BTA201_08 [NXP]

1 A Three-quadrant triacs high commutation; 1三象限三端双向可控硅整流高
BTA201_08
型号: BTA201_08
厂家: NXP    NXP
描述:

1 A Three-quadrant triacs high commutation
1三象限三端双向可控硅整流高

可控硅
文件: 总12页 (文件大小:77K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BTA201 series B, E and ER  
1 A Three-quadrant triacs high commutation  
Rev. 04 — 4 February 2008  
Product data sheet  
1. Product profile  
1.1 General description  
Passivated, guaranteed commutation triacs in a plastic package. The ‘sensitive gate’ E  
and ER series are intended for interfacing with low power drivers, including  
microcontrollers. The high commutation B series are designed to commutate the full RMS  
current at the maximum junction temperature without the aid of a snubber.  
1.2 Features  
I Suitable for interfacing with low power  
drivers, including microcontrollers  
I Reverse pinning option (ER type)  
1.3 Applications  
I Motor controls  
I Solenoid drivers  
1.4 Quick reference data  
I ITSM 12.5 A  
I IGT 50 mA (BTA201-600B/800B)  
I IGT 10 mA (BTA201-600E/800E/ER)  
I IGT 5 mA (BTA201-600B/800B)  
I IGT 1 mA (BTA201-600E/800E/ER)  
I IT(RMS) 1 A  
I VDRM 600 V (BTA201-600B/E)  
I VDRM 800 V (BTA201-800B/E/ER)  
2. Pinning information  
Table 1.  
Pinning  
Pin  
Description  
Simplified outline  
Graphic symbol  
B and E series  
1
main terminal 2 (T2)  
gate (G)  
T2  
T1  
G
2
3
main terminal 1 (T1)  
sym051  
ER series  
1
2
3
main terminal 1 (T1)  
gate (G)  
3 2 1  
SOT54 (TO-92)  
main terminal 2 (T2)  
BTA201 series B, E and ER  
NXP Semiconductors  
1 A Three-quadrant triacs high commutation  
3. Ordering information  
Table 2.  
Ordering information  
Type number  
Package  
Name  
Description  
plastic single-ended leaded (through hole) package; 3 leads  
Version  
BTA201-600B  
BTA201-600E  
BTA201-800B  
BTA201-800E  
BTA201-800ER  
TO-92  
SOT54  
4. Limiting values  
Table 3.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
VDRM  
repetitive peak off-state voltage  
[1]  
[1]  
BTA201-600B  
BTA201-600E  
BTA201-800B  
BTA201-800E  
BTA201-800ER  
-
-
-
-
-
-
600  
600  
800  
800  
800  
1
V
V
V
V
V
A
IT(RMS)  
ITSM  
RMS on-state current  
full sine wave; Tlead 54.3 °C; see  
Figure 4 and 5  
non-repetitive peak on-state current full sine wave; Tj = 25 °C prior to  
surge; see Figure 2 and 3  
t = 20 ms  
-
-
-
-
12.5  
13.7  
0.78  
100  
A
t = 16.7 ms  
A
A2s  
I2t  
I2t for fusing  
tp = 10 ms  
dIT/dt  
rate of rise of on-state current  
ITM = 1.5 A; IG = 0.2 A;  
A/µs  
dIG/dt = 0.2 A/µs  
IGM  
peak gate current  
peak gate power  
-
2
A
PGM  
PG(AV)  
Tstg  
Tj  
-
5
W
W
°C  
°C  
average gate power  
storage temperature  
junction temperature  
over any 20 ms period  
-
0.1  
+150  
125  
40  
-
[1] Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state. The  
rate of rise of current should not exceed 6 A/µs.  
BTA201_SER_B_E_ER_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 4 February 2008  
2 of 12  
BTA201 series B, E and ER  
NXP Semiconductors  
1 A Three-quadrant triacs high commutation  
001aag957  
1.5  
α
P
tot  
(W)  
α = 180°  
120°  
90°  
α
1.0  
60°  
30°  
0.5  
0
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
I
(A)  
T(RMS)  
α = conduction angle  
Fig 1. Total power dissipation as a function of RMS on-state current; maximum values  
001aag959  
16  
I
TSM  
(A)  
12  
8
4
0
I
I
TSM  
T
t
T
T
= 25 °C max  
j(init)  
2
3
1
10  
10  
10  
number of cycles (n)  
f = 50 Hz  
Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum  
values  
BTA201_SER_B_E_ER_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 4 February 2008  
3 of 12  
BTA201 series B, E and ER  
NXP Semiconductors  
1 A Three-quadrant triacs high commutation  
003aaa955  
3
10  
I
I
TSM  
t
T
I
TSM  
(A)  
t
p
T
= 25 °C max  
j(init)  
2
10  
(1)  
10  
10  
5  
4  
3  
2  
1  
10  
10  
10  
10  
t
(s)  
p
tp 20 ms  
(1) dIT/dt limit  
Fig 3. Non-repetitive peak on-state current as a function of pulse width; maximum values  
001aag960  
001aag961  
1.2  
3
I
T(RMS)  
(A)  
54.3 °C  
I
T(RMS)  
(A)  
1.0  
0.8  
0.6  
0.4  
0.2  
0
2
1
0
2  
1  
50  
0
50  
100  
150  
(°C)  
10  
10  
1
10  
T
surge duration (s)  
lead  
f = 50 Hz; Tlead 54.3 °C  
Fig 4. RMS on-state current as a function of surge  
duration; maximum values  
Fig 5. RMS on-state current as a function of lead  
temperature; maximum values  
BTA201_SER_B_E_ER_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 4 February 2008  
4 of 12  
BTA201 series B, E and ER  
NXP Semiconductors  
1 A Three-quadrant triacs high commutation  
5. Thermal characteristics  
Table 4.  
