JN5168-001-MYY [NXP]
JenNet-IP, ZigBee PRO and IEEE802.15.4 Module;型号: | JN5168-001-MYY |
厂家: | NXP |
描述: | JenNet-IP, ZigBee PRO and IEEE802.15.4 Module |
文件: | 总29页 (文件大小:765K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Data Sheet: JN5168-001-Myy
JenNet-IP, ZigBee PRO and IEEE802.15.4 Module
Overview
Features: Module
The JN5168-001-Myy family is a range of ultra low power, high performance surface mount
modules targeted at IEEE 802.15.4, JenNet-IP, ZigBee Light Link, ZigBee Smart Energy and
RF4CE networking applications, enabling users to realise products with minimum time to
market and at the lowest cost. They remove the need for expensive and lengthy development
of custom RF board designs and test suites. The modules use NXP’s JN5168 wireless
microcontroller to provide a comprehensive solution with large memory, high CPU and radio
performance and all RF components included. All that is required to develop and manufacture
wireless control or sensing products is to connect a power supply and peripherals such as
switches, actuators and sensors, considerably simplifying product development.
•
2.4GHz IEEE 802.15.4, JenNet-IP,
ZigBee Light Link, ZigBee Smart Energy
and RF4CE compatible
•
JN5168-001-M00/03
up to 1km range (Ext antenna)
M00: integral antenna 16x30mm
M03: uFl connector 16x21mm
o
o
o
o
o
TX power +2.5dBm
Receiver sensitivity –95dBm
TX current 15.3mA
RX current 17mA
Four module variants are available: JN5168-001-M00 with an integrated antenna, JN5168-001-
M03 with an antenna connector and the JN5168-001-M05 and M06 with an antenna connector,
power amplifier and LNA for extended range. The JN5168-001-M05 output power has been
optimised for use in Europe and Asia.
2.0-3.6V operation
•
JN5168-001-M05
up to 2km range (Ext 2dBi Antenna)
Module Block Diagram
o
o
o
o
o
o
o
9.5 dBm TX Power
Receiver sensitivity -96dBm
uFl connector
TX current 35mA
RX current 22mA
16x30mm
XTAL
Watchdog
Timer
RAM
8/32K
Flash
64/160/256K
SPI Master & Slave
Matching
M00 Option
2.0-3.6V operation
Integrated Antenna
2.4GHz
Radio
Voltage
Brownout
2-Wire Serial
(Master/Slave)
•
JN5168-001-M06
up to 6km range (Ext 2 dBi Antenna)
Including
Diversity
32 -Bit
RISC CPU
4xPWM + Timers
O-QPSK
Modem
uFl
Connector
Matching
M03 Option
2x UART
20 DIO
o
o
o
o
o
o
o
22dBm TX Power
Receiver sensitivity -100dBm
uFl connector
TX current 175mA
RX current 22mA
16x30mm
4kB
EEPROM
IEEE802.15.4
MAC
Accelerator
External
Antenna
uFl
Connector
PA / LNA
Matching
Sleep Counter
M05/M06 Option
Power
Management
4 Chan 10-bit ADC
128-bit AES
Encryption
Accelerator
Battery and Temp
Sensor
2.0-3.6V operation
Power
Features: Microcontroller
•
•
•
32-bit RISC CPU, up to 32MIPs with low
power
Data EEPROM with guaranteed 100k
write operations
Benefits
Applications
RF4CE, JenNet-IP, ZigBee Smart
Energy stacks
•
Robust and secure low power wireless
applications
•
•
•
Microminiature module solutions
Ready to use in products
•
•
•
•
•
•
•
•
•
JTAG debug interface
•
•
ZigBee and JenNet-IP networks
Minimises product development
time
4-input 10-bit ADC, 1 comparator
5 x PWM (4 x timer, 1 x timer/counter)
2 UARTs
Home and commercial building
automation
•
•
No RF test required for systems
Compliant with
•
•
Utilities metering (e.g. AMR)
SPI Master & Slave port with 3 selects
2-wire serial interface
Location Aware services (e.g. Asset
Tracking)
o
o
FCC 47CFR Part 15C
•
•
Toys and gaming peripherals
Industrial systems
Battery and Temperature Sensor
Watchdog timer and BOR
Up to 20 DIO
IC Canada RSS 210 Issue 8 -
Annex 8,
•
•
Telemetry
Remote Control
o
o
o
ETSI EN 300-328 V1.7.1
EN 301-489-17 V2.1.1
Industrial temp (-40°C to +85°C)
Lead-free and RoHS compliant
EN60950-1-2006 +A1, A11, A12
JN-DS-JN5168-001-Myy
© NXP Laboratories UK 2013
Contents
1. Introduction
3
3
3
1.1.
