74LVC2G241GM [NXP]
Dual buffer/line driver; 3-state; 双缓冲/线路驱动器;三态
| 型号： | 74LVC2G241GM |
| 厂家： | 
NXP |
| 描述： | Dual buffer/line driver; 3-state |
| 文件： | 总17页 (文件大小：99K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
74LVC2G241
Dual buffer/line driver; 3-state
Rev. 07 — 5 October 2007
Product data sheet
1. General description
The 74LVC2G241 is a dual non-inverting buffer/line driver with 3-state outputs. The
3-state outputs are controlled by the output enable inputs 1OE and 2OE:
• A HIGH level at pin 1OE causes output 1Y to assume a high-impedance OFF-state.
• A LOW level at pin 2OE causes output 2Y to assume a high-impedance OFF-state.
Schmitt trigger action at all inputs makes the circuit highly tolerant of slower input rise and
fall times.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these
devices as translators in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial power-down applications using IOFF. The IOFF
circuitry disables the output, preventing the damaging backflow current through the device
when it is powered down.
2. Features
I Wide supply voltage range from 1.65 V to 5.5 V
I 5 V tolerant input/output for interfacing with 5 V logic
I High noise immunity
I Complies with JEDEC standard:
N JESD8-7 (1.65 V to 1.95 V)
N JESD8-5 (2.3 V to 2.7 V)
N JESD8-B/JESD36 (2.7 V to 3.6 V)
I ESD protection:
N HBM JESD22-A114E exceeds 2000 V
N MM JESD22-A115-A exceeds 200 V
I ±24 mA output drive (VCC = 3.0 V)
I CMOS low power consumption
I Latch-up performance exceeds 250 mA
I Direct interface with TTL levels
I Inputs accept voltages up to 5 V
I Multiple package options
I Specified from −40 °C to +85 °C and −40 °C to +125 °C
74LVC2G241
NXP Semiconductors
Dual buffer/line driver; 3-state
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74LVC2G241DP
74LVC2G241DC
74LVC2G241GT
74LVC2G241GM
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
VSSOP8
XSON8
XQFN8
plastic very thin shrink small outline package; 8 leads; SOT765-1
body width 2.3 mm
plastic extremely thin small outline package; no leads; SOT833-1
8 terminals; body 1 × 1.95 × 0.5 mm
plastic extremely thin quad flat package; no leads;
SOT902-1
8 terminals; body 1.6 × 1.6 × 0.5 mm
4. Marking
Table 2.
Marking
Type number
Marking code
V241
74LVC2G241DP
74LVC2G241DC
74LVC2G241GT
74LVC2G241GM
V41
V41
V41
5. Functional diagram
1
1OE
2
1Y
6
2
7
1A
6
3
1
1
EN1
2OE
5
3
2Y
5
2A
2
7
EN2
001aaa409
001aaa408
Fig 1. Logic symbol
Fig 2. IEC logic symbol
74LVC2G241_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 5 October 2007
2 of 17
74LVC2G241
NXP Semiconductors
Dual buffer/line driver; 3-state
6. Pinning information
6.1 Pinning
74LVC2G241
1
2
3
4
8
7
6
5
1OE
1A
V
CC
2OE
1Y
2Y
GND
2A
001aab569
Fig 3. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8)
74LVC2G241
terminal 1
index area
74LVC2G241
2OE
1
1OE
1A
1
2
3
4
8
7
6
5
V
CC
7
6
5
1OE
1A
2OE
1Y
1Y
2A
2
3
2Y
2Y
GND
2A
001aaf057
001aab570
Transparent top view
Transparent top view
Fig 4. Pin configuration SOT833-1 (XSON8)
Fig 5. Pin configuration SOT902-1 (XQFN8)
6.2 Pin description
Table 3.
Symbol
Pin description
Pin
Description
SOT505-2, SOT765-1,
SOT833-1
SOT902-1
1OE
1A
1
2
3
4
5
6
7
8
7
6
5
4
3
2
1
8
output enable input 1OE (active LOW)
data input
2Y
data output
GND
2A
ground (0 V)
data input
1Y
data output
2OE
VCC
output enable input 2OE (active HIGH)
supply voltage
74LVC2G241_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 5 October 2007
3 of 17
74LVC2G241
NXP Semiconductors
Dual buffer/line driver; 3-state
7. Functional description
Table 4.
