IP4059CX5/LF/T3 [NXP]
SPECIALTY CONSUMER CIRCUIT, PBGA5;
| 型号： | IP4059CX5/LF/T3 |
| 厂家： | 
NXP |
| 描述： | SPECIALTY CONSUMER CIRCUIT, PBGA5 商用集成电路 |
| 文件： | 总9页 (文件大小：88K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IP4059CX5
Integrated USB 2.0 and USB OTG ESD protection to
IEC 61000-4-2 level 4
Rev. 1 — 15 September 2011
Product data sheet
1. Product profile
1.1 General description
The IP4059CX5 is designed to protect several I/O pins of computer interfaces, such as
Universal Serial Bus (USB) 2.0, USB On-The-Go (OTG), Ethernet, Digital Visual Interface
(DVI) etc. The IP4059CX5 incorporates ultra-low capacity diodes to provide protection to
downstream components from ElectroStatic Discharge (ESD) voltages as high as 8 kV
contact discharge according to the IEC 61000-4-2 model.
The device is fabricated using monolithic silicon technology and integrates four ultra-low
capacity ESD protection diodes in a 0.5 mm pitch Wafer-Level Chip-Scale Package
(WLCSP) measuring 0.96 mm by 1.34 mm only.
1.2 Features and benefits
Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant)
4 ultra-low input capacity rail-to-rail ESD protection diodes with Cd = 3.0 pF
Integrated ESD protection withstanding 8 kV contact discharge and 15 kV air
discharge
WLCSP with 0.5 mm pitch
1.3 Applications
General purpose ElectroMagnetic Interference (EMI) and Radio Frequency Interference
(RFI) filtering and downstream ESD protection for USB ports inside:
Cellular and Personal Communication System (PCS) mobile handsets
PC peripherals and PCs
Cordless telephones
Wireless data and Local Area Network (LAN) systems
Personal Digital Assistants (PDAs)
Digital cameras
IP4059CX5
NXP Semiconductors
Integrated USB 2.0 and USB OTG ESD protection
2. Pinning information
Table 1.
Pinning
Example of pin configuration for USB 2.0; other combinations for ID, D+ and D in relation to pin A1,
pin C1 and pin C2 are possible.
Pin Symbol Description
Simplified outline
Graphic symbol
A1 D
C1 D+
B1 GND
A2 VBUS
C2 ID
USB 2.0 differential pair
A2
bump A1
index area
2
1
ground
A1
C1
C2
power
A
B
C
USB OTG ID pin
B1
B1
008aaa271
008aaa262
transparent top view,
solder balls facing down
3. Ordering information
Table 2.
Ordering information
Type number Package
Name
Description
Version
IP4059CX5/LF WLCSP5 wafer level chip-size package; 5 bumps (2-1-2)
IP4059CX5/LF
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCC
Parameter
Conditions
Min Max
Unit
V
supply voltage
input voltage
0
5
VI
0.5 VCC + 0.5
15 +15
V
[1]
[1]
VESD
electrostatic discharge voltage contact discharge
air discharge
kV
kV
15 +15
IEC 61000-4-2 level 4
contact discharge
8
+8
kV
kV
C
C
C
air discharge
15 +15
Tstg
storage temperature
55 +150
Treflow(peak) peak reflow temperature
Tamb ambient temperature
10 s maximum
-
260
40 +85
[1] Device is qualified with > 200 pulses of 15 kV contact discharges each, according to the IEC 61000-4-2
model and far exceeds the specified level 4 (8 kV contact discharge).
IP4059CX5
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 15 September 2011
2 of 9
IP4059CX5
NXP Semiconductors
Integrated USB 2.0 and USB OTG ESD protection
5. Characteristics
Table 4.
Electrical characteristics
Tamb = 25 C; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
[1]
Cd
diode capacitance
pins A1, C1 and C2;
Vbias(DC) = 0 V;
-
3.0
4.0
pF
f = 1 MHz; VA2 = 0 V
ILR
VBR
VF
reverse leakage current VI = 3.0 V
-
-
100
nA
V
breakdown voltage
forward voltage
Itest = 1 mA
6
-
-
9
-
0.7
V
[1] Guaranteed by design.
IP4059CX5
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 15 September 2011
3 of 9
IP4059CX5
NXP Semiconductors
Integrated USB 2.0 and USB OTG ESD protection
6. Package outline
WLCSP5: wafer level chip-size package; 5 bumps (2-1-2)
bump A1
index area
D
A
2
E
A
A
1
detail X
e
1/2 e
b
C
B
A
e
1
B1
e
2
2
1
X
European
projection
wlcsp5_2-1-2_r_po
Fig 1. Package outline IP4059CX5/LF (WLCSP5)
Table 5.