1.2.
Variants
Regulatory Approvals
2. Specifications
4
5
2.1.
JN5168 Single Chip Wireless Microcontroller
3. Pin Configurations
6
7
8
8
3.1.
Pin Assignment
Pin Descriptions
Power Supplies
3.2.
3.2.1
4. Electrical Characteristics
9
9
9
4.1.
4.2.
Maximum Ratings
Operating Conditions
Appendix A Additional Information
10
10
13
14
15
19
19
20
20
20
21
22
22
22
23
24
25
25
25
26
26
26
27
A.1
Outline Drawing
A.2
Module PCB Footprint
A.3
A.4
A.5
Optimal PCB placement of the JN5168-001-M00 Module
JN5168-001-M00 Antenna Radiation Pattern
Manufacturing
A.5.1
A.5.2
A.6
Reflow Profile
Soldering Paste and Cleaning
Tape and Reel Information
A.6.1
A.6.2
A.6.3
A.6.4
A.7
Tape Orientation and dimensions
Reel Dimensions
Cover tape details
Leader and Trailer
Related Documents
A.8
Ordering Information
A.9
Federal Communication Commission Interference Statement
Antennas approved by FCC for use with JN5168 modules
High Power Module usage limitation
FCC End Product Labelling
A.9.1
A.9.2
A.9.3
A.10 Industry Canada Statement
A.10.1
Industry Canada End Product Labelling
A.11 European R & TTE Directive 1999/5/EC Statement
A.12 RoHS Compliance
Status Information
Disclaimers
Trademarks
Version Control
Contact Details
27
28
28
28
29
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JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
1. Introduction
The JN5168-001-Myy module family provides designers with a ready-made component that provides a fully
integrated solution for applications, using the IEEE802.15.4 standard in the 2.4-2.5GHz ISM frequency band [1],
including JenNet-IP and ZigBee Smart Energy, and can be quickly and easily included in product designs. The
modules integrate all of the RF components required, removing the need to perform expensive RF design and test.
Products can be designed by simply connecting sensors and switches to the module IO pins. The modules use
NXP’s single chip IEEE802.15.4 Wireless Microcontroller, allowing designers to make use of the extensive chip
development support material. Hence, this range of modules allows designers to bring wireless applications to
market in the minimum time with significantly reduced development effort and cost.
Four variants are available: JN5168-001-M00, JN5168-001-M03, JN5168-001-M05 and JN5168-001-M06. All
modules have FCC and Industry Canada modular approvals. All modules other than the JN5168-001-M06 are also
CE compliant and subject to a Notified Body Opinion.
The variants available are described below.
1.1. Variants
Variant
Description
FCCID
Industry Canada ID
7438A-CYO5168M0
7438A-CYO5168M3
7438A-CYO5168M5
7438A-CYO5168M6
JN5168-001-M00
JN5168-001-M03
JN5168-001-M05
JN5168-001-M06
Standard Power, integrated antenna
Standard Power, uFL connector
Medium Power, uFL connector
High Power, uFL connector
TYOJN5168M0
TYOJN5168M3
TYOJN5168M5
TYOJN5168M6
1.2. Regulatory Approvals
The JN5168-001-M00, M03 and M05 have been tested against the requirements of the following European
standards.
•
•
•
Radio EN 300 328 v1.7.1.
EMC, EN 301 489-17 v2.1.1
Basic Safety Assessment (BSA) EN 60950-1:2006
A Notified Body statement of opinion for this standard is available on request.
The High Power module with M06 suffix is not approved for use in Europe, instead the JN5168-001-M05 module may
be used with an antenna with up to 2.2dBi; 10mW/MHz power spectral density e.i.r.p is the maximum permitted in
Europe.
Additionally, all module types have received FCC “Modular Approval”, in compliance with CFR 47 FCC part 15
regulations and in accordance to FCC Public notice DA00-1407. Appendix 0 contains details on the conditions
applying to this modular approval. The modules are approved for use with a range of different antennas; further
details of which can be found in section Appendix A.9.1. The modular approvals notice and test reports are available
on request.
All modules are compliant with Industry Canada RSS210 (Issue 8, Annex 8) and have Industry Canada modular
approval.
The JN5168-001-M06 module is subject to user proximity restrictions under FCC and Industry Canada regulations;
more specific information is available in A.9.2.
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
3
2. Specifications
Most specification parameters for the modules are specified in the chip datasheet – JN-DS-JN5168 Wireless
Microcontroller Datasheet [2]. Where there are differences, the parameters are defined here.
