74HC151DB,112 [NXP]
74HC(T)151 - 8-input multiplexer SSOP1 16-Pin;
| 型号： | 74HC151DB,112 |
| 厂家： | 
NXP |
| 描述： | 74HC(T)151 - 8-input multiplexer SSOP1 16-Pin 光电二极管 逻辑集成电路 |
| 文件： | 总19页 (文件大小：161K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
74HC151; 74HCT151
8-input multiplexer
Rev. 4 — 11 February 2013
Product data sheet
1. General description
The 74HC151; 74HCT151 are 8-bit multiplexer with eight binary inputs (I0 to I7), three
select inputs (S0 to S2) and an enable input (E). One of the eight binary inputs is selected
by the select inputs and routed to the complementary outputs (Y and Y). A HIGH on E
forces the output Y LOW and output Y HIGH. Inputs also include clamp diodes that enable
the use of current limiting resistors to interface inputs to voltages in excess of VCC
.
2. Features and benefits
Input levels:
For 74HC151: CMOS level
For 74HCT151: TTL level
Low-power dissipation
Non-inverting data path
Specified in compliance with JEDEC standard no. 7A
ESD protection:
HBM JESD22-A114F exceeds 2 000 V
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from 40 C to +85 C and from 40 C to +125 C
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74HC151N
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
DIP16
plastic dual in-line package; 16 leads (300 mil)
SOT38-4
74HCT151N
74HC151D
SO16
plastic small outline package; 16 leads; body width SOT109-1
3.9 mm
74HCT151D
74HC151DB
74HCT151DB
74HC151PW
74HCT151PW
SSOP16
TSSOP16
plastic shrink small outline package; 16 leads;
body width 5.3 mm
SOT338-1
plastic thin shrink small outline package; 16 leads; SOT403-1
body width 4.4 mm
74HC151; 74HCT151
NXP Semiconductors
8-input multiplexer
4. Functional diagram
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Fig 1. Logic symbol
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Fig 2. Functional diagram
Fig 3. Logic diagram
74HC_HCT151
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 11 February 2013
2 of 19
74HC151; 74HCT151
NXP Semiconductors
8-input multiplexer
5. Pinning information
5.1 Pinning
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Fig 4. Pin configuration DIP16, SO16 and (T)SSOP16
5.2 Pin description
Table 2.
Symbol
I0 to I7
Y
Pin description
Pin
Description
4, 3, 2, 1, 15, 14, 13, 12
data inputs
5
multiplexer output
Y
6
complementary multiplexer output
enable input (active LOW)
ground (0 V)
E
7
GND
S0, S1, S2
VCC
8
11, 10, 9
16
common data select inputs
supply voltage
74HC_HCT151
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 11 February 2013
3 of 19
74HC151; 74HCT151
NXP Semiconductors
8-input multiplexer
6. Functional description
Table 3.
Function table[1]
Input
E
H
L
Output
S2
X
L
S1
X
L
S0
X
L
I0
X
L
I1
X
X
X
L
I2
X
X
X
X
X
L
I3
X
X
X
X
X
X
X
L
I4
X
X
X
X
X
X
X
X
X
L
I5
X
X
X
X
X
X
X
X
X
X
X
L
I6
X
X
X
X
X
X
X
X
X
X
X
X
X
L
I7
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
L
Y
H
H
L
Y
L
L
L
L
L
L
H
X
X
X
X
X
X
X
X
X
X
X
X
X
X
H
L
L
L
L
H
H
L
H
L
L
L
L
H
X
X
X
X
X
X
X
X
X
X
X
X
H
L
L
L
H
H
H
H
L
H
L
L
L
L
H
X
X
X
X
X
X
X
X
X
X
H
L
L
L
H
H
L
H
L
L
L
H
X
X
X
X
X
X
X
X
H
L
L
H
H
H
H
H
H
H
H
H
L
L
L
L
H
X
X
X
X
X
X
H
L
L
L
H
H
L
H
L
L
L
H
X
X
X
X
H
L
L
H
H
H
H
H
L
L
L
H
X
X
H
L
L
H
H
H
L
L
H
H
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care.
