74ABT541D-T [NXP]
Octal buffer/line driver (3-State); 八路缓冲器/线路驱动器（三态）
| 型号： | 74ABT541D-T |
| 厂家： | 
NXP |
| 描述： | Octal buffer/line driver (3-State) |
| 文件： | 总11页 (文件大小：118K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
74ABT541
Octal buffer/line driver (3-State)
Product specification
Supersedes data of 1996 Sep 10
1998 Jan 16
IC23 Data Handbook
Philips
Semiconductors
Philips Semiconductors
Product specification
Octal buffer/line driver (3-State)
74ABT541
FEATURES
• Octal bus interface
• ESD protection exceeds 2000 V per MIL STD 883 Method 3015
and 200 V per Machine Model
• Live insertion/extraction permitted
• Functions similar to the ’ABT241
• Provides ideal interface and increases fan-out of MOS
DESCRIPTION
Microprocessors
The 74ABT541 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.
• Efficient pinout to facilitate PC board layout
• 3-State buffer outputs sink 64mA and source 32mA
• Power-up 3-State
The 74ABT541 device is an octal buffer that is ideal for driving bus
lines. The outputs are all capable of sinking 64mA and sourcing
32mA. The device features input and outputs on opposite sides of
the package to facilitate printed circuit board layout.
• Latch-up protection exceeds 500mA per Jedec JC40.2 Std 17
QUICK REFERENCE DATA
CONDITIONS
= 25°C; GND = 0V
SYMBOL
PARAMETER
TYPICAL
UNIT
T
amb
t
t
Propagation delay
An to Yn
PLH
PHL
C = 50pF; V = 5V
2.9
ns
L
CC
C
Input capacitance
Output capacitance
Total supply current
V = 0V or V
CC
4
7
pF
pF
nA
IN
I
C
Outputs disabled; V = 0V or V
O CC
OUT
CCZ
I
Outputs disabled; V = 5.5V
500
CC
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE OUTSIDE NORTH AMERICA
NORTH AMERICA
74ABT541 N
DWG NUMBER
SOT146-1
20-Pin Plastic DIP
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
74ABT541 N
74ABT541 D
74ABT541 DB
74ABT541 PW
20-Pin plastic SO
74ABT541 D
SOT163-1
20-Pin Plastic SSOP Type II
20-Pin Plastic TSSOP Type I
74ABT541 DB
74ABT541PW DH
SOT339-1
SOT360-1
PIN CONFIGURATION
LOGIC SYMBOL
1
OE0
OE1
19
20
19
18
17
16
15
14
13
12
11
1
V
OE0
CC
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
A0
A1
A2
A3
A4
A5
A6
A7
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
2
3
A0
A1
OE1
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
4
A2
5
A3
6
A4
7
A5
8
A6
9
A7
10
GND
SA00202
SA00203
2
1998 Jan 16
853-1458 18864
Philips Semiconductors
Product specification
Octal buffer/line driver (3-State)
74ABT541
LOGIC SYMBOL (IEEE/IEC)
PIN DESCRIPTION
PIN NUMBER
SYMBOL
NAME AND FUNCTION
2, 3, 4, 5,
6, 7, 8, 9
A0 – A7
Y0 – Y7
Data inputs
&
1
19
EN
18, 17, 16, 15,
14, 13, 12, 11
Data outputs
1, 19
10
OE0, OE1
GND
Output enables
2
18
Ground (0V)
17
16
3
4
20
V
CC
Positive supply voltage
15
5
6
7
14
13
FUNCTION TABLE
8
9
12
11
INPUTS
OUTPUTS
OE0
OE1
An
Yn
L
L
X
H
L
L
H
X
L
H
X
X
L
H
Z
Z
SA00204
H = High voltage level
L
X
Z
= Low voltage level
= Don’t care
= High impedance ”off” state
1, 2
ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
DC supply voltage
CONDITIONS
RATING
–0.5 to +7.0
–18
UNIT
V
V
CC
I
IK
DC input diode current
V < 0
I
mA
V
3
V
I
DC input voltage
–1.2 to +7.0
–50
I
DC output diode current
V
O
< 0
mA
V
OK
3
V
DC output voltage
output in Off or High state
output in Low state
–0.5 to +5.5
128
OUT
OUT
I
DC output current
mA
°C
T
stg
Storage temperature range
–65 to 150
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
3
1998 Jan 16
Philips Semiconductors
Product specification
Octal buffer/line driver (3-State)
74ABT541
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
LIMITS
UNIT
Min
4.5
0
Max
V
DC supply voltage
5.5
V
V
CC
V
Input voltage
V
CC
I
V
High-level input voltage
Low-level Input voltage
High-level output current
Low-level output current
Input transition rise or fall rate
2.0
V
IH
V
0.8
–32
64
V
IL
I
mA
mA
ns/V
°C
OH
I
OL
∆t/∆v
0
5
T
amb
Operating free-air temperature range
–40
+85
DC ELECTRICAL CHARACTERISTICS
LIMITS
T
= –40°C
to +85°C
amb
SYMBOL
PARAMETER
TEST CONDITIONS
T
amb
= +25°C
UNIT
Min
Typ
Max
Min
Max
V
Input clamp voltage
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 4.5V; I = –18mA
–0.9
2.9
–1.2
–1.2
V
V
IK
IK
= 4.5V; I = –3mA; V = V or V
2.5
3.0
2.0
2.5
3.0
2.0
OH
I
IL
IH
IH
V
OH
High-level output voltage
= 5.0V; I = –3mA; V = V or V
3.4
V
OH
I
