two possible clock sources and shows the
LCD frame frequency and blink frequency clock source. The LCD blink frequency is discussed in
Section 9.4.3.2, “Blink Frequency.”
DIV16
SOURCE
BRATE[2:0]
CLKADJ[5:0]
LCLK[2:0]
LCDCLK
÷16
Internal Clock
External Clock = 32.768 kHz
LCLK[2:0]
5+BRATE[2:0]
÷(1+CLKADJ[5:0])
÷8
÷(2
)
÷(2
)
(1+CPCADJ[1:0])
÷2
÷2
÷2
÷6
Blink Rate
Source
LCD Charge Pump Clock
Source
CPCADJ[1:0] LCD Base Frequency
Source
Figure 9-10. LCD Clock Tree
Because the clock sources may not be approximately 32.768 kHz, the DIV16 bit and CLKADJ[5:0] bit
field are provided as a clock divider mechanism that can be used to make LCD module clock source
adjustments in order to achieve the required 32.768-kHz LCD module clock input, LCDCLK. Table 9-14
provides calculations of LCDCLK using different values of DIV16 and CLKADJ[5:0] for a range of clock
inputs frequencies. Using an external 32.768-kHz clock input is required for reduced power consumption
applications.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
139
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
Table 9-14. LCDCLK Calculations (only bold/unshaded values are valid)
Selected Clock Frequencies in kHz
(NOTE: DIV16 = 0)
Selected Clock Frequencies in kHz
(NOTE: DIV16 = 1)
CLKADJ[5:0]
+ 1
32.8
100
200
300
400
500
2000
4000
9980
16000 18886 20000
1
32.8
16.4
10.9
8.2
6.6
5.5
4.7
4.1
3.6
3.3
3.0
2.7
2.5
2.3
2.2
2.0
1.9
1.8
1.7
1.6
1.6
1.5
1.4
1.4
1.3
1.3
1.2
1.2
1.1
1.1
1.1
1.0
1.0
1.0
0.9
0.9
0.9
0.9
0.8
0.8
0.8
0.8
100.0
50.0
33.3
25.0
20.0
16.7
14.3
12.5
11.1
10.0
9.1
200.0
100.0
66.7
50.0
40.0
33.3
28.6
25.0
22.2
20.0
18.2
16.7
15.4
14.3
13.3
12.5
11.8
11.1
10.5
10.0
9.5
300.0
150.0
100.0
75.0
60.0
50.0
42.9
37.5
33.3
30.0
27.3
25.0
23.1
21.4
20.0
18.8
17.6
16.7
15.8
15.0
14.3
13.6
13.0
12.5
12.0
11.5
11.1
10.7
10.3
10.0
9.7
400.0
200.0
133.3
100.0
80.0
66.7
57.1
50.0
44.4
40.0
36.4
33.3
30.8
28.6
26.7
25.0
23.5
22.2
21.1
20.0
19.0
18.2
17.4
16.7
16.0
15.4
14.8
14.3
13.8
13.3
12.9
12.5
12.1
11.8
11.4
11.1
10.8
10.5
10.3
10.0
9.8
500.0
250.0
166.7
125.0
100.0
83.3
71.4
62.5
55.6
50.0
45.5
41.7
38.5
35.7
33.3
31.3
29.4
27.8
26.3
25.0
23.8
22.7
21.7
20.8
20.0
19.2
18.5
17.9
17.2
16.7
16.1
15.6
15.2
14.7
14.3
13.9
13.5
13.2
12.8
12.5
12.2
11.9
62.5
62.5
41.7
31.3
25.0
20.8
17.9
15.6
13.9
12.5
11.4
10.4
9.6
250.0
125.0
83.3
62.5
50.0
41.7
35.7
31.3
27.8
25.0
22.7
20.8
19.2
17.9
16.7
15.6
14.7
13.9
13.2
12.5
11.9
11.4
10.9
10.4
10.0
9.6
624
312
1000
500
1180
590
1250
625
2
3
207.9
155.9
124.8
104.0
89.1
78.0
69.3
62.4
56.7
52.0
48.0
44.6
41.6
39.0
36.7
34.7
32.8
31.2
29.7
28.4
27.1
26.0
25.0
24.0
23.1
22.3
21.5
20.8
20.1
19.5
18.9
18.3
17.8
17.3
16.9
16.4
16.0
15.6
15.2
14.9
333.3
250.0
200.0
166.7
142.9
125.0
111.1
100.0
90.9
83.3
76.9
71.4
66.7
62.5
58.8
55.6
52.6
50.0
47.6
45.5
43.5
41.7
40.0
38.5
37.0
35.7
34.5
33.3
32.3
31.3
30.3
29.4
28.6
27.8
27.0
26.3
25.6
25.0
24.4
23.8
393.5
295.1
236.1
196.7
168.6
147.5
131.2
118.0
107.3
98.4
90.8
84.3
78.7
73.8
69.4
65.6
62.1
59.0
56.2
53.7
51.3
49.2
47.2
45.4
43.7
42.2
40.7
39.3
38.1
36.9
35.8
34.7
33.7
32.8
31.9
31.1
30.3
29.5
28.8
28.1
416.7
312.5
250.0
208.3
178.6
156.3
138.9
125.0
113.6
104.2
96.2
89.3
83.3
78.1
73.5
69.4
65.8
62.5
59.5
56.8
54.3
52.1
50.0
48.1
46.3
44.6
43.1
41.7
40.3
39.1
37.9
36.8
35.7
34.7
33.8
32.9
32.1
31.3
30.5
29.8
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
8.3
7.7
7.1
8.9
6.7
8.3
6.3
7.8
5.9
7.4
5.6
6.9
5.3
6.6
5.0
6.3
4.8
6.0
4.5
9.1
5.7
4.3
8.7
5.4
4.2
8.3
5.2
4.0
8.0
5.0
3.8
7.7
4.8
3.7
7.4
4.6
9.3
3.6
7.1
4.5
8.9
3.4
6.9
4.3
8.6
3.3
6.7
4.2
8.3
3.2
6.5
4.0
8.1
3.1
6.3
9.4
3.9
7.8
3.0
6.1
9.1
3.8
7.6
2.9
5.9
8.8
3.7
7.4
2.9
5.7
8.6
3.6
7.1
2.8
5.6
8.3
3.5
6.9
2.7
5.4
8.1
3.4
6.8
2.6
5.3
7.9
3.3
6.6
2.6
5.1
7.7
3.2
6.4
2.5
5.0
7.5
3.1
6.3
2.4
4.9
7.3
3.0
6.1
2.4
4.8
7.1
9.5
3.0
6.0
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
140
Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
The value of LCDCLK is important because it is used to generate the LCD module waveform base clock
frequency. Equation 9-1 provides an expression for the LCD module waveform base clock frequency
calculation. Equation 9-1 illustrates that the LCD module waveform base clock frequency also depends on
the LCLK[2:0] bit field.
The LCD module waveform base clock is the basis for the calculation of the LCD module frame frequency.
The LCD module frame frequency is a function of LCD module duty cycle as shown in Equation 9-6.
Table 9-15 shows LCD module frame frequency calculations considering several possible LCD module
configurations of LCLK[2:0] and DUTY[1:0]. The using LCD module frame frequency calculations a
based on LCD module clock input value approximately 32 kHz.
LCD module frame frequency = (LCD module waveform base clock) × (duty cycle)
Eqn. 9-6
The LCD module frame frequency is defined as the number of times the LCD segments are energized per
second. The LCD module frame frequency must be selected to prevent the LCD display from flickering
(LCD module frame frequency is too low) or ghosting (LCD module frame frequency is too high). To
avoid these issues a LCD module frame frequency in the range of 30 to 100 Hz is required. LCD module
frame frequency less that 30 Hz or greater that 100 Hz are out of specification and invalid. Selecting lower
values for the LCD base and frame frequency results in lower current consumption for the LCD module.
1
2
Table 9-15. LCD Module Frame Frequency Calculations ,
LCD Base
Frequency
(Hz)
LCD Clock Input Divider
LCLK[2:0]
LCD Frame Frequency (Hz)
(16 × 2LCLK[2:0]
)
0
1
2
3
4
5
6
7
16
32
2049.3
1024.7
512.3
256.2
128.1
64.0
1024
512.32
256.16
128.08
64.04
32.02
16.01
8.00
683
341.55
170.77
85.38
42.69
21.34
10.67
5.33
512.32
256.16
128.08
64.04
32.02
16.01
8.00
64
128
256
512
1024
2048
32.0
16.0
4.00
Duty Cycle
1/2/
1/3
1/4
1
2
LCD clock input ~ 32.768 kHz
Shaded table entries are out of specification and are invalid.
9.4.1.4
LCD Waveform Examples
This section shows the timing examples of the LCD output waveforms for the available modes of
operation. As shown in Table 9-16, all examples use 1/3 bias mode.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
141
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
Table 9-16. Configurations for Example LCD Waveforms
Bias Mode
DUTY[1:0]
Duty Cycle
LPWAVE bit
01
1/2
0
Example 1
Example 2
Example 3
Example 4
Example 5
Example 6
01
10
10
11
11
1/2
1/3
1/3
1/4
1/4
1
0
1
0
1
1/3
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
142
Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.4.1.4.1
Example 1: 1/2 Duty Multiplexed with 1/3 Bias Mode (Normal Waveform)
Duty=1/2: DUTY[1:0] = 01 (BP2 and BP3 are not used)
Normal Waveform selected: LPWAVE = 0
LCDRAM = XX10
1 Frame
Base_Clk
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
BP0
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
BP1
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
FPx (xx10)
+VLCD
+VLCD × 2/3
+VLCD × 1/3
BP0-FPx (OFF)
BP1-FPx (ON)
0
-VLCD × 1/3
-VLCD × 2/3
-VLCD
+VLCD
+VLCD × 2/3
+VLCD × 1/3
0
-VLCD × 1/3
-VLCD × 2/3
-VLCD
Figure 9-11. 1/2 Duty and 1/3 Bias (Normal Waveform)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
143
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.4.1.4.2
Example 2: 1/2 Duty Multiplexed with 1/3 Bias Mode (Low-power Waveform)
Duty=1/2: DUTY[1:0] = 01 (BP2 and BP3 are not used)
Low-Power Waveform selected: LPWAVE = 1
LCDRAM = XX10
1 Frame
Base_Clk
Sub_Frame
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
BP0
BP1
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
FPx (xx10)
+VLCD
+VLCD × 2/3
BP0-FPx (OFF)
+VLCD × 1/3
0
-VLCD × 1/3
-VLCD × 2/3
-VLCD
+VLCD
+VLCD × 2/3
+VLCD × 1/3
0
-VLCD × 1/3
-VLCD × 2/3
-VLCD
BP1-FPx (ON)
Figure 9-12. 1/2 Duty and 1/3 Bias (Low-power Waveform)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
144
Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.4.1.4.3
Example 3: 1/3 Duty Multiplexed with 1/3 Bias Mode (Normal Waveform)
Duty=1/3: DUTY[1:0] = 10 (BP3 are not used)
Normal Waveform selected: LPWAVE = 0
LCDRAM = X010
1 Frame
Base_Clk
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
BP0
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
BP1
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
BP2
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
FPx (x010)
+VLCD
+VLCD × 2/3
+VLCD × 1/3
0
-VLCD × 1/3
-VLCD × 2/3
-VLCD
BP0-FPx (OFF)
BP1-FPx (ON)
+VLCD
+VLCD × 2/3
+VLCD × 1/3
0
-VLCD × 1/3
-VLCD × 2/3
-VLCD
Figure 9-13. 1/3 Duty and 1/3 Bias (Normal Waveform)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
145
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.4.1.4.4
Example 4: 1/3 Duty Multiplexed with 1/3 Bias Mode (Low-power Waveform)
Duty=1/3: DUTY[1:0] = 10 (BP3 are not used)
Low-power Waveform selected: LPWAVE = 1
LCDRAM = X010
1 Frame
Base_Clk
Sub_Frame
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
BP0
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
BP1
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
BP2
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
FPx (x010)
+VLCD
+VLCD × 2/3
+VLCD × 1/3
0
-VLCD × 1/3
-VLCD × 2/3
-VLCD
BP0-FPx (OFF)
BP1-FPx (ON)
+VLCD
+VLCD × 2/3
+VLCD × 1/3
0
-VLCD × 1/3
-VLCD × 2/3
-VLCD
Figure 9-14. 1/3 Duty and 1/3 Bias (Low-power Waveform)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
146
Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.4.1.4.5
Example 5: 1/4 Duty Multiplexed with 1/3 Bias Mode (Normal Waveform)
Duty=1/4: DUTY[1:0] = 11 (All available backplanes used)
Normal Waveform selected: LPWAVE = 0
LCDRAM = 1001
1 Frame
Base_Clk
BP0
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
BP1
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
BP2
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
BP3
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
FPx (1001)
+VLCD
+VLCD × 2/3
+VLCD × 1/3
0
-VLCD × 1/3
-VLCD × 2/3
-VLCD
BP0-FPx (ON)
BP1-FPx (OFF)
+VLCD
+VLCD × 2/3
+VLCD × 1/3
0
-VLCD × 1/3
-VLCD × 2/3
-VLCD
Figure 9-15. 1/4 Duty and 1/3 Bias (Normal Waveform)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
147
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.4.1.4.6
Example 6: 1/4 Duty Multiplexed with 1/3 Bias Mode (Low-power Waveform)
Duty=1/4: DUTY[1:0] = 11 (All available backplanes used)
Low-power Waveform selected: LPWAVE = 1
LCDRAM = 1001
1 Frame
Base_Clk
Sub_Frame
BP0
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
BP1
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
BP2
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
BP3
VLCD
VLCD × 2/3
VLCD × 1/3
VSSX
FPx (1001)
+VLCD
+VLCD × 2/3
+VLCD × 1/3
0
-VLCD × 1/3
-VLCD × 2/3
-VLCD
BP0-FPx (ON)
BP1-FPx (OFF)
+VLCD
+VLCD × 2/3
+VLCD × 1/3
0
-VLCD × 1/3
-VLCD × 2/3
-VLCD
Figure 9-16. 1/4 Duty and 1/3 Bias (Low-power Waveform)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.4.2
LCDRAM Registers
For a segment on the LCD panel to be displayed, data must be written to the LCDRAM registers. Each bit
in the LCDRAM registers correspond to a segment on the LCD panel.
The LCDRAM registers provide access to two different register groups depending on the state of the
LCDDRMS bit in the LCDCMD register. If LCDDRMS = 0, the LCDRAM register accesses a register
bank that controls the on/off state for frontplane drivers. If LCDDRMS = 1, the LCDRAM register bank
accesses a register bank that enables the blink mode for each individual LCD segment.
If LCDDRMS = 0, when the LCDEN bit is set and the corresponding FP[31:0]EN bit is set, writing a 1 to
a given LCDRAM location will result in the corresponding display segment being driven with a
differential root mean square (RMS) voltage necessary to turn the segment on.Writing a 0 to a given
location will result in the corresponding display segment being driven with a differential RMS voltage
necessary to turn the segment off.
The LCDRAM is a dual port RAM that interfaces with the internal address and data buses of the MCU.
When LCDEN = 0, the LCDRAM registers can be used as on-chip RAM. Writing or reading of the
LCDEN bit does not change the contents of the LCDRAM registers.After a reset, the LCDRAM contents
will be indeterminate.
9.4.2.1
LCDRAM Data Clear Command
The LCD module data register clear command deasserts all accessible bits in the LCDRAM registers.
LCDDRMS bit in the LCDCMD register determines which LCDRAM registers bits are accessible.To
clear all LCD segment blink enables in the LCDRAM registers, the LCDCLR bit must be asserted only
when the LCDDRMS bit is asserted. To clear the entire LCD display, the LCDCLR bit must be asserted
only when the LCDDRMS bit is deasserted.
9.4.2.2
LCDRAM Data Blank Command
The LCD module display blank command clears all segments in the LCD display regardless of the contents
of the LCDRAM registers or the state of the LCDDRMS bit. This bit does not disable the LCD module
timing generator. Writing or reading of the BLANK bit does not change the contents of the LCDRAM
registers.
9.4.3
LCD Blinking
The LCD module LCD panel blink capabilities are very flexible. The LCD module can be configured to
blink either individual LCD segments or the entire LCD panel. The blink rate frequency is configured
using the BRATE[2:0] bit field.
The LCD will blink at the configured frequency while the BLINK bit in the LCDBCTL register is set to 1.
When the BLINK bit is modified to start or stop the LCD display blinking, the BLINK command change
takes place at the beginning of the next LCD frame cycle.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
149
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.4.3.1
LCD Segment Blinking
To configure all LCD segments to blink regardless of the contents of the LCDRAM bits while
LCDDRMS = 1, the BLKMODE bit in the LCDBCTL control register must to set to 1. To configure
individual LCD segments to blink, the BLKMODE bit in the LCDBCTL control register must be
deasserted.
If BLKMODE = 0, asserting the LCDRAM FP[n]BP[x] bits while LCDDRMS = 0 and LCDDRMS = 1
enables the LCD segment connected between FP[n] and BP[x] to blink when BLINK = 1. Each LCDRAM
register controls two frontplane drivers.
9.4.3.2
Blink Frequency
The LCD module waveform base clock is the basis for the calculation of the LCD module blink frequency.
The LCD module blink frequency is equal to the LCD module waveform base clock divided by the
BRATE[2:0] divider. Table 9-17 shows LCD module blink frequency calculations for all values of
BRATE[2:0] and LCLK[2:0].
Table 9-17. Blink Frequency Calculations
(Blink Rate = LCD Base (Hz) ÷ Blink Divider)
LCD Base
Frequency (Hz)
LCLK[2:0]
Blink Frequency
0
1
2
3
4
5
6
7
2049.3
1024.7
512.3
256.2
128.1
64.0
64.0
32.0
16.0
8.00
4.00
2.00
1.00
0.50
32.0
16.0
8.00
4.00
2.00
1.00
0.50
0.25
16.0
8.00
4.00
2.00
1.00
0.50
0.25
0.13
8.00
4.00
2.00
1.00
0.50
0.25
0.13
0.06
4.00
2.00
1.00
0.50
0.25
0.13
0.06
0.03
2.00
1.00
0.50
0.25
0.13
0.06
0.03
0.02
1.00
0.50
0.25
0.13
0.06
0.03
0.02
0.01
0.50
0.25
0.13
0.06
0.03
0.02
0.01
0.00
32.0
16.0
Blink Divider = 2 (5+ BRATE[2:0])
32
64
128 256 512 1024
2048
4096
1 Shaded table entries are out of specification and are not valid
9.4.4
LCD Charge Pump, Voltage Divider, and Power Supply Operation
This section describes the LCD charge pump, voltage divider, and LCD power supply configuration
options. Figure 9-17 provides a block diagram for the LCD charge pump and a V voltage divider.
LCD
The VSUPPLY[1:0] bit field in the LCDSUPPLY register is used to configure the LCD module power
supply source. VSUPPLY[1:0] indicates the state of internal signals used to configure power switches as
shown in the Table in Figure 9-17. The block diagram in Figure 9-17 illustrates several potential
operational modes for the LCD module including configuration of the LCD module power supply source
using internal V or an external supply.
DD
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
150
Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
VDD
powersw1
VLCD
powersw2
(BBYPASS & powersw3)
LCDCPMS
R1
+
–
VLL1
~(LCDCPMS)
R1
R1
(~(BBYPASS) & powersw3)
(~(LCDCPMS) & powersw3)
VOLTAGE DIVIDER
BLOCK
VSUPPLY[1:0] powersw1 powersw2 powersw3
VLL1
VLL2
VLL3
00
01
10
11
1
0
0
0
0
1
0
0
0
0
1
0
CHARGE PUMP
Figure 9-17. LCD Charge Pump and V
Voltage Divider Block Diagram
LCD
Figure 9-17 also illustrates a buffer, a voltage follower with an ideal op amp. The buffer, if enabled, gives
VIn = VOut, and, because the input impedance of the op amp is very high, VIn is isolated from VOut This
isolation can protect VIn from things like current draw from VOut; however, if the buffer is disabled
((~BBYPASS & powersw3) = 0), the output and input will be configured in a tri-state condition; that is,
floating.
NOTE:
The charge pump is optimized for 1/3 bias mode operation only.
During the first 16 timebase clock cycles after the LCDCPEN bit is set, all
the LCD frontplane and backplane outputs are disabled regardless of state
of the LCDEN bit.
The charge pump requires external capacitance for is operation. To provide
this external capacitance, the V
and V
external pins are provided. It
cap1
cap2
is recommended that a low equivalent series resistance (ESR) capacitor be
used. Proper orientation is imperative when using a polarized capacitor. The
recommended value for the external capacitor is 0.1 μF.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
151
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.4.4.1
LCD Charge Pump and Voltage Divider
The LCD charge pump is a voltage tripler. Using the voltage divider and the charge pump, the LCD module
can effectively double or triple V
This LCD module configurability makes the LCD module
LCD.
compatible with both 3-V or 5-V LCD glass.
The LCD module charge pump mode select bit (LCDCPMS) in the LCDSUPPLY register configures the
LCD module operational mode as a voltage doubler or a voltage tripler. In Figure 9-17, LCDCPMS bit
signal is used to control switches within the voltage divider block to enable or disable the two-thirds (2/3
* V
) voltage divider. If LCDCPMS = 0, the LCD module is configured as a voltage doubler
LCD
(recommended to V
be used with 3-V LCD glass) by enabling the voltage divider. If LCDCPMS = 1,
LCD
the LCD module is configured as a voltage tripler (recommended to be used with 5-V LCD glass) by
shorting the voltage divider. The LCDCPMS configuration depends on the LCD panel operating voltage
specification in the design application.
9.4.4.1.1
The LCDCPEN bit in the LCDSUPPLY register enables the charge pump. When charge pump is enabled
(LCDCPEN = 1), V , V , and V are will be generated internally.
LCD Charge Pump Enabled
LL1
LL2
LL3
9.4.4.1.2
When charge pump is disabled (LCDCPEN = 0), V , V , and V are not generated internally.
LL3
LCD Charge Pump Disabled
LL1
LL2
Instead, V , V , and V must be provided by external hardware.
LL1
LL2
LL3
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
152
Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.4.4.2
LCD Power Supply and Voltage Buffer Configuration
The LCD power supply can be internally derived from V or it can be externally derived from a voltage
DD
source in the range between 0.9 to 1.8 Volts that is applied to the V
pin. The Table below provides a
LCD
more detailed description of the power state of the LCD module which depends on the configuration of the
VSUPPLY[1:0], LCDCPMS, BBYPASS, and LCDCPEN bits.
Table 9-18. V Switch Option
DD
LCD Power Supply Configuration
LCD Operational State
0
1
0
1
0
1
Initial VLL2 voltage to VDD level.
Internal power supply.
LCD disabled
00
01
X
X
X
X
LCD operational
VLL2 is generated from VDD.
Initial VLL3 voltage to VDD level.
Internal power supply.
LCD disabled
LCD operational
Minimum current consumption
V
LL3 is generated from VDD
.
x
x
Bias voltages not generated.
LCD disabled
External power supply for VLCD
.
LCD operational
Maximum current consumption
0
0
Buffered doubler mode.
External power supply for VLCD
Un-buffered doubler mode.
.
LCD operational
10
0
1
1
1
0
1
1
1
1
External power supply for VLCD
.
LCD operational
Buffered tripler mode.
External power supply for VLCD
.
LCD operational
Minimum current consumption
Un-buffered tripler mode.
External power supply for VLL1,VLL2, and VLL3 required. LCD Operational
0
1
VLCD pin floating.
11
X
X
VLCD pin floating.
Invalid LCD power configuration
Figure 9-18 shows that if VSUPPLY[1:0] = 10 or 11, the LCD module is configured for an external power
source. If VSUPPLY[1:0] = 00 or 01, the LCD power supply is configured to be internally derived from
V
.
DD
9.4.4.2.1
When VSPUPPLY[1:0] = 10, only the powersw3 signal is asserted and the LCD module is configured to
be powered via an external voltage input on V (Recall V is specified to be in the range from 0.9 V
LCD External Power Supply, VSPUPPLY[1:0] = 10
LCD
LCD
to 1.8 V). The figure above shows that V
is an input to the voltage divider block and is related to V
LCD
LL1.
The voltage divider block uses the states of LCDCPMS, BBYPASS, and powersw3 to derive a state for
V
.
LL1
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
153
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
The output of the voltage divider block is V
V
is connected to the internal charge pump via the V
LL1. LL1 ref.
Using the charge pump, the value of V
is tripled and outputted as V
V
, a LCD bias voltage, is
LL1
LL3. LL3
equal to the voltage required to energize the LCD panel, V
For 3-V LCD glass, V
should be
LCDON.
LL3
approximately 3-V; while for 5-V LCD glass, V
should be approximately 5-V.
LL3
Depending on the LCDCPMS bit configuration, V
will be equal to 3*V
or 3*(2/3*V
) (see
LL3
LCD
LCD
Section 9.4.4, “LCD Charge Pump, Voltage Divider, and Power Supply Operation). Table 9-19 shows the
selected V and V values based on the input value of V
.
LCD
LL1
LL3
Table 9-19. V
LCDCPMS = 0
Typical Values
LL1
LCDCPMS = 1
Voltage Tripler
Voltage Doubler
VLCD
V
LL1 = Vref VLL3 = 3 × Vref
VLL1 = Vref
VLL3 = 3 × Vref
1.4 V
1.5 V
1.7 V
1.8 V
(2/3) × 1.4 V
(2/3) × 1.5 V
(2/3) × 1.7 V
(2/3) × 1.8 V
2.8 V
3.0 V
3.3 V
3.6 V
1.4 V
1.5 V
1.67 V
1.8 V
4.2 V
4.5 V
5.0 V
5.4 V
In addition to V
and V , V
is also generated internally when the charge pump is enabled
LL1
LL3
LL2
(LCDCPEN = 1). For a typical LCD panel, the bias voltages in 1/3 bias mode would be:
•
•
•
•
V = V
= V
= 3 × V
3
LL3
LL2
LL1
SS
LCDON ref
V = V
= 2 × V
ref
2
V = V
= V
1
ref
V = V
0
NOTE
is the LCD panel driving voltage required to turn on an LCD
V
LCDON
segment. Since V
and V
are equivalent, V
should be
LL3
LCDON
LL3
configured so that it is 3 V or 5 V, depending on the LCD panel specification.
9.4.4.2.2
LCD External Power Supply, VSPUPPLY[1:0] = 11
When VSPUPPLY[1:0] = 11, powersw1, powersw2, and powersw3 are deasserted. Moreover with
powersw3 deasserted, the buffer is disabled ((~BBYPASS & pwersw3) = 0), so V will be configured
LCD
in a tri-state condition. V is not available to power the LCD module internally, so the LCD module
DD
requires an external power source for V
V
and V
when the charge pump is disabled. If the
LL1, LL2,
LL3
charge pump is enabled, external power must be applied to either V
V
or V
.
LL1, LL2,
LL3
9.4.4.2.3
LCD Internal Power Supply, VSUPPLY[1:0] = 00 or 01
V
is specified to be from 1.8 V to 3.6 V. V is used as the LCD module power supply when
DD
DD
VSUPPLY[1:0] = 00 or 01(see Table 9-18). When powering the LCD module using V , the charge pump
DD
must be enabled (LCDCPEN = 1). Table 9-20 provides recommendations regarding configuration of the
VSUPPLY[1:0] bit field when using both 3-V and 5-V LCD panels.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
154
Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
Table 9-20. V Switch Option
DD
RecommendUsefor3-V RecommendUsefor5-V
LCD Panels LCD Panels
VSUPPLY[1:0]
VDD Switch Option
00
VLL2 is generated from VDD
• VLL1 = 1v
• VLL1 = 1.67v
• VDD = VLL2 = 2v
• VLL3 = 3v
• VDD = VLL2 = 3.3v
• VLL3 = 5v
01
VLL3 is generated from VDD
• VLL1 = 1v
• VLL2 = 2v
Invalid LCD power
configuration
• VDD = VLL3 = 3v
9.4.5
Resets
During a reset, the LCD module system is configured in the default mode. The default mode includes the
following settings:
•
LCDEN is cleared, thereby forcing all frontplane and backplane driver outputs to the high
impedance state.
•
•
•
•
1/4 duty
1/3 bias
All frontplane enable bits, FP[n]EN, are cleared
LCLK[2:0], VSUPPLY[2:0], BBYPASS, and BRATE[2:0] revert to their reset values
9.4.6
Interrupts
When an LCD module frame (LPWAVE = 0) or sub-frame (LPWAVE = 1) frequency interrupt event
occurs, the LCDIF bit in the LCDCMD register is asserted. The LCDIF bit remains asserted until the LCD
module frame frequency interrupt is cleared by software. The interrupt can be cleared by software by
writing a 1 to the LCDIF bit.
If a both the LCDIF bit in the LCDCMD register and the LCDIEN bit in the LCDCR1 register are set, an
LCD interrupt signal asserts.
For both normal waveform and low-power waveform, configured for the same frequency with the same
clock configuration. The low-power waveform splits a frame into two subframes with equal duration. See
Figure 9-11 through Figure 9-16.
When an LCD module frame(LPWAVE=0) or sub-frame(LPWAVE=1) frequency interrupt event occurs,
the LCDIF bit in the LCDCMD register is asserted. The LCDIF bit remains asserted until the LCD module
frame frequency interrupt is cleared by software. The interrupt can be cleared by software by writing a 1
to the LCDIF bit.
9.5
Initialization Section
This section provides a recommended initialization sequence for the LCD module and also includes
initialization examples for several possible LCD application scenarios.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
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Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.5.1
Initialization Sequence
The list below provides a recommended initialization sequence for the LCD module.
1. LCDCLKS register
a) Configure LCD clock source (SOURCE bit)
b) Adjust the clock source to achieve a value for LCDCLK of ~ 32 kHz (CLKADJ[5:0] & DIV16)
2. LCDSUPPLY register
a) Enable charge pump (LCDCPEN bit)
b) Configure the LCD module for doubler or tripler mode (LCDCPMS bit)
c) Configure charge pump clock (CPCADJ[1:0])
d) Configure HDRVBUF
e) Configure op amp switch (BBYPASS bit)
f) Configure LCD power supply (VSUPPLY[1:0])
3. LCDCR1 register
a) Configure the LCD frame frequency interrupt (LCDIEN bit)
b) Configure LCD behavior in low power mode (LCDWAI and LCDSTP3 bits)
4. LCDCR0 register
a) Configure LCD duty cycle (DUTY[1:0])
b) Configure LPWAVE
c) Select and configure the LCD frame frequency (LCLK[2:0])
5. LCDBCTL register
a) Configure the blink mode to blink individual or blink all segments (BLKMODE bit)
b) Configure the blink frequency (BRATE[2:0])
6. FPENR[5:0] register
a) Enable the LCD module frontplane waveform output (FP[40:0]EN bits)
7. LCDCR0 register
a) Enable the LCD module (LCDEN bit)
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Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.5.2
Initialization Examples
This section provides initialization information for configuration of the LCD. Each example details the
register and bit field values required in order to achieve the appropriate LCD configuration for a given LCD
application scenario. Table 9-21 lists each example and the setup requirements.
Table 9-21. LCD Application Scenarios
Operating
Voltage,
VDD
LCD Glass Required
LCD
Frame
Rate
Behavior in
WAIT/STO3
modes
LCD Clock
Source
Blinking
Mode/Rate
LCD Power
Input
Example
Operating
Voltage
LCD
segments
1
1.8-V
3.6-V
3.6-V
1.8-V
External
32.768 kHz
3-V
3-V
5-V
5-V
128
99
30 Hz
None
WAIT: on
STOP3: on
Power via
VLCD
2
3
4
Internal
100 kHz
80 Hz Individual segment
0.5 Hz
WAIT: on
STOP3: off
Power via
VDD
Internal
18886 kHz
160
123
60 Hz Individual segment
2.0 Hz
WAIT: off
STOP3: on
Power via
VDD
External
32.768 kHz
30 Hz
all segment
2.0 Hz
WAIT: off
STOP3: off
Power via
VLCD
These examples illustrate the flexibility of the LCD module to be configured to meet a wide range of application requirements
including:
•
•
•
•
•
•
clock inputs/sources
LCD power supply
LCD glass operating voltage
LCD segment count
varied blink modes/frequencies
LCD frame rate
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.5.2.1
Initialization Example 1
Example 1 LCD setup requirements are reiterated in the following table:
Operating
Voltage,
VDD
LCD Glass Required
LCD
Frame
Rate
Behavior in
STOP3 and
WAIT modes
LCD Clock
Source
Blinking
Mode/Rate
LCD Power
Input
Example
Operating
Voltage
LCD
segments
1
1.8-V
External
32.768 kHz
3-V
128
30 Hz
No Blinking
WAIT: on
STOP3: on
Power via
VLCD
Table 9-22 lists the required setup values required to initialize the LCD as specified by Example 1:
Table 9-22. Initialization Register Values for Example 1
bit or
bit field
Binary
Value
Register
Comment
LCDCLKS
00000000
SOURCE
0
Selects the external clock reference as the LCD clock input
External clock reference = 0; Bus clock = 1
DIV16
0
Adjusts the LCD clock input (see table 9-12)
Adjusts the LCD clock input (see table 9-12)
Enable the charge pump
CLKADJ[5:0]
LCDCPEN
LCDCPMS
HDRVBUF
CPCADJ[1:0]
BBYPASS
000000
LCDSUPPLY
10XXXX10
1
0
For 3-V LCD glass, select doubler mode; Doubler mode = 0; Tripler mode = 1
High drive buffer
X
XX
X
Configure LCD charge pump clock source
Buffer Bypass; Buffer mode = 0; Unbuffered mode = 1
VSUPPLY[1:0]
10
When VSUPPLY[1:0] = 10, the LCD must be externally powered via VLCD (see
table 9-16). For 3-V glass, the nominal value of VLCD should be 1.5-V.
LCDCR1
XXXXXX00
LCDIEN
LCDWAI
X
0
LCD Interrupt Enable
LCD is “on” in WAIT mode
LCD is “on” in STOP3 mode
LCDSTP3
LCLK[2:0]
0
LCDCR0
0X100X00
100
For 1/4 duty cycle, select closest value to the desired 30 Hz LCD frame frequency
(see table 9-13)
LPWAVE
DUTY[1:0]
BLKMODE
BRATE[2:0]
X
11
Low power waveform
For 128 segments (4x32), select 1/4 duty cycle (see table 9-11)
LCDBCTL
0XXXXXXX
X
N/A; Blink Segments = 0; Blink All = 1
N/A
XXX
FPENR[5:0]
FPENR0
FPENR1
FPENR2
FPENR3
FPENR4
FPENR5
11111111 Only 32 Frontplanes need to be enabled.
11111111
11111111
11111111
00000000
XXXXXXX0
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.5.2.2
Initialization Example 2
Example 2 LCD setup requirements are reiterated in the following table:
Operating
Voltage,
VDD
LCD Glass Required
LCD
Frame
Rate
Behavior in
STOP3 and
WAIT modes
LCD Clock
Source
Blinking
Mode/Rate
LCD Power
Input
Example
Operating
Voltage
LCD
segments
2
3.6-V
Internal
100 kHz
3-V
99
80 Hz Individual segment
0.5 Hz
WAIT: on
STOP3: off
Power via
VDD
Table 9-23 lists the required setup values required to initialize the LCD as specified by Example 2:
Table 9-23. Initialization Register Values for Example 2
Binary
Register
Bit/bit field
Comment
Value
LCDCLKS
10000010
SOURCE
1
Selects the bus clock as the LCD clock input
External clock reference = 0; Bus clock = 1
DIV16
0
Adjusts the LCD clock input (see table 9-12)
Adjusts the LCD clock input (see table 9-12)
Enable the charge pump
CLKADJ[5:0]
LCDCPEN
LCDCPMS
000010
LCDSUPPLY
1XXXXX01
1
X
Don’t care since power is from internal VDD
Doubler mode = 0; Tripler mode = 1
HDRVBUF
CPCADJ[1:0]
BBYPASS
X
XX
X
High drive buffer
Configure LCD charge pump clock source
Buffer Bypass; Buffer mode = 0; Unbuffered mode = 1
Power LCD via VDD internal power (see table 9-16). When VSUPPLY[1:0] = 01,
VSUPPLY[1:0]
01
V
LL3 is generated from VDD .
LCDCR1
XXXXXX01
LCDWAI
0
1
LCD is “on” in WAIT mode
LCD is “off” in STOP3 mode
LCDSTP3
LCDCR0
0X011X11
LCLK[2:0]
011
For 1/3 duty cycle, select closest value to the desired 80 Hz LCD frame frequency
(see table 9-13). Note the LCD base frequency - 256.2 Hz
LPWAVE
X
Low power waveform
DUTY[1:0]
10
For 99 segments (3x33), select 1/3 duty cycle (see table 9-11)
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Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
Table 9-23. Initialization Register Values for Example 2 (continued)
Binary
Value
Register
Bit/bit field
Comment
LCDBCTL
0XXX0100
BLKMODE
0
Blink individual segments; Blink Segments = 0; Blink All = 1
BRATE[2:0]
100
Using the LCD base frequency for the selected LCD frame frequency, select 0.5
Hz blink frequency (see table 9-15).
FPENR[5:0]
FPENR0
FPENR1
FPENR2
FPENR3
FPENR4
FPENR5
11111111 Only 33 Frontplanes need to be enabled.
11111111
11111111 Optionally, if required, 1/4 duty cycle could be used. This option would only
11111111 require 25 frontplane pins to be enabled.
00000001
XXXXXXX0
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.5.2.3
Initialization Example 3
Example 3 LCD setup requirements are reiterated in the table below:
Operating
Voltage,
VDD
LCD Glass Required
LCD
Frame
Rate
Behavior in
STOP3 and
WAIT modes
LCD Clock
Source
Blinking
Mode/Rate
LCD Power
Input
Example
Operating
Voltage
LCD
segments
3
3.6-V
Internal
18886 kHz
5-V
160
60 Hz Individual segment
2.0 Hz
WAIT: off
STOP3: on
Power via
VDD
Table 9-24 lists the required setup values required to initialize the LCD as specified by Example 3:
Table 9-24. Initialization Register Values for Example 3
Binary
Value
Register
Bit/bit field
Comment
LCDCLKS
11100011
SOURCE
1
Selects the bus clock as the LCD clock input
External clock reference = 0; Bus clock = 1
DIV16
1
Adjusts the LCD clock input (see table 9-12)
Adjusts the LCD clock input (see table 9-12)
Enable the charge pump
CLKADJ[5:0]
LCDCPEN
LCDCPMS
100011
LCDSUPPLY
1XXXXX00
1
X
Don’t care since power is from internal VDD
Doubler mode = 0; Tripler mode = 1
HDRVBUF
CPCADJ[1:0]
BBYPASS
X
XX
X
High drive buffer
Configure LCD charge pump clock source
Buffer Bypass; Buffer mode = 0; Unbuffered mode = 1
Power LCD via VDD internal power (see table 9-16). When VSUPPLY[1:0] = 00,
VSUPPLY[1:0]
00
V
LL2 is generated from VDD .
LCDCR1
XXXXXX10
LCDWAI
1
0
LCD is “off” in WAIT mode
LCD is “on” in STOP3 mode
LCDSTP3
LCDCR0
0X011X00
LCLK[2:0]
011
For 1/4 duty cycle, select closest value to the desired 60 Hz LCD frame frequency
(see table 9-13). Note the LCD base frequency - 256.2 Hz
LPWAVE
DUTY[1:0]
BLKMODE
BRATE[2:0]
X
11
0
Low power waveform
For 160 segments (4x40), select 1/4 duty cycle (see table 9-11)
Blink individual segments; Blink Segments = 0; Blink All = 1
LCDBCTL
0XXX0010
010
Using the LCD base frequency for the selected LCD frame frequency, select 2.0
Hz blink frequency (see table 9-15).
FPENR[5:0]
FPENR0
FPENR1
FPENR2
FPENR3
FPENR4
FPENR5
11111111 40 LCD frontplanes need to be enabled.
11111111
11111111
11111111
11111111
XXXXXXX0
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
161
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.5.2.4
Initialization Example 4
Example 3 LCD setup requirements are reiterated in the table below:
Operating
Voltage,
VDD
LCD Glass Required
LCD
Frame
Rate
Behavior in
STOP3 and Power
WAIT modes Input
LCD
LCD Clock
Source
Blinking
Mode/Rate
Example
Operating
Voltage
LCD
segments
4
1.8-V
External
32.768 kHz
5-V
123
30 Hz
all segment
2.0 Hz
WAIT: off
STOP3: off
Power
via
VLCD
Table 9-25 lists the required setup values required to initialize the LCD as specified by Example 4:
Table 9-25. Initialization Register Values for Example 4
Binary
Value
Register
Bit/bit field
Comment
LCDCLKS
00000000
SOURCE
0
Selects the external clock reference as the LCD clock input
External clock reference = 0; Bus clock = 1
DIV16
0
Adjusts the LCD clock input (see table 9-12)
Adjusts the LCD clock input (see table 9-12)
Enable the charge pump
CLKADJ[5:0]
LCDCPEN
LCDCPMS
000000
LCDSUPPLY
1100XX10
1
1
For 3-V LCD glass, select tripler mode
Doubler mode = 0; Tripler mode = 1
HDRVBUF
CPCADJ[1:0]
BBYPASS
X
00
X
High drive buffer
Configure LCD charge pump clock source
Buffer Bypass; Buffer mode = 0; Unbuffered mode = 1
VSUPPLY[1:0]
10
When VSUPPLY[1:0] = 10, the LCD must be externally powered via VLCD (see
table 9-16). For 5-V glass, the nominal value of VLCD should be 1.67-V.
LCDCR1
XXXXXX00
LCDWAI
LCDSTP3
LCLK[2:0]
0
0
LCD is “off” in WAIT mode
LCD is “off” in STOP3 mode
LCDCR0
0X010X11
010
For 1/3 duty cycle, select the closest value to the desired 30 Hz LCD frame
frequency (see table 9-13). Note the LCD base frequency - 128.1 Hz
LPWAVE
DUTY[1:0]
BLKMODE
BRATE[2:0]
X
10
1
Low power waveform
For 123 segments (3x41), select 1/3 duty cycle (see table 9-11)
Blink all segments; Blink Segments = 0; Blink All = 1
LCDBCTL
0XXX1001
001
Using the LCD base frequency for the selected LCD frame frequency, select 2.0
Hz blink frequency (see table 9-15).
FPENR[5:0]
FPENR0
FPENR1
FPENR2
FPENR3
FPENR4
FPENR5
11111111 All 41 LCD frontplanes need to be enabled.
11111111
11111111
11111111
11111111
XXXXXXX1
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Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.6
Application Information
Figure 9-18 is a programmer’s model of the LCD module. The programmer’s model groups the LCD
module register bit and bit field into functional groups. The model is a very high level illustration of the
LCD module showing the module’s functional hierarchy including initialization and runtime control.
LCD Segment Display and Blink Control
Shown with 7-segment
LCD glass hardware
LCD Segment Energize
LCDRAM Mode Select
LCDBCTL
Blink Enable
and Command
Data Bus
(not all LCD pins used)
Blink LCDRAM
Mode Select
LCDBCTL
LCDDRMS = 0
LCD GLASS PANEL
FP[40:0]
BP[3:0]
Segment Energize
LCDRAM
FP[40:0]BP[3:0]
BLKMODE
LCDDRMS = 1
BLINK
Segment Blink
Enable
Clear Display
LCDRAM
LCDMISC
LCDCLR
BLANK
FP[40:0]BP[3:0]
LCD Frame
LCDCR1
LCDIEN
LCDMISC
LCDIF
Frequency
Interrupt
Initialization Options
Module Enable
LCD Pin Enable
FPENR[5:0]
LCDCR0
LCDEN
FP[40:0]EN
V
LCD
Input Clock Source
External Crystal = 32.768 kHz
Power Options
X
V
LL3
LL2
LL1
LCDCLKS
SOURCE
DIV16
LCD Power Pins
LCDCR1
LCDCPMS
LCDCPEN
Internal Clock Generator
V
V
NOTE: Configured
for power using
internal VDD
CLKADJ[5:0]
LCDMISC
BBYPASS
Frame Frequency
C
BYLCD
VSUPPLY[1:0]
HDRVBUF
LCDCR0
LCLK[2:0]
DUTY[1:0]
Low Power
Blink Rate
LCDCR1
LCDWAI
LCDSTP3
LCDBCTL
BLKMODE
BRATE[2:0]
C
LCD
V
V
cap1
cap2
LCD charge pump capacitance
Figure 9-18. LCD Programmer’s Model Diagram
9.6.1
LCD Seven Segment Example Description
A description of the connection between the LCD module and a seven segment LCD character is illustrated
below to provide a basic example for a LPWAVE = 0 and 1/3 duty cycle LCD implementation. The
example use backplane pins (BP0, BP1, BP2) and frontplace pins (FP0, FP1, and FP2). LCDRAM
contents and output waveforms are also shown. Output waveforms are illustrated in Figure 9-19 and
Figure 9-20.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
FP CONNECTION
a
BP CONNECTION
a
BP0 (a, b COMMONED)
f
b
c
f
b
g
d
g
BP1 (c, f, g COMMONED)
BP2 (d, e COMMONED)
e
e
c
d
FP2 (b, c COMMONED)
FP1 (a, d, g COMMONED)
FP0 (e, f COMMONED)
The segment assignments for each bit in the data registers are:
F1B3
F1B2
F1B1
F1B0
F0B3
F0B2
F0B1
F0B0
LDAT1
0x0052
—
d
g
a
—
e
f
—
FP1
FP0
FP2
F3B3
F3B2
F3B1
F3B0
F2B3
F2B2
F2B1
F2B0
LDAT2
0x0053
—
—
—
—
—
—
c
b
To display the character “4”: LDAT1 = X010X01X, LDAT2 = XXXXXX11
a
g
LDAT1
0x0052
X
0
1
0
X
X
0
1
1
X
1
f
b
c
e
LDAT2
0x0053
d
X
X
X
X
X
X = don’t care
Figure 9-19. Waveform Output from LCDRAM Registers
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
164
Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.6.1.1
LCD Module Waveforms
DUTY = 1/3
1FRAME
V
3
V
2
BP0
BP1
V
1
V
0
V
3
V
2
V
1
V
0
V
3
V
2
BP2
V
1
V
0
V
3
F0B2 F0B1 F0B0
V
2
—
0
1
0
FP0
V
1
V
0
V
3
F1B2 F1B1 F1B0
V
2
—
—
0
1
0
FP1
FP2
V
1
V
0
V
3
F2B2 F2B1 F2B0
V
2
0
1
1
V
1
V
0
Figure 9-20. LCD Waveforms (LPWAVE = 0)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
165
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
9.6.1.2
Segment On Driving Waveform
The voltage waveform across the “f” segment of the LCD (between BP1 and FP0) is illustrated in
Figure 9-21. As shown in the waveform, the voltage level reaches the value V therefore the segment will
3
be on.
+V
3
+V
2
+V
1
BP1–FP0
V
0
–V
–V
–V
1
2
3
Figure 9-21. “f” Segment Voltage Waveform
9.6.1.3
Segment Off Driving Waveform
The voltage waveform across the “e” segment of the LCD (between BP2 and FP0) is illustrated in
Figure 9-22. As shown in the waveform, the voltage does not reach the voltage V threshold therefore the
3
segment will be off.
+V
3
+V
2
+V
1
V
BP2–FP0
0
–V
–V
–V
1
2
3
Figure 9-22. “e” Segment Voltage Waveform
9.6.2
LCD Contrast Control
Contrast control for the LCD module is achieved when LCD power supply is adjusted above and below
the LCD threshold voltage. The LCD threshold voltage is the nominal voltage required to energize the
LCD segments. For 3-V LCD glass, the LCD threshold voltage is 3-V; while, for 5-V LCD glass, the LCD
threshold voltage is 5-V. By increasing the value of the LCD threshold voltage, the energized segments on
the LCD glass will become more opaque. Decreasing the value of the LCD threshold voltage makes the
energized segments on the LCD glass become more transparent. The LCD power supply can be adjusted
to facilitate contrast control by using external components like a variable resistor. Figure 9-23 shows two
circuits that could be used to implement contract control.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Freescale Semiconductor
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
LCD GLASS PANEL
NOTE:
Contrast control configuration when
LCD is powered using external VLCD
FP[40:0]
BP[3:0]
This is the recommended configuration
for contrast control.
