BAP64Q,125 [NXP]

BAP64Q - Quad PIN diode attenuator TSOP 5-Pin;
BAP64Q,125
型号: BAP64Q,125
厂家: NXP    NXP
描述:

BAP64Q - Quad PIN diode attenuator TSOP 5-Pin

衰减器 测试 光电二极管
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BAP64Q  
Quad PIN diode attenuator  
Rev. 1 — 7 October 2010  
Product data sheet  
1. Product profile  
1.1 General description  
Quad PIN diode in a SOT753 package.  
1.2 Features and benefits  
„ 4 PIN diodes in a SOT753 package  
„ 300 kHz to 4 GHz  
„ High linearity  
„ Low insertion loss  
„ reduction in part count  
„ Low diode capacitance  
„ Low diode forward resistance  
1.3 Applications  
„ RF attenuators  
„ Broadband system applications  
„ General purpose Voltage Controlled Attenuators for high linearity applications  
2. Pinning information  
Table 1.  
Discrete pinning  
Pin  
1
Description  
RF in  
Simplified outline  
Graphic symbol  
5
4
5
4
2
series bias  
RF out  
3
4
shunt 1 bias  
shunt 2 bias  
1
2
3
1
2
3
5
sym143  
3. Ordering information  
Table 2.  
Ordering information  
Type number Package  
Name  
Description  
Version  
BAP64Q  
SC-74A plastic surface-mounted package; 5 leads  
SOT753  
 
 
 
 
 
 
BAP64Q  
NXP Semiconductors  
Quad PIN diode attenuator  
4. Marking  
Table 3.  
Marking  
Type number  
Marking code  
BAP64Q  
A1  
5. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VR  
Parameter  
Conditions  
Min  
Max  
100  
Unit  
V
[1]  
[1]  
[1]  
reverse voltage  
-
IF  
forward current  
-
100  
mA  
mW  
°C  
Ptot  
Tstg  
Tj  
total power dissipation  
storage temperature  
junction temperature  
Tsp = 90 °C  
-
125  
65  
65  
+150  
+150  
°C  
[1] single diode.  
6. Thermal characteristics  
Table 5.  
Thermal characteristics  
Symbol Parameter  
Conditions  
Typ  
350  
Unit  
K/W  
Rth(j-sp)  
thermal resistance from junction to solder point  
BAP64Q  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 1 — 7 October 2010  
2 of 13  
 
 
 
 
BAP64Q  
NXP Semiconductors  
Quad PIN diode attenuator  
7. Characteristics  
Table 6.  
Characteristics  
Tj = 25 °C unless otherwise specified.  
Symbol Parameter  
Per diode  
Conditions  
Min Typ  
Max Unit  
VF  
IR  
forward voltage  
IF = 50 mA  
VR = 20 V  
-
-
-
0.95 1.1  
V
reverse current  
-
-
1
μA  
μA  
VR = 100 V  
f = 1 MHz; see Figure 1  
VR = 0 V  
10  
Cd  
diode capacitance  
-
-
-
0.52  
0.37  
-
-
pF  
pF  
VR = 1 V  
VR = 20 V  
0.23 0.35 pF  
rD  
diode forward resistance f = 100 MHz; see Figure 2  
[1]  
[1]  
[1]  
[1]  
IF = 0.5 mA  
IF = 1 mA  
-
-
-
-
-
20  
10  
2
40  
20  
3.8  
Ω
Ω
Ω
IF = 10 mA  
IF = 100 mA  
0.7  
1.55  
1.35 Ω  
μs  
τL  
charge carrier life time  
when switched from  
IF = 10 mA to IR = 6 mA;  
RL = 100 Ω;  
-
measured at IR = 3 mA  
[1] Guaranteed on AQL basis: inspection level S4, AQL 1.0.  
001aam721  
001aam722  
2
10  
500  
C
d
(fF)  
r
D
(Ω)  
400  
10  
300  
200  
1
100  
0
1  
10  
10  
1  
2
1
10  
10  
0
4
8
12  
16  
20  
I
(mA)  
F
V
R
(V)  
f = 1 MHz; Tj = 25 °C.  
f = 100 MHz; Tj = 25 °C.  
Fig 1. Diode capacitance as a function of reverse  
voltage; typical values.  
Fig 2. Diode forward resistance as a function of  
forward current; typical values.  
BAP64Q  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 1 — 7 October 2010  
3 of 13  
 
 
 
