74LVC1G17GM [NXP]

Single Schmitt-trigger buffer; 单施密特触发缓冲器
74LVC1G17GM
型号: 74LVC1G17GM
厂家: NXP    NXP
描述:

Single Schmitt-trigger buffer
单施密特触发缓冲器

栅极 逻辑集成电路 光电二极管
文件: 总16页 (文件大小:94K)
中文:  中文翻译
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INTEGRATED CIRCUITS  
DATA SHEET  
74LVC1G17  
Single Schmitt-trigger buffer  
Product specification  
2004 Nov 30  
Supersedes data of 2004 Oct 18  
Philips Semiconductors  
Product specification  
Single Schmitt-trigger buffer  
74LVC1G17  
FEATURES  
DESCRIPTION  
Wide supply voltage range from 1.65 V to 5.5 V  
High noise immunity  
The 74LVC1G17 is a high-performance, low-power,  
low-voltage, Si-gate CMOS device, superior to most  
advanced CMOS compatible TTL families.  
Complies with JEDEC standard:  
– JESD8-7 (1.65 V to 1.95 V)  
The input can be driven from either 3.3 V or 5 V devices.  
This feature allows the use of this device in a mixed  
3.3 V and 5 V environment.  
– JESD8-5 (2.3 V to 2.7 V)  
– JESD8B/JESD36 (2.7 V to 3.6 V).  
• ±24 mA output drive (VCC = 3.0 V)  
CMOS low power consumption  
Latch-up performance exceeds 250 mA  
Direct interface with TTL levels  
Unlimited rise and fall times  
This device is fully specified for partial power-down  
applications using Ioff. The Ioff circuitry disables the output,  
preventing the damaging backflow current through the  
device when it is powered down.  
The 74LVC1G17 provides a buffer function with  
Schmitt-trigger action. It is capable of transforming slowly  
changing input signals into sharply defined outputs.  
Input accepts voltages up to 5 V  
ESD protection:  
– HBM EIA/JESD22-A114-B exceeds 2000 V  
– MM EIA/JESD22-A115-A exceeds 200 V.  
Multiple package options  
Specified from 40 °C to +85 °C and 40 °C to +125 °C.  
QUICK REFERENCE DATA  
GND = 0 V; Tamb = 25 °C; tr = tf 2.5 ns.  
SYMBOL  
PARAMETER  
CONDITIONS  
TYPICAL  
UNIT  
tPHL/tPLH  
propagation delay A to Y  
VCC = 1.8 V; CL = 30 pF; RL = 1 kΩ  
4.1  
ns  
ns  
ns  
ns  
VCC = 2.5 V; CL = 30 pF; RL = 500 2.8  
VCC = 3.3 V; CL = 50 pF; RL = 500 3.0  
VCC = 5.0 V; CL = 50 pF; RL = 500 2.2  
CI  
input capacitance  
5
pF  
pF  
CPD  
power dissipation capacitance per buffer notes 1 and 2  
16.6  
Notes  
1. CPD is used to determine the dynamic power dissipation (PD in µW).  
PD = CPD × VCC2 × fi × N + (CL × VCC2 × fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in Volts;  
N = number of inputs switching;  
(CL × VCC2 × fo) = sum of the outputs.  
2. The condition is VI = GND to VCC  
.
2004 Nov 30  
2
Philips Semiconductors  
Product specification  
Single Schmitt-trigger buffer  
74LVC1G17  
FUNCTION TABLE  
See note 1.  
INPUT  
A
OUTPUT  
Y
L
L
H
H
Note  
1. H = HIGH voltage level;  
L = LOW voltage level.  
ORDERING INFORMATION  
PACKAGE  
PACKAGE MATERIAL  
TYPE NUMBER  
TEMPERATURE  
PINS  
CODE  
MARKING  
RANGE  
74LVC1G17GW  
74LVC1G17GV  
74LVC1G17GM  
40 °C to +125 °C  
40 °C to +125 °C  
40 °C to +125 °C  
5
5
6
SC-88A  
SC-74A  
XSON6  
plastic  
plastic  
plastic  
SOT353  
SOT753  
SOT886  
VJ  
V17  
VJ  
PINNING  
PIN SC-88A; SC-74A  
PIN XSON6  
SYMBOL  
DESCRIPTION  
1
2
3
4
-
1
2
3
4
5
6
n.c.  
not connected  
data input A  
A
GND  
Y
ground (0 V)  
data output Y  
not connected  
supply voltage  
n.c.  