Function table[1]
Input
1OE
L
Output
1A
L
2OE
H
2A
L
1Y
L
2Y
L
L
H
H
H
H
Z
H
Z
H
X
L
X
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground 0 V).
Symbol
VCC
IIK
Parameter
Conditions
Min
−0.5
−50
−0.5
-
Max
+6.5
-
Unit
V
supply voltage
input clamping current
input voltage
VI < 0 V
mA
V
[1]
VI
+6.5
±50
VCC + 0.5
+6.5
+6.5
±50
100
-
IOK
output clamping current
output voltage
VO > VCC or VO < 0 V
enable mode
mA
V
[1][2]
[1][2]
[1][2]
VO
−0.5
−0.5
−0.5
-
disable mode
V
Power-down mode
VO = 0 V to VCC
V
IO
output current
mA
mA
mA
°C
mW
ICC
IGND
Tstg
Ptot
supply current
-
ground current
−100
−65
-
storage temperature
total power dissipation
+150
300
[3]
Tamb = −40 °C to +125 °C
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation.
[3] For TSSOP8 packages: above 55 °C the value of Ptot derates linearly with 2.5 mW/K.
For VSSOP8 packages: above 110 °C the value of Ptot derates linearly with 8.0 mW/K.
For XSON8 and XQFN8 packages: above 45 °C the value of Ptot derates linearly with 2.4 mW/K.
74LVC2G241_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 5 October 2007
4 of 17
74LVC2G241
NXP Semiconductors
Dual buffer/line driver; 3-state
9. Recommended operating conditions
Table 6.
Symbol
VCC
Recommended operating conditions
Parameter
Conditions
Min
Typ
Max
5.5
5.5
VCC
5.5
5.5
+125
20
Unit
V
supply voltage
input voltage
output voltage
1.65
-
-
-
-
-
-
-
-
VI
0
V
VO
VCC = 1.65 V to 5.5 V; enable mode
VCC = 1.65 V to 5.5 V; disable mode
VCC = 0 V; Power-down mode
0
V
0
V
0
V
Tamb
ambient temperature
−40
°C
ns/V
ns/V
∆t/∆V
input transition rise
and fall rate
VCC = 1.65 V to 2.7 V
VCC = 2.7 V to 5.5 V
-
-
10
10. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground 0 V).
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Tamb = −40 °C to +85 °C[1]
VIH
HIGH-level input voltage
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 4.5 V to 5.5 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 4.5 V to 5.5 V
0.65VCC
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
1.7
-
2.0
-
0.7VCC
-
VIL
LOW-level input voltage
-
-
-
-
0.35VCC
0.7
0.8
0.3VCC
VOL
LOW-level output voltage VI = VIH or VIL
IO = 100 µA; VCC = 1.65 V to 5.5 V
-
-
-
-
-
-
-
-
-
-
-
-
0.1
V
V
V
V
V
V
IO = 4 mA; VCC = 1.65 V
IO = 8 mA; VCC = 2.3 V
IO = 12 mA; VCC = 2.7 V
IO = 24 mA; VCC = 3.0 V
IO = 32 mA; VCC = 4.5 V
0.45
0.3
0.4
0.55
0.55
VOH
HIGH-level output voltage VI = VIH or VIL
IO = −100 µA; VCC = 1.65 V to 5.5 V
IO = −4 mA; VCC = 1.65 V
V
CC − 0.1
-
-
-
-
-
-
-
-
-
-
-
-
V
1.2
1.9
2.2
2.3
3.8
-
V
IO = −8 mA; VCC = 2.3 V
V
IO = −12 mA; VCC = 2.7 V
V
IO = −24 mA; VCC = 3.0 V
V
IO = −32 mA; VCC = 4.5 V
V
II
input leakage current
VI = 5.5 V or GND; VCC = 0 V to 5.5 V
±0.1 ±5
µA
74LVC2G241_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 5 October 2007
5 of 17
74LVC2G241
NXP Semiconductors
Dual buffer/line driver; 3-state
Table 7.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground 0 V).