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
VCC
IIK
Parameter
Conditions
Min
Max
+7
Unit
V
supply voltage
0.5
input clamping current
output clamping current
output current
VI < 0.5 V or VI > VCC + 0.5 V
VO < 0.5 V or VO > VCC + 0.5 V
VO = 0.5 V to (VCC + 0.5 V)
-
20
20
25
+50
50
+150
mA
mA
mA
mA
mA
C
IOK
-
IO
-
ICC
supply current
-
IGND
Tstg
ground current
-
storage temperature
65
74HC_HCT151
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 11 February 2013
4 of 19
74HC151; 74HCT151
NXP Semiconductors
8-input multiplexer
Table 4.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Max
Unit
Ptot
total power dissipation
DIP16 package
SO16 package
Tamb = 40 C to +125 C
[1]
[2]
[3]
-
-
-
750
500
500
mW
mW
mW
(T)SSOP16 package
[1] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 C.
[2] For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.
[3] For SSOP16 and TSSOP16 packages: Ptot derates linearly with 5.5 mW/K above 60 C.
8. Recommended operating conditions
Table 5.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V)
Symbol Parameter Conditions
74HC151
74HCT151
Unit
Min
Typ
Max
6.0
Min
Typ
Max
VCC
VI
supply voltage
2.0
5.0
4.5
5.0
5.5
VCC
VCC
+125
-
V
input voltage
0
-
VCC
VCC
+125
625
139
83
0
-
V
VO
output voltage
0
-
0
-
V
Tamb
t/V
ambient temperature
input transition rise and fall rate VCC = 2.0 V
VCC = 4.5 V
40
+25
40
+25
C
-
-
-
-
-
-
-
-
ns/V
ns/V
ns/V
1.67
-
1.67
-
139
-
VCC = 6.0 V
74HC_HCT151
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 11 February 2013
5 of 19
74HC151; 74HCT151
NXP Semiconductors
8-input multiplexer
9. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Tamb = 25 C
Min Typ Max
Tamb = 40 C to Tamb = 40 C to Unit
+85 C +125 C
Min
Max
Min
Max
74HC151
VIH
HIGH-level
input voltage
VCC = 2.0 V
1.5
1.2
2.4
3.2
0.8
-
-
1.5
-
-
1.5
-
-
V
V
V
V
V
V
VCC = 4.5 V
3.15
3.15
3.15
VCC = 6.0 V
4.2
-
4.2
-
4.2
-
VIL
LOW-level
input voltage
VCC = 2.0 V
-
-
-
0.5
-
-
-
0.5
1.35
1.8
-
-
-
0.5
1.35
1.8
VCC = 4.5 V
2.1 1.35
VCC = 6.0 V
2.8
1.8
VOH
HIGH-level
VI = VIH or VIL
output voltage
IO = 20 A; VCC = 2.0 V
IO = 20 A; VCC = 4.5 V
IO = 20 A; VCC = 6.0 V
1.9
4.4
5.9
2.0
4.5
6.0
-
-
-
-
-
1.9
4.4
-
-
-
-
-
1.9
4.4
5.9
3.7
5.2
-
-
-
-
-
V
V
V
V
V
5.9
IO = 4.0 mA; VCC = 4.5 V 3.98 4.32
IO = 5.2 mA; VCC = 6.0 V 5.48 5.81
VI = VIH or VIL
3.84
5.34
VOL
LOW-level
output voltage
IO = 20 A; VCC = 2.0 V
IO = 20 A; VCC = 4.5 V
IO = 20 A; VCC = 6.0 V
IO = 4.0 mA; VCC = 4.5 V
IO = 5.2 mA; VCC = 6.0 V
-
-
-
-
-
-
0
0
0
0.1
0.1
0.1
-
-
-
-
-
-
0.1
0.1
-
-
-
-
-
-
0.1
0.1
0.1
0.4
0.4
1.0
V
V
0.1
V
0.15 0.26
0.16 0.26
0.33
0.33
1.0
V
V
II
input leakage
current
VI = VCC or GND;
VCC = 6.0 V
-
0.1
8.0
-
A
ICC
CI
supply current VI = VCC or GND; IO = 0 A;
VCC = 6.0 V
-
-
-
-
80
-
160
A
input
3.5
pF
capacitance
74HC_HCT151