VCC  
5
17  
n.c.  
A
1
2
3
6
5
4
V
CC  
1
2
3
5
4
n.c.  
A
V
Y
CC  
17  
n.c.  
Y
GND  
GND  
001aab808  
001aab809  
Transparent top view  
Fig.1 Pin configuration SC-88A and SC-74A.  
Fig.2 Pin configuration XSON6.  
2004 Nov 30  
3
Philips Semiconductors  
Product specification  
Single Schmitt-trigger buffer  
74LVC1G17  
handbook, halfpage  
handbook, halfpage  
A
Y
2
4
4
2
MNB151  
MNB150  
Fig.3 Logic symbol.  
Fig.4 IEEE/IEC logic symbol.  
handbook, halfpage  
A
Y
MNB152  
Fig.5 Logic diagram.  
2004 Nov 30  
4
Philips Semiconductors  
Product specification  
Single Schmitt-trigger buffer  
74LVC1G17  
RECOMMENDED OPERATING CONDITIONS  
SYMBOL  
VCC  
PARAMETER  
supply voltage  
CONDITIONS  
MIN.  
1.65  
MAX.  
5.5  
UNIT  
V
VI  
input voltage  
0
5.5  
V
VO  
output voltage  
active mode  
Power-down mode; VCC = 0 V  
0
VCC  
5.5  
V
0
V
Tamb  
operating ambient temperature  
40  
+125  
°C  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).  
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT  
VCC supply voltage 0.5 +6.5  
V
IIK  
input diode current  
input voltage  
VI < 0 V  
note 1  
50  
mA  
V
VI  
0.5  
+6.5  
±50  
IOK  
VO  
output diode current  
output voltage  
VO > VCC or VO < 0 V  
mA  
V
active mode; notes 1 and 2  
0.5  
VCC + 0.5  
+6.5  
±50  
Power-down mode; notes 1 and 2 0.5  
V
IO  
output source or sink current  
VCC or GND current  
VO = 0 V to VCC  
mA  
mA  
°C  
mW  
ICC, IGND  
Tstg  
±100  
+150  
250  
storage temperature  
65  
Ptot  
total power dissipation  
Tamb = 40 °C to +125 °C  
Notes  
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation.  
2004 Nov 30  
5
Philips Semiconductors  
Product specification  
Single Schmitt-trigger buffer  
74LVC1G17  
DC CHARACTERISTICS  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
TEST CONDITIONS  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
OTHER  
VCC (V)  
Tamb = 40 °C to +85 °C; note 1  
VOL  
LOW-level output voltage VI = VCC or GND  
IO = 100 µA  
IO = 4 mA  
IO = 8 mA  
IO = 12 mA  
IO = 24 mA  
IO = 32 mA  
1.65 to 5.5  
1.65  
2.3  
0.1  
V
0.45  
0.3  
V
V
V
V
V
2.7  
0.4  
3.0  
0.55  
0.55  
4.5  
VOH  
HIGH-level output  
voltage  
VI = VCC or GND  
IO = 100 µA  
IO = 4 mA  
1.65 to 5.5  
1.65  
2.3  
V
CC 0.1  
V
1.2  
1.9  
2.2  
2.3  
3.8  
V
IO = 8 mA  
V
IO = 12 mA  
IO = 24 mA  
IO = 32 mA  
2.7  
V
3.0  
V
4.5  
V
ILI  
input leakage current  
VI = 5.5 V or GND 3.6  
VI or VO = 5.5 V  
±0.1  
±0.1  
±5  
±10  
µA  
µA  
Ioff  
power OFF leakage  
current  
0
ICC  
quiescent supply current VI = VCC or GND; 5.5  
IO = 0 A  
0.1  
5
10  
µA  
µA  
ICC  
additional quiescent  
supply current per pin  
VI = VCC 0.6 V;  
IO = 0 A  
2.3 to 5.5  
500  
2004 Nov 30  
6
Philips Semiconductors  
Product specification  