 
BAP64Q  
NXP Semiconductors  
Quad PIN diode attenuator  
8. Application information  
8.1 Application circuit  
C1  
1
R1  
V
ctrl  
RF  
in/out  
RF  
in/out  
C2  
C3  
2
3
BAP64Q  
4
5
R2  
R3  
C4  
C5  
V
CC  
001aam723  
Fig 3. Wideband Quad PIN diode Π attenuator circuit  
Table 7. List of components used for the typical application  
Component  
Description  
chip capacitor  
chip resistor  
Value  
10 nF  
C1, C2, C3, C4, C5  
R1, R2, R3  
1000 Ω  
BAP64Q  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 1 — 7 October 2010  
4 of 13  
 
 
BAP64Q  
NXP Semiconductors  
Quad PIN diode attenuator  
8.2 Quad PIN pi attenuator characteristics  
Table 8.  
Typical performance for BAP64Q quad PIN diode Π attenuator  
VCC = 0.75 V; Tamb = 25 °C unless otherwise specified.  
Symbol Parameter Test Conditions  
Typ  
1.8  
18  
Units  
dB  
Lins  
RLin  
α
insertion loss  
Vctrl = 10 V; f = 1 GHz  
Vctrl = 0 V; f = 1 GHz  
Vctrl = 0 V; f = 1 GHz  
f = 0.1 GHz  
input return loss  
dB  
attenuation  
38  
dB  
IP3i  
input third-order intercept point  
Vctrl = 2 V  
32  
42  
dBm  
dBm  
Vctrl = 10 V  
f = 0.9 GHz  
Vctrl = 2 V  
40  
41  
dBm  
dBm  
Vctrl = 10 V  
f = 1.8 GHz  
Vctrl = 2 V  
40  
37  
dBm  
dBm  
Vctrl = 10 V  
f = 2.1 GHz  
Vctrl = 2 V  
38  
39  
dBm  
dBm  
Vctrl = 10 V  
001aam724  
0
L
(dB)  
ins  
(7)  
(6)  
(5)  
(4)  
(3)  
20  
40  
60  
80  
(2)  
(1)  
2
3
4
10  
10  
10  
10  
f (MHz)  
VCC = 0.75 V; Tamb = 25 °C.  
(1) Vctrl = 0 V  
(2) Vctrl = 0.5 V  
(3) Vctrl = 1 V  
(4) Vctrl = 2 V  
(5) Vctrl = 3 V  
(6) Vctrl = 5 V  
(7) Vctrl = 10 V  
Fig 4. Insertion loss as function of frequency; typical values  
BAP64Q  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 1 — 7 October 2010  
5 of 13  
 