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 11 February 2013
6 of 19
74HC151; 74HCT151
NXP Semiconductors
8-input multiplexer
Table 6.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Tamb = 25 C
Min Typ Max
Tamb = 40 C to Tamb = 40 C to Unit
+85 C +125 C
Min
Max
Min
Max
74HCT151
VIH
VIL
HIGH-level
input voltage
VCC = 4.5 V to 5.5 V
VCC = 4.5 V to 5.5 V
2.0
-
1.6
1.2
-
2.0
-
-
2.0
-
-
V
V
LOW-level
0.8
0.8
0.8
input voltage
VOH
HIGH-level
output voltage
VI = VIH or VIL; VCC = 4.5 V
IO = 20 A
4.4
4.5
-
-
4.4
-
-
4.4
3.7
-
-
V
V
IO = 4 mA
3.98 4.32
3.84
VOL
LOW-level
output voltage
VI = VIH or VIL; VCC = 4.5 V
IO = 20 A
-
-
-
0
0.1
-
-
-
0.1
-
-
-
0.1
0.4
V
IO = 4.0 mA
0.15 0.26
0.33
1.0
V
II
input leakage
current
VI = VCC or GND;
VCC = 5.5 V
-
0.1
1.0
A
ICC
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
8.0
-
80
-
160
A
additional
VI = VCC 2.1 V;
supply current other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V;
IO = 0 A
per input pin; In inputs
per input pin; E input
per input pin; Sn input
-
-
-
-
45
30
162
108
-
-
-
203
135
675
-
-
-
221
147
735
A
A
A
pF
150 540
3.5
CI
input
-
capacitance
74HC_HCT151
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 11 February 2013
7 of 19
74HC151; 74HCT151
NXP Semiconductors
8-input multiplexer
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 7.
Symbol Parameter Conditions
Tamb = 25 C
Min
Tamb = 40 C
to +85 C
Tamb = 40 C
to +125 C
Unit
Typ Max Min
Max
Min
Max
For type 74HC151
[1]
[1]
[1]
[1]
tpd
propagation In to Y; see Figure 5
delay
VCC = 2.0 V
-
-
-
-
52
19
17
15
170
34
-
-
-
-
-
215
43
-
-
-
-
-
255
51
-
ns
ns
ns
ns
VCC = 4.5 V
VCC = 5 V; CL = 15 pF
VCC = 6.0 V
29
37
43
In to Y; see Figure 5
VCC = 2.0 V
-
-
-
-
58
21
17
17
185
37
-
-
-
-
-
230
46
-
-
-
-
-
280
56
-
ns
ns
ns
ns
VCC = 4.5 V
VCC = 5 V; CL = 15 pF
VCC = 6.0 V
31
39
48
Sn to Y; see Figure 6
VCC = 2.0 V
-
-
-
-
61
22
19
18
185
37
-
-
-
-
-
230
46
-
-
-
-
-
280
56
-
ns
ns
ns
ns
VCC = 4.5 V
VCC = 5 V; CL = 15 pF
VCC = 6.0 V
31
39
48
Sn to Y; see Figure 6
VCC = 2.0 V
-
-
-
-
61
22
19
18
205
41
-
-
-
-
-
255
51
-
-
-
-
-
310
62
-
ns
ns
ns
ns
VCC = 4.5 V
VCC = 5 V; CL = 15 pF
VCC = 6.0 V
35
43
53
E to Y; see Figure 6
VCC = 2.0 V
-
-
-
-
41
15
12
12
125
25
-
-
-
-
-
155
31
-
-
-
-
-
190
38
-
ns
ns
ns
ns
VCC = 4.5 V
VCC = 5 V; CL = 15 pF
VCC = 6.0 V
21
26
32
E to Y; see Figure 6
VCC = 2.0 V
-
-
-
-
47
17
14
14
145
29
-
-
-
-
-
180
36
-
-
-
-
-
220
44
-
ns
ns
ns
ns
VCC = 4.5 V
VCC = 5 V; CL = 15 pF
VCC = 6.0 V
25
31
38
[2]
tt
transition
time
Y, Y; see Figure 5
VCC = 2.0 V
-
-
-
19
7
75
15
13
-
-
-
95
19
16
-
-
-
110
22
ns
ns
ns
VCC = 4.5 V
VCC = 6.0 V
6
19
74HC_HCT151
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 11 February 2013
8 of 19
74HC151; 74HCT151
NXP Semiconductors
8-input multiplexer
Table 7.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 7.