Single Schmitt-trigger buffer  
74LVC1G17  
TEST CONDITIONS  
OTHER VCC (V)  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
Tamb = 40 °C to +125 °C  
VOL  
LOW-level output voltage VI = VCC or GND  
IO = 100 µA  
IO = 4 mA  
IO = 8 mA  
IO = 12 mA  
IO = 24 mA  
IO = 32 mA  
1.65 to 5.5  
1.65  
2.3  
0.1  
V
0.7  
0.45  
0.6  
0.8  
0.8  
V
V
V
V
V
2.7  
3.0  
4.5  
VOH  
HIGH-level output  
voltage  
VI = VCC or GND  
IO = 100 µA  
IO = 4 mA  
1.65 to 5.5  
1.65  
2.3  
V
CC 0.1  
V
0.95  
1.7  
1.9  
2.0  
3.4  
V
IO = 8 mA  
V
IO = 12 mA  
IO = 24 mA  
IO = 32 mA  
2.7  
V
3.0  
V
4.5  
V
ILI  
input leakage current  
VI = 5.5 V or GND 3.6  
VI or VO = 5.5 V  
±100  
±200  
µA  
µA  
Ioff  
power OFF leakage  
current  
0
ICC  
quiescent supply current VI = VCC or GND; 5.5  
IO = 0 A  
200  
µA  
µA  
ICC  
additional quiescent  
supply current per pin  
VI = VCC 0.6 V;  
IO = 0 A  
2.3 to 5.5  
5000  
Note  
1. All typical values are measured at maximum VCC and Tamb = 25 °C.  
2004 Nov 30  
7
Philips Semiconductors  
Product specification  
Single Schmitt-trigger buffer  
74LVC1G17  
TRANSFER CHARACTERISTICS  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
TEST CONDITIONS  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
OTHER  
VCC (V)  
Tamb = 40 °C to +85 °C; note 1  
VT+  
VT  
VH  
positive-going threshold see Figs 6 and 7  
voltage  
1.8  
0.82  
1.0  
1.2  
1.5  
2.1  
2.5  
0.6  
0.8  
1.0  
1.5  
1.8  
0.4  
0.4  
0.5  
0.6  
0.6  
1.14  
V
2.3  
3.0  
4.5  
5.5  
1.8  
2.3  
3.0  
4.5  
5.5  
1.8  
2.3  
3.0  
4.5  
5.5  
1.03  
1.29  
1.84  
2.19  
0.46  
0.65  
0.88  
1.32  
1.58  
0.26  
0.28  
0.31  
0.40  
0.47  
1.40  
1.71  
2.36  
2.79  
0.75  
0.96  
1.24  
1.84  
2.24  
0.51  
0.57  
0.64  
0.77  
0.88  
V
V
V
V
V
V
V
V
V
V
V
V
V
V
negative-going threshold see Figs 6 and 7  
voltage  
hysteresis voltage  
see Figs 6 and 7  
(VT+ VT)  
Tamb = 40 °C to +125 °C  
VT+  
VT−  
VH  
positive-going threshold see Figs 6 and 7  
voltage  
1.8  
2.3  
3.0  
4.5  
5.5  
1.8  
2.3  
3.0  
4.5  
5.5  
1.8  
2.3  
3.0  
4.5  
5.5  
0.79  
1.00  
1.26  
1.81  
2.16  
0.46  
0.65  
0.88  
1.32  
1.58  
0.19  
0.22  
0.25  
0.34  
0.41  
1.14  
1.40  
1.71  
2.36  
2.79  
0.78  
0.99  
1.27  
1.87  
2.27  
0.51  
0.57  
0.64  
0.77  
0.88  
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
negative-going threshold see Figs 6 and 7  
voltage  
hysteresis voltage  
see Figs 6 and 7  
(VT+ VT)  
Note  
1. All typical values are measured at Tamb = 25 °C.  
2004 Nov 30  
8
Philips Semiconductors  
Product specification  
Single Schmitt-trigger buffer  
74LVC1G17  
TRANSFER CHARACTERISTIC WAVEFORMS  
V
O
handbook, halfpage  
V
T+  
V
I
V
H
V
T−  
V
O
V
I
V
H
MNB155  
V
T  
V
T+  
mnb154  
Fig.6 Transfer characteristic.  