Symbol Parameter
Conditions
OFF-state output current VI = VIH or VIL; VO = 5.5 V or GND;
CC = 3.6 V
power-off leakage current VI or VO = 5.5 V; VCC = 0 V
supply current VI = 5.5 V or GND; IO = 0 A;
CC = 1.65 V to 5.5 V
additional supply current per pin; VI = VCC − 0.6 V; IO = 0 A;
CC = 2.3 V to 5.5 V
Min
Typ
Max
Unit
IOZ
-
±0.1 ±10
µA
V
IOFF
ICC
-
-
±0.1 ±10
µA
µA
0.1
5
10
500
-
V
∆ICC
-
-
µA
V
CI
input capacitance
2
pF
Tamb = −40 °C to +125 °C
VIH HIGH-level input voltage
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 4.5 V to 5.5 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 4.5 V to 5.5 V
0.65VCC
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
1.7
-
2.0
-
0.7VCC
-
VIL
LOW-level input voltage
-
-
-
-
0.35VCC
0.7
0.8
0.3VCC
VOL
LOW-level output voltage VI = VIH or VIL
IO = 100 µA; VCC = 1.65 V to 5.5 V
-
-
-
-
-
-
-
-
-
-
-
-
0.1
V
V
V
V
V
V
IO = 4 mA; VCC = 1.65 V
IO = 8 mA; VCC = 2.3 V
IO = 12 mA; VCC = 2.7 V
IO = 24 mA; VCC = 3.0 V
IO = 32 mA; VCC = 4.5 V
0.70
0.45
0.60
0.80
0.80
VOH
HIGH-level output voltage VI = VIH or VIL
IO = −100 µA; VCC = 1.65 V to 5.5 V
IO = −4 mA; VCC = 1.65 V
V
CC − 0.1
-
-
-
-
-
-
-
-
-
V
0.95
1.7
1.9
2.0
3.4
-
-
V
IO = −8 mA; VCC = 2.3 V
-
V
IO = −12 mA; VCC = 2.7 V
-
V
IO = −24 mA; VCC = 3.0 V
-
V
IO = −32 mA; VCC = 4.5 V
-
V
II
input leakage current
VI = 5.5 V or GND; VCC = 0 V to 5.5 V
±20
±20
µA
µA
IOZ
OFF-state output current VI = VIH or VIL; VO = 5.5 V or GND;
CC = 3.6 V
-
V
IOFF
ICC
power-off leakage current VI or VO = 5.5 V; VCC = 0 V
supply current VI = 5.5 V or GND; IO = 0 A;
CC = 1.65 V to 5.5 V
additional supply current per pin; VI = VCC − 0.6 V; IO = 0 A;
CC = 2.3 V to 5.5 V
-
-
-
-
±20
µA
µA
40
V
∆ICC
-
-
5
mA
V
[1] Typical values are measured at VCC = 3.3 V and Tamb = 25 °C.
74LVC2G241_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 5 October 2007
6 of 17
74LVC2G241
NXP Semiconductors
Dual buffer/line driver; 3-state
11. Dynamic characteristics
Table 8.
Dynamic characteristics
Voltages are referenced to GND (ground 0 V); for test circuit see Figure 9.
Symbol Parameter
Conditions
−40 °C to +85 °C
−40 °C to +125 °C Unit
Min
Typ[1]
Max
Min
Max
[2]
[3]
[3]
[4]
[4]
tpd
propagation delay nA to nY; see Figure 6
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
1.0
0.5
1.0
0.5
0.5
4.5
2.8
2.8
2.6
2.1
8.8
4.9
4.7
4.3
3.7
1.0
0.5
1.0
0.5
0.5
11.0
6.3
5.9
5.4
4.6
ns
ns
ns
ns
ns
VCC = 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
ten
enable time
1OE to 1Y; see Figure 7
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V
1.5
1.0
1.5
0.5
0.5
5.2
3.1
3.2
2.7
2.0
9.9
5.6
5.5
4.7
3.8
1.5
1.0
1.5
0.5
0.5
12.4
7.0
6.9
5.9
4.8
ns
ns
ns
ns
ns
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
2OE to 2Y; see Figure 7
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V
1.0
1.0
1.0
1.0
0.5
4.3
2.7
2.7
2.5
1.9
8.8
4.7
4.6
4.1
3.3
1.0
1.0
1.0
1.0
0.5
11.0
5.9
5.8
5.1
4.1
ns
ns
ns
ns
ns
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
1OE to 1Y; see Figure 7
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V
tdis
disable time
1.0
0.5
1.0
1.0
0.5
3.2
2.2
2.8
2.6
2.0
11.6
5.8
4.6
4.4
3.4
1.0
0.5
1.0
1.0
0.5
14.1
7.6
5.9
5.7
4.6
ns
ns
ns
ns
ns
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
2OE to 2Y; see Figure 7
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V
1.0
0.5
1.5
1.0
0.5
3.6
2.0
3.2
2.8
2.0
12.5
5.2
4.9
4.2
3.3
1.0
0.5
1.5
1.0
0.5
15.2
6.9
6.3
5.4
4.4
ns
ns
ns
ns
ns
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
74LVC2G241_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 5 October 2007
7 of 17
74LVC2G241
NXP Semiconductors
Dual buffer/line driver; 3-state
Table 8.