VDD=3.0V @ +25°C
Typical DC Characteristics
JN5168-001- JN5168-001-
Notes
JN5168-001-
M05
M00/03
100nA
0.70uA
M06
Deep sleep current
Sleep current
100nA
0.70uA
100nA
0.70uA
With active sleep timer
Radio transmit
current
15.3mA
17mA
175mA
22mA
35mA
22mA
CPU in doze, radio transmitting
CPU in doze, radio receiving
Radio receive
current
Centre frequency
accuracy
Additional +/-15ppm allowance for
temperature and ageing
+/-25ppm
+/-25ppm
+/-25ppm
Typical RF Characteristics
Notes
Nominal for 1% PER, as per 802.15.4
section 6.5.3.3 (Note 1)
Receive sensitivity
Transmit power
-95dBm
-100dBm
22dBm
5dBm
-96dBm
9.5 dBm
10dBm
2.5dBm
10dBm
Nominal
Maximum input
signal
For 1% PER, measured as sensitivity
-95 to
-10dBm
-105 to
-20dBm
-102 to
-17dBm
RSSI range
RF Port impedance
– uFL connector
50 ohm
-61dBm
50 ohm
-69dBm
50 ohm
-69dBm
2.4 - 2.5GHz
Rx Spurious
Emissions
Measured conducted into 50ohms
Measured conducted into 50ohms
Tx Spurious
Emissions
-40dBm
2:1
-49dBm
2:1
-45dBm
2:1
VSWR (max)
Peripherals
Master SPI port
Slave SPI port
Two UARTs
2.4 - 2.5GHz
Notes
3 selects
3 selects
3 selects
250kHz - 16MHz
250kHz - 4MHz
16550 compatible
Two-wire serial I/F
(compatible with
SMbus & I2C)
Up to 400kHz
16MHz clock
32kHz clock
5 x PWM (4 x timer,
1 x timer/counter)
Two programmable
Sleep Timers
Digital IO lines
(multiplexed with
UARTs, timers and
DIO2 & DIO3 not available on JN5168-001-
M05 and JN5168-001-M06 modules
20
18
18
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JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
SPI selects)
Four channel
Analogue-to-Digital
converter
10-bit, up to 100ks/s
Programmable
analogue
comparators
Ultra low power mode for sleep
Internal
temperature sensor
and battery monitor
The performance of all peripherals is defined in the JN-DS-JN5168 Wireless Microcontroller Datasheet [2].
Note 1: Sensitivity is defined for conducted measurements on connectorised modules. Modules with an integrated
antenna have approximately 1.5 dB less e.i.r.p and reciprocal receive sensitivity.
NXP supplies all the development tools and networking stacks needed to enable end-product development to occur
quickly and efficiently. These are all freely available from the NXP Wireless Connectivity TechZone:
www.nxp.com/techzones/wireless-connectivity. A range of evaluation/developer kits is also available, allowing
products to be quickly bread boarded. Efficient development of software applications is enabled by the provision of a
complete, unlimited, software developer kit. Together with the available libraries for the IEEE802.15.4 MAC and the
JenNet-IP and ZigBee PRO network stacks, this package provides everything required to develop application code
and to trial it with hardware representative of the final module.
The modules can be user programmed both in development and in production using software supplied by NXP.
Access to the on-chip peripherals, MAC and network stack software is provided through specific APIs. This
information is available on the NXP support website, together with many example applications, user guides, reference
manuals and application notes.
2.1. JN5168 Single Chip Wireless Microcontroller
The JN5168-001-Myy series is constructed around the JN5168-001 single chip wireless microcontroller, which
includes the radio system, a 32-bit RISC CPU, Flash, RAM & EEPROM memory and a range of analogue and digital
peripherals.
The chip is described fully in JN-DS-JN5168 Wireless Microcontroller Datasheet [2].
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
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3. Pin Configurations
1
27
ADC1
VREF/ADC2
2
26 DIO17
25 DIO16
DO0
3
DO1
4
24 DIO15
DIO18
5
23
DIO19
DIO14
6
22
DIO0
RESETN
7
DIO13
DIO12
DIO11
21
20
19
DIO1
8
DIO2
9
DIO3
10 11 12 13 14 15 16 17 18
Figure 1: Pin Configuration (top view)
Note that the same basic pin configuration applies for all module designs. However, DIO3 (pin 9) and DIO2 (pin 8)
are not available on the JN5168-001-M05 and JN5168-001-M06.