LCD Power Supply
VLCD specified between 0.9 and 1.8
volts.
9S08LC60
V
LCD
R
V
LL3
LCD Power Pins
V
LL2
V
LL1
C
BYLCD
V
V
cap1
cap2
C
LCD
LCD charge pump capacitance
Figure 9-23. Power Connections for Contrast Control
9.6.3
LCD Power Consumption
The following tables show relative power consumption from V for the different modes available for the
DD
LCD module.
Table 26. Relative Power Consumption, 5 V
LCD Display Voltage
Range
VDD Supply
Range
VDD Current
Consumption Level
Mode
Typical Voltage
V
LL2 connect to VDD
VDD = 3.333 V
VLCD = 1.6667 V
VLCD = 1.6667 V
VDD = 3 V ~ 3.6 V
VLCD = 1.5 V ~ 1.8 V
VLCD = 1.5 V ~ 1.8 V
3 V ~ 3.6 V
2.4 V ~ 3.6 V
1.8 V ~ 3.6 V
low
high
Tripler Buffered Mode
Tripler Bypassed Mode
lowest
Note: Current consumption data based on using the external 32-kHz oscillator with LCD configured using the low-power wave
forms option, a 1/4 duty, and a 32-Hz frame frequency. CLCD = CBYLCD = 100 nF; 160 segment 2000 pF LCD panel.
Table 27. Relative Power Consumption, 3 V
LCD Display Voltage
Range
VDD Supply
Range
VDD Current
Consumption Level
Mode
Typical Voltage
V
LL2 connect to VDD
VDD = 2 V
VLCD = 1 V
VLCD = 1 V
VDD = 3 V
VDD = 1.8 V ~ 2.2 V
VLCD = 0.9 V ~ 1.1 V
VLCD = 0.9 V ~ 1.1 V
VDD = 2.7 V ~ 3.3 V
VLCD = 1.35 V ~ 1.65 V
1.8 V ~ 2.2 V
2.0 V ~ 3.6 V
1.8 V ~ 3.6 V
2.7 V ~ 3.3 V
2.4 V ~ 3.6 V
high
highest
lowest
low
Tripler Buffered Mode
Tripler Bypassed Mode
VLL3 connect to VDD
Doubler Buffered Mode
VLCD = 1.5 V
highest
Note: Current consumption data based on using the external 32-kHz oscillator with LCD configured using the low-power wave
forms option, a 1/4 duty, and a 32-Hz frame frequency. CLCD = CBYLCD = 100 nF; 160 segment 2000 pF LCD panel.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
167
Chapter 9 Liquid Crystal Display Driver (S08LCDV1)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
168
Freescale Semiconductor
Chapter 10 Internal Clock Generator (S08ICGV4)
Chapter 10
Internal Clock Generator (S08ICGV4)
10.1 Introduction
The ICG module is used to generate the system clocks for the MC9S08LC60/36/20 MCU. Figure 10-1
shows the clock distribution for the MC9S08LC60/36/20 MCU. Electrical parametric data for the ICG
may be found in Appendix.
TPMCLK
1-kHz
SYSTEM
CONTROL
LOGIC
TPM1
TPM2
IIC1
SCI
SPI1
SPI2
ACMP
ICGERCLK
FFE
RTI
÷2
ICG
FIXED FREQ CLOCK
(XCLK)
BUSCLK
ICGOUT
÷2
ICGLCLK*
COP
CPU
BDC
LCD
ADC
RAM
FLASH
ADC has min and max
frequency requirements.
FLASH has frequency
requirements for program
See Chapter 1, “Introduction” and erase operation.
and the Electricals Appendix. See the Electricals Appendix.
* ICGLCLK is the alternate BDC clock source for the MC9S08LC60 Series.
Figure 10-1. System Clock Distribution Diagram
NOTE
Freescale Semiconductor programs a factory trim value for ICGTRM into
the FLASH location $FFBE (NVICGTRM). Leaving this address for the
ICGTRM value also allows debugger and programmer vendors to perform
a manual trim operation and store the resultant ICGTRM value into
NVICGTRM for users to access at a later time. The value in NVICGTRM
is not automatically loaded and therefore must be copied into ICGTRM by
user code.
Figure 10-2 shows the MC9S08LC60 Series block diagram with the ICG highlighted.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
169
Chapter 10 Internal Clock Generator (S08ICGV4)
HCS08 CORE
ON-CHIP ICE
DEBUG MODULE (DBG)
CPU
INT
ADP[7:4]
ADP3
4
PTA[7:4]/KBI1P[7:4]/ADP[7:4]
12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
ADP2
BKGD
BKP
ADP1
ADP0
HCS08 SYSTEM CONTROL
ACMP–
ACMP+
ANALOG COMPARATOR
PTA3/KBI1P3/ADP3/ACMP–
PTA2/KBI1P2/ADP2/ACMP+
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
(ACMP)
8-BIT KEYBOARD
8
PTA[1:0]/KBI1P[1:0]/ADP[1:0]
INTERRUPT (KBI1)
RTI
COP
LVD
IRQ
SS1
PTB7/KBI2P4/SS1
PTB6/KBI2P3/SPSCK1
SPSCK1
MISO1
SERIAL PERIPHERAL
INTERFACE (SPI1)
USER FLASH A
MOSI1
(LC60 = 32,768 BYTES)
(LC36 = 24,576 BYTES)
SCL
SDA
PTB5/MOSI1/SCL
PTB4/MISO1/SDA
IIC MODULE (IIC)
USER FLASH B
PTB3/KBI2P2
PTB2/RESET
RESET
(LC60 = 28,464 BYTES)
(LC36 = 12,288 BYTES)
5
3
8-BIT KEYBOARD
INTERRUPT (KBI2)
XTAL
EXTAL
USER RAM
PTB1/KBI2P1/XTAL
PTB0/KBI2P0/EXTAL
(LC60 = 4096 BYTES)
(LC36 = 2560 BYTES)
IRQ
PTC7/KBI2P7/IRQ/TPMCLK
PTC6/BKGD/MS
INTERNAL CLOCK
GENERATOR (ICG)
TPM2CH1
TPM2CH0
2-CHANNEL TIMER/PWM
PTC5/KBI2P6/TPM2CH1
PTC4/KBI2P5/TPM2CH0
(TPM2)
TPMCLK
TPM1CH0
TPM1CH1
LOW-POWER OSCILLATOR
2-CHANNEL TIMER/PWM
(TPM1)
V
LCD
SS2
V
LL1
PTC3/SS2/TPM1CH1
SPSCK2
MOSI2
MISO2
V
SERIAL PERIPHERAL
LL2
PTC2/SPSCK2/TPM1CH0
LIQUID CRYSTAL
DISPLAY DRIVER
LCD
INTERFACE (SPI2)
V
LL3
V
V
CAP1
CAP2
TxD
RxD
PTC1/MOSI2/TxD
PTC0/MISO2/RxD
SERIAL COMMUNICATIONS
INTERFACE (SCI)
BP[2:0]
BP3/FP40
FP[39:0]
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pulldown device if IRQ enabled
(IRQPE = 1).
V
DD
VOLTAGE
3. IRQ does not have a clamp diode to V . IRQ should not be driven above V
.
DD
DD
V
4. Pin contains integrated pullup device.
REGULATOR
SS
5. Input-only RESET is shared with output-only PTB2. Default function after reset is
RESET.
6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is
output-only PTC7.
VREFH
VREFL
7. PTC6/BKGD/MS is an output only pin
8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP.
9. ACMPO is not available.
VDDAD
VSSAD
Figure 10-2. MC9S08LC60 Series Block Diagram Highlighting the ICGBlock and Pins
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
170
Freescale Semiconductor
Chapter 10 Internal Clock Generator (S08ICGV4)
10.2 Introduction
The ICG provides multiple options for clock sources. This offers a user great flexibility when making
choices between cost, precision, current draw, and performance. As seen in Figure 10-3, the ICG consists
of four functional blocks. Each of these is briefly described here and then in more detail in a later section.
•
Oscillator block — The oscillator block provides means for connecting an external crystal or
resonator. Two frequency ranges are software selectable to allow optimal startup and stability.
Alternatively, the oscillator block can be used to route an external square wave to the system clock.
External sources can provide a very precise clock source. The oscillator is capable of being
configured for low power mode or high amplitude mode as selected by HGO.
•
Internal reference generator — The internal reference generator consists of two controlled clock
sources. One is designed to be approximately 8 MHz and can be selected as a local clock for the
background debug controller. The other internal reference clock source is typically 243 kHz and
can be trimmed for finer accuracy via software when a precise timed event is input to the MCU.
This provides a highly reliable, low-cost clock source.
•
•
Frequency-locked loop — A frequency-locked loop (FLL) stage takes either the internal or
external clock source and multiplies it to a higher frequency. Status bits provide information when
the circuit has achieved lock and when it falls out of lock. Additionally, this block can monitor the
external reference clock and signals whether the clock is valid or not.
Clock select block — The clock select block provides several switch options for connecting
different clock sources to the system clock tree. ICGDCLK is the multiplied clock frequency out
of the FLL, ICGERCLK is the reference clock frequency from the crystal or external clock source,
and FFE (fixed frequency enable) is a control signal used to control the system fixed frequency
clock (XCLK). ICGLCLK is the clock source for the background debug controller (BDC).
10.2.1 Features
The module is intended to be very user friendly with many of the features occurring automatically without
user intervention. To quickly configure the module, go to Section 10.6, “Initialization/Application
Information” and pick an example that best suits the application needs.
Features of the ICG and clock distribution system:
•
Several options for the primary clock source allow a wide range of cost, frequency, and precision
choices:
— 32 kHz–100 kHz crystal or resonator
— 1 MHz–16 MHz crystal or resonator
— External clock
— Internal reference generator
•
•
Defaults to self-clocked mode to minimize startup delays
Frequency-locked loop (FLL) generates 8 MHz to 40 MHz (for bus rates up to 20 MHz)
— Uses external or internal clock as reference frequency
Automatic lockout of non-running clock sources
Reset or interrupt on loss of clock or loss of FLL lock
•
•
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
171
Chapter 10 Internal Clock Generator (S08ICGV4)
•
Digitally-controlled oscillator (DCO) preserves previous frequency settings, allowing fast
frequency lock when recovering from stop3 mode
•
•
•
•
DCO will maintain operating frequency during a loss or removal of reference clock
Post-FLL divider selects 1 of 8 bus rate divisors (/1 through /128)
Separate self-clocked source for real-time interrupt
Trimmable internal clock source supports SCI communications without additional external
components
•
•
Automatic FLL engagement after lock is acquired
External oscillator selectable for low power or high gain
10.2.2 Modes of Operation
This is a high-level description only. Detailed descriptions of operating modes are contained in
Section 10.5, “Functional Description.”
•
•
•
Mode 1 — Off
The output clock, ICGOUT, is static. This mode may be entered when the STOP instruction is
executed.
Mode 2 — Self-clocked (SCM)
Default mode of operation that is entered immediately after reset. The ICG’s FLL is open loop and
the digitally controlled oscillator (DCO) is free running at a frequency set by the filter bits.
Mode 3 — FLL engaged internal (FEI)
In this mode, the ICG’s FLL is used to create frequencies that are programmable multiples of the
internal reference clock.
— FLL engaged internal unlocked is a transition state that occurs while the FLL is attempting to
lock. The FLL DCO frequency is off target and the FLL is adjusting the DCO to match the
target frequency.
— FLL engaged internal locked is a state that occurs when the FLL detects that the DCO is locked
to a multiple of the internal reference.
•
•
Mode 4 — FLL bypassed external (FBE)
In this mode, the ICG is configured to bypass the FLL and use an external clock as the clock source.
Mode 5 — FLL engaged external (FEE)
The ICG’s FLL is used to generate frequencies that are programmable multiples of the external
clock reference.
— FLL engaged external unlocked is a transition state that occurs while the FLL is attempting to
lock. The FLL DCO frequency is off target and the FLL is adjusting the DCO to match the
target frequency.
— FLL engaged external locked is a state which occurs when the FLL detects that the DCO is
locked to a multiple of the internal reference.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
172
Freescale Semiconductor
Chapter 10 Internal Clock Generator (S08ICGV4)
10.2.3 Block Diagram
Figure 10-3 is a top-level diagram that shows the functional organization of the internal clock generation
(ICG) module. This section includes a general description and a feature list.
EXTAL
ICG
OSCILLATOR (OSC)
CLOCK
WITH EXTERNAL REF
SELECT
SELECT
ICGERCLK
OUTPUT
XTAL
CLOCK
ICGDCLK
/R
FREQUENCY
LOCKED
SELECT
DCO
ICGOUT
REF
LOOP (FLL)
SELECT
V
DDA
(SEE NOTE 2)
LOSS OF LOCK
AND CLOCK DETECTOR
V
SSA
(SEE NOTE 2)
FIXED
CLOCK
SELECT
FFE
IRG
TYP 243 kHz
ICGIRCLK
INTERNAL
REFERENCE
8 MHz
RG
LOCAL CLOCK FOR OPTIONAL USE WITH BDC
GENERATORS
ICGLCLK
NOTES:
1. See Table 8-1 for specific use of ICGOUT, FFE, ICGLCLK, ICGERCLK
2. Not all HCS08 microcontrollers have unique supply pins for the ICG. See the device pin assignments.
Figure 10-3. ICG Block Diagram
10.3 External Signal Description
The oscillator pins are used to provide an external clock source for the MCU. The oscillator pins are gain
controlled in low-power mode (default). Oscillator amplitudes in low-power mode are limited to
approximately 1 V, peak-to-peak.
10.3.1 EXTAL — External Reference Clock / Oscillator Input
If upon the first write to ICGC1, either the FEE mode or FBE mode is selected, this pin functions as either
the external clock input or the input of the oscillator circuit as determined by REFS. If upon the first write
to ICGC1, either the FEI mode or SCM mode is selected, this pin is not used by the ICG.
10.3.2 XTAL — Oscillator Output
If upon the first write to ICGC1, either the FEE mode or FBE mode is selected, this pin functions as the
output of the oscillator circuit. If upon the first write to ICGC1, either the FEI mode or SCM mode is
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
173
Chapter 10 Internal Clock Generator (S08ICGV4)
selected, this pin is not used by the ICG. The oscillator is capable of being configured to provide a higher
amplitude output for improved noise immunity. This mode of operation is selected by HGO = 1.
10.3.3 External Clock Connections
If an external clock is used, then the pins are connected as shown Figure 10-4.
ICG
EXTAL
XTAL
V
SS
NOT CONNECTED
CLOCK INPUT
Figure 10-4. External Clock Connections
10.3.4 External Crystal/Resonator Connections
If an external crystal/resonator frequency reference is used, then the pins are connected as shown in
Figure 10-5. Recommended component values are listed in the Electrical Characteristics chapter.
ICG
EXTAL
V
XTAL
SS
R
S
C
C
2
1
R
F
CRYSTAL OR RESONATOR
Figure 10-5. External Frequency Reference Connection
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
174
Freescale Semiconductor
Chapter 10 Internal Clock Generator (S08ICGV4)
10.4 Register Definition
Refer to the direct-page register summary in the Memory chapter of this data sheet for the absolute address
assignments for all ICG registers. This section refers to registers and control bits only by their names. A
Freescale-provided equate or header file is used to translate these names into the appropriate absolute
addresses.
10.4.1 ICG Control Register 1 (ICGC1)
7
6
5
4
3
2
1
0
R
W
0
HGO1
RANGE
REFS
CLKS
OSCSTEN
LOCD
Reset
0
1
0
0
0
1
0
0
= Unimplemented or Reserved
Figure 10-6. ICG Control Register 1 (ICGC1)
1
This bit can be written only once after reset. Additional writes are ignored.
Table 10-1. ICGC1 Register Field Descriptions
Field
Description
7
High Gain Oscillator Select — The HGO bit is used to select between low power operation and high gain
HGO
operation for improved noise immunity. This bit is write-once after reset.
0
1
Oscillator configured for low power operation.
Oscillator configured for high gain operation.
6
Frequency Range Select — The RANGE bit controls the oscillator, reference divider, and FLL loop prescaler
multiplication factor (P). It selects one of two reference frequency ranges for the ICG. The RANGE bit is
write-once after a reset. The RANGE bit only has an effect in FLL engaged external and FLL bypassed external
modes.
RANGE
0
1
Oscillator configured for low frequency range. FLL loop prescale factor P is 64.
Oscillator configured for high frequency range. FLL loop prescale factor P is 1.
5
External Reference Select — The REFS bit controls the external reference clock source for ICGERCLK. The
REFS
REFS bit is write-once after a reset.
0
1
External clock requested.
Oscillator using crystal or resonator requested.
4:3
CLKS
Clock Mode Select — The CLKS bits control the clock mode as described below. If FLL bypassed external is
requested, it will not be selected until ERCS = 1. If the ICG enters off mode, the CLKS bits will remain
unchanged. Writes to the CLKS bits will not take effect if a previous write is not complete.
00 Self-clocked
01 FLL engaged, internal reference
10 FLL bypassed, external reference
11 FLL engaged, external reference
The CLKS bits are writable at any time, unless the first write after a reset was CLKS = 0X, the CLKS bits cannot
be written to 1X until after the next reset (because the EXTAL pin was not reserved).
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
175
Chapter 10 Internal Clock Generator (S08ICGV4)
Table 10-1. ICGC1 Register Field Descriptions (continued)
Field
Description
2
Enable Oscillator in Off Mode — The OSCSTEN bit controls whether or not the oscillator circuit remains
OSCSTEN enabled when the ICG enters off mode. This bit has no effect if HGO = 1 and RANGE = 1.
0
1
Oscillator disabled when ICG is in off mode unless ENABLE is high, CLKS = 10, and REFST = 1.
Oscillator enabled when ICG is in off mode, CLKS = 1X and REFST = 1.
1
Loss of Clock Disable
LOCD
0
1
Loss of clock detection enabled.
Loss of clock detection disabled.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
176
Freescale Semiconductor
Chapter 10 Internal Clock Generator (S08ICGV4)
10.4.2 ICG Control Register 2 (ICGC2)
7
6
5
4
3
2
1
0
R
W
LOLRE
MFD
LOCRE
RFD
Reset
0
0
0
0
0
0
0
0
Figure 10-7. ICG Control Register 2 (ICGC2)
Table 10-2. ICGC2 Register Field Descriptions
Description
Field
7
Loss of Lock Reset Enable — The LOLRE bit determines what type of request is made by the ICG following a
LOLRE
loss of lock indication. The LOLRE bit only has an effect when LOLS is set.
0
1
Generate an interrupt request on loss of lock.
Generate a reset request on loss of lock.
6:4
MFD
Multiplication Factor — The MFD bits control the programmable multiplication factor in the FLL loop. The value
specified by the MFD bits establishes the multiplication factor (N) applied to the reference frequency. Writes to
the MFD bits will not take effect if a previous write is not complete. Select a low enough value for N such that
fICGDCLK does not exceed its maximum specified value.
000 Multiplication factor = 4
001 Multiplication factor = 6
010 Multiplication factor = 8
011 Multiplication factor = 10
100 Multiplication factor = 12
101 Multiplication factor = 14
110 Multiplication factor = 16
111 Multiplication factor = 18
3
Loss of Clock Reset Enable — The LOCRE bit determines how the system manages a loss of clock condition.
LOCRE
0
1
Generate an interrupt request on loss of clock.
Generate a reset request on loss of clock.
2:0
Reduced Frequency Divider — The RFD bits control the value of the divider following the clock select circuitry.
RFD
The value specified by the RFD bits establishes the division factor (R) applied to the selected output clock source.
Writes to the RFD bits will not take effect if a previous write is not complete.
000 Division factor = 1
001 Division factor = 2
010 Division factor = 4
011 Division factor = 8
100 Division factor = 16
101 Division factor = 32
110 Division factor = 64
111 Division factor = 128
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
177
Chapter 10 Internal Clock Generator (S08ICGV4)
10.4.3 ICG Status Register 1 (ICGS1)
7
6
5
4
3
2
1
0
R
W
CLKST
REFST
LOLS
LOCK
LOCS
ERCS
ICGIF
1
0
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 10-8. ICG Status Register 1 (ICGS1)
Table 10-3. ICGS1 Register Field Descriptions
Description
Field
7:6
CLKST
Clock Mode Status — The CLKST bits indicate the current clock mode. The CLKST bits don’t update
immediately after a write to the CLKS bits due to internal synchronization between clock domains.
00 Self-clocked
01 FLL engaged, internal reference
10 FLL bypassed, external reference
11 FLL engaged, external reference
5
Reference Clock Status — The REFST bit indicates which clock reference is currently selected by the
REFST
Reference Select circuit.
0
1
External Clock selected.
Crystal/Resonator selected.
4
FLL Loss of Lock Status — The LOLS bit is a sticky indication of FLL lock status.
LOLS
0
1
FLL has not unexpectedly lost lock since LOLS was last cleared.
FLL has unexpectedly lost lock since LOLS was last cleared, LOLRE determines action taken.FLL has
unexpectedly lost lock since LOLS was last cleared, LOLRE determines action taken.
3
FLL Lock Status — The LOCK bit indicates whether the FLL has acquired lock. The LOCK bit is cleared in off,
LOCK
self-clocked, and FLL bypassed modes.
0
1
FLL is currently unlocked.
FLL is currently locked.
2
Loss Of Clock Status — The LOCS bit is an indication of ICG loss of clock status.
LOCS
0
1
ICG has not lost clock since LOCS was last cleared.
ICG has lost clock since LOCS was last cleared, LOCRE determines action taken.
1
External Reference Clock Status — The ERCS bit is an indication of whether or not the external reference
ERCS
clock (ICGERCLK) meets the minimum frequency requirement.
0
1
External reference clock is not stable, frequency requirement is not met.
External reference clock is stable, frequency requirement is met.
0
ICG Interrupt Flag — The ICGIF read/write flag is set when an ICG interrupt request is pending. It is cleared by
a reset or by reading the ICG status register when ICGIF is set and then writing a logic 1 to ICGIF. If another ICG
interrupt occurs before the clearing sequence is complete, the sequence is reset so ICGIF would remain set after
the clear sequence was completed for the earlier interrupt. Writing a logic 0 to ICGIF has no effect.
ICGIF
0
1
No ICG interrupt request is pending.
An ICG interrupt request is pending.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
178
Freescale Semiconductor
Chapter 10 Internal Clock Generator (S08ICGV4)
10.4.4 ICG Status Register 2 (ICGS2)
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
DCOS
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 10-9. ICG Status Register 2 (ICGS2)
Table 10-4. ICGS2 Register Field Descriptions
Description
Field
0
DCO Clock Stable — The DCOS bit is set when the DCO clock (ICG2DCLK) is stable, meaning the count error
has not changed by more than nunlock for two consecutive samples and the DCO clock is not static. This bit is
used when exiting off state if CLKS = X1 to determine when to switch to the requested clock mode. It is also used
in self-clocked mode to determine when to start monitoring the DCO clock. This bit is cleared upon entering the
off state.
DCOS
0 DCO clock is unstable.
1 DCO clock is stable.
10.4.5 ICG Filter Registers (ICGFLTU, ICGFLTL)
7
6
5
4
3
2
1
0
R
W
0
0
0
0
FLT
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 10-10. ICG Upper Filter Register (ICGFLTU)
Table 10-5. ICGFLTU Register Field Descriptions
Description
Field
3:0
FLT
Filter Value — The FLT bits indicate the current filter value, which controls the DCO frequency. The FLT bits are
read only except when the CLKS bits are programmed to self-clocked mode (CLKS = 00). In self-clocked mode,
any write to ICGFLTU updates the current 12-bit filter value. Writes to the ICGFLTU register will not affect FLT if
a previous latch sequence is not complete.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
179
Chapter 10 Internal Clock Generator (S08ICGV4)
7
6
5
4
3
2
1
0
R
W
FLT
Reset
1
1
0
0
0
0
0
0
Figure 10-11. ICG Lower Filter Register (ICGFLTL)
Table 10-6. ICGFLTL Register Field Descriptions
Description
Field
7:0
FLT
Filter Value — The FLT bits indicate the current filter value, which controls the DCO frequency. The FLT bits are
read only except when the CLKS bits are programmed to self-clocked mode (CLKS = 00). In self-clocked mode,
any write to ICGFLTU updates the current 12-bit filter value. Writes to the ICGFLTU register will not affect FLT if
a previous latch sequence is not complete. The filter registers show the filter value (FLT).
10.4.6 ICG Trim Register (ICGTRM)
7
6
5
4
3
2
1
0
R
W
TRIM
1
0
0
0
0
0
0
0
POR
Reset:
U
U
U
U
U
U
U
U
U = Unaffected by MCU reset
Figure 10-12. ICG Trim Register (ICGTRM)
Table 10-7. ICGTRM Register Field Descriptions
Description
Field
7
ICG Trim Setting — The TRIM bits control the internal reference generator frequency. They allow a 25%
adjustment of the nominal (POR) period. The bit’s effect on period is binary weighted (i.e., bit 1 will adjust twice
as much as changing bit 0). Increasing the binary value in TRIM will increase the period and decreasing the value
will decrease the period.
TRIM
10.5 Functional Description
This section provides a functional description of each of the five operating modes of the ICG. Also
discussed are the loss of clock and loss of lock errors and requirements for entry into each mode. The ICG
is very flexible, and in some configurations, it is possible to exceed certain clock specifications. When
using the FLL, configure the ICG so that the frequency of ICGDCLK does not exceed its maximum value
to ensure proper MCU operation.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Freescale Semiconductor
Chapter 10 Internal Clock Generator (S08ICGV4)
10.5.1 Off Mode (Off)
Normally when the CPU enters stop mode, the ICG will cease all clock activity and is in the off state.
However there are two cases to consider when clock activity continues while the CPU is in stop mode,
10.5.1.1 BDM Active
When the BDM is enabled, the ICG continues activity as originally programmed. This allows access to
memory and control registers via the BDC controller.
10.5.1.2 OSCSTEN Bit Set
When the oscillator is enabled in stop mode (OSCSTEN = 1), the individual clock generators are enabled
but the clock feed to the rest of the MCU is turned off. This option is provided to avoid long oscillator
startup times if necessary, or to run the RTI from the oscillator during stop3.
10.5.1.3 Stop/Off Mode Recovery
Upon the CPU exiting stop mode due to an interrupt, the previously set control bits are valid and the system
clock feed resumes. If FEE is selected, the ICG will source the internal reference until the external clock
is stable. If FBE is selected, the ICG will wait for the external clock to stabilize before enabling ICGOUT.
Upon the CPU exiting stop mode due to a reset, the previously set ICG control bits are ignored and the
default reset values applied. Therefore the ICG will exit stop in SCM mode configured for an
approximately 8 MHz DCO output (4 MHz bus clock) with trim value maintained. If using a crystal, 4096
clocks are detected prior to engaging ICGERCLK. This is incorporated in crystal start-up time.
10.5.2 Self-Clocked Mode (SCM)
Self-clocked mode (SCM) is the default mode of operation and is entered when any of the following
conditions occur:
•
•
After any reset.
Exiting from off mode when CLKS does not equal 10. If CLKS = X1, the ICG enters this state
temporarily until the DCO is stable (DCOS = 1).
•
•
CLKS bits are written from X1 to 00.
CLKS = 1X and ICGERCLK is not detected (both ERCS = 0 and LOCS = 1).
In this state, the FLL loop is open. The DCO is on, and the output clock signal ICGOUT frequency is given
by f / R. The ICGDCLK frequency can be varied from 8 MHz to 40 MHz by writing a new value
ICGDCLK
into the filter registers (ICGFLTH and ICGFLTL). This is the only mode in which the filter registers can
be written.
If this mode is entered due to a reset, f
will default to f
which is nominally 8 MHz. If this
ICGDCLK
Self_reset
mode is entered from FLL engaged internal, f
will maintain the previous frequency.If this mode
ICGDCLK
is entered from FLL engaged external (either by programming CLKS or due to a loss of external reference
clock), f will maintain the previous frequency, but ICGOUT will double if the FLL was unlocked.
ICGDCLK
If this mode is entered from off mode, f
will be equal to the frequency of ICGDCLK before
ICGDCLK
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
181
Chapter 10 Internal Clock Generator (S08ICGV4)
entering off mode. If CLKS bits are set to 01 or 11 coming out of the Off state, the ICG enters this mode
until ICGDCLK is stable as determined by the DCOS bit. After ICGDCLK is considered stable, the ICG
automatically closes the loop by switching to FLL engaged (internal or external) as selected by the CLKS
bits.
CLKST
CLKS
RFD
REFERENCE
DIVIDER (/7)
ICGIRCLK
CLOCK
SELECT
CIRCUIT
REDUCED
FREQUENCY
DIVIDER (R)
ICGOUT
RANGE
MFD
ICGDCLK
FLT
1x
2x
DIGITAL
LOOP
FILTER
DIGITALLY
CONTROLLED
OSCILLATOR
SUBTRACTOR
FLL ANALOG
CLKST
FREQUENCY-
LOCKED
LOOP (FLL)
OVERFLOW
ICG2DCLK
PULSE
COUNTER
COUNTER ENABLE
RANGE
IRQ
LOCK AND
LOSS OF CLOCK
DETECTOR
RESET AND
INTERRUPT
CONTROL
RESET
DCOS LOCK LOLS LOCS ERCS LOCD
ICGIF LOLRE LOCRE
Figure 10-13. Detailed Frequency-Locked Loop Block Diagram
10.5.3 FLL Engaged, Internal Clock (FEI) Mode
FLL engaged internal (FEI) is entered when any of the following conditions occur:
•
•
CLKS bits are written to 01
The DCO clock stabilizes (DCOS = 1) while in SCM upon exiting the off state with CLKS = 01
In FLL engaged internal mode, the reference clock is derived from the internal reference clock
ICGIRCLK, and the FLL loop will attempt to lock the ICGDCLK frequency to the desired value, as
selected by the MFD bits.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
182
Freescale Semiconductor
Chapter 10 Internal Clock Generator (S08ICGV4)
10.5.4 FLL Engaged Internal Unlocked
FEI unlocked is a temporary state that is entered when FEI is entered and the count error (Δn) output from
the subtractor is greater than the maximum n
lock detector to detect the unlock condition.
or less than the minimum n
, as required by the
unlock
unlock
The ICG will remain in this state while the count error (Δn) is greater than the maximum n
or less than
lock
the minimum n , as required by the lock detector to detect the lock condition.
lock
In this state the output clock signal ICGOUT frequency is given by f
/ R.
ICGDCLK
10.5.5 FLL Engaged Internal Locked
FLL engaged internal locked is entered from FEI unlocked when the count error (Δn), which comes from
the subtractor, is less than n (max) and greater than n (min) for a given number of samples, as
lock
lock
required by the lock detector to detect the lock condition. The output clock signal ICGOUT frequency is
given by f / R. In FEI locked, the filter value is updated only once every four comparison cycles.
ICGDCLK
The update made is an average of the error measurements taken in the four previous comparisons.
10.5.6 FLL Bypassed, External Clock (FBE) Mode
FLL bypassed external (FBE) is entered when any of the following conditions occur:
•
•
•
From SCM when CLKS = 10 and ERCS is high
When CLKS = 10, ERCS = 1 upon entering off mode, and off is then exited
From FLL engaged external mode if a loss of DCO clock occurs and the external reference remains
valid (both LOCS = 1 and ERCS = 1)
In this state, the DCO and IRG are off and the reference clock is derived from the external reference clock,
ICGERCLK. The output clock signal ICGOUT frequency is given by f / R. If an external clock
ICGERCLK
source is used (REFS = 0), then the input frequency on the EXTAL pin can be anywhere in the range
0 MHz to 40 MHz. If a crystal or resonator is used (REFS = 1), then frequency range is either low for
RANGE = 0 or high for RANGE = 1.
10.5.7 FLL Engaged, External Clock (FEE) Mode
The FLL engaged external (FEE) mode is entered when any of the following conditions occur:
•
•
CLKS = 11 and ERCS and DCOS are both high.
The DCO stabilizes (DCOS = 1) while in SCM upon exiting the off state with CLKS = 11.
In FEE mode, the reference clock is derived from the external reference clock ICGERCLK, and the FLL
loop will attempt to lock the ICGDCLK frequency to the desired value, as selected by the MFD bits. To
run in FEE mode, there must be a working 32 kHz–100 kHz or 2 MHz–10 MHz external clock source. The
maximum external clock frequency is limited to 10 MHz in FEE mode to prevent over-clocking the DCO.
The minimum multiplier for the FLL, from Table 10-12 is 4. Because 4 X 10 MHz is 40MHz, which is the
operational limit of the DCO, the reference clock cannot be any faster than 10 MHz.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
183
Chapter 10 Internal Clock Generator (S08ICGV4)
10.5.7.1 FLL Engaged External Unlocked
FEE unlocked is entered when FEE is entered and the count error (Δn) output from the subtractor is greater
than the maximum n
unlock condition.
or less than the minimum n
, as required by the lock detector to detect the
unlock
unlock
The ICG will remain in this state while the count error (Δn) is greater than the maximum n
or less than
lock
the minimum n , as required by the lock detector to detect the lock condition.
lock
In this state, the pulse counter, subtractor, digital loop filter, and DCO form a closed loop and attempt to
lock it according to their operational descriptions later in this section. Upon entering this state and until
the FLL becomes locked, the output clock signal ICGOUT frequency is given by f
/ (2×R) This
ICGDCLK
extra divide by two prevents frequency overshoots during the initial locking process from exceeding
chip-level maximum frequency specifications. After the FLL has locked, if an unexpected loss of lock
causes it to re-enter the unlocked state while the ICG remains in FEE mode, the output clock signal
ICGOUT frequency is given by f
/ R.
ICGDCLK
10.5.7.2 FLL Engaged External Locked
FEE locked is entered from FEE unlocked when the count error (Δn) is less than n
(max) and greater
lock
than n
(min) for a given number of samples, as required by the lock detector to detect the lock
lock
condition. The output clock signal ICGOUT frequency is given by f
/R. In FLL engaged external
ICGDCLK
locked, the filter value is updated only once every four comparison cycles. The update made is an average
of the error measurements taken in the four previous comparisons.
10.5.8 FLL Lock and Loss-of-Lock Detection
To determine the FLL locked and loss-of-lock conditions, the pulse counter counts the pulses of the DCO
for one comparison cycle (see Table 10-9 for explanation of a comparison cycle) and passes this number
to the subtractor. The subtractor compares this value to the value in MFD and produces a count error, Δn.
To achieve locked status, Δn must be between n
(min) and n
(max). After the FLL has locked, Δn
lock
lock
must stay between n
(min) and n
(max) to remain locked. If Δn goes outside this range
unlock
unlock
unexpectedly, the LOLS status bit is set and remains set until cleared by software or until the MCU is reset.
LOLS is cleared by reading ICGS1 then writing 1 to ICGIF (LOLRE = 0), or by a loss-of-lock induced
reset (LOLRE = 1), or by any MCU reset.
If the ICG enters the off state due to stop mode when ENBDM = OSCSTEN = 0, the FLL loses locked
status (LOCK is cleared), but LOLS remains unchanged because this is not an unexpected loss-of-lock
condition. Though it would be unusual, if ENBDM is cleared to 0 while the MCU is in stop, the ICG enters
the off state. Because this is an unexpected stopping of clocks, LOLS will be set when the MCU wakes up
from stop.
Expected loss of lock occurs when the MFD or CLKS bits are changed or in FEI mode only, when the
TRIM bits are changed. In these cases, the LOCK bit will be cleared until the FLL regains lock, but the
LOLS will not be set.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
184
Freescale Semiconductor
Chapter 10 Internal Clock Generator (S08ICGV4)
10.5.9 FLL Loss-of-Clock Detection
The reference clock and the DCO clock are monitored under different conditions (see Table 10-8).
Provided the reference frequency is being monitored, ERCS = 1 indicates that the reference clock meets
minimum frequency requirements. When the reference and/or DCO clock(s) are being monitored, if either
one falls below a certain frequency, f
and f
, respectively, the LOCS status bit will be set to indicate
LOR
LOD
the error. LOCS will remain set until it is acknowledged or until the MCU is reset. LOCS is cleared by
reading ICGS1 then writing 1 to ICGIF (LOCRE = 0), or by a loss-of-clock induced reset (LOCRE = 1),
or by any MCU reset.
If the ICG is in FEE, a loss of reference clock causes the ICG to enter SCM, and a loss of DCO clock causes
the ICG to enter FBE mode. If the ICG is in FBE mode, a loss of reference clock will cause the ICG to
enter SCM. In each case, the CLKST and CLKS bits will be automatically changed to reflect the new state.
If the ICG is in FEE mode when a loss of clock occurs and the ERCS is still set to 1, then the CLKST bits
are set to 10 and the ICG reverts to FBE mode.
A loss of clock will also cause a loss of lock when in FEE or FEI modes. Because the method of clearing
the LOCS and LOLS bits is the same, this would only be an issue in the unlikely case that LOLRE = 1 and
LOCRE = 0. In this case, the interrupt would be overridden by the reset for the loss of lock.
Table 10-8. Clock Monitoring (When LOCD = 0)
External Reference
DCO Clock
Mode
CLKS
REFST
ERCS
Clock
Monitored?
Monitored?
Off
0X or 11
10
X
0
Forced Low
Forced Low
Real-Time1
Forced Low
Forced High
Real-Time
Real-Time
Forced Low
Real-Time
Forced High
Real-Time
Real-Time
No
No
Yes(1)
No
No
10
1
No
SCM
(CLKST = 00)
0X
X
0
No
Yes2
Yes(2)
Yes(2)
Yes(2)
Yes
10
No
10
1
Yes
Yes
No
11
X
X
X
0
FEI
(CLKST = 01)
0X
11
Yes
No
Yes
FBE
(CLKST = 10)
10
No
10
1
Yes
Yes
No
FEE
11
X
Yes
(CLKST = 11)
1
2
If ENABLE is high (waiting for external crystal start-up after exiting stop).
DCO clock will not be monitored until DCOS = 1 upon entering SCM from off or FLL bypassed external mode.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
185
Chapter 10 Internal Clock Generator (S08ICGV4)
10.5.10 Clock Mode Requirements
A clock mode is requested by writing to CLKS1:CLKS0 and the actual clock mode is indicated by
CLKST1:CLKST0. Provided minimum conditions are met, the status shown in CLKST1:CLKST0 should
be the same as the requested mode in CLKS1:CLKS0. Table 10-9 shows the relationship between CLKS,
CLKST, and ICGOUT. It also shows the conditions for CLKS = CLKST or the reason CLKS ≠ CLKST.
NOTE
If a crystal will be used before the next reset, then be sure to set REFS = 1
and CLKS = 1x on the first write to the ICGC1 register. Failure to do so will
result in “locking” REFS = 0 which will prevent the oscillator amplifier
from being enabled until the next reset occurs.
Table 10-9. ICG State Table
Actual
Mode
(CLKST)
Desired
Mode
(CLKS)
Reference
Frequency
(fREFERENCE)
Reason
CLKS1 ≠
CLKST
Comparison
Cycle Time
Conditions1 for
CLKS = CLKST
Range
ICGOUT
Off
(XX)
X
X
0
0
—
—
0
0
—
—
—
Off
(XX)
FBE
(10)
ERCS = 0
Not switching
from FBE to
SCM
SCM
(00)
ICGIRCLK/72
8/fICGIRCLK
X
ICGDCLK/R
—
f
FEI
(01)
8/fICGIRCLK
8/fICGIRCLK
8/fICGIRCLK
8/fICGIRCLK
8/fICGIRCLK
0
X
X
0
ICGDCLK/R
ICGDCLK/R
ICGDCLK/R
ICGDCLK/R
ICGDCLK/R
ICGERCLK/R
ICGERCLK/R
ICGDCLK/R3
ICGDCLK/R(2)
—
DCOS = 0
ERCS = 0
f
f
f
ICGIRCLK/7(1)
ICGIRCLK/7(1)
ICGIRCLK/7(1)
SCM
(00)
FBE
(10)
—
—
FEE
(11)
DCOS = 0 or
ERCS = 0
FEI
(01)
fICGIRCLK/7
DCOS = 1
—
—
ERCS = 0
—
FEI
(01)
FEE
(11)
fICGIRCLK/7
X
X
X
0
FBE
(10)
0
—
ERCS = 1
—
FBE
(10)
FEE
(11)
LOCS = 1 &
ERCS = 1
0
—
ERCS = 1 and
DCOS = 1
fICGERCLK
fICGERCLK
2/fICGERCLK
128/fICGERCLK
—
—
FEE
(11)
FEE
(11)
ERCS = 1 and
DCOS = 1
1
1
2
3
CLKST will not update immediately after a write to CLKS. Several bus cycles are required before CLKST updates to the new
value.
The reference frequency has no effect on ICGOUT in SCM, but the reference frequency is still used in making the comparisons
that determine the DCOS bit
After initial LOCK; will be ICGDCLK/2R during initial locking process and while FLL is re-locking after the MFD bits are changed.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
186
Freescale Semiconductor
Chapter 10 Internal Clock Generator (S08ICGV4)
10.5.11 Fixed Frequency Clock
The ICG provides a fixed frequency clock output, XCLK, for use by on-chip peripherals. This output is
equal to the internal bus clock, BUSCLK, in all modes except FEE. In FEE mode, XCLK is equal to
ICGERCLK ÷ 2 when the following conditions are met:
•
(P × N) ÷ R ≥ 4 where P is determined by RANGE (see Table 10-11), N and R are determined by
MFD and RFD respectively (see Table 10-12).
•
LOCK = 1.
If the above conditions are not true, then XCLK is equal to BUSCLK.
When the ICG is in either FEI or SCM mode, XCLK is turned off. Any peripherals which can use XCLK
as a clock source must not do so when the ICG is in FEI or SCM mode.
10.5.12 High Gain Oscillator
The oscillator has the option of running in a high gain oscillator (HGO) mode, which improves the
oscillator's resistance to EMC noise when running in FBE or FEE modes. This option is selected by writing
a 1 to the HGO bit in the ICGC1 register. HGO is used with both the high and low range oscillators but is
only valid when REFS = 1 in the ICGC1 register. When HGO = 0, the standard low-power oscillator is
selected. This bit is writable only once after any reset.
10.6 Initialization/Application Information
10.6.1 Introduction
The section is intended to give some basic direction on which configuration a user would want to select
when initializing the ICG. For some applications, the serial communication link may dictate the accuracy
of the clock reference. For other applications, lowest power consumption may be the chief clock
consideration. Still others may have lowest cost as the primary goal. The ICG allows great flexibility in
choosing which is best for any application.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
187
Chapter 10 Internal Clock Generator (S08ICGV4)
Table 10-10. ICG Configuration Consideration
Clock Reference Source = Internal
Clock Reference Source = External
FEI
FEE
4 MHz < fBus < 20 MHz.
4 MHz < fBus < 20 MHz
Medium power (will be less than FEE if oscillator
range = high)
Medium power (will be less than FEI if oscillator
range = low)
FLL
Good clock accuracy (After IRG is trimmed)
Lowest system cost (no external components
required)
IRG is on. DCO is on. 1
Engaged
High clock accuracy
Medium/High system cost (crystal, resonator or
external clock source required)
IRG is off. DCO is on.
SCM
FBE
This mode is mainly provided for quick and reliable
system startup.
3 MHz < fBus < 5 MHz (default).
f
Bus range ≤ 8 MHz when crystal or resonator is
used.
Lowest power
FLL
Bypassed
3 MHz < fBus < 20 MHz (via filter bits).
Highest clock accuracy
Medium/High system cost (Crystal, resonator or
external clock source required)
IRG is off. DCO is off.
Medium power
Poor accuracy.
IRG is off. DCO is on and open loop.
1
The IRG typically consumes 100 μA. The FLL and DCO typically consumes 0.5 to 2.5 mA, depending upon output frequency.
For minimum power consumption and minimum jitter, choose N and R to be as small as possible.
The following sections contain initialization examples for various configurations.
NOTE
Hexadecimal values designated by a preceding $, binary values designated
by a preceding %, and decimal values have no preceding character.
Important configuration information is repeated here for reference.
Table 10-11. ICGOUT Frequency Calculation Options
1
Clock Scheme
fICGOUT
P
Note
SCM — self-clocked mode (FLL bypassed
internal)
fICGDCLK / R
NA
Typical fICGOUT = 8 MHz
immediately after reset
FBE — FLL bypassed external
FEI — FLL engaged internal
FEE — FLL engaged external
fext / R
NA
64
(fIRG / 7)* 64 * N / R
fext * P * N / R
Typical fIRG = 243 kHz
Range = 0 ; P = 64
Range = 1; P = 1
1
Ensure that f
, which is equal to f
* R, does not exceed f
.
ICGDCLKmax
ICGDCLK
ICGOUT
Table 10-12. MFD and RFD Decode Table
MFD Value
Multiplication Factor (N)
RFD
Division Factor (R)
000
001
010
011
100
4
6
000
001
010
011
100
÷1
÷2
÷4
÷8
÷16
8
10
12
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
188
Freescale Semiconductor
Chapter 10 Internal Clock Generator (S08ICGV4)
Table 10-12. MFD and RFD Decode Table
101
110
111
14
16
18
101
110
111
÷32
÷64
÷128
10.6.2 Example #1: External Crystal = 32 kHz, Bus Frequency = 4.19 MHz
In this example, the FLL will be used (in FEE mode) to multiply the external 32 kHz oscillator up to
8.38 MHz to achieve 4.19 MHz bus frequency.
After the MCU is released from reset, the ICG is in self-clocked mode (SCM) and supplies approximately
8 MHz on ICGOUT, which corresponds to a 4 MHz bus frequency (f ).
Bus
The clock scheme will be FLL engaged, external (FEE). So
f
= f * P * N / R ; P = 64, f = 32 kHz
ext
Eqn. 10-1
Eqn. 10-2
ICGOUT
ext
Solving for N / R gives:
N / R = 8.38 MHz /(32 kHz * 64) = 4 ; we can choose N = 4 and R =1
The values needed in each register to set up the desired operation are:
ICGC1 = $38 (%00111000)
Bit 7
Bit 6
Bit 5
HGO
RANGE
REFS
0
0
1
11
Configures oscillator for low power
Configures oscillator for low-frequency range; FLL prescale factor is 64
Oscillator using crystal or resonator is requested
FLL engaged, external reference clock mode
Oscillator disabled
Loss-of-clock detection enabled
Unimplemented or reserved, always reads zero
Bits 4:3 CLKS
Bit 2
Bit 1
Bit 0
OSCSTEN 0
LOCD
0
0
ICGC2 = $00 (%00000000)
Bit 7 LOLRE
0
Generates an interrupt request on loss of lock
Bits 6:4 MFD
000 Sets the MFD multiplication factor to 4
Generates an interrupt request on loss of clock
000 Sets the RFD division factor to ÷1
Bit 3
LOCRE
0
Bits 2:0 RFD
ICGS1 = $xx
This is read only except for clearing interrupt flag
ICGS2 = $xx
This is read only; should read DCOS = 1 before performing any time critical tasks
ICGFLTLU/L = $xx
Only needed in self-clocked mode; FLT will be adjusted by loop to give 8.38 MHz DCO clock
Bits 15:12 unused
0000
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
189
Chapter 10 Internal Clock Generator (S08ICGV4)
Bits 11:0 FLT
ICGTRM = $xx
Bits 7:0 TRIM
No need for user initialization
Only need to write when trimming internal oscillator; not used when external
crystal is clock source
Figure 10-14 shows flow charts for three conditions requiring ICG initialization.
QUICK RECOVERY FROM STOP
MINIMUM CURRENT DRAW IN STOP
RESET
RECOVERY FROM STOP
OSCSTEN = 0
RECOVERY FROM STOP
OSCSTEN = 1
INITIALIZE ICG
ICGC1 = $38
ICGC2 = $00
CHECK
NO
CHECK
NO
FLL LOCK STATUS.
