BAP63-01 [NXP]
Silicon PIN diode; 硅PIN二极管
| 型号： | BAP63-01 |
| 厂家： | 
NXP |
| 描述： | Silicon PIN diode |
| 文件： | 总7页 (文件大小：76K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
BAP63-01
Silicon PIN diode
Preliminary specification
2001 Nov 01
Philips Semiconductors
Preliminary specification
Silicon PIN diode
BAP63-01
FEATURES
PINNING
• High speed switching for RF signals
• Low diode capacitance
PIN
DESCRIPTION
1
2
cathode
anode
• Low diode forward resistance
• Very low series inductance
• For applications up to 3 GHz.
handbook, halfpage
1
2
APPLICATIONS
• RF attenuators and switches.
Top view
MAM405
DESCRIPTION
Marking code: K5
Planar PIN diode in a SOD723A ultra small plastic SMD
package.
Fig.1 Simplified outline (SOD723A) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VR
PARAMETER
CONDITIONS
MIN.
MAX.
50
UNIT
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
−
−
−
V
IF
100
mA
mW
°C
Ptot
Tstg
Tj
Ts = 90 °C
315
−65
−65
+150
+150
junction temperature
°C
2001 Nov 01
2
Philips Semiconductors
Preliminary specification
Silicon PIN diode
BAP63-01
ELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
VF
PARAMETER
forward voltage
CONDITIONS
TYP.
0.95
MAX.
1.1
UNIT
IF = 50 mA
VR =35 V
V
IR
reverse leakage current
diode capacitance
−
10
−
nA
pF
pF
pF
Ω
Cd
VR = 0; f = 1 MHz
0.35
0.30
0.24
2.5
VR = 1 V; f = 1 MHz
−
VR = 20 V; f = 1 MHz
0.32
3.5
3.0
1.8
1.5
−
rD
diode forward resistance
IF = 0.5 mA; f = 100 MHz; note 1
IF = 1 mA; f = 100 MHz; note 1
IF = 10 mA; f = 100 MHz; note 1
IF = 100 mA; f = 100 MHz; note 1
VR = 0; f = 900 MHz
1.98
1.2
Ω
Ω
0.9
Ω
2
|s21
|s21
|s21
|s21
|s21
|
isolation
14.9
9.7
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
µs
VR = 0; f = 1800 MHz
−
VR = 0; f = 2450 MHz
7.8
−
2
|
insertion loss
insertion loss
insertion loss
insertion loss
IF = 0.5 mA; f = 900 MHz
IF = 0.5 mA; f = 1800 MHz
IF = 0.5 mA; f = 2450 MHz
IF = 1 mA; f = 900 MHz
IF = 1 mA; f = 1800 MHz
IF = 1 mA; f = 2450 MHz
IF = 10 mA; f = 900 MHz
IF = 10 mA; f = 1800 MHz
IF = 10 mA; f = 2450 MHz
IF = 100 mA; f = 900 MHz
IF = 100 mA; f = 1800 MHz
IF = 100 mA; f = 2450 MHz
0.22
0.23
0.25
0.19
0.21
0.22
0.15
0.17
0.19
0.12
0.15
0.17
0.3
−
−
−
2
|
−
−
−
2
|
−
−
−
2
|
−
−
−
τL
charge carrier life time
series inductance
when switched from IF = 10 mA to
IR = 6 mA; RL = 100 Ω;
measured at IR = 3 mA
−
LS
0.6
−
nH
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
UNIT
Rth j-s
thermal resistance from junction to soldering point
190
K/W
2001 Nov 01
3
Philips Semiconductors
Preliminary specification
Silicon PIN diode
BAP63-01
GRAPHICAL DATA
400
300
200
100
0
10
rD
Cd
(pF)
Ω
)
(
1
0.1
0
4
8
12
16
20
0.1
1
10
100
IF (mA)
V
R (V)
f = 100 MHz; Tj = 25 °C.
f = 1 MHz; Tj = 25 °C.
Fig.2 Forward resistance as a function of forward
current; typical values.
Fig.3 Diode capacitance as a function of reverse
voltage; typical values.
0
0
2
|s21
|
2
|s21
|
(dB)
-0.1
(dB)
(3)
(1)
(4)
(2)
-10
-20
-30
-40
-0.2
-0.3
-0.4
-0.5
0
1
2
3
0
1
2
3
f (GHz)
f (GHz)
(1) IF = 0.5 mA.
(2) IF = 1 mA.
(3)
IF = 10 mA.
(4) IF = 100 mA.
Diode inserted in series with a 50 Ω stripline circuit and biased
via the analyzer Tee network. Tamb = 25 °C.
Diode zero biased and inserted in series with a 50 Ω stripline circuit.
Tamb = 25 °C.
Fig.4 Insertion loss (|s21|2) of the diode as a
Fig.5 Isolation (|s21|2) of the diode as a function of
function of frequency; typical values.
frequency; typical values.
2001 Nov 01
4
Philips Semiconductors
Preliminary specification
Silicon PIN diode
BAP63-01
PACKAGE OUTLINE
SOD723A
2001 Nov 01
5
Philips Semiconductors
Preliminary specification
Silicon PIN diode
BAP63-01
DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)
DEFINITIONS
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury.
Philips Semiconductors customers using or selling these
products for use in such applications do so at their own
risk and agree to fully indemnify Philips Semiconductors
for any damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in
the Characteristics sections of the specification is not
implied. Exposure to limiting values for extended periods
may affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or
title under any patent, copyright, or mask work right to
these products, and makes no representations or
warranties that these products are free from patent,
copyright, or mask work right infringement, unless
otherwise specified.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will
be suitable for the specified use without further testing or
modification.
2001 Nov 01
6
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2001
SCA73
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
125004/04/pp7
Date of release: 2001 Nov 01
Document order number: 9397 750 08973
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