Fig.7 Definitions of VT+, VTand VH.  
MNA641  
10  
handbook, halfpage  
I
CC  
(mA)  
8
6
4
2
0
0
1
2
3
V (V)  
I
VCC = 3.0 V.  
Fig.8 Typical transfer characteristics.  
2004 Nov 30  
9
Philips Semiconductors  
Product specification  
Single Schmitt-trigger buffer  
74LVC1G17  
AC CHARACTERISTICS  
GND = 0 V.  
TEST CONDITIONS  
OTHER VCC (V)  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
Tamb = 40 °C to +85 °C; note 1  
tPHL/tPLH propagation delay A to Y see Figs 9 and 10 1.65 to 1.95 1.0  
4.1  
2.8  
3.2  
3.0  
2.2  
11.0  
ns  
2.3 to 2.7  
2.7  
0.7  
0.7  
0.7  
0.7  
6.5  
6.5  
5.5  
5.0  
ns  
ns  
ns  
ns  
3.0 to 3.6  
4.5 to 5.5  
Tamb = 40 °C to +125 °C  
tPHL/tPLH propagation delay A to Y see Figs 9 and 10 1.65 to 1.95 1.0  
14.0  
8.5  
8.5  
7.0  
6.5  
ns  
ns  
ns  
ns  
ns  
2.3 to 2.7  
2.7  
0.7  
0.7  
0.7  
0.7  
3.0 to 3.6  
4.5 to 5.5  
Note  
1. All typical values are measured at Tamb = 25 °C.  
AC WAVEFORMS  
V
handbook, halfpage  
A input  
I
V
M
GND  
t
t
PHL  
PLH  
V
OH  
V
Y output  
M
V
MNB153  
OL  
INPUT  
VCC  
VM  
VI  
tr = tf  
1.65 V to 1.95 V  
2.3 V to 2.7 V  
2.7 V  
0.5 × VCC  
0.5 × VCC  
1.5 V  
VCC  
VCC  
2.0 ns  
2.0 ns  
2.5 ns  
2.5 ns  
2.5 ns  
2.7 V  
3.0 V to 3.6 V  
4.5 V to 5.5 V  
1.5 V  
2.7 V  
VCC  
0.5 × VCC  
VOL and VOH are typical output voltage drop that occur with the output load.  
Fig.9 Input A to output Y propagation delay times.  
10  
2004 Nov 30  
Philips Semiconductors  
Product specification  
Single Schmitt-trigger buffer  
74LVC1G17  
V
EXT  
V
CC  
R
L
V
I
V
O
PULSE  
GENERATOR  
D.U.T.  
C
L
R
L
R
T
mna616  
VEXT  
VCC  
VI  
CL  
RL  
tPLH/tPHL  
tPZH/tPHZ  
tPZL/tPLZ  
1.65 V to 1.95 V VCC  
30 pF  
30 pF  
50 pF  
50 pF  
50 pF  
1 kΩ  
open  
open  
open  
open  
open  
GND  
GND  
GND  
GND  
GND  
2 × VCC  
2 × VCC  
6 V  
2.3 V to 2.7 V  
2.7 V  
VCC  
500 Ω  
500 Ω  
500 Ω  
500 Ω  
2.7 V  
2.7 V  
VCC  
3.0 V to 3.6 V  
4.5 V to 5.5 V  
6 V  
2 × VCC  
Definitions for test circuit:  
RL = Load resistor.  
CL = Load capacitance including jig and probe capacitance.  
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.  
Fig.10 Load circuitry for switching times.  