Dimensions for Figure 1
Min
Symbol
Typ
Max
0.69
0.26
0.43
0.37
1.01
1.39
-
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
A
0.61
0.22
0.39
0.27
0.91
1.29
-
0.65
0.24
0.41
0.32
0.96
1.34
0.5
A1
A2
b
D
E
e
e1
e2
-
0.435
0.87
-
-
-
IP4059CX5
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 15 September 2011
4 of 9
IP4059CX5
NXP Semiconductors
Integrated USB 2.0 and USB OTG ESD protection
7. Design and assembly recommendations
7.1 PCB design guidelines
For optimum performance it is recommended to use a Non-Solder Mask Defined (NSMD),
also known as a copper-defined design, incorporating laser-drilled micro-vias connecting
the ground pads to a buried ground-plane layer. This results in the lowest possible ground
inductance and provides the best high frequency and ESD performance. For this case,
refer to Table 6 for the recommended PCB design parameters.
Table 6.
Recommended PCB design parameters
Parameter
Value or specification
275 m
PCB pad diameter
Micro-via diameter
Solder mask aperture diameter
Copper thickness
Copper finish
100 m (0.004 inch)
375 m
20 m to 40 m
AuNi
PCB material
FR4
7.2 PCB assembly guidelines for Pb-free soldering
Table 7.
Assembly recommendations
Parameter
Value or specification
330 m
Solder screen aperture diameter
Solder screen thickness
Solder paste: Pb-free
Solder to flux ratio
100 m (0.004 inch)
SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %)
50 : 50
Solder reflow profile
see Figure 2
T
(°C)
reflow(peak)
250
T
230
217
cooling rate
preheat
t (s)
t
t
2
1
t
t
3
4
t
5
001aai943
The device is capable of withstanding at least three reflows with this profile.
Fig 2. Pb-free solder reflow profile
IP4059CX5
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 15 September 2011
5 of 9
IP4059CX5
NXP Semiconductors
Integrated USB 2.0 and USB OTG ESD protection
Table 8.
Symbol
Characteristics
Parameter
Conditions
Min Typ Max Unit
Treflow(peak) peak reflow temperature
230
60
-
-
-
-
-
-
-
-
-
260 C
t1
time 1
soak time
180
30
s
t2
time 2
time during T 250 C
time during T 230 C
time during T > 217 C
s
t3
time 3
10
30
-
50
s
t4
time 4
150
540
6
s
t5
time 5
s
dT/dt
rate of change of temperature
cooling rate
preheat
-
C/s
2.5
4.0 C/s
8. Abbreviations
Table 9.
Abbreviations
Acronym
DVI
Description
Digital Visual Interface
ElectroMagnetic Interference
ElectroStatic Discharge
Flame Retard 4
EMI
ESD
FR4
IEC
International Electrotechnical Commission
Input/Output
I/O
LAN
Local Area Network
NSMD
OTG
PCB
PCS
PDA
RFI
Non-Solder Mask Defined
On-The-Go
Printed-Circuit Board
Personal Communication System
Personal Digital Assistant
Radio Frequency Interference
Restriction of Hazardous Substances
Universal Serial Bus
RoHS
USB
WLCSP
Wafer-Level Chip-Scale Package
9. Revision history
Table 10. Revision history
Document ID
Release date
20110915
Data sheet status
Change notice
Supersedes
IP4059CX5 v.1
Product data sheet
-
-
IP4059CX5
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 15 September 2011
6 of 9
IP4059CX5
NXP Semiconductors
Integrated USB 2.0 and USB OTG ESD protection
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
10.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
10.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
IP4059CX5
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 15 September 2011
7 of 9
IP4059CX5
NXP Semiconductors
Integrated USB 2.0 and USB OTG ESD protection
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
IP4059CX5
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 15 September 2011
8 of 9
IP4059CX5
NXP Semiconductors
Integrated USB 2.0 and USB OTG ESD protection
12. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
3
4
5
6
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
7
7.1
7.2
Design and assembly recommendations . . . . 5
PCB design guidelines . . . . . . . . . . . . . . . . . . . 5
PCB assembly guidelines for Pb-free soldering 5
8
9
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6
10
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
10.1
10.2
10.3
10.4
11
12
Contact information. . . . . . . . . . . . . . . . . . . . . . 8
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 15 September 2011
Document identifier: IP4059CX5
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