FLL LOCK STATUS.
LOCK = 1?
LOCK = 1?
YES
YES
CHECK
FLL LOCK STATUS.
LOCK = 1?
NO
CONTINUE
CONTINUE
YES
CONTINUE
NOTE: THIS WILL REQUIRE THE OSCILLATOR TO START AND
STABILIZE. ACTUAL TIME IS DEPENDENT ON CRYSTAL /RESONATOR
AND EXTERNAL CIRCUITRY.
Figure 10-14. ICG Initialization for FEE in Example #1
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
190
Freescale Semiconductor
Chapter 10 Internal Clock Generator (S08ICGV4)
10.6.3 Example #2: External Crystal = 4 MHz, Bus Frequency = 20 MHz
In this example, the FLL will be used (in FEE mode) to multiply the external 4 MHz oscillator up to
40-MHz to achieve 20 MHz bus frequency.
After the MCU is released from reset, the ICG is in self-clocked mode (SCM) and supplies approximately
8 MHz on ICGOUT which corresponds to a 4 MHz bus frequency (f ).
Bus
During reset initialization software, the clock scheme will be set to FLL engaged, external (FEE). So
f
= f * P * N / R ; P = 1, f = 4.00 MHz
Eqn. 10-3
ICGOUT
ext
ext
Solving for N / R gives:
N / R = 40 MHz /(4 MHz * 1) = 10 ; We can choose N = 10 and R = 1
The values needed in each register to set up the desired operation are:
ICGC1 = $78 (%01111000)
Eqn. 10-4
Bit 7
Bit 6
Bit 5
HGO
RANGE
REFS
0
1
1
Configures oscillator for low power
Configures oscillator for high-frequency range; FLL prescale factor is 1
Requests an oscillator
Bits 4:3 CLKS
11
FLL engaged, external reference clock mode
Disables the oscillator
Loss-of-clock detection enabled
Bit 2
Bit 1
Bit 0
OSCSTEN 0
LOCD
0
0
Unimplemented or reserved, always reads zero
ICGC2 = $30 (%00110000)
Bit 7 LOLRE
0
Generates an interrupt request on loss of lock
Bit 6:4 MFD
011 Sets the MFD multiplication factor to 10
Generates an interrupt request on loss of clock
000 Sets the RFD division factor to ÷1
Bit 3
LOCRE
0
Bit 2:0 RFD
ICGS1 = $xx
This is read only except for clearing interrupt flag
ICGS2 = $xx
This is read only. Should read DCOS before performing any time critical tasks
ICGFLTLU/L = $xx
Not used in this example
ICGTRM
Not used in this example
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
191
Chapter 10 Internal Clock Generator (S08ICGV4)
RECOVERY
FROM STOP
RESET
INITIALIZE ICG
ICGC1 = $7A
ICGC2 = $30
SERVICE INTERRUPT
SOURCE (f
= 4 MHz)
Bus
CHECK
FLL LOCK STATUS
LOCK = 1?
NO
CHECK
FLL LOCK STATUS
LOCK = 1?
NO
YES
YES
CONTINUE
CONTINUE
Figure 10-15. ICG Initialization and Stop Recovery for Example #2
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
192
Freescale Semiconductor
Chapter 10 Internal Clock Generator (S08ICGV4)
10.6.4 Example #3: No External Crystal Connection, 5.4 MHz Bus
Frequency
In this example, the FLL will be used (in FEI mode) to multiply the internal 243 kHz (approximate)
reference clock up to 10.8 MHz to achieve 5.4 MHz bus frequency. This system will also use the trim
function to fine tune the frequency based on an external reference signal.
After the MCU is released from reset, the ICG is in self-clocked mode (SCM) and supplies approximately
8 MHz on ICGOUT which corresponds to a 4 MHz bus frequency (f ).
Bus
The clock scheme will be FLL engaged, internal (FEI). So
f
= (f
/ 7) * P * N / R ; P = 64, f = 243 kHz
IRG
Eqn. 10-5
Eqn. 10-6
ICGOUT
IRG
Solving for N / R gives:
N / R = 10.8 MHz /(243/7 kHz * 64) = 4.86 ; We can choose N = 10 and R = 2.
A trim procedure will be required to hone the frequency to exactly 5.4 MHz. An example of the trim
procedure is shown in example #4.
The values needed in each register to set up the desired operation are:
ICGC1 = $28 (%00101000)
Bit 7
Bit 6
Bit 5
HGO
RANGE
REFS
0
0
1
01
Configures oscillator for low power
Configures oscillator for low-frequency range; FLL prescale factor is 64
Oscillator using crystal or resonator requested (bit is really a don’t care)
FLL engaged, internal reference clock mode
Disables the oscillator
Loss-of-clock enabled
Unimplemented or reserved, always reads zero
Bits 4:3 CLKS
Bit 2
Bit 1
Bit 0
OSCSTEN 0
LOCD
0
0
ICGC2 = $31 (%00110001)
Bit 7 LOLRE
Bit 6:4 MFD
0
Generates an interrupt request on loss of lock
011 Sets the MFD multiplication factor to 10
Generates an interrupt request on loss of clock
001 Sets the RFD division factor to ÷2
Bit 3
LOCRE
0
Bit 2:0 RFD
ICGS1 = $xx
This is read only except for clearing interrupt flag
ICGS2 = $xx
This is read only; good idea to read this before performing time critical operations
ICGFLTLU/L = $xx
Not used in this example
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
193
Chapter 10 Internal Clock Generator (S08ICGV4)
ICGTRM = $xx
Bit 7:0 TRIM
Only need to write when trimming internal oscillator; done in separate
operation (see example #4)
RECOVERY
FROM STOP
RESET
INITIALIZE ICG
ICGC1 = $28
ICGC2 = $31
CHECK
FLL LOCK STATUS.
LOCK = 1?
NO
YES
CHECK
FLL LOCK STATUS.
LOCK = 1?
NO
CONTINUE
YES
CONTINUE
NOTE: THIS WILL REQUIRE THE INTERAL REFERENCE CLOCK TO START AND
STABILIZE.
Figure 10-16. ICG Initialization and Stop Recovery for Example #3
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
194
Freescale Semiconductor
Chapter 10 Internal Clock Generator (S08ICGV4)
10.6.5 Example #4: Internal Clock Generator Trim
The internally generated clock source is guaranteed to have a period 25% of the nominal value. In some
cases, this may be sufficient accuracy. For other applications that require a tight frequency tolerance, a
trimming procedure is provided that will allow a very accurate source. This section outlines one example
of trimming the internal oscillator. Many other possible trimming procedures are valid and can be used.
Initial conditions:
1) Clock supplied from ATE has 500 μsec duty period
2) ICG configured for internal reference with 4 MHz bus
START TRIM PROCEDURE
ICGTRM = $80, n = 1
MEASURE
INCOMING CLOCK WIDTH
(COUNT = # OF BUS CLOCKS / 4)
COUNT < EXPECTED = 500
(RUNNING TOO SLOW)
COUNT = EXPECTED = 500
.
CASE STATEMENT
COUNT > EXPECTED = 500
(RUNNING TOO FAST)
ICGTRM =
ICGTRM - 128 / (2**n)
(DECREASING ICGTRM
INCREASES THE FREQUENCY)
ICGTRM =
STORE ICGTRM VALUE
IN NON-VOLATILE
MEMORY
ICGTRM + 128 / (2**n)
(INCREASING ICGTRM
DECREASES THE FREQUENCY)
CONTINUE
n = n + 1
YES
IS n > 8?
NO
Figure 10-17. Trim Procedure
In this particular case, the MCU has been attached to a PCB and the entire assembly is undergoing final
test with automated test equipment. A separate signal or message is provided to the MCU operating under
user provided software control. The MCU initiates a trim procedure as outlined in Figure 10-17 while the
tester supplies a precision reference signal.
If the intended bus frequency is near the maximum allowed for the device, it is recommended to trim using
a reduction divisor (R) twice the final value. After the trim procedure is complete, the reduction divisor
can be restored. This will prevent accidental overshoot of the maximum clock frequency.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
195
Chapter 10 Internal Clock Generator (S08ICGV4)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
196
Freescale Semiconductor
Chapter 11
Timer Pulse-Width Modulator (S08TPMV2)
11.1 Introduction
The TPM uses one input/output (I/O) pin per channel, TPMxCHn where x is the TPM number (for
example, 1 or 2) and n is the channel number (for example, 0–4). The TPM shares its I/O pins with
general-purpose I/O port pins (refer to the Pins and Connections chapter for more information).
The MC9S08LC60 Series has two TPM modules
Figure 11-1 shows the MC9S08LC60 Series block diagram with the TPMs highlighted.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
197
Chapter 11 Timer Pulse-Width Modulator (S08TPMV2)
HCS08 CORE
ON-CHIP ICE
DEBUG MODULE (DBG)
CPU
INT
ADP[7:4]
ADP3
4
PTA[7:4]/KBI1P[7:4]/ADP[7:4]
12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
ADP2
BKGD
BKP
ADP1
ADP0
HCS08 SYSTEM CONTROL
ACMP–
ACMP+
ANALOG COMPARATOR
PTA3/KBI1P3/ADP3/ACMP–
PTA2/KBI1P2/ADP2/ACMP+
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
(ACMP)
8-BIT KEYBOARD
8
PTA[1:0]/KBI1P[1:0]/ADP[1:0]
INTERRUPT (KBI1)
RTI
COP
LVD
IRQ
SS1
PTB7/KBI2P4/SS1
PTB6/KBI2P3/SPSCK1
SPSCK1
MISO1
SERIAL PERIPHERAL
INTERFACE (SPI1)
USER FLASH A
MOSI1
(LC60 = 32,768 BYTES)
(LC36 = 24,576 BYTES)
SCL
SDA
PTB5/MOSI1/SCL
PTB4/MISO1/SDA
IIC MODULE (IIC)
USER FLASH B
PTB3/KBI2P2
PTB2/RESET
RESET
(LC60 = 28,464 BYTES)
(LC36 = 12,288 BYTES)
5
3
8-BIT KEYBOARD
INTERRUPT (KBI2)
XTAL
EXTAL
USER RAM
PTB1/KBI2P1/XTAL
PTB0/KBI2P0/EXTAL
(LC60 = 4096 BYTES)
(LC36 = 2560 BYTES)
IRQ
PTC7/KBI2P7/IRQ/TPMCLK
PTC6/BKGD/MS
INTERNAL CLOCK
GENERATOR (ICG)
TPM2CH1
TPM2CH0
2-CHANNEL TIMER/PWM
(TPM2)
PTC5/KBI2P6/TPM2CH1
PTC4/KBI2P5/TPM2CH0
TPMCLK
TPM1CH0
TPM1CH1
LOW-POWER OSCILLATOR
2-CHANNEL TIMER/PWM
(TPM1)
V
LCD
SS2
V
LL1
PTC3/SS2/TPM1CH1
SPSCK2
MOSI2
MISO2
V
SERIAL PERIPHERAL
LL2
PTC2/SPSCK2/TPM1CH0
LIQUID CRYSTAL
DISPLAY DRIVER
LCD
INTERFACE (SPI2)
V
LL3
V
V
CAP1
CAP2
TxD
RxD
PTC1/MOSI2/TxD
PTC0/MISO2/RxD
SERIAL COMMUNICATIONS
INTERFACE (SCI)
BP[2:0]
BP3/FP40
FP[39:0]
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pulldown device if IRQ enabled
(IRQPE = 1).
V
DD
VOLTAGE
3. IRQ does not have a clamp diode to V . IRQ should not be driven above V
.
DD
DD
V
4. Pin contains integrated pullup device.
REGULATOR
SS
5. Input-only RESET is shared with output-only PTB2. Default function after reset is
RESET.
6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is
output-only PTC7.
VREFH
VREFL
7. PTC6/BKGD/MS is an output only pin
8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP.
9. ACMPO is not available.
VDDAD
VSSAD
Figure 11-1. MC9S08LC60 Series Block Diagram Highlighting TPM Block and Pins
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
198
Freescale Semiconductor
Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2)
11.1.1 Features
The TPM has the following features:
•
Each TPM may be configured for buffered, center-aligned pulse-width modulation (CPWM) on all
channels
•
•
•
•
•
•
•
Clock sources independently selectable per TPM (multiple TPMs device)
Selectable clock sources (device dependent): bus clock, fixed system clock, external pin
Clock prescaler taps for divide by 1, 2, 4, 8, 16, 32, 64, or 128
16-bit free-running or up/down (CPWM) count operation
16-bit modulus register to control counter range
Timer system enable
One interrupt per channel plus a terminal count interrupt for each TPM module (multiple TPMs
device)
•
Channel features:
— Each channel may be input capture, output compare, or buffered edge-aligned PWM
— Rising-edge, falling-edge, or any-edge input capture trigger
— Set, clear, or toggle output compare action
— Selectable polarity on PWM outputs
11.1.2 Block Diagram
Figure 11-2 shows the structure of a TPM. Some MCUs include more than one TPM, with various
numbers of channels.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
199
Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2)
BUSCLK
CLOCK SOURCE
SELECT
PRESCALE AND SELECT
DIVIDE BY
XCLK
OFF, BUS, XCLK, EXT
1, 2, 4, 8, 16, 32, 64, or 128
SYNC
TPMxCLK
PS2
PS1
PS0
CLKSB
CLKSA
CPWMS
MAIN 16-BIT COUNTER
TOF
TOIE
INTERRUPT
LOGIC
COUNTER RESET
16-BIT COMPARATOR
TPMxMODH:TPMxMODL
ELS0B ELS0A
CHANNEL 0
PORT
LOGIC
TPMxCH0
16-BIT COMPARATOR
TPMxC0VH:TPMxC0VL
CH0F
INTERRUPT
LOGIC
16-BIT LATCH
CH0IE
MS0B
MS0A
ELS1B ELS1A
CHANNEL 1
16-BIT COMPARATOR
TPMxC1VH:TPMxC1VL
16-BIT LATCH
TPMxCH1
PORT
LOGIC
CH1F
INTERRUPT
LOGIC
CH1IE
MS1B
MS1A
ELSnB ELSnA
CHANNEL n
TPMxCHn
PORT
LOGIC
16-BIT COMPARATOR
TPMxCnVH:TPMxCnVL
CHnF
INTERRUPT
LOGIC
16-BIT LATCH
CHnIE
MSnA
MSnB
Figure 11-2. TPM Block Diagram
The central component of the TPM is the 16-bit counter that can operate as a free-running counter, a
modulo counter, or an up-/down-counter when the TPM is configured for center-aligned PWM. The TPM
counter (when operating in normal up-counting mode) provides the timing reference for the input capture,
output compare, and edge-aligned PWM functions. The timer counter modulo registers,
TPMxMODH:TPMxMODL, control the modulo value of the counter. (The values 0x0000 or 0xFFFF
effectively make the counter free running.) Software can read the counter value at any time without
affecting the counting sequence. Any write to either byte of the TPMxCNT counter resets the counter
regardless of the data value written.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
200
Freescale Semiconductor
Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2)
All TPM channels are programmable independently as input capture, output compare, or buffered
edge-aligned PWM channels.
11.2 External Signal Description
When any pin associated with the timer is configured as a timer input, a passive pullup can be enabled.
After reset, the TPM modules are disabled and all pins default to general-purpose inputs with the passive
pullups disabled.
11.2.1 External TPM Clock Sources
When control bits CLKSB:CLKSA in the timer status and control register are set to 1:1, the prescaler and
consequently the 16-bit counter for TPMx are driven by an external clock source, TPMxCLK, connected
to an I/O pin. A synchronizer is needed between the external clock and the rest of the TPM. This
synchronizer is clocked by the bus clock so the frequency of the external source must be less than one-half
the frequency of the bus rate clock. The upper frequency limit for this external clock source is specified to
be one-fourth the bus frequency to conservatively accommodate duty cycle and phase-locked loop (PLL)
or frequency-locked loop (FLL) frequency jitter effects.
On some devices the external clock input is shared with one of the TPM channels. When a TPM channel
is shared as the external clock input, the associated TPM channel cannot use the pin. (The channel can still
be used in output compare mode as a software timer.) Also, if one of the TPM channels is used as the
external clock input, the corresponding ELSnB:ELSnA control bits must be set to 0:0 so the channel is not
trying to use the same pin.
11.2.2 TPMxCHn — TPMx Channel n I/O Pins
Each TPM channel is associated with an I/O pin on the MCU. The function of this pin depends on the
configuration of the channel. In some cases, no pin function is needed so the pin reverts to being controlled
by general-purpose I/O controls. When a timer has control of a port pin, the port data and data direction
registers do not affect the related pin(s). See the Pins and Connections chapter for additional information
about shared pin functions.
11.3 Register Definition
The TPM includes:
•
•
•
An 8-bit status and control register (TPMxSC)
A 16-bit counter (TPMxCNTH:TPMxCNTL)
A 16-bit modulo register (TPMxMODH:TPMxMODL)
Each timer channel has:
•
•
An 8-bit status and control register (TPMxCnSC)
A 16-bit channel value register (TPMxCnVH:TPMxCnVL)
Refer to the direct-page register summary in the Memory chapter of this data sheet for the absolute address
assignments for all TPM registers. This section refers to registers and control bits only by their names. A
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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201
Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2)
Freescale-provided equate or header file is used to translate these names into the appropriate absolute
addresses.
Some MCU systems have more than one TPM, so register names include placeholder characters to identify
which TPM and which channel is being referenced. For example, TPMxCnSC refers to timer (TPM) x,
channel n and TPM1C2SC is the status and control register for timer 1, channel 2.
11.3.1 Timer x Status and Control Register (TPMxSC)
TPMxSC contains the overflow status flag and control bits that are used to configure the interrupt enable,
TPM configuration, clock source, and prescale divisor. These controls relate to all channels within this
timer module.
7
6
5
4
3
2
1
0
R
W
TOF
TOIE
CPWMS
CLKSB
CLKSA
PS2
PS1
PS0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-3. Timer x Status and Control Register (TPMxSC)
Table 11-1. TPMxSC Register Field Descriptions
Description
Field
7
TOF
Timer Overflow Flag — This flag is set when the TPM counter changes to 0x0000 after reaching the modulo
value programmed in the TPM counter modulo registers. When the TPM is configured for CPWM, TOF is set
after the counter has reached the value in the modulo register, at the transition to the next lower count value.
Clear TOF by reading the TPM status and control register when TOF is set and then writing a 0 to TOF. If another
TPM overflow occurs before the clearing sequence is complete, the sequence is reset so TOF would remain set
after the clear sequence was completed for the earlier TOF. Reset clears TOF. Writing a 1 to TOF has no effect.
0 TPM counter has not reached modulo value or overflow
1 TPM counter has overflowed
6
Timer Overflow Interrupt Enable — This read/write bit enables TPM overflow interrupts. If TOIE is set, an
interrupt is generated when TOF equals 1. Reset clears TOIE.
0 TOF interrupts inhibited (use software polling)
TOIE
1 TOF interrupts enabled
5
Center-Aligned PWM Select — This read/write bit selects CPWM operating mode. Reset clears this bit so the
TPM operates in up-counting mode for input capture, output compare, and edge-aligned PWM functions. Setting
CPWMS reconfigures the TPM to operate in up-/down-counting mode for CPWM functions. Reset clears
CPWMS.
CPWMS
0 All TPMx channels operate as input capture, output compare, or edge-aligned PWM mode as selected by the
MSnB:MSnA control bits in each channel’s status and control register
1 All TPMx channels operate in center-aligned PWM mode
4:3
Clock Source Select — As shown in Table 11-2, this 2-bit field is used to disable the TPM system or select one
CLKS[B:A] of three clock sources to drive the counter prescaler. The external source and the XCLK are synchronized to the
bus clock by an on-chip synchronization circuit.
2:0
PS[2:0]
Prescale Divisor Select — This 3-bit field selects one of eight divisors for the TPM clock input as shown in
Table 11-3. This prescaler is located after any clock source synchronization or clock source selection, so it affects
whatever clock source is selected to drive the TPM system.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
202
Freescale Semiconductor
Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2)
Table 11-2. TPM Clock Source Selection
CLKSB:CLKSA
TPM Clock Source to Prescaler Input
0:0
0:1
1:0
1:1
No clock selected (TPMx disabled)
Bus rate clock (BUSCLK)
Fixed system clock (XCLK)
External source (TPMxCLK)1,2
1
2
The maximum frequency that is allowed as an external clock is one-fourth of the bus
frequency.
If the external clock input is shared with channel n and is selected as the TPM clock source,
the corresponding ELSnB:ELSnA control bits should be set to 0:0 so channel n does not try
to use the same pin for a conflicting function.
Table 11-3. Prescale Divisor Selection
PS2:PS1:PS0
TPM Clock Source Divided-By
0:0:0
0:0:1
0:1:0
0:1:1
1:0:0
1:0:1
1:1:0
1:1:1
1
2
4
8
16
32
64
128
11.3.2 Timer x Counter Registers (TPMxCNTH:TPMxCNTL)
The two read-only TPM counter registers contain the high and low bytes of the value in the TPM counter.
Reading either byte (TPMxCNTH or TPMxCNTL) latches the contents of both bytes into a buffer where
they remain latched until the other byte is read. This allows coherent 16-bit reads in either order. The
coherency mechanism is automatically restarted by an MCU reset, a write of any value to TPMxCNTH or
TPMxCNTL, or any write to the timer status/control register (TPMxSC).
Reset clears the TPM counter registers.
7
6
5
4
3
2
1
0
R
W
Bit 15
14
13
12
11
10
9
Bit 8
Any write to TPMxCNTH clears the 16-bit counter.
Reset
0
0
0
0
0
0
0
0
Figure 11-4. Timer x Counter Register High (TPMxCNTH)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
203
Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2)
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Any write to TPMxCNTL clears the 16-bit counter.
Reset
0
0
0
0
0
0
0
0
Figure 11-5. Timer x Counter Register Low (TPMxCNTL)
When background mode is active, the timer counter and the coherency mechanism are frozen such that the
buffer latches remain in the state they were in when the background mode became active even if one or
both bytes of the counter are read while background mode is active.
11.3.3 Timer x Counter Modulo Registers (TPMxMODH:TPMxMODL)
The read/write TPM modulo registers contain the modulo value for the TPM counter. After the TPM
counter reaches the modulo value, the TPM counter resumes counting from 0x0000 at the next clock
(CPWMS = 0) or starts counting down (CPWMS = 1), and the overflow flag (TOF) becomes set. Writing
to TPMxMODH or TPMxMODL inhibits TOF and overflow interrupts until the other byte is written. Reset
sets the TPM counter modulo registers to 0x0000, which results in a free-running timer counter (modulo
disabled).
7
6
5
4
3
2
1
0
R
W
Bit 15
14
13
12
11
10
9
Bit 8
Reset
0
0
0
0
0
0
0
0
Figure 11-6. Timer x Counter Modulo Register High (TPMxMODH)
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 11-7. Timer x Counter Modulo Register Low (TPMxMODL)
It is good practice to wait for an overflow interrupt so both bytes of the modulo register can be written well
before a new overflow. An alternative approach is to reset the TPM counter before writing to the TPM
modulo registers to avoid confusion about when the first counter overflow will occur.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
204
Freescale Semiconductor
Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2)
11.3.4 Timer x Channel n Status and Control Register (TPMxCnSC)
TPMxCnSC contains the channel interrupt status flag and control bits that are used to configure the
interrupt enable, channel configuration, and pin function.
7
6
5
4
3
2
1
0
R
W
0
0
CHnF
CHnIE
MSnB
MSnA
ELSnB
ELSnA
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-8. Timer x Channel n Status and Control Register (TPMxCnSC)
Table 11-4. TPMxCnSC Register Field Descriptions
Description
Field
7
Channel n Flag — When channel n is configured for input capture, this flag bit is set when an active edge occurs
on the channel n pin. When channel n is an output compare or edge-aligned PWM channel, CHnF is set when
the value in the TPM counter registers matches the value in the TPM channel n value registers. This flag is
seldom used with center-aligned PWMs because it is set every time the counter matches the channel value
register, which correspond to both edges of the active duty cycle period.
CHnF
A corresponding interrupt is requested when CHnF is set and interrupts are enabled (CHnIE = 1). Clear CHnF
by reading TPMxCnSC while CHnF is set and then writing a 0 to CHnF. If another interrupt request occurs before
the clearing sequence is complete, the sequence is reset so CHnF would remain set after the clear sequence
was completed for the earlier CHnF. This is done so a CHnF interrupt request cannot be lost by clearing a
previous CHnF. Reset clears CHnF. Writing a 1 to CHnF has no effect.
0 No input capture or output compare event occurred on channel n
1 Input capture or output compare event occurred on channel n
6
Channel n Interrupt Enable — This read/write bit enables interrupts from channel n. Reset clears CHnIE.
0 Channel n interrupt requests disabled (use software polling)
CHnIE
1 Channel n interrupt requests enabled
5
Mode Select B for TPM Channel n — When CPWMS = 0, MSnB = 1 configures TPM channel n for
MSnB
edge-aligned PWM mode. For a summary of channel mode and setup controls, refer to Table 11-5.
4
Mode Select A for TPM Channel n — When CPWMS = 0 and MSnB = 0, MSnA configures TPM channel n for
input capture mode or output compare mode. Refer to Table 11-5 for a summary of channel mode and setup
controls.
MSnA
3:2
Edge/Level Select Bits — Depending on the operating mode for the timer channel as set by
ELSn[B:A] CPWMS:MSnB:MSnA and shown in Table 11-5, these bits select the polarity of the input edge that triggers an
input capture event, select the level that will be driven in response to an output compare match, or select the
polarity of the PWM output.
Setting ELSnB:ELSnA to 0:0 configures the related timer pin as a general-purpose I/O pin unrelated to any timer
channel functions. This function is typically used to temporarily disable an input capture channel or to make the
timer pin available as a general-purpose I/O pin when the associated timer channel is set up as a software timer
that does not require the use of a pin.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
205
Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2)
Table 11-5. Mode, Edge, and Level Selection
CPWMS
MSnB:MSnA
ELSnB:ELSnA
Mode
Configuration
X
XX
00
Pin not used for TPM channel; use as an external clock for the TPM or
revert to general-purpose I/O
0
00
01
01
10
11
00
01
10
11
10
X1
10
X1
Input capture
Capture on rising edge only
Capture on falling edge only
Capture on rising or falling edge
Software compare only
Output
compare
Toggle output on compare
Clear output on compare
Set output on compare
1X
XX
Edge-aligned
PWM
High-true pulses (clear output on compare)
Low-true pulses (set output on compare)
1
Center-aligned High-true pulses (clear output on compare-up)
PWM
Low-true pulses (set output on compare-up)
If the associated port pin is not stable for at least two bus clock cycles before changing to input capture
mode, it is possible to get an unexpected indication of an edge trigger. Typically, a program would clear
status flags after changing channel configuration bits and before enabling channel interrupts or using the
status flags to avoid any unexpected behavior.
11.3.5 Timer x Channel Value Registers (TPMxCnVH:TPMxCnVL)
These read/write registers contain the captured TPM counter value of the input capture function or the
output compare value for the output compare or PWM functions. The channel value registers are cleared
by reset.
7
6
5
4
3
2
1
0
R
W
Bit 15
14
13
12
11
10
9
Bit 8
Reset
0
0
0
0
0
0
0
0
Figure 11-9. Timer x Channel Value Register High (TPMxCnVH)
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 11-10. Timer Channel Value Register Low (TPMxCnVL)
In input capture mode, reading either byte (TPMxCnVH or TPMxCnVL) latches the contents of both bytes
into a buffer where they remain latched until the other byte is read. This latching mechanism also resets
(becomes unlatched) when the TPMxCnSC register is written.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
206
Freescale Semiconductor
Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2)
In output compare or PWM modes, writing to either byte (TPMxCnVH or TPMxCnVL) latches the value
into a buffer. When both bytes have been written, they are transferred as a coherent 16-bit value into the
timer channel value registers. This latching mechanism may be manually reset by writing to the
TPMxCnSC register.
This latching mechanism allows coherent 16-bit writes in either order, which is friendly to various
compiler implementations.
11.4 Functional Description
All TPM functions are associated with a main 16-bit counter that allows flexible selection of the clock
source and prescale divisor. A 16-bit modulo register also is associated with the main 16-bit counter in the
TPM. Each TPM channel is optionally associated with an MCU pin and a maskable interrupt function.
The TPM has center-aligned PWM capabilities controlled by the CPWMS control bit in TPMxSC. When
CPWMS is set to 1, timer counter TPMxCNT changes to an up-/down-counter and all channels in the
associated TPM act as center-aligned PWM channels. When CPWMS = 0, each channel can
independently be configured to operate in input capture, output compare, or buffered edge-aligned PWM
mode.
The following sections describe the main 16-bit counter and each of the timer operating modes (input
capture, output compare, edge-aligned PWM, and center-aligned PWM). Because details of pin operation
and interrupt activity depend on the operating mode, these topics are covered in the associated mode
sections.
11.4.1 Counter
All timer functions are based on the main 16-bit counter (TPMxCNTH:TPMxCNTL). This section
discusses selection of the clock source, up-counting vs. up-/down-counting, end-of-count overflow, and
manual counter reset.
After any MCU reset, CLKSB:CLKSA = 0:0 so no clock source is selected and the TPM is inactive.
Normally, CLKSB:CLKSA would be set to 0:1 so the bus clock drives the timer counter. The clock source
for each of the TPM can be independently selected to be off, the bus clock (BUSCLK), the fixed system
clock (XCLK), or an external input. The maximum frequency allowed for the external clock option is
one-fourth the bus rate. Refer to Section 11.3.1, “Timer x Status and Control Register (TPMxSC)” and
Table 11-2 for more information about clock source selection.
When the microcontroller is in active background mode, the TPM temporarily suspends all counting until
the microcontroller returns to normal user operating mode. During stop mode, all TPM clocks are stopped;
therefore, the TPM is effectively disabled until clocks resume. During wait mode, the TPM continues to
operate normally.
The main 16-bit counter has two counting modes. When center-aligned PWM is selected (CPWMS = 1),
the counter operates in up-/down-counting mode. Otherwise, the counter operates as a simple up-counter.
As an up-counter, the main 16-bit counter counts from 0x0000 through its terminal count and then
continues with 0x0000. The terminal count is 0xFFFF or a modulus value in TPMxMODH:TPMxMODL.
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Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2)
When center-aligned PWM operation is specified, the counter counts upward from 0x0000 through its
terminal count and then counts downward to 0x0000 where it returns to up-counting. Both 0x0000 and the
terminal count value (value in TPMxMODH:TPMxMODL) are normal length counts (one timer clock
period long).
An interrupt flag and enable are associated with the main 16-bit counter. The timer overflow flag (TOF) is
a software-accessible indication that the timer counter has overflowed. The enable signal selects between
software polling (TOIE = 0) where no hardware interrupt is generated, or interrupt-driven operation
(TOIE = 1) where a static hardware interrupt is automatically generated whenever the TOF flag is 1.
The conditions that cause TOF to become set depend on the counting mode (up or up/down). In
up-counting mode, the main 16-bit counter counts from 0x0000 through 0xFFFF and overflows to 0x0000
on the next counting clock. TOF becomes set at the transition from 0xFFFF to 0x0000. When a modulus
limit is set, TOF becomes set at the transition from the value set in the modulus register to 0x0000. When
the main 16-bit counter is operating in up-/down-counting mode, the TOF flag gets set as the counter
changes direction at the transition from the value set in the modulus register and the next lower count value.
This corresponds to the end of a PWM period. (The 0x0000 count value corresponds to the center of a
period.)
Because the HCS08 MCU is an 8-bit architecture, a coherency mechanism is built into the timer counter
for read operations. Whenever either byte of the counter is read (TPMxCNTH or TPMxCNTL), both bytes
are captured into a buffer so when the other byte is read, the value will represent the other byte of the count
at the time the first byte was read. The counter continues to count normally, but no new value can be read
from either byte until both bytes of the old count have been read.
The main timer counter can be reset manually at any time by writing any value to either byte of the timer
count TPMxCNTH or TPMxCNTL. Resetting the counter in this manner also resets the coherency
mechanism in case only one byte of the counter was read before resetting the count.
11.4.2 Channel Mode Selection
Provided CPWMS = 0 (center-aligned PWM operation is not specified), the MSnB and MSnA control bits
in the channel n status and control registers determine the basic mode of operation for the corresponding
channel. Choices include input capture, output compare, and buffered edge-aligned PWM.
11.4.2.1 Input Capture Mode
With the input capture function, the TPM can capture the time at which an external event occurs. When an
active edge occurs on the pin of an input capture channel, the TPM latches the contents of the TPM counter
into the channel value registers (TPMxCnVH:TPMxCnVL). Rising edges, falling edges, or any edge may
be chosen as the active edge that triggers an input capture.
When either byte of the 16-bit capture register is read, both bytes are latched into a buffer to support
coherent 16-bit accesses regardless of order. The coherency sequence can be manually reset by writing to
the channel status/control register (TPMxCnSC).
An input capture event sets a flag bit (CHnF) that can optionally generate a CPU interrupt request.
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11.4.2.2 Output Compare Mode
With the output compare function, the TPM can generate timed pulses with programmable position,
polarity, duration, and frequency. When the counter reaches the value in the channel value registers of an
output compare channel, the TPM can set, clear, or toggle the channel pin.
In output compare mode, values are transferred to the corresponding timer channel value registers only
after both 8-bit bytes of a 16-bit register have been written. This coherency sequence can be manually reset
by writing to the channel status/control register (TPMxCnSC).
An output compare event sets a flag bit (CHnF) that can optionally generate a CPU interrupt request.
11.4.2.3 Edge-Aligned PWM Mode
This type of PWM output uses the normal up-counting mode of the timer counter (CPWMS = 0) and can
be used when other channels in the same TPM are configured for input capture or output compare
functions. The period of this PWM signal is determined by the setting in the modulus register
(TPMxMODH:TPMxMODL). The duty cycle is determined by the setting in the timer channel value
register (TPMxCnVH:TPMxCnVL). The polarity of this PWM signal is determined by the setting in the
ELSnA control bit. Duty cycle cases of 0 percent and 100 percent are possible.
As Figure 11-11 shows, the output compare value in the TPM channel registers determines the pulse width
(duty cycle) of the PWM signal. The time between the modulus overflow and the output compare is the
pulse width. If ELSnA = 0, the counter overflow forces the PWM signal high and the output compare
forces the PWM signal low. If ELSnA = 1, the counter overflow forces the PWM signal low and the output
compare forces the PWM signal high.
OVERFLOW
OVERFLOW
OVERFLOW
PERIOD
PULSE
WIDTH
TPMxC
OUTPUT
COMPARE
OUTPUT
COMPARE
OUTPUT
COMPARE
Figure 11-11. PWM Period and Pulse Width (ELSnA = 0)
When the channel value register is set to 0x0000, the duty cycle is 0 percent. By setting the timer channel
value register (TPMxCnVH:TPMxCnVL) to a value greater than the modulus setting, 100% duty cycle
can be achieved. This implies that the modulus setting must be less than 0xFFFF to get 100% duty cycle.
Because the HCS08 is a family of 8-bit MCUs, the settings in the timer channel registers are buffered to
ensure coherent 16-bit updates and to avoid unexpected PWM pulse widths. Writes to either register,
TPMxCnVH or TPMxCnVL, write to buffer registers. In edge-PWM mode, values are transferred to the
corresponding timer channel registers only after both 8-bit bytes of a 16-bit register have been written and
the value in the TPMxCNTH:TPMxCNTL counter is 0x0000. (The new duty cycle does not take effect
until the next full period.)
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Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2)
11.4.3 Center-Aligned PWM Mode
This type of PWM output uses the up-/down-counting mode of the timer counter (CPWMS = 1). The
output compare value in TPMxCnVH:TPMxCnVL determines the pulse width (duty cycle) of the PWM
signal and the period is determined by the value in TPMxMODH:TPMxMODL.
TPMxMODH:TPMxMODL should be kept in the range of 0x0001 to 0x7FFF because values outside this
range can produce ambiguous results. ELSnA will determine the polarity of the CPWM output.
pulse width = 2 x (TPMxCnVH:TPMxCnVL)
Eqn. 11-1
period = 2 x (TPMxMODH:TPMxMODL);
for TPMxMODH:TPMxMODL = 0x0001–0x7FFF
Eqn. 11-2
If the channel value register TPMxCnVH:TPMxCnVL is zero or negative (bit 15 set), the duty cycle will
be 0%. If TPMxCnVH:TPMxCnVL is a positive value (bit 15 clear) and is greater than the (nonzero)
modulus setting, the duty cycle will be 100% because the duty cycle compare will never occur. This
implies the usable range of periods set by the modulus register is 0x0001 through 0x7FFE (0x7FFF if
generation of 100% duty cycle is not necessary). This is not a significant limitation because the resulting
period is much longer than required for normal applications.
TPMxMODH:TPMxMODL = 0x0000 is a special case that should not be used with center-aligned PWM
mode. When CPWMS = 0, this case corresponds to the counter running free from 0x0000 through
0xFFFF, but when CPWMS = 1 the counter needs a valid match to the modulus register somewhere other
than at 0x0000 in order to change directions from up-counting to down-counting.
Figure 11-12 shows the output compare value in the TPM channel registers (multiplied by 2), which
determines the pulse width (duty cycle) of the CPWM signal. If ELSnA = 0, the compare match while
counting up forces the CPWM output signal low and a compare match while counting down forces the
output high. The counter counts up until it reaches the modulo setting in TPMxMODH:TPMxMODL, then
counts down until it reaches zero. This sets the period equal to two times TPMxMODH:TPMxMODL.
COUNT = 0
OUTPUT
COMPARE
(COUNT UP)
OUTPUT
COMPARE
(COUNT DOWN)
COUNT =
TPMxMODH:TPMx
COUNT =
TPMxMODH:TPMx
TPM1C
PULSE WIDTH
PERIOD
2 x
2 x
Figure 11-12. CPWM Period and Pulse Width (ELSnA = 0)
Center-aligned PWM outputs typically produce less noise than edge-aligned PWMs because fewer I/O pin
transitions are lined up at the same system clock edge. This type of PWM is also required for some types
of motor drives.
Because the HCS08 is a family of 8-bit MCUs, the settings in the timer channel registers are buffered to
ensure coherent 16-bit updates and to avoid unexpected PWM pulse widths. Writes to any of the registers,
TPMxMODH, TPMxMODL, TPMxCnVH, and TPMxCnVL, actually write to buffer registers. Values are
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Chapter 11 Timer/Pulse-Width Modulator (S08TPMV2)
transferred to the corresponding timer channel registers only after both 8-bit bytes of a 16-bit register have
been written and the timer counter overflows (reverses direction from up-counting to down-counting at the
end of the terminal count in the modulus register). This TPMxCNT overflow requirement only applies to
PWM channels, not output compares.
Optionally, when TPMxCNTH:TPMxCNTL = TPMxMODH:TPMxMODL, the TPM can generate a TOF
interrupt at the end of this count. The user can choose to reload any number of the PWM buffers, and they
will all update simultaneously at the start of a new period.
Writing to TPMxSC cancels any values written to TPMxMODH and/or TPMxMODL and resets the
coherency mechanism for the modulo registers. Writing to TPMxCnSC cancels any values written to the
channel value registers and resets the coherency mechanism for TPMxCnVH:TPMxCnVL.
11.5 TPM Interrupts
The TPM generates an optional interrupt for the main counter overflow and an interrupt for each channel.
The meaning of channel interrupts depends on the mode of operation for each channel. If the channel is
configured for input capture, the interrupt flag is set each time the selected input capture edge is
recognized. If the channel is configured for output compare or PWM modes, the interrupt flag is set each
time the main timer counter matches the value in the 16-bit channel value register. See the Resets,
Interrupts, and System Configuration chapter for absolute interrupt vector addresses, priority, and local
interrupt mask control bits.
For each interrupt source in the TPM, a flag bit is set on recognition of the interrupt condition such as timer
overflow, channel input capture, or output compare events. This flag may be read (polled) by software to
verify that the action has occurred, or an associated enable bit (TOIE or CHnIE) can be set to enable
hardware interrupt generation. While the interrupt enable bit is set, a static interrupt will be generated
whenever the associated interrupt flag equals 1. It is the responsibility of user software to perform a
sequence of steps to clear the interrupt flag before returning from the interrupt service routine.
11.5.1 Clearing Timer Interrupt Flags
TPM interrupt flags are cleared by a 2-step process that includes a read of the flag bit while it is set (1)
followed by a write of 0 to the bit. If a new event is detected between these two steps, the sequence is reset
and the interrupt flag remains set after the second step to avoid the possibility of missing the new event.
11.5.2 Timer Overflow Interrupt Description
The conditions that cause TOF to become set depend on the counting mode (up or up/down). In
up-counting mode, the 16-bit timer counter counts from 0x0000 through 0xFFFF and overflows to 0x0000
on the next counting clock. TOF becomes set at the transition from 0xFFFF to 0x0000. When a modulus
limit is set, TOF becomes set at the transition from the value set in the modulus register to 0x0000. When
the counter is operating in up-/down-counting mode, the TOF flag gets set as the counter changes direction
at the transition from the value set in the modulus register and the next lower count value. This corresponds
to the end of a PWM period. (The 0x0000 count value corresponds to the center of a period.)
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11.5.3 Channel Event Interrupt Description
The meaning of channel interrupts depends on the current mode of the channel (input capture, output
compare, edge-aligned PWM, or center-aligned PWM).
When a channel is configured as an input capture channel, the ELSnB:ELSnA control bits select rising
edges, falling edges, any edge, or no edge (off) as the edge that triggers an input capture event. When the
selected edge is detected, the interrupt flag is set. The flag is cleared by the 2-step sequence described in
Section 11.5.1, “Clearing Timer Interrupt Flags.”
When a channel is configured as an output compare channel, the interrupt flag is set each time the main
timer counter matches the 16-bit value in the channel value register. The flag is cleared by the 2-step
sequence described in Section 11.5.1, “Clearing Timer Interrupt Flags.”
11.5.4 PWM End-of-Duty-Cycle Events
For channels that are configured for PWM operation, there are two possibilities:
•
When the channel is configured for edge-aligned PWM, the channel flag is set when the timer
counter matches the channel value register that marks the end of the active duty cycle period.
•
When the channel is configured for center-aligned PWM, the timer count matches the channel
value register twice during each PWM cycle. In this CPWM case, the channel flag is set at the start
and at the end of the active duty cycle, which are the times when the timer counter matches the
channel value register.
The flag is cleared by the 2-step sequence described in Section 11.5.1, “Clearing Timer Interrupt Flags.”
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Chapter 12
Serial Communications Interface (S08SCIV3)
12.1 Introduction
Figure 12-1 shows the MC9S08LC60 Series block diagram with the SCI highlighted.
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Chapter 12 Serial Communications Interface (S08SCIV3)
HCS08 CORE
ON-CHIP ICE
DEBUG MODULE (DBG)
CPU
INT
ADP[7:4]
ADP3
4
PTA[7:4]/KBI1P[7:4]/ADP[7:4]
12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
ADP2
BKGD
BKP
ADP1
ADP0
HCS08 SYSTEM CONTROL
ACMP–
ACMP+
ANALOG COMPARATOR
PTA3/KBI1P3/ADP3/ACMP–
PTA2/KBI1P2/ADP2/ACMP+
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
(ACMP)
8-BIT KEYBOARD
8
PTA[1:0]/KBI1P[1:0]/ADP[1:0]
INTERRUPT (KBI1)
RTI
COP
LVD
IRQ
SS1
PTB7/KBI2P4/SS1
PTB6/KBI2P3/SPSCK1
SPSCK1
MISO1
SERIAL PERIPHERAL
INTERFACE (SPI1)
USER FLASH A
MOSI1
(LC60 = 32,768 BYTES)
(LC36 = 24,576 BYTES)
SCL
SDA
PTB5/MOSI1/SCL
PTB4/MISO1/SDA
IIC MODULE (IIC)
USER FLASH B
PTB3/KBI2P2
PTB2/RESET
RESET
(LC60 = 28,464 BYTES)
(LC36 = 12,288 BYTES)
5
3
8-BIT KEYBOARD
INTERRUPT (KBI2)
XTAL
EXTAL
USER RAM
PTB1/KBI2P1/XTAL
PTB0/KBI2P0/EXTAL
(LC60 = 4096 BYTES)
(LC36 = 2560 BYTES)
IRQ
PTC7/KBI2P7/IRQ/TPMCLK
PTC6/BKGD/MS
INTERNAL CLOCK
GENERATOR (ICG)
TPM2CH1
TPM2CH0
2-CHANNEL TIMER/PWM
PTC5/KBI2P6/TPM2CH1
PTC4/KBI2P5/TPM2CH0
(TPM2)
TPMCLK
TPM1CH0
TPM1CH1
LOW-POWER OSCILLATOR
2-CHANNEL TIMER/PWM
(TPM1)
V
LCD
SS2
V
LL1
PTC3/SS2/TPM1CH1
SPSCK2
MOSI2
MISO2
V
SERIAL PERIPHERAL
LL2
PTC2/SPSCK2/TPM1CH0
LIQUID CRYSTAL
DISPLAY DRIVER
LCD
INTERFACE (SPI2)
V
LL3
V
V
CAP1
CAP2
TxD
RxD
PTC1/MOSI2/TxD
PTC0/MISO2/RxD
SERIAL COMMUNICATIONS
INTERFACE (SCI)
BP[2:0]
BP3/FP40
FP[39:0]
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pulldown device if IRQ enabled
(IRQPE = 1).
V
DD
VOLTAGE
3. IRQ does not have a clamp diode to V . IRQ should not be driven above V
.
DD
DD
V
4. Pin contains integrated pullup device.
REGULATOR
SS
5. Input-only RESET is shared with output-only PTB2. Default function after reset is
RESET.
6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is
output-only PTC7.
VREFH
VREFL
7. PTC6/BKGD/MS is an output only pin
8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP.
9. ACMPO is not available.
VDDAD
VSSAD
Figure 12-1. MC9S08LC60 Series Block Diagram Highlighting SCI Block and Pins
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Chapter 12 Serial Communications Interface (S08SCIV3)
Module Initialization:
Write:
Write:
Write;
SCIBDH:SCIBDL
SCFC1
to set
baud rate
to configure
to configure
1-wire/2-wire, 9/8-bit data, wakeup, and parity, if used.
SCIC2
interrupts, enable Rx and Tx, RWU
Enable Rx wakeup, SBK sends break character
Write:
SCIC3
to enable
Rx error interrupt sources. Also controls pin direction in
1-wire modes. R8 and T8 only used in 9-bit data modes.
Module Use:
Wait for TDRE, then write data to SCID
Wait for RDRF, then read data from SCID
A small number of applications will use RWU to manage automatic receiver wakeup, SBK to send break characters, and
R8 and T8 for 9-bit data.
SBR12
SBR4
SBR11
SBR3
SBR10
SBR2
SBR9
SBR1
SBR8
SBR0
SCIBDH
SCIBDL
SBR7
SBR6
SBR5
Baud rate = BUSCLK / (16 x SBR12:SBR0)
LOOPS SCISWAI
Module configuration
RSRC
M
WAKE
TE
ILT
RE
PE
PT
SCIC1
SCIC2
TIE
TCIE
RIE
ILIE
RWU
SBK
Local interrupt enables Tx and Rx enable
Rx wakeup and send break
TDRE
TC
RDRF
IDLE
OR
NF
FE
PF
SCIS1
SCIS2
Interrupt flags
Rx error flags
BRK13
RAF
Configure LIN support options and monitor receiver activity
R8
T8
TXDIR
ORIE
NEIE
FEIE
PEIE
TXINV
SCIS3
SCIID
Local interrupt enables
9th data bits
Rx/Tx pin
Tx data path
direction in polarity
single-wire
mode
R7/T7
R6/T6
R5/T5
R4/T4
R3/T3
R2/T2
R1/T1
R0/T0
Read: Rx data; write: Tx data
Figure 12-2. SCI Module Quick Start
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Chapter 12 Serial Communications Interface (S08SCIV3)
12.1.1 Features
Features of SCI module include:
•
•
•
•
Full-duplex, standard non-return-to-zero (NRZ) format
Double-buffered transmitter and receiver with separate enables
Programmable baud rates (13-bit modulo divider)
Interrupt-driven or polled operation:
— Transmit data register empty and transmission complete
— Receive data register full
— Receive overrun, parity error, framing error, and noise error
— Idle receiver detect
•
•
•
•
•
Hardware parity generation and checking
Programmable 8-bit or 9-bit character length
Receiver wakeup by idle-line or address-mark
Optional 13-bit break character
Selectable transmitter output polarity
12.1.2 Modes of Operation
See Section 12.3, “Functional Description,” for a detailed description of SCI operation in the different
modes.