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JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
3.1. Pin Assignment
Pin
No
Pin Functions
Signal
Type
Description
Primary
ADC1
DO0
Alternate Functions
1
3.3V
Analogue to Digital Input
2
SPICLK
PWM2
PWM3
CMOS SPI Master Clock Output or
PWM2 Output
3
DO1
SPIMISO
CMOS SPI Master In Slave Out Input or
PWM3 Output
4
5
6
DIO18
DIO19
DIO0
SPIMOSI
SPISEL0
SPISEL1
CMOS SPI Master Out Slave In Output
CMSO SPI Master Select Output 0
ADC3
CMOS DIO0, SPI Master Select Output 1
or ADC input 3
7
8
DIO1
SPISEL2
ADC4
RFRX
PC0
CMOS DIO1, SPI Master Select Output
2, ADC input 4 or Pulse Counter
0 Input
DIO2*
TIM0CK_GT
CMOS DIO2, Radio Receive Control
Output or Timer0 Clock/Gate
Input
9
DIO3*
DIO4
RFTX
TIM0CAP
TIM0OUT
CMOS DIO3, Radio Transmit Control
Output or Timer0 Capture Input
10
CTS0
RTS0
JTAG_TCK
PC0
PC1
CMOS DIO4, UART 0 Clear To Send
Input, JTAG CLK Input, Timer0
PWM Output, or Pulse Counter 0
input
11
DIO5
JTAG_TMS
PWM1
CMOS DIO5, UART 0 Request To Send
Output, JTAG Mode Select Input,
PWM1 Output or Pulse Counter 1
Input
12
13
14
15
DIO6
DIO7
DIO8
DIO9
TXD0
RXD0
JTAG_TDO
JTAG_TDI
PC1
PWM2
PWM3
PWM4
RXD1
CMOS DIO6, UART 0 Transmit Data
Output, JTAG Data Output or
PWM2 Output
CMOS DIO7, UART 0 Receive Data
Input, JTAG Data Input or PWM 3
Output
TIM0CK_GT
TIM0CAP
CMOS DIO8, Timer0 Clock/Gate Input,
Pulse Counter1 Input or PWM 4
Output
32KXTALIN
32KIN
CMOS DIO9, Timer0 Capture Input, 32K
External Crystal Input, UART 1
Receive Data Input or 32K
external clock Input
16
DIO10
TIM0OUT
32KXTALOUT
CMOS DIO10, Timer0 PWM Output or
32K External Crystal Output
17
18
19
VDD
GND
3.3V
0V
Supply Voltage
Digital Ground
DIO11
PWM1
PWM2
TXD1
CMOS DIO11, PWM1 Output or UART 1
Transmit Data Output
20
DIO12
CTS0
RTS0
JTAG_TCK
ADO or
SPISMOSI
CMOS DIO12, PWM2 Output, UART 0
Clear To Send Input, JTAG CLK
Input, Antenna Diversity Odd
Output or SPI Slave Master Out
Slave In Input
21
DIO13
PWM3
JTAG_TMS
ADE or
SPISMISO
CMOS DIO13, PWM3 Output, UART 0
Request To Send Output, JTAG
Mode Select Input, Antenna
Diversity Even output or SPI
Slave Master In Slave Out Output
22
23
RESETN
DIO14
CMOS Reset input
SIF_CLK
TXD0 TXD1
JTAG_TDO
SPISEL1 or
CMOS DIO14, Serial Interface Clock,
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
7
SPISSEL
SPISEL2
UART 0 Transmit Data Output,
UART 1 Transmit Data Output,
JTAG Data Output, SPI Master
Select Output 1 or SPI Slave
Select Input
24
25
DIO15
DIO16
SIF_D
RXD0 RXD1
SIF_CLK
JTAG_TDI
SPISMOSI
CMOS DIO15, Serial Interface Data or
Intelligent Peripheral Data Out
COMP1P
CMOS DIO16, Comparator Positive
Input, Serial Interface clock or
SPI Slave Master Out Slave In
Input
26
27
DIO17
COMP1M
PWM4
I2C DATA
SPISIMO
CMOS DIO17, Comparator Negative
Input, Serial Interface Data or SPI
Slave Master In Slave Out Output
VREF/ADC2
3.3V
Analogue peripheral reference
voltage or ADC input 2
* These two pins are not connected for JN5168-001-M05 & JN5168-001-M06 modules.
3.2. Pin Descriptions
All pins behave as described in the JN-DS-JN5168 Wireless Microcontroller Datasheet [2], with the exception of the
following:
3.2.1 Power Supplies
A single power supply pin, VDD is provided.
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JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
4. Electrical Characteristics
In most cases, the Electrical Characteristics are the same for both module and chip. They are described in detail in
the chip datasheet. Where there are differences, they are detailed below.
4.1. Maximum Ratings
Exceeding these conditions will result in damage to the device.