Symbol Parameter Conditions
Tamb = 25 C
Min
Tamb = 40 C
to +85 C
Tamb = 40 C
to +125 C
Unit
Typ Max Min
Max
Min
Max
[3]
CPD
power
dissipation
capacitance
CL = 50 pF; f = 1 MHz;
VI = GND to VCC
-
40
-
-
-
-
-
pF
For type 74HCT151
[1]
[1]
[1]
[1]
[1]
[1]
tpd
propagation In to Y; see Figure 5
delay
VCC = 4.5 V
-
-
22
19
38
-
-
-
48
-
-
-
57
-
ns
ns
VCC = 5 V; CL = 15 pF
In to Y; see Figure 5
VCC = 4.5 V
-
-
22
19
38
-
-
-
48
-
-
-
57
-
ns
ns
VCC = 5 V; CL = 15 pF
Sn to Y; see Figure 6
VCC = 4.5 V
-
-
23
20
41
-
-
-
51
-
-
-
62
-
ns
ns
VCC = 5 V; CL = 15 pF
Sn to Y; see Figure 6
VCC = 4.5 V
-
-
25
20
43
-
-
-
54
-
-
-
65
-
ns
ns
VCC = 5 V; CL = 15 pF
E to Y; see Figure 6
VCC = 4.5 V
-
-
16
13
29
-
-
-
36
-
-
-
44
-
ns
ns
VCC = 5 V; CL = 15 pF
E to Y; see Figure 6
VCC = 4.5 V
-
-
21
18
36
-
-
-
45
-
-
-
54
-
ns
ns
VCC = 5 V; CL = 15 pF
[2]
[3]
tt
transition
time
Y, Y; see Figure 5
VCC = 4.5 V
-
-
7
15
-
-
-
19
-
-
-
22
-
ns
CPD
power
dissipation
capacitance
CL = 50 pF; f = 1 MHz;
VI = GND to VCC
40
pF
[1] tpd is the same as tPLH and tPHL
[2] tt is the same as tTHL and tTLH
.
.
[3]
CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD VCC2 fi N + (CL VCC2 fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL VCC2 fo) = sum of outputs.
74HC_HCT151
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 11 February 2013
9 of 19
74HC151; 74HCT151
NXP Semiconductors
8-input multiplexer
11. Waveforms
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ꢔ
ꢔ
ꢍ
ꢍ
ꢋꢜ !ꢚ"!ꢚ
ꢂꢃꢜꢝ
ꢂꢃꢜꢝ
ꢔ
%ꢏ
ꢚ
ꢚ
ꢐꢏꢛ
ꢐꢛꢏ
ꢀꢀꢀꢁꢂꢂꢃꢄꢅꢅ
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 5. Propagation delay input (In) to output (Y, Y) and the output (Y, Y) transition time
ꢔ
ꢊ
ꢔ
ꢔ
ꢍ
ꢉ#&ꢜꢈꢜ$#"!ꢚ
ꢋꢜ !ꢚ"!ꢚ
ꢍ
ꢖꢗꢘ
ꢚ
ꢚ
ꢑꢛꢏ
ꢑꢏꢛ
ꢔ
%ꢛ
ꢁꢃꢜꢝ
ꢁꢃꢜꢝ
ꢔ
ꢔ
ꢍ
ꢍ
ꢂꢃꢜꢝ
ꢂꢃꢜꢝ
ꢔ
%ꢏ
ꢚ
ꢚ
ꢐꢏꢛ
ꢐꢛꢏ
ꢚ
ꢚ
ꢑꢏꢛ
ꢑꢛꢏ
ꢔ
%ꢛ
ꢁꢃꢜꢝ
ꢁꢃꢜꢝ
ꢔ
ꢔ
ꢍ
ꢍ
ꢋꢜ !ꢚ"!ꢚ
ꢂꢃꢜꢝ
ꢂꢃꢜꢝ
ꢔ
%ꢏ
ꢚ
ꢚ
ꢐꢏꢛ
ꢐꢛꢏ
ꢀꢀꢀꢁꢂꢂꢃꢄꢅꢈ
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 6. Propagation delay input (Sn, E) to output (Y, Y) and output (Y, Y) transitions time
74HC_HCT151
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Product data sheet
Rev. 4 — 11 February 2013
10 of 19
74HC151; 74HCT151
NXP Semiconductors
8-input multiplexer
Table 8.