•
•
•
•
8- and 9- bit data modes
Stop modes — SCI is halted during all stop modes
Loop mode
Single-wire mode
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Chapter 12 Serial Communications Interface (S08SCIV3)
12.1.3 Block Diagram
Figure 12-3 shows the transmitter portion of the SCI. (Figure 12-4 shows the receiver portion of the SCI.)
INTERNAL BUS
(WRITE-ONLY)
LOOPS
SCID – Tx BUFFER
RSRC
LOOP
TO RECEIVE
CONTROL
DATA IN
M
11-BIT TRANSMIT SHIFT REGISTER
H
8
7
6
5
4
3
2
1
0
L
TO TxD PIN
1 × BAUD
RATE CLOCK
SHIFT DIRECTION
TXINV
T8
PE
PT
PARITY
GENERATION
SCI CONTROLS TxD
TxD DIRECTION
TE
SBK
TO TxD
PIN LOGIC
TRANSMIT CONTROL
TXDIR
BRK13
TDRE
TIE
Tx INTERRUPT
REQUEST
TC
TCIE
Figure 12-3. SCI Transmitter Block Diagram
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Chapter 12 Serial Communications Interface (S08SCIV3)
Figure 12-4 shows the receiver portion of the SCI.
INTERNAL BUS
(READ-ONLY)
SCID – Rx BUFFER
DIVIDE
BY 16
16 × BAUD
RATE CLOCK
M
11-BIT RECEIVE SHIFT REGISTER
H
8
7
6
5
4
3
2
1
0
L
DATA RECOVERY
FROM RxD PIN
SHIFT DIRECTION
LOOPS
RSRC
WAKE
SINGLE-WIRE
LOOP CONTROL
WAKEUP
LOGIC
RWU
ILT
FROM
TRANSMITTER
RDRF
RIE
Rx INTERRUPT
REQUEST
IDLE
ILIE
OR
ORIE
FE
FEIE
ERROR INTERRUPT
REQUEST
NF
NEIE
PE
PT
PARITY
CHECKING
PF
PEIE
Figure 12-4. SCI Receiver Block Diagram
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Chapter 12 Serial Communications Interface (S08SCIV3)
12.2 Register Definition
The SCI has eight 8-bit registers to control baud rate, select SCI options, report SCI status, and for
transmit/receive data.
Refer to the direct-page register summary in the Memory chapter of this data sheet for the absolute address
assignments for all SCI registers. This section refers to registers and control bits only by their names. A
Freescale-provided equate or header file is used to translate these names into the appropriate absolute
addresses.
12.2.1 SCI Baud Rate Registers (SCIBDH, SCIBHL)
This pair of registers controls the prescale divisor for SCI baud rate generation. To update the 13-bit baud
rate setting [SBR12:SBR0], first write to SCIBDH to buffer the high half of the new value and then write
to SCIBDL. The working value in SCIBDH does not change until SCIBDL is written.
SCIBDL is reset to a non-zero value, so after reset the baud rate generator remains disabled until the first
time the receiver or transmitter is enabled (RE or TE bits in SCIC2 are written to 1).
7
6
5
4
3
2
1
0
R
W
0
0
0
SBR12
SBR11
SBR10
SBR9
SBR8
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-5. SCI Baud Rate Register (SCIBDH)
Table 12-1. SCIBDH Register Field Descriptions
Description
Field
4:0
Baud Rate Modulo Divisor — These 13 bits are referred to collectively as BR, and they set the modulo divide
SBR[12:8] rate for the SCI baud rate generator. When BR = 0, the SCI baud rate generator is disabled to reduce supply
current. When BR = 1 to 8191, the SCI baud rate = BUSCLK/(16×BR). See also BR bits in Table 12-2.
7
6
5
4
3
2
1
0
R
W
SBR7
SBR6
SBR5
SBR4
SBR3
SBR2
SBR1
SBR0
Reset
0
0
0
0
0
1
0
0
Figure 12-6. SCI Baud Rate Register (SCIBDL)
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Chapter 12 Serial Communications Interface (S08SCIV3)
Table 12-2. SCIBDL Register Field Descriptions
Field
Description
7:0
SBR[7:0]
Baud Rate Modulo Divisor — These 13 bits are referred to collectively as BR, and they set the modulo divide
rate for the SCI baud rate generator. When BR = 0, the SCI baud rate generator is disabled to reduce supply
current. When BR = 1 to 8191, the SCI baud rate = BUSCLK/(16×BR). See also BR bits in Table 12-1.
12.2.2 SCI Control Register 1 (SCIC1)
This read/write register is used to control various optional features of the SCI system.
7
6
5
4
3
2
1
0
R
W
LOOPS
SCISWAI
RSRC
M
WAKE
ILT
PE
PT
Reset
0
0
0
0
0
0
0
0
Figure 12-7. SCI Control Register 1 (SCIC1)
Table 12-3. SCIC1 Register Field Descriptions
Description
Field
7
Loop Mode Select — Selects between loop back modes and normal 2-pin full-duplex modes. When
LOOPS = 1, the transmitter output is internally connected to the receiver input.
0 Normal operation — RxD and TxD use separate pins.
LOOPS
1 Loop mode or single-wire mode where transmitter outputs are internally connected to receiver input. (See
RSRC bit.) RxD pin is not used by SCI.
6
SCI Stops in Wait Mode
SCISWAI 0 SCI clocks continue to run in wait mode so the SCI can be the source of an interrupt that wakes up the CPU.
1 SCI clocks freeze while CPU is in wait mode.
5
Receiver Source Select — This bit has no meaning or effect unless the LOOPS bit is set to 1. When
LOOPS = 1, the receiver input is internally connected to the TxD pin and RSRC determines whether this
connection is also connected to the transmitter output.
RSRC
0 Provided LOOPS = 1, RSRC = 0 selects internal loop back mode and the SCI does not use the RxD pins.
1 Single-wire SCI mode where the TxD pin is connected to the transmitter output and receiver input.
4
9-Bit or 8-Bit Mode Select
M
0 Normal — start + 8 data bits (LSB first) + stop.
1 Receiver and transmitter use 9-bit data characters
start + 8 data bits (LSB first) + 9th data bit + stop.
3
Receiver Wakeup Method Select — Refer to Section 12.3.3.2, “Receiver Wakeup Operation” for more
WAKE
information.
0 Idle-line wakeup.
1 Address-mark wakeup.
2
ILT
Idle Line Type Select — Setting this bit to 1 ensures that the stop bit and logic 1 bits at the end of a character
do not count toward the 10 or 11 bit times of the logic high level by the idle line detection logic. Refer to
Section 12.3.3.2.1, “Idle-Line Wakeup” for more information.
0 Idle character bit count starts after start bit.
1 Idle character bit count starts after stop bit.
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Table 12-3. SCIC1 Register Field Descriptions (continued)
Field
Description
1
PE
Parity Enable — Enables hardware parity generation and checking. When parity is enabled, the most significant
bit (MSB) of the data character (eighth or ninth data bit) is treated as the parity bit.
0 No hardware parity generation or checking.
1 Parity enabled.
0
Parity Type — Provided parity is enabled (PE = 1), this bit selects even or odd parity. Odd parity means the total
PT
number of 1s in the data character, including the parity bit, is odd. Even parity means the total number of 1s in
the data character, including the parity bit, is even.
0 Even parity.
1 Odd parity.
12.2.3 SCI Control Register 2 (SCIC2)
This register can be read or written at any time.
7
6
5
4
3
2
1
0
R
W
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SBK
Reset
0
0
0
0
0
0
0
0
Figure 12-8. SCI Control Register 2 (SCIC2)
Table 12-4. SCIC2 Register Field Descriptions
Description
Field
7
Transmit Interrupt Enable (for TDRE)
TIE
0 Hardware interrupts from TDRE disabled (use polling).
1 Hardware interrupt requested when TDRE flag is 1.
6
Transmission Complete Interrupt Enable (for TC)
0 Hardware interrupts from TC disabled (use polling).
1 Hardware interrupt requested when TC flag is 1.
TCIE
5
Receiver Interrupt Enable (for RDRF)
RIE
0 Hardware interrupts from RDRF disabled (use polling).
1 Hardware interrupt requested when RDRF flag is 1.
4
Idle Line Interrupt Enable (for IDLE)
ILIE
0 Hardware interrupts from IDLE disabled (use polling).
1 Hardware interrupt requested when IDLE flag is 1.
3
TE
Transmitter Enable
0 Transmitter off.
1 Transmitter on.
TE must be 1 in order to use the SCI transmitter. When TE = 1, the SCI forces the TxD pin to act as an output
for the SCI system.
When the SCI is configured for single-wire operation (LOOPS = RSRC = 1), TXDIR controls the direction of
traffic on the single SCI communication line (TxD pin).
TE also can be used to queue an idle character by writing TE = 0 then TE = 1 while a transmission is in progress.
Refer to Section 12.3.2.1, “Send Break and Queued Idle,” for more details.
When TE is written to 0, the transmitter keeps control of the port TxD pin until any data, queued idle, or queued
break character finishes transmitting before allowing the pin to revert to a general-purpose I/O pin.
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Table 12-4. SCIC2 Register Field Descriptions (continued)
Field
Description
2
Receiver Enable — When the SCI receiver is off, the RxD pin reverts to being a general-purpose port I/O pin.
RE
If LOOPS = 1, the RxD pin reverts to being a general-purpose I/O pin even if RE = 1.
0 Receiver off.
1 Receiver on.
1
Receiver Wakeup Control — This bit can be written to 1 to place the SCI receiver in a standby state where it
waits for automatic hardware detection of a selected wakeup condition. The wakeup condition is either an idle
line between messages (WAKE = 0, idle-line wakeup), or a logic 1 in the most significant data bit in a character
(WAKE = 1, address-mark wakeup). Application software sets RWU and (normally) a selected hardware
condition automatically clears RWU. Refer to Section 12.3.3.2, “Receiver Wakeup Operation,” for more details.
0 Normal SCI receiver operation.
RWU
1 SCI receiver in standby waiting for wakeup condition.
0
SBK
Send Break — Writing a 1 and then a 0 to SBK queues a break character in the transmit data stream. Additional
break characters of 10 or 11 bit times of logic 0 are queued as long as SBK = 1. Depending on the timing of the
set and clear of SBK relative to the information currently being transmitted, a second break character may be
queued before software clears SBK. Refer to Section 12.3.2.1, “Send Break and Queued Idle,” for more details.
0 Normal transmitter operation.
1 Queue break character(s) to be sent.
12.2.4 SCI Status Register 1 (SCIS1)
This register has eight read-only status flags. Writes have no effect. Special software sequences (which do
not involve writing to this register) are used to clear these status flags.
7
6
5
4
3
2
1
0
R
W
TDRE
TC
RDRF
IDLE
OR
NF
FE
PF
Reset
1
1
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-9. SCI Status Register 1 (SCIS1)
Table 12-5. SCIS1 Register Field Descriptions
Description
Field
7
Transmit Data Register Empty Flag — TDRE is set out of reset and when a transmit data value transfers from
the transmit data buffer to the transmit shifter, leaving room for a new character in the buffer. To clear TDRE, read
SCIS1 with TDRE = 1 and then write to the SCI data register (SCID).
0 Transmit data register (buffer) full.
TDRE
1 Transmit data register (buffer) empty.
6
TC
Transmission Complete Flag — TC is set out of reset and when TDRE = 1 and no data, preamble, or break
character is being transmitted.
0 Transmitter active (sending data, a preamble, or a break).
1 Transmitter idle (transmission activity complete).
TC is cleared automatically by reading SCIS1 with TC = 1 and then doing one of the following three things:
• Write to the SCI data register (SCID) to transmit new data
• Queue a preamble by changing TE from 0 to 1
• Queue a break character by writing 1 to SBK in SCIC2
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Table 12-5. SCIS1 Register Field Descriptions (continued)
Field
Description
5
Receive Data Register Full Flag — RDRF becomes set when a character transfers from the receive shifter into
RDRF
the receive data register (SCID). To clear RDRF, read SCIS1 with RDRF = 1 and then read the SCI data register
(SCID).
0 Receive data register empty.
1 Receive data register full.
4
IDLE
Idle Line Flag — IDLE is set when the SCI receive line becomes idle for a full character time after a period of
activity. When ILT = 0, the receiver starts counting idle bit times after the start bit. So if the receive character is
all 1s, these bit times and the stop bit time count toward the full character time of logic high (10 or 11 bit times
depending on the M control bit) needed for the receiver to detect an idle line. When ILT = 1, the receiver doesn’t
start counting idle bit times until after the stop bit. So the stop bit and any logic high bit times at the end of the
previous character do not count toward the full character time of logic high needed for the receiver to detect an
idle line.
To clear IDLE, read SCIS1 with IDLE = 1 and then read the SCI data register (SCID). After IDLE has been
cleared, it cannot become set again until after a new character has been received and RDRF has been set. IDLE
will get set only once even if the receive line remains idle for an extended period.
0 No idle line detected.
1 Idle line was detected.
3
OR
Receiver Overrun Flag — OR is set when a new serial character is ready to be transferred to the receive data
register (buffer), but the previously received character has not been read from SCID yet. In this case, the new
character (and all associated error information) is lost because there is no room to move it into SCID. To clear
OR, read SCIS1 with OR = 1 and then read the SCI data register (SCID).
0 No overrun.
1 Receive overrun (new SCI data lost).
2
NF
Noise Flag — The advanced sampling technique used in the receiver takes seven samples during the start bit
and three samples in each data bit and the stop bit. If any of these samples disagrees with the rest of the samples
within any bit time in the frame, the flag NF will be set at the same time as the flag RDRF gets set for the
character. To clear NF, read SCIS1 and then read the SCI data register (SCID).
0 No noise detected.
1 Noise detected in the received character in SCID.
1
FE
Framing Error Flag — FE is set at the same time as RDRF when the receiver detects a logic 0 where the stop
bit was expected. This suggests the receiver was not properly aligned to a character frame. To clear FE, read
SCIS1 with FE = 1 and then read the SCI data register (SCID).
0 No framing error detected. This does not guarantee the framing is correct.
1 Framing error.
0
Parity Error Flag — PF is set at the same time as RDRF when parity is enabled (PE = 1) and the parity bit in
PF
the received character does not agree with the expected parity value. To clear PF, read SCIS1 and then read the
SCI data register (SCID).
0 No parity error.
1 Parity error.
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12.2.5 SCI Status Register 2 (SCIS2)
This register has one read-only status flag. Writes have no effect.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
RAF
BRK13
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-10. SCI Status Register 2 (SCIS2)
Table 12-6. SCIS2 Register Field Descriptions
Description
Field
2
Break Character Length — BRK13 is used to select a longer break character length. Detection of a framing
error is not affected by the state of this bit.
BRK13
0 Break character is 10 bit times (11 if M = 1)
1 Break character is 13 bit times (14 if M = 1)
0
RAF
Receiver Active Flag — RAF is set when the SCI receiver detects the beginning of a valid start bit, and RAF is
cleared automatically when the receiver detects an idle line. This status flag can be used to check whether an
SCI character is being received before instructing the MCU to go to stop mode.
0 SCI receiver idle waiting for a start bit.
1 SCI receiver active (RxD input not idle).
12.2.6 SCI Control Register 3 (SCIC3)
7
6
5
4
3
2
1
0
R
W
R8
T8
TXDIR
TXINV
ORIE
NEIE
FEIE
PEIE
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-11. SCI Control Register 3 (SCIC3)
Table 12-7. SCIC3 Register Field Descriptions
Description
Field
7
R8
Ninth Data Bit for Receiver — When the SCI is configured for 9-bit data (M = 1), R8 can be thought of as a
ninth receive data bit to the left of the MSB of the buffered data in the SCID register. When reading 9-bit data,
read R8 before reading SCID because reading SCID completes automatic flag clearing sequences which could
allow R8 and SCID to be overwritten with new data.
6
T8
Ninth Data Bit for Transmitter — When the SCI is configured for 9-bit data (M = 1), T8 may be thought of as a
ninth transmit data bit to the left of the MSB of the data in the SCID register. When writing 9-bit data, the entire
9-bit value is transferred to the SCI shift register after SCID is written so T8 should be written (if it needs to
change from its previous value) before SCID is written. If T8 does not need to change in the new value (such as
when it is used to generate mark or space parity), it need not be written each time SCID is written.
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Table 12-7. SCIC3 Register Field Descriptions (continued)
Field
Description
5
TxD Pin Direction in Single-Wire Mode — When the SCI is configured for single-wire half-duplex operation
(LOOPS = RSRC = 1), this bit determines the direction of data at the TxD pin.
0 TxD pin is an input in single-wire mode.
TXDIR
1 TxD pin is an output in single-wire mode.
4
Transmit Data Inversion — Setting this bit reverses the polarity of the transmitted data output.
0 Transmit data not inverted
TXINV1
1 Transmit data inverted
3
Overrun Interrupt Enable — This bit enables the overrun flag (OR) to generate hardware interrupt requests.
0 OR interrupts disabled (use polling).
ORIE
1 Hardware interrupt requested when OR = 1.
2
Noise Error Interrupt Enable — This bit enables the noise flag (NF) to generate hardware interrupt requests.
0 NF interrupts disabled (use polling).
NEIE
1 Hardware interrupt requested when NF = 1.
1
Framing Error Interrupt Enable — This bit enables the framing error flag (FE) to generate hardware interrupt
FEIE
requests.
0 FE interrupts disabled (use polling).
1 Hardware interrupt requested when FE = 1.
0
Parity Error Interrupt Enable — This bit enables the parity error flag (PF) to generate hardware interrupt
PEIE
requests.
0 PF interrupts disabled (use polling).
1 Hardware interrupt requested when PF = 1.
1
Setting TXINV inverts the TxD output for all cases: data bits, start and stop bits, break, and idle.
12.2.7 SCI Data Register (SCID)
This register is actually two separate registers. Reads return the contents of the read-only receive data
buffer and writes go to the write-only transmit data buffer. Reads and writes of this register are also
involved in the automatic flag clearing mechanisms for the SCI status flags.
7
6
5
4
3
2
1
0
R
W
R7
R6
R5
R4
R3
R2
R1
R0
T7
0
T6
0
T5
0
T4
0
T3
0
T2
0
T1
0
T0
0
Reset
Figure 12-12. SCI Data Register (SCID)
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12.3 Functional Description
The SCI allows full-duplex, asynchronous, NRZ serial communication among the MCU and remote
devices, including other MCUs. The SCI comprises a baud rate generator, transmitter, and receiver block.
The transmitter and receiver operate independently, although they use the same baud rate generator. During
normal operation, the MCU monitors the status of the SCI, writes the data to be transmitted, and processes
received data. The following describes each of the blocks of the SCI.
12.3.1 Baud Rate Generation
As shown in Figure 12-13, the clock source for the SCI baud rate generator is the bus-rate clock.
MODULO DIVIDE BY
(1 THROUGH 8191)
DIVIDE BY
16
Tx BAUD RATE
BUSCLK
SBR12:SBR0
Rx SAMPLING CLOCK
BAUD RATE GENERATOR
OFF IF [SBR12:SBR0] = 0
(16 × BAUD RATE)
BUSCLK
BAUD RATE =
[SBR12:SBR0] × 16
Figure 12-13. SCI Baud Rate Generation
SCI communications require the transmitter and receiver (which typically derive baud rates from
independent clock sources) to use the same baud rate. Allowed tolerance on this baud frequency depends
on the details of how the receiver synchronizes to the leading edge of the start bit and how bit sampling is
performed.
The MCU resynchronizes to bit boundaries on every high-to-low transition, but in the worst case, there are
no such transitions in the full 10- or 11-bit time character frame so any mismatch in baud rate is
accumulated for the whole character time. For a Freescale Semiconductor SCI system whose bus
frequency is driven by a crystal, the allowed baud rate mismatch is about 4.5 percent for 8-bit data format
and about 4 percent for 9-bit data format. Although baud rate modulo divider settings do not always
produce baud rates that exactly match standard rates, it is normally possible to get within a few percent,
which is acceptable for reliable communications.
12.3.2 Transmitter Functional Description
This section describes the overall block diagram for the SCI transmitter, as well as specialized functions
for sending break and idle characters. The transmitter block diagram is shown in Figure 12-3.
The transmitter output (TxD) idle state defaults to logic high (TXINV = 0 following reset). The transmitter
output is inverted by setting TXINV = 1. The transmitter is enabled by setting the TE bit in SCIC2. This
queues a preamble character that is one full character frame of the idle state. The transmitter then remains
idle until data is available in the transmit data buffer. Programs store data into the transmit data buffer by
writing to the SCI data register (SCID).
The central element of the SCI transmitter is the transmit shift register that is either 10 or 11 bits long
depending on the setting in the M control bit. For the remainder of this section, we will assume M = 0,
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selecting the normal 8-bit data mode. In 8-bit data mode, the shift register holds a start bit, eight data bits,
and a stop bit. When the transmit shift register is available for a new SCI character, the value waiting in
the transmit data register is transferred to the shift register (synchronized with the baud rate clock) and the
transmit data register empty (TDRE) status flag is set to indicate another character may be written to the
transmit data buffer at SCID.
If no new character is waiting in the transmit data buffer after a stop bit is shifted out the TxD1 pin, the
transmitter sets the transmit complete flag and enters an idle mode, with TxD1 high, waiting for more
characters to transmit.
Writing 0 to TE does not immediately release the pin to be a general-purpose I/O pin. Any transmit activity
that is in progress must first be completed. This includes data characters in progress, queued idle
characters, and queued break characters.
12.3.2.1 Send Break and Queued Idle
The SBK control bit in SCIC2 is used to send break characters which were originally used to gain the
attention of old teletype receivers. Break characters are a full character time of logic 0 (10 bit times
including the start and stop bits). A longer break of 13 bit times can be enabled by setting BRK13 = 1.
Normally, a program would wait for TDRE to become set to indicate the last character of a message has
moved to the transmit shifter, then write 1 and then write 0 to the SBK bit. This action queues a break
character to be sent as soon as the shifter is available. If SBK is still 1 when the queued break moves into
the shifter (synchronized to the baud rate clock), an additional break character is queued. If the receiving
device is another Freescale Semiconductor SCI, the break characters will be received as 0s in all eight data
bits and a framing error (FE = 1) occurs.
When idle-line wakeup is used, a full character time of idle (logic 1) is needed between messages to wake
up any sleeping receivers. Normally, a program would wait for TDRE to become set to indicate the last
character of a message has moved to the transmit shifter, then write 0 and then write 1 to the TE bit. This
action queues an idle character to be sent as soon as the shifter is available. As long as the character in the
shifter does not finish while TE = 0, the SCI transmitter never actually releases control of the TxD1 pin. If
there is a possibility of the shifter finishing while TE = 0, set the general-purpose I/O controls so the pin
that is shared with TxD1 is an output driving a logic 1. This ensures that the TxD1 line will look like a
normal idle line even if the SCI loses control of the port pin between writing 0 and then 1 to TE.
The length of the break character is affected by the BRK13 and M bits as shown below.
Table 12-8. Break Character Length
BRK13
M
Break Character Length
0
0
1
1
0
1
0
1
10 bit times
11 bit times
13 bit times
14 bit times
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12.3.3 Receiver Functional Description
In this section, the receiver block diagram (Figure 12-4) is used as a guide for the overall receiver
functional description. Next, the data sampling technique used to reconstruct receiver data is described in
more detail. Finally, two variations of the receiver wakeup function are explained.
The receiver is enabled by setting the RE bit in SCIC2. Character frames consist of a start bit of logic 0,
eight (or nine) data bits (LSB first), and a stop bit of logic 1. For information about 9-bit data mode, refer
to Section 12.4.1, “8- and 9-Bit Data Modes.” For the remainder of this discussion, we assume the SCI is
configured for normal 8-bit data mode.
After receiving the stop bit into the receive shifter, and provided the receive data register is not already full,
the data character is transferred to the receive data register and the receive data register full (RDRF) status
flag is set. If RDRF was already set indicating the receive data register (buffer) was already full, the overrun
(OR) status flag is set and the new data is lost. Because the SCI receiver is double-buffered, the program
has one full character time after RDRF is set before the data in the receive data buffer must be read to avoid
a receiver overrun.
When a program detects that the receive data register is full (RDRF = 1), it gets the data from the receive
data register by reading SCID. The RDRF flag is cleared automatically by a 2-step sequence which is
normally satisfied in the course of the user’s program that handles receive data. Refer to Section 12.3.4,
“Interrupts and Status Flags,” for more details about flag clearing.
12.3.3.1 Data Sampling Technique
The SCI receiver uses a 16× baud rate clock for sampling. The receiver starts by taking logic level samples
at 16 times the baud rate to search for a falling edge on the RxD1 serial data input pin. A falling edge is
defined as a logic 0 sample after three consecutive logic 1 samples. The 16× baud rate clock is used to
divide the bit time into 16 segments labeled RT1 through RT16. When a falling edge is located, three more
samples are taken at RT3, RT5, and RT7 to make sure this was a real start bit and not merely noise. If at
least two of these three samples are 0, the receiver assumes it is synchronized to a receive character.
The receiver then samples each bit time, including the start and stop bits, at RT8, RT9, and RT10 to
determine the logic level for that bit. The logic level is interpreted to be that of the majority of the samples
taken during the bit time. In the case of the start bit, the bit is assumed to be 0 if at least two of the samples
at RT3, RT5, and RT7 are 0 even if one or all of the samples taken at RT8, RT9, and RT10 are 1s. If any
sample in any bit time (including the start and stop bits) in a character frame fails to agree with the logic
level for that bit, the noise flag (NF) will be set when the received character is transferred to the receive
data buffer.
The falling edge detection logic continuously looks for falling edges, and if an edge is detected, the sample
clock is resynchronized to bit times. This improves the reliability of the receiver in the presence of noise
or mismatched baud rates. It does not improve worst case analysis because some characters do not have
any extra falling edges anywhere in the character frame.
In the case of a framing error, provided the received character was not a break character, the sampling logic
that searches for a falling edge is filled with three logic 1 samples so that a new start bit can be detected
almost immediately.
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In the case of a framing error, the receiver is inhibited from receiving any new characters until the framing
error flag is cleared. The receive shift register continues to function, but a complete character cannot
transfer to the receive data buffer if FE is still set.
12.3.3.2 Receiver Wakeup Operation
Receiver wakeup is a hardware mechanism that allows an SCI receiver to ignore the characters in a
message that is intended for a different SCI receiver. In such a system, all receivers evaluate the first
character(s) of each message, and as soon as they determine the message is intended for a different
receiver, they write logic 1 to the receiver wake up (RWU) control bit in SCIC2. When RWU = 1, it inhibits
setting of the status flags associated with the receiver, thus eliminating the software overhead for handling
the unimportant message characters. At the end of a message, or at the beginning of the next message, all
receivers automatically force RWU to 0 so all receivers wake up in time to look at the first character(s) of
the next message.
12.3.3.2.1
Idle-Line Wakeup
When WAKE = 0, the receiver is configured for idle-line wakeup. In this mode, RWU is cleared
automatically when the receiver detects a full character time of the idle-line level. The M control bit selects
8-bit or 9-bit data mode that determines how many bit times of idle are needed to constitute a full character
time (10 or 11 bit times because of the start and stop bits).
When the RWU bit is set, the idle character that wakes a receiver does not set the receiver idle bit, IDLE,
or the receive data register full flag, RDRF. It therefore will not generate an interrupt when this idle
character occurs. The receiver will wake up and wait for the next data transmission which will set RDRF
and generate an interrupt if enabled.
The idle-line type (ILT) control bit selects one of two ways to detect an idle line. When ILT = 0, the idle
bit counter starts after the start bit so the stop bit and any logic 1s at the end of a character count toward
the full character time of idle. When ILT = 1, the idle bit counter does not start until after a stop bit time,
so the idle detection is not affected by the data in the last character of the previous message.
12.3.3.2.2
Address-Mark Wakeup
When WAKE = 1, the receiver is configured for address-mark wakeup. In this mode, RWU is cleared
automatically when the receiver detects a logic 1 in the most significant bit of a received character (eighth
bit in M = 0 mode and ninth bit in M = 1 mode).
Address-mark wakeup allows messages to contain idle characters but requires that the MSB be reserved
for use in address frames. The logic 1 MSB of an address frame clears the receivers RWU bit before the
stop bit is received and sets the RDRF flag.
12.3.4 Interrupts and Status Flags
The SCI system has three separate interrupt vectors to reduce the amount of software needed to isolate the
cause of the interrupt. One interrupt vector is associated with the transmitter for TDRE and TC events.
Another interrupt vector is associated with the receiver for RDRF and IDLE events, and a third vector is
used for OR, NF, FE, and PF error conditions. Each of these eight interrupt sources can be separately
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masked by local interrupt enable masks. The flags can still be polled by software when the local masks are
cleared to disable generation of hardware interrupt requests.
The SCI transmitter has two status flags that optionally can generate hardware interrupt requests. Transmit
data register empty (TDRE) indicates when there is room in the transmit data buffer to write another
transmit character to SCID. If the transmit interrupt enable (TIE) bit is set, a hardware interrupt will be
requested whenever TDRE = 1. Transmit complete (TC) indicates that the transmitter is finished
transmitting all data, preamble, and break characters and is idle with TxD1 high. This flag is often used in
systems with modems to determine when it is safe to turn off the modem. If the transmit complete interrupt
enable (TCIE) bit is set, a hardware interrupt will be requested whenever TC = 1. Instead of hardware
interrupts, software polling may be used to monitor the TDRE and TC status flags if the corresponding TIE
or TCIE local interrupt masks are 0s.
When a program detects that the receive data register is full (RDRF = 1), it gets the data from the receive
data register by reading SCID. The RDRF flag is cleared by reading SCIS1 while RDRF = 1 and then
reading SCID.
When polling is used, this sequence is naturally satisfied in the normal course of the user program. If
hardware interrupts are used, SCIS1 must be read in the interrupt service routine (ISR). Normally, this is
done in the ISR anyway to check for receive errors, so the sequence is automatically satisfied.
The IDLE status flag includes logic that prevents it from getting set repeatedly when the RxD1 line remains
idle for an extended period of time. IDLE is cleared by reading SCIS1 while IDLE = 1 and then reading
SCID. After IDLE has been cleared, it cannot become set again until the receiver has received at least one
new character and has set RDRF.
If the associated error was detected in the received character that caused RDRF to be set, the error flags —
noise flag (NF), framing error (FE), and parity error flag (PF) — get set at the same time as RDRF. These
flags are not set in overrun cases.
If RDRF was already set when a new character is ready to be transferred from the receive shifter to the
receive data buffer, the overrun (OR) flag gets set instead and the data and any associated NF, FE, or PF
condition is lost.
12.4 Additional SCI Functions
The following sections describe additional SCI functions.
12.4.1 8- and 9-Bit Data Modes
The SCI system (transmitter and receiver) can be configured to operate in 9-bit data mode by setting the
M control bit in SCIC1. In 9-bit mode, there is a ninth data bit to the left of the MSB of the SCI data
register. For the transmit data buffer, this bit is stored in T8 in SCIC3. For the receiver, the ninth bit is held
in R8 in SCIC3.
For coherent writes to the transmit data buffer, write to the T8 bit before writing to SCID.
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Chapter 12 Serial Communications Interface (S08SCIV3)
If the bit value to be transmitted as the ninth bit of a new character is the same as for the previous character,
it is not necessary to write to T8 again. When data is transferred from the transmit data buffer to the
transmit shifter, the value in T8 is copied at the same time data is transferred from SCID to the shifter.
9-bit data mode typically is used in conjunction with parity to allow eight bits of data plus the parity in the
ninth bit. Or it is used with address-mark wakeup so the ninth data bit can serve as the wakeup bit. In
custom protocols, the ninth bit can also serve as a software-controlled marker.
12.4.2 Stop Mode Operation
During all stop modes, clocks to the SCI module are halted.
In stop1 and stop2 modes, all SCI register data is lost and must be re-initialized upon recovery from these
two stop modes.
No SCI module registers are affected in stop3 mode.
Note, because the clocks are halted, the SCI module will resume operation upon exit from stop (only in
stop3 mode). Software should ensure stop mode is not entered while there is a character being transmitted
out of or received into the SCI module.
12.4.3 Loop Mode
When LOOPS = 1, the RSRC bit in the same register chooses between loop mode (RSRC = 0) or
single-wire mode (RSRC = 1). Loop mode is sometimes used to check software, independent of
connections in the external system, to help isolate system problems. In this mode, the transmitter output is
internally connected to the receiver input and the RxD1 pin is not used by the SCI, so it reverts to a
general-purpose port I/O pin.
12.4.4 Single-Wire Operation
When LOOPS = 1, the RSRC bit in the same register chooses between loop mode (RSRC = 0) or
single-wire mode (RSRC = 1). Single-wire mode is used to implement a half-duplex serial connection.
The receiver is internally connected to the transmitter output and to the TxD1 pin. The RxD1 pin is not
used and reverts to a general-purpose port I/O pin.
In single-wire mode, the TXDIR bit in SCIC3 controls the direction of serial data on the TxD1 pin. When
TXDIR = 0, the TxD1 pin is an input to the SCI receiver and the transmitter is temporarily disconnected
from the TxD1 pin so an external device can send serial data to the receiver. When TXDIR = 1, the TxD1
pin is an output driven by the transmitter. In single-wire mode, the internal loop back connection from the
transmitter to the receiver causes the receiver to receive characters that are sent out by the transmitter.
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MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Chapter 13
Serial Peripheral Interface (S08SPIV3)
13.1 Introduction
The MC9S08LC60 Series contains two SPI modules.
Figure 13-1 shows the MC9S08LC60 Series block diagram with the SPIs highlighted.
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Chapter 13 Serial Peripheral Interface (S08SPIV3)
HCS08 CORE
ON-CHIP ICE
DEBUG MODULE (DBG)
CPU
INT
ADP[7:4]
ADP3
4
PTA[7:4]/KBI1P[7:4]/ADP[7:4]
12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
ADP2
BKGD
BKP
ADP1
ADP0
HCS08 SYSTEM CONTROL
ACMP–
ACMP+
ANALOG COMPARATOR
PTA3/KBI1P3/ADP3/ACMP–
PTA2/KBI1P2/ADP2/ACMP+
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
(ACMP)
8-BIT KEYBOARD
8
PTA[1:0]/KBI1P[1:0]/ADP[1:0]
INTERRUPT (KBI1)
RTI
COP
LVD
IRQ
SS1
PTB7/KBI2P4/SS1
PTB6/KBI2P3/SPSCK1
SPSCK1
MISO1
SERIAL PERIPHERAL
INTERFACE (SPI1)
USER FLASH A
MOSI1
(LC60 = 32,768 BYTES)
(LC36 = 24,576 BYTES)
SCL
SDA
PTB5/MOSI1/SCL
PTB4/MISO1/SDA
IIC MODULE (IIC)
USER FLASH B
PTB3/KBI2P2
PTB2/RESET
RESET
(LC60 = 28,464 BYTES)
(LC36 = 12,288 BYTES)
5
3
8-BIT KEYBOARD
INTERRUPT (KBI2)
XTAL
EXTAL
USER RAM
PTB1/KBI2P1/XTAL
PTB0/KBI2P0/EXTAL
(LC60 = 4096 BYTES)
(LC36 = 2560 BYTES)
IRQ
PTC7/KBI2P7/IRQ/TPMCLK
PTC6/BKGD/MS
INTERNAL CLOCK
GENERATOR (ICG)
TPM2CH1
TPM2CH0
2-CHANNEL TIMER/PWM
PTC5/KBI2P6/TPM2CH1
PTC4/KBI2P5/TPM2CH0
(TPM2)
TPMCLK
TPM1CH0
TPM1CH1
LOW-POWER OSCILLATOR
2-CHANNEL TIMER/PWM
(TPM1)
V
LCD
SS2
V
LL1
PTC3/SS2/TPM1CH1
SPSCK2
MOSI2
MISO2
V
SERIAL PERIPHERAL
LL2
PTC2/SPSCK2/TPM1CH0
LIQUID CRYSTAL
DISPLAY DRIVER
LCD
INTERFACE (SPI2)
V
LL3
V
V
CAP1
CAP2
TxD
RxD
PTC1/MOSI2/TxD
PTC0/MISO2/RxD
SERIAL COMMUNICATIONS
INTERFACE (SCI)
BP[2:0]
BP3/FP40
FP[39:0]
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pulldown device if IRQ enabled
(IRQPE = 1).
V
DD
VOLTAGE
3. IRQ does not have a clamp diode to V . IRQ should not be driven above V
.
DD
DD
V
4. Pin contains integrated pullup device.
REGULATOR
SS
5. Input-only RESET is shared with output-only PTB2. Default function after reset is
RESET.
6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is
output-only PTC7.
VREFH
VREFL
7. PTC6/BKGD/MS is an output only pin
8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP.
9. ACMPO is not available.
VDDAD
VSSAD
Figure 13-1. MC9S08LC60 Series Block Diagram Highlighting SPI Blocks and Pins
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Chapter 13 Serial Peripheral Interface (S08SPIV3)
13.1.1 Features
Features of the SPI module include:
•
•
•
•
•
•
•
Master or slave mode operation
Full-duplex or single-wire bidirectional option
Programmable transmit bit rate
Double-buffered transmit and receive
Serial clock phase and polarity options
Slave select output
Selectable MSB-first or LSB-first shifting
13.1.2 Block Diagrams
This section includes block diagrams showing SPI system connections, the internal organization of the SPI
module, and the SPI clock dividers that control the master mode bit rate.
13.1.2.1 SPI System Block Diagram
Figure 13-2 shows the SPI modules of two MCUs connected in a master-slave arrangement. The master
device initiates all SPI data transfers. During a transfer, the master shifts data out (on the MOSI pin) to the
slave while simultaneously shifting data in (on the MISO pin) from the slave. The transfer effectively
exchanges the data that was in the SPI shift registers of the two SPI systems. The SPSCK signal is a clock
output from the master and an input to the slave. The slave device must be selected by a low level on the
slave select input (SS pin). In this system, the master device has configured its SS pin as an optional slave
select output.
SLAVE
MASTER
MOSI
MISO
MOSI
MISO
SPI SHIFTER
SPI SHIFTER
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
SPSCK
SS
SPSCK
SS
CLOCK
GENERATOR
Figure 13-2. SPI System Connections
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Chapter 13 Serial Peripheral Interface (S08SPIV3)
The most common uses of the SPI system include connecting simple shift registers for adding input or
output ports or connecting small peripheral devices such as serial A/D or D/A converters. Although
Figure 13-2 shows a system where data is exchanged between two MCUs, many practical systems involve
simpler connections where data is unidirectionally transferred from the master MCU to a slave or from a
slave to the master MCU.
13.1.2.2 SPI Module Block Diagram
Figure 13-3 is a block diagram of the SPI module. The central element of the SPI is the SPI shift register.
Data is written to the double-buffered transmitter (write to SPIxD) and gets transferred to the SPI shift
register at the start of a data transfer. After shifting in a byte of data, the data is transferred into the
double-buffered receiver where it can be read (read from SPIxD). Pin multiplexing logic controls
connections between MCU pins and the SPI module.
When the SPI is configured as a master, the clock output is routed to the SPSCK pin, the shifter output is
routed to MOSI, and the shifter input is routed from the MISO pin.
When the SPI is configured as a slave, the SPSCK pin is routed to the clock input of the SPI, the shifter
output is routed to MISO, and the shifter input is routed from the MOSI pin.
In the external SPI system, simply connect all SPSCK pins to each other, all MISO pins together, and all
MOSI pins together. Peripheral devices often use slightly different names for these pins.
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Chapter 13 Serial Peripheral Interface (S08SPIV3)
PIN CONTROL
M
MOSI
SPE
S
(MOMI)
Tx BUFFER (WRITE SPIxD)
ENABLE
M
S
MISO
SPI SYSTEM
(SISO)
SHIFT
OUT
SHIFT
IN
SPI SHIFT REGISTER
SPC0
Rx BUFFER (READ SPIxD)
BIDIROE
SHIFT
SHIFT
Rx BUFFER
FULL
Tx BUFFER
EMPTY
LSBFE
DIRECTION
CLOCK
MASTER CLOCK
SLAVE CLOCK
M
S
BUS RATE
CLOCK
CLOCK
LOGIC
SPIBR
SPSCK
CLOCK GENERATOR
MASTER/SLAVE
MODE SELECT
MASTER/
SLAVE
MSTR
MODFEN
SSOE
MODE FAULT
DETECTION
SS
SPTEF
SPTIE
SPRF
SPI
INTERRUPT
REQUEST
MODF
SPIE
Figure 13-3. SPI Module Block Diagram
13.1.3 SPI Baud Rate Generation
As shown in Figure 13-4, the clock source for the SPI baud rate generator is the bus clock. The three
prescale bits (SPPR2:SPPR1:SPPR0) choose a prescale divisor of 1, 2, 3, 4, 5, 6, 7, or 8. The three rate
select bits (SPR2:SPR1:SPR0) divide the output of the prescaler stage by 2, 4, 8, 16, 32, 64, 128, or 256
to get the internal SPI master mode bit-rate clock.
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Chapter 13 Serial Peripheral Interface (S08SPIV3)
PRESCALER
CLOCK RATE DIVIDER
MASTER
SPI
BIT RATE
DIVIDE BY
DIVIDE BY
BUS CLOCK
1, 2, 3, 4, 5, 6, 7, or 8
2, 4, 8, 16, 32, 64, 128, or 256
SPPR2:SPPR1:SPPR0
SPR2:SPR1:SPR0
Figure 13-4. SPI Baud Rate Generation
13.2 External Signal Description
The SPI optionally shares four port pins. The function of these pins depends on the settings of SPI control
bits. When the SPI is disabled (SPE = 0), these four pins revert to being general-purpose port I/O pins that
are not controlled by the SPI.
13.2.1 SPSCK — SPI Serial Clock
When the SPI is enabled as a slave, this pin is the serial clock input. When the SPI is enabled as a master,
this pin is the serial clock output.
13.2.2 MOSI — Master Data Out, Slave Data In
When the SPI is enabled as a master and SPI pin control zero (SPC0) is 0 (not bidirectional mode), this
pin is the serial data output. When the SPI is enabled as a slave and SPC0 = 0, this pin is the serial data
input. If SPC0 = 1 to select single-wire bidirectional mode, and master mode is selected, this pin becomes
the bidirectional data I/O pin (MOMI). Also, the bidirectional mode output enable bit determines whether
the pin acts as an input (BIDIROE = 0) or an output (BIDIROE = 1). If SPC0 = 1 and slave mode is
selected, this pin is not used by the SPI and reverts to being a general-purpose port I/O pin.
13.2.3 MISO — Master Data In, Slave Data Out
When the SPI is enabled as a master and SPI pin control zero (SPC0) is 0 (not bidirectional mode), this
pin is the serial data input. When the SPI is enabled as a slave and SPC0 = 0, this pin is the serial data
output. If SPC0 = 1 to select single-wire bidirectional mode, and slave mode is selected, this pin becomes
the bidirectional data I/O pin (SISO) and the bidirectional mode output enable bit determines whether the
pin acts as an input (BIDIROE = 0) or an output (BIDIROE = 1). If SPC0 = 1 and master mode is selected,
this pin is not used by the SPI and reverts to being a general-purpose port I/O pin.
13.2.4 SS — Slave Select
When the SPI is enabled as a slave, this pin is the low-true slave select input. When the SPI is enabled as
a master and mode fault enable is off (MODFEN = 0), this pin is not used by the SPI and reverts to being
a general-purpose port I/O pin. When the SPI is enabled as a master and MODFEN = 1, the slave select
output enable bit determines whether this pin acts as the mode fault input (SSOE = 0) or as the slave select
output (SSOE = 1).
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Chapter 13 Serial Peripheral Interface (S08SPIV3)
13.3 Modes of Operation
13.3.1 SPI in Stop Modes
The SPI is disabled in all stop modes, regardless of the settings before executing the STOP instruction.
During either stop1 or stop2 mode, the SPI module will be fully powered down. Upon wake-up from stop1
or stop2 mode, the SPI module will be in the reset state. During stop3 mode, clocks to the SPI module are
halted. No registers are affected. If stop3 is exited with a reset, the SPI will be put into its reset state. If
stop3 is exited with an interrupt, the SPI continues from the state it was in when stop3 was entered.
13.4 Register Definition
The SPI has five 8-bit registers to select SPI options, control baud rate, report SPI status, and for
transmit/receive data.
Refer to the direct-page register summary in the Memory chapter of this data sheet for the absolute address
assignments for all SPI registers. This section refers to registers and control bits only by their names, and
a Freescale-provided equate or header file is used to translate these names into the appropriate absolute
addresses.
13.4.1 SPI Control Register 1 (SPIxC1)
This read/write register includes the SPI enable control, interrupt enables, and configuration options.
7
6
5
4
3
2
1
0
R
W
SPIE
SPE
SPTIE
MSTR
CPOL
CPHA
SSOE
LSBFE
Reset
0
0
0
0
0
1
0
0
Figure 13-5. SPI Control Register 1 (SPIxC1)
Table 13-1. SPIxC1 Field Descriptions
Description
Field
7
SPI Interrupt Enable (for SPRF and MODF) — This is the interrupt enable for SPI receive buffer full (SPRF)
and mode fault (MODF) events.
SPIE
0 Interrupts from SPRF and MODF inhibited (use polling)
1 When SPRF or MODF is 1, request a hardware interrupt
6
SPI System Enable — Disabling the SPI halts any transfer that is in progress, clears data buffers, and initializes
SPE
internal state machines. SPRF is cleared and SPTEF is set to indicate the SPI transmit data buffer is empty.
0 SPI system inactive
1 SPI system enabled
5
SPI Transmit Interrupt Enable — This is the interrupt enable bit for SPI transmit buffer empty (SPTEF).
0 Interrupts from SPTEF inhibited (use polling)
SPTIE
1 When SPTEF is 1, hardware interrupt requested
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Table 13-1. SPIxC1 Field Descriptions (continued)
Field
Description
4
Master/Slave Mode Select
MSTR
0 SPI module configured as a slave SPI device
1 SPI module configured as a master SPI device
3
Clock Polarity — This bit effectively places an inverter in series with the clock signal from a master SPI or to a
slave SPI device. Refer to Section 13.5.1, “SPI Clock Formats” for more details.
0 Active-high SPI clock (idles low)
CPOL
1 Active-low SPI clock (idles high)
2
Clock Phase — This bit selects one of two clock formats for different kinds of synchronous serial peripheral
devices. Refer to Section 13.5.1, “SPI Clock Formats” for more details.
CPHA
0 First edge on SPSCK occurs at the middle of the first cycle of an 8-cycle data transfer
1 First edge on SPSCK occurs at the start of the first cycle of an 8-cycle data transfer
1
Slave Select Output Enable — This bit is used in combination with the mode fault enable (MODFEN) bit in
SSOE
SPCR2 and the master/slave (MSTR) control bit to determine the function of the SS pin as shown in Table 13-2.
0
LSB First (Shifter Direction)
LSBFE
0 SPI serial data transfers start with most significant bit
1 SPI serial data transfers start with least significant bit
Table 13-2. SS Pin Function
MODFEN
SSOE
Master Mode
Slave Mode
Slave select input
0
0
1
1
0
1
0
1
General-purpose I/O (not SPI)
General-purpose I/O (not SPI)
SS input for mode fault
Slave select input
Slave select input
Slave select input
Automatic SS output
NOTE
Ensure that the SPI should not be disabled (SPE=0) at the same time as a bit change to the CPHA bit. These
changes should be performed as separate operations or unexpected behavior may occur.
