IP4253CZ12 [NXP]
Integrated 4-, 6- and 8-channel passive filter network with ESD protection to IEC 61000-4-2, level 4; 集成的4,6和8通道无源滤波器网络与ESD保护符合IEC 61000-4-2 4级
| 型号： | IP4253CZ12 |
| 厂家： | 
NXP |
| 描述： | Integrated 4-, 6- and 8-channel passive filter network with ESD protection to IEC 61000-4-2, level 4 |
| 文件： | 总10页 (文件大小：60K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IP4253CZ8/CZ12/CZ16;
IP4254CZ8/CZ12/CZ16
Integrated 4-, 6- and 8-channel passive filter network with
ESD protection to IEC 61000-4-2, level 4
Rev. 02 — 8 November 2007
Product data sheet
1. Product profile
1.1 General description
The IP4253CZ8/CZ12/CZ16; IP4254CZ8/CZ12/CZ16 family consists of 4-, 6- and
8-channel RC low-pass filter arrays which are designed to provide filtering of undesired
RF signals on the I/O ports of portable communication or computing devices. In addition,
the IP4253CZ8/CZ12/CZ16; IP4254CZ8/CZ12/CZ16 family incorporates diodes to
provide protection to downstream components from ElectroStatic Discharge (ESD)
voltages as high as ±30 kV.
The IP4253CZ8/CZ12/CZ16; IP4254CZ8/CZ12/CZ16 family is fabricated using monolithic
silicon technology and integrates up to 8 resistors and 16 diodes in a 0.4 mm pitch 8-, 12-
or 16-pin MicroPak (compatible with QFN) lead-free plastic package with a height of
0.5 mm only.
1.2 Features
I Pb-free and dark green compliant
I 4-, 6- and 8-channel integrated π-type RC filter network
I IP4253CZ8/CZ12/CZ16: 200 Ω channel series resistance, 30 pF (at 2.5 V DC)
channel capacitance
I IP4254CZ8/CZ12/CZ16: 100 Ω channel series resistance, 30 pF (at 2.5 V DC)
channel capacitance
I ESD protection to ±30 kV contact discharge according to IEC 61000-4-2 standard far
exceeding level 4
I MicroPak (QFN compatible) plastic package with 0.4 mm pitch
1.3 Applications
I General purpose ElectroMagnetic Interference (EMI) and Radio-Frequency
Interference (RFI) filtering and downstream ESD protection for:
N Cellular and Personal Communication System (PCS) mobile handsets
N Cordless telephones
N Wireless data (WAN/LAN) systems
N PDAs
IP425xCZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive filter network
2. Pinning information
Table 1.
Pin
Pinning IP4253CZx and IP4254CZx
Description
Simplified outline
Symbol
CZ8
1 and 8
2 and 7
3 and 6
4 and 5
ground pad
filter channel 1
filter channel 2
filter channel 3
filter channel 4
ground
R
s(ch)
8
5
1, 2, 3, 4
5, 6, 7, 8
001aaf978
C
ch
C
ch
2
2
1
4
Transparent
top view
GND
CZ12
1 and 12
2 and 11
3 and 10
4 and 9
filter channel 1
filter channel 2
filter channel 3
filter channel 4
filter channel 5
filter channel 6
ground
R
12
1
7
6
s(ch)
1, 2, 3,
4, 5, 6
7, 8, 9,
10, 11, 12
C
ch
C
2
ch
2
Transparent
top view
5 and 8
GND
001aaf979
6 and 7
ground pad
CZ16
1 and 16
2 and 15
3 and 14
4 and 13
5 and 12
6 and 11
7 and 10
8 and 9
filter channel 1
filter channel 2
filter channel 3
filter channel 4
filter channel 5
filter channel 6
filter channel 7
filter channel 8
ground
R
16
1
9
8
s(ch)
1, 2, 3, 4,
5, 6, 7, 8
9, 10, 11, 12,
13, 14, 15, 16
C
ch
C
2
ch
2
Transparent
top view
GND
001aaf980
ground pad
IP4253_54_CZ8_CZ12_CZ16_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 8 November 2007
2 of 10
IP425xCZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive filter network
3. Ordering information
Table 2.