Symbol  
Rth(j-lead)  
Thermal characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
60  
80  
-
Unit  
K/W  
K/W  
K/W  
thermal resistance from junction to full cycle; see Figure 6  
lead  
-
-
-
-
half cycle; see Figure 6  
-
Rth(j-a)  
thermal resistance from junction to printed-circuit board  
150  
ambient  
mounted; lead  
length = 4 mm  
001aag962  
2
10  
Z
th(j-lead)  
(K/W)  
10  
(1)  
(2)  
1
1  
10  
2  
10  
5  
4  
3  
2  
1  
10  
10  
10  
10  
10  
1
10  
t
(s)  
p
(1) Unidirectional  
(2) Bidirectional  
Fig 6. Transient thermal impedance from junction to lead as a function of pulse width  
BTA201_SER_B_E_ER_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 4 February 2008  
5 of 12  
BTA201 series B, E and ER  
NXP Semiconductors  
1 A Three-quadrant triacs high commutation  
6. Static characteristics  
Table 5.  
Static characteristics  
Tj = 25 °C unless otherwise specified.  
Symbol Parameter Conditions  
BTA201-600B  
BTA201-800B  
BTA201-600E  
BTA201-800E  
BTA201-800ER  
Unit  
Min  
Typ  
Max Min  
Typ  
Max  
IGT  
gate trigger current VD = 12 V; IT = 0.1 A; see Figure 8  
T2+ G+  
5
5
5
-
-
-
50  
50  
50  
1
1
1
-
-
-
10  
10  
10  
mA  
mA  
mA  
T2+ G−  
T2G−  
IL  
latching current  
VD = 12 V; IGT = 0.1 A; see Figure 10  
T2+ G+  
-
-
30  
50  
30  
30  
1.5  
1.5  
-
-
-
12  
20  
12  
12  
1.5  
1.5  
-
mA  
mA  
mA  
mA  
V
T2+ G−  
-
-
-
-
T2G−  
-
-
-
-
IH  
holding current  
on-state voltage  
VD = 12 V; IGT = 0.1 A; see Figure 11  
IT = 1.4 A; see Figure 9  
-
-
-
-
VT  
VGT  
-
1.2  
0.7  
0.3  
0.1  
-
1.2  
0.7  
0.3  
0.1  
gate trigger voltage VD = 12 V; IT = 0.1 A; see Figure 7  
-
-
V
VD = 400 V; IT = 0.1 A; Tj = 125 °C  
0.2  
-
0.2  
-
V
ID  
off-state current  
VD = VDRM(max); Tj = 125 °C  
0.5  
0.5  
mA  
BTA201_SER_B_E_ER_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 4 February 2008  
6 of 12  
BTA201 series B, E and ER  
NXP Semiconductors  
1 A Three-quadrant triacs high commutation  
7. Dynamic characteristics  
Table 6.  
Dynamic characteristics  
Symbol Parameter  
Conditions  
BTA201-600B  
BTA201-800B  
BTA201-600E  
BTA201-800E  
BTA201-800ER  
Unit  
Min  
Typ  
Max  
Min  
Typ  
Max  
dVD/dt  
rate of rise of  
VDM = 67 % VDRM(max)  
;
1000  
-
-
600  
-
-
V/µs  
off-state voltage  
Tj = 125 °C; exponential  
waveform; gate open  
circuit  
dIcom/dt  
rate of change of  
commutating  
current  
VDM = 400 V;Tj = 125 °C;  
dVcom/dt = 20 V/µs; gate  
open circuit  
12  
16  
-
-
-
-
-
2.5  
3.5  
-
-
-
-
-
A/ms  
A/ms  
µs  
VDM = 400 V;Tj = 125 °C;  
dVcom/dt = 10 V/µs; gate  
open circuit  
-
-
tgt  
gate-controlled  
turn-on time  
ITM = 20 A;  
2
2
VD = VDRM(max)  
;
IG = 0.1 A;  
dIG/dt = 5 A/µs  
001aab101  
003aaa959  
1.6  
3
V
GT  
I
GT  
V
GT(25°C)  
I
GT(25°C)  
1.2  
2
(1)  
(2)  
(3)  
0.8  
1
(3)  
(2)  
(1)  
0.4  
50  
0
50  
0
50  
100  
150  
50  
0
150  
100  
T (°C)  
j
T (°C)  
j
(1) T2G−  
(2) T2+ G−  
(3) T2+ G+  
Fig 7. Normalized gate trigger voltage as a function  
of junction temperature  
Fig 8. Normalized gate trigger current as a function  
of junction temperature  
BTA201_SER_B_E_ER_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 4 February 2008  
7 of 12  
BTA201 series B, E and ER  
NXP Semiconductors  
1 A Three-quadrant triacs high commutation  
001aab100  
003aaa960  
3
2
I
T
I
L
(A)  
1.6  
I
L(25°C)  
2
1.2  
0.8  
0.4  
0
(1)  
(2)  
(3)  
1
0
50  
0
50  
100  
150  
2
0.4  
0
0.8  
1.2  
1.6  
T (°C)  
j
V
(V)  
T
Vo = 1.02 V; Rs = 0.358 Ω  
(1) Tj = 125 °C; typical values  
(2) Tj = 125 °C; maximum values  
(3) Tj = 25 °C; maximum values  
Fig 9. On-state current as a function of on-state  
voltage  
Fig 10. Normalized latching current as a function of  
junction temperature  
001aab099  
003aab834  
3
4
10  
dV /dt  
D
I
H
(V/µs)  
I
H(25°C)  
3
2
10  
(1)  
(2)  
2
1
10  
0
50  
10  
0
0
50  
100  
150  
50  
150  
100  
T °C  
j
T (°C)  
j