Parameter
Device supply voltage VDD
Min
Max
-0.3V
3.6V
All Pins
-0.3V
-40ºC
VDD + 0.3V
150ºC
Storage temperature
4.2. Operating Conditions
Supply
Min
Max
VDD
2.0V
3.6V
Ambient temperature range
-40ºC
85ºC
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
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Appendix A Additional Information
A.1 Outline Drawing
16mm
30.0mm
1.27
mm
2.54
mm
3.30
mm
2.54
mm
Thickness: 3.5mm
Figure 2: JN5168-001-M00 Outline Drawing
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JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
16mm
9.72mm
2.59
mm
1.27
mm
21mm
2.54
mm
3.30
mm
2.54
mm
Thickness: 3.5mm
Figure 3: JN5168-001-M03 Outline Drawing
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
11
16mm
8.0mm
2.81mm
30mm
1.27
mm
2.54
mm
.
2.54
mm
3.30
mm
Thickness: 3.5mm
Figure 4: JN5168-001-M05 and JN5168-001-M06 Outline Drawing
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JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
A.2 Module PCB Footprint
All dimensions are in mm.
16.00
1.27
Ø1
2.54
1.5
1
3.30
2.54
Note: All modules have the same footprint
Figure 5: Module PCB footprint
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
13
A.3 Optimal PCB placement of the JN5168-001-M00 Module
The JN5168-001-M00 module features an optimised, low cost, integrated, inverted F, printed PCB antenna. The
antenna has a vertically polarised near omnidirectional radiation pattern and up to 1.6 dBi of peak gain. The PCB
design has been elongated in order to increase the ground plane area which increases the antenna efficiency. This
allows stand alone operation without any additional ground plane however care must be taken when mounting this
module onto another PCB. The area around the antenna must be kept clear of conductors or other metal objects for
an absolute minimum of 20 mm. This is true for all layers of the PCB and not just the top layer. Any conductive
objects close to the antenna could severely disrupt the antenna pattern resulting in deep nulls and high directivity in
some directions.
The diagrams below show various possible scenarios. The top 3 scenarios are correct; groundplane may be placed
beneath JN5168-001-M00 module as long as it does not protrude beyond the edge of the top layer ground plane on
the module PCB.
The bottom 3 scenarios are incorrect; the left hand side example because there is groundplane underneath the
antenna, the middle example because there is insufficient clearance around the antenna (it is best to have no
conductors anywhere near the antenna), finally the right hand example has a battery’s metal casing in the
recommended keep out area.
Figure 6: PCB placement of the JN5168-001-M00 Module
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© NXP Laboratories UK 2013
A.4 JN5168-001-M00 Antenna Radiation Pattern
Figure 7, Figure 8 & Figure 9 are simulated 3D radiation plots of the JN5168-001-M00. They are provided here to
help the user orientate the module in end equipment in an optimal way. These visualisations are an accurate
representation of the antenna radiation pattern in the 3D space.
The 2D XZ plots for each channel are shown in
JN5168-001-M00 Radiation Plots @ 3 meters (XZ Orientation)
CH11 CH18 CH26
dBuV
104
94
84
74
64
54
44
34
24
14
4
2
3
1
14
24
34
44
54
64
74
84
94
104
Mkr Trace
X-Axis
Value
CH11
CH18
CH26
40.0 deg
40.0 deg
40.0 deg
101.04 dBuV
100.67 dBuV
101.26 dBuV
1
2
3
Figure 10. These are actual measurements in an anechoic chamber with the JN5168-001-M00 mounted on a
DR1174 carrier board from the JN516x-EK001 Evaluation kit. The device under test and the antenna height was 1m
and the values are in dBuV/m at a distance of 3m.
Figure 11 is a plot of the peak field strengths for a JN5168-001-M00, JN5148-001-M00 and JN5168-001-M03. The
M03 is used with a λ/2 vertical antenna. Figure 11 shows that the new integrated antenna is 1.5-3dB better than the
JN5148-001-M00 and is within 1.5 dB of a JN5168-001-M03 λ/2 vertical.
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
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Figure 7: 3D radiation plot JN5168-001-M00 XY Orientation (simulation)
Figure 8: 3D radiation plot JN5168-001-M00 XZ Orientation (simulation)
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© NXP Laboratories UK 2013
Figure 9: 3D radiation plot JN5168-001-M00 YZ Orientation (simulation)
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
17
JN5168-001-M00 Radiation Plots @ 3 meters (XZ Orientation)
CH11 CH18 CH26
dBuV
104
94
84
74
64
54
44
34
24
14
4
2
3
1
14
24
34
44
54
64
74
84
94
104
Mkr Trace
X-Axis
Value
CH11
CH18
CH26
40.0 deg
40.0 deg
40.0 deg
101.04 dBuV
100.67 dBuV
101.26 dBuV
1
2
3
Figure 10: Actual radiation plot of JN5168-001-M00 Mounted on a carrier PCB – XZ orientation
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© NXP Laboratories UK 2013
Module Peak Field Strengths
104.0
103.5
103.0
102.5
102.0
101.5
101.0
100.5
100.0
99.5
JN5168-001-M03 with
vertical
JN5168-001-M00
99.0
JN5148-001-M00
98.5
98.0
11
18
26
Channel
Figure 11: Peak Field Strengths for various modules optimised for height and azimuth
A.5 Manufacturing
A.5.1 Reflow Profile
For reflow soldering, it is recommended to follow the reflow profile in figure 6 as a guide, as well as the paste
manufacturer’s guidelines on peak flow temperature, soak times, time above liquid and ramp rates.