Ordering information
Type number Package
Name
Description
Version
IP4253CZ8-4 HXSON8
plastic thermal enhanced extremely thin small outline package; no leads;
8 terminals; body 1.35 × 1.7 × 0.5 mm
SOT983-1
SOT984-1
SOT985-1
SOT983-1
SOT984-1
SOT985-1
IP4253CZ12-6 HXSON12 plastic thermal enhanced extremely thin small outline package; no leads;
12 terminals; body 1.35 × 2.5 × 0.5 mm
IP4253CZ16-8 HXSON16 plastic thermal enhanced extremely thin small outline package; no leads;
16 terminals; body 1.35 × 3.3 × 0.5 mm
IP4254CZ8-4 HXSON8
plastic thermal enhanced extremely thin small outline package; no leads;
8 terminals; body 1.35 × 1.7 × 0.5 mm
IP4254CZ12-6 HXSON12 plastic thermal enhanced extremely thin small outline package; no leads;
12 terminals; body 1.35 × 2.5 × 0.5 mm
IP4254CZ16-8 HXSON16 plastic thermal enhanced extremely thin small outline package; no leads;
16 terminals; body 1.35 × 3.3 × 0.5 mm
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
VCC
Vesd
supply voltage
−0.5
+5.6
V
electrostatic discharge
voltage
all pins to ground
contact discharge
air discharge
[1]
[1]
−30
−30
+30
+30
kV
kV
IEC 61000-4-2, Level 4;
all pins to ground
contact discharge
air discharge
−8
−15
-
+8
kV
+15
60
kV
Pch
channel power dissipation Tamb = 85 °C
mW
mW
°C
Ptot
total power dissipation
storage temperature
ambient temperature
Tamb = 85 °C
-
200
+150
+85
Tstg
Tamb
−55
−40
°C
[1] Device withstands ≥ 1000 discharges with ±30 kV using the IEC 61000-4-2 model without degradation.
5. Thermal characteristics
Table 4.
Symbol Parameter
Rth(j-pcb) thermal resistance from junction to 2 layer printed-circuit
printed-circuit board board
Thermal characteristics
Conditions
Typ
120[1]
Unit
K/W
[1] Depends on layout details.
IP4253_54_CZ8_CZ12_CZ16_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 8 November 2007
3 of 10
IP425xCZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive filter network
6. Characteristics
Table 5.
Channel resistance
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions
channel series resistance IP4253CZ8/CZ12/CZ16
Min
160
80
Typ
Max Unit
Rs(ch)
-
-
240
120
Ω
Ω
IP4254CZ8/CZ12/CZ16
Table 6.
Channel characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max Unit
Cch
channel capacitance
for the total channel;
f = 100 kHz
Vbias(DC) = 2.5 V
-
30
45
-
-
pF
pF
µA
V
[1]
Vbias(DC) = 0 V
-
-
ILR
VBR
VF
reverse leakage current
breakdown voltage
forward voltage
per channel; VI = 3.5 V
positive clamp; II = 1 mA
negative clamp; IF = 1 mA
-
0.1
9
5.8
0.4
-
-
1.5
V
[1] Guaranteed by design.
Table 7.
