BF410D [NXP]

N-channel silicon field-effect transistors; N-沟道硅音响场效晶体管
BF410D
型号: BF410D
厂家: NXP    NXP
描述:

N-channel silicon field-effect transistors
N-沟道硅音响场效晶体管

晶体 晶体管
文件: 总6页 (文件大小:40K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
BF410A to D  
N-channel silicon field-effect  
transistors  
December 1990  
Product specification  
File under Discrete Semiconductors, SC07  
Philips Semiconductors  
Product specification  
N-channel silicon field-effect transistors  
BF410A to D  
DESCRIPTION  
PINNING - TO-92 VARIANT  
Asymmetrical N-channel planar  
epitaxial junction field-effect  
transistors in a plastic TO-92 variant;  
intended for applications up to the  
VHF range.  
1
2
3
= drain  
= source  
= gate  
These FETs can be supplied in four  
IDSS groups. Special features are the  
low feedback capacitance and the low  
noise figure. Thanks to these special  
features the BF410 is very suitable for  
applications such as the RF stages in  
FM portables (type A), car radios  
(type B) and mains radios (type C) or  
the mixer stage (type D).  
1
handbook, halfpage  
2
3
d
s
g
MAM257  
Fig.1 Simplified outline and symbol  
QUICK REFERENCE DATA  
Drain-source voltage  
VDS  
ID  
max.  
max.  
20  
30  
V
Drain current (DC or average)  
Total power dissipation  
up to Tamb = 75 °C  
mA  
Ptot  
max.  
300  
mW  
BF410A  
B
C
D
Drain current  
VDS = 10 V; VGS = 0  
min.  
0.7  
3.0  
2.5  
7.0  
6
10 mA  
18 mA  
IDSS  
max.  
12  
Transfer admittance  
DS = 10 V; VGS = 0; f = 1 kHz  
V
yfs  
min.  
2.5  
4
6
7 mS  
Feedback capacitance  
VDS = 10 V; VGS = 0  
Crs  
Crs  
typ.  
typ.  
0.5  
0.5  
pF  
VDS = 10 V; ID = 5 mA  
0.5  
0.5 pF  
Noise figure at optimum source admittance  
GS = 1 mS; BS = 3 mS; f = 100 MHz  
V
DS = 10 V; VGS = 0  
F
F
typ.  
typ.  
1.5  
1.5  
dB  
VDS = 10 V; ID = 5 mA  
1.5  
1.5 dB  
December 1990  
2
Philips Semiconductors  
Product specification  
N-channel silicon field-effect transistors  
BF410A to D  
RATINGS  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
Drain-source voltage  
VDS  
VDGO  
ID  
max.  
max.  
max.  
max.  
max.  
20 V  
20 V  
Drain-gate voltage (open source)  
Drain current (DC or average)  
Gate current  
30 mA  
10 mA  
300 mW  
± IG  
Ptot  
Tstg  
Tj  
Total power dissipation up to Tamb = 75 °C  
Storage temperature range  
Junction temperature  
65 to +150 °C  
max.  
150 °C  
THERMAL RESISTANCE  
From junction to ambient in free air  
Rth j-a  
=
250 K/W  
STATIC CHARACTERISTICS  
Tamb = 25 °C  
Gate cut-off current  
BF410A  
B
C
D
VGS = 0.2 V; VDS = 0  
Gate-drain breakdown voltage  
IS = 0; ID = 10 µA  
IGSS  
max.  
min.  
10  
10  
10  
10 nA  
V(BR)GDO  
20  
20  
20  
20  
V
Drain current  
VDS = 10 V; VGS = 0  
min.  
0.7  
3.0  
2.5  
7.0  
6
10 mA  
18 mA  
IDSS  
max.  
12  
Gate-source cut-off voltage  
ID = 10 µA; VDS = 10 V  
V(P)GS  
typ.  
0.8  
1.5  
2.2  
3 V  
December 1990  
3
Philips Semiconductors  
Product specification  
N-channel silicon field-effect transistors  
BF410A to D  
DYNAMIC CHARACTERISTICS  
Measuring conditions (common source): VDS = 10 V; VGS = 0; Tamb = 25 °C for BF410A and B  
VDS = 10 V; ID = 5 mA; Tamb = 25 °C for BF410C and D  
y-parameters (common source)  
Input capacitance at f = 1 MHz  
Input conductance at f = 100 MHz  
BF410A  
5
B
C
D
Cis  
gis  
max.  
typ.  
5
90  
0.5  
0.7  
4.0  
5
60  
5 pF  
50 µS  
0.5 pF  
0.7 pF  
3.5 mS  
7.0 mS  
5.0 mS  
3 pF  
100  
0.5  
0.7  
2.5  
typ.  
0.5  
0.7  
4.0  
6.0  
5.0  
3
Feedback capacitance at f = 1 MHz  
Transfer admittance at f = 1 kHz  
Crs  
max.  
min.  
min.  
typ.  
yfs  
VGS = 0 instead of ID = 5 mA  
yfs  
yfs  
Transfer admittance at f = 100 MHz  
Output capacitance at f = 1 MHz  
Output conductance at f = 1 MHz  
Output conductance at f = 100 MHz  
3.5  
3
5.5  
3
Cos  
gos  
gos  
max.  
max.  
typ.  
60  
80  
55  
100  
70  
120 µS  
90 µS  
35  
Noise figure at optimum source admittance  
GS = 1 mS; BS = 3 mS; f = 100 MHz  
F
typ.  
1.5  
1.5  
1.5  
1.5 dB  
MDA277  
MDA278  
1.5  
10  
handbook, halfpage  
handbook, halfpage  
|y  
|
fs  
BF410D  
C
rs  
(mA/V)  
(pF)  
8
BF410C  
BF410B  
1
6
4
2
0
BF410A  
0.5  
typ  
0
0
4
8
12  
16  
V
20  
(V)  
0
5
10  
15  
I
(mA)  
D
DS  
Fig.2 VGS = 0 for BF410A and BF410B;  
ID = 5 mA for BF410C and BF410D;  
f = 1 MHz; Tamb = 25 °C.  
Fig.3 VDS 10 V; f = 1 kHz; Tamb = 25 °C; typical values.  
December 1990  
4
Philips Semiconductors  
Product specification  
N-channel silicon field-effect transistors  
BF410A to D  
PACKAGE OUTLINE  
Plastic single-ended leaded (through hole) package; 3 leads (on-circle)  
SOT54 variant  
c
L
2
E
d
A
L
b
1
2
e
1
e
D
3
b
1
L
1
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
L
L
2
1
UNIT  
mm  
A
b
b
c
D
d
E
e
e
L
1
1
max  
max  
5.2  
5.0  
0.48  
0.40  
0.66  
0.56  
0.45  
0.40  
4.8  
4.4  
1.7  
1.4  
4.2  
3.6  
14.5  
12.7  
2.54  
1.27  
2.5  
2.5  
Notes  
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
97-04-14  
SOT54 variant  
TO-92  
SC-43  
December 1990  
5
Philips Semiconductors  
Product specification  
N-channel silicon field-effect transistors  
BF410A to D  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
Short-form specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
The data in this specification is extracted from a full data sheet with the same type  
number and title. For detailed information see the relevant data sheet or data handbook.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
December 1990  
6

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