13.4.2 SPI Control Register 2 (SPIxC2)
This read/write register is used to control optional features of the SPI system. Bits 7, 6, 5, and 2 are not
implemented and always read 0.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
MODFEN
BIDIROE
SPISWAI
SPC0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 13-6. SPI Control Register 2 (SPIxC2)
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Chapter 13 Serial Peripheral Interface (S08SPIV3)
Table 13-3. SPIxC2 Register Field Descriptions
Field
Description
4
Master Mode-Fault Function Enable — When the SPI is configured for slave mode, this bit has no meaning or
MODFEN effect. (The SS pin is the slave select input.) In master mode, this bit determines how the SS pin is used (refer
to Table 13-2 for more details).
0 Mode fault function disabled, master SS pin reverts to general-purpose I/O not controlled by SPI
1 Mode fault function enabled, master SS pin acts as the mode fault input or the slave select output
3
Bidirectional Mode Output Enable — When bidirectional mode is enabled by SPI pin control 0 (SPC0) = 1,
BIDIROE BIDIROE determines whether the SPI data output driver is enabled to the single bidirectional SPI I/O pin.
Depending on whether the SPI is configured as a master or a slave, it uses either the MOSI (MOMI) or MISO
(SISO) pin, respectively, as the single SPI data I/O pin. When SPC0 = 0, BIDIROE has no meaning or effect.
0 Output driver disabled so SPI data I/O pin acts as an input
1 SPI I/O pin enabled as an output
1
SPI Stop in Wait Mode
SPISWAI 0 SPI clocks continue to operate in wait mode
1 SPI clocks stop when the MCU enters wait mode
0
SPI Pin Control 0 — The SPC0 bit chooses single-wire bidirectional mode. If MSTR = 0 (slave mode), the SPI
uses the MISO (SISO) pin for bidirectional SPI data transfers. If MSTR = 1 (master mode), the SPI uses the
MOSI (MOMI) pin for bidirectional SPI data transfers. When SPC0 = 1, BIDIROE is used to enable or disable the
output driver for the single bidirectional SPI I/O pin.
SPC0
0 SPI uses separate pins for data input and data output
1 SPI configured for single-wire bidirectional operation
13.4.3 SPI Baud Rate Register (SPIxBR)
This register is used to set the prescaler and bit rate divisor for an SPI master. This register may be read or
written at any time.
7
6
5
4
3
2
1
0
R
W
0
0
SPPR2
SPPR1
SPPR0
SPR2
SPR1
SPR0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 13-7. SPI Baud Rate Register (SPIxBR)
Table 13-4. SPIxBR Register Field Descriptions
Description
Field
6:4
SPI Baud Rate Prescale Divisor — This 3-bit field selects one of eight divisors for the SPI baud rate prescaler
SPPR[2:0] as shown in Table 13-5. The input to this prescaler is the bus rate clock (BUSCLK). The output of this prescaler
drives the input of the SPI baud rate divider (see Figure 13-4).
2:0
SPR[2:0]
SPI Baud Rate Divisor — This 3-bit field selects one of eight divisors for the SPI baud rate divider as shown in
Table 13-6. The input to this divider comes from the SPI baud rate prescaler (see Figure 13-4). The output of this
divider is the SPI bit rate clock for master mode.
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Table 13-5. SPI Baud Rate Prescaler Divisor
SPPR2:SPPR1:SPPR0
Prescaler Divisor
0:0:0
0:0:1
0:1:0
0:1:1
1:0:0
1:0:1
1:1:0
1:1:1
1
2
3
4
5
6
7
8
Table 13-6. SPI Baud Rate Divisor
SPR2:SPR1:SPR0
0:0:0
Rate Divisor
2
0:0:1
0:1:0
0:1:1
1:0:0
1:0:1
1:1:0
1:1:1
4
8
16
32
64
128
256
13.4.4 SPI Status Register (SPIxS)
This register has three read-only status bits. Bits 6, 3, 2, 1, and 0 are not implemented and always read 0.
Writes have no meaning or effect.
7
6
5
4
3
2
1
0
R
W
SPRF
0
SPTEF
MODF
0
0
0
0
Reset
0
0
1
0
0
0
0
0
= Unimplemented or Reserved
Figure 13-8. SPI Status Register (SPIxS)
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Table 13-7. SPIxS Register Field Descriptions
Field
Description
7
SPI Read Buffer Full Flag — SPRF is set at the completion of an SPI transfer to indicate that received data may
be read from the SPI data register (SPIxD). SPRF is cleared by reading SPRF while it is set, then reading the
SPI data register.
SPRF
0 No data available in the receive data buffer
1 Data available in the receive data buffer
5
SPI Transmit Buffer Empty Flag — This bit is set when there is room in the transmit data buffer. It is cleared by
reading SPIxS with SPTEF set, followed by writing a data value to the transmit buffer at SPIxD. SPIxS must be
read with SPTEF = 1 before writing data to SPIxD or the SPIxD write will be ignored. SPTEF generates an
SPTEF CPU interrupt request if the SPTIE bit in the SPIxC1 is also set. SPTEF is automatically set when a data
byte transfers from the transmit buffer into the transmit shift register. For an idle SPI (no data in the transmit buffer
or the shift register and no transfer in progress), data written to SPIxD is transferred to the shifter almost
immediately so SPTEF is set within two bus cycles allowing a second 8-bit data value to be queued into the
transmit buffer. After completion of the transfer of the value in the shift register, the queued value from the
transmit buffer will automatically move to the shifter and SPTEF will be set to indicate there is room for new data
in the transmit buffer. If no new data is waiting in the transmit buffer, SPTEF simply remains set and no data
moves from the buffer to the shifter.
SPTEF
0 SPI transmit buffer not empty
1 SPI transmit buffer empty
4
Master Mode Fault Flag — MODF is set if the SPI is configured as a master and the slave select input goes
low, indicating some other SPI device is also configured as a master. The SS pin acts as a mode fault error input
only when MSTR = 1, MODFEN = 1, and SSOE = 0; otherwise, MODF will never be set. MODF is cleared by
reading MODF while it is 1, then writing to SPI control register 1 (SPIxC1).
0 No mode fault error
MODF
1 Mode fault error detected
13.4.5 SPI Data Register (SPIxD)
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 13-9. SPI Data Register (SPIxD)
Reads of this register return the data read from the receive data buffer. Writes to this register write data to
the transmit data buffer. When the SPI is configured as a master, writing data to the transmit data buffer
initiates an SPI transfer.
Data should not be written to the transmit data buffer unless the SPI transmit buffer empty flag (SPTEF)
is set, indicating there is room in the transmit buffer to queue a new transmit byte.
Data may be read from SPIxD any time after SPRF is set and before another transfer is finished. Failure
to read the data out of the receive data buffer before a new transfer ends causes a receive overrun condition
and the data from the new transfer is lost.
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13.5 Functional Description
An SPI transfer is initiated by checking for the SPI transmit buffer empty flag (SPTEF = 1) and then
writing a byte of data to the SPI data register (SPIxD) in the master SPI device. When the SPI shift register
is available, this byte of data is moved from the transmit data buffer to the shifter, SPTEF is set to indicate
there is room in the buffer to queue another transmit character if desired, and the SPI serial transfer starts.
During the SPI transfer, data is sampled (read) on the MISO pin at one SPSCK edge and shifted, changing
the bit value on the MOSI pin, one-half SPSCK cycle later. After eight SPSCK cycles, the data that was in
the shift register of the master has been shifted out the MOSI pin to the slave while eight bits of data were
shifted in the MISO pin into the master’s shift register. At the end of this transfer, the received data byte is
moved from the shifter into the receive data buffer and SPRF is set to indicate the data can be read by
reading SPIxD. If another byte of data is waiting in the transmit buffer at the end of a transfer, it is moved
into the shifter, SPTEF is set, and a new transfer is started.
Normally, SPI data is transferred most significant bit (MSB) first. If the least significant bit first enable
(LSBFE) bit is set, SPI data is shifted LSB first.
When the SPI is configured as a slave, its SS pin must be driven low before a transfer starts and SS must
stay low throughout the transfer. If a clock format where CPHA = 0 is selected, SS must be driven to a
logic 1 between successive transfers. If CPHA = 1, SS may remain low between successive transfers. See
Section 13.5.1, “SPI Clock Formats” for more details.
Because the transmitter and receiver are double buffered, a second byte, in addition to the byte currently
being shifted out, can be queued into the transmit data buffer, and a previously received character can be
in the receive data buffer while a new character is being shifted in. The SPTEF flag indicates when the
transmit buffer has room for a new character. The SPRF flag indicates when a received character is
available in the receive data buffer. The received character must be read out of the receive buffer (read
SPIxD) before the next transfer is finished or a receive overrun error results.
In the case of a receive overrun, the new data is lost because the receive buffer still held the previous
character and was not ready to accept the new data. There is no indication for such an overrun condition
so the application system designer must ensure that previous data has been read from the receive buffer
before a new transfer is initiated.
13.5.1 SPI Clock Formats
To accommodate a wide variety of synchronous serial peripherals from different manufacturers, the SPI
system has a clock polarity (CPOL) bit and a clock phase (CPHA) control bit to select one of four clock
formats for data transfers. CPOL selectively inserts an inverter in series with the clock. CPHA chooses
between two different clock phase relationships between the clock and data.
Figure 13-10 shows the clock formats when CPHA = 1. At the top of the figure, the eight bit times are
shown for reference with bit 1 starting at the first SPSCK edge and bit 8 ending one-half SPSCK cycle after
the sixteenth SPSCK edge. The MSB first and LSB first lines show the order of SPI data bits depending
on the setting in LSBFE. Both variations of SPSCK polarity are shown, but only one of these waveforms
applies for a specific transfer, depending on the value in CPOL. The SAMPLE IN waveform applies to the
MOSI input of a slave or the MISO input of a master. The MOSI waveform applies to the MOSI output
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Freescale Semiconductor
Chapter 13 Serial Peripheral Interface (S08SPIV3)
pin from a master and the MISO waveform applies to the MISO output from a slave. The SS OUT
waveform applies to the slave select output from a master (provided MODFEN and SSOE = 1). The master
SS output goes to active low one-half SPSCK cycle before the start of the transfer and goes back high at
the end of the eighth bit time of the transfer. The SS IN waveform applies to the slave select input of a
slave.
BIT TIME #
(REFERENCE)
1
2
...
6
7
8
SPSCK
(CPOL = 0)
SPSCK
(CPOL = 1)
SAMPLE IN
(MISO OR MOSI)
MOSI
(MASTER OUT)
MSB FIRST
LSB FIRST
BIT 7
BIT 0
BIT 6
BIT 1
...
...
BIT 2
BIT 5
BIT 1
BIT 6
BIT 0
BIT 7
MISO
(SLAVE OUT)
SS OUT
(MASTER)
SS IN
(SLAVE)
Figure 13-10. SPI Clock Formats (CPHA = 1)
When CPHA = 1, the slave begins to drive its MISO output when SS goes to active low, but the data is not
defined until the first SPSCK edge. The first SPSCK edge shifts the first bit of data from the shifter onto
the MOSI output of the master and the MISO output of the slave. The next SPSCK edge causes both the
master and the slave to sample the data bit values on their MISO and MOSI inputs, respectively. At the
third SPSCK edge, the SPI shifter shifts one bit position which shifts in the bit value that was just sampled,
and shifts the second data bit value out the other end of the shifter to the MOSI and MISO outputs of the
master and slave, respectively. When CHPA = 1, the slave’s SS input is not required to go to its inactive
high level between transfers.
Figure 13-11 shows the clock formats when CPHA = 0. At the top of the figure, the eight bit times are
shown for reference with bit 1 starting as the slave is selected (SS IN goes low), and bit 8 ends at the last
SPSCK edge. The MSB first and LSB first lines show the order of SPI data bits depending on the setting
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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245
Chapter 13 Serial Peripheral Interface (S08SPIV3)
in LSBFE. Both variations of SPSCK polarity are shown, but only one of these waveforms applies for a
specific transfer, depending on the value in CPOL. The SAMPLE IN waveform applies to the MOSI input
of a slave or the MISO input of a master. The MOSI waveform applies to the MOSI output pin from a
master and the MISO waveform applies to the MISO output from a slave. The SS OUT waveform applies
to the slave select output from a master (provided MODFEN and SSOE = 1). The master SS output goes
to active low at the start of the first bit time of the transfer and goes back high one-half SPSCK cycle after
the end of the eighth bit time of the transfer. The SS IN waveform applies to the slave select input of a
slave.
BIT TIME #
(REFERENCE)
1
2
...
6
7
8
SPSCK
(CPOL = 0)
SPSCK
(CPOL = 1)
SAMPLE IN
(MISO OR MOSI)
MOSI
(MASTER OUT)
MSB FIRST
LSB FIRST
BIT 7
BIT 0
BIT 6
BIT 1
...
...
BIT 2
BIT 5
BIT 1
BIT 6
BIT 0
BIT 7
MISO
(SLAVE OUT)
SS OUT
(MASTER)
SS IN
(SLAVE)
Figure 13-11. SPI Clock Formats (CPHA = 0)
When CPHA = 0, the slave begins to drive its MISO output with the first data bit value (MSB or LSB
depending on LSBFE) when SS goes to active low. The first SPSCK edge causes both the master and the
slave to sample the data bit values on their MISO and MOSI inputs, respectively. At the second SPSCK
edge, the SPI shifter shifts one bit position which shifts in the bit value that was just sampled and shifts the
second data bit value out the other end of the shifter to the MOSI and MISO outputs of the master and
slave, respectively. When CPHA = 0, the slave’s SS input must go to its inactive high level between
transfers.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Freescale Semiconductor
Chapter 13 Serial Peripheral Interface (S08SPIV3)
13.5.2 SPI Interrupts
There are three flag bits, two interrupt mask bits, and one interrupt vector associated with the SPI system.
The SPI interrupt enable mask (SPIE) enables interrupts from the SPI receiver full flag (SPRF) and mode
fault flag (MODF). The SPI transmit interrupt enable mask (SPTIE) enables interrupts from the SPI
transmit buffer empty flag (SPTEF). When one of the flag bits is set, and the associated interrupt mask bit
is set, a hardware interrupt request is sent to the CPU. If the interrupt mask bits are cleared, software can
poll the associated flag bits instead of using interrupts. The SPI interrupt service routine (ISR) should
check the flag bits to determine what event caused the interrupt. The service routine should also clear the
flag bit(s) before returning from the ISR (usually near the beginning of the ISR).
13.5.3 Mode Fault Detection
A mode fault occurs and the mode fault flag (MODF) becomes set when a master SPI device detects an
error on the SS pin (provided the SS pin is configured as the mode fault input signal). The SS pin is
configured to be the mode fault input signal when MSTR = 1, mode fault enable is set (MODFEN = 1),
and slave select output enable is clear (SSOE = 0).
The mode fault detection feature can be used in a system where more than one SPI device might become
a master at the same time. The error is detected when a master’s SS pin is low, indicating that some other
SPI device is trying to address this master as if it were a slave. This could indicate a harmful output driver
conflict, so the mode fault logic is designed to disable all SPI output drivers when such an error is detected.
When a mode fault is detected, MODF is set and MSTR is cleared to change the SPI configuration back
to slave mode. The output drivers on the SPSCK, MOSI, and MISO (if not bidirectional mode) are
disabled.
MODF is cleared by reading it while it is set, then writing to the SPI control register 1 (SPIxC1). User
software should verify the error condition has been corrected before changing the SPI back to master
mode.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
247
Chapter 13 Serial Peripheral Interface (S08SPIV3)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
248
Freescale Semiconductor
Chapter 14
Inter-Integrated Circuit (S08IICV1)
14.1 Introduction
The inter-integrated circuit (IIC) provides a method of communication between a number of devices. The
interface is designed to operate up to 100 kbps with maximum bus loading and timing. The device is
capable of operating at higher baud rates, up to a maximum of clock/20, with reduced bus loading. The
maximum communication length and the number of devices that can be connected are limited by a
maximum bus capacitance of 400 pF.
Figure 14-1 is the MC9S08LC60 Series block diagram with the IIC block highlighted.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
249
Chapter 14 Inter-Integrated Circuit (S08IICV1)
HCS08 CORE
ON-CHIP ICE
DEBUG MODULE (DBG)
CPU
INT
ADP[7:4]
ADP3
4
PTA[7:4]/KBI1P[7:4]/ADP[7:4]
12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
ADP2
BKGD
BKP
ADP1
ADP0
HCS08 SYSTEM CONTROL
ACMP–
ACMP+
ANALOG COMPARATOR
PTA3/KBI1P3/ADP3/ACMP–
PTA2/KBI1P2/ADP2/ACMP+
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
(ACMP)
8-BIT KEYBOARD
8
PTA[1:0]/KBI1P[1:0]/ADP[1:0]
INTERRUPT (KBI1)
RTI
COP
LVD
IRQ
SS1
PTB7/KBI2P4/SS1
PTB6/KBI2P3/SPSCK1
SPSCK1
MISO1
SERIAL PERIPHERAL
INTERFACE (SPI1)
USER FLASH A
MOSI1
(LC60 = 32,768 BYTES)
(LC36 = 24,576 BYTES)
SCL
SDA
PTB5/MOSI1/SCL
PTB4/MISO1/SDA
IIC MODULE (IIC)
USER FLASH B
PTB3/KBI2P2
PTB2/RESET
RESET
(LC60 = 28,464 BYTES)
(LC36 = 12,288 BYTES)
5
3
8-BIT KEYBOARD
INTERRUPT (KBI2)
XTAL
EXTAL
USER RAM
PTB1/KBI2P1/XTAL
PTB0/KBI2P0/EXTAL
(LC60 = 4096 BYTES)
(LC36 = 2560 BYTES)
IRQ
PTC7/KBI2P7/IRQ/TPMCLK
PTC6/BKGD/MS
INTERNAL CLOCK
GENERATOR (ICG)
TPM2CH1
TPM2CH0
2-CHANNEL TIMER/PWM
PTC5/KBI2P6/TPM2CH1
PTC4/KBI2P5/TPM2CH0
(TPM2)
TPMCLK
TPM1CH0
TPM1CH1
LOW-POWER OSCILLATOR
2-CHANNEL TIMER/PWM
(TPM1)
V
LCD
SS2
V
LL1
PTC3/SS2/TPM1CH1
SPSCK2
MOSI2
MISO2
V
SERIAL PERIPHERAL
LL2
PTC2/SPSCK2/TPM1CH0
LIQUID CRYSTAL
DISPLAY DRIVER
LCD
INTERFACE (SPI2)
V
LL3
V
V
CAP1
CAP2
TxD
RxD
PTC1/MOSI2/TxD
PTC0/MISO2/RxD
SERIAL COMMUNICATIONS
INTERFACE (SCI)
BP[2:0]
BP3/FP40
FP[39:0]
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pulldown device if IRQ enabled
(IRQPE = 1).
V
DD
VOLTAGE
3. IRQ does not have a clamp diode to V . IRQ should not be driven above V
.
DD
DD
V
4. Pin contains integrated pullup device.
REGULATOR
SS
5. Input-only RESET is shared with output-only PTB2. Default function after reset is
RESET.
6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is
output-only PTC7.
VREFH
VREFL
7. PTC6/BKGD/MS is an output only pin
8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP.
9. ACMPO is not available.
VDDAD
VSSAD
Figure 14-1. MC9S08LC60 Series Block Diagram Highlighting IIC Block and Pins
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
250
Freescale Semiconductor
Chapter 14 Inter-Integrated Circuit (S08IICV1)
14.1.1 Features
The IIC includes these distinctive features:
•
•
•
•
•
•
•
•
•
•
•
Compatible with IIC bus standard
Multi-master operation
Software programmable for one of 64 different serial clock frequencies
Software selectable acknowledge bit
Interrupt driven byte-by-byte data transfer
Arbitration lost interrupt with automatic mode switching from master to slave
Calling address identification interrupt
START and STOP signal generation/detection
Repeated START signal generation
Acknowledge bit generation/detection
Bus busy detection
14.1.2 Modes of Operation
The IIC functions the same in normal and monitor modes. A brief description of the IIC in the various
MCU modes is given here.
•
•
•
Run mode — This is the basic mode of operation. To conserve power in this mode, disable the
module.
Wait mode — The module will continue to operate while the MCU is in wait mode and can provide
a wake-up interrupt.
Stop mode — The IIC is inactive in stop3 mode for reduced power consumption. The STOP
instruction does not affect IIC register states. Stop2 and stop1 will reset the register contents.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
251
Chapter 14 Inter-Integrated Circuit (S08IICV1)
14.1.3 Block Diagram
Figure 14-2 is a block diagram of the IIC.
ADDRESS
DATA BUS
DATA_MUX
INTERRUPT
ADDR_DECODE
CTRL_REG
FREQ_REG
ADDR_REG
STATUS_REG
DATA_REG
INPUT
SYNC
IN/OUT
DATA
START
STOP
SHIFT
ARBITRATION
CONTROL
REGISTER
CLOCK
ADDRESS
COMPARE
CONTROL
SDA
SCL
Figure 14-2. IIC Functional Block Diagram
14.2 External Signal Description
This section describes each user-accessible pin signal.
14.2.1 SCL — Serial Clock Line
The bidirectional SCL is the serial clock line of the IIC system.
14.2.2 SDA — Serial Data Line
The bidirectional SDA is the serial data line of the IIC system.
14.3 Register Definition
This section consists of the IIC register descriptions in address order.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Freescale Semiconductor
Chapter 14 Inter-Integrated Circuit (S08IICV1)
Refer to the direct-page register summary in the Memory chapter of this data sheet for the absolute address
assignments for all IIC registers. This section refers to registers and control bits only by their names. A
Freescale-provided equate or header file is used to translate these names into the appropriate absolute
addresses.
14.3.1 IIC Address Register (IICA)
7
6
5
4
3
2
1
0
R
W
0
ADDR
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 14-3. IIC Address Register (IICA)
Table 14-1. IICA Register Field Descriptions
Description
Field
7:1
IIC Address Register — The ADDR contains the specific slave address to be used by the IIC module. This is
ADDR[7:1] the address the module will respond to when addressed as a slave.
14.3.2 IIC Frequency Divider Register (IICF)
7
6
5
4
3
2
1
0
R
W
MULT
ICR
Reset
0
0
0
0
0
0
0
0
Figure 14-4. IIC Frequency Divider Register (IICF)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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253
Chapter 14 Inter-Integrated Circuit (S08IICV1)
Table 14-2. IICA Register Field Descriptions
Field
Description
7:6
IIC Multiplier Factor — The MULT bits define the multiplier factor mul. This factor is used along with the SCL
MULT
divider to generate the IIC baud rate. The multiplier factor mul as defined by the MULT bits is provided below.
00 mul = 01
01 mul = 02
10 mul = 04
11 Reserved
5:0
ICR
IIC Clock Rate — The ICR bits are used to prescale the bus clock for bit rate selection. These bits are used to
define the SCL divider and the SDA hold value. The SCL divider multiplied by the value provided by the MULT
register (multiplier factor mul) is used to generate IIC baud rate.
IIC baud rate = bus speed (Hz)/(mul * SCL divider)
SDA hold time is the delay from the falling edge of the SCL (IIC clock) to the changing of SDA (IIC data). The
ICR is used to determine the SDA hold value.
SDA hold time = bus period (s) * SDA hold value
Table 14-3 provides the SCL divider and SDA hold values for corresponding values of the ICR. These values can
be used to set IIC baud rate and SDA hold time. For example:
Bus speed = 8 MHz
MULT is set to 01 (mul = 2)
Desired IIC baud rate = 100 kbps
IIC baud rate = bus speed (Hz)/(mul * SCL divider)
100000 = 8000000/(2*SCL divider)
SCL divider = 40
Table 14-3 shows that ICR must be set to 0B to provide an SCL divider of 40 and that this will result in an SDA
hold value of 9.
SDA hold time = bus period (s) * SDA hold value
SDA hold time = 1/8000000 * 9 = 1.125 μs
If the generated SDA hold value is not acceptable, the MULT bits can be used to change the ICR. This will result
in a different SDA hold value.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
254
Freescale Semiconductor
Chapter 14 Inter-Integrated Circuit (S08IICV1)
Table 14-3. IIC Divider and Hold Values
ICR
(hex)
SDA Hold
Value
ICR
(hex)
SDA Hold
Value
SCL Divider
SCL Divider
00
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
0E
0F
10
11
12
13
14
15
16
17
18
19
1A
1B
1C
1D
1E
1F
20
22
7
7
20
21
22
23
24
25
26
27
28
29
2A
2B
2C
2D
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
3D
3E
3F
160
192
17
17
24
8
224
33
26
8
256
33
28
9
288
49
30
9
320
49
34
10
10
7
384
65
40
480
65
28
320
33
32
7
384
33
36
9
448
65
40
9
512
65
44
11
11
13
13
9
576
97
48
640
97
56
768
129
129
65
68
960
48
640
56
9
768
65
64
13
13
17
17
21
21
9
896
129
129
193
193
257
257
129
129
257
257
385
385
513
513
72
1024
1152
1280
1536
1920
1280
1536
1792
2048
2304
2560
3072
3840
80
88
104
128
80
96
9
112
128
144
160
192
240
17
17
25
25
33
33
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
255
Chapter 14 Inter-Integrated Circuit (S08IICV1)
14.3.3 IIC Control Register (IICC)
7
6
5
4
3
2
1
0
R
W
0
0
0
IICEN
IICIE
MST
TX
TXAK
RSTA
0
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 14-5. IIC Control Register (IICC)
Table 14-4. IICC Register Field Descriptions
Description
Field
7
IIC Enable — The IICEN bit determines whether the IIC module is enabled.
IICEN
0 IIC is not enabled.
1 IIC is enabled.
6
IICIE
IIC Interrupt Enable — The IICIE bit determines whether an IIC interrupt is requested.
0 IIC interrupt request not enabled.
1 IIC interrupt request enabled.
5
Master Mode Select — The MST bit is changed from a 0 to a 1 when a START signal is generated on the bus
MST
and master mode is selected. When this bit changes from a 1 to a 0 a STOP signal is generated and the mode
of operation changes from master to slave.
0 Slave Mode.
1 Master Mode.
4
Transmit Mode Select — The TX bit selects the direction of master and slave transfers. In master mode this bit
TX
should be set according to the type of transfer required. Therefore, for address cycles, this bit will always be high.
When addressed as a slave this bit should be set by software according to the SRW bit in the status register.
0 Receive.
1 Transmit.
3
Transmit Acknowledge Enable — This bit specifies the value driven onto the SDA during data acknowledge
cycles for both master and slave receivers.
TXAK
0 An acknowledge signal will be sent out to the bus after receiving one data byte.
1 No acknowledge signal response is sent.
2
Repeat START — Writing a one to this bit will generate a repeated START condition provided it is the current
RSTA
master. This bit will always be read as a low. Attempting a repeat at the wrong time will result in loss of arbitration.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Freescale Semiconductor
Chapter 14 Inter-Integrated Circuit (S08IICV1)
14.3.4 IIC Status Register (IICS)
7
6
5
4
3
2
1
0
R
W
TCF
BUSY
0
SRW
RXAK
IAAS
ARBL
IICIF
Reset
1
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 14-6. IIC Status Register (IICS)
Table 14-5. IICS Register Field Descriptions
Description
Field
7
TCF
Transfer Complete Flag — This bit is set on the completion of a byte transfer. Note that this bit is only valid
during or immediately following a transfer to the IIC module or from the IIC module.The TCF bit is cleared by
reading the IICD register in receive mode or writing to the IICD in transmit mode.
0 Transfer in progress.
1 Transfer complete.
6
Addressed as a Slave — The IAAS bit is set when the calling address matches the programmed slave address.
IAAS
Writing the IICC register clears this bit.
0 Not addressed.
1 Addressed as a slave.
5
Bus Busy — The BUSY bit indicates the status of the bus regardless of slave or master mode. The BUSY bit is
BUSY
set when a START signal is detected and cleared when a STOP signal is detected.
0 Bus is idle.
1 Bus is busy.
4
Arbitration Lost — This bit is set by hardware when the arbitration procedure is lost. The ARBL bit must be
ARBL
cleared by software, by writing a one to it.
0 Standard bus operation.
1 Loss of arbitration.
2
Slave Read/Write — When addressed as a slave the SRW bit indicates the value of the R/W command bit of
the calling address sent to the master.
SRW
0 Slave receive, master writing to slave.
1 Slave transmit, master reading from slave.
1
IIC Interrupt Flag — The IICIF bit is set when an interrupt is pending. This bit must be cleared by software, by
IICIF
writing a one to it in the interrupt routine. One of the following events can set the IICIF bit:
•
•
•
One byte transfer completes
Match of slave address to calling address
Arbitration lost
0 No interrupt pending.
1 Interrupt pending.
0
Receive Acknowledge — When the RXAK bit is low, it indicates an acknowledge signal has been received after
RXAK
the completion of one byte of data transmission on the bus. If the RXAK bit is high it means that no acknowledge
signal is detected.
0 Acknowledge received.
1 No acknowledge received.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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257
Chapter 14 Inter-Integrated Circuit (S08IICV1)
14.3.5 IIC Data I/O Register (IICD)
7
6
5
4
3
2
1
0
R
W
DATA
Reset
0
0
0
0
0
0
0
0
Figure 14-7. IIC Data I/O Register (IICD)
Table 14-6. IICD Register Field Descriptions
Description
Field
7:0
Data — In master transmit mode, when data is written to the IICD, a data transfer is initiated. The most significant
DATA
bit is sent first. In master receive mode, reading this register initiates receiving of the next byte of data.
NOTE
When transmitting out of master receive mode, the IIC mode should be
switched before reading the IICD register to prevent an inadvertent
initiation of a master receive data transfer.
In slave mode, the same functions are available after an address match has occurred.
Note that the TX bit in IICC must correctly reflect the desired direction of transfer in master and slave
modes for the transmission to begin. For instance, if the IIC is configured for master transmit but a master
receive is desired, then reading the IICD will not initiate the receive.
Reading the IICD will return the last byte received while the IIC is configured in either master receive or
slave receive modes. The IICD does not reflect every byte that is transmitted on the IIC bus, nor can
software verify that a byte has been written to the IICD correctly by reading it back.
In master transmit mode, the first byte of data written to IICD following assertion of MST is used for the
address transfer and should comprise of the calling address (in bit 7–bit 1) concatenated with the required
R/W bit (in position bit 0).
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
258
Freescale Semiconductor
Chapter 14 Inter-Integrated Circuit (S08IICV1)
14.4 Functional Description
This section provides a complete functional description of the IIC module.
14.4.1 IIC Protocol
The IIC bus system uses a serial data line (SDA) and a serial clock line (SCL) for data transfer. All devices
connected to it must have open drain or open collector outputs. A logic AND function is exercised on both
lines with external pull-up resistors. The value of these resistors is system dependent.
Normally, a standard communication is composed of four parts:
•
•
•
•
START signal
Slave address transmission
Data transfer
STOP signal
The STOP signal should not be confused with the CPU STOP instruction. The IIC bus system
communication is described briefly in the following sections and illustrated in Figure 14-8.
MSB
1
LSB
8
MSB
1
LSB
8
SCL
SDA
2
3
4
5
6
7
9
2
3
4
5
6
7
9
AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W
XXX
D7 D6 D5 D4 D3 D2 D1 D0
START
SIGNAL
CALLING ADDRESS
READ/ ACK
BIT
WRITE
DATA BYTE
NO STOP
ACK SIGNAL
BIT
MSB
1
LSB
MSB
LSB
8
SCL
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
9
SDA
AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W
XX
AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W
START
SIGNAL
CALLING ADDRESS
READ/ ACK REPEATED
BIT START
SIGNAL
NEW CALLING ADDRESS
NO STOP
ACK SIGNAL
BIT
READ/
WRITE
WRITE
Figure 14-8. IIC Bus Transmission Signals
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
259
Chapter 14 Inter-Integrated Circuit (S08IICV1)
14.4.1.1 START Signal
When the bus is free; i.e., no master device is engaging the bus (both SCL and SDA lines are at logical
high), a master may initiate communication by sending a START signal. As shown in Figure 14-8, a
START signal is defined as a high-to-low transition of SDA while SCL is high. This signal denotes the
beginning of a new data transfer (each data transfer may contain several bytes of data) and brings all slaves
out of their idle states.
14.4.1.2 Slave Address Transmission
The first byte of data transferred immediately after the START signal is the slave address transmitted by
the master. This is a seven-bit calling address followed by a R/W bit. The R/W bit tells the slave the desired
direction of data transfer.
1 = Read transfer, the slave transmits data to the master.
0 = Write transfer, the master transmits data to the slave.
Only the slave with a calling address that matches the one transmitted by the master will respond by
sending back an acknowledge bit. This is done by pulling the SDA low at the 9th clock (see Figure 14-8).
No two slaves in the system may have the same address. If the IIC module is the master, it must not transmit
an address that is equal to its own slave address. The IIC cannot be master and slave at the same time.
However, if arbitration is lost during an address cycle, the IIC will revert to slave mode and operate
correctly even if it is being addressed by another master.
14.4.1.3 Data Transfer
Before successful slave addressing is achieved, the data transfer can proceed byte-by-byte in a direction
specified by the R/W bit sent by the calling master.
All transfers that come after an address cycle are referred to as data transfers, even if they carry sub-address
information for the slave device
Each data byte is 8 bits long. Data may be changed only while SCL is low and must be held stable while
SCL is high as shown in Figure 14-8. There is one clock pulse on SCL for each data bit, the MSB being
transferred first. Each data byte is followed by a 9th (acknowledge) bit, which is signalled from the
receiving device. An acknowledge is signalled by pulling the SDA low at the ninth clock. In summary, one
complete data transfer needs nine clock pulses.
If the slave receiver does not acknowledge the master in the 9th bit time, the SDA line must be left high
by the slave. The master interprets the failed acknowledge as an unsuccessful data transfer.
If the master receiver does not acknowledge the slave transmitter after a data byte transmission, the slave
interprets this as an end of data transfer and releases the SDA line.
In either case, the data transfer is aborted and the master does one of two things:
•
•
Relinquishes the bus by generating a STOP signal.
Commences a new calling by generating a repeated START signal.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Freescale Semiconductor
Chapter 14 Inter-Integrated Circuit (S08IICV1)
14.4.1.4 STOP Signal
The master can terminate the communication by generating a STOP signal to free the bus. However, the
master may generate a START signal followed by a calling command without generating a STOP signal
first. This is called repeated START. A STOP signal is defined as a low-to-high transition of SDA while
SCL at logical 1 (see Figure 14-8).
The master can generate a STOP even if the slave has generated an acknowledge at which point the slave
must release the bus.
14.4.1.5 Repeated START Signal
As shown in Figure 14-8, a repeated START signal is a START signal generated without first generating a
STOP signal to terminate the communication. This is used by the master to communicate with another
slave or with the same slave in different mode (transmit/receive mode) without releasing the bus.
14.4.1.6 Arbitration Procedure
The IIC bus is a true multi-master bus that allows more than one master to be connected on it. If two or
more masters try to control the bus at the same time, a clock synchronization procedure determines the bus
clock, for which the low period is equal to the longest clock low period and the high is equal to the shortest
one among the masters. The relative priority of the contending masters is determined by a data arbitration
procedure, a bus master loses arbitration if it transmits logic 1 while another master transmits logic 0. The
losing masters immediately switch over to slave receive mode and stop driving SDA output. In this case,
the transition from master to slave mode does not generate a STOP condition. Meanwhile, a status bit is
set by hardware to indicate loss of arbitration.
14.4.1.7 Clock Synchronization
Because wire-AND logic is performed on the SCL line, a high-to-low transition on the SCL line affects all
the devices connected on the bus. The devices start counting their low period and after a device’s clock has
gone low, it holds the SCL line low until the clock high state is reached. However, the change of low to
high in this device clock may not change the state of the SCL line if another device clock is still within its
low period. Therefore, synchronized clock SCL is held low by the device with the longest low period.
Devices with shorter low periods enter a high wait state during this time (see Figure 14-9). When all
devices concerned have counted off their low period, the synchronized clock SCL line is released and
pulled high. There is then no difference between the device clocks and the state of the SCL line and all the
devices start counting their high periods. The first device to complete its high period pulls the SCL line
low again.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
261
Chapter 14 Inter-Integrated Circuit (S08IICV1)
START COUNTING HIGH PERIOD
DELAY
SCL1
SCL2
SCL
INTERNAL COUNTER RESET
Figure 14-9. IIC Clock Synchronization
14.4.1.8 Handshaking
The clock synchronization mechanism can be used as a handshake in data transfer. Slave devices may hold
the SCL low after completion of one byte transfer (9 bits). In such case, it halts the bus clock and forces
the master clock into wait states until the slave releases the SCL line.
14.4.1.9 Clock Stretching
The clock synchronization mechanism can be used by slaves to slow down the bit rate of a transfer. After
the master has driven SCL low the slave can drive SCL low for the required period and then release it. If
the slave SCL low period is greater than the master SCL low period then the resulting SCL bus signal low
period is stretched.
14.5 Resets
The IIC is disabled after reset. The IIC cannot cause an MCU reset.
14.6 Interrupts
The IIC generates a single interrupt.
An interrupt from the IIC is generated when any of the events in Table 14-7 occur provided the IICIE bit
is set. The interrupt is driven by bit IICIF (of the IIC status register) and masked with bit IICIE (of the IIC
control register). The IICIF bit must be cleared by software by writing a one to it in the interrupt routine.
The user can determine the interrupt type by reading the status register.
Table 14-7. Interrupt Summary
Interrupt Source
Status
Flag
Local Enable
Complete 1-byte transfer
Match of received calling address
Arbitration Lost
TCF
IAAS
ARBL
IICIF
IICIF
IICIF
IICIE
IICIE
IICIE
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Freescale Semiconductor
Chapter 14 Inter-Integrated Circuit (S08IICV1)
14.6.1 Byte Transfer Interrupt
The TCF (transfer complete flag) bit is set at the falling edge of the 9th clock to indicate the completion of
byte transfer.
14.6.2 Address Detect Interrupt
When the calling address matches the programmed slave address (IIC address register), the IAAS bit in
the status register is set. The CPU is interrupted provided the IICIE is set. The CPU must check the SRW
bit and set its Tx mode accordingly.
14.6.3 Arbitration Lost Interrupt
The IIC is a true multi-master bus that allows more than one master to be connected on it. If two or more
masters try to control the bus at the same time, the relative priority of the contending masters is determined
by a data arbitration procedure. The IIC module asserts this interrupt when it loses the data arbitration
process and the ARBL bit in the status register is set.
Arbitration is lost in the following circumstances:
•
•
SDA sampled as a low when the master drives a high during an address or data transmit cycle.
SDA sampled as a low when the master drives a high during the acknowledge bit of a data receive
cycle.
•
•
•
A START cycle is attempted when the bus is busy.
A repeated START cycle is requested in slave mode.
A STOP condition is detected when the master did not request it.
This bit must be cleared by software by writing a one to it.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
263
Chapter 14 Inter-Integrated Circuit (S08IICV1)
14.7 Initialization/Application Information
Module Initialization (Slave)
1. Write: IICA
—
to set the slave address
2. Write: IICC
—
to enable IIC and interrupts
3. Initialize RAM variables (IICEN = 1 and IICIE = 1) for transmit data
4. Initialize RAM variables used to achieve the routine shown in Figure 14-11
Module Initialization (Master)
1. Write: IICF
—
to set the IIC baud rate (example provided in this chapter)
2. Write: IICC
—
to enable IIC and interrupts
3. Initialize RAM variables (IICEN = 1 and IICIE = 1) for transmit data
4. Initialize RAM variables used to achieve the routine shown in Figure 14-11
5. Write: IICC
—
to enable TX
6. Write: IICC
—
to enable MST (master mode)
7. Write: IICD
—
with the address of the target slave. (The LSB of this byte will determine whether the communication is
master receive or transmit.)
Module Use
The routine shown in Figure 14-11 can handle both master and slave IIC operations. For slave operation, an
incoming IIC message that contains the proper address will begin IIC communication. For master operation,
communication must be initiated by writing to the IICD register.
Register Model
ADDR
Address to which the module will respond when addressed as a slave (in slave mode)
MULT
Baud rate = BUSCLK / (2 x MULT x (SCL DIVIDER))
0
IICA
IICF
ICR
IICEN
Module configuration
TCF IAAS
Module status flags
IICIE
MST
TX
TXAK
RSTA
0
0
IICC
IICS
IICD
BUSY
ARBL
0
SRW
IICIF
RXAK
DATA
Data register; Write to transmit IIC data read to read IIC data
Figure 14-10. IIC Module Quick Start
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
264
Freescale Semiconductor
Chapter 14 Inter-Integrated Circuit (S08IICV1)
Clear
IICIF
Master
Mode
?
Y
N
Y
Arbitration
Lost
TX
RX
Tx/Rx
?
?
N
Last Byte
Transmitted
Clear ARBL
Y
N
?
N
Last
Byte to Be Read
?
Y
N
RXAK=0
?
IAAS=1
?
IAAS=1
?
Y
N
Y
Y
N
Data Transfer
Address Transfer
Y
End of
Addr Cycle
(Master Rx)
?
2nd Last
Byte to Be Read
?
(Read)
Y
Y
SRW=1
?
TX/RX
?
RX
TX
(Write)
N
N
N
ACK from
Receiver
?
Y
Generate
Stop Signal
(MST = 0)
Write Next
Byte to IICD
Set TX
Mode
Set TXACK =1
N
Read Data
from IICD
and Store
Tx Next
Byte
Write Data
to IICD
Switch to
Rx Mode
Set RX
Mode
Switch to
Rx Mode
Generate
Stop Signal
(MST = 0)
Read Data
from IICD
and Store
Dummy Read
from IICD
Dummy Read
from IICD
Dummy Read
from IICD
RTI
Figure 14-11. Typical IIC Interrupt Routine
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
265
Chapter 14 Inter-Integrated Circuit (S08IICV1)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
266
Freescale Semiconductor
Chapter 15
Analog-to-Digital Converter (S08ADC12V1)
15.1 Introduction
The 12-bit analog-to-digital converter (ADC) is a successive approximation ADC designed for operation
within an integrated microcontroller system-on-chip.
15.1.1 ADC Configuration Information
The ADC channel assignments, alternate clock function, and hardware trigger function are configured as
described in this section for the MC9S08LC60/36/20 Family of devices.
15.1.1.1 Channel Assignments
The ADC channel assignments for the MC9S08LC60/36/20 devices are shown in Table 15-1. Reserved
channels convert to an unknown value.
Table 15-1. ADC Channel Assignment
ADCH
Channel
Input
Pin Control
ADCH
Channel
Input
Pin Control
00000
00001
00010
00011
00100
00101
00110
00111
01000
01001
01010
01011
01100
01101
01110
01111
AD0
AD1
PTA0/ADP0
PTA1/ADP1
PTA2/ADP2
PTA3/ADP3
PTA4/ADP4
PTA5/ADP5
PTA6/ADP6
PTA7/ADP7
VREFL
ADPC0
ADPC1
ADPC2
ADPC3
ADPC4
ADPC5
ADPC6
ADPC7
N/A
10000
10001
10010
10011
10100
10101
10110
10111
11000
11001
11010
11011
11100
11101
11110
11111
AD16
AD17
AD18
AD19
AD20
AD21
AD22
AD23
AD24
AD25
AD26
AD27
VREFH
VREFH
VREFL
VREFL
VREFL
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
AD2
VREFL
AD3
VSS
AD4
VLCD
AD5
VLL1
AD6
VDDASW
VDDA
AD7
AD8
VDDSW
AD9
VREFL
N/A
VDD
AD10
AD11
AD12
AD13
AD14
AD15
VREFL
N/A
Temperature Sensor
Internal Bandgap1
VREFH
VREFL
N/A
VREFL
N/A
VREFL
N/A
VREFH
VREFL
N/A
VREFL
VREFL
N/A
Module
None
Disabled
1
Requires BGBE =1 in SPMSC1 see Section 5.8.8, “System Power Management Status and Control 1
Register (SPMSC1)”. For value of bandgap voltage reference see Section A.5, “DC Characteristics”.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Chapter 15 Analog-to-Digital Converter (S08ADC12V1)
15.1.1.2 Alternate Clock
The ADC is capable of performing conversions using the MCU bus clock, the bus clock divided by two,
or the local asynchronous clock (ADACK) within the module. The alternate clock, ALTCLK, input for the
MC9S08LC60/36/20 MCU devices is not implemented.
15.1.1.3 Hardware Trigger
The ADC hardware trigger, ADHWT, is output from the real-time interrupt (RTI) counter. The RTI counter
can be clocked by either ICGERCLK or a nominal 1-kHz clock source within the RTI block.
The period of the RTI is determined by the input clock frequency and the RTIS bits. The RTI counter is a
free running counter that generates an overflow at the RTI rate determined by the RTIS bits. When the ADC
hardware trigger is enabled, a conversion is initiated upon a RTI counter overflow.
The RTI can be configured to cause a hardware trigger in MCU run, wait, and stop3.
15.1.1.4 Analog Pin Enables
The ADC on MC9S08LC60/36/20 MCU devices contains only one analog pin enable registers, APCTL1.
15.1.1.5 Temperature Sensor
To use the on-chip temperature sensor, the user must perform the following:
1. Configure ADC for long sample with a maximum of 1-MHz clock.
2. Convert the bandgap voltage reference channel (AD27).
By converting the digital value of the bandgap voltage reference channel using the value of VBG,
the user can determine V . For value of bandgap voltage, see Section A.5, “DC Characteristics”.
DD
3. Convert the temperature sensor channel (AD26).
By using the calculated value of V , convert the digital value of AD26 into a voltage, V
DD
temp
Equation 15-1 provides an approximate transfer function of the on-chip temperature sensor for:
= 3.0 V, Temp = 25˚C, using the ADC at f = 1.0 MHz, and configured for long sample.
V
DD
ADCK
TempC = (V
– 0.7013) ÷ (0.0017)
Eqn. 15-1
temp
0.0017 is the uncalibrated voltage versus temperature slope in V/˚C. Uncalibrated accuracy of the
temperature sensor is approximately 12˚C, using Equation 15-1.
4. To improve accuracy, the user should calibrate the bandgap voltage reference and temperature
sensor.
— Calibrating at 25˚C will improve accuracy to 4.5˚C.
— Calibration at three temperature points (–40˚C, 25˚C, and 125˚C) will improve accuracy to
2.5˚C. After calibration has been completed, the user must calculate the slope for both hot
and cold. In application code, the user would then calculate the temperature using
Equation 15-1 and then determine whether the temperature is above or below 25˚C. After
determining whether the temperature is above or below 25˚C, the user can recalculate the
temperature using either the hot or cold slope value obtained during calibration.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Freescale Semiconductor
Chapter 15 Analog-to-Digital Converter (S08ADC12V1)
15.1.1.6 Low-Power Mode Operation
The ADC is capable of running in stop3 mode but requires LVDSE in SPMSC1 to be set.