Dynamic characteristics …continued
Voltages are referenced to GND (ground 0 V); for test circuit see Figure 9.
Symbol Parameter
Conditions
−40 °C to +85 °C
−40 °C to +125 °C Unit
Min
Typ[1]
Max
Min
Max
[5]
CPD
power dissipation per buffer; VI = GND to VCC
capacitance
output enabled
-
-
20
5
-
-
-
-
-
-
pF
pF
output disabled
[1] Typical values are measured at nominal VCC and at Tamb = 25 °C.
[2] tpd is the same as tPLH and tPHL
[3] ten is the same as tPZH and tPZL.
[4] tdis is the same as tPLZ and tPHZ
.
.
.
[5] CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
Σ(CL × VCC2 × fo) = sum of outputs.
12. Waveforms
V
I
V
nA input
M
GND
t
t
PHL
PLH
V
OH
V
nY output
M
V
OL
mna230
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 6. The data input (nA) to output (nY) propagation delays
Table 9.
Measurement points
Supply voltage
VCC
Input
VM
Output
VM
VX
VY
1.65 V to 1.95 V
2.3 V to 2.7 V
2.7 V
0.5VCC
0.5VCC
1.5 V
1.5 V
0.5VCC
0.5VCC
0.5VCC
1.5 V
VOL + 0.15 V
VOL + 0.15 V
VOL + 0.3 V
VOL + 0.3 V
VOL + 0.3 V
V
OH − 0.15 V
OH − 0.15 V
OH − 0.3 V
OH − 0.3 V
OH − 0.3 V
V
V
V
V
3.0 V to 3.6 V
4.5 V to 5.5 V
1.5 V
0.5VCC
74LVC2G241_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 5 October 2007
8 of 17
74LVC2G241
NXP Semiconductors
Dual buffer/line driver; 3-state
V
I
1OE input
V
M
t
GND
t
PLZ
PZL
V
CC
output
LOW-to-OFF
OFF-to-LOW
V
M
V
X
V
OL
t
t
PZH
PHZ
V
OH
V
Y
output
V
HIGH-to-OFF
OFF-to-HIGH
M
GND
outputs
enabled
outputs
enabled
outputs
disabled
mna730
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 7. Enable and disable times for input 1OE
V
I
2OE input
V
M
t
GND
t
PLZ
PZL
V
CC
output
LOW-to-OFF
OFF-to-LOW
V
M
V
X
V
OL
t
t
PZH
PHZ
V
OH
V
Y
output
V
HIGH-to-OFF
OFF-to-HIGH
M
GND
outputs
enabled
outputs
enabled
outputs
disabled
mna731
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 8. Enable and disable times for input 2OE
74LVC2G241_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 5 October 2007
9 of 17
74LVC2G241
NXP Semiconductors
Dual buffer/line driver; 3-state
V
EXT
V
CC
R
L
V
V
O
I
G
DUT
R
T
C
L
R
L
mna616
Test data is given in Table 10.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
VEXT = External voltage for measuring switching times.
Fig 9. Load circuitry for switching times
Table 10. Test data
Supply voltage
Input
VI
Load
CL
VEXT
RL
tPLH, tPHL
open
tPZH, tPHZ
GND
tPZL, tPLZ
2 × VCC
2 × VCC
6 V
1.65 V to 1.95 V
2.3 V to 2.7 V
2.7 V
VCC
VCC
2.7 V
2.7 V
VCC
30 pF
30 pF
50 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
500 Ω
open
GND
open
GND
3.0 V to 3.6 V
4.5 V to 5.5 V
open
GND
6 V
open
GND
2 × VCC
74LVC2G241_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 5 October 2007
10 of 17
74LVC2G241
NXP Semiconductors
Dual buffer/line driver; 3-state
13. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
SOT505-2
D
E
A
X
c
H
v
M
y
A
E
Z
5
8
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
detail X
1
4
e
w
M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT
v
w
y
Z
θ
1
2
3
p
max.