Temperature
25~160 ºC
90~130
160~190 ºC
30~60
> 220º C
20~50
230~Pk.
10~15
Pk. Temp
(235ºC)
Target Time (s)
150~270
Figure 12: Recommended solder reflow profile
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
19
A.5.2 Soldering Paste and Cleaning
NXP does not recommend use of a solder paste that requires the module and PCB assembly to be cleaned (rinsed in
water) for the following reasons:
Solder flux residues and water can be trapped by the PCB, can or components and result in short circuits.
The module label could be damaged or removed.
NXP recommends use of a 'no clean' solder paste for all its module products.
A.6 Tape and Reel Information
A.6.1 Tape Orientation and dimensions
All dimensions are in mm.
Module type
A
B
W
F
E
P0
P1
P2
T
Cover Tape
width (W)
JN5168-001-M00
JN5168-001-M03
JN5168-001-M05
JN5168-001-M06
Tolerance
16.6
16.6
16.6
16.6
±0.1
30.6
21.6
30.6
30.6
±0.1
44
20.2
20.2
20.2
20.2
1.75
1.75
1.75
1.75
4.0
4.0
4.0
4.0
±0.1
24.0
24.0
24.0
24.0
±0.1
2.0
2.0
2.0
2.0
3.7
3.7
3.7
3.7
44.0
44.0
44.0
44.0
±0.3
44
44
44
±0.3
±0.15 +0.1
±0.15 ±0.1
20
JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
A.6.2 Reel Dimensions
All dimensions are in mm.
Module
A
B
N
W1
W2 (Max)
50.4
JN5168-001-MYY
330 ±2.0
2.0±0.5
181.3±0.2
45.0 +1.4/-0.6
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
21
A.6.3 Cover tape details
Thickness (T)
0.06 ± 0.005mm
37.5 ± 0.1mm
105 to 1011 Ohms/sq
Non-conductive
Polyester
Width (W)
Surface resistivity (component side)
Surface resistivity (component side)
Backing type:
Adhesive type:
PSA
Sealing:
Room ambient
A.6.4 Leader and Trailer
Vacant
Vacant
Quantity/400PCS
>500mm
>500 MM
A.7 Related Documents
[1] IEEE Std 802.15.4-2003 IEEE Standard for Information Technology – Part 15.4 Wireless Medium Access Control
(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
[2] JN-DS-JN5168 Wireless Microcontroller Datasheet
22
JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
A.8 Ordering Information
Ordering Code Format:
JN5168-001-MYY
Module Type (YY)
00
03
05
06
Standard Power, Integral antenna
Standard Power, uFl connector
Medium Power, uFL connector
High Power, uFl connector
Where this Data Sheet is denoted as “Advanced” or “Preliminary”, devices will be either Engineering Samples or
Prototypes.
Part Number
Description
JN5168-001-M00
JN5168-001-M03
JN5168-001-M05
JN5168-001-M06
Shipped in tape mounted 400 piece reel
Line Content Format
Options
Sample
1
NXP Logo B&W outline logo
1
2D
Coding
2D Matrix
Symbology, square
data matrix ECC-200
with 0.5mm cell size
x is module type, 0,
3, 5 or 6
JN5168-001-M00
2
3
4
Part ID
JN5168-001-M0x
NNNNN
Serial No. NNNNN
Serial number from
test
ZSDYWW
Z
S
D
SSMC
FCC ID:TYOJN5168M0
APK
RoHs
IC:7438A-CYO5168M0
Compliant
Y
Year
WW
Week
5
6
FCC ID
IC ID
FCCID:TYOJN5168Mx x is module type
0,3,5 or 6
IC:7438A-
x is module type
0,3,5 or 6
CYO5168Mx
Figure 13: Example module labelling
Note :- The 2-D barcode in line 1 is used only for production purposes.
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
23
A.9 Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate this equipment.
WARNING!
FCC Radiation Exposure Statement:
This portable equipment with its antenna complies with FCC’s RF radiation exposure limits set forth for an
uncontrolled environment. To maintain compliance follow the instructions below;
1. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
2. Avoid direct contact to the antenna, or keep it to a minimum while using this equipment.
This transmitter module is authorized to be used in other devices only by OEM integrators under the
following condition:
The transmitter module must not be co-located with any other antenna or transmitter.