HCS08 CORE
ON-CHIP ICE
DEBUG MODULE (DBG)
CPU
INT
ADP[7:4]
ADP3
4
PTA[7:4]/KBI1P[7:4]/ADP[7:4]
12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
ADP2
BKGD
BKP
ADP1
ADP0
HCS08 SYSTEM CONTROL
ACMP–
ACMP+
ANALOG COMPARATOR
PTA3/KBI1P3/ADP3/ACMP–
PTA2/KBI1P2/ADP2/ACMP+
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
(ACMP)
8-BIT KEYBOARD
8
PTA[1:0]/KBI1P[1:0]/ADP[1:0]
INTERRUPT (KBI1)
RTI
COP
LVD
IRQ
SS1
PTB7/KBI2P4/SS1
PTB6/KBI2P3/SPSCK1
SPSCK1
MISO1
SERIAL PERIPHERAL
INTERFACE (SPI1)
USER FLASH A
MOSI1
(LC60 = 32,768 BYTES)
(LC36 = 24,576 BYTES)
SCL
SDA
PTB5/MOSI1/SCL
PTB4/MISO1/SDA
IIC MODULE (IIC)
USER FLASH B
PTB3/KBI2P2
PTB2/RESET
RESET
(LC60 = 28,464 BYTES)
(LC36 = 12,288 BYTES)
5
3
8-BIT KEYBOARD
INTERRUPT (KBI2)
XTAL
EXTAL
USER RAM
PTB1/KBI2P1/XTAL
PTB0/KBI2P0/EXTAL
(LC60 = 4096 BYTES)
(LC36 = 2560 BYTES)
IRQ
PTC7/KBI2P7/IRQ/TPMCLK
PTC6/BKGD/MS
INTERNAL CLOCK
GENERATOR (ICG)
TPM2CH1
TPM2CH0
2-CHANNEL TIMER/PWM
PTC5/KBI2P6/TPM2CH1
PTC4/KBI2P5/TPM2CH0
(TPM2)
TPMCLK
TPM1CH0
TPM1CH1
LOW-POWER OSCILLATOR
2-CHANNEL TIMER/PWM
(TPM1)
V
LCD
SS2
V
LL1
PTC3/SS2/TPM1CH1
SPSCK2
MOSI2
MISO2
V
SERIAL PERIPHERAL
LL2
PTC2/SPSCK2/TPM1CH0
LIQUID CRYSTAL
DISPLAY DRIVER
LCD
INTERFACE (SPI2)
V
LL3
V
V
CAP1
CAP2
TxD
RxD
PTC1/MOSI2/TxD
PTC0/MISO2/RxD
SERIAL COMMUNICATIONS
INTERFACE (SCI)
BP[2:0]
BP3/FP40
FP[39:0]
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pulldown device if IRQ enabled
(IRQPE = 1).
V
DD
VOLTAGE
3. IRQ does not have a clamp diode to V . IRQ should not be driven above V
.
DD
DD
V
4. Pin contains integrated pullup device.
REGULATOR
SS
5. Input-only RESET is shared with output-only PTB2. Default function after reset is
RESET.
6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is
output-only PTC7.
VREFH
VREFL
7. PTC6/BKGD/MS is an output only pin
8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP.
9. ACMPO is not available.
VDDAD
VSSAD
Figure 15-1. MC9S08LC60 Series Block Diagram Highlighting ADC Block and Pins
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
269
Chapter 15 Analog-to-Digital Converter (S08ADC12V1)
15.1.2 Features
Features of the ADC module include:
•
•
•
•
•
•
•
•
•
•
•
Linear successive approximation algorithm with 12 bits resolution
Up to 28 analog inputs
Output formatted in 12-, 10- or 8-bit right-justified format
Single or continuous conversion (automatic return to idle after single conversion)
Configurable sample time and conversion speed/power
Conversion complete flag and interrupt
Input clock selectable from up to four sources
Operation in wait or stop3 modes for lower noise operation
Asynchronous clock source for lower noise operation
Selectable asynchronous hardware conversion trigger
Automatic compare with interrupt for less-than, or greater-than or equal-to, programmable value
15.1.3 Block Diagram
Figure 15-2 provides a block diagram of the ADC module.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Freescale Semiconductor
Chapter 15 Analog-to-Digital Converter (S08ADC12V1)
Compare true
ADCSC1
ADCCFG
3
Async
Clock Gen
1
2
ADACK
Bus Clock
MCU STOP
ADHWT
ADCK
Clock
Divide
Control Sequencer
÷2
ALTCLK
AD0
1
2
AIEN
Interrupt
COCO
ADVIN
SAR Converter
AD27
V
V
REFH
Data Registers
REFL
Compare true
ADCSC2
3
Compare
Logic
Compare Value Registers
Figure 15-2. ADC Block Diagram
15.2 External Signal Description
The ADC module supports up to 28 separate analog inputs. It also requires four supply/reference/ground
connections.
Table 15-2. Signal Properties
Name
Function
AD27–AD0
VREFH
Analog Channel inputs
High reference voltage
Low reference voltage
Analog power supply
Analog ground
VREFL
VDDAD
VSSAD
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Chapter 15 Analog-to-Digital Converter (S08ADC12V1)
15.2.1 Analog Power (VDDAD
)
The ADC analog portion uses V
as its power connection. In some packages, V
is connected
DDAD
DDAD
internally to V . If externally available, connect the V
pin to the same voltage potential as V
.
DD
DD
DDAD
External filtering may be necessary to ensure clean V
for good results.
DDAD
15.2.2 Analog Ground (VSSAD
)
The ADC analog portion uses V
as its ground connection. In some packages, V
is connected
SSAD
SSAD
internally to V . If externally available, connect the V
pin to the same voltage potential as V .
SS
SSAD
SS
15.2.3 Voltage Reference High (VREFH
)
V
V
is the high reference voltage for the converter. In some packages, V
is connected internally to
REFH
REFH
. If externally available, V
may be connected to the same potential as V
, or may be
DDAD
REFH
DDAD
driven by an external source that is between the minimum V
spec and the V
potential (V
DDAD
DDAD REFH
must never exceed V
).
DDAD
15.2.4 Voltage Reference Low (VREFL
)
V
V
is the low reference voltage for the converter. In some packages, V
is connected internally to
REFL
REFL
SSAD
. If externally available, connect the V
pin to the same voltage potential as V
.
REFL
SSAD
15.2.5 Analog Channel Inputs (ADx)
The ADC module supports up to 28 separate analog inputs. An input is selected for conversion through the
ADCH channel select bits.
15.3 Register Definition
These memory mapped registers control and monitor operation of the ADC:
•
•
•
•
•
•
Status and control register, ADCSC1
Status and control register, ADCSC2
Data result registers, ADCRH and ADCRL
Compare value registers, ADCCVH and ADCCVL
Configuration register, ADCCFG
Pin enable registers, APCTL1, APCTL2, APCTL3
15.3.1 Status and Control Register 1 (ADCSC1)
This section describes the function of the ADC status and control register (ADCSC1). Writing ADCSC1
aborts the current conversion and initiates a new conversion (if the ADCH bits are equal to a value other
than all 1s).
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7
6
5
4
3
2
1
0
R
W
COCO
AIEN
ADCO
ADCH
Reset:
0
0
0
1
1
1
1
1
= Unimplemented or Reserved
Figure 15-3. Status and Control Register (ADCSC1)
Table 15-3. ADCSC1 Register Field Descriptions
Description
Field
7
Conversion Complete Flag — The COCO flag is a read-only bit which is set each time a conversion is
completed when the compare function is disabled (ACFE = 0). When the compare function is enabled (ACFE =
1) the COCO flag is set upon completion of a conversion only if the compare result is true. This bit is cleared
whenever ADCSC1 is written or whenever ADCRL is read.
COCO
0 Conversion not completed
1 Conversion completed
6
Interrupt Enable — AIEN is used to enable conversion complete interrupts. When COCO becomes set while
AIEN is high, an interrupt is asserted.
AIEN
0 Conversion complete interrupt disabled
1 Conversion complete interrupt enabled
5
Continuous Conversion Enable — ADCO is used to enable continuous conversions.
ADCO
0 One conversion following a write to the ADCSC1 when software triggered operation is selected, or one
conversion following assertion of ADHWT when hardware triggered operation is selected.
1 Continuous conversions initiated following a write to ADCSC1 when software triggered operation is selected.
Continuous conversions are initiated by an ADHWT event when hardware triggered operation is selected.
4:0
ADCH
Input Channel Select — The ADCH bits form a 5-bit field which is used to select one of the input channels. The
input channels are detailed in Figure 15-4.
The successive approximation converter subsystem is turned off when the channel select bits are all set to 1.
This feature allows for explicit disabling of the ADC and isolation of the input channel from all sources.
Terminating continuous conversions this way will prevent an additional, single conversion from being performed.
It is not necessary to set the channel select bits to all 1s to place the ADC in a low-power state when continuous
conversions are not enabled because the module automatically enters a low-power state when a conversion
completes.
Figure 15-4. Input Channel Select
ADCH
Input Select
ADCH
Input Select
00000
00001
00010
00011
00100
00101
00110
00111
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
10000
10001
10010
10011
10100
10101
10110
10111
AD16
AD17
AD18
AD19
AD20
AD21
AD22
AD23
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Figure 15-4. Input Channel Select (continued)
ADCH
Input Select
ADCH
Input Select
01000
01001
01010
01011
01100
01101
01110
01111
AD8
AD9
11000
11001
11010
11011
11100
11101
11110
11111
AD24
AD25
AD10
AD11
AD12
AD13
AD14
AD15
AD26
AD27
Reserved
VREFH
VREFL
Module disabled
15.3.2 Status and Control Register 2 (ADCSC2)
The ADCSC2 register is used to control the compare function, conversion trigger and conversion active of
the ADC module.
7
6
5
4
3
2
1
0
R
W
ADACT
0
0
ADTRG
ACFE
ACFGT
R1
R1
Reset:
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
1
Bits 1 and 0 are reserved bits that must always be written to 0.
Figure 15-5. Status and Control Register 2 (ADCSC2)
Table 15-4. ADCSC2 Register Field Descriptions
Description
Field
7
Conversion Active — ADACT indicates that a conversion is in progress. ADACT is set when a conversion is
initiated and cleared when a conversion is completed or aborted.
0 Conversion not in progress
ADACT
1 Conversion in progress
6
Conversion Trigger Select — ADTRG is used to select the type of trigger to be used for initiating a conversion.
Two types of trigger are selectable: software trigger and hardware trigger. When software trigger is selected, a
conversion is initiated following a write to ADCSC1. When hardware trigger is selected, a conversion is initiated
following the assertion of the ADHWT input.
ADTRG
0 Software trigger selected
1 Hardware trigger selected
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Table 15-4. ADCSC2 Register Field Descriptions (continued)
Field
Description
5
Compare Function Enable — ACFE is used to enable the compare function.
0 Compare function disabled
ACFE
1 Compare function enabled
4
Compare Function Greater Than Enable — ACFGT is used to configure the compare function to trigger when
the result of the conversion of the input being monitored is greater than or equal to the compare value. The
compare function defaults to triggering when the result of the compare of the input being monitored is less than
the compare value.
ACFGT
0 Compare triggers when input is less than compare level
1 Compare triggers when input is greater than or equal to compare level
15.3.3 Data Result High Register (ADCRH)
In 12-bit operation, ADCRH contains the upper four bits of the result of a 12-bit conversion.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
ADR11
ADR10
ADR9
ADR8
Reset:
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 15-6. Data Result High Register (ADCRH)
In 10-bit mode, ADCRH contains the upper two bits of the result of a 10-bit conversion. When configured
for 10-bit mode, ADR11 – ADR10 are equal to zero. When configured for 8-bit mode, ADR11 – ADR8
are equal to zero.
In both 12-bit and 10-bit mode, ADCRH is updated each time a conversion completes except when
automatic compare is enabled and the compare condition is not met. In 12-bit and 10-bit mode, reading
ADCRH prevents the ADC from transferring subsequent conversion results into the result registers until
ADCRL is read. If ADCRL is not read until after the next conversion is completed, then the intermediate
conversion result is lost. In 8-bit mode there is no interlocking with ADCRL.
In the case that the MODE bits are changed, any data in ADCRH becomes invalid.
15.3.4 Data Result Low Register (ADCRL)
ADCRL contains the lower eight bits of the result of a 12-bit or 10-bit conversion, and all eight bits of an
8-bit conversion. This register is updated each time a conversion completes except when automatic
compare is enabled and the compare condition is not met. In 12-bit and 10-bit mode, reading ADCRH
prevents the ADC from transferring subsequent conversion results into the result registers until ADCRL is
read. If ADCRL is not read until the after next conversion is completed, then the intermediate conversion
results will be lost. In 8-bit mode, there is no interlocking with ADCRH. In the case that the MODE bits
are changed, any data in ADCRL becomes invalid.
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7
6
5
4
3
2
1
0
R
W
ADR7
ADR6
ADR5
ADR4
ADR3
ADR2
ADR1
ADR0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 15-7. Data Result Low Register (ADCRL)
15.3.5 Compare Value High Register (ADCCVH)
In 12-bit mode, the ADCCVH register holds the upper four bits of the 12-bit compare value. These bits are
compared to the upper four bits of the result following a conversion in 12-bit mode when the compare
function is enabled.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
ADCV11
ADCV10
ADCV9
ADCV8
Reset:
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 15-8. Compare Value High Register (ADCCVH)
In 10-bit mode, the ADCCVH register holds the upper two bits of the 10-bit compare value (ADCV9 –
ADCV8). These bits are compared to the upper two bits of the result following a conversion in 10-bit mode
when the compare function is enabled.
In 8-bit mode, ADCCVH is not used during compare.
15.3.6 Compare Value Low Register (ADCCVL)
This register holds the lower 8 bits of the 12-bit or 10-bit compare value, or all 8 bits of the 8-bit compare
value. Bits ADCV7:ADCV0 are compared to the lower 8 bits of the result following a conversion in 12-bit,
10-bit or 8-bit mode.
7
6
5
4
3
2
1
0
R
W
ADCV7
ADCV6
ADCV5
ADCV4
ADCV3
ADCV2
ADCV1
ADCV0
Reset:
0
0
0
0
0
0
0
0
Figure 15-9. Compare Value Low Register(ADCCVL)
15.3.7 Configuration Register (ADCCFG)
ADCCFG is used to select the mode of operation, clock source, clock divide, and configure for low power
or long sample time.
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7
6
5
4
3
2
1
0
R
W
ADLPC
ADIV
ADLSMP
MODE
ADICLK
Reset:
0
0
0
0
0
0
0
0
Figure 15-10. Configuration Register (ADCCFG)
Table 15-5. ADCCFG Register Field Descriptions
Description
Field
7
Low Power Configuration — ADLPC controls the speed and power configuration of the successive
approximation converter. This is used to optimize power consumption when higher sample rates are not required.
0 High speed configuration
ADLPC
1 Low power configuration: {FC31}The power is reduced at the expense of maximum clock speed.
6:5
Clock Divide Select — ADIV select the divide ratio used by the ADC to generate the internal clock ADCK.
ADIV
Table 15-6 shows the available clock configurations.
4
Long Sample Time Configuration — ADLSMP selects between long and short sample time. This adjusts the
ADLSMP sample period to allow higher impedance inputs to be accurately sampled or to maximize conversion speed for
lower impedance inputs. Longer sample times can also be used to lower overall power consumption when
continuous conversions are enabled if high conversion rates are not required.
0 Short sample time
1 Long sample time
3:2
Conversion Mode Selection — MODE bits are used to select between 12-, 10- or 8-bit operation. See
MODE
Table 15-7.
1:0
Input Clock Select — ADICLK bits select the input clock source to generate the internal clock ADCK. See
ADICLK
Table 15-8.
Table 15-6. Clock Divide Select
ADIV
Divide Ratio
Clock Rate
00
01
10
11
1
2
4
8
Input clock
Input clock ÷ 2
Input clock ÷ 4
Input clock ÷ 8
Table 15-7. Conversion Modes
Mode Description
MODE
00
01
10
11
8-bit conversion (N=8)
12-bit conversion (N=12)
10-bit conversion (N=10)
Reserved
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Table 15-8. Input Clock Select
ADICLK
Selected Clock Source
00
01
10
11
Bus clock
Bus clock divided by 2
Alternate clock (ALTCLK)
Asynchronous clock (ADACK)
15.3.8 Pin Control 1 Register (APCTL1)
The pin control registers are used to disable the I/O port control of MCU pins used as analog inputs.
APCTL1 is used to control the pins associated with channels 0–7 of the ADC module.
7
6
5
4
3
2
1
0
R
W
ADPC7
ADPC6
ADPC5
ADPC4
ADPC3
ADPC2
ADPC1
ADPC0
Reset:
0
0
0
0
0
0
0
0
Figure 15-11. Pin Control 1 Register (APCTL1)
Table 15-9. APCTL1 Register Field Descriptions
Description
Field
7
ADC Pin Control 7 — ADPC7 is used to control the pin associated with channel AD7.
0 AD7 pin I/O control enabled
ADPC7
1 AD7 pin I/O control disabled
6
ADC Pin Control 6 — ADPC6 is used to control the pin associated with channel AD6.
0 AD6 pin I/O control enabled
ADPC6
1 AD6 pin I/O control disabled
5
ADC Pin Control 5 — ADPC5 is used to control the pin associated with channel AD5.
0 AD5 pin I/O control enabled
ADPC5
1 AD5 pin I/O control disabled
4
ADC Pin Control 4 — ADPC4 is used to control the pin associated with channel AD4.
0 AD4 pin I/O control enabled
ADPC4
1 AD4 pin I/O control disabled
3
ADC Pin Control 3 — ADPC3 is used to control the pin associated with channel AD3.
0 AD3 pin I/O control enabled
ADPC3
1 AD3 pin I/O control disabled
2
ADC Pin Control 2 — ADPC2 is used to control the pin associated with channel AD2.
0 AD2 pin I/O control enabled
ADPC2
1 AD2 pin I/O control disabled
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Table 15-9. APCTL1 Register Field Descriptions (continued)
Field
Description
1
ADC Pin Control 1 — ADPC1 is used to control the pin associated with channel AD1.
0 AD1 pin I/O control enabled
ADPC1
1 AD1 pin I/O control disabled
0
ADC Pin Control 0 — ADPC0 is used to control the pin associated with channel AD0.
0 AD0 pin I/O control enabled
ADPC0
1 AD0 pin I/O control disabled
15.3.9 Pin Control 2 Register (APCTL2)
APCTL2 is used to control channels 8–15 of the ADC module.
7
6
5
4
3
2
1
0
R
W
ADPC15
ADPC14
ADPC13
ADPC12
ADPC11
ADPC10
ADPC9
ADPC8
Reset:
0
0
0
0
0
0
0
0
Figure 15-12. Pin Control 2 Register (APCTL2)
Table 15-10. APCTL2 Register Field Descriptions
Description
Field
7
ADC Pin Control 15 — ADPC15 is used to control the pin associated with channel AD15.
ADPC15 0 AD15 pin I/O control enabled
1 AD15 pin I/O control disabled
6
ADC Pin Control 14 — ADPC14 is used to control the pin associated with channel AD14.
ADPC14 0 AD14 pin I/O control enabled
1 AD14 pin I/O control disabled
5
ADC Pin Control 13 — ADPC13 is used to control the pin associated with channel AD13.
ADPC13 0 AD13 pin I/O control enabled
1 AD13 pin I/O control disabled
4
ADC Pin Control 12 — ADPC12 is used to control the pin associated with channel AD12.
ADPC12 0 AD12 pin I/O control enabled
1 AD12 pin I/O control disabled
3
ADC Pin Control 11 — ADPC11 is used to control the pin associated with channel AD11.
ADPC11 0 AD11 pin I/O control enabled
1 AD11 pin I/O control disabled
2
ADC Pin Control 10 — ADPC10 is used to control the pin associated with channel AD10.
ADPC10 0 AD10 pin I/O control enabled
1 AD10 pin I/O control disabled
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Table 15-10. APCTL2 Register Field Descriptions (continued)
Field
Description
1
ADC Pin Control 9 — ADPC9 is used to control the pin associated with channel AD9.
ADPC9 0 AD9 pin I/O control enabled
1 AD9 pin I/O control disabled
0
ADC Pin Control 8 — ADPC8 is used to control the pin associated with channel AD8.
ADPC8 0 AD8 pin I/O control enabled
1 AD8 pin I/O control disabled
15.3.10 Pin Control 3 Register (APCTL3)
APCTL3 is used to control channels 16–23 of the ADC module.
7
6
5
4
3
2
1
0
R
W
ADPC23
ADPC22
ADPC21
ADPC20
ADPC19
ADPC18
ADPC17
ADPC16
Reset:
0
0
0
0
0
0
0
0
Figure 15-13. Pin Control 3 Register (APCTL3)
Table 15-11. APCTL3 Register Field Descriptions
Description
Field
7
ADC Pin Control 23 — ADPC23 is used to control the pin associated with channel AD23.
ADPC23 0 AD23 pin I/O control enabled
1 AD23 pin I/O control disabled
6
ADC Pin Control 22 — ADPC22 is used to control the pin associated with channel AD22.
ADPC22 0 AD22 pin I/O control enabled
1 AD22 pin I/O control disabled
5
ADC Pin Control 21 — ADPC21 is used to control the pin associated with channel AD21.
ADPC21 0 AD21 pin I/O control enabled
1 AD21 pin I/O control disabled
4
ADC Pin Control 20 — ADPC20 is used to control the pin associated with channel AD20.
ADPC20 0 AD20 pin I/O control enabled
1 AD20 pin I/O control disabled
3
ADC Pin Control 19 — ADPC19 is used to control the pin associated with channel AD19.
ADPC19 0 AD19 pin I/O control enabled
1 AD19 pin I/O control disabled
2
ADC Pin Control 18 — ADPC18 is used to control the pin associated with channel AD18.
ADPC18 0 AD18 pin I/O control enabled
1 AD18 pin I/O control disabled
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Table 15-11. APCTL3 Register Field Descriptions (continued)
Field
Description
1
ADC Pin Control 17 — ADPC17 is used to control the pin associated with channel AD17.
ADPC17 0 AD17 pin I/O control enabled
1 AD17 pin I/O control disabled
0
ADC Pin Control 16 — ADPC16 is used to control the pin associated with channel AD16.
ADPC16 0 AD16 pin I/O control enabled
1 AD16 pin I/O control disabled
15.4 Functional Description
The ADC module is disabled during reset or when the ADCH bits are all high. The module is idle when a
conversion has completed and another conversion has not been initiated. When idle, the module is in its
lowest power state.
The ADC can perform an analog-to-digital conversion on any of the software selectable channels. In 12-bit
and 10-bit mode, the selected channel voltage is converted by a successive approximation algorithm into
a 12-bit digital result. In 8-bit mode, the selected channel voltage is converted by a successive
approximation algorithm into a 9-bit digital result.
When the conversion is completed, the result is placed in the data registers (ADCRH and ADCRL). In
10-bit mode, the result is rounded to 10 bits and placed in the data registers (ADCRH and ADCRL). In
8-bit mode, the result is rounded to 8 bits and placed in ADCRL. The conversion complete flag (COCO)
is then set and an interrupt is generated if the conversion complete interrupt has been enabled (AIEN = 1).
The ADC module has the capability of automatically comparing the result of a conversion with the
contents of its compare registers. The compare function is enabled by setting the ACFE bit and operates
in conjunction with any of the conversion modes and configurations.
15.4.1 Clock Select and Divide Control
One of four clock sources can be selected as the clock source for the ADC module. This clock source is
then divided by a configurable value to generate the input clock to the converter (ADCK). The clock is
selected from one of the following sources by means of the ADICLK bits.
•
The bus clock, which is equal to the frequency at which software is executed. This is the default
selection following reset.
•
The bus clock divided by 2. For higher bus clock rates, this allows a maximum divide by 16 of the
bus clock.
•
•
ALTCLK, as defined for this MCU (See module section introduction).
The asynchronous clock (ADACK) – This clock is generated from a clock source within the ADC
module. When selected as the clock source this clock remains active while the MCU is in wait or
stop3 mode and allows conversions in these modes for lower noise operation.
Whichever clock is selected, its frequency must fall within the specified frequency range for ADCK. If the
available clocks are too slow, the ADC will not perform according to specifications. If the available clocks
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are too fast, then the clock must be divided to the appropriate frequency. This divider is specified by the
ADIV bits and can be divide-by 1, 2, 4, or 8.
15.4.2 Input Select and Pin Control
The pin control registers (APCTL3, APCTL2, and APCTL1) are used to disable the I/O port control of the
pins used as analog inputs.When a pin control register bit is set, the following conditions are forced for the
associated MCU pin:
•
•
The output buffer is forced to its high impedance state.
The input buffer is disabled. A read of the I/O port returns a zero for any pin with its input buffer
disabled.
•
The pullup is disabled.
15.4.3 Hardware Trigger
The ADC module has a selectable asynchronous hardware conversion trigger, ADHWT, that is enabled
when the ADTRG bit is set. This source is not available on all MCUs. Consult the module introduction for
information on the ADHWT source specific to this MCU.
When ADHWT source is available and hardware trigger is enabled (ADTRG=1), a conversion is initiated
on the rising edge of ADHWT. If a conversion is in progress when a rising edge occurs, the rising edge is
ignored. In continuous convert configuration, only the initial rising edge to launch continuous conversions
is observed. The hardware trigger function operates in conjunction with any of the conversion modes and
configurations.
15.4.4 Conversion Control
Conversions can be performed in 12-bit mode, 10-bit mode or 8-bit mode as determined by the MODE
bits. Conversions can be initiated by either a software or hardware trigger. In addition, the ADC module
can be configured for low power operation, long sample time, continuous conversion, and automatic
compare of the conversion result to a software determined compare value.
15.4.4.1 Initiating Conversions
A conversion is initiated:
•
Following a write to ADCSC1 (with ADCH bits not all 1s) if software triggered operation is
selected.
•
•
Following a hardware trigger (ADHWT) event if hardware triggered operation is selected.
Following the transfer of the result to the data registers when continuous conversion is enabled.
If continuous conversions are enabled a new conversion is automatically initiated after the completion of
the current conversion. In software triggered operation, continuous conversions begin after ADCSC1 is
written and continue until aborted. In hardware triggered operation, continuous conversions begin after a
hardware trigger event and continue until aborted.
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15.4.4.2 Completing Conversions
A conversion is completed when the result of the conversion is transferred into the data result registers,
ADCRH and ADCRL. This is indicated by the setting of COCO. An interrupt is generated if AIEN is high
at the time that COCO is set.
A blocking mechanism prevents a new result from overwriting previous data in ADCRH and ADCRL if
the previous data is in the process of being read while in 12-bit or 10-bit MODE (the ADCRH register has
been read but the ADCRL register has not). When blocking is active, the data transfer is blocked, COCO
is not set, and the new result is lost. In the case of single conversions with the compare function enabled
and the compare condition false, blocking has no effect and ADC operation is terminated. In all other cases
of operation, when a data transfer is blocked, another conversion is initiated regardless of the state of
ADCO (single or continuous conversions enabled).
If single conversions are enabled, the blocking mechanism could result in several discarded conversions
and excess power consumption. To avoid this issue, the data registers must not be read after initiating a
single conversion until the conversion completes.
15.4.4.3 Aborting Conversions
Any conversion in progress will be aborted when:
•
A write to ADCSC1 occurs (the current conversion will be aborted and a new conversion will be
initiated, if ADCH are not all 1s).
•
A write to ADCSC2, ADCCFG, ADCCVH, or ADCCVL occurs. This indicates a mode of
operation change has occurred and the current conversion is therefore invalid.
•
•
The MCU is reset.
The MCU enters stop mode with ADACK not enabled.
When a conversion is aborted, the contents of the data registers, ADCRH and ADCRL, are not altered but
continue to be the values transferred after the completion of the last successful conversion. In the case that
the conversion was aborted by a reset, ADCRH and ADCRL return to their reset states.
15.4.4.4 Power Control
The ADC module remains in its idle state until a conversion is initiated. If ADACK is selected as the
conversion clock source, the ADACK clock generator is also enabled.
Power consumption when active can be reduced by setting ADLPC. This results in a lower maximum value
for f
(see the electrical specifications).
ADCK
15.4.4.5 Sample Time and Total Conversion Time
The total conversion time depends on the sample time (as determined by ADLSMP), the MCU bus
frequency, the conversion mode (8-bit, 10-bit or 12-bit), and the frequency of the conversion clock (fADCK).
After the module becomes active, sampling of the input begins. ADLSMP is used to select between short
(3.5 ADCK cycles) and long (23.5 ADCK cycles) sample times.When sampling is complete, the converter
is isolated from the input channel and a successive approximation algorithm is performed to determine the
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digital value of the analog signal. The result of the conversion is transferred to ADCRH and ADCRL upon
completion of the conversion algorithm.
If the bus frequency is less than the f
frequency, precise sample time for continuous conversions
ADCK
cannot be guaranteed when short sample is enabled (ADLSMP=0). If the bus frequency is less than 1/11th
of the f frequency, precise sample time for continuous conversions cannot be guaranteed when long
ADCK
sample is enabled (ADLSMP=1).
The maximum total conversion time for different conditions is summarized in Table 15-12.
Table 15-12. Total Conversion Time vs. Control Conditions
Conversion Type
ADICLK
ADLSMP
Max Total Conversion Time
Single or first continuous 8-bit
Single or first continuous 10-bit or 12-bit
Single or first continuous 8-bit
0x, 10
0x, 10
0x, 10
0x, 10
11
0
0
1
1
0
0
1
1
0
20 ADCK cycles + 5 bus clock cycles
23 ADCK cycles + 5 bus clock cycles
40 ADCK cycles + 5 bus clock cycles
43 ADCK cycles + 5 bus clock cycles
5 μs + 20 ADCK + 5 bus clock cycles
5 μs + 23 ADCK + 5 bus clock cycles
5 μs + 40 ADCK + 5 bus clock cycles
5 μs + 43 ADCK + 5 bus clock cycles
17 ADCK cycles
Single or first continuous 10-bit or 12-bit
Single or first continuous 8-bit
Single or first continuous 10-bit or 12-bit
Single or first continuous 8-bit
11
11
Single or first continuous 10-bit or 12-bit
11
Subsequent continuous 8-bit;
xx
fBUS > fADCK
Subsequent continuous 10-bit or 12-bit;
xx
xx
xx
0
1
1
20 ADCK cycles
37 ADCK cycles
40 ADCK cycles
fBUS > fADCK
Subsequent continuous 8-bit;
fBUS > fADCK/11
Subsequent continuous 10-bit or 12-bit;
fBUS > fADCK/11
The maximum total conversion time is determined by the clock source chosen and the divide ratio selected.
The clock source is selectable by the ADICLK bits, and the divide ratio is specified by the ADIV bits. For
example, in 10-bit mode, with the bus clock selected as the input clock source, the input clock divide-by-1
ratio selected, and a bus frequency of 8 MHz, then the conversion time for a single conversion is:
23 ADCK cyc
8 MHz/1
5 bus cyc
8 MHz
= 3.5 μs
Conversion time =
+
Number of bus cycles = 3.5 μs x 8 MHz = 28 cycles
NOTE
The ADCK frequency must be between f
maximum to meet ADC specifications.
minimum and f
ADCK
ADCK
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Chapter 15 Analog-to-Digital Converter (S08ADC12V1)
15.4.5 Automatic Compare Function
The compare function can be configured to check for either an upper limit or lower limit. After the input
is sampled and converted, the result is added to the two’s complement of the compare value (ADCCVH
and ADCCVL). When comparing to an upper limit (ACFGT = 1), if the result is greater-than or equal-to
the compare value, COCO is set. When comparing to a lower limit (ACFGT = 0), if the result is less than
the compare value, COCO is set. The value generated by the addition of the conversion result and the two’s
complement of the compare value is transferred to ADCRH and ADCRL.
Upon completion of a conversion while the compare function is enabled, if the compare condition is not
true, COCO is not set and no data is transferred to the result registers. An ADC interrupt is generated upon
the setting of COCO if the ADC interrupt is enabled (AIEN = 1).
NOTE
The compare function can be used to monitor the voltage on a channel while
the MCU is in either wait or stop3 mode. The ADC interrupt will wake the
MCU when the compare condition is met.
15.4.6 MCU Wait Mode Operation
The WAIT instruction puts the MCU in a lower power-consumption standby mode from which recovery
is very fast because the clock sources remain active. If a conversion is in progress when the MCU enters
wait mode, it continues until completion. Conversions can be initiated while the MCU is in wait mode by
means of the hardware trigger or if continuous conversions are enabled.
The bus clock, bus clock divided by two, and ADACK are available as conversion clock sources while in
wait mode. The use of ALTCLK as the conversion clock source in wait is dependent on the definition of
ALTCLK for this MCU. Consult the module introduction for information on ALTCLK specific to this
MCU.
A conversion complete event sets the COCO and generates an ADC interrupt to wake the MCU from wait
mode if the ADC interrupt is enabled (AIEN = 1).
15.4.7 MCU Stop3 Mode Operation
The STOP instruction is used to put the MCU in a low power-consumption standby mode during which
most or all clock sources on the MCU are disabled.
15.4.7.1 Stop3 Mode With ADACK Disabled
If the asynchronous clock, ADACK, is not selected as the conversion clock, executing a STOP instruction
aborts the current conversion and places the ADC in its idle state. The contents of ADCRH and ADCRL
are unaffected by stop3 mode. After exiting from stop3 mode, a software or hardware trigger is required
to resume conversions.
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Chapter 15 Analog-to-Digital Converter (S08ADC12V1)
15.4.7.2 Stop3 Mode With ADACK Enabled
If ADACK is selected as the conversion clock, the ADC continues operation during stop3 mode. For
guaranteed ADC operation, the MCU’s voltage regulator must remain active during stop3 mode. Consult
the module introduction for configuration information for this MCU.
If a conversion is in progress when the MCU enters stop3 mode, it continues until completion. Conversions
can be initiated while the MCU is in stop3 mode by means of the hardware trigger or if continuous
conversions are enabled.
A conversion complete event sets the COCO and generates an ADC interrupt to wake the MCU from stop3
mode if the ADC interrupt is enabled (AIEN = 1).
NOTE
It is possible for the ADC module to wake the system from low power stop
and cause the MCU to begin consuming run-level currents without
generating a system level interrupt. To prevent this scenario, software
should ensure that the data transfer blocking mechanism (discussed in
Section 15.4.4.2, “Completing Conversions) is cleared when entering stop3
and continuing ADC conversions.
15.4.8 MCU Stop1 and Stop2 Mode Operation
The ADC module is automatically disabled when the MCU enters either stop1 or stop2 mode. All module
registers contain their reset values following exit from stop1 or stop2. Therefore the module must be
re-enabled and re-configured following exit from stop1 or stop2.
15.5 Initialization Information
This section gives an example which provides some basic direction on how a user would initialize and
configure the ADC module. The user has the flexibility of choosing between configuring the module for
8-, 10-, or 12-bit resolution, single or continuous conversion, and a polled or interrupt approach, among
many other options. Refer to Table 15-6, Table 15-7, and Table 15-8 for information used in this example.
NOTE
Hexadecimal values designated by a preceding 0x, binary values designated
by a preceding %, and decimal values have no preceding character.
15.5.1 ADC Module Initialization Example
15.5.1.1 Initialization Sequence
Before the ADC module can be used to complete conversions, an initialization procedure must be
performed. A typical sequence is as follows:
1. Update the configuration register (ADCCFG) to select the input clock source and the divide ratio
used to generate the internal clock, ADCK. This register is also used for selecting sample time and
low-power configuration.
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Chapter 15 Analog-to-Digital Converter (S08ADC12V1)
2. Update status and control register 2 (ADCSC2) to select the conversion trigger (hardware or
software) and compare function options, if enabled.
3. Update status and control register 1 (ADCSC1) to select whether conversions will be continuous
or completed only once, and to enable or disable conversion complete interrupts. The input channel
on which conversions will be performed is also selected here.
15.5.1.2 Pseudo — Code Example
In this example, the ADC module will be set up with interrupts enabled to perform a single 10-bit
conversion at low power with a long sample time on input channel 1, where the internal ADCK clock will
be derived from the bus clock divided by 1.
ADCCFG = 0x98 (%10011000)
Bit 7
Bit 6:5 ADIV
Bit 4
ADLPC
1
00
1
Configures for low power (lowers maximum clock speed)
Sets the ADCK to the input clock ÷ 1
Configures for long sample time
ADLSMP
Bit 3:2 MODE
10
Sets mode at 10-bit conversions
Bit 1:0 ADICLK 00
Selects bus clock as input clock source
ADCSC2 = 0x00 (%00000000)
Bit 7
Bit 6
Bit 5
ADACT
ADTRG
ACFE
0
0
0
Flag indicates if a conversion is in progress
Software trigger selected
Compare function disabled
Bit 4
ACFGT
0
Not used in this example
Bit 3:2
Bit 1:0
00
00
Unimplemented or reserved, always reads zero
Reserved for Freescale’s internal use; always write zero
ADCSC1 = 0x41 (%01000001)
Bit 7
Bit 6
Bit 5
COCO
AIEN
ADCO
0
1
0
Read-only flag which is set when a conversion completes
Conversion complete interrupt enabled
One conversion only (continuous conversions disabled)
Bit 4:0 ADCH
00001 Input channel 1 selected as ADC input channel
ADCRH/L = 0xxx
Holds results of conversion. Read high byte (ADCRH) before low byte (ADCRL) so that conversion
data cannot be overwritten with data from the next conversion.
ADCCVH/L = 0xxx
Holds compare value when compare function enabled
APCTL1=0x02
AD1 pin I/O control disabled. All other AD pins remain general purpose I/O pins
APCTL2=0x00
All other AD pins remain general purpose I/O pins
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Chapter 15 Analog-to-Digital Converter (S08ADC12V1)
RESET
INITIALIZE ADC
ADCCFG = $98
ADCSC2 = $00
ADCSC1 = $41
NO
CHECK
COCO=1?
YES
READ ADCRH
THEN ADCRL TO
CLEAR COCO BIT
CONTINUE
Figure 15-14. Initialization Flowchart for Example
15.6 Application Information
This section contains information for using the ADC module in applications. The ADC has been designed
to be integrated into a microcontroller for use in embedded control applications requiring an A/D
converter.
15.6.1 External Pins and Routing
The following sections discuss the external pins associated with the ADC module and how they should be
used for best results.
15.6.1.1 Analog Supply Pins
The ADC module has analog power and ground supplies (V
and V
) which are available as
DDAD
SSAD
separate pins on some devices. On other devices, V
is shared on the same pin as the MCU digital V ,
SSAD
SS
and on others, both V
and V
are shared with the MCU digital supply pins. In these cases, there
SSAD
DDAD
are separate pads for the analog supplies which are bonded to the same pin as the corresponding digital
supply so that some degree of isolation between the supplies is maintained.
When available on a separate pin, both V
and V
must be connected to the same voltage potential
SSAD
DDAD
as their corresponding MCU digital supply (V and V ) and must be routed carefully for maximum
DD
SS
noise immunity and bypass capacitors placed as near as possible to the package.
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Chapter 15 Analog-to-Digital Converter (S08ADC12V1)
In cases where separate power supplies are used for analog and digital power, the ground connection
between these supplies must be at the V
pin. This should be the only ground connection between these
SSAD
supplies if possible. The V
pin makes a good single point ground location.
SSAD
15.6.1.2 Analog Reference Pins
In addition to the analog supplies, the ADC module has connections for two reference voltage inputs. The
high reference is V
, which may be shared on the same pin as V
on some devices. The low
REFH
DDAD
reference is V
, which may be shared on the same pin as V
on some devices.
REFL
SSAD
When available on a separate pin, V
may be connected to the same potential as V
, or may be
REFH
DDAD
driven by an external source that is between the minimum V
spec and the V
potential (V
DDAD
DDAD REFH
must never exceed V
). When available on a separate pin, V
must be connected to the same
DDAD
REFL
voltage potential as V
. Both V
and V
must be routed carefully for maximum noise
SSAD
REFH
REFL
immunity and bypass capacitors placed as near as possible to the package.
AC current in the form of current spikes required to supply charge to the capacitor array at each successive
approximation step is drawn through the V
and V
loop. The best external component to meet this
REFH
REFL
current demand is a 0.1 μF capacitor with good high frequency characteristics. This capacitor is connected
between V and V and must be placed as near as possible to the package pins. Resistance in the
REFH
REFL
path is not recommended because the current will cause a voltage drop which could result in conversion
errors. Inductance in this path must be minimum (parasitic only).
15.6.1.3 Analog Input Pins
The external analog inputs are typically shared with digital I/O pins on MCU devices. The pin I/O control
is disabled by setting the appropriate control bit in one of the pin control registers. Conversions can be
performed on inputs without the associated pin control register bit set. It is recommended that the pin
control register bit always be set when using a pin as an analog input. This avoids problems with contention
because the output buffer will be in its high impedance state and the pullup is disabled. Also, the input
buffer draws DC current when its input is not at either V or V . Setting the pin control register bits for
DD
SS
all pins used as analog inputs should be done to achieve lowest operating current.
Empirical data shows that capacitors on the analog inputs improve performance in the presence of noise
or when the source impedance is high. Use of 0.01 μF capacitors with good high-frequency characteristics
is sufficient. These capacitors are not necessary in all cases, but when used they must be placed as near as
possible to the package pins and be referenced to V
.
SSA
For proper conversion, the input voltage must fall between V
and V
. If the input is equal to or
REFH
REFL
exceeds V
, the converter circuit converts the signal to $FFF (full scale 12-bit representation), $3FF
REFH
(full scale 10-bit representation) or $FF (full scale 8-bit representation). If the input is equal to or less than
, the converter circuit converts it to $000. Input voltages between V and V are straight-line
V
REFL
REFH
REFL
linear conversions. There will be a brief current associated with V
when the sampling capacitor is
REFL
charging. The input is sampled for 3.5 cycles of the ADCK source when ADLSMP is low, or 23.5 cycles
when ADLSMP is high.
For minimal loss of accuracy due to current injection, pins adjacent to the analog input pins should not be
transitioning during conversions.
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Chapter 15 Analog-to-Digital Converter (S08ADC12V1)
15.6.2 Sources of Error
Several sources of error exist for A/D conversions. These are discussed in the following sections.
15.6.2.1 Sampling Error
For proper conversions, the input must be sampled long enough to achieve the proper accuracy. Given the
maximum input resistance of approximately 7kΩ and input capacitance of approximately 5.5 pF, sampling
to within 1/4LSB (at 12-bit resolution) can be achieved within the minimum sample window (3.5 cycles @
8 MHz maximum ADCK frequency) provided the resistance of the external analog source (R ) is kept
AS
below 2 kΩ.
Higher source resistances or higher-accuracy sampling is possible by setting ADLSMP (to increase the
sample window to 23.5 cycles) or decreasing ADCK frequency to increase sample time.
15.6.2.2 Pin Leakage Error
Leakage on the I/O pins can cause conversion error if the external analog source resistance (R ) is high.
AS
N
If this error cannot be tolerated by the application, keep R lower than V
/ (2 *I
) for less than
AS
DDAD
LEAK
1/4LSB leakage error (N = 8 in 8-bit, 10 in 10-bit or 12 in 12-bit mode).
15.6.2.3 Noise-Induced Errors
System noise which occurs during the sample or conversion process can affect the accuracy of the
conversion. The ADC accuracy numbers are guaranteed as specified only if the following conditions are
met:
•
•
•
There is a 0.1 μF low-ESR capacitor from V
There is a 0.1 μF low-ESR capacitor from V
to V
.
REFH
REFL
to V
.
DDAD
SSAD
If inductive isolation is used from the primary supply, an additional 1 μF capacitor is placed from
V
to V
.
DDAD
SSAD
•
•
V
(and V
, if connected) is connected to V at a quiet point in the ground plane.
SSAD
REFL SS
Operate the MCU in wait or stop3 mode before initiating (hardware triggered conversions) or
immediately after initiating (hardware or software triggered conversions) the ADC conversion.
— For software triggered conversions, immediately follow the write to the ADCSC1 with a WAIT
instruction or STOP instruction.
— For stop3 mode operation, select ADACK as the clock source. Operation in stop3 reduces V
noise but increases effective conversion time due to stop recovery.
DD
•
There is no I/O switching, input or output, on the MCU during the conversion.
There are some situations where external system activity causes radiated or conducted noise emissions or
excessive V noise is coupled into the ADC. In these situations, or when the MCU cannot be placed in
DD
wait or stop3 or I/O activity cannot be halted, these recommended actions may reduce the effect of noise
on the accuracy:
•
Place a 0.01 μF capacitor (C ) on the selected input channel to V
or V
(this will
AS
REFL
SSAD
improve noise issues but will affect sample rate based on the external analog source resistance).
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Chapter 15 Analog-to-Digital Converter (S08ADC12V1)
•
•
Average the result by converting the analog input many times in succession and dividing the sum
of the results. Four samples are required to eliminate the effect of a 1LSB, one-time error.
Reduce the effect of synchronous noise by operating off the asynchronous clock (ADACK) and
averaging. Noise that is synchronous to ADCK cannot be averaged out.
15.6.2.4 Code Width and Quantization Error
The ADC quantizes the ideal straight-line transfer function into 4096 steps (in 12-bit mode). Each step
ideally has the same height (1 code) and width. The width is defined as the delta between the transition
points to one code and the next. The ideal code width for an N bit converter (in this case N can be 8, 10 or
12), defined as 1LSB, is:
N
1LSB = (V
- V
) / 2
REFL
Eqn. 15-2
REFH
There is an inherent quantization error due to the digitization of the result. For 8-bit or 10-bit conversions
the code will transition when the voltage is at the midpoint between the points where the straight line
transfer function is exactly represented by the actual transfer function. Therefore, the quantization error
will be 1/2LSB in 8- or 10-bit mode. As a consequence, however, the code width of the first ($000)
conversion is only 1/2LSB and the code width of the last ($FF or $3FF) is 1.5LSB.
For 12-bit conversions the code transitions only after the full code width is present, so the quantization
error is -1LSB to 0LSB and the code width of each step is 1LSB.
15.6.2.5 Linearity Errors
The ADC may also exhibit non-linearity of several forms. Every effort has been made to reduce these
errors but the system should be aware of them because they affect overall accuracy. These errors are:
•
Zero-scale error (E ) (sometimes called offset) — This error is defined as the difference between
ZS
the actual code width of the first conversion and the ideal code width (1/2LSB in 8-bit or 10-bit
modes and 1LSB in 12-bit mode). Note, if the first conversion is $001, then the difference between
the actual $001 code width and its ideal (1LSB) is used.
•
Full-scale error (E ) — This error is defined as the difference between the actual code width of
FS
the last conversion and the ideal code width (1.5LSB in 8-bit or 10-bit modes and 1LSB in 12-bit
mode). Note, if the last conversion is $3FE, then the difference between the actual $3FE code width
and its ideal (1LSB) is used.
•
•
Differential non-linearity (DNL) — This error is defined as the worst-case difference between the
actual code width and the ideal code width for all conversions.
Integral non-linearity (INL) — This error is defined as the highest-value the (absolute value of the)
running sum of DNL achieves. More simply, this is the worst-case difference of the actual
transition voltage to a given code and its corresponding ideal transition voltage, for all codes.
•
Total unadjusted error (TUE) — This error is defined as the difference between the actual transfer
function and the ideal straight-line transfer function, and therefore includes all forms of error.
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Chapter 15 Analog-to-Digital Converter (S08ADC12V1)
15.6.2.6 Code Jitter, Non-Monotonicity and Missing Codes
Analog-to-digital converters are susceptible to three special forms of error. These are code jitter,
non-monotonicity, and missing codes.
Code jitter is when, at certain points, a given input voltage converts to one of two values when sampled
repeatedly. Ideally, when the input voltage is infinitesimally smaller than the transition voltage, the
converter yields the lower code (and vice-versa). However, even very small amounts of system noise can
cause the converter to be indeterminate (between two codes) for a range of input voltages around the
transition voltage. This range is normally around 1/2LSB in 8-bit or 10-bit mode, or around 2 LSB in 12-bit
mode, and will increase with noise.
This error may be reduced by repeatedly sampling the input and averaging the result. Additionally the
techniques discussed in Section 15.6.2.3 will reduce this error.
Non-monotonicity is defined as when, except for code jitter, the converter converts to a lower code for a
higher input voltage. Missing codes are those values which are never converted for any input value.
In 8-bit or 10-bit mode, the ADC is guaranteed to be monotonic and to have no missing codes.
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Chapter 16
Analog Comparator (S08ACMPV2)
16.1 Introduction
The analog comparator module (ACMP) provides a circuit for comparing two analog input voltages or for
comparing one analog input voltage to an internal reference voltage. The comparator circuit is designed to
operate across the full range of the supply voltage (rail to rail operation).