BAP64Q  
NXP Semiconductors  
Quad PIN diode attenuator  
001aam725  
001aam726  
0
80  
(1)  
(2)  
RL  
(dB)  
α
(dB)  
in  
10  
60  
(3)  
(4)  
20  
30  
40  
40  
20  
0
(1)  
(2)  
(3)  
(4)  
(5)  
(6)  
2
3
4
1  
2
10  
10  
10  
10  
10  
1
10  
10  
f (MHz)  
V
ctrl  
(V)  
VCC = 0.75 V; Tamb = 25 °C.  
VCC = 0.75 V; Tamb = 25 °C.  
(1) Vctrl = 0 V  
(2) Vctrl = 1 V  
(3) Vctrl = 2 V  
(4) Vctrl = 3 V  
(5) Vctrl = 5 V  
(6) Vctrl = 10 V  
(1) f = 10 MHz  
(2) f = 100 MHz  
(3) f = 1000 MHz  
(4) f = 3000 MHz  
Fig 5. Return loss as function of frequency;  
typical values  
Fig 6. Attenuation as function of control voltage;  
typical values  
BAP64Q  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 1 — 7 October 2010  
6 of 13  
BAP64Q  
NXP Semiconductors  
Quad PIN diode attenuator  
001aam727  
001aam728  
2
2
10  
10  
(1)  
(1)  
(2)  
α
(dB)  
α
(dB)  
(2)  
10  
10  
(3)  
(4)  
(5)  
(3)  
(4)  
(5)  
(6)  
(6)  
1
40  
1
40  
0
40  
80  
0
40  
80  
T
amb  
(°C)  
T
amb  
(°C)  
VCC = 0.75 V; f = 100 MHz.  
(1) Vctrl = 0 V  
VCC = 0.75 V; f = 1000 MHz.  
(1) Vctrl = 0 V  
(2) Vctrl = 1 V  
(3) Vctrl = 2 V  
(4) Vctrl = 3 V  
(5) Vctrl = 5 V  
(6) Vctrl = 10 V  
(2) Vctrl = 1 V  
(3) Vctrl = 2 V  
(4) Vctrl = 3 V  
(5) Vctrl = 5 V  
(6) Vctrl = 10 V  
Fig 7. Attenuation as function of temperature;  
typical values  
Fig 8. Attenuation as function of temperature;  
typical values  
BAP64Q  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 1 — 7 October 2010  
7 of 13  
BAP64Q  
NXP Semiconductors  
Quad PIN diode attenuator  
001aam729  
001aam730  
2
2
10  
10  
(1)  
α
(dB)  
α
(dB)  
(1)  
(2)  
(2)  
10  
10  
(3)  
(4)  
(5)  
(3)  
(4)  
(5)  
(6)  
(6)  
1
40  
1
40  
0
40  
80  
0
40  
80  
T
amb  
(°C)  
T
amb  
(°C)  
VCC = 0.75 V; f = 2000 MHz.  
(1) Vctrl = 0 V  
VCC = 0.75 V; f = 3000 MHz.  
(1) Vctrl = 0 V  
(2) Vctrl = 1 V  
(3) Vctrl = 2 V  
(4) Vctrl = 3 V  
(5) Vctrl = 5 V  
(6) Vctrl = 10 V  
(2) Vctrl = 1 V  
(3) Vctrl = 2 V  
(4) Vctrl = 3 V  
(5) Vctrl = 5 V  
(6) Vctrl = 10 V  
Fig 9. Attenuation as function of temperature;  
typical values  
Fig 10. Attenuation as function of temperature;  
typical values  
001aam731  
50  
IP3  
i
(dBm)  
40  
(1)  
(2)  
(3)  
(4)  
30  
20  
10  
0
0
4
8
12  
16  
20  
V
ctrl  
(V)  
VCC = 0.75 V; Tamb = 25 °C.  
(1) f = 100 MHz  
(2) f = 900 MHz  
(3) f = 1800 MHz  
(4) f = 2100 MHz  
Fig 11. Input third-order intercept point as control voltage; typical values  
BAP64Q  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 1 — 7 October 2010  
8 of 13  
BAP64Q  
NXP Semiconductors  
Quad PIN diode attenuator  
9. Package outline  
Plastic surface-mounted package; 5 leads  
SOT753  
D
B
E
A
X
y
H
v
M
A
E
5
4
Q
A
A
1
c
L
1
2
3
p
detail X  
e
b
p
w
M B  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
UNIT  
A
A
b
c
D
E
e
H
L
Q
v
w
y
p
1
p
E
0.100  
0.013  
0.40  
0.25  
1.1  
0.9  
0.26  
0.10  
3.1  
2.7  
1.7  
1.3  
3.0  
2.5  
0.6  
0.2  
0.33  
0.23  
mm  
0.95  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC JEITA  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
02-04-16  
06-03-16  
SOT753  
SC-74A  
Fig 12. Package outline SOT753  
BAP64Q  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 1 — 7 October 2010  
9 of 13  
 
BAP64Q  
NXP Semiconductors  
Quad PIN diode attenuator  
10. Abbreviations  
Table 9.  
Abbreviations  
Description  
Acronym  
AQL  
PIN  
Acceptable Quality Level  
P-type, Intrinsic, N-type  
Radio Frequency  
RF  
S4  
Special inspection level 4  
11. Revision history  
Table 10. Revision history  
Document ID  
Release date  
Data sheet status  
Change notice  
Supersedes  
BAP64Q v.1  
20101007  
Product data sheet  
-
-
BAP64Q  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 1 — 7 October 2010  
10 of 13  
 
 
BAP64Q  
NXP Semiconductors  
Quad PIN diode attenuator  
12. Legal information  
12.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of an NXP Semiconductors product can reasonably be expected  
12.2 Definitions  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
12.3 Disclaimers  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
BAP64Q  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 1 — 7 October 2010  
11 of 13  
 
 
 
 
BAP64Q  
NXP Semiconductors  
Quad PIN diode attenuator  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
non-automotive qualified products in automotive equipment or applications.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
12.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
13. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
BAP64Q  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 1 — 7 October 2010  
12 of 13  
 
 
BAP64Q  
NXP Semiconductors  
Quad PIN diode attenuator  
14. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1  
1.2  
1.3  
General description . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits. . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
2
3
4
5
6
7
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 1  
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Thermal characteristics . . . . . . . . . . . . . . . . . . 2  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
8
8.1  
8.2  
Application information. . . . . . . . . . . . . . . . . . . 4  
Application circuit . . . . . . . . . . . . . . . . . . . . . . . 4  
Quad PIN pi attenuator characteristics. . . . . . . 5  
9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10  
10  
11  
12  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
12.1  
12.2  
12.3  
12.4  
13  
14  
Contact information. . . . . . . . . . . . . . . . . . . . . 12  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2010.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 7 October 2010  
Document identifier: BAP64Q  
 

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