As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is
still responsible for testing their end product for any additional compliance requirements required with this module
installed (for example, digital device emissions, PC peripheral requirements, etc.).
This applies to the JN5168-001-M00, JN5168-001-M03 and JN5168-001-M05 devices, the JN5168-001-M06 is a
mobile device (see section A.9.2)
24
JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
A.9.1 Antennas approved by FCC for use with JN5168 modules
Brand
Model Number
ANT-2.4-CW-RCT-RP
2010B6090-01
HG2402RD-RSF
E-0005-AC
Description
Gain (dBi) Connector type
1
2
3
4
5
6
7
8
9
Antenna Factor
Vertical - knuckle antenna
Vertical - knuckle antenna
Vertical - knuckle antenna
Vertical- flying lead
2.2
2.2
2.2
2
RP-SMA
RP-SMA
RP-SMA
RP-SMA
RP-SMA
uFL
Antennova
Hyperlink Technology
Aveslink Technology, Inc
Aveslink Technology, Inc
Aveslink Technology, Inc
Aveslink Technology, Inc
Aveslink Technology, Inc
Aveslink Technology, Inc
E-2411-GC
Vertical - swivel
2
E-2410-CA
Vertical - bulkhead- flying lead
Vertical - swivel
2
E-2410-GC
2
RP-SMA
uFL
E-2820-CA
Vertical - bulkhead- flying lead
Vertical - swivel
2
E-2820-GC
2
RP-SMA
RP-SMA
uFL
10 Embedded Antenna Design FBKR35068-RS-KR
Vertical - knuckle antenna
Vertical - knuckle-flying lead
Vertical - knuckle-flying lead
Vertical - knuckle-flying lead
Vertical - right angle
2
11
12
13
Nearson
S131CL-L-PX-2450S
WRR2400-IP04
WRR2400-RPSMA
E-6170-DA
2
Laird Technologies
Laird Technologies
1.5
1.3
1
uFL
RP-SMA
uFL
14 Aveslink Technology, Inc
15 Laird Technologies
WCR2400-SMRP
Vertical - knuckle antenna
1
RP-SMA
This device has been designed to operate with the antennas listed above, and having a maximum gain of 2.2 dBi.
Alternative vertical antennas may be used provided that the gain does not exceed 2.2 dBi. Antennas having a gain
greater than 2.2 dBi are strictly prohibited for use with this device.
The required antenna impedance is 50 ohms.
A.9.2 High Power Module usage limitation
The high power module variants are classified as ‘mobile’ device pursuant with FCC § 2.1091 and must not be used
at a distance of < 20 cm (8”) from any people. This applies to the JN5168-001-M06 module type (TYOJN5168M6).
IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location with
another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the
final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate FCC authorization.
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this
RF module in the user manual of the end product.
The user manual for the end product must include the following information in a prominent location;
“To comply with FCC’s RF radiation exposure requirements, the antenna(s) used for this transmitter must not be co-
located or operating in conjunction with any other antenna or transmitter.”
A.9.3 FCC End Product Labelling
The final ‘end product’ should be labelled in a visible area with the following:
“Contains TX FCC ID: TYOJN5168M0, TYOJN5168M3, TYOJN5168M5 or TYOJN5168M6” to reflect the version of
the module being used inside the product.
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
25
A.10 Industry Canada Statement
This device complies with Industry Canada licence-
exempt RSS standard(s). Operation is subject
to the following two conditions: (1) this device may
not cause interference, and (2) this device must
accept any interference, including interference that
may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie
Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux
deux conditions suivantes : (1) l'appareil ne
doit pas produire de brouillage, et (2) l'utilisateur de
l'appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.
To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the
equivalent isotropic radiated power (e.i.r.p.) is not more than that permitted for successful communication.
These modules have been designed to operate with antennas having a maximum gain of 2.2 dBi. Antennas having a
gain greater than 2.2 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms.
As long as the above condition is met, further transmitter testing will not be required. However, the OEM integrator is
still responsible for testing their end-product for any additional compliance requirements required with this module
installed (for example, digital device emissions, PC peripheral requirements, etc).
A.10.1 Industry Canada End Product Labelling
For Industry Canada purposes the following should be used.
“Contains Industry Canada ID IC: 7438A-CYO5168M0, IC: 7438A-CYO5168M3, IC: 7438A-CYO5168M5 or IC:
7438A-CYO5168M6” to reflect the version of the module being used inside the product.
A.11 European R & TTE Directive 1999/5/EC Statement
All modules listed in this datasheet with the exception of the JN5168-001-M06 are compliant with ETSI EN 300 328
V1.7.1 (2006-10), EMC, EN 301 489-17 v2.1.1 (2009-02) and the Basic Safety Assessment (BSA) EN 60950-1:2006
(2006-06) and are subject to a Notified Body Opinion.