16.1.1 ACMP/TPM1 Configuration Information
The ACMP module can be configured to connect the output of the analog comparator to TPM1 input
capture channel 0 by setting ACIC in SOPT2. With ACIC set, the TPM1CH0 pin is not available externally
regardless of the configuration of the TPM1 module
Figure 16-1 shows the MC9S08LC60 Series block diagram with the ACMP highlighted.
16.1.2 AMCPO Availability
For the MC9S08LC60 Series, the AMCPO pin is not available, so the ACOPE bit in the ACMPSC register
is reserved and does not have any effect.
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Chapter 16 Analog Comparator (S08ACMPV2)
HCS08 CORE
ON-CHIP ICE
DEBUG MODULE (DBG)
CPU
INT
ADP[7:4]
ADP3
4
PTA[7:4]/KBI1P[7:4]/ADP[7:4]
12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
ADP2
BKGD
BKP
ADP1
ADP0
HCS08 SYSTEM CONTROL
ACMP–
ACMP+
ANALOG COMPARATOR
(ACMP)
PTA3/KBI1P3/ADP3/ACMP–
PTA2/KBI1P2/ADP2/ACMP+
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
8-BIT KEYBOARD
8
PTA[1:0]/KBI1P[1:0]/ADP[1:0]
INTERRUPT (KBI1)
RTI
COP
LVD
IRQ
SS1
PTB7/KBI2P4/SS1
PTB6/KBI2P3/SPSCK1
SPSCK1
MISO1
SERIAL PERIPHERAL
INTERFACE (SPI1)
USER FLASH A
MOSI1
(LC60 = 32,768 BYTES)
(LC36 = 24,576 BYTES)
SCL
SDA
PTB5/MOSI1/SCL
PTB4/MISO1/SDA
IIC MODULE (IIC)
USER FLASH B
PTB3/KBI2P2
PTB2/RESET
RESET
(LC60 = 28,464 BYTES)
(LC36 = 12,288 BYTES)
5
3
8-BIT KEYBOARD
INTERRUPT (KBI2)
XTAL
EXTAL
USER RAM
PTB1/KBI2P1/XTAL
PTB0/KBI2P0/EXTAL
(LC60 = 4096 BYTES)
(LC36 = 2560 BYTES)
IRQ
PTC7/KBI2P7/IRQ/TPMCLK
PTC6/BKGD/MS
INTERNAL CLOCK
GENERATOR (ICG)
TPM2CH1
TPM2CH0
2-CHANNEL TIMER/PWM
PTC5/KBI2P6/TPM2CH1
PTC4/KBI2P5/TPM2CH0
(TPM2)
TPMCLK
TPM1CH0
TPM1CH1
LOW-POWER OSCILLATOR
2-CHANNEL TIMER/PWM
(TPM1)
V
LCD
SS2
V
LL1
PTC3/SS2/TPM1CH1
SPSCK2
MOSI2
MISO2
V
SERIAL PERIPHERAL
LL2
PTC2/SPSCK2/TPM1CH0
LIQUID CRYSTAL
DISPLAY DRIVER
LCD
INTERFACE (SPI2)
V
LL3
V
V
CAP1
CAP2
TxD
RxD
PTC1/MOSI2/TxD
PTC0/MISO2/RxD
SERIAL COMMUNICATIONS
INTERFACE (SCI)
BP[2:0]
BP3/FP40
FP[39:0]
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pulldown device if IRQ enabled
(IRQPE = 1).
V
DD
VOLTAGE
3. IRQ does not have a clamp diode to V . IRQ should not be driven above V
.
DD
DD
V
4. Pin contains integrated pullup device.
REGULATOR
SS
5. Input-only RESET is shared with output-only PTB2. Default function after reset is
RESET.
6. IRQ is shared with PTC7/KBI2P7/TPMCLK. Default function after reset is
output-only PTC7.
VREFH
VREFL
7. PTC6/BKGD/MS is an output only pin
8. FP[39:32], PTA[1:0], and PTA[7:4] are not available in the 64 LQFP.
9. ACMPO is not available.
VDDAD
VSSAD
Figure 16-1. MC9S08LC60 Series Block Diagram Highlighting ACMP Block and Pins
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Chapter 16 Analog Comparator (S08ACMPV2)
16.1.3 Features
The ACMP has the following features:
•
•
•
•
Full rail-to-rail supply operation.
Less than 40 mV of input offset.
Less than 15 mV of hysteresis.
Selectable interrupt on rising edge, falling edge, or either rising or falling edges of comparator
output.
•
•
Option to compare to fixed internal bandgap reference voltage.
Option to allow comparator output to be visible on a pin, ACMPO.
16.1.4 Modes of Operation
This section defines the ACMP operation in wait, stop, and background debug modes.
16.1.4.1 ACMP in Wait Mode
The ACMP continues to run in wait mode if enabled before executing the WAIT instruction. Therefore,
the ACMP can be used to bring the MCU out of wait mode if the ACMP interrupt, ACIE, is enabled. For
lowest possible current consumption, the ACMP should be disabled by software if not required as an
interrupt source during wait mode.
16.1.4.2 ACMP in Stop Modes
The ACMP is disabled in all stop modes, regardless of the settings before executing the STOP instruction.
Therefore, the ACMP cannot be used as a wake up source from stop modes.
During either stop1 or stop2 mode, the ACMP module will be fully powered down. Upon wake-up from
stop1 or stop2 mode, the ACMP module will be in the reset state.
During stop3 mode, clocks to the ACMP module are halted. No registers are affected. In addition, the
ACMP comparator circuit will enter a low power state. No compare operation will occur while in stop3.
If stop3 is exited with a reset, the ACMP will be put into its reset state. If stop3 is exited with an interrupt,
the ACMP continues from the state it was in when stop3 was entered.
16.1.4.3 ACMP in Active Background Mode
When the microcontroller is in active background mode, the ACMP will continue to operate normally.
16.1.5 Block Diagram
The block diagram for the analog comparator module is shown Figure 16-2.
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Chapter 16 Analog Comparator (S08ACMPV2)
Internal Bus
Internal
Reference
ACMP
INTERRUPT
REQUEST
ACIE
ACBGS
ACME
Status & Control
Register
ACF
ACOPE
ACMP+
+
–
Interrupt
Control
Comparator
ACMP–
ACMPO
Figure 16-2. Analog Comparator (ACMP) Block Diagram
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
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Chapter 16 Analog Comparator (S08ACMPV2)
16.2 External Signal Description
The ACMP has two analog input pins, ACMP+ and ACMP– and one digital output pin ACMPO. Each of
these pins can accept an input voltage that varies across the full operating voltage range of the MCU. As
shown in Figure 16-2, the ACMP– pin is connected to the inverting input of the comparator, and the
ACMP+ pin is connected to the comparator non-inverting input if ACBGS is a 0. As shown in Figure 16-2,
the ACMPO pin can be enabled to drive an external pin.
The signal properties of ACMP are shown in Table 16-1.
Table 16-1. Signal Properties
Signal
Function
I/O
ACMP–
Inverting analog input to the ACMP.
(Minus input)
I
ACMP+
ACMPO
Non-inverting analog input to the ACMP.
(Positive input)
I
Digital output of the ACMP.
O
16.3 Register Definition
The ACMP includes one register:
•
An 8-bit status and control register
Refer to the direct-page register summary in the memory section of this data sheet for the absolute address
assignments for all ACMP registers.This section refers to registers and control bits only by their names and
relative address offsets.
Some MCUs may have more than one ACMP, so register names include placeholder characters to identify
which ACMP is being referenced.
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16.3.1 ACMP Status and Control Register (ACMPSC)
ACMPSC contains the status flag and control bits which are used to enable and configure the ACMP.
7
6
5
4
3
2
1
0
R
W
ACO
ACME
ACBGS
ACF
ACIE
ACOPE
ACMOD
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 16-3. ACMP Status and Control Register
Table 16-2. ACMP Status and Control Register Field Descriptions
Description
Field
7
Analog Comparator Module Enable — ACME enables the ACMP module.
ACME
0 ACMP not enabled
1 ACMP is enabled
6
Analog Comparator Bandgap Select — ACBGS is used to select between the bandgap reference voltage or
the ACMP+ pin as the input to the non-inverting input of the analog comparatorr.
0 External pin ACMP+ selected as non-inverting input to comparator
ACBGS
1 Internal reference select as non-inverting input to comparator
5
ACF
Analog Comparator Flag — ACF is set when a compare event occurs. Compare events are defined by ACMOD.
ACF is cleared by writing a one to ACF.
0 Compare event has not occurred
1 Compare event has occurred
4
Analog Comparator Interrupt Enable — ACIE enables the interrupt from the ACMP. When ACIE is set, an
ACIE
interrupt will be asserted when ACF is set.
0 Interrupt disabled
1 Interrupt enabled
3
Analog Comparator Output — Reading ACO will return the current value of the analog comparator output. ACO
ACO
is reset to a 0 and will read as a 0 when the ACMP is disabled (ACME = 0).
2
Analog Comparator Output Pin Enable — ACOPE is used to enable the comparator output to be placed onto
the external pin, ACMPO.
ACOPE
0 Analog comparator output not available on ACMPO
1 Analog comparator output is driven out on ACMPO
1:0
ACMOD
Analog Comparator Mode — ACMOD selects the type of compare event which sets ACF.
00 Encoding 0 — Comparator output falling edge
01 Encoding 1 — Comparator output rising edge
10 Encoding 2 — Comparator output falling edge
11 Encoding 3 — Comparator output rising or falling edge
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16.4 Functional Description
The analog comparator can be used to compare two analog input voltages applied to ACMP+ and ACMP–;
or it can be used to compare an analog input voltage applied to ACMP– with an internal bandgap reference
voltage. ACBGS is used to select between the bandgap reference voltage or the ACMP+ pin as the input
to the non-inverting input of the analog comparator. The comparator output is high when the non-inverting
input is greater than the inverting input, and is low when the non-inverting input is less than the inverting
input. ACMOD is used to select the condition which will cause ACF to be set. ACF can be set on a rising
edge of the comparator output, a falling edge of the comparator output, or either a rising or a falling edge
(toggle). The comparator output can be read directly through ACO. The comparator output can be driven
onto the ACMPO pin using ACOPE.
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Chapter 17
Development Support
17.1 Introduction
This chapter describes the single-wire background debug mode (BDM), which uses the on-chip
background debug controller (BDC) module, and the independent on-chip real-time in-circuit emulation
(ICE) system, which uses the on-chip debug (DBG) module.
17.1.1 Features
Features of the BDC module include:
•
•
•
•
•
•
•
•
•
•
Single pin for mode selection and background communications
BDC registers are not located in the memory map
SYNC command to determine target communications rate
Non-intrusive commands for memory access
Active background mode commands for CPU register access
GO and TRACE1 commands
BACKGROUND command can wake CPU from stop or wait modes
One hardware address breakpoint built into BDC
Oscillator runs in stop mode, if BDC enabled
COP watchdog disabled while in active background mode
Features of the ICE system include:
•
•
Two trigger comparators: Two address + read/write (R/W) or one full address + data + R/W
Flexible 8-word by 16-bit FIFO (first-in, first-out) buffer for capture information:
— Change-of-flow addresses or
— Event-only data
•
•
Two types of breakpoints:
— Tag breakpoints for instruction opcodes
— Force breakpoints for any address access
Nine trigger modes:
— Basic: A-only, A OR B
— Sequence: A then B
— Full: A AND B data, A AND NOT B data
— Event (store data): Event-only B, A then event-only B
— Range: Inside range (A ≤ address ≤ B), outside range (address < A or address > B)
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17.2 Background Debug Controller (BDC)
All MCUs in the HCS08 Family contain a single-wire background debug interface that supports in-circuit
programming of on-chip nonvolatile memory and sophisticated non-intrusive debug capabilities. Unlike
debug interfaces on earlier 8-bit MCUs, this system does not interfere with normal application resources.
It does not use any user memory or locations in the memory map and does not share any on-chip
peripherals.
BDC commands are divided into two groups:
•
Active background mode commands require that the target MCU is in active background mode (the
user program is not running). Active background mode commands allow the CPU registers to be
read or written, and allow the user to trace one user instruction at a time, or GO to the user program
from active background mode.
•
Non-intrusive commands can be executed at any time even while the user’s program is running.
Non-intrusive commands allow a user to read or write MCU memory locations or access status and
control registers within the background debug controller.
Typically, a relatively simple interface pod is used to translate commands from a host computer into
commands for the custom serial interface to the single-wire background debug system. Depending on the
development tool vendor, this interface pod may use a standard RS-232 serial port, a parallel printer port,
or some other type of communications such as a universal serial bus (USB) to communicate between the
host PC and the pod. The pod typically connects to the target system with ground, the BKGD pin, RESET,
and sometimes V . An open-drain connection to reset allows the host to force a target system reset,
DD
which is useful to regain control of a lost target system or to control startup of a target system before the
on-chip nonvolatile memory has been programmed. Sometimes V can be used to allow the pod to use
DD
power from the target system to avoid the need for a separate power supply. However, if the pod is powered
separately, it can be connected to a running target system without forcing a target system reset or otherwise
disturbing the running application program.
2
GND
BKGD
1
NO CONNECT 3
NO CONNECT 5
4 RESET
6 V
DD
Figure 17-1. BDM Tool Connector
17.2.1 BKGD Pin Description
BKGD is the single-wire background debug interface pin. The primary function of this pin is for
bidirectional serial communication of active background mode commands and data. During reset, this pin
is used to select between starting in active background mode or starting the user’s application program.
This pin is also used to request a timed sync response pulse to allow a host development tool to determine
the correct clock frequency for background debug serial communications.
BDC serial communications use a custom serial protocol first introduced on the M68HC12 Family of
microcontrollers. This protocol assumes the host knows the communication clock rate that is determined
by the target BDC clock rate. All communication is initiated and controlled by the host that drives a
high-to-low edge to signal the beginning of each bit time. Commands and data are sent most significant bit
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first (MSB first). For a detailed description of the communications protocol, refer to Section 17.2.2,
“Communication Details.”
If a host is attempting to communicate with a target MCU that has an unknown BDC clock rate, a SYNC
command may be sent to the target MCU to request a timed sync response signal from which the host can
determine the correct communication speed.
BKGD is a pseudo-open-drain pin and there is an on-chip pullup so no external pullup resistor is required.
Unlike typical open-drain pins, the external RC time constant on this pin, which is influenced by external
capacitance, plays almost no role in signal rise time. The custom protocol provides for brief, actively
driven speedup pulses to force rapid rise times on this pin without risking harmful drive level conflicts.
Refer to Section 17.2.2, “Communication Details,” for more detail.
When no debugger pod is connected to the 6-pin BDM interface connector, the internal pullup on BKGD
chooses normal operating mode. When a debug pod is connected to BKGD it is possible to force the MCU
into active background mode after reset. The specific conditions for forcing active background depend
upon the HCS08 derivative (refer to the introduction to this Development Support section). It is not
necessary to reset the target MCU to communicate with it through the background debug interface.
17.2.2 Communication Details
The BDC serial interface requires the external controller to generate a falling edge on the BKGD pin to
indicate the start of each bit time. The external controller provides this falling edge whether data is
transmitted or received.
BKGD is a pseudo-open-drain pin that can be driven either by an external controller or by the MCU. Data
is transferred MSB first at 16 BDC clock cycles per bit (nominal speed). The interface times out if
512 BDC clock cycles occur between falling edges from the host. Any BDC command that was in progress
when this timeout occurs is aborted without affecting the memory or operating mode of the target MCU
system.
The custom serial protocol requires the debug pod to know the target BDC communication clock speed.
The clock switch (CLKSW) control bit in the BDC status and control register allows the user to select the
BDC clock source. The BDC clock source can either be the bus or the alternate BDC clock source.
The BKGD pin can receive a high or low level or transmit a high or low level. The following diagrams
show timing for each of these cases. Interface timing is synchronous to clocks in the target BDC, but
asynchronous to the external host. The internal BDC clock signal is shown for reference in counting cycles.
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Figure 17-2 shows an external host transmitting a logic 1 or 0 to the BKGD pin of a target HCS08 MCU.
The host is asynchronous to the target so there is a 0-to-1 cycle delay from the host-generated falling edge
to where the target perceives the beginning of the bit time. Ten target BDC clock cycles later, the target
senses the bit level on the BKGD pin. Typically, the host actively drives the pseudo-open-drain BKGD pin
during host-to-target transmissions to speed up rising edges. Because the target does not drive the BKGD
pin during the host-to-target transmission period, there is no need to treat the line as an open-drain signal
during this period.
BDC CLOCK
(TARGET MCU)
HOST
TRANSMIT 1
HOST
TRANSMIT 0
10 CYCLES
EARLIEST START
OF NEXT BIT
SYNCHRONIZATION
UNCERTAINTY
TARGET SENSES BIT LEVEL
PERCEIVED START
OF BIT TIME
Figure 17-2. BDC Host-to-Target Serial Bit Timing
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Figure 17-3 shows the host receiving a logic 1 from the target HCS08 MCU. Because the host is
asynchronous to the target MCU, there is a 0-to-1 cycle delay from the host-generated falling edge on
BKGD to the perceived start of the bit time in the target MCU. The host holds the BKGD pin low long
enough for the target to recognize it (at least two target BDC cycles). The host must release the low drive
before the target MCU drives a brief active-high speedup pulse seven cycles after the perceived start of the
bit time. The host should sample the bit level about 10 cycles after it started the bit time.
BDC CLOCK
(TARGET MCU)
HOST DRIVE
HIGH-IMPEDANCE
TO BKGD PIN
TARGET MCU
SPEEDUP PULSE
HIGH-IMPEDANCE
HIGH-IMPEDANCE
PERCEIVED START
OF BIT TIME
R-C RISE
BKGD PIN
10 CYCLES
10 CYCLES
EARLIEST START
OF NEXT BIT
HOST SAMPLES BKGD PIN
Figure 17-3. BDC Target-to-Host Serial Bit Timing (Logic 1)
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Figure 17-4 shows the host receiving a logic 0 from the target HCS08 MCU. Because the host is
asynchronous to the target MCU, there is a 0-to-1 cycle delay from the host-generated falling edge on
BKGD to the start of the bit time as perceived by the target MCU. The host initiates the bit time but the
target HCS08 finishes it. Because the target wants the host to receive a logic 0, it drives the BKGD pin low
for 13 BDC clock cycles, then briefly drives it high to speed up the rising edge. The host samples the bit
level about 10 cycles after starting the bit time.
BDC CLOCK
(TARGET MCU)
HOST DRIVE
TO BKGD PIN
HIGH-IMPEDANCE
SPEEDUP
PULSE
TARGET MCU
DRIVE AND
SPEED-UP PULSE
PERCEIVED START
OF BIT TIME
BKGD PIN
10 CYCLES
10 CYCLES
EARLIEST START
OF NEXT BIT
HOST SAMPLES BKGD PIN
Figure 17-4. BDM Target-to-Host Serial Bit Timing (Logic 0)
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17.2.3 BDC Commands
BDC commands are sent serially from a host computer to the BKGD pin of the target HCS08 MCU. All
commands and data are sent MSB-first using a custom BDC communications protocol. Active background
mode commands require that the target MCU is currently in the active background mode while
non-intrusive commands may be issued at any time whether the target MCU is in active background mode
or running a user application program.
Table 17-1 shows all HCS08 BDC commands, a shorthand description of their coding structure, and the
meaning of each command.
Coding Structure Nomenclature
This nomenclature is used in Table 17-1 to describe the coding structure of the BDC commands.
Commands begin with an 8-bit hexadecimal command code in the host-to-target
direction (most significant bit first)
/
d
=
=
=
=
=
=
=
=
=
=
separates parts of the command
delay 16 target BDC clock cycles
AAAA
RD
a 16-bit address in the host-to-target direction
8 bits of read data in the target-to-host direction
8 bits of write data in the host-to-target direction
16 bits of read data in the target-to-host direction
16 bits of write data in the host-to-target direction
the contents of BDCSCR in the target-to-host direction (STATUS)
8 bits of write data for BDCSCR in the host-to-target direction (CONTROL)
WD
RD16
WD16
SS
CC
RBKP
16 bits of read data in the target-to-host direction (from BDCBKPT breakpoint
register)
WBKP
=
16 bits of write data in the host-to-target direction (for BDCBKPT breakpoint register)
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Table 17-1. BDC Command Summary
Command
Mnemonic
Active BDM/
Non-intrusive
Coding
Structure
Description
Request a timed reference pulse to determine
target BDC communication speed
n/a1
D5/d
D6/d
90/d
SYNC
Non-intrusive
Non-intrusive
Non-intrusive
Non-intrusive
Enable acknowledge protocol. Refer to
Freescale document order no. HCS08RMv1/D.
ACK_ENABLE
ACK_DISABLE
BACKGROUND
Disable acknowledge protocol. Refer to
Freescale document order no. HCS08RMv1/D.
Enter active background mode if enabled
(ignore if ENBDM bit equals 0)
READ_STATUS
WRITE_CONTROL
READ_BYTE
Non-intrusive
Non-intrusive
Non-intrusive
Non-intrusive
E4/SS
C4/CC
Read BDC status from BDCSCR
Write BDC controls in BDCSCR
Read a byte from target memory
Read a byte and report status
E0/AAAA/d/RD
READ_BYTE_WS
E1/AAAA/d/SS/RD
Re-read byte from address just read and
report status
READ_LAST
Non-intrusive
E8/SS/RD
WRITE_BYTE
WRITE_BYTE_WS
READ_BKPT
Non-intrusive
Non-intrusive
Non-intrusive
Non-intrusive
C0/AAAA/WD/d
C1/AAAA/WD/d/SS
E2/RBKP
Write a byte to target memory
Write a byte and report status
Read BDCBKPT breakpoint register
Write BDCBKPT breakpoint register
WRITE_BKPT
C2/WBKP
Go to execute the user application program
starting at the address currently in the PC
GO
Active BDM
Active BDM
Active BDM
08/d
10/d
18/d
Trace 1 user instruction at the address in the
PC, then return to active background mode
TRACE1
TAGGO
Same as GO but enable external tagging
(HCS08 devices have no external tagging pin)
READ_A
Active BDM
Active BDM
Active BDM
Active BDM
Active BDM
68/d/RD
Read accumulator (A)
READ_CCR
READ_PC
READ_HX
READ_SP
69/d/RD
Read condition code register (CCR)
Read program counter (PC)
Read H and X register pair (H:X)
Read stack pointer (SP)
6B/d/RD16
6C/d/RD16
6F/d/RD16
Increment H:X by one then read memory byte
located at H:X
READ_NEXT
Active BDM
Active BDM
70/d/RD
Increment H:X by one then read memory byte
located at H:X. Report status and data.
READ_NEXT_WS
71/d/SS/RD
WRITE_A
Active BDM
Active BDM
Active BDM
Active BDM
Active BDM
48/WD/d
Write accumulator (A)
WRITE_CCR
WRITE_PC
WRITE_HX
WRITE_SP
49/WD/d
Write condition code register (CCR)
Write program counter (PC)
Write H and X register pair (H:X)
Write stack pointer (SP)
4B/WD16/d
4C/WD16/d
4F/WD16/d
Increment H:X by one, then write memory byte
located at H:X
WRITE_NEXT
Active BDM
Active BDM
50/WD/d
Increment H:X by one, then write memory byte
located at H:X. Also report status.
WRITE_NEXT_WS
51/WD/d/SS
1
The SYNC command is a special operation that does not have a command code.
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The SYNC command is unlike other BDC commands because the host does not necessarily know the
correct communications speed to use for BDC communications until after it has analyzed the response to
the SYNC command.
To issue a SYNC command, the host:
•
Drives the BKGD pin low for at least 128 cycles of the slowest possible BDC clock (The slowest
clock is normally the reference oscillator/64 or the self-clocked rate/64.)
•
Drives BKGD high for a brief speedup pulse to get a fast rise time (This speedup pulse is typically
one cycle of the fastest clock in the system.)
•
•
Removes all drive to the BKGD pin so it reverts to high impedance
Monitors the BKGD pin for the sync response pulse
The target, upon detecting the SYNC request from the host (which is a much longer low time than would
ever occur during normal BDC communications):
•
•
•
•
•
Waits for BKGD to return to a logic high
Delays 16 cycles to allow the host to stop driving the high speedup pulse
Drives BKGD low for 128 BDC clock cycles
Drives a 1-cycle high speedup pulse to force a fast rise time on BKGD
Removes all drive to the BKGD pin so it reverts to high impedance
The host measures the low time of this 128-cycle sync response pulse and determines the correct speed for
subsequent BDC communications. Typically, the host can determine the correct communication speed
within a few percent of the actual target speed and the communication protocol can easily tolerate speed
errors of several percent.
17.2.4 BDC Hardware Breakpoint
The BDC includes one relatively simple hardware breakpoint that compares the CPU address bus to a
16-bit match value in the BDCBKPT register. This breakpoint can generate a forced breakpoint or a tagged
breakpoint. A forced breakpoint causes the CPU to enter active background mode at the first instruction
boundary following any access to the breakpoint address. The tagged breakpoint causes the instruction
opcode at the breakpoint address to be tagged so that the CPU will enter active background mode rather
than executing that instruction if and when it reaches the end of the instruction queue. This implies that
tagged breakpoints can only be placed at the address of an instruction opcode while forced breakpoints can
be set at any address.
The breakpoint enable (BKPTEN) control bit in the BDC status and control register (BDCSCR) is used to
enable the breakpoint logic (BKPTEN = 1). When BKPTEN = 0, its default value after reset, the
breakpoint logic is disabled and no BDC breakpoints are requested regardless of the values in other BDC
breakpoint registers and control bits. The force/tag select (FTS) control bit in BDCSCR is used to select
forced (FTS = 1) or tagged (FTS = 0) type breakpoints.
The on-chip debug module (DBG) includes circuitry for two additional hardware breakpoints that are more
flexible than the simple breakpoint in the BDC module.
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17.3 On-Chip Debug System (DBG)
Because HCS08 devices do not have external address and data buses, the most important functions of an
in-circuit emulator have been built onto the chip with the MCU. The debug system consists of an 8-stage
FIFO that can store address or data bus information, and a flexible trigger system to decide when to capture
bus information and what information to capture. The system relies on the single-wire background debug
system to access debug control registers and to read results out of the eight stage FIFO.
The debug module includes control and status registers that are accessible in the user’s memory map.
These registers are located in the high register space to avoid using valuable direct page memory space.
Most of the debug module’s functions are used during development, and user programs rarely access any
of the control and status registers for the debug module. The one exception is that the debug system can
provide the means to implement a form of ROM patching. This topic is discussed in greater detail in
Section 17.3.6, “Hardware Breakpoints.”
17.3.1 Comparators A and B
Two 16-bit comparators (A and B) can optionally be qualified with the R/W signal and an opcode tracking
circuit. Separate control bits allow you to ignore R/W for each comparator. The opcode tracking circuitry
optionally allows you to specify that a trigger will occur only if the opcode at the specified address is
actually executed as opposed to only being read from memory into the instruction queue. The comparators
are also capable of magnitude comparisons to support the inside range and outside range trigger modes.
Comparators are disabled temporarily during all BDC accesses.
The A comparator is always associated with the 16-bit CPU address. The B comparator compares to the
CPU address or the 8-bit CPU data bus, depending on the trigger mode selected. Because the CPU data
bus is separated into a read data bus and a write data bus, the RWAEN and RWA control bits have an
additional purpose, in full address plus data comparisons they are used to decide which of these buses to
use in the comparator B data bus comparisons. If RWAEN = 1 (enabled) and RWA = 0 (write), the CPU’s
write data bus is used. Otherwise, the CPU’s read data bus is used.
The currently selected trigger mode determines what the debugger logic does when a comparator detects
a qualified match condition. A match can cause:
•
•
•
•
Generation of a breakpoint to the CPU
Storage of data bus values into the FIFO
Starting to store change-of-flow addresses into the FIFO (begin type trace)
Stopping the storage of change-of-flow addresses into the FIFO (end type trace)
17.3.2 Bus Capture Information and FIFO Operation
The usual way to use the FIFO is to setup the trigger mode and other control options, then arm the
debugger. When the FIFO has filled or the debugger has stopped storing data into the FIFO, you would
read the information out of it in the order it was stored into the FIFO. Status bits indicate the number of
words of valid information that are in the FIFO as data is stored into it. If a trace run is manually halted by
writing 0 to ARM before the FIFO is full (CNT = 1:0:0:0), the information is shifted by one position and
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the host must perform ((8 – CNT) – 1) dummy reads of the FIFO to advance it to the first significant entry
in the FIFO.
In most trigger modes, the information stored in the FIFO consists of 16-bit change-of-flow addresses. In
these cases, read DBGFH then DBGFL to get one coherent word of information out of the FIFO. Reading
DBGFL (the low-order byte of the FIFO data port) causes the FIFO to shift so the next word of information
is available at the FIFO data port. In the event-only trigger modes (see Section 17.3.5, “Trigger Modes”),
8-bit data information is stored into the FIFO. In these cases, the high-order half of the FIFO (DBGFH) is
not used and data is read out of the FIFO by simply reading DBGFL. Each time DBGFL is read, the FIFO
is shifted so the next data value is available through the FIFO data port at DBGFL.
In trigger modes where the FIFO is storing change-of-flow addresses, there is a delay between CPU
addresses and the input side of the FIFO. Because of this delay, if the trigger event itself is a change-of-flow
address or a change-of-flow address appears during the next two bus cycles after a trigger event starts the
FIFO, it will not be saved into the FIFO. In the case of an end-trace, if the trigger event is a change-of-flow,
it will be saved as the last change-of-flow entry for that debug run.
The FIFO can also be used to generate a profile of executed instruction addresses when the debugger is not
armed. When ARM = 0, reading DBGFL causes the address of the most-recently fetched opcode to be
saved in the FIFO. To use the profiling feature, a host debugger would read addresses out of the FIFO by
reading DBGFH then DBGFL at regular periodic intervals. The first eight values would be discarded
because they correspond to the eight DBGFL reads needed to initially fill the FIFO. Additional periodic
reads of DBGFH and DBGFL return delayed information about executed instructions so the host debugger
can develop a profile of executed instruction addresses.
17.3.3 Change-of-Flow Information
To minimize the amount of information stored in the FIFO, only information related to instructions that
cause a change to the normal sequential execution of instructions is stored. With knowledge of the source
and object code program stored in the target system, an external debugger system can reconstruct the path
of execution through many instructions from the change-of-flow information stored in the FIFO.
For conditional branch instructions where the branch is taken (branch condition was true), the source
address is stored (the address of the conditional branch opcode). Because BRA and BRN instructions are
not conditional, these events do not cause change-of-flow information to be stored in the FIFO.
Indirect JMP and JSR instructions use the current contents of the H:X index register pair to determine the
destination address, so the debug system stores the run-time destination address for any indirect JMP or
JSR. For interrupts, RTI, or RTS, the destination address is stored in the FIFO as change-of-flow
information.
17.3.4 Tag vs. Force Breakpoints and Triggers
Tagging is a term that refers to identifying an instruction opcode as it is fetched into the instruction queue,
but not taking any other action until and unless that instruction is actually executed by the CPU. This
distinction is important because any change-of-flow from a jump, branch, subroutine call, or interrupt
causes some instructions that have been fetched into the instruction queue to be thrown away without being
executed.
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A force-type breakpoint waits for the current instruction to finish and then acts upon the breakpoint
request. The usual action in response to a breakpoint is to go to active background mode rather than
continuing to the next instruction in the user application program.
The tag vs. force terminology is used in two contexts within the debug module. The first context refers to
breakpoint requests from the debug module to the CPU. The second refers to match signals from the
comparators to the debugger control logic. When a tag-type break request is sent to the CPU, a signal is
entered into the instruction queue along with the opcode so that if/when this opcode ever executes, the CPU
will effectively replace the tagged opcode with a BGND opcode so the CPU goes to active background
mode rather than executing the tagged instruction. When the TRGSEL control bit in the DBGT register is
set to select tag-type operation, the output from comparator A or B is qualified by a block of logic in the
debug module that tracks opcodes and only produces a trigger to the debugger if the opcode at the compare
address is actually executed. There is separate opcode tracking logic for each comparator so more than one
compare event can be tracked through the instruction queue at a time.
17.3.5 Trigger Modes
The trigger mode controls the overall behavior of a debug run. The 4-bit TRG field in the DBGT register
selects one of nine trigger modes. When TRGSEL = 1 in the DBGT register, the output of the comparator
must propagate through an opcode tracking circuit before triggering FIFO actions. The BEGIN bit in
DBGT chooses whether the FIFO begins storing data when the qualified trigger is detected (begin trace),
or the FIFO stores data in a circular fashion from the time it is armed until the qualified trigger is detected
(end trigger).
A debug run is started by writing a 1 to the ARM bit in the DBGC register, which sets the ARMF flag and
clears the AF and BF flags and the CNT bits in DBGS. A begin-trace debug run ends when the FIFO gets
full. An end-trace run ends when the selected trigger event occurs. Any debug run can be stopped manually
by writing a 0 to ARM or DBGEN in DBGC.
In all trigger modes except event-only modes, the FIFO stores change-of-flow addresses. In event-only
trigger modes, the FIFO stores data in the low-order eight bits of the FIFO.
The BEGIN control bit is ignored in event-only trigger modes and all such debug runs are begin type
traces. When TRGSEL = 1 to select opcode fetch triggers, it is not necessary to use R/W in comparisons
because opcode tags would only apply to opcode fetches that are always read cycles. It would also be
unusual to specify TRGSEL = 1 while using a full mode trigger because the opcode value is normally
known at a particular address.
The following trigger mode descriptions only state the primary comparator conditions that lead to a trigger.
Either comparator can usually be further qualified with R/W by setting RWAEN (RWBEN) and the
corresponding RWA (RWB) value to be matched against R/W. The signal from the comparator with
optional R/W qualification is used to request a CPU breakpoint if BRKEN = 1 and TAG determines
whether the CPU request will be a tag request or a force request.
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A-Only — Trigger when the address matches the value in comparator A
A OR B — Trigger when the address matches either the value in comparator A or the value in
comparator B
A Then B — Trigger when the address matches the value in comparator B but only after the address for
another cycle matched the value in comparator A. There can be any number of cycles after the A match
and before the B match.
A AND B Data (Full Mode) — This is called a full mode because address, data, and R/W (optionally)
must match within the same bus cycle to cause a trigger event. Comparator A checks address, the low byte
of comparator B checks data, and R/W is checked against RWA if RWAEN = 1. The high-order half of
comparator B is not used.
In full trigger modes it is not useful to specify a tag-type CPU breakpoint (BRKEN = TAG = 1), but if you
do, the comparator B data match is ignored for the purpose of issuing the tag request to the CPU and the
CPU breakpoint is issued when the comparator A address matches.
A AND NOT B Data (Full Mode) — Address must match comparator A, data must not match the low
half of comparator B, and R/W must match RWA if RWAEN = 1. All three conditions must be met within
the same bus cycle to cause a trigger.
In full trigger modes it is not useful to specify a tag-type CPU breakpoint (BRKEN = TAG = 1), but if you
do, the comparator B data match is ignored for the purpose of issuing the tag request to the CPU and the
CPU breakpoint is issued when the comparator A address matches.
Event-Only B (Store Data) — Trigger events occur each time the address matches the value in
comparator B. Trigger events cause the data to be captured into the FIFO. The debug run ends when the
FIFO becomes full.
A Then Event-Only B (Store Data) — After the address has matched the value in comparator A, a trigger
event occurs each time the address matches the value in comparator B. Trigger events cause the data to be
captured into the FIFO. The debug run ends when the FIFO becomes full.
Inside Range (A ≤ Address ≤ B) — A trigger occurs when the address is greater than or equal to the value
in comparator A and less than or equal to the value in comparator B at the same time.
Outside Range (Address < A or Address > B) — A trigger occurs when the address is either less than
the value in comparator A or greater than the value in comparator B.
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17.3.6 Hardware Breakpoints
The BRKEN control bit in the DBGC register may be set to 1 to allow any of the trigger conditions
described in Section 17.3.5, “Trigger Modes,” to be used to generate a hardware breakpoint request to the
CPU. TAG in DBGC controls whether the breakpoint request will be treated as a tag-type breakpoint or a
force-type breakpoint. A tag breakpoint causes the current opcode to be marked as it enters the instruction
queue. If a tagged opcode reaches the end of the pipe, the CPU executes a BGND instruction to go to active
background mode rather than executing the tagged opcode. A force-type breakpoint causes the CPU to
finish the current instruction and then go to active background mode.
If the background mode has not been enabled (ENBDM = 1) by a serial WRITE_CONTROL command
through the BKGD pin, the CPU will execute an SWI instruction instead of going to active background
mode.
17.4 Register Definition
This section contains the descriptions of the BDC and DBG registers and control bits.
Refer to the high-page register summary in the device overview chapter of this data sheet for the absolute
address assignments for all DBG registers. This section refers to registers and control bits only by their
names. A Freescale-provided equate or header file is used to translate these names into the appropriate
absolute addresses.
17.4.1 BDC Registers and Control Bits
The BDC has two registers:
•
The BDC status and control register (BDCSCR) is an 8-bit register containing control and status
bits for the background debug controller.
•
The BDC breakpoint match register (BDCBKPT) holds a 16-bit breakpoint match address.
These registers are accessed with dedicated serial BDC commands and are not located in the memory
space of the target MCU (so they do not have addresses and cannot be accessed by user programs).
Some of the bits in the BDCSCR have write limitations; otherwise, these registers may be read or written
at any time. For example, the ENBDM control bit may not be written while the MCU is in active
background mode. (This prevents the ambiguous condition of the control bit forbidding active background
mode while the MCU is already in active background mode.) Also, the four status bits (BDMACT, WS,
WSF, and DVF) are read-only status indicators and can never be written by the WRITE_CONTROL serial
BDC command. The clock switch (CLKSW) control bit may be read or written at any time.
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17.4.1.1 BDC Status and Control Register (BDCSCR)
This register can be read or written by serial BDC commands (READ_STATUS and WRITE_CONTROL)
but is not accessible to user programs because it is not located in the normal memory map of the MCU.
7
6
5
4
3
2
1
0
R
BDMACT
WS
WSF
DVF
ENBDM
BKPTEN
FTS
CLKSW
W
Normal
Reset
0
1
0
1
0
0
0
0
0
1
0
0
0
0
0
0
Reset in
Active BDM:
= Unimplemented or Reserved
Figure 17-5. BDC Status and Control Register (BDCSCR)
Table 17-2. BDCSCR Register Field Descriptions
Description
Field
7
Enable BDM (Permit Active Background Mode) — Typically, this bit is written to 1 by the debug host shortly
after the beginning of a debug session or whenever the debug host resets the target and remains 1 until a normal
reset clears it.
ENBDM
0 BDM cannot be made active (non-intrusive commands still allowed)
1 BDM can be made active to allow active background mode commands
6
Background Mode Active Status — This is a read-only status bit.
BDMACT 0 BDM not active (user application program running)
1 BDM active and waiting for serial commands
5
BDC Breakpoint Enable — If this bit is clear, the BDC breakpoint is disabled and the FTS (force tag select)
control bit and BDCBKPT match register are ignored.
0 BDC breakpoint disabled
BKPTEN
1 BDC breakpoint enabled
4
FTS
Force/Tag Select — When FTS = 1, a breakpoint is requested whenever the CPU address bus matches the
BDCBKPT match register. When FTS = 0, a match between the CPU address bus and the BDCBKPT register
causes the fetched opcode to be tagged. If this tagged opcode ever reaches the end of the instruction queue,
the CPU enters active background mode rather than executing the tagged opcode.
0 Tag opcode at breakpoint address and enter active background mode if CPU attempts to execute that
instruction
1 Breakpoint match forces active background mode at next instruction boundary (address need not be an
opcode)
3
Select Source for BDC Communications Clock — CLKSW defaults to 0, which selects the alternate BDC
CLKSW
clock source.
0 Alternate BDC clock source
1 MCU bus clock
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Table 17-2. BDCSCR Register Field Descriptions (continued)
Field
Description
2
WS
Wait or Stop Status — When the target CPU is in wait or stop mode, most BDC commands cannot function.
However, the BACKGROUND command can be used to force the target CPU out of wait or stop and into active
background mode where all BDC commands work. Whenever the host forces the target MCU into active
background mode, the host should issue a READ_STATUS command to check that BDMACT = 1 before
attempting other BDC commands.
0 Target CPU is running user application code or in active background mode (was not in wait or stop mode when
background became active)
1 Target CPU is in wait or stop mode, or a BACKGROUND command was used to change from wait or stop to
active background mode
1
WSF
Wait or Stop Failure Status — This status bit is set if a memory access command failed due to the target CPU
executing a wait or stop instruction at or about the same time. The usual recovery strategy is to issue a
BACKGROUND command to get out of wait or stop mode into active background mode, repeat the command
that failed, then return to the user program. (Typically, the host would restore CPU registers and stack values and
re-execute the wait or stop instruction.)
0 Memory access did not conflict with a wait or stop instruction
1 Memory access command failed because the CPU entered wait or stop mode
0
DVF
Data Valid Failure Status — This status bit is not used in the MC9S08LC60 Series because it does not have
any slow access memory.
0 Memory access did not conflict with a slow memory access
1 Memory access command failed because CPU was not finished with a slow memory access
17.4.1.2 BDC Breakpoint Match Register (BDCBKPT)
This 16-bit register holds the address for the hardware breakpoint in the BDC. The BKPTEN and FTS
control bits in BDCSCR are used to enable and configure the breakpoint logic. Dedicated serial BDC
commands (READ_BKPT and WRITE_BKPT) are used to read and write the BDCBKPT register but is
not accessible to user programs because it is not located in the normal memory map of the MCU.
Breakpoints are normally set while the target MCU is in active background mode before running the user
application program. For additional information about setup and use of the hardware breakpoint logic in
the BDC, refer to Section 17.2.4, “BDC Hardware Breakpoint.”
17.4.2 System Background Debug Force Reset Register (SBDFR)
This register contains a single write-only control bit. A serial background mode command such as
WRITE_BYTE must be used to write to SBDFR. Attempts to write this register from a user program are
ignored. Reads always return 0x00.
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7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
BDFR1
0
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
1
BDFR is writable only through serial background mode debug commands, not from user programs.
Figure 17-6. System Background Debug Force Reset Register (SBDFR)
Table 17-3. SBDFR Register Field Description
Description
Field
0
Background Debug Force Reset — A serial active background mode command such as WRITE_BYTE allows
an external debug host to force a target system reset. Writing 1 to this bit forces an MCU reset. This bit cannot
be written from a user program.
BDFR
17.4.3 DBG Registers and Control Bits
The debug module includes nine bytes of register space for three 16-bit registers and three 8-bit control
and status registers. These registers are located in the high register space of the normal memory map so
they are accessible to normal application programs. These registers are rarely if ever accessed by normal
user application programs with the possible exception of a ROM patching mechanism that uses the
breakpoint logic.
17.4.3.1 Debug Comparator A High Register (DBGCAH)
This register contains compare value bits for the high-order eight bits of comparator A. This register is
forced to 0x00 at reset and can be read at any time or written at any time unless ARM = 1.
17.4.3.2 Debug Comparator A Low Register (DBGCAL)
This register contains compare value bits for the low-order eight bits of comparator A. This register is
forced to 0x00 at reset and can be read at any time or written at any time unless ARM = 1.
17.4.3.3 Debug Comparator B High Register (DBGCBH)
This register contains compare value bits for the high-order eight bits of comparator B. This register is
forced to 0x00 at reset and can be read at any time or written at any time unless ARM = 1.
17.4.3.4 Debug Comparator B Low Register (DBGCBL)
This register contains compare value bits for the low-order eight bits of comparator B. This register is
forced to 0x00 at reset and can be read at any time or written at any time unless ARM = 1.
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17.4.3.5 Debug FIFO High Register (DBGFH)
This register provides read-only access to the high-order eight bits of the FIFO. Writes to this register have
no meaning or effect. In the event-only trigger modes, the FIFO only stores data into the low-order byte of
each FIFO word, so this register is not used and will read 0x00.
Reading DBGFH does not cause the FIFO to shift to the next word. When reading 16-bit words out of the
FIFO, read DBGFH before reading DBGFL because reading DBGFL causes the FIFO to advance to the
next word of information.
17.4.3.6 Debug FIFO Low Register (DBGFL)
This register provides read-only access to the low-order eight bits of the FIFO. Writes to this register have
no meaning or effect.
Reading DBGFL causes the FIFO to shift to the next available word of information. When the debug
module is operating in event-only modes, only 8-bit data is stored into the FIFO (high-order half of each
FIFO word is unused). When reading 8-bit words out of the FIFO, simply read DBGFL repeatedly to get
successive bytes of data from the FIFO. It isn’t necessary to read DBGFH in this case.
Do not attempt to read data from the FIFO while it is still armed (after arming but before the FIFO is filled
or ARMF is cleared) because the FIFO is prevented from advancing during reads of DBGFL. This can
interfere with normal sequencing of reads from the FIFO.
Reading DBGFL while the debugger is not armed causes the address of the most-recently fetched opcode
to be stored to the last location in the FIFO. By reading DBGFH then DBGFL periodically, external host
software can develop a profile of program execution. After eight reads from the FIFO, the ninth read will
return the information that was stored as a result of the first read. To use the profiling feature, read the FIFO
eight times without using the data to prime the sequence and then begin using the data to get a delayed
picture of what addresses were being executed. The information stored into the FIFO on reads of DBGFL
(while the FIFO is not armed) is the address of the most-recently fetched opcode.
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17.4.3.7 Debug Control Register (DBGC)
This register can be read or written at any time.
7
6
5
4
3
2
1
0
R
W
DBGEN
ARM
TAG
BRKEN
RWA
RWAEN
RWB
RWBEN
Reset
0
0
0
0
0
0
0
0
Figure 17-7. Debug Control Register (DBGC)
Table 17-4. DBGC Register Field Descriptions
Description
Field
7
Debug Module Enable — Used to enable the debug module. DBGEN cannot be set to 1 if the MCU is secure.
DBGEN
0 DBG disabled
1 DBG enabled
6
Arm Control — Controls whether the debugger is comparing and storing information in the FIFO. A write is used
ARM
to set this bit (and ARMF) and completion of a debug run automatically clears it. Any debug run can be manually
stopped by writing 0 to ARM or to DBGEN.
0 Debugger not armed
1 Debugger armed
5
TAG
Tag/Force Select — Controls whether break requests to the CPU will be tag or force type requests. If
BRKEN = 0, this bit has no meaning or effect.
0 CPU breaks requested as force type requests
1 CPU breaks requested as tag type requests
4
Break Enable — Controls whether a trigger event will generate a break request to the CPU. Trigger events can
cause information to be stored in the FIFO without generating a break request to the CPU. For an end trace, CPU
break requests are issued to the CPU when the comparator(s) and R/W meet the trigger requirements. For a
begin trace, CPU break requests are issued when the FIFO becomes full. TRGSEL does not affect the timing of
CPU break requests.
BRKEN
0 CPU break requests not enabled
1 Triggers cause a break request to the CPU
3
R/W Comparison Value for Comparator A — When RWAEN = 1, this bit determines whether a read or a write
access qualifies comparator A. When RWAEN = 0, RWA and the R/W signal do not affect comparator A.
0 Comparator A can only match on a write cycle
RWA
1 Comparator A can only match on a read cycle
2
Enable R/W for Comparator A — Controls whether the level of R/W is considered for a comparator A match.
0 R/W is not used in comparison A
RWAEN
1 R/W is used in comparison A
1
R/W Comparison Value for Comparator B — When RWBEN = 1, this bit determines whether a read or a write
access qualifies comparator B. When RWBEN = 0, RWB and the R/W signal do not affect comparator B.
0 Comparator B can match only on a write cycle
RWB
1 Comparator B can match only on a read cycle
0
Enable R/W for Comparator B — Controls whether the level of R/W is considered for a comparator B match.
0 R/W is not used in comparison B
RWBEN
1 R/W is used in comparison B
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17.4.3.8 Debug Trigger Register (DBGT)
This register can be read any time, but may be written only if ARM = 0, except bits 4 and 5 are hard-wired
to 0s.