0.15
0.00
0.95
0.75
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
4.1
3.9
0.47
0.33
0.70
0.35
8°
0°
mm
1.1
0.65
0.25
0.5
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-01-16
SOT505-2
- - -
Fig 10. Package outline SOT505-2 (TSSOP8)
74LVC2G241_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 5 October 2007
11 of 17
74LVC2G241
NXP Semiconductors
Dual buffer/line driver; 3-state
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
A
1
(A )
3
pin 1 index
θ
L
p
L
detail X
1
4
e
w
M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
A
A
A
b
c
D
E
e
H
L
L
p
Q
UNIT
v
w
y
Z
θ
1
2
3
p
E
max.
0.15
0.00
0.85
0.60
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
3.2
3.0
0.40
0.15
0.21
0.19
0.4
0.1
8°
0°
mm
1
0.5
0.12
0.4
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-06-07
SOT765-1
MO-187
Fig 11. Package outline SOT765-1 (VSSOP8)
74LVC2G241_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 5 October 2007
12 of 17
74LVC2G241
NXP Semiconductors
Dual buffer/line driver; 3-state
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm
SOT833-1
b
1
2
3
4
4×
(2)
L
L
1
e
8
7
6
5
e
1
e
1
e
1
8×
(2)
A
A
1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
A
1
UNIT
b
D
E
e
e
L
L
1
1
max max
0.25
0.17
2.0
1.9
1.05
0.95
0.35 0.40
0.27 0.32
mm
0.5 0.04
0.6
0.5
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
- - -
04-07-22
04-11-09
SOT833-1
- - -
MO-252
Fig 12. Package outline SOT833-1 (XSON8)
74LVC2G241_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 5 October 2007
13 of 17
74LVC2G241
NXP Semiconductors
Dual buffer/line driver; 3-state
XQFN8: plastic extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm
SOT902-1
D
B
A
terminal 1
index area
E
A
A
1
detail X
e
L
1
e
C
y
C
1
y
L
M
M
v
C A
C
B
4
w
5
6
7
3
2
metal area
not for soldering
e
1
b
e
1
1
terminal 1
index area
8
X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
1
b
D
E
e
e
1
L
L
v
w
y
y
1
1
max
0.05 0.25 1.65 1.65
0.00 0.15 1.55 1.55
0.35 0.15
0.25 0.05
mm
0.5
0.55
0.5
0.1
0.05 0.05 0.05
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
MO-255
JEITA
05-11-16
05-11-25
SOT902-1
- - -
- - -
Fig 13. Package outline SOT902-1 (XQFN8)
74LVC2G241_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 5 October 2007
14 of 17
74LVC2G241
NXP Semiconductors
Dual buffer/line driver; 3-state
14. Abbreviations
Table 11. Abbreviations
Acronym
CMOS
DUT
Description
Complementary Metal Oxide Semiconductor
Device Under Test
ESD
ElectroStatic Discharge
Human Body Model
HBM
MM
Machine Model
TTL
Transistor-Transistor Logic
15. Revision history
Table 12. Revision history
Document ID
74LVC2G241_7
Modifications:
Release date
Data sheet status
Change notice
Supersedes
20071005
Product data sheet
-
74LVC2G241_6
• The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• In Section 10 “Static characteristics”, changed conditions for input leakage and supply current.
74LVC2G241_6
74LVC2G241_5
74LVC2G241_4
74LVC2G241_3
74LVC2G241_2
74LVC2G241_1
20060922
20050202
20040922
20030311
20030129
20021030
Product data sheet
Product specification
Product specification
Product specification
Product specification
Product specification
-
-
-
-
-
-
74LVC2G241_5
74LVC2G241_4
74LVC2G241_3
74LVC2G241_2
74LVC2G241_1
-
74LVC2G241_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 5 October 2007
15 of 17
74LVC2G241
NXP Semiconductors
Dual buffer/line driver; 3-state
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of a NXP Semiconductors product can reasonably be expected to
16.2 Definitions
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
17. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
74LVC2G241_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 5 October 2007
16 of 17
74LVC2G241
NXP Semiconductors
Dual buffer/line driver; 3-state
18. Contents
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15
8
9
10
11
12
13
14
15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 5 October 2007
Document identifier: 74LVC2G241_7
相关型号：
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