Type
Measurement points
Input
VM
Output
VM
74HC151
0.5VCC
1.3 V
0.5VCC
1.3 V
74HCT151
t
W
V
I
90 %
negative
pulse
V
V
V
V
M
M
10 %
GND
t
t
r
f
t
t
f
r
V
I
90 %
positive
pulse
M
M
10 %
GND
t
W
V
CC
V
V
O
I
G
DUT
R
T
C
L
001aah768
Test data is given in Table 9.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
RL = Load resistance.
S1 = Test selection switch.
Fig 7. Test circuit for measuring switching times
Table 9.
Type
Test data
Input
VI
Load
Test
tr, tf
CL
74HC151
VCC
3.0 V
6.0 ns
6.0 ns
15 pF, 50 pF
15 pF, 50 pF
tPLH, tPHL
tPLH, tPHL
74HCT151
74HC_HCT151
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Product data sheet
Rev. 4 — 11 February 2013
11 of 19
74HC151; 74HCT151
NXP Semiconductors
8-input multiplexer
12. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
b
2
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.30
0.53
0.38
1.25
0.85
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.1
7.62
0.3
0.254
0.01
0.76
0.068 0.021 0.049 0.014
0.051 0.015 0.033 0.009
0.77
0.73
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.02
0.13
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
95-01-14
03-02-13
SOT38-4
Fig 8. Package outline SOT38-4 (DIP16)
74HC_HCT151
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 11 February 2013
12 of 19
74HC151; 74HCT151
NXP Semiconductors
8-input multiplexer
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
v
c
y
H
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT109-1
076E07
MS-012
Fig 9. Package outline SOT109-1 (SO16)
74HC_HCT151
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 11 February 2013
13 of 19
74HC151; 74HCT151
NXP Semiconductors
8-input multiplexer
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
8
1
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
1.00
0.55
mm
2
0.25
0.65
1.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT338-1
MO-150
Fig 10. Package outline SOT338-1 (SSOP16)
74HC_HCT151
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 11 February 2013
14 of 19
74HC151; 74HCT151
NXP Semiconductors
8-input multiplexer
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
8
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.40
0.06
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT403-1
MO-153
Fig 11. Package outline SOT403-1 (TSSOP16)
74HC_HCT151
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 11 February 2013
15 of 19
74HC151; 74HCT151
NXP Semiconductors
8-input multiplexer
13. Abbreviations
Table 10. Abbreviations
Acronym
CMOS
DUT
Description
Complementary Metal Oxide Semiconductor
Device Under Test
ESD
ElectroStatic Discharge
Human Body Model
Machine Model
HBM
MM
TTL
Transistor-Transistor Logic
Military
MIL
14. Revision history
Table 11. Revision history
Document ID
Release date Data sheet status
20130211 Product data sheet
• New descriptive title (errata).
Change notice
Supersedes
74HC_HCT151 v.4
Modifications:
-
74HC_HCT151 v.3
74HC_HCT151 v.3
74HC_HCT151_CNV v.2
20120919
Product data sheet
-
-
74HC_HCT151_CNV v.2
19970827
Product specification
74HC_HCT151
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 11 February 2013
16 of 19
74HC151; 74HCT151
NXP Semiconductors
8-input multiplexer
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
15.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
74HC_HCT151
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 11 February 2013
17 of 19
74HC151; 74HCT151
NXP Semiconductors
8-input multiplexer
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74HC_HCT151
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 11 February 2013
18 of 19
74HC151; 74HCT151
NXP Semiconductors
8-input multiplexer
17. Contents
1
2
3
4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16
7
8
9
10
11
12
13
14
15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
15.1
15.2
15.3
15.4
16
17
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 11 February 2013
Document identifier: 74HC_HCT151
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