The modules are approved for use with the antennas listed in the following table. The JN5168-001-M06 module is not
approved for use in Europe, instead use the JN5168-001-M05 which produces the maximum permitted power.
Alternative vertical antennas may be used provided that the gain does not exceed 2.2 dBi.
Brand
Model Number
Description
Gain (dBi) Connector type
1
2
3
4
5
6
7
8
9
Antenna Factor
ANT-2.4-CW-RCT-SMA Vertical - knuckle antenna
2.2
2.2
2.2
2
SMA
RP-SMA
RP-SMA
RP-SMA
RP-SMA
uFL
Antennova
B6090
HG2402RD-RSF
E-0005-AC
E-2411-GC
E-2410-CA
E-2410-GC
E-2820-CA
E-2820-GC
Vertical - knuckle antenna
Vertical - knuckle antenna
Vertical- flying lead
Hyperlink Technology
Aveslink Technology, Inc
Aveslink Technology, Inc
Aveslink Technology, Inc
Aveslink Technology, Inc
Aveslink Technology, Inc
Aveslink Technology, Inc
Vertical - swivel
2
Vertical - bulkhead- flying lead
Vertical - swivel
2
2
RP-SMA
uFL
Vertical - bulkhead- flying lead
Vertical - swivel
2
2
RP-SMA
RP-SMA
uFL
10 Embedded Antenna Design FBKR35068-RS-KR
Vertical - knuckle antenna
Vertical - knuckle-flying lead
Vertical - knuckle-flying lead
Vertical - knuckle-flying lead
Vertical - right angle
2
11
12
13
Nearson
S131CL-L-PX-2450S
WRR2400-IP04
WRR2400-RPSMA
E-6170-DA
2
Laird Technologies
Laird Technologies
1.5
1.3
1
uFL
RP-SMA
uFL
14 Aveslink Technology, Inc
15
Laird Technologies
WCR2400-SMRP
Vertical - knuckle antenna
1
RP-SMA
26
JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
A.12 RoHS Compliance
JN5168-001-Myy modules meet the requirements of Directive 2002/95/EC of the European Parliament and of the
Council on the Restriction of Hazardous Substance (RoHS) and of the Chinese RoHS requirements SJ/T11363-2006
which came into force on 1st March 2007.
Status Information
The status of this Data Sheet is Production.
NXP products progress according to the following format:
Advanced
The Data Sheet shows the specification of a product in planning or in development.
The functionality and electrical performance specifications are target values and may be used as a guide to the final
specification.
NXP reserves the right to make changes to the product specification at anytime without notice.
Preliminary
The Data Sheet shows the specification of a product that is commercially available, but is not yet fully qualified.
The functionality of the product is final. The electrical performance specifications are target values and may be used
as a guide to the final specification. NXP reserves the right to make changes to the product specification at anytime
without notice.
Production
This is the production Data Sheet for the product.
All functional and electrical performance specifications, where included, including min and max values are derived
from detailed product characterization.
This Data Sheet supersedes all previous document versions.
NXP reserves the right to make changes to the product specification at anytime.
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
27
Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation -
lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion
and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine
whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the
products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.
Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause
permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above
those given in the Operating Conditions section or the Electrical Characteristics sections of this document is not warranted. Constant or repeated
exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.
AEC unqualified products — This product has not been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101
and should not be used in automotive applications, including but not limited to applications where failure or malfunction of an NXP Semiconductors
product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no
liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the
customer’s own risk.
Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the
Product data sheet
All products are sold subject to NXP Semiconductors’ terms and conditions of sale, supplied at the time of order acknowledgment and published at
http://www.nxp.com/profile/terms.
Trademarks
All trademarks are the property of their respective owners.
“JenNet” and “JenNet-IP” are trademarks of NXP B.V..
Version Control
Version
1.0
Notes
Initial release
1.1
Additional clarification of RF exposure conditions added to FCC Section A8 and minor corrections made
Revision of key parameters. Module footprint dimension updated
Tape and reel information added
1.2
1.3
1.4
Updated pin configuration and assignments. Module labelling and reel dimensions updated.
28
JN-DS-JN5168-001-Myy 1v4
© NXP Laboratories UK 2013
Contact Details
NXP Laboratories UK Ltd
Furnival Street
Sheffield
S1 4QT
United Kingdom
Tel: +44 (0)114 281 2655
Fax: +44 (0) 114 281 2951
For the contact details of your local NXP office or distributor, refer to the NXP web site:
www.nxp.com
© NXP Laboratories UK 2013
JN-DS-JN5168-001-Myy 1v4
29
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