APPLICATION INFORMATION  
MNB156  
50  
handbook, halfpage  
I
CC  
(mA)  
(1)  
40  
30  
20  
(2)  
10  
0
2
3
4
5
6
V
(V)  
CC  
(1) Positive-going edge.  
Linear change of VI between 0.8 V to 2.0 V.  
(2) Negative-going edge.  
Fig.11 Average supply current as a function of supply voltage.  
11  
2004 Nov 30  
Philips Semiconductors  
Product specification  
Single Schmitt-trigger buffer  
74LVC1G17  
PACKAGE OUTLINES  
Plastic surface mounted package; 5 leads  
SOT353  
D
B
E
A
X
y
H
v
M
A
E
5
4
Q
A
A
1
1
2
3
c
e
b
L
p
w
M B  
1
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
(2)  
UNIT  
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max  
0.3  
0.2  
1.1  
0.8  
0.25  
0.10  
2.2  
1.8  
1.35  
1.15  
2.2  
2.0  
0.45  
0.15  
0.25  
0.15  
mm  
0.1  
1.3  
0.65  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC JEITA  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
97-02-28  
04-11-16  
SC-88A  
SOT353  
2004 Nov 30  
12  
Philips Semiconductors  
Product specification  
Single Schmitt-trigger buffer  
74LVC1G17  
Plastic surface mounted package; 5 leads  
SOT753  
D
B
E
A
X
y
H
v
M
A
E
5
4
Q
A
A
1
c
L
p
1
2
3
detail X  
e
b
p
w
M B  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
UNIT  
A
A
1
b
c
D
E
e
H
L
Q
v
w
y
p
p
E
0.100  
0.013  
0.40  
0.25  
1.1  
0.9  
0.26  
0.10  
3.1  
2.7  
1.7  
1.3  
3.0  
2.5  
0.6  
0.2  
0.33  
0.23  
mm  
0.95  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC JEITA  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
SOT753  
SC-74A  
02-04-16  
2004 Nov 30  
13  
Philips Semiconductors  
Product specification  
Single Schmitt-trigger buffer  
74LVC1G17  
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm  
SOT886  
b
1
2
3
4×  
(2)  
L
L
1
e
6
5
4
e
1
e
1
6×  
(2)  
A
A
1
D
E
terminal 1  
index area  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
A
1
UNIT  
b
D
E
e
e
L
L
1
1
max max  
0.25  
0.17  
1.5  
1.4  
1.05  
0.95  
0.35 0.40  
0.27 0.32  
mm  
0.5 0.04  
0.6  
0.5  
Notes  
1. Including plating thickness.  
2. Can be visible in some manufacturing processes.  
REFERENCES  
JEDEC JEITA  
OUTLINE  
VERSION  
EUROPEAN  
PROJECTION  
ISSUE DATE  
IEC  
04-07-15  
04-07-22  
SOT886  
MO-252  
2004 Nov 30  
14  
Philips Semiconductors  
Product specification  
Single Schmitt-trigger buffer  
74LVC1G17  
DATA SHEET STATUS  
DATA SHEET  
STATUS(1)  
PRODUCT  
STATUS(2)(3)  
LEVEL  
DEFINITION  
I
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
II  
Preliminary data Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Relevant changes will  
be communicated via a Customer Product/Process Change Notification  
(CPCN).  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.  
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes in the products -  
including circuits, standard cells, and/or software -  
described or contained herein in order to improve design  
and/or performance. When the product is in full production  
(status ‘Production’), relevant changes will be  
Application information  
Applications that are  
communicated via a Customer Product/Process Change  
Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these  
products, conveys no licence or title under any patent,  
copyright, or mask work right to these products, and  
makes no representations or warranties that these  
products are free from patent, copyright, or mask work  
right infringement, unless otherwise specified.  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2004 Nov 30  
15  
Philips Semiconductors – a worldwide company  
Contact information  
For additional information please visit http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.  
© Koninklijke Philips Electronics N.V. 2004  
SCA76  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
R20/04/pp16  
Date of release: 2004 Nov 30  
Document order number: 9397 750 14375  

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