BAP51-04W [NXP]
GENERAL PURPOSE PIN DIODE; 通用PIN二极管型号: | BAP51-04W |
厂家: | NXP |
描述: | GENERAL PURPOSE PIN DIODE |
文件: | 总7页 (文件大小:84K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
k, halfpage
BAP51-04W
General purpose PIN diode
Preliminary specification
2002 Feb 19
Philips Semiconductors
Preliminary specification
General purpose PIN diode
BAP51-04W
FEATURES
PINNING
• Two elements in series configuration in a small SMD
plastic package
PIN
DESCRIPTION
1
2
3
anode
• Low diode capacitance
cathode
• Low diode forward resistance.
common connection
APPLICATIONS
3
3
handbook, halfpage
• General RF applications.
1
2
DESCRIPTION
1
2
Two planar PIN diodes in series configuration in a SOT323
small SMD plastic package.
MAM391
Top view
Marking code: W6-
Fig.1 Simplified outline (SOT323) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
Per diode
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VR
IF
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
−
−
−
50
V
50
mA
mW
°C
Ptot
Tstg
Tj
Ts = 90 °C
240
+150
+150
−65
−65
junction temperature
°C
2002 Feb 19
2
Philips Semiconductors
Preliminary specification
General purpose PIN diode
BAP51-04W
ELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
Per diode
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
VF
VR
IR
forward voltage
IF = 50 mA
IR = 10 µA
VR = 50 V
−
0.95
−
1.1
−
V
reverse voltage
reverse current
diode capacitance
50
−
V
−
100
−
nA
pF
pF
pF
Ω
Cd
VR = 0; f = 1 MHz
−
0.4
0.3
0.2
5.5
3.6
1.5
550
VR = 1 V; f = 1 MHz
−
0.55
0.35
9
VR = 5 V; f = 1 MHz
−
rD
diode forward resistance
IF = 0.5 mA; f = 100 MHz; note 1
IF = 1 mA; f = 100 MHz; note 1
IF = 10 mA; f = 100 MHz; note 1
−
−
6.5
2.5
−
Ω
−
Ω
τL
charge carrier life time
series inductance
when switched from IF = 10 mA to
IR = 6 mA; RL = 100 Ω;
measured at IR = 3 mA
−
ns
LS
IF = 10 mA; f = 100 MHz
−
1.6
−
nH
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
250
UNIT
Rth j-s
thermal resistance from junction to soldering point
K/W
2002 Feb 19
3
Philips Semiconductors
Preliminary specification
General purpose PIN diode
BAP51-04W
GRAPHICAL DATA
MLD507
MLD508
2
10
500
handbook, halfpage
handbook, halfpage
C
d
r
D
(fF)
400
(Ω)
10
300
200
1
100
−1
10
10
0
0
−1
2
1
10
10
4
8
12
16
20
I
(mA)
F
V
(V)
R
f = 100 MHz; Tj = 25 °C.
f = 100 MHz; Tj = 25 °C.
Fig.2 Forward resistance as a function of forward
current; typical values.
Fig.3 Diode capacitance as a function of reverse
voltage; typical values.
MLD509
MGS659
0
2
0
handbook, halfpage
handbook, halfpage
2
s
|S
|
21
21
(dB)
−0.5
(dB)
−10
(1)
(2)
(3)
−20
−30
−1
−1.5
−2
−40
−50
−2.5
0.5
1
1.5
2
2.5
3
0.5
1
1.5
2
2.5
3
f (GHz)
f (GHz)
(1) IF = 10 mA.
(2) IF = 1 mA
(3) IF = 0.5 mA
Diode zero biased and inserted in series with a 50 Ω stripline circuit.
Tamb = 25 °C.
Diode inserted in series with a 50 Ω stripline circuit and biased via the
analyzer Tee network. Tamb = 25 °C.
Fig.4 Insertion loss (|s21|2) of the diode as a
Fig.5 Isolation (|s21|2) of the diode as a function of
function of frequency; typical values.
frequency; typical values.
2002 Feb 19
4
Philips Semiconductors
Preliminary specification
General purpose PIN diode
BAP51-04W
PACKAGE OUTLINE
Plastic surface mounted package; 3 leads
SOT323
D
B
E
A
X
H
y
v M
A
E
3
Q
A
A
1
c
1
2
L
p
e
b
w
M B
1
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
A
UNIT
b
c
D
E
e
e
H
E
L
Q
v
w
p
p
1
max
1.1
0.8
0.4
0.3
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.45
0.15
0.23
0.13
mm
0.1
1.3
0.65
0.2
0.2
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
SOT323
SC-70
97-02-28
2002 Feb 19
5
Philips Semiconductors
Preliminary specification
General purpose PIN diode
BAP51-04W
DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)
DEFINITIONS
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Product data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS
DISCLAIMERS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury.
Philips Semiconductors customers using or selling these
products for use in such applications do so at their own
risk and agree to fully indemnify Philips Semiconductors
for any damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in
the Characteristics sections of the specification is not
implied. Exposure to limiting values for extended periods
may affect device reliability.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or
title under any patent, copyright, or mask work right to
these products, and makes no representations or
warranties that these products are free from patent,
copyright, or mask work right infringement, unless
otherwise specified.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will
be suitable for the specified use without further testing or
modification.
2002 Feb 19
6
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2001
SCA73
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613512/01/pp7
Date of release: 2002 Feb 19
Document order number: 9397 750 09456
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