Frequency characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
IP4253CZ8/CZ12/CZ16
Conditions
Min
Typ
Max Unit
αil
insertion loss
Rsource = 50 Ω; RL = 50 Ω
800 MHz < f < 3 GHz
f = 1 GHz
-
25
-
-
-
-
dB
dB
dB
30
-
αct
crosstalk attenuation
Rsource = 50 Ω; RL = 50 Ω;
25
800 MHz < f < 3 GHz
IP4254CZ8/CZ12/CZ16
αil
insertion loss
Rsource = 50 Ω; RL = 50 Ω
800 MHz < f < 3 GHz
f = 1 GHz
-
20
-
-
-
-
dB
dB
dB
25
-
αct
crosstalk attenuation
Rsource = 50 Ω; RL = 50 Ω;
21
800 MHz < f < 3 GHz
IP4253_54_CZ8_CZ12_CZ16_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 8 November 2007
4 of 10
IP425xCZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive filter network
7. Package outline
HXSON8: plastic thermal enhanced extremely thin small outline package; no leads;
8 terminals; body 1.35 x 1.7 x 0.5 mm
SOT983-1
X
D
B
A
E
A
A
1
terminal 1
index area
detail X
e
1
1/2 e
b
C
terminal 1
index area
M
v
C A
C
B
e
y
y
M
w
C
1
1
4
L
1
L
E
h
8
5
D
h
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
1
b
D
D
h
E
E
e
e
1
L
L
v
w
y
y
1
h
1
max
0.05 0.25 1.75
0.00 0.15 1.65
1.5
1.3
1.4
1.3
0.5
0.3
0.35 0.09
0.15
mm
0.5
0.4
1.2
0.1
0.05 0.05
0.1
0.00
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
07-01-04
07-01-12
SOT983-1
- - -
- - -
Fig 1. Package outline SOT983-1 (HXSON8)
IP4253_54_CZ8_CZ12_CZ16_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 8 November 2007
5 of 10
IP425xCZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive filter network
HXSON12: plastic thermal enhanced extremely thin small outline package; no leads;
12 terminals; body 1.35 x 2.5 x 0.5 mm
SOT984-1
X
D
B
A
E
A
A
1
terminal 1
index area
detail X
e
1
C
terminal 1
index area
M
v
C A
C
B
b
e
1/2 e
y
y
M
w
C
1
1
6
L
1
L
E
h
12
7
D
h
0
0.5
scale
1 mm
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
1
b
D
D
h
E
E
e
e
1
L
L
v
w
y
y
1
h
1
max
0.05 0.25 2.55
0.00 0.15 2.45
2.3
2.1
1.4
1.3
0.5
0.3
0.35 0.09
0.15 0.00
mm
0.5
0.4
2
0.1
0.05 0.05
0.1
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
07-01-04
07-01-12
SOT984-1
- - -
- - -
Fig 2. Package outline SOT984-1 (HXSON12)
IP4253_54_CZ8_CZ12_CZ16_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 8 November 2007
6 of 10
IP425xCZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive filter network
HXSON16: plastic thermal enhanced extremely thin small outline package; no leads;
16 terminals; body 1.35 x 3.3 x 0.5 mm
SOT985-1
X
D
B
A
E
A
A
1
terminal 1
index area
detail X
e
1
C
terminal 1
index area
M
v
C A
C
B
b
e
1/2 e
y
y
M
w
C
1
1
8
L
1
L
E
h
16
9
D
h
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
1
b
D
D
h
E
E
e
e
1
L
L
v
w
y
y
1
h
1
max
0.05 0.25 3.35
0.00 0.15 3.25
3.1
2.9
1.4
1.3
0.5
0.3
0.35 0.09
0.15 0.00
mm
0.5
0.4
2.8
0.1
0.05 0.05
0.1
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
07-01-04
07-01-12
SOT985-1
- - -
- - -
Fig 3. Package outline SOT985-1 (HXSON16)
IP4253_54_CZ8_CZ12_CZ16_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 8 November 2007
7 of 10
IP425xCZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive filter network
8. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change Supersedes
notice
IP4253_54_CZ8_CZ12_CZ16_2 20071108
Product data sheet
Objective data sheet
-
IP4253_54_CZ8_CZ12_CZ16_1
Modifications:
• All <tbd> values filled in.
IP4253_54_CZ8_CZ12_CZ16_1 20070209
-
-
IP4253_54_CZ8_CZ12_CZ16_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 8 November 2007
8 of 10
IP425xCZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive filter network
9. Legal information
9.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
9.2
Definitions
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
9.3
Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
9.4
Trademarks
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
10. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
IP4253_54_CZ8_CZ12_CZ16_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 8 November 2007
9 of 10
IP425xCZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive filter network
11. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
3
4
5
6
7
8
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8
9
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
9.1
9.2
9.3
9.4
10
11
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 November 2007
Document identifier: IP4253_54_CZ8_CZ12_CZ16_2
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