7
6
5
4
3
2
1
0
R
W
0
0
TRGSEL
BEGIN
TRG3
TRG2
TRG1
TRG0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 17-8. Debug Trigger Register (DBGT)
Table 17-5. DBGT Register Field Descriptions
Description
Field
7
Trigger Type — Controls whether the match outputs from comparators A and B are qualified with the opcode
tracking logic in the debug module. If TRGSEL is set, a match signal from comparator A or B must propagate
through the opcode tracking logic and a trigger event is only signalled to the FIFO logic if the opcode at the match
address is actually executed.
TRGSEL
0 Trigger on access to compare address (force)
1 Trigger if opcode at compare address is executed (tag)
6
Begin/End Trigger Select — Controls whether the FIFO starts filling at a trigger or fills in a circular manner until
a trigger ends the capture of information. In event-only trigger modes, this bit is ignored and all debug runs are
assumed to be begin traces.
BEGIN
0 Data stored in FIFO until trigger (end trace)
1 Trigger initiates data storage (begin trace)
3:0
TRG[3:0]
Select Trigger Mode — Selects one of nine triggering modes, as described below.
0000 A-only
0001 A OR B
0010 A Then B
0011 Event-only B (store data)
0100 A then event-only B (store data)
0101 A AND B data (full mode)
0110 A AND NOT B data (full mode)
0111 Inside range: A ≤ address ≤ B
1000 Outside range: address < A or address > B
1001 – 1111 (No trigger)
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17.4.3.9 Debug Status Register (DBGS)
This is a read-only status register.
7
6
5
4
3
2
1
0
R
W
AF
BF
ARMF
0
CNT3
CNT2
CNT1
CNT0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 17-9. Debug Status Register (DBGS)
Table 17-6. DBGS Register Field Descriptions
Description
Field
7
Trigger Match A Flag — AF is cleared at the start of a debug run and indicates whether a trigger match A
AF
condition was met since arming.
0 Comparator A has not matched
1 Comparator A match
6
Trigger Match B Flag — BF is cleared at the start of a debug run and indicates whether a trigger match B
BF
condition was met since arming.
0 Comparator B has not matched
1 Comparator B match
5
Arm Flag — While DBGEN = 1, this status bit is a read-only image of ARM in DBGC. This bit is set by writing 1
to the ARM control bit in DBGC (while DBGEN = 1) and is automatically cleared at the end of a debug run. A
debug run is completed when the FIFO is full (begin trace) or when a trigger event is detected (end trace). A
debug run can also be ended manually by writing 0 to ARM or DBGEN in DBGC.
0 Debugger not armed
ARMF
1 Debugger armed
3:0
CNT[3:0]
FIFO Valid Count — These bits are cleared at the start of a debug run and indicate the number of words of valid
data in the FIFO at the end of a debug run. The value in CNT does not decrement as data is read out of the FIFO.
The external debug host is responsible for keeping track of the count as information is read out of the FIFO.
0000 Number of valid words in FIFO = No valid data
0001 Number of valid words in FIFO = 1
0010 Number of valid words in FIFO = 2
0011 Number of valid words in FIFO = 3
0100 Number of valid words in FIFO = 4
0101 Number of valid words in FIFO = 5
0110 Number of valid words in FIFO = 6
0111 Number of valid words in FIFO = 7
1000 Number of valid words in FIFO = 8
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Appendix A
Electrical Characteristics
A.1
Introduction
This section contains electrical and timing specifications.
A.2
Absolute Maximum Ratings
Absolute maximum ratings are stress ratings only, and functional operation at the maxima is not
guaranteed. Stress beyond the limits specified in Table A-1 may affect device reliability or cause
permanent damage to the device. For functional operating conditions, refer to the remaining tables in this
section.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (for instance, either V or V ) or the programmable
SS
DD
pull-up resistor associated with the pin is enabled.
Table A-1. Absolute Maximum Ratings
Rating
Symbol
VDD
Value
Unit
V
–0.3 to +3.8
120
Supply voltage
IDD
mA
V
Maximum current into V
Digital input voltage
DD
VIn
–0.3 to VDD + 0.3
Instantaneous maximum current
ID
25
mA
Single pin limit (applies to all port
(1) (2) (3)
pins)
,
,
Tstg
–55 to 150
°C
Storage temperature range
1
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive (VDD) and negative (VSS) clamp
voltages, then use the larger of the two resistance values.
2
3
All functional non-supply pins are internally clamped to VSS and VDD
.
Power supply must maintain regulation within operating VDD range during instantaneous and
operating maximum current conditions. If positive injection current (VIn > VDD) is greater than
IDD, the injection current may flow out of VDD and could result in external power supply going
out of regulation. Ensure external VDD load will shunt current greater than maximum injection
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if
no system clock is present, or if the clock rate is very low which would reduce overall power
consumption.
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Appendix A Electrical Characteristics
A.3
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits and it is user-determined rather than being controlled by the
MCU design. In order to take P into account in power calculations, determine the difference between
I/O
actual pin voltage and V or V and multiply by the pin current for each I/O pin. Except in cases of
SS
DD
unusually high pin current (heavy loads), the difference between pin voltage and V or V will be very
SS
DD
small.
Table A-2. Thermal Characteristics
Rating
Symbol
Value
Unit
TA
-40 to 85
°C
Operating temperature range (packaged)
Thermal resistance
80-pin LQFP
64
49
1s
2s2p
(1), (2) (3) (4)
°C/W
θJA
,
,
64-pin LQFP
66
47
1s
2s2p
1
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, airflow, power dissipation of other components on the board, and board
thermal resistance.
2
3
4
Junction to Ambient Natural Convection
1s - Single Layer Board, one signal layer
2s2p - Four Layer Board, 2 signal and 2 power layers
The average chip-junction temperature (T ) in °C can be obtained from:
J
T = T + (P × θ )
JA
Eqn. A-1
J
A
D
where:
T = Ambient temperature, °C
A
θ
= Package thermal resistance, junction-to-ambient, °C/W
JA
P = P + P
D
int
I/O
P
P
= I × V , Watts — chip internal power
= Power dissipation on input and output pins — user determined
int
I/O
DD DD
For most applications, P << P and can be neglected. An approximate relationship between P and T
J
I/O
int
D
(if P is neglected) is:
I/O
P = K ÷ (T + 273°C)
Eqn. A-2
D
J
Solving Equation A-1 and Equation A-2 for K gives:
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Appendix A Electrical Characteristics
2
K = P × (T + 273°C) + θ × (P )
Eqn. A-3
D
A
JA
D
where K is a constant pertaining to the particular part. K can be determined from Equation A-3 by
measuring P (at equilibrium) for a known T . Using this value of K, the values of P and T can be
D
A
D
J
obtained by solving equations 1 and 2 iteratively for any value of T .
A
A.4
Electrostatic Discharge (ESD) Protection Characteristics
Although damage from static discharge is much less common on these devices than on early CMOS
circuits, normal handling precautions should be used to avoid exposure to static discharge. Qualification
tests are performed to ensure that these devices can withstand exposure to reasonable levels of static
without suffering any permanent damage. All ESD testing is in conformity with CDF-AEC-Q00 Stress
Test Qualification for Automotive Grade Integrated Circuits. (http://www.aecouncil.com/) This device was
qualified to AEC-Q100 Rev E. A device is considered to have failed if, after exposure to ESD pulses, the
device no longer meets the device specification requirements. Complete dc parametric and functional
testing is performed per the applicable device specification at room temperature followed by hot
temperature, unless specified otherwise in the device specification.
Table A-3. ESD and Latch-up Test Conditions
Model
Description
Symbol
Value
Unit
Ω
Human
Body
Series resistance
R1
1500
Storage capacitance
C
100
3
pF
Number of pulses per pin
—
Machine
Series resistance
R1
0
Ω
Storage capacitance
C
200
3
pF
Number of pulses per pin
—
Latch-up Minimum input voltage limit
Maximum input voltage limit
1.8
3.6
V
V
Table A-4. ESD and Latch-Up Protection Characteristics
(1)
No.
1
Symbol
VHBM
VMM
Min
2000
200
500
100
Max
—
Unit
V
Rating
Human body model (HBM)
Machine model (MM)
2
—
V
VCDM
ILAT
3
Charge device model (CDM)
Latch-up current at TA = 85°C
—
V
4
—
mA
1
Parameter is achieved by design characterization on a small sample size from typical devices
under typical conditions unless otherwise noted.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
325
Appendix A Electrical Characteristics
A.5
DC Characteristics
This section includes information about power supply requirements, I/O pin characteristics, and power
supply current in various operating modes.
Table A-5. DC Characteristics (Sheet 1 of 2)
(Temperature Range = -40 to 85°C Ambient)
Symbol
VDD
Min
1.8
Typical(1)
Max
3.6
Unit
V
Parameter
Supply voltage (run, wait and stop modes.)
—
Minimum RAM retention supply voltage applied to
VDD
VRAM
1.0(2)
—
—
V
V
Low-voltage detection threshold — high range
VLVDH
(VDD falling)
(VDD rising)
2.02
2.07
2.15
2.23
2.3
2.33
Low-voltage detection threshold — low range
VLVDL
VLVWH
VLVWL
VRearm
V
V
V
V
(VDD falling)
(VDD rising)
1.76
1.8
1.88
1.93
1.98
2.04
Low-voltage warning threshold — high range
(VDD falling)
(VDD rising)
2.32
2.32
2.45
2.48
2.6
2.6
Low-voltage warning threshold — low range
(VDD falling)
(VDD rising)
2.02
2.02
2.15
2.21
2.3
2.33
Power on reset (POR) re-arm voltage(2)
Mode = stop
Mode = run and Wait
0.20
0.50
0.30
0.80
0.40
1.2
Bandgap voltage reference,
VBG
VIH
VIH
1.18
1.20
1.21
—
V
V
V
Input high voltage (VDD > 2.3 V) (all digital inputs)
0.70 × VDD
0.85 × VDD
Input high voltage (1.8 V ≤ VDD ≤ 2.3 V)
(all digital inputs)
—
Input low voltage (VDD > 2.3 V) (all digital inputs)
VIL
VIL
—
—
0.35 × VDD
0.30 × VDD
V
V
Input low voltage (1.8 V ≤ VDD ≤ 2.3 V)
(all digital inputs)
Input hysteresis (all digital inputs)
Vhys
|IIn|
0.06 × VDD
—
1
V
Input leakage current (per pin)
—
0.025
μA
VIn = VDD or VSS, all input only pins
High impedance (off-state) leakage current (per pin)
VIn = VDD or VSS, all input/output (all except PTC7)
|IOZ
|
—
0.025
0.025
1
2
μA
kΩ
kΩ
VIn = VDD or VSS, all input/output (PTC7 only)
Internal pullup and pulldown resistors(3)
(all port pins and IRQ)
RPU
17.5
17.5
52.5
Internal pulldown resistors (all port pins and IRQ)
RPD
52.5
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
326
Freescale Semiconductor
Appendix A Electrical Characteristics
Table A-5. DC Characteristics (Sheet 2 of 2)
(Temperature Range = -40 to 85°C Ambient)
Symbol
VOH
Min
Typical(1)
Max
—
Unit
V
Parameter
Output high voltage (VDD ≥ 1.8 V)
I
= –2 mA (ports A, B, and C)
VDD – 0.5
OH
Output high voltage (all port pins)
VDD – 0.5
I
I
I
= –10 mA (VDD ≥ 2.7 V)
= –6 mA (VDD ≥ 2.3 V)
= –3 mA (VDD ≥ 1.8 V)
—
—
—
OH
OH
OH
Maximum total IOH for all port pins
|IOHT
VOL
|
—
—
60
mA
V
Output low voltage (VDD ≥ 1.8 V)
I
= 2.0 mA (ports A, B, and C)
0.5
OL
Output low voltage (all port pins)
I
= 10.0 mA (VDD ≥ 2.7 V)
= 6 mA (VDD ≥ 2.3 V)
—
—
—
0.5
0.5
0.5
OL
I
I
OL
OL
= 3 mA (V ≥ 1.8 V)
DD
Maximum total IOL for all port pins
IOLT
|IIC|
—
60
mA
dc injection current(4), (5), (6), (7), (8)
VIN < VSS, VIN > VDD
Single pin limit
Total MCU limit, includes sum of all stressed pins
—
—
0.2
5
mA
mA
Input capacitance (all non-supply pins)(2)
CIn
—
7
pF
1
2
3
4
Typicals are measured at 25°C.
This parameter is characterized and not tested on each device.
Measurement condition for pull resistors: VIn = VSS for pullup and VIn = VDD for pulldown.
Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current
conditions. If positive injection current (VIn > VDD) is greater than IDD, the injection current may flow out of VDD and could result
in external power supply going out of regulation. Ensure external VDD load will shunt current greater than maximum injection
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if no system clock is present, or
if clock rate is very low which would reduce overall power consumption.
5
6
All functional non-supply pins are internally clamped to VSS and VDD
.
Input must be current limited to the value specified. To determine the value of the required current-limiting resistor, calculate
resistance values for positive and negative clamp voltages, then use the larger of the two values.
7
8
This parameter is characterized and not tested on each device.
IRQ does not have a clamp diode to VDD. Do not drive IRQ above VDD
.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
327
Appendix A Electrical Characteristics
Pull Up Resistance
Pull Down Resistance
36
34
32
30
28
26
24
22
20
34
32
30
28
26
24
22
20
-40C
25C
70C
85C
-40C
25C
70C
85C
1.8
2
2.3
2.7
3
3.6
1.8
2
2.3
2.7
3
3.6
VDD (V)
VDD (V)
Figure A-1. Pullup and Pulldown Typical Resistor Values (V = 3.0 V)
DD
OL
I
at Vdd = 2.7V
-40C
25C
70C
85C
40
30
20
10
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6
VOL (V)
Figure A-2. Typical Low-Side Driver (Sink) Characteristics (Ports A, B, and C)
Typical I vs. V at V = 2.7 V
OL
OL
DD
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
328
Freescale Semiconductor
Appendix A Electrical Characteristics
VOL vs VDD
350.00
300.00
250.00
200.00
150.00
100.00
50.00
-40C (3mA)
-40C (6mA)
-40C (10mA)
25C (3mA)
25C (6mA)
25C (10mA)
70C (3mA)
70C (6mA)
70C (10mA)
85C (3mA)
85C (6mA)
85C (10mA)
10mA
6mA
3mA
0.00
1.8
2.3
2.7
VDD (V)
Figure A-3. Typical Low-Side Driver (Sink) Characteristics (Ports A, B, and C)
Typical V vs. V
OL
DD
OH
I
at Vdd =2.7V
-35
-30
-25
-20
-15
-10
-5
-40C
25C
70C
85C
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
VDD-VOH(V)
Figure A-4. Typical Low-Side Driver (Source) Characteristics (Ports A, B, and C)
Typical I vs. V – V at V = 2.7 V
OH
DD
OH
DD
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
329
Appendix A Electrical Characteristics
VOH vs VDD
-40C (3mA)
-40C (6mA)
-40C (10mA)
25C (3mA)
25C (6mA)
25C (10mA)
70C (3mA)
70C (6mA)
70C (10mA)
85C (3mA)
85C (6mA)
85C (10mA)
2.700
2.500
2.300
2.100
1.900
1.700
1.500
1.8
2.3
2.7
VDD (V)
Figure A-5. Typical Low-Side Driver (Sink) Characteristics (Ports A, B, and C)
Typical V vs. V at Spec I
OH
DD
OH
A.6
Supply Current Characteristics
Table A-6. Supply Current Characteristics
Parameter
Symbol
VDD (V)
Typical(1)
Max(2)
Temp. (°C)
(3)
3
2
3
2
3
2
3
2
3
2
3
2
3
2
3
2
800 μA
600 μA
5 mA
1.7 mA
1.3 mA
8.7 mA
6.3 mA
17.2 mA
15.5 mA
10 μA
85
85
85
85
85
85
85
85
85
85
85
85
85
85
85
85
Run supply current measured at
RIDD
(CPU clock = 2 MHz, f
= 1 MHz)
Bus
(3)
Run supply current measured at
RIDD
RIDD
(CPU clock = 16 MHz, f
= 8 MHz)
4 mA
Bus
(3)
12 mA
10 mA
770 nA
600 nA
770 nA
600 nA
840 nA
660 nA
350 nA
350 nA
75 μA
Run supply current measured at
(CPU clock = 40 MHz, f
= 20 MHz)
Bus
Stop1 mode supply current
Stop2 mode supply current
Stop3 mode supply current
S1IDD
S2IDD
S3IDD
10 μA
12 μA
12 μA
20 μA
(4)
20 μA
Internal RTI [clock?] adder to stop2 or
(5)
stop3
LVI adder to stop3
(LVDSE = LVDE = 1)
70 μA
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
330
Freescale Semiconductor
Appendix A Electrical Characteristics
Table A-6. Supply Current Characteristics (continued)
Parameter
Symbol
VDD (V)
Typical(1)
Max(2)
Temp. (°C)
(6)
3
2
4 μA
85
85
Adder to stop3 for oscillator enabled
(OSCSTEN =1) (32 kHz)
3.5 μA
Adder for loss-of-clock detection
(LOCD = 0)
3
9 μA
85
1
2
3
4
5
Typicals are measured at 25°C. See Table A-6 through Table A-9 for typical curves across voltage/temperature.
Values given here are preliminary estimates prior to completing characterization.
All modules except ADC active, ICG configured for FBE, and does not include any dc loads on port pins.
With LCD and external clock module disabled.
Most customers are expected to find that auto-wakeup from stop2 or stop3 can be used instead of the higher current wait
mode. Wait mode typical is 560 μA at 3 V and 422 μA at 2V with fBus = 1 MHz.
Values given under the following conditions: low range operation (RANGE = 0), low power mode (HGO = 0), clock monitor
disabled (LOCD = 1).
6
Figure A-6. Typical Run I for FBE FEE Mode, I vs. V
DD
DD
DD
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
331
Appendix A Electrical Characteristics
Typical Room Temp SIDD1
1000
900
800
700
600
500
400
Room Temp SIDD1
1.8
2.1
2.4
2.7
3
3.3
3.6
VDD (V)
Figure A-7. Typical Stop1 I
DD
Typical Room Temp SIDD2
1000
900
800
700
600
500
400
Room Temp SIDD2
1.8
2.1
2.4
2.7
3
3.3
3.6
VDD (V)
Figure A-8. Typical Stop 2 I
DD
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
332
Freescale Semiconductor
Appendix A Electrical Characteristics
Typical Room Temp SIDD3
1000
900
800
700
600
500
400
Room Temp SIDD3
1.8
2.1
2.4
2.7
3
3.3
3.6
VDD (V)
Figure A-9. Typical Stop3 I
DD
A.7
ADC Characteristics
Table A-7. 3 Volt 12-bit ADC Operating Conditions
Characteristic
Conditions
Symbol
Min
Typ(1)
Max
Unit
Comment
Supply voltage
Ground voltage
Absolute
Delta to VDD (VDD-VDDAD
VDDAD
1.8
—
0
3.6
V
(2)
)
ΔVDDAD
-100
+100
mV
2
Delta to VSS (VSS-VSSAD
)
ΔVSSAD
-100
0
+100
mV
V
Ref Voltage High
VREFH
VDDAD
VDDAD
(80-pin package only)
1.8
Ref Voltage Low
VREFL
VSSAD
VSSAD
VSSAD
V
(80-pin package only)
Supply Current
Input Voltage
Stop, Reset, Module Off
IDDAD
VADIN
CADIN
RADIN
—
VREFL
—
0.007
—
0.8
VREFH
5.5
μA
V
Input Capacitance
Input Resistance
4.5
5
pF
kΩ
—
7
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
333
Appendix A Electrical Characteristics
Table A-7. 3 Volt 12-bit ADC Operating Conditions
Characteristic
Conditions
12 bit mode
Symbol
Min
Typ(1)
Max
Unit
Comment
Analog Source
Resistance
RAS
kΩ
External to MCU
f
ADCK > 4MHz
ADCK < 4MHz
—
—
—
—
2
5
f
10 bit mode
fADCK > 4MHz
ADCK < 4MHz
—
—
—
—
5
10
f
8 bit mode (all valid fADCK
High Speed (ADLPC=0)
Low Power (ADLPC=1)
)
—
—
—
—
10
8.0
4.0
ADC Conversion
Clock Freq.
fADCK
0.4
0.4
MHz
1
2
Typical values assume VDDAD = 3.0V, Temp = 25°C, fADCK=1.0MHz unless otherwise stated. Typical values are for reference only
and are not tested in production.
DC potential difference.
SIMPLIFIED
INPUT PIN EQUIVALENT
CIRCUIT
Z
ADIN
SIMPLIFIED
CHANNEL SELECT
CIRCUIT
Pad
Z
AS
leakage
due to
input
ADC SAR
ENGINE
R
R
AS
ADIN
protection
+
V
ADIN
–
C
AS
V
+
AS
–
R
ADIN
INPUT PIN
INPUT PIN
INPUT PIN
R
ADIN
R
ADIN
C
ADIN
Figure A-10. ADC Input Impedance Equivalency Diagram
Table A-8. 3 Volt 12-bit ADC Characteristics (V = V , V
= V )
SSAD
REFH
DDAD REFL
Characteristic
Conditions
C
Symbol
Min
Typ(1)
120
Max
Unit
Comment
Supply Current
ADLPC=1
T
IDDAD
—
—
μA
ADLSMP=1
ADCO=1
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
334
Freescale Semiconductor
Appendix A Electrical Characteristics
Table A-8. 3 Volt 12-bit ADC Characteristics (V
= V
, V
= V
) (continued)
SSAD
REFH
DDAD REFL
Characteristic
Conditions
C
Symbol
Min
Typ(1)
Max
Unit
Comment
Supply Current
ADLPC=1
ADLSMP=0
ADCO=1
T
IDDAD
IDDAD
IDDAD
—
202
—
—
μA
Supply Current
ADLPC=0
ADLSMP=1
ADCO=1
T
—
288
μA
Supply Current
ADLPC=0
ADLSMP=0
ADCO=1
T
P
—
—
532
—
—
1
μA
V
DDAD < 3.6V
mA
ADC
Asynchronous
Clock Source
High Speed (ADLPC=0)
Low Power (ADLPC=1)
P
P
P
fADACK
2
3.3
2
5
MHz
tADACK =
1/fADACK
1.25
3.3
Conversion
Time(Including
sample time)
Short Sample (ADLSMP=0)
Long Sample (ADLSMP=1)
tADC
—
—
20
40
—
—
ADCK
cycles
See Table A-7
for conversion
time variances
Sample Time
Short Sample (ADLSMP=0)
Long Sample (ADLSMP=1)
12 bit mode
tADS
—
—
—
—
—
3.5
23.5
3.0
1
—
ADCK
cycles
—
Total
Unadjusted
Error
(80-pin
package only)
T
P
P
ETUE
—
LSB2
Includes
quantization
10 bit mode
2.5
1.0
8 bit mode
0.5
Total
Unadjusted
Error
(64-pin
package only)
12 bit mode
10 bit mode
8 bit mode
T
P
P
ETUE
LSB2
Includes
quantization
—
—
1.5
0.7
3.5
1.5
Differential
Non-Linearity
12 bit mode
10 bit mode(3)
8 bit mode3
12 bit mode
10 bit mode
8 bit mode
T
P
P
T
T
T
T
P
P
DNL
INL
—
—
—
—
—
—
—
—
—
1.75
0.5
0.3
3
—
LSB(2)
LSB2
LSB2
1.0
0.5
—
Integral
Non-Linearity
2.5
1.5
1.5
0.5
0.5
3.5
2
Zero-Scale
Error
(80-pin
12 bit mode
10 bit mode
8 bit mode
EZS
—
VADIN = VSSAD
1.5
0.5
package only)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
335
Appendix A Electrical Characteristics
Table A-8. 3 Volt 12-bit ADC Characteristics (V
= V
Min
, V
= V
) (continued)
SSAD
REFH
DDAD REFL
Characteristic
Conditions
12 bit mode
C
Symbol
Typ(1)
Max
Unit
Comment
Zero-Scale
Error
T
P
P
T
P
P
T
P
P
D
EZS
EFS
EFS
EQ
LSB2
VADIN = VSSAD
VADIN = VDDAD
VADIN = VDDAD
10 bit mode
8 bit mode
12 bit mode
10 bit mode
8 bit mode
12 bit mode
10 bit mode
8 bit mode
12 bit mode
10 bit mode
8 bit mode
12 bit mode
10 bit mode
8 bit mode
-40°C– 25°C
25°C– 125°C
25°C
—
—
—
—
—
1.5
0.5
1.0
0.5
0.5
2.1
0.7
—
(64-pin
package only)
Full-Scale
Error
LSB2
LSB2
LSB2
LSB2
1
(80-pin
package only)
0.5
Full-Scale
Error
—
—
—
—
—
—
—
—
—
—
—
1
0.5
1.5
0.5
—
(64-pin
package only)
Quantization
Error
0.5
—
0.5
0.5
—
—
Input Leakage
Error
D
EIL
2
Padleakage(4)
* RAS
0.2
4
0.1
1.2
—
Temp Sensor
Slope
D
D
m
1.646
1.769
701.2
mV/°C
—
Temp Sensor
Voltage
VTEMP25
—
mV
1
Typical values assume VDDAD = 3.0V, Temp = 25°C, fADCK=1.0MHz unless otherwise stated. Typical values are for reference
only and are not tested in production.
2
3
4
1 LSB = (VREFH - VREFL)/2N
Monotonicity and No-Missing-Codes guaranteed in 10 bit and 8 bit modes
Based on input pad leakage current. Refer to pad electricals.
A.8
LCD Characteristics
Table A-9. LCD Electricals, 3-V Glass
Characteristic
Symbol
Min
Typ
Max
Unit
LCD Supply Voltage
LCD Frame Frequency
VLCD
fRame
0.9
25
-
1.8
V
30
100
Hz
Note: Current consumption data based on using the external 32-kHz oscillator with LCD configured using
the low-power wave forms option, a 1/4 duty, and a 32-Hz frame frequency. CLCD = CBYLCD = 100
nF; 160 segment 2000 pF LCD panel.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
336
Freescale Semiconductor
Appendix A Electrical Characteristics
Table A-9. LCD Electricals, 3-V Glass (continued)
Characteristic
Symbol
Min
Typ
Max
Unit
LCD Charge Pump Capacitance
LCD Bypass Capacitance
LCD Current Consumption
CLCD
100
100
100
100
433
433
nF
nF
CBYLCD
VLL2 connect to VDD; VDD = 2 V
all segments off, all FP enabled
Isegoff
Iseghalf
Isegallon
—
—
—
0.35
1
—
—
—
μA
μA
μA
half of segments on
all segments on
1
LCD Current Consumption
Trippler Buffered Mode; VDD = 3 V, VLCD = 1.0 V
all segments off, all FP enabled
half of segments on
Isegoff
Iseghalf
Isegallon
—
—
—
2.65
3.8
—
—
—
μA
μA
μA
all segments on
3.6
LCD Current Consumption
Trippler Bypassed Mode; VDD = 3 V, VLCD = 1.0 V
all segments off, all FP enabled
half of segments on
Isegoff
Iseghalf
Isegallon
—
—
—
0.2
0.2
0.2
—
—
—
μA
μA
μA
all segments on
LCD Current Consumption
VLL3 connect to VDD; VDD = 3 V
all segments off, all FP enabled
Isegoff
Iseghalf
Isegallon
—
-
0.15
0.75
0.7
-
-
-
μA
μA
μA
half of segments on
all segments on
-
LCD Current Consumption
Doubler Buffered Mode; VLCD = 1.5 V
all segments off, all FP enabled
Isegoff
Iseghalf
Isegallon
-
-
-
2.7
3.85
3.6
-
-
-
μA
μA
μA
half of segments on
all segments on
Note: Current consumption data based on using the external 32-kHz oscillator with LCD configured using
the low-power wave forms option, a 1/4 duty, and a 32-Hz frame frequency. CLCD = CBYLCD = 100
nF; 160 segment 2000 pF LCD panel.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
337
Appendix A Electrical Characteristics
Table A-10. LCD Electricals, 5 V Glass
Characteristic
Symbol
Min
Typ
Max Unit
LCD Supply Voltage
VLCD
fRame
0.9
25
—
30
1.8
100
433
433
V
Hz
nF
nF
LCD Frame Frequency
LCD Charge Pump Capacitance
CLCD
100
100
100
100
LCD Bypass Capacitance
LCD Current Consumption
CBYLCD
V
LL2 connect to VDD; VDD = 3.3 V
all segments off, all FP enabled
Isegoff
Iseghalf
Isegallon
—
—
—
0.2
—
—
—
μA
μA
μA
half of segments on
all segments on
0.95
0.67
LCD Current Consumption
Trippler Buffered Mode; VDD = 3 V, VLCD = 1.667 V
all segments off, all FP enabled
half of segments on
Isegoff
Iseghalf
Isegallon
—
—
—
3.1
4.2
3.6
—
—
—
μA
μA
μA
all segments on
LCD Current Consumption
Trippler Bypassed Mode; VDD = 3 V, VLCD = 1.667 V
all segments off, all FP enabled
half of segments on
Isegoff
Iseghalf
Isegallon
—
—
—
0.1
0.1
0.1
—
—
—
μA
μA
μA
all segments on
Note: Current consumption data based on using the external 32-kHz oscillator with LCD configured
using the low-power wave forms option, a 1/4 duty, and a 32-Hz frame frequency. CLCD = CBYLCD
= 100 nF; 160 segment 2000 pF LCD panel.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
338
Freescale Semiconductor
Appendix A Electrical Characteristics
A.9
Internal Clock Generation Module Characteristics
ICG
EXTAL
XTAL
R
S
R
F
Crystal or Resonator (See Note)
C
1
C
2
NOTE:
Use fundamental mode crystal or ceramic resonator only.
Table A-11. ICG DC Electrical Specifications (Temperature Range = 0 to 70°C Ambient)
Characteristic
Symbol
Min
Typ(1)
Max
Unit
Load capacitors
Feedback resistor
C1
C2
See Note (2)
Low range (32k to 100 kHz)
High range (1M – 16 MHz)
RF
RS
10
1
MΩ
MΩ
Series resistor
Low range (32 kHz to 100 kHz)
High range (1 MHz to 16 MHz)
0
0
0
0
10
0
kΩ
1
2
Data in Typical column was characterized at 3.0 V, 25°C or is typical recommended value.
See crystal or resonator manufacturer’s recommendation.
A.9.1
ICG Frequency Specifications
Table A-12. ICG Frequency Specifications
(min) to V (max), Temperature Range = 0 to 70°C Ambient)
(V
= V
DDA
DDA
DDA
Characteristic
Symbol
Min
Typical
Max
Unit
Oscillator crystal or resonator (REFS = 1)
(Fundamental mode crystal or ceramic
resonator)
flo
32
1
2
—
—
—
100
16
10
kHz
MHz
MHz
Low range
fhi_byp
fhi_eng
High range, FLL bypassed external (CLKS = 10)
High range, FLL engaged external (CLKS = 11)
Input clock frequency (CLKS = 11, REFS = 0)
Low range
High range
flo
32
2
—
—
100
10
kHz
MHz
fhi_eng
fExtal
0
—
40
MHz
kHz
Input clock frequency (CLKS = 10, REFS = 0)
Internal reference frequency (untrimmed)
fICGIRCLK
182.25
243
303.75
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
339
Appendix A Electrical Characteristics
Table A-12. ICG Frequency Specifications
(min) to V (max), Temperature Range = 0 to 70°C Ambient)
(V
= V
DDA
DDA
DDA
Characteristic
Symbol
Min
Typical
Max
Unit
4
tdc
40
—
60
%
Duty cycle of input clock (REFS = 0)
Output clock ICGOUT frequency
CLKS = 10, REFS = 0
All other cases
f
Extal (max)
fExtal (min)
flo (min)
fICGOUT
fICGDCLKmax
(max)
MHz
Minimum DCO clock (ICGDCLK) frequency
fICGDCLKmin
fICGDCLKmax
fSelf
8
—
—
MHz
MHz
MHz
MHz
Maximum DCO clock (ICGDCLK) frequency
Self-clock mode (ICGOUT) frequency (1)
Self-clock mode reset (ICGOUT) frequency
40
fICGDCLKmin
5.5
fICGDCLKmax
fSelf_reset
8
10.5
Loss of reference frequency (2)
Low range
fLOR
5
50
25
500
kHz
High range
Loss of DCO frequency (3)
fLOD
0.5
1.5
MHz
Crystal start-up time (4), (5)
Low range
t
—
—
430
4
—
—
CSTL
ms
ms
High range
t
CSTH
FLL lock time 4, (6)
Low range
tLockl
—
—
5
5
High range
tLockh
FLL frequency unlock range
FLL frequency lock range
nUnlock
nLock
–4*N
–2*N
4*N
2*N
counts
counts
ICGOUT period jitter, 4, (7) measured at fICGOUT Max
Long term jitter (averaged over 2 ms interval)
CJitter
% fICG
—
0.2
Internal oscillator deviation from trimmed frequency(8)
VDD = 1.8 – 3.6 V, (constant temperature)
—
—
0.5
0.5
2
2
ACCint
%
VDD = 3.0 V 10%, –40° C to 85° C
1
2
Self-clocked mode frequency is the frequency that the DCO generates when the FLL is open-loop.
Loss of reference frequency is the reference frequency detected internally, which transitions the ICG into self-clocked
mode if it is not in the desired range.
3
Loss of DCO frequency is the DCO frequency detected internally, which transitions the ICG into FLL bypassed external
mode (if an external reference exists) if it is not in the desired range.
4
5
6
This parameter is characterized before qualification rather than 100% tested.
Proper PC board layout procedures must be followed to achieve specifications.
This specification applies to the period of time required for the FLL to lock after entering FLL engaged internal or external
modes. If a crystal/resonator is being used as the reference, this specification assumes it is already running.
7
Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum fICGOUT
.
Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise
injected into the FLL circuitry via VDDA and VSSA and variation in crystal oscillator frequency increase the CJitter
percentage for a given interval.
8
See Figure A-10
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
340
Freescale Semiconductor
Appendix A Electrical Characteristics
Figure A-11. Internal Oscillator Deviation from Trimmed Frequency
A.10 AC Characteristics
This section describes ac timing characteristics for each peripheral system. For detailed information about
how clocks for the bus are generated, see Chapter 7, “Internal Clock Generator (ICG) Module.”
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
341
Appendix A Electrical Characteristics
A.10.1 Control Timing
Table A-13. Control Timing
Parameter
Symbol
fBus
Min
dc
Typical
Max
20
Unit
MHz
μs
—
Bus frequency (t = 1/f
)
Bus
cyc
tRTI
700
1300
Real-time interrupt internal oscillator period
1.5 x
fSelf_reset
(1)
textrst
—
—
ns
ns
External reset pulse width
34 x
fSelf_reset
(2)
trstdrv
Reset low drive
tMSSU
tMSH
tILIH
25
25
—
—
—
ns
ns
ns
Active background debug mode latch setup time
Active background debug mode latch hold time
(3)
1.5 x tcyc
IRQ pulse width
(4)
Port rise and fall time (load = 50 pF)
tRise, tFall
—
—
3
30
ns
Slew rate control disabled
Slew rate control enabled
1
2
3
4
This is the shortest pulse that is guaranteed to be recognized as a reset pin request. Shorter pulses are not guaranteed to
override reset requests from internal sources.
When any reset is initiated, internal circuitry drives the reset pin low for about 34 cycles of fSelf_reset and then samples the level
on the reset pin about 38 cycles later to distinguish external reset requests from internal requests.
This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or
may not be recognized. In stop mode, the synchronizer is bypassed so shorter pulses can be recognized in that case.
Timing is shown with respect to 20% VDD and 80% VDD levels. Temperature range –40°C to 85°C.
t
extrst
RESET PIN
Figure A-12. Reset Timing
BKGD/MS
RESET
t
MSH
t
MSSU
Figure A-13. Active Background Debug Mode Latch Timing
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
342
Freescale Semiconductor
Appendix A Electrical Characteristics
t
ILIH
IRQ
Figure A-14. IRQ Timing
A.10.2 Timer/PWM (TPM) Module Timing
Synchronizer circuits determine the shortest input pulses that can be recognized or the fastest clock that
can be used as the optional external source to the timer counter. These synchronizers operate from the
current bus rate clock.
Table A-14. TPM Input Timing
Function
External clock frequency
External clock period
Symbol
fTPMext
tTPMext
tclkh
Min
dc
Max
fBus/4
—
Unit
MHz
tcyc
tcyc
tcyc
tcyc
4
1.5
1.5
1.5
—
External clock high time
External clock low time
Input capture pulse width
tclkl
—
tICPW
—
t
Text
t
clkh
TPMxCHn
t
clkl
Figure A-15. Timer External Clock
t
ICPW
TPMxCHn
TPMxCHn
t
ICPW
Figure A-16. Timer Input Capture Pulse
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
343
Appendix A Electrical Characteristics
A.10.3 SPI Timing
Table A-12 and Figure A-16 through Figure A-19 describe the timing requirements for the SPI system.
Table A-15. SPI Timing
No.
Function
Symbol
Min
Max
Unit
Operating frequency
Master
Slave
f
f
/2048
dc
f
f
/2
/4
Hz
op
Bus
Bus
Bus
SCK period
Master
Slave
1
2
3
4
5
6
t
t
2
4
2048
—
t
t
SCK
cyc
cyc
Enable lead time
Master
Slave
1/2
1
—
—
t
SCK
t
Lead
cyc
Enable lag time
Master
Slave
t
1/2
1
—
—
t
SCK
t
Lag
cyc
Clock (SCK) high or low time
Master
Slave
t
t
t
– 30
– 30
1024 t
—
ns
ns
WSCK
cyc
cyc
cyc
Data setup time (inputs)
Master
Slave
t
t
15
15
—
—
ns
ns
SU
Data hold time (inputs)
Master
Slave
t
0
25
—
—
ns
ns
HI
Slave access time
7
8
t
—
—
1
1
t
a
cyc
cyc
Slave MISO disable time
t
dis
Data valid (after SCK edge)
Master
Slave
9
t
—
—
25
25
ns
ns
v
Data hold time (outputs)
Master
Slave
10
11
12
t
t
0
0
—
—
ns
ns
HO
Rise time
Input
Output
t
—
—
t
t
– 25
ns
ns
RI
cyc
25
RO
Fall time
Input
Output
t
t
—
—
– 25
25
ns
ns
FI
cyc
FO
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
344
Freescale Semiconductor
Appendix A Electrical Characteristics
1
SS
(OUTPUT)
1
2
11
12
3
SCK
(CPOL = 0)
(OUTPUT)
4
4
SCK
(CPOL = 1)
(OUTPUT)
5
6
MISO
(INPUT)
2
BIT 6 . . . 1
9
MSB IN
LSB IN
9
10
MOSI
(OUTPUT)
2
BIT 6 . . . 1
LSB OUT
MSB OUT
NOTES:
1. SS output mode (DDS7 = 1, SSOE = 1).
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
Figure A-17. SPI Master Timing (CPHA = 0)
(1)
SS
(OUTPUT)
1
2
11
12
3
12
11
SCK
(CPOL = 0)
(OUTPUT)
4
4
SCK
(CPOL = 1)
(OUTPUT)
5
6
MISO
(INPUT)
(2)
MSB IN
BIT 6 . . . 1
10
BIT 6 . . . 1
LSB IN
9
MOSI
(OUTPUT)
(2)
PORT DATA
MASTER LSB OUT
PORT DATA
MASTER MSB OUT
NOTES:
1. SS output mode (DDS7 = 1, SSOE = 1).
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
Figure A-18. SPI Master Timing (CPHA = 1)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
345
Appendix A Electrical Characteristics
SS
(INPUT)
11
12
3
1
12
11
SCK
(CPOL = 0)
(INPUT)
2
4
4
SCK
(CPOL = 1)
(INPUT)
8
7
10
9
10
MISO
(OUTPUT)
SEE
NOTE
BIT 6 . . . 1
SLAVE LSB OUT
MSB OUT
6
SLAVE
5
MOSI
(INPUT)
BIT 6 . . . 1
MSB IN
LSB IN
NOTE:
1. Not defined but normally MSB of character just received
Figure A-19. SPI Slave Timing (CPHA = 0)
SS
(INPUT)
1
3
12
2
11
SCK
(CPOL = 0)
(INPUT)
4
4
11
12
SCK
(CPOL = 1)
(INPUT)
9
10
8
MISO
(OUTPUT)
SEE
BIT 6 . . . 1
SLAVE LSB OUT
LSB IN
SLAVE MSB OUT
NOTE
5
6
7
MOSI
(INPUT)
MSB IN
BIT 6 . . . 1
NOTE:
1. Not defined but normally LSB of character just received
Figure A-20. SPI Slave Timing (CPHA = 1)
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
346
Freescale Semiconductor
Appendix A Electrical Characteristics
A.11 FLASH Specifications
This section provides details about program/erase times and program-erase endurance for the FLASH
memory.
Program and erase operations do not require any special power sources other than the normal V supply.
DD
For more detailed information about program/erase operations, see Chapter 4, “Memory.”
Table A-16. FLASH Characteristics
Characteristic
Symbol
Min
Typical
Max
Unit
Vprog/erase
1.8
3.6
V
Supply voltage for program/erase
Supply voltage for read operation
VRead
1.8
2.08
3.6
3.6
V
0 < f
0 < f
< 8 MHz
< 20 MHz
Bus
Bus
(1)
fFCLK
tFcyc
150
5
200
kHz
Internal FCLK frequency
6.67
μs
Internal FCLK period (1/FCLK)
Byte program time (random
tprog
tFcyc
9
(2)
location)
(2)
tBurst
tPage
tMass
tFcyc
tFcyc
tFcyc
4
Byte program time (burst mode)
(2)
4000
20,000
Page erase time
(2)
Mass erase time
(3)
Program/erase endurance
10,000
15
—
—
cycles
years
T to T = –40°C to + 85°C
L
H
100,000
100
T = 25°C
(4)
tD_ret
—
Data retention
1
2
The frequency of this clock is controlled by a software setting.
These values are hardware state machine controlled. User code does not need to count cycles. This information
supplied for calculating approximate time to program and erase.
3
4
Typical endurance for FLASH was evaluated for this product family on the 9S12Dx64. For additional
information on how Freescale Semiconductor defines typical endurance, please refer to Engineering Bulletin
EB619/D, Typical Endurance for Nonvolatile Memory.
Typical data retention values are based on intrinsic capability of the technology measured at high temperature
and de-rated to 25°C using the Arrhenius equation. For additional information on how Freescale Semiconductor
defines typical data retention, please refer to Engineering Bulletin EB618/D, Typical Data Retention for
Nonvolatile Memory.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
347
Appendix A Electrical Characteristics
A.12 EMC Performance
Electromagnetic compatibility (EMC) performance is highly dependant on the environment in which the
MCU resides. Board design and layout, circuit topology choices, location and characteristics of external
components as well as MCU software operation all play a significant role in EMC performance. The
system designer should consult Freescale applications notes such as AN2321, AN1050, AN1263,
AN2764, and AN1259 for advice and guidance specifically targeted at optimizing EMC performance.
A.12.1 Radiated Emissions
Microcontroller radiated RF emissions are measured from 150 kHz to 1 GHz using the TEM/GTEM Cell
method in accordance with the IEC 61967-2 and SAE J1752/3 standards. The measurement is performed
with the microcontroller installed on a custom EMC evaluation board while running specialized EMC test
software. The radiated emissions from the microcontroller are measured in all four package orientations
(North, South, East and West). For more detailed information concerning the evaluation results, conditions
and setup, please refer to the Radiated RF Emissions test report for this device.
The maximum radiated RF emissions of the tested configuration in all orientations are less than or equal
to the reported emissions levels.
1
Table 17-7. Radiated RF Emissions Characteristics
Supply
Voltage
[V]
Ambient
Temp.
[oC]
Oscillator
Source &
Frequency
Emissions
Level
System Bus
Frequency
Test Frequency
Range
Package
Unit
[Typical]2
Internal
20 MHz
0.150 - 50 MHz
50 - 150 MHz
150 - 500 MHz
500 - 1000 MHz
IEC Level3
15
17
3
dBuV
3
L
-
-
SAE Level4
2
80 LQFP
3.3
25
External crystal,
16 MHz
8 MHz
0.150 - 50 MHz
50 - 150 MHz
150 - 500 MHz
500 - 1000 MHz
IEC Level3
10
12
-3
-3
L
dBuV
-
-
SAE Level4
2
NOTES:
1. This data based on qualification test results. Not tested in production.
2. The reported emission level is the value of the maximum emission, rounded up to the next whole dB, from
among the mesured orienations in each frequency range.
3. IEC levels are as specified in IEC 61967-1 and IEC 61967-2.
4. SAE levels are as specified in SAE J1752/1 and SAE J1752/3.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
348
Freescale Semiconductor
Appendix A Electrical Characteristics
A.12.2 Conducted Transient Susceptibility
Microcontroller transient conducted susceptibility is measured in accordance with an internal Freescale
test method. The measurement is performed with the microcontroller installed on a custom EMC
evaluation board and running specialized EMC test software designed in compliance with the test method.
The conducted susceptibility is determined by injecting the transient signal on each pin of the
microcontroller. The transient waveform and injection methodology is in accordance with IEC 61000-4-4
for the electrical fast transient/burst (EFT/B). The transient voltage required to cause performance
degradation on any pin in the tested configuration is greater than or equal to the reported levels unless
otherwise indicated by footnotes below the table.
1
Table A-17. Conducted Transient Susceptibility Characteristics
Supply
Voltage
[V]
Ambient
Temp.
[oC]
Oscillator
Source &
Frequency
Amplitude
Level
System Bus
Frequency
Package
Result
Unit
[Typical]2
A
B
C
+/- 4
none
none
none
none
External crystal,
32 kHz
80LQFP
2.2
25
20 MHz
kV
D
E
NOTES:
1. This data based on qualification test results. Not tested in production.
2. The reported transient immunity voltage ;levels indicate the minimum voltage range for each result type.
The susceptibility performance classification is described in Table A-18.
Table A-18. Susceptibility Performance Classification
Result
Performance Criteria
A
B
No failure
The MCU performs as designed during and after exposure.
Self-recovering The MCU does not perform as designed during exposure. The MCU returns
failure
automatically to normal operation after exposure is removed.
C
D
E
Soft failure
The MCU does not perform as designed during exposure. The MCU does not return to
normal operation until exposure is removed and the RESET pin is asserted.
Hard failure
Damage
The MCU does not perform as designed during exposure. The MCU does not return to
normal operation until exposure is removed and the power to the MCU is cycled.
The MCU does not perform as designed during and after exposure. The MCU cannot
be returned to proper operation due to physical damage or other permanent
performance degradation.
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
349
Appendix A Electrical Characteristics
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
350
Freescale Semiconductor
Appendix B
Ordering Information and Mechanical Drawings
B.1
Ordering Information
This section contains ordering numbers for MC9S08LC60 and MC9S08LC36 devices. See below for an
example of the device numbering system.
Table B-1. Device Numbering System
Memory
Package
Designator
Device Number
FLASH
RAM
Type
MC9S08LC60
MC9S08LC36
60K
4K
80 LQFP
80 LQFP
64 LQFP
LK
LK
LH
36K
2K
9
LC60 C XX E
MC S08
Pb-free package designator
Package designator
Status
(MC = Fully Qualified)
Temperature range
(blank = -40°C to 85°C)
Memory
(9 = FLASH-based)
Core
Family
B.2
Mechanical Drawings
The following pages provide mechanical drawings packages available for MC9S08LC60 Series:
•
•
80 LQFP
64 LQFP
Table B-2. Package Information
Pin Count
Type
Designator
Document No.
80
64
LQFP
LQFP
LK
LH
98ASS23174W
98ASS23234W
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
Freescale Semiconductor
351
Appendix B Ordering Information and Mechanical Drawings
MC9S08LC60 Series Data Sheet: Technical Data, Rev. 4
352
Freescale Semiconductor
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