IL
= 4.5V; I = –32mA; V = V or V
IH
2.4
V
OH
I
IL
V
OL
Low-level output voltage
Input leakage current
= 4.5V; I = 64mA; V = V or V
IH
0.42
±0.01
±5.0
0.55
±1.0
±100
0.55
±1.0
±100
V
OL
I
IL
I
= 5.5V; V = GND or 5.5V
µA
µA
I
I
I
Power-off leakage current
= 0.0V; V or V ≤ 4.5V
I O
OFF
Power-up/down 3-state
output current
V
V
= 2.0V; V = 0.5V; V = GND or V
= Don’t care
;
CC
OE
O
I
CC
CC
I
/I
±5.0
±50
±50
µA
PU PD
3
I
I
3-State output High current
3-State output Low current
Output High leakage current
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 5.5V; V = 2.7V; V = V or V
5.0
–5.0
5.0
50
–50
50
50
–50
50
µA
µA
µA
mA
µA
mA
OZH
O
I
IL
IH
IH
I
= 5.5V; V = 0.5V; V = V or V
O I IL
OZL
CEX
= 5.5V; V = 5.5V; V = GND or V
O
I
1
I
Output current
= 5.5V; V = 2.5V
–40
–100
0.5
–180
250
30
–40
–180
250
30
O
O
I
= 5.5V; Outputs High, V = GND or V
CCH
I
CC
I
Quiescent supply current
= 5.5V; Outputs Low, V = GND or V
24
CCL
I
CC
= 5.5V; Outputs 3-State;
I
0.5
0.5
0.5
0.5
250
1.5
50
250
1.5
50
µA
mA
µA
CCZ
V = GND or V
I
CC
Outputs enabled, one input at 3.4V, other
inputs at V or GND; V = 5.5V
CC
CC
Additional supply current per Outputs 3-State, one data input at 3.4V,
∆I
CC
2
input pin
other inputs at V or GND; V = 5.5V
CC CC
Outputs 3-State, one enable input at 3.4V,
other inputs at V or GND; V = 5.5V
1.5
1.5
mA
CC
CC
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2. This is the increase in supply current for each input at 3.4V.
3. This parameter is valid for any V between 0V and 2.1V with a transition time of up to 10msec. For V = 2.1V to V = 5V " 10%, a
CC
CC
CC
transition time of up to 100µsec is permitted.
4
1998 Jan 16
Philips Semiconductors
Product specification
Octal buffer/line driver (3-State)
74ABT541
AC CHARACTERISTICS
GND = 0V; t = t = 2.5ns; C = 50pF, R = 500Ω
R
F
L
L
LIMITS
T
V
= +25°C
= +5.0V
T
= –40°C to +85°C
amb
CC
amb
V
SYMBOL
PARAMETER
WAVEFORM
UNIT
= +5.0V ±0.5V
CC
Min
Typ
Max
Min
Max
t
t
Propagation delay
An to Yn
1.0
1.0
2.6
2.9
4.1
4.2
1.0
1.0
4.6
4.6
PLH
PHL
1
2
2
ns
ns
ns
t
Output enable time
to High and Low level
1.1
2.1
3.1
4.4
4.8
5.9
1.1
2.1
5.3
6.4
PZH
t
PZL
t
Output disable time
from High and Low level
2.1
1.7
5.1
4.7
6.6
6.2
2.1
1.7
7.1
6.7
PHZ
t
PLZ
AC WAVEFORMS
V
M
= 1.5V, V = GND to 3.0V
IN
3 V
0 V
V
V
OEn
INPUT
M
M
1.5V
1.5V
INPUT
t
t
PLZ
PZL
3.5V
t
t
PHL
PLH
V
Yn
OUTPUT
M
V
V
V
+ 0.3V
OH
OL
OL
t
t
PHZ
PZH
1.5V
1.5V
V
V
OH
Yn
OUTPUT
– 0.3V
OUTPUT
OH
V
M
V
OL
0V
SA00028
SA00206
Waveform 2. Waveforms Showing the 3-State Output Enable
and Disable Times
Waveform 1. Waveforms Showing the Input (An) to Output (Yn)
Propagation Delays
TEST CIRCUIT AND WAVEFORMS
7 V
500 Ω
S1
From Output
Under Test
Open
GND
500 Ω
C
= 50 pF
L
Load Circuit
TEST
S1
t
open
7 V
pd
t
/t
PLZ PZL
t
/t
open
PHZ PZH
DEFINITIONS
C
=
Load capacitance includes jig and probe capacitance;
see AC CHARACTERISTICS for value.
L
SA00012
5
1998 Jan 16
Philips Semiconductors
Product specification
Octal buffer/line driver (3-State)
74ABT541
DIP20: plastic dual in-line package; 20 leads (300 mil)
SOT146-1
6
1998 Jan 16
Philips Semiconductors
Product specification
Octal buffer/line driver (3-State)
74ABT541
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
7
1998 Jan 16
Philips Semiconductors
Product specification
Octal buffer/line driver (3-State)
74ABT541
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
8
1998 Jan 16
Philips Semiconductors
Product specification
Octal buffer/line driver (3-State)
74ABT541
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
9
1998 Jan 16
Philips Semiconductors
Product specification
Octal buffer/line driver (3-State)
74ABT541
NOTES
10
1998 Jan 16
Philips Semiconductors
Product specification
Octal buffer/line driver (3-State)
74ABT541
Data sheet status
[1]
Data sheet
status
Product
status
Definition
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Righttomakechanges—PhilipsSemiconductorsreservestherighttomakechanges, withoutnotice, intheproducts, includingcircuits,standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Sunnyvale, California 94088–3409
Telephone 800-234-7381
print code
Date of release: 05-96
9397-750-03614
Document order number:
Philips
Semiconductors
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