Gate open circuit  
(1) BTA201 series B  
(2) BTA201 series E and ER  
Fig 11. Normalized holding current as a function of  
junction temperature  
Fig 12. Critical rate of rise of off-state voltage as a  
function of junction temperature; minimum  
values  
BTA201_SER_B_E_ER_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 4 February 2008  
8 of 12  
BTA201 series B, E and ER  
NXP Semiconductors  
1 A Three-quadrant triacs high commutation  
8. Package outline  
Plastic single-ended leaded (through hole) package; 3 leads  
SOT54  
c
E
d
A
L
b
1
2
e
1
e
D
3
b
1
L
1
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
L
1
UNIT  
A
b
b
c
D
d
E
e
e
L
1
1
max.  
5.2  
5.0  
0.48  
0.40  
0.66  
0.55  
0.45  
0.38  
4.8  
4.4  
1.7  
1.4  
4.2  
3.6  
14.5  
12.7  
mm  
2.54  
1.27  
2.5  
Note  
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
04-06-28  
04-11-16  
SOT54  
TO-92  
SC-43A  
Fig 13. Package outline SOT54 (TO-92)  
BTA201_SER_B_E_ER_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 4 February 2008  
9 of 12  
BTA201 series B, E and ER  
NXP Semiconductors  
1 A Three-quadrant triacs high commutation  
9. Revision history  
Table 7.  
Revision history  
Document ID  
Release date Data sheet status  
20080204 Product data sheet  
Figure 3: Changed figure.  
Change notice Supersedes  
BTA201_SER_B_E_ER_3  
BTA201_SER_B_E_ER_4  
Modifications:  
-
Section 1.4 “Quick reference data” on page 1: Updated with minimum IGT values added.  
Table 3 “Limiting values” on page 2: I2t condition, tp; symbol update.  
Table 5 “Static characteristics” on page 6: Minimum IGT values added.  
BTA201_SER_B_E_ER_3  
Modifications:  
20070910  
Product data sheet  
-
BTA201_SER_B_E_ER_2  
The format of this data sheet has been redesigned to comply with the new identity  
guidelines of NXP Semiconductors.  
Legal texts have been adapted to the new company name where appropriate.  
Descriptive titles have been corrected.  
Table 3 “Limiting values” on page 2: dIT/dt uprated.  
Table 6 “Dynamic characteristics” on page 7: dVD/dt uprated.  
Figure 12 “Critical rate of rise of off-state voltage as a function of junction temperature;  
minimum values” on page 8: graph updated.  
BTA201_SER_B_E_ER_2  
Modifications:  
20060113  
Product data sheet  
-
BTA201_SER_B_E_ER_1  
Figure 4: Figure note corrected  
Table 6 “Dynamic characteristics” on page 7: Units corrected  
Figure 12: Figure title corrected  
BTA201_SER_B_E_ER_1  
(9397 750 15154)  
20050825  
Product data sheet  
-
-
BTA201_SER_B_E_ER_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 4 February 2008  
10 of 12  
BTA201 series B, E and ER  
NXP Semiconductors  
1 A Three-quadrant triacs high commutation  
10. Legal information  
10.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
10.2 Definitions  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
10.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
10.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
11. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
BTA201_SER_B_E_ER_4  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 04 — 4 February 2008  
11 of 12  
BTA201 series B, E and ER  
NXP Semiconductors  
1 A Three-quadrant triacs high commutation  
12. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1  
1.2  
1.3  
1.4  
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1  
2
3
4
5
6
7
8
9
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Thermal characteristics. . . . . . . . . . . . . . . . . . . 5  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10  
10  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
10.1  
10.2  
10.3  
10.4  
11  
12  
Contact information. . . . . . . . . . . . . . . . . . . . . 11  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2008.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 4 February 2008  
Document identifier: BTA201_SER_